JP6269112B2 - Image acquisition device, image acquisition device manufacturing method, and electronic apparatus - Google Patents

Description

  The present invention relates to an image acquisition device, a method for manufacturing the image acquisition device, and an electronic apparatus.

As an image acquisition device, for example, Patent Document 1 discloses a light source layer including a photographic light source unit that irradiates a photographic subject with photographic light including a first wavelength, and light having a first wavelength emitted from the light source unit. An image pickup apparatus having a detection layer including a detection element for detecting light and a light shielding unit provided between the light source layer and the detection layer and having a structure in which the light source layer is sandwiched between the imaging target and the detection layer It is disclosed.
According to such an imaging apparatus of Patent Document 1, the light source is integrated and small, and light emitted from the light source is not directly incident on the detection element but is blocked by the light shielding unit. An imaging device suitable for biometric authentication can be provided.

JP 2009-3821 A

  According to the imaging apparatus of Patent Document 1, the light shielding means is provided substantially in parallel between the light source layer and the detection layer. However, there is no specific description about what means or method the light shielding means is arranged in a state substantially parallel to the light source layer or the detection layer. If the distance between the light source layer and the light shielding unit and the distance between the light shielding unit and the detection layer are not constant, respectively, the light emitted from the light source and reflected by the object to be photographed can be reliably guided to the detection element, There was a problem that unnecessary light could not be reliably shielded.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example] The image acquisition apparatus according to this application example is an image acquisition apparatus in which a plurality of substrates are stacked via a sealing material, and is disposed on the uppermost layer substrate and the lowermost layer. A lowermost substrate, and a plurality of intermediate layer substrates disposed between the uppermost layer substrate and the lowermost layer substrate, and any one of the uppermost layer substrate and the plurality of intermediate layer substrates Is a substrate having a light emitting function, and among the lowermost layer substrate and the plurality of intermediate layer substrates, any one of the substrates disposed below the substrate having the light emitting function is a substrate having a light receiving function, and the image In a state where the acquisition device is viewed in plan, a sealing material used for stacking the plurality of intermediate layer substrates is an arrangement of the sealing material used for stacking the uppermost layer substrate and the intermediate layer substrate immediately below the uppermost layer substrate. Within the region and the bottom layer Characterized by the presence in the intermediate layer substrate and the arrangement region of the sealing material used for lamination of the immediately above the the plate bottom layer substrate.

  According to the configuration of this application example, the sealing material is disposed in the region where the sealing material is disposed between the uppermost substrate and the intermediate layer substrate, and the region where the sealing material is disposed between the lowermost substrate and the other intermediate layer substrate. A sealing material used for stacking a plurality of intermediate layer substrates disposed between the upper layer substrate and the lowermost layer substrate is disposed. Therefore, compared to the case where the arrangement regions of the sealing materials are different from each other, distortion and bending are less likely to occur when a plurality of substrates are stacked. Therefore, the gap between the intermediate layer substrates is substantially constant, and an image acquisition device capable of acquiring a clear image can be provided.

In the image acquisition device according to the application example, any one of the plurality of intermediate layer substrates may be configured to block light incident on the substrate having the light receiving function directly from the light emitted from the substrate having the light emitting function. It preferably has a function.
According to this configuration, unnecessary light other than the image light that contributes to image acquisition is shielded, so that a clearer image can be acquired.

In the image acquisition device according to the application example described above, any one of the uppermost substrate and the plurality of intermediate layer substrates collects light reflected from a subject toward the substrate having the light receiving function. A substrate having an optical function is preferable.
According to this configuration, even if the intensity of light emitted from the substrate having a light emitting function is weak, it is possible to collect light reflected from the subject and obtain a clear image.

  [Application Example] Another image acquisition apparatus according to this application example is an image acquisition apparatus in which a plurality of substrates are stacked via a sealing material, and includes a first substrate having a light receiving unit and a light shielding unit. And a second substrate stacked on the first substrate, a light emitting unit, a third substrate stacked on the second substrate, a light collecting unit, and the third substrate. A fourth substrate stacked on the substrate, wherein the first substrate and the second substrate are stacked via a first sealant, and the third substrate and the fourth substrate The substrate is laminated via a second sealing material, the second substrate and the third substrate are laminated via a third sealing material, and the image acquisition device is viewed in plan view, The third sealing material is present in the arrangement area of the first sealing material and in the arrangement area of the second sealing material.

