JP6242542B2 - Gantry device and control method - Google Patents

Description

  The present invention relates to an optical device and a control method, and more particularly to a gantry apparatus and a control method that are movable in the vertical direction.

  With the development of flat panel display technology, in lithographic apparatus and measurement apparatus for flat panel display, a larger size substrate is placed on the wafer stage, and the length of the movable path is limited by the size of the substrate. It is more difficult to move the stage in the vertical or horizontal direction. Compared with the wafer stage, the gantry has an advantage of a simple structure and a long moving distance. For this reason, the advantage of replacing the wafer stage with a gantry has become more prominent.

  All existing gantry are horizontally controlled, and no vertically controlled gantry has ever existed. Traditionally, vertical control of a lithographic tool is achieved by moving the area to be measured to the optimal focal plane with closed loop control enabled by a focus leveling sensor. The control is given a predetermined height and tilt value of the focus / leveling sensor, and the height and tilt values measured by the focus / leveling sensor are set in order to place the area to be measured on the optimal focal plane. The servo operation is performed until the predetermined value is met. FIG. 1 shows a conventional vertical control mechanism in which a control unit sends a control command to a wafer stage actuator (motor) with a substrate positioned on a wafer stage, and the wafer stage is displaced according to the command. Then, the focus / leveling sensor measures the current position of the upper surface of the substrate and feeds back to the control unit to form a control loop. Thereafter, the control unit sends a further control command to the motor based on the feedback. This step is repeated until the substrate on the wafer stage is placed in the optimal focal plane, i.e. the target plane.

  However, such vertical control takes time in a closed-loop control mechanism that requires a focus / leveling sensor and a feedback mechanism, and the closed-loop control mechanism based on the focus / leveling sensor is relatively complicated.

  An object of the present invention is to provide a gantry apparatus and a control method. The gantry device includes a gantry and a gantry guide rail, and is movable horizontally and vertically. This makes it possible to adjust the substrate to an optimal focal plane by closed-loop control that does not include a focus / leveling sensor, thereby reducing the difficulty of control and reducing manufacturing costs.

A support device for supporting the substrate;
A gantry main body, and the gantry connection mechanism, wherein the gantry main body is disposed on the support device via the gantry connection mechanism;
A vertical actuator disposed on the gantry body and movable in a direction perpendicular to the gantry body;
A scanning galvanometer disposed on the vertical actuator;
A first sensing element disposed on the support device, wherein the first sensing element detects an optimum focal plane of the scanning galvanometer from a reference plane of the first sensing element;
A second sensing element disposed on the gantry body for measuring a first distance from a surface of the substrate to a reference plane of the first sensing element;
A third sensing element disposed on the vertical actuator, the first sensing element having on the reference plane of the first sensing element that has detected the optimum focal plane of the scanning galvanometer from the scanning galvanometer; Measuring the second distance to the surface, the third sensing element;
The vertical actuator is configured such that, based on the first distance and the second distance, a distance between the scanning galvanometer and the surface of the substrate is equal to a sum of the first distance and the second distance. Adjust the vertical position of the scanning galvanometer.

  Furthermore, the gantry coupling mechanism may have a gantry guide rail.

  Further, the gantry main body supports the scanning galvanometer in which the first horizontal beam and the second horizontal beam intersect at a right angle in a horizontal plane and can move horizontally along the gantry guide rail. You may have a horizontal beam and the said 2nd horizontal horizontal beam.

  Furthermore, the third sensing element may be a profilometer.

  Furthermore, the first detection element may be an aberration sensor, a mutation sensor, or a focus / leveling sensor.

  Further, the second sensing element may be a lattice scale, a linear variable differential transformer (LVDT), or an interferometer.

  Further, the support device includes a wafer stage, marble, a damper, and a base, the substrate is disposed on the wafer stage, the wafer stage is disposed on the marble, and the marble is It may be connected to the base via a damper.

  Furthermore, the gantry apparatus may be used for laser sealing of a glass substrate, and the substrate may include an upper glass substrate and a lower glass substrate, and the surface of the substrate may be a bottom surface of the upper glass substrate.

