JP6243199B2 - Manufacturing method of ceramic substrate - Google Patents

Description

  The present invention relates to a method of manufacturing a ceramic substrate for manufacturing a ceramic substrate from a ceramic grease sheet, and more particularly to a cutting method capable of suitably cutting a ceramic grease sheet with a protective tape disposed on a base.

  Conventionally, as a method for manufacturing a ceramic substrate used for a wiring substrate, for example, as shown below, a ceramic green sheet with a protective tape (protective film) wound in a roll shape is cut to a predetermined size, and then A technique is known in which a protective tape is peeled off from a cut ceramic green sheet, and then the ceramic green sheet is fired to manufacture a ceramic substrate. In addition, the technique of patent document 1 is disclosed as a technique which peels a film-shaped member.

Below, the manufacturing process of this ceramic substrate is shown concretely.
As shown in FIG. 11A, first, for example, a vinyl chloride base sheet P2 is placed on a metal base P1, and a ceramic green sheet P4 with a protective tape P3 is placed thereon, and the protective tape P3 is placed thereon. Is placed on the base sheet P2 side (downward).

  Next, as shown in FIG. 11B, the cutting blade P5 is disposed along the cutting portion above the ceramic green sheet P4. Then, the cutting blade P5 is moved downward and pushed down to the center portion of the base sheet P2, thereby cutting the ceramic green sheet P4 together with the protective tape P3.

  Next, as shown in FIG. 11 (C), the cut ceramic green sheet P4 is arranged so that the protective tape P3 faces upward, and a cutter knife P6 or the like is provided between the protective tape P3 and the ceramic green sheet P4. Is inserted to float the protective tape P3 from the ceramic green sheet P4.

  Next, as shown in FIG. 11D, the end of the floated protective tape P3 is pinched with a finger or the like, and the protective tape P3 is peeled off from the ceramic green sheet P4.

JP 7-157187 A

However, the above-described prior art has the following problems, and improvements are required.
Specifically, since the protective tape and the ceramic green sheet are in close contact with each other, the protective tape cannot be easily peeled off. Ceramic green sheets could be damaged. As a result, there is a problem that the yield of the ceramic green sheet itself or the fired ceramic substrate product is lowered.

  Further, since the cutting blade is inserted to the base sheet made of vinyl chloride, chips on the base sheet may be generated, and the chips may adhere to the ceramic green sheet. As a result, there is a problem that the yield of the ceramic green sheet itself or the fired ceramic substrate product is lowered.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a ceramic substrate that can be easily manufactured by peeling off a protective tape from a ceramic green sheet. It is in.

  (1) The present invention provides, as a first aspect, a first step in which a ceramic green sheet having a protective tape attached to one surface is disposed on the base with the protective tape side as a base side, and the base A second step of cutting the protective tape and the ceramic green sheet disposed on the predetermined shape using a cutting blade; and the ceramic green sheet with respect to the protective tape and the ceramic green sheet after the cutting. A method for producing a ceramic substrate, comprising: a third step of peeling the protective tape from a first step; and a fourth step of firing the ceramic green sheet from which the protective tape has been peeled to produce a ceramic substrate. Grooves are formed on the surface on the side where the protective tape is disposed along the cutting portion of the cutting blade. Then, the cutting blade is disposed along the groove, and the ceramic green sheet and the protective tape are inserted into the groove from the ceramic green sheet side while vibrating the cutting blade in the vertical direction. In the third step, the protective tape is peeled off from the ceramic green sheet by pinching a portion turned up from the ceramic green sheet at the time of the cutting.

  In the first aspect, a groove is formed on the surface of the base on which the protective tape is disposed along a cutting position by the cutting blade (that is, a position where the ceramic green sheet is cut). Then, the cutting blade is disposed along the groove, and the ceramic green sheet and the protective tape are cut by pushing the cutting blade into the groove from the ceramic green sheet side while vibrating the cutting blade in the vertical direction.

  At the time of this cutting, the tip of the cutting blade hits the protective tape, and the protective tape is bent in the pressing direction, so that it is turned up from the ceramic green sheet. Can be easily peeled off.