  According to the configuration of this application example, the third sealing material is disposed in the first sealing material arrangement region and in the second sealing material region, and the second substrate and the third substrate are separated from each other. Laminated. Therefore, when the second substrate and the third substrate are stacked, distortion and bending are less likely to occur than when the arrangement regions of the respective sealing materials are different from each other. Therefore, the gap between the second substrate and the third substrate is substantially constant, and an image acquisition device capable of acquiring a clear image can be provided.

In the image acquisition device according to the application example described above, an opening that transmits light reaching the light receiving portion is formed in the light shielding portion, and between the first substrate and the second substrate, and It is preferable that a filler is packed in the light path between the second substrate and the third substrate.
According to this configuration, since the filler is packed in the gap between the first substrate and the second substrate and the gap between the second substrate and the third substrate, compared with the case where there is no filler. For example, the gap between the substrates is prevented from fluctuating due to the influence of temperature, pressure, and the like. In addition, since the opening formed in the light-shielding portion of the second substrate serves as a diaphragm, the light reaching the light-receiving portion is narrowed down and a clear image can be acquired.

  [Application Example] A method for manufacturing an image acquisition apparatus according to this application example is a method for manufacturing an image acquisition apparatus in which a plurality of substrates are stacked via a sealing material, the uppermost substrate disposed on the uppermost layer, A lowermost substrate disposed in the lowermost layer and having a light receiving function; and a plurality of intermediate layer substrates disposed between the uppermost substrate and the lowermost substrate, wherein the uppermost substrate and the plurality of intermediate layers Any one of the substrates is a substrate having a light emitting function, and a first step of laminating the uppermost layer substrate and the intermediate layer substrate immediately below the uppermost layer substrate through a sealing material, and the lowermost layer A second step of laminating the substrate and the intermediate layer substrate directly above the lowermost layer substrate via a sealing material, and a third step of laminating the plurality of intermediate layer substrates via a sealing material, In the third step, the substrate is viewed in plan with the first A plurality of intermediate layer substrates are stacked by disposing a sealing material in a first arrangement region of the sealing material in the step and in a third arrangement region of the second arrangement region of the sealing material in the second step. It is characterized by.

  According to the method of this application example, the plurality of intermediate layer substrates are stacked by disposing the sealing material in the third disposition region common to the first disposition region and the second disposition region. Therefore, compared to the case where the arrangement regions of the sealing materials are different from each other, distortion and bending are less likely to occur when a plurality of substrates are stacked. Therefore, the gap between the intermediate layer substrates is substantially constant, and an image acquisition device capable of acquiring a clear image can be manufactured.

In the method for manufacturing an image acquisition device according to the application example, it is preferable that the first step, the second step, and the third step are performed in order of increasing width of the sealing material.
According to this method, when a plurality of substrates are stacked, distortion and bending are less likely to occur.

  [Application Example] Another method for manufacturing an image acquisition device according to this application example is a method for manufacturing an image acquisition device in which a plurality of substrates are stacked via a sealing material, in which a light receiving unit is formed. The first step of laminating the substrate and the second substrate on which the light shielding portion is formed via the first sealing material, the third substrate on which the light emitting portion is formed, and the light collecting portion are formed. A second step of laminating a fourth substrate via a second sealing material; and a third step of laminating the second substrate and the third substrate via a third sealing material. And in the third step, in a state where the substrate is viewed in plan, in the first arrangement region of the first sealing material in the first step, and in the second step of the second sealing material in the second step. A third sealing material is disposed in a third arrangement region within the arrangement region, and the second substrate and the third substrate are laminated. It is characterized in.