  The gantry apparatus may be used in an exposure apparatus, and the surface of the substrate may be an upper surface of the substrate.

Further, the above object is achieved by a gantry device control method for the gantry device. The method is
1) Move the second sensing element directly above the first sensing element, and measure the first distance Z_BF from the second sensing element to the reference plane of the first sensing element by the second sensing element. To do;
2) The scanning galvanometer is moved on the first sensing element, and the vertical actuator detects the optimum focal plane of the scanning galvanometer on the reference plane of the first sensing element. Adjust the vertical position of the scanning galvanometer to the reference plane, and then detect the second distance Z_galBFRef from the zero plane of the third sensing element to the reference plane of the first sensing element by the third sensing element To do;
3) moving the second sensing element directly above the substrate, and detecting a third distance Z_mes from the second sensing element to the surface of the substrate by the second sensing element;
4) A fourth distance Z_s from the zero plane of the third sensing element to the surface of the substrate when the optimum focal plane of the scanning galvanometer is adjusted to the surface of the substrate,

で表される、前記第４距離と、前記第１、第２及び第３距離との関係から算出すること；及び、
５）前記走査ガルバノメータの前記最適焦点面を、前記第４距離に基づいて、前記基板の表面に移動すること、
の各工程を有する。

And calculating from the relationship between the fourth distance and the first, second and third distances represented by:
5) moving the optimum focal plane of the scanning galvanometer to the surface of the substrate based on the fourth distance;
It has each process.

  Further, in the step 5), the third sensing element includes the vertical actuator until the vertical distance from the zero plane of the third sensing element to the surface of the substrate is equal to the fourth distance Z_s. Servo closed loop control may be performed so that the third sensing element and the scanning galvanometer are driven to move vertically in synchronization.

Further, the above object is achieved by a gantry device control method for the gantry device. The method is
1) Move the second sensing element directly above the first sensing element, and measure the first distance Z_BF from the second sensing element to the reference plane of the first sensing element by the second sensing element. To do;
2) The scanning galvanometer is moved on the first sensing element, and the vertical actuator detects the optimum focal plane of the scanning galvanometer on the reference plane of the first sensing element. Adjust the vertical position of the scanning galvanometer to the reference plane, and then detect the second distance Z_galBFRef from the zero plane of the third sensing element to the reference plane of the first sensing element by the third sensing element To do;
3) Move the second sensing element directly above the substrate, and the second sensing element causes distances z ₁ , z ₂ ,... From the second sensing element to a plurality of leveling points on the surface of the substrate. .. detecting z _n ;
4) The average distance pz from the second sensing element to the surface of the substrate, the inclination coefficients pwx and pwy, and the horizontal positions of the distances z ₁ , z ₂ ,..., Z _n and a plurality of leveling points. Based on (x1, y1), (x2, y2) and (x3, y3),

ｎは整数であり、ｐｗｘおよびｐｗｙは傾斜係数を表す。
により算出すること；
５）目標点の高さｚ＿ａｉｍを、前記第２検知素子から前記基板の表面までの前記平均距離ｐｚ、前記傾斜係数ｐｗｘ及びｐｗｙ、及び、目標点の予め設定された水平位置（ｘ＿ａｉｍ、ｙ＿ａｉｍ）を元に、

n is an integer, and pwx and pwy represent slope coefficients.
To calculate by:
5) The height z_aim of the target point is determined based on the average distance pz from the second sensing element to the surface of the substrate, the tilt coefficients pwx and pwy, and the preset horizontal position (x_aim, y_aim) of the target point. Based on the,

により算出すること；
６）前記第３検知素子の前記ゼロ平面から、前記走査ガルバノメータの前記最適焦点面が前記基板の表面に調整されたときの前記基板の表面までの第４距離Ｚ＿ｓを、

To calculate by:
6) A fourth distance Z_s from the zero plane of the third sensing element to the surface of the substrate when the optimum focal plane of the scanning galvanometer is adjusted to the surface of the substrate,