  Therefore, in the first aspect, even when the protective tape and the ceramic green sheet are in close contact, the protective tape can be easily peeled off. Therefore, unlike the prior art, it is not necessary to insert a cutter knife or the like between the protective tape and the ceramic green sheet, so that the ceramic green sheet is not damaged. As a result, the yield of the ceramic green sheet itself and the product of the fired ceramic substrate is improved.

  In addition, since a vinyl chloride base sheet is not used, chips on the base sheet are not generated. From this point, the yield of the ceramic green sheet itself and the product of the ceramic substrate after firing is improved. is there.

(2) As a second aspect of the present invention, the cutting blade is a cutting blade that vibrates ultrasonically.
The present invention exemplifies a suitable cutting blade. That is, the ceramic green sheet and the protective tape can be easily cut by using a cutting blade (ultrasonic cutter) that vibrates ultrasonically.

(3) As a third aspect of the present invention, the groove is a polygon having a frame shape in plan view.
The third aspect exemplifies a preferable groove shape. That is, when the planar shape of the ceramic green sheet to be cut is a polygon such as a square, if a polygonal groove is provided along the outer peripheral shape, by using a cutting blade along the groove, A ceramic green sheet having a desired shape can be easily formed.

(4) The present invention is characterized in that, as a fourth aspect, the cutting blades are arranged along each side of the polygon.
In this 4th aspect, since the cutting blade is arrange | positioned along each edge | side of a polygon (groove), it can cut | disconnect efficiently. The cutting blade is desirably arranged at the center in the width direction of the groove.

  (5) As a fifth aspect of the present invention, the ceramic green sheet is a single green sheet made of one ceramic green sheet or a green sheet laminate in which a plurality of ceramic green sheets are laminated. It is characterized by that.

The fifth aspect exemplifies the aspect of the ceramic green sheet.
(6) In the present invention, as a sixth aspect, the width W0 of the groove, the width W1 of the cutting blade on the surface of the base when the protective tape is cut, and the thickness t of the protective tape are expressed by the following formula ( The relationship 1) is satisfied.

(W0−W1) / 2 ≧ k1 · t (1)
(K1 is a coefficient)
As illustrated in FIG. 1, WO is (width of the vertical direction and the extending direction of the blade (the direction perpendicular to the plane)) groove width, W1 is the width of the cutting blade in put that soil stand surface during cutting of the protection tape , T is the thickness of the protective tape, and D is the amount of deflection of the protective tape. Note that k1 is a coefficient determined by the physical properties of the protective tape.

In addition, W1 can be calculated | required like a half of the maximum width of a cutting blade, for example.
FIG. 2A is a graph showing the formula (1). A region R indicated by diagonal lines in the drawing is a range satisfying the above-described formula (1), that is, a region where the vicinity of the cut portion of the protective tape can be preferably separated from the ceramic green sheet at the time of cutting (the protective tape is easily peeled off).

  FIG. 2B and the following formula (2) show the relationship between the amount of deflection of the protective tape and the thickness of the protective tape. When the groove width W0 is constant, the amount of deflection increases as the thickness of the protective tape increases. It turns out that it becomes small. K2 is a coefficient determined by the physical properties of the protective tape.

D = k2 / 1 / t (2)
(However, when W0 is constant)
FIG. 2C and the following formula (3) show the relationship between the amount of deflection of the protective tape and the width of the groove. When the thickness of the protective tape is constant, the amount of deflection increases as the width of the groove increases. I understand that. Note that k3 is a coefficient determined by the physical properties of the protective tape.

D = k3 · W0 (3)
(However, when t is constant)