  According to the method of this application example, the sealing material is arranged in the third arrangement area common to the first arrangement area and the second arrangement area, and the second substrate and the third substrate are laminated. Therefore, compared to the case where the arrangement regions of the sealing materials are different from each other, distortion and bending are less likely to occur when a plurality of substrates are stacked. Therefore, the gap between the second substrate and the third substrate is substantially constant, and an image acquisition device capable of acquiring a clear image can be manufactured.

In the manufacturing method of the image acquisition device according to the application example, the first step, the second step, and the third step are the first sealing material, the second sealing material, and the third sealing material. It is preferable to implement in order of increasing width.
According to this method, when a plurality of substrates are stacked, distortion and bending are less likely to occur.

In the method for manufacturing an image acquisition device according to the application example, in the light shielding portion of the second substrate, an opening is formed at a position facing the light receiving portion of the first substrate; And filling a filler into a path of light that passes through the opening between the second substrate and the second substrate and between the second substrate and the third substrate. .
According to this method, since the filler is packed in the gap between the first substrate and the second substrate and the gap between the second substrate and the third substrate, compared with the case where there is no filler, for example, the temperature Fluctuation of the gap between the substrates due to the influence of pressure and pressure is suppressed. In addition, the opening formed in the light-shielding part of the second substrate plays a role of a diaphragm, so that the light reaching the light-receiving part is narrowed down and an image acquisition device capable of acquiring a clear image is manufactured. can do.

[Application Example] An electronic apparatus according to this application example includes the image acquisition device described in the application example.
According to this application example, it is possible to provide an electronic device capable of acquiring a clear image.

The schematic perspective view which shows the structure of an image acquisition apparatus. 1 is a schematic cross-sectional view showing the structure of an image acquisition device. FIG. 3 is a circuit diagram showing an electrical configuration of a light emitting unit in the image acquisition device. The schematic plan view which shows arrangement | positioning of the light-receiving part in the image acquisition apparatus, a light emission part, and a condensing part. (A) is a schematic top view which shows the image acquisition apparatus of a comparative example, (b) is a schematic sectional drawing which shows the lamination | stacking state of the some board | substrate in the image acquisition apparatus of the comparative example cut along the AA 'line of (a). . (A) is a schematic top view which shows the image acquisition apparatus of an Example, (b) is a schematic sectional drawing which shows the lamination | stacking state of the several board | substrate in an image acquisition apparatus in the Example cut by the AA 'line of (a). . (A)-(d) is a schematic sectional drawing which shows the manufacturing method of an image acquisition apparatus. The block diagram which shows the structure of the biometrics apparatus as an electronic device. The perspective view which shows the personal computer as an electronic device. The schematic sectional drawing which shows the structure of the image acquisition apparatus of a modification.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

(First embodiment)
<Image acquisition device>
First, an image acquisition apparatus according to the present embodiment will be described with reference to FIGS. 1 is a schematic perspective view showing the configuration of the image acquisition device, FIG. 2 is a schematic cross-sectional view showing the structure of the image acquisition device, FIG. 3 is a circuit diagram showing the electrical configuration of the light emitting unit in the image acquisition device, and FIG. It is a schematic plan view which shows arrangement | positioning of the light-receiving part in the image acquisition apparatus, a light emission part, and a condensing part.
The image acquisition apparatus according to the present embodiment is applied to a biometric authentication apparatus as an example of an electronic device to be described later, and acquires (captures) a vein pattern of a human finger as an image.

  As shown in FIG. 1, the image acquisition device 150 according to the present embodiment is disposed in the lowermost layer, and includes a first substrate 110 having a light receiving unit, and a second substrate having a light shielding unit stacked on the first substrate 110. Substrate 120, a third substrate 130 stacked on the second substrate 120 and having a light emitting portion, and a fourth substrate 140 stacked on the third substrate 130 and having a light collecting portion. ing. A finger F (for example, an index finger) as a living body (subject) is arranged on the fourth substrate 140 which is the uppermost layer.