で表される、前記第４距離と、前記第１、第２及び第３距離との関係から算出すること；及び、
７）前記走査ガルバノメータを目標点の真上に移動し、前記走査ガルバノメータの前記最適焦点面を、前記第４距離に基づいて、目標点の位置における平面に移動すること、
の各工程を有する。

And calculating from the relationship between the fourth distance and the first, second and third distances represented by:
7) moving the scanning galvanometer directly above a target point, and moving the optimum focal plane of the scanning galvanometer to a plane at the position of the target point based on the fourth distance;
It has each process.

  Further, in the step 7), the third sensing element includes the vertical actuator until the vertical distance from the zero plane of the third sensing element to the surface of the substrate is equal to the fourth distance Z_s. Servo closed loop control may be performed so that the third sensing element and the scanning galvanometer are driven to move vertically in synchronization.

  Further, the number of the plurality of leveling points may be three.

  Compared with the prior art, the present invention has the following advantages: not only a wafer stage but also a gantry body and a gantry coupling mechanism are used together, and the gantry body is coupled by the gantry coupling term, It can be moved both in the vertical and vertical directions, which allows for additional options and application diversification; and the optical focus of the scanning galvanometer is that of the sensing element that measures the height of the scanning galvanometer Based on the vertical value preset by the measurement of the height of the scanning galvanometer based on the measurement results of the first, second and third sensing elements, it is adjusted to the target point by the movement of the scanning galvanometer under the closed loop control. This reduces control difficulties and reduces manufacturing costs.

FIG. 1 shows a vertical control mechanism according to the prior art. FIG. 2 is a configuration diagram of the vertical control mechanism of the gantry apparatus according to the first embodiment of the present invention. FIG. 3 is a configuration diagram of a laser sealing system for a glass package according to the first embodiment of the present invention. FIG. 4 shows the vertical control mechanism in the first embodiment of the present invention. FIG. 5 schematically shows the height adjustment of the scanning galvanometer in the first embodiment of the present invention. 6a to 6c schematically show a vertical control process of the gantry apparatus according to the present invention. FIG. 7 schematically shows the height adjustment of the scanning galvanometer in the second embodiment of the present invention.

  1, 1 light source; 2, first sensing element; 3, third sensing element; 4, scanning galvanometer; 5, second sensing element; 6, vertical actuator; 7, glass substrate; 7a, upper glass substrate; 8, gantry main body; 9, gantry guide rail; 10, wafer stage; 11, marble; 12, damper; 13, base; 14, zero plane of second sensing element; 16. Zero plane; 16, upper surface of third sensing element; 17, upper surface of upper glass substrate; 18, lower surface of upper glass substrate; 19, upper surface of lower glass substrate; 20, horizontal zero position; 21, first leveling point; , Target point; 23, second leveling point; 24, third leveling point; A, solder; B, OLED die.

  Specific embodiments of the present invention will be described in more detail with reference to the drawings. The features and advantages of the invention will become more apparent from the following detailed description and from the claims. It should be noted that the attached drawings are shown in a very simplified form that is not necessarily presented to scale, for the purpose of facilitating convenience and clarity for describing the embodiments.