It is explanatory drawing which shows the width | variety of a groove | channel, the width | variety of a cutting blade, the thickness of a protective tape, the amount of bending, etc. FIG. (A) is a graph which shows Formula (1), (B) is a graph which shows Formula (2), (C) is a graph which shows Formula (3). It is process drawing explaining the manufacturing process of a ceramic substrate. (A) is a top view of a base, (B) is X1-X1 sectional drawing of (A). It is explanatory drawing which shows a part of manufacturing method of a ceramic substrate. It is explanatory drawing which shows a part of manufacturing method of a ceramic substrate. (A) is a top view which shows the state which has arrange | positioned the ceramic green sheet (with protection tape) on the surface of a base, (B) is X2-X2 sectional drawing of (A), (C) is the Y section in (B). It is sectional drawing which expands and shows typically. The state at the time of cutting is shown by breaking the base in the thickness direction and perpendicular to the direction in which the groove extends, (A) is an explanatory view showing a state in which a cutting blade is arranged on the ceramic green sheet, (B) Explanatory drawing which expands and shows the state which a cutting blade strikes and bends a protective tape, (C) is explanatory drawing which expands and shows the state which the cutting blade cut | disconnected the protective tape. It is a perspective view which shows the positional relationship of a cutting blade and a groove | channel. It is explanatory drawing which shows a part (process after a cutting | disconnection) of the manufacturing method of a ceramic substrate. It is explanatory drawing of a prior art.

  Next, an embodiment of a method for manufacturing a ceramic substrate will be described as a mode for carrying out the present invention.

a) The manufacturing process of the ceramic substrate of a present Example is demonstrated based on FIGS. In addition, about the procedure of the process of step S100-S170, it shows collectively in FIG.
<Base preparation process (step S100)>
First, as shown in FIG. 4, a base 1 made of a ceramic plate having a length of 250 mm, a width of 250 mm, and a thickness of 20 mm is prepared.

  The surface of the base 1 has, for example, a vertical (outer diameter) 170 mm × horizontal (outside) so that the outer diameter shape of a ceramic green sheet 3 (see FIG. 5) to be described later, that is, the outer diameter shape in a plan view is along a square shape. A square frame-shaped groove 5 is formed along each side of a square having a diameter of 170 mm × width 10 mm × depth 10 mm. However, the outer dimension of the groove 5 is slightly smaller than the outer dimension of the ceramic green sheet 3.

As the material of the ceramic plate constituting the base 1, for example, alumina is (Al 2 _{O 3),} can be adopted, other than a ceramic material (e.g., resin) can be used.
<Protective tape preparation process (step S110)>
Further, as shown in FIG. 5A, a protective tape (carrier film) 7 that is a single-sided tape has an adhesive layer (adhesive) made of an adhesive (adhesive) on one surface of a base film (not shown). (Not shown) is provided.

  As a material for the base film, polyester (PET or the like), polyphenylene sulfide (PPS), polyetherimide (PEI) or the like can be employed, and a film having a thickness of 30 to 100 μm can be used.

In addition, when using, for example, a polyester film as the protective tape 7, by dispersing solid particles in the film and making the structure in which long-chain molecules constituting the film are appropriately blocked in the middle, the shearing property of the film is increased. It is preferable to improve. As the solid particles, particles such as TiO ₂ , BaO ₃ , Ba ₂ (SO ₄ ) ₃ , alumina (Al ₂ O ₃ ), and silica (SiO ₂ ) can be used.

As the adhesive constituting the adhesive layer, for example, an acrylic or rubber pressure sensitive adhesive that can be bonded and peeled can be employed.
<Casting process (step S120)>
As shown in FIG. 5B, a known slurry (slurry) is prepared using a ceramic material containing, for example, ceramic powder, a binder, and an organic solvent. Then, using the slurry, the slurry is thinly applied on the protective tape 7 by, for example, a doctor blade method to form the slurry layer 9.

Here, as the ceramic material, a low-temperature fired ceramic in which borosilicate glass and alumina are mixed, a high-temperature fired ceramic made of alumina, or the like can be used.
Thereafter, as shown in FIG. 5C, the slurry layer 9 is dried to form a known clay-like ceramic green sheet 3 on the protective tape 7. Thereby, for example, the ceramic green sheet 3 having a thickness of 30 to 120 μm is cast (tape-molded).

The ceramic green sheet 3 with the protective tape 7 is usually wound and stored in a roll shape as shown in FIG. 5D, for example, but may not be wound in a roll shape.
<Sheet cutting step (step S130)>
After casting, the ceramic green sheet 3 is attached to the ceramic green sheet 3 with a protective knife 7 using a cutter knife (not shown) as shown in FIG. × 200 mm wide).