  Each substrate has substantially the same outer size, the short direction of the substrate is the X direction, the long direction is orthogonal to the Y direction, the X direction, and the Y direction, and the lowermost first substrate 110 to the uppermost fourth layer. The direction toward the substrate 140 will be described as the Z direction. Further, viewing from the direction opposite to the Z direction, that is, the direction from the uppermost fourth substrate 140 toward the lowermost first substrate 110 is referred to as a plan view.

Next, the configuration of each substrate of the image acquisition device 150 will be specifically described with reference to FIG.
As shown in FIG. 2, the first substrate 110 includes a substrate body 111 and a plurality of light receiving portions 112 provided on one surface (upper surface) 111 a of the substrate body 111. The light receiving unit 112 is an optical sensor such as a CCD or CMOS. As the substrate body 111, for example, a glass epoxy substrate or a ceramic substrate on which the light receiving unit 112 can be mounted can be adopted. Note that the first substrate 110 has an electric circuit (not shown) to which the light receiving unit 112 is connected.

  The second substrate 120 stacked on the first substrate 110 in the Z direction has a transparent substrate body 121 and a light shielding portion 122. The light shielding portion 122 is provided on the front surface (lower surface) 121b of the substrate body 121 facing the first substrate 110, and the light shielding portion 122 has openings 123 formed at positions facing the plurality of light receiving portions 112 in plan view. ing.

  The third substrate 130 stacked on the second substrate 120 in the Z direction includes a transparent substrate main body 131 and a plurality of light emitting units 30 provided on one surface (upper surface) 131a of the substrate main body 131. Have. The light emitting unit 30 in the present embodiment is a light emitting element that emits near infrared light IL as illumination light. The wavelength range of the near infrared light IL is, for example, 700 nm to 1500 nm. The substrate body 131 is provided with a drive circuit (not shown) that can independently control the light emission of each of the plurality of light emitting units 30. Detailed configurations of the light emitting unit 30 and the drive circuit will be described later.

  The fourth substrate 140 stacked on the third substrate 130 in the Z direction includes a transparent substrate main body 141 and a plurality of substrates provided on the surface (lower surface) 141b of the substrate main body 141 facing the third substrate 130. A condensing part 142. The condensing unit 142 is, for example, a microlens having a convex lens surface facing the third substrate 130 side. The condensing part 142 is arrange | positioned between the light emission parts 30 adjacent by planar view. The finger F is arranged on the surface (upper surface) 141a opposite to the surface (lower surface) 141b of the substrate body 141 provided with the light collecting portion 142.

  Each of the transparent substrate bodies 121, 131, 141 is made of, for example, non-alkali glass whose main component is borosilicate.

  As described above, the image acquisition device 150 emits near-infrared light IL from the light emitting unit 30 toward the fourth substrate 140 (that is, in the Z direction). The near-infrared light IL not only reflects on the surface of the finger F but also enters the inside of the finger F and scatters, and part of the near-infrared light IL passes through the substrate body 141 as reflected light RL and is collected by the light collecting unit 142. Is done. The collected reflected light RL passes through the substrate body 131 and the substrate body 121, passes through the opening 123 formed in the light shielding unit 122, and reaches the light receiving unit 112.

  The light shielding unit 122 shields light directly incident on the light receiving unit 112 and light incident on the light receiving unit 112 indirectly by being reflected by the lens surface of the light collecting unit 142 among the light emitted from the light emitting unit 30. Thus, it is formed on the surface 121 b of the substrate body 121. That is, the opening 123 formed in the light shielding portion 122 functions as a diaphragm that selectively transmits the collected reflected light RL.

  Reduced hemoglobin (deoxygenated hemoglobin) flowing through the vein of the finger F has a property of absorbing near-infrared light IL. For this reason, when near-infrared light IL is emitted from the light emitting unit 30 to illuminate the finger F, the vein portion under the finger F becomes darker than the surrounding tissue. By detecting the pattern (reflected light RL) due to the difference in brightness with the light receiving unit 112, a vein pattern as an image is acquired (captured).