First Embodiment FIG. 2 is a configuration diagram of a vertical control mechanism of a gantry apparatus according to a first embodiment of the present invention. As shown in the figure, the gantry device is
A support device that is a glass substrate or a sapphire substrate, and in this embodiment the glass substrate 7 supports a preferred substrate;
A gantry body 8, and a gantry coupling mechanism that connects the gantry body 8 to the support device via the gantry coupling mechanism;
A scanning galvanometer 4 disposed on the gantry main body 8, which can scan along a predetermined trajectory with light rays, and has one vertical degree of freedom (Z direction) and two horizontal degrees of freedom. A scanning galvanometer 4 having three movement degrees of freedom (X, Y, Z directions) consisting of (X and Y directions);
A light source 1 that emits a light beam, which allows the scanning galvanometer 4 to scan along a predetermined trajectory, in this embodiment in the form of a laser;
A third sensing element 3 disposed on the support device, wherein a third galvanometer 4 measures the size and intensity of the light spot formed by the light beam directed to the third sensing element 3 With element 3;
The first sensing element 2 is disposed on the gantry body 8 and measures the height of the surface of the substrate 7 and the height of the surface of the third sensing element 3. The height of the third sensing element 3 is The first sensing element 2 used for determining the position of the optimum focal plane of the scanning galvanometer 4 together with the size and intensity of the light spot;
A second sensing element 5 disposed on the gantry body 8 for measuring the height of the scanning galvanometer 4;
A vertical actuator 6 disposed between the scanning galvanometer 4 and the gantry body 8 and enabling the scanning galvanometer 4 to move vertically so that the optimum focus of the scanning galvanometer 4 is a target point.

The gantry coupling mechanism includes a gantry guide rail 9, and the gantry body 8 includes a first horizontal beam extending in the X direction and a second horizontal beam extending in the Y direction. The first and second horizontal transverse beams intersect each other at right angles in the horizontal plane, and move horizontally along the gantry guide rail 9 while supporting the scanning galvanometer 4. The first sensing element 2 may be called a non-contact height sensor, the second sensing element 5 may be called a scanning galvanometer height sensor, and the third sensing element 3 may be called a profilometer. The first sensing element 2 and the second sensing element 5 are configured for vertical measurement, and the first sensing element 2 is mounted as an aberration sensor, a displacement sensor, or a focus / leveling sensor, and at least the target object The Z-axis data of the target surface can be measured without being in contact with the object. The second sensing element 5 is implemented as a grating scale, a linear variable differential transformer (LVDT) or an interferometer, measures the height of the scanning galvanometer 4, and along with the vertical actuator 6, the optimum focus of the scanning galvanometer 4 is the target point. It is adapted to perform a closed loop control that moves the scanning galvanometer 4 until it is moved to. The third sensing element 3 measures the size and intensity of the light spot formed by the laser beam exiting the scanning galvanometer 4.
The support device includes a wafer stage 10, a marble 11, a damper 12, and a base 13. The glass substrate 7 is placed on the wafer stage 10, and the wafer stage 10 does not need to move vertically or horizontally, and may simply support the glass substrate 7. The profilometer 3, the wafer stage 10, and the gantry guide rail 9 are arranged on a marble 11, and the marble 11 is connected to a base 13 via a damper 12. The laser device is disposed on the base 13, emits a laser beam, passes through the scanning galvanometer 4, and is irradiated on the upper surface of the glass substrate 7 or the profilometer 3.

  The gantry apparatus may be used for laser sealing the glass substrate 7. As shown in FIG. 3, the glass substrate 7 includes an upper glass substrate 7a and a lower glass substrate 7b. During the laser sealing of the substrate, the light spot is aligned so as to cover the sealing solder A, that is, aligned with the bottom surface 18 of the upper glass substrate 7a. The direction of propagation of the laser beam is controlled by the scanning galvanometer 4 so that the light spot scans the sealing line quickly and periodically until the temperature of the solder A continuously rises to a temperature higher than its softening point. Is done. Thereafter, heating is interrupted, the upper and lower glass substrates are cooled, and the substrates are firmly bonded to each other by the solder A disposed between the substrates. As shown in FIG. 3, this forms a hermetic package in which the OLED die B is sealed. In this case, the height of the substrate surface measured by the first sensing element 2 is the height of the bottom surface 18 of the upper glass substrate.

  Furthermore, the gantry apparatus can also be used for an exposure apparatus that handles a single substrate as in the prior art. In this case, the height of the surface of the substrate measured by the first sensing element 2 is the height of the upper surface of the substrate.