In the following description, the ceramic green sheet 3 having the protective tape 7 attached to one surface may be referred to as a protective green sheet 11.
<Sheet Placement Step (Step S140)>
Next, as shown in FIG. 6B, the protective green sheet 11 is placed on the surface of the base 1 with the grooves 5 with the protective tape 7 side down.

  Specifically, as shown in FIG. 7, the center of gravity of the base 1 and the center of the protective green sheet 11 are made to coincide so that all the grooves 5 are covered, and the sides of the base 1 and the protective green sheet 11 are parallel to each other. Then, the protective green sheet 11 is arranged on the base 1.

  As shown in FIG. 7C, for example, when the width W0 of the groove 5 is 10 mm, the width L0 of the protective green sheet 11 protruding outward from the groove 5 is, for example, 15 mm that is equal to or larger than the width W0 of the groove 5. It is.

<Ultrasonic cutting process (step S150)>
Next, as shown in FIG. 8, the protective green sheet 11 is cut using an ultrasonic cutter (that is, a cutting blade 13 that vibrates ultrasonically).

  Specifically, as shown in FIG. 8A, a cutting blade is formed along the groove 5 at the center of the width of the groove above the ceramic green sheet 3, that is, above the ceramic green sheet covering the groove 5. 13 is arranged.

  Specifically, as shown in FIG. 9, the cutting blade 13 is a rectangular plate-shaped member (thickness L1: 2.5 mm × width L2: 10 mm × length L3: 160 mm) with a sharp tip. The linear cutting edge 13 a is arranged so as to be parallel to the longitudinal direction of the groove 5.

  Then, as shown in FIGS. 8B and 8C, protection is performed by gradually moving the cutting blade 13 downward by oscillating the cutting blade 13 to the upper limit with a frequency of 20 kHz or less, for example, 20 kHz. The green sheet 11 is cut.

  That is, as shown in FIG. 8B, when the cutting blade 13 applies a downward pressing force (F1) to the protective green sheet 11, a frictional force (F2) is applied, and the cutting force (F3) protects the protective green. The sheet 11 is cut.

  Specifically, in this embodiment, since the groove 5 is provided in the direction in which the cutting force is applied, when the cutting blade 13 is pressed against the ceramic green sheet 3, the ceramic green sheet 3 and the protective tape 7 are pulled downward. The ceramic green sheet 3 is gradually cut while being extended.

At this time, a shearing force (F4) acts between the ceramic green sheet 3 and the protective tape 7, and the adhesion between the ceramic green sheet 3 and the protective tape 7 becomes weak.
When the cutting blade 13 reaches the interface between the ceramic green sheet 3 and the protective tape 7, only the protective tape 7 receives a pressing force downward, so that a gap 15 is generated between the ceramic green sheet 3 and the protective tape 7. The protective tape 7 is cut while widening the gap 15.

After the cutting, the protective tape 7 is turned up by friction between the side surface of the vibrating cutting blade 13 and the protective tape 7.
Then, the same operation is sequentially performed along the longitudinal direction of the groove 5 so that the periphery of the protective green sheet 11 is cut into a desired square of 160 mm × 160 mm.

<Sheet peeling process (step S160)>
Next, as shown in FIG. 10 (A), a part (end part) of the protective tape 7 is slightly turned up from the ceramic green sheet 3, and as shown in FIG. The raised portion 7 a is pinched with a finger or the like, and the protective tape 7 is peeled off from the ceramic green sheet 3.

As a result, a sheet body of only the ceramic green sheet 3 as shown in FIG. 10C is obtained.
<Degreasing / firing step (step S170)>
Thereafter, the ceramic green sheet 3 is degreased by heating, for example, 240 ° C. × 10 hours, and further fired at 840 ° C. × 60 minutes. As a result, a ceramic substrate 17 as shown in FIG. 10D (for example, 120 mm long × 120 mm wide × 1 mm thick) is obtained. In this case, when glass ceramic is used as the low-temperature firing material, firing is performed at about 870 ° C.

b) Next, the effect of the present embodiment will be described.
In the present embodiment, a groove 5 is formed on the surface of the base 1 (on the side where the protective tape 7 is disposed) along a cutting position by the cutting blade 13 (that is, a position where the ceramic green sheet 3 is cut). .