  Next, an electrical configuration of the third substrate 130 having the light emitting unit 30 will be described with reference to FIG. As shown in FIG. 3, the third substrate 130 of this embodiment includes a plurality of scanning lines 12 and a plurality of data lines 13 that intersect each other, and a plurality of power supply lines that are parallel to each of the plurality of data lines 13. 14. It has a scanning line driving circuit 16 to which a plurality of scanning lines 12 are connected, and a data line driving circuit 15 to which a plurality of data lines 13 are connected. Further, the light emitting pixels 18 are arranged in a matrix corresponding to the intersections of the plurality of scanning lines 12 and the plurality of data lines 13.

  The light emitting pixel 18 includes a light emitting unit 30 and a pixel circuit 20 that controls driving of the light emitting unit 30.

  The light emitting unit 30 includes an anode 31, a cathode 33, and a functional layer 32 provided between the anode 31 and the cathode 33. The functional layer 32 includes a light emitting layer made of an organic semiconductor material, and such a light emitting unit 30 is called an organic electroluminescence (EL) element. The light emitting unit 30 (organic EL element) can be electrically expressed as a diode. The cathode 33 is formed as a common electrode extending over the plurality of light emitting pixels 18.

  The pixel circuit 20 includes a switching transistor 21, a storage capacitor 22, and a driving transistor 23. The two transistors 21 and 23 can be configured using, for example, an n-channel or p-channel thin film transistor (TFT) or a MOS transistor.

The gate of the switching transistor 21 is connected to the scanning line 12, one of the source or drain is connected to the data line 13, and the other of the source or drain is connected to the gate of the driving transistor 23.
One of the source or drain of the driving transistor 23 is connected to the anode 31 of the light emitting unit 30, and the other of the source or drain is connected to the power supply line 14. A storage capacitor 22 is connected between the gate of the driving transistor 23 and the power supply line 14.

  When the scanning line 12 is driven and the switching transistor 21 is turned on, the potential based on the control signal supplied from the data line 13 at that time is held in the storage capacitor 22 via the switching transistor 21. The ON / OFF state of the driving transistor 23 is determined according to the potential of the storage capacitor 22, that is, the gate potential of the driving transistor 23. When the driving transistor 23 is turned on, a current corresponding to the gate potential flows from the power supply line 14 to the functional layer 32 sandwiched between the anode 31 and the cathode 33 via the driving transistor 23. The light emitting unit 30 emits light according to the magnitude of the current flowing through the functional layer 32.

Next, the arrangement of the light receiving unit 112, the light shielding unit 122, the opening 123, the light emitting unit 30, and the light collecting unit 142 in a plan view will be described with reference to FIG.
As shown in FIG. 4, the condensing unit 142 is circular in plan view in order to efficiently capture the reflected light RL from the finger F, and is arranged at equal intervals in the X direction and the Y direction. In other words, the light collecting portions 142 are arranged in a matrix at intervals in a plane defined by the X direction and the Y direction.
A light receiving unit 112 having a circular light receiving surface is disposed at the center of the circular light collecting unit 142. The light shielding portion 122 is arranged so that the opening portion 123 is positioned so as to surround the light receiving portion 112.
The diameter of the light receiving unit 112 is, for example, 15 μm to 20 μm, the diameter of the light collecting unit 142 is, for example, 70 μm, and the arrangement interval (arrangement pitch) in the X direction and the Y direction of the light collecting unit 142 is, for example, 98 μm.

  The light emitting units 30 (light emitting pixels 18) are arranged between the light collecting units 142 arranged in a matrix. That is, the light emitting units 30 (light emitting pixels 18) are also arranged in a matrix in the X direction and the Y direction. A state in which four light collecting units 142 are arranged around one light emitting unit 30, in other words, a state in which four light emitting units 30 are arranged around one light collecting unit 142 (light receiving unit 112), The light emitting unit 30 (the light emitting pixel 18) has a substantially cross shape having an outer shape including a circular arc part. The shape of the light emitting unit 30 is caused by the shape of the anode 31 because the cathode 33 is formed as a common electrode across the plurality of light emitting pixels 18 as described above. Note that the shapes, sizes, and arrangements of the light receiving unit 112, the opening 123, the light emitting unit 30, and the light collecting unit 142 are not limited thereto.