  FIG. 4 schematically shows the vertical control mechanism in the first embodiment of the present invention. When the control unit issues a control command, the vertical actuator 6 (motor) is operated by the scanning galvanometer 4 based on the command. , And the current position is negatively fed back to the control unit to form a control loop. The preset vertical setpoint is calculated using a mathematical model established from data obtained from measurements performed by the first sensing element 2, the second sensing element 5 and the third sensing element 3. The mathematical model includes a first mathematical model and a second mathematical model. The difference between the vertical setting value and the current position is input to the control unit, and the current position is controlled to approach the vertical setting value, and finally the difference is controlled to be zero.

  FIG. 5 is a diagram schematically showing the height adjustment of the scanning galvanometer in the first embodiment of the present invention. The optical focus of the scanning galvanometer 4 is adjusted to the target point by visual field measurement and focusing. Vertical control is performed as follows.

      1. As shown in FIG. 6 a, the first sensing element 2 is moved directly above the third sensing element 3, and its height Z_BF is measured with respect to the upper surface 16 of the third sensing element 3.

      2. As shown in FIG. 6 b, the scanning galvanometer 4 is moved directly above the third sensing element 3, and the light emitted from the light source 1 is directed to the third sensing element 3 after passing through the scanning galvanometer 4. The vertical actuator 6 adjusts the vertical position of the scanning galvanometer 4 until the light spot detected by the third sensing element 3 has both the maximum size and the maximum intensity (the light spot having both the maximum size and the maximum intensity). Detection means that the upper surface 16 of the third sensing element 3 is at the optimum focus position of the scanning galvanometer 4). At this time, the distance from the scanning galvanometer 4 whose vertical position is updated to the upper surface 16 of the third sensing element 3 is the optimum focal length of the scanning galvanometer 4. In other words, the point on the upper surface 16 of the third sensing element 3 is located at the optimum focus of the scanning galvanometer 4. Since the vertical position of the scanning galvanometer 4 and the second sensing element 5 is fixed to each other, the vertical distance from the scanning galvanometer 4 to the upper surface 16 of the third sensing element 3 is indirectly determined by the second sensing element 5. The vertical distance Z_galBFRef from the zero plane 14 to the upper surface 16 of the third sensing element 3 is shown. When the vertical position of the scanning galvanometer 4 is adjusted by the vertical actuator 6, the second sensing element 5 and the scanning galvanometer 4 move synchronously, and the first sensing element 2 and the third sensing element 3 are perpendicular to each other. The position does not change.

      3. As shown in FIG. 6c, the first sensing element 2 is moved right above the substrate 7, and the height Z_mes with respect to the target point on the substrate surface is measured. That is, the height of the measurement position of the bottom surface 18 of the upper glass substrate is measured (that is, the target point 22). The target point 22 is not shown in FIG.

      4). When the optical focal point of the scanning galvanometer 4 is adjusted to the target point 22, the set height Z_s of the zero plane 14 of the second sensing element 5 with respect to the plane 18 on which the target point 22 is located is calculated by the following equation. The

式（１）は、上述した第１数理モデルを表す。

Equation (1) represents the first mathematical model described above.

      5. As shown in FIG. 6 c, the scanning galvanometer 4 is moved directly above the target point 22, and the optical focus of the scanning galvanometer 4 is moved to the target height 22. That is, the servo closed loop control is executed based on the second sensing element 5, and the vertical actuator 6 performs the first operation until the distance from the zero plane 14 of the second sensing element 5 to the target point 22 becomes equal to the set height Z_s. 2 The sensing element 5 and the scanning galvanometer 4 are moved synchronously in the vertical direction. As a result, the target point 22 is located at the optical focus of the scanning galvanometer 4.

Second Embodiment The schematic configurations of the vertical control device and the vertical control mechanism of the gantry apparatus in the second embodiment are also as shown in FIGS. 2 and 4, respectively. Since the gantry device of FIG. 2 and the vertical control mechanism of FIG. 4 are as described in the first embodiment, description thereof is omitted here.