  Then, a cutting blade 13 (which is an ultrasonic cutter) is disposed along the groove 5 and is pushed into the groove 5 from the ceramic green sheet 3 side while vibrating the cutting blade 13 in the vertical direction. The green sheet 3 and the protective tape 7 are cut.

  At the time of this cutting, the cutting edge 13a of the cutting blade 13 hits the protective tape 7, and the protective tape 7 is bent up in the pressing direction so that it is turned up from the ceramic green sheet 3. Thus, the protective tape 7 can be easily peeled off from the ceramic green sheet 3.

  Therefore, in this embodiment, even when the protective tape 7 and the ceramic green sheet 3 are in close contact, the protective tape 7 can be easily peeled off. Therefore, unlike the prior art, it is not necessary to insert a cutter knife or the like between the protective tape 7 and the ceramic green sheet 3, so that the ceramic green sheet 3 is not damaged. As a result, the yield of products of the ceramic green sheet 3 and the fired ceramic substrate 17 is improved.

  In addition, since the base sheet as in the prior art is not used, chips of the base sheet are not generated, and from this point, the yield of the products of the ceramic green sheet 3 and the ceramic substrate 17 is improved.

  Further, in the present embodiment, a rectangular frame-shaped (square) groove 5 is formed in plan view corresponding to the outer shape of the ceramic green sheet 3, so that by cutting along the groove 5, a desired shape can be obtained. The ceramic green sheet 3 having the shape (square) can be obtained.

Needless to say, the present invention is not limited to the above-described embodiments, and can be implemented in various modes without departing from the scope of the present invention.
(1) For example, when the groove is polygonal in plan view, a cutting blade may be disposed in the groove corresponding to each side. Thereby, it can cut | disconnect efficiently.

  (2) In the above embodiment, the ceramic substrate was manufactured from one ceramic green sheet (single green sheet), but a green sheet laminate in which a plurality of ceramic green sheets are laminated may be used as the ceramic green sheet. .

DESCRIPTION OF SYMBOLS 1 ... Base 3 ... Ceramic green sheet 5 ... Groove 7 ... Protection tape 13 ... Cutting blade 17 ... Ceramic substrate

Claims (6)

A first step of disposing a ceramic green sheet having a protective tape affixed on one surface thereof on the base with the protective tape side as a base side;
A second step of cutting the protective tape and the ceramic green sheet disposed on the base into a predetermined shape using a cutting blade;
For the protective tape and the ceramic green sheet after the cutting, a third step of peeling the protective tape from the ceramic green sheet;
A fourth step of producing a ceramic substrate by firing the ceramic green sheet from which the protective tape has been peeled;
A method of manufacturing a ceramic substrate having
On the surface of the base on the side where the protective tape is disposed, a groove is formed along a cutting position by the cutting blade,
In the second step, the cutting blade is disposed along the groove, and the cutting blade is pushed into the groove from the ceramic green sheet side while vibrating the cutting blade in the vertical direction. Cutting the protective tape,
In the third step, a method of manufacturing a ceramic substrate, wherein a portion of the ceramic green sheet turned up at the time of cutting is pinched and the protective tape is peeled off from the ceramic green sheet.   The method for manufacturing a ceramic substrate according to claim 1, wherein the cutting blade is a cutting blade that vibrates ultrasonically.   The method for manufacturing a ceramic substrate according to claim 1, wherein the groove is a polygon having a frame shape in plan view.   The said cutting blade is each arrange | positioned along each side of the said polygon, The manufacturing method of the ceramic substrate of Claim 3 characterized by the above-mentioned.   The ceramic green sheet is a single green sheet composed of one ceramic green sheet or a green sheet laminate in which a plurality of ceramic green sheets are laminated. A method for producing a ceramic substrate according to claim 1. The width W0 of the groove, the width W1 of the cutting blade on the surface of the base when the protective tape is cut, and the thickness t of the protective tape satisfy the relationship of the following formula (1). The manufacturing method of the ceramic substrate of any one of claim | item 1 -5.
(W0−W1) / 2 ≧ k1 · t (1)
(K1 is a coefficient)

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