Next, the problem to be solved by the present invention will be specifically described with reference to FIG. As described above, the image acquisition device 150 includes the first substrate 110, the second substrate 120, the third substrate 130, and the fourth substrate 140 stacked in this order. In order to reliably guide the reflected light RL, which is scattered and reflected inside the finger F by irradiating the finger F with the near infrared light IL from the light emitting unit 30 of the third substrate 130, to the light receiving unit 112 of the first substrate 110. For this, it is important that the distance between the substrates in the Z direction is kept constant, and the substrates are arranged in parallel to each other.
If the substrates are not arranged parallel to each other at a predetermined distance, the reflected light RL collected by the light collecting unit 142 passes through the opening 123 of the light shielding unit 122 provided on the second substrate 120. It becomes impossible or light other than the condensed reflected light RL reaches the light receiving unit 112, and a vein pattern as a clear (clear) image cannot be obtained. Hereinafter, specific examples will be described with reference to comparative examples and examples.

(Comparative example)
5A is a schematic plan view showing a comparative image acquisition apparatus, and FIG. 5B is a stack of a plurality of substrates in the comparative image acquisition apparatus cut along the line AA ′ in FIG. It is a schematic sectional drawing which shows a state. The AA ′ line passes through the center in the X direction of the substrate and extends in the Y direction.
For example, in the image acquisition device 150B in the comparative example shown in FIGS. 5A and 5B, the first substrate 110 and the second substrate 120 are stacked via the first sealant 161, and the second substrate The substrate 120 and the third substrate 130 are stacked via a third sealant 163, and the third substrate 130 and the fourth substrate 140 are stacked via a second sealant 162. . Each of the first sealing material 161, the second sealing material 162, and the third sealing material 163 is arranged in a frame shape along the outer shape of the image acquisition device 150B.
In plan view, the widths of the first sealing material 161, the second sealing material 162, and the third sealing material 163 are each about 1.5 mm. In addition, the arrangement regions where the second sealing material 162 and the third sealing material 163 are arranged are substantially the same, but the first sealing material 161 includes the second sealing material 162 and the third sealing material 163. It is arrange | positioned inside the arrangement | positioning area | region. These sealing materials 161, 162, and 163 are made of, for example, a thermosetting epoxy resin.
A transparent filler 171 is disposed in a region surrounded by the first sealing material 161 between the surface 111a of the substrate body 111 and the surface 121b of the substrate body 121 facing the substrate body 111. In addition, a transparent filler 172 is disposed in a region surrounded by the third sealing material 163 between the surface 121a of the substrate body 121 and the surface 131b of the substrate body 131 facing the substrate body 121. These fillers 171 and 172 are made of acrylic resin, for example.
The substrate body 111 and the substrate body 141 are approximately 0.5 mm in thickness, and the substrate body 121 and the substrate body 131 are approximately 0.15 mm in thickness.

In the manufacture of the image acquisition device 150B of the comparative example, in order to stack a plurality of substrates, first, a sealing material is disposed on one substrate. The sealing material includes a gap material for setting the distance between one substrate and the other substrate to a predetermined value. Then, the other substrate is pressed against one substrate through the sealing material, and the sealing material is cured in a state where the gap material is sandwiched between the one substrate and the other substrate. The substrate is bonded by the sealing material. The gap material is, for example, beads (true spheres) made of glass or plastic, or fibers (fibers) cut to a predetermined length.
The first sealing material 161 includes a gap material having a diameter of about 100 μm. The second sealing material 162 includes a gap material having a diameter of about 70 μm. The third sealing material 163 also includes a gap material having a diameter of about 70 μm.
For example, after the first substrate 110 and the second substrate 120 are stacked via the first sealant 161, the second substrate 120 and the third substrate 130 are interposed via the third sealant 163. Since the arrangement area of the first sealing material 161 and the arrangement area of the third sealing material 163 are different when stacked, the first sealing material is pressed when the third substrate 130 is pressed toward the second substrate 120. The second substrate 120 is deformed using 161 as a fulcrum. Specifically, as shown in FIG. 5