  FIG. 7 is a diagram schematically showing the height adjustment of the scanning galvanometer in the second embodiment of the present invention. When a glass substrate is used, there is usually an inclination on the bottom surface of the upper glass substrate. In the present embodiment, unlike the first embodiment in which the inclination is not considered, the influence of the bottom inclination of the upper glass substrate on the set height is evaluated. The optical focus of the scanning galvanometer 4 is adjusted to the target point by visual field measurement and focusing. Vertical control is performed as follows.

      1. As shown in FIG. 6 a, the first sensing element 2 is moved directly above the third sensing element 3, and its height Z_BF is measured with respect to the upper surface 16 of the third sensing element 3.

      2. As shown in FIG. 6 b, the scanning galvanometer 4 is moved directly above the third sensing element 3, and the light emitted from the light source 1 is directed to the third sensing element 3 after passing through the scanning galvanometer 4. The vertical actuator 6 adjusts the vertical position of the scanning galvanometer 4 until the light spot detected by the third sensing element 3 has both the maximum size and the maximum intensity (the light spot having both the maximum size and the maximum intensity). Detection means that the upper surface 16 of the third sensing element 3 is at the optimum focus position of the scanning galvanometer 4). At this time, the distance from the scanning galvanometer 4 whose vertical position is updated to the upper surface 16 of the third sensing element 3 is the optimum focal length of the scanning galvanometer 4. In other words, the point on the upper surface 16 of the third sensing element 3 is located at the optimum focus of the scanning galvanometer 4. Since the vertical position of the scanning galvanometer 4 and the second sensing element 5 is fixed to each other, the vertical distance from the scanning galvanometer 4 to the upper surface 16 of the third sensing element 3 is indirectly determined by the second sensing element 5. The vertical distance Z_galBFRef from the zero plane 14 to the upper surface 16 of the third sensing element 3 is shown. When the vertical position of the scanning galvanometer 4 is adjusted by the vertical actuator 6, the second sensing element 5 and the scanning galvanometer 4 move synchronously, and the first sensing element 2 and the third sensing element 3 are perpendicular to each other. The position does not change.

3. As shown in FIG. 6c, the first sensing element 2 is moved directly above the substrate 7, and the heights z ₁ , z ₂ ,..., Z _n with respect to a plurality of leveling points on the substrate surface are measured. And n is an integer. In the present embodiment, the first sensing element 2 has its height on the lower surface 18 of the upper glass substrate of the substrate supported by the wafer stage 10, z ₁ with respect to the first leveling point 21, and the second leveling point 23. On the other hand, z ₂ and z ₃ with respect to the third leveling point 24 are measured.

      4). The overall height and inclination of the upper glass substrate are calculated based on the heights of the three leveling points. The calculation of height and slope requires the setting of three unknowns, defined here as pz, pwx and pwy. Next, the bottom surface 18 of the upper glass substrate can be described using the following equation:

第１レベリングポイント２１、第２レベリングポイント２３、及び、第３レベリングポイント２４の水平ゼロ位置を、それぞれ、（ｘ_１，ｙ_１）、（ｘ_２，ｙ_２）、（ｘ_３，ｙ_３）と定義し、当該３つのレベリングポイントにおける前記第１検知素子２の高さ、ｚ_１、ｚ_２、及びｚ_３と共に式（２）に代入すると、

The horizontal zero positions of the first leveling point 21, the second leveling point 23, and the third leveling point 24 are respectively (x ₁ , y ₁ ), (x ₂ , y ₂ ), (x ₃ , y ₃ ). And substituting into equation (2) together with the height of the first sensing element 2 at the three leveling points, z ₁ , z ₂ , and z ₃ ,

が得られる。
未知数ｐｚ、ｐｗｘおよびｐｗｙは、式（３）から解くことができる。

Is obtained.
The unknowns pz, pwx and pwy can be solved from equation (3).

      5. The height of the target point 22 is calculated. When the horizontal position of the target point 22 is defined as (x_aim, y_aim), the relative height is defined as z_aim, and these are substituted into the equation (2),

が得られる。
ｚ＿ａｉｍは、式（４）から解くことができる。

Is obtained.
z_aim can be solved from Equation (4).

      6). When the optical focus of the scanning galvanometer 4 is adjusted to the target point 22, the vertical setting height Z_s of the zero plane 14 of the second sensing element 5 with respect to the plane 18 on which the target point 22 is located is calculated by the following equation. .

数式（２），（３），（４），及び（５）は前述の第２数理モデルを構成する。

Equations (2), (3), (4), and (5) constitute the aforementioned second mathematical model.

      7). As shown in FIG. 6 c, the scanning galvanometer 4 is moved directly above the target point 22, and the optical focus of the scanning galvanometer 4 is moved to the target height 22. That is, the servo closed loop control is executed based on the second sensing element 5, and the vertical actuator 6 performs the first operation until the distance from the zero plane 14 of the second sensing element 5 to the target point 22 becomes equal to the set height Z_s. 2 The sensing element 5 and the scanning galvanometer 4 are moved synchronously in the vertical direction. As a result, the target point 22 is located at the optical focus of the scanning galvanometer 4.

  In summary, the control mechanism and method of the gantry apparatus in the above-described embodiment of the present invention employ not only the wafer stage but also the gantry body 8 and the gantry coupling mechanism. The gantry body 8 is combined with a gantry coupling mechanism, and as a result, is movable in both the horizontal direction and the vertical direction. This allows for additional options and diversification of applications. Furthermore, the optical focus of the scanning galvanometer 2 is simply using a closed loop control based on the set vertical value of the scanning galvanometer height sensor 5 calculated from the measurement results of the non-contact height sensor 2 and the scanning galvanometer height sensor 5. The target point 22 can be adjusted simply by moving the scanning galvanometer 4. This reduces control difficulty and reduces manufacturing costs.

  The above description presents several preferred embodiments of the invention and is not meant to limit its scope in any way. All equivalent substitutions and modifications made by those skilled in the art to the subject matter disclosed herein and details thereof without departing from the scope of the invention do not depart from the scope.

Claims (14)

A support device for supporting the substrate;
A gantry main body, and the gantry connection mechanism, wherein the gantry main body is disposed on the support device via the gantry connection mechanism;
A vertical actuator disposed on the gantry body and movable in a direction perpendicular to the gantry body;
A scanning galvanometer disposed on the vertical actuator;
A first sensing element disposed on the support device, wherein the first sensing element detects an optimum focal plane of the scanning galvanometer from a reference plane of the first sensing element;
A second sensing element disposed on the gantry body for measuring a first distance from a surface of the substrate to a reference plane of the first sensing element;
A third sensing element disposed on the vertical actuator, the first sensing element having on the reference plane of the first sensing element that has detected the optimum focal plane of the scanning galvanometer from the scanning galvanometer; Measuring the second distance to the surface, the third sensing element;
The vertical actuator is configured such that, based on the first distance and the second distance, a distance between the scanning galvanometer and the surface of the substrate is equal to a sum of the first distance and the second distance. A gantry device that adjusts the vertical position of the scanning galvanometer.   The gantry device according to claim 1, wherein the gantry coupling mechanism includes a gantry guide rail.   The gantry body includes a first horizontal beam and a second horizontal beam, and the first horizontal beam and the second horizontal beam intersect at a right angle in a horizontal plane and move horizontally along the gantry guide rail. 3. A gantry apparatus according to claim 2, which supports the possible scanning galvanometer.   The gantry apparatus according to claim 1, wherein the first sensing element is a profilometer.   The gantry apparatus according to claim 1, wherein the second detection element is an aberration sensor, a mutation sensor, or a focus / leveling sensor.   The gantry apparatus according to claim 1, wherein the third sensing element is a lattice scale, a linear variable differential transformer, or an interferometer.   The support device includes a wafer stage, marble, a damper, and a base, the substrate is disposed on the wafer stage, the wafer stage is disposed on the marble, and the marble is interposed through the damper. The gantry device according to claim 1, wherein the gantry device is connected to a base.   The gantry apparatus is used for laser sealing of a glass substrate, and the substrate includes an upper glass substrate and a lower glass substrate, and a surface of the substrate is a bottom surface of the upper glass substrate. Gantry equipment.   The gantry apparatus according to claim 1, wherein the gantry apparatus is used in an exposure apparatus, and a surface of the substrate is an upper surface of the substrate. A gantry device control method for a gantry device according to claim 1,
1) Move the second sensing element directly above the first sensing element, and measure the first distance Z_BF from the second sensing element to the reference plane of the first sensing element by the second sensing element. To do;
2) The scanning galvanometer is moved on the first sensing element, and the vertical actuator detects the optimum focal plane of the scanning galvanometer on the reference plane of the first sensing element. The vertical position of the scanning galvanometer is adjusted to the reference plane, and then the second distance Z_galBFRef from the zero plane of the third sensing element to the reference plane of the first sensing element is adjusted by the third sensing element. Detecting;
3) moving the second sensing element directly above the substrate, and detecting a third distance Z_mes from the second sensing element to the surface of the substrate by the second sensing element;
4) A fourth distance Z_s from the zero plane of the third sensing element to the surface of the substrate when the optimum focal plane of the scanning galvanometer is adjusted to the surface of the substrate,

And calculating from the relationship between the fourth distance and the first, second and third distances represented by:
5) moving the optimum focal plane of the scanning galvanometer to the surface of the substrate based on the fourth distance;
The gantry apparatus control method which has each process of these.   In the step 5), the third sensing element includes the vertical actuator until the vertical distance from the zero plane of the third sensing element to the surface of the substrate becomes equal to the fourth distance Z_s. The gantry device control method according to claim 10, wherein servo closed loop control is performed so that the detection element and the scanning galvanometer are driven to move vertically in synchronization. A gantry device control method for a gantry device according to claim 1,
1) Move the second sensing element directly above the first sensing element, and measure the first distance Z_BF from the second sensing element to the reference plane of the first sensing element by the second sensing element. To do;
2) The scanning galvanometer is moved on the first sensing element, and the vertical actuator detects the optimum focal plane of the scanning galvanometer on the reference plane of the first sensing element. The vertical position of the scanning galvanometer is adjusted to the reference plane, and then the second distance Z_galBFRef from the zero plane of the third sensing element to the reference plane of the first sensing element is adjusted by the third sensing element. Detecting;
3) Move the second sensing element directly above the substrate, and the second sensing element causes distances z ₁ , z ₂ ,... From the second sensing element to a plurality of leveling points on the surface of the substrate. .. detecting z _n ;
4) The average distance pz from the second sensing element to the surface of the substrate, the inclination coefficients pwx and pwy, and the horizontal positions of the distances z ₁ , z ₂ ,..., Z _n and a plurality of leveling points. Based on (x1, y1), (x2, y2) and (x3, y3),

n is an integer, and pwx and pwy represent slope coefficients.
To calculate by:
5) The height z_aim of the target point is determined based on the average distance pz from the second sensing element to the surface of the substrate, the tilt coefficients pwx and pwy, and the preset horizontal position (x_aim, y_aim) Based on the,

To calculate by:
6) A fourth distance Z_s from the zero plane of the third sensing element to the surface of the substrate when the optimum focal plane of the scanning galvanometer is adjusted to the surface of the substrate,

And calculating from the relationship between the fourth distance and the first, second and third distances represented by:
7) moving the scanning galvanometer directly above a target point, and moving the optimum focal plane of the scanning galvanometer to a plane at the position of the target point based on the fourth distance;
The gantry apparatus control method which has each process of these.   In the step 7), the third sensing element includes the vertical actuator until the vertical distance from the zero plane of the third sensing element to the surface of the substrate is equal to the fourth distance Z_s. The gantry apparatus control method according to claim 12, wherein servo closed loop control is performed so that the detection element and the scanning galvanometer are driven to move vertically in synchronization.   The gantry apparatus control method according to claim 12, wherein the number of the plurality of leveling points is three.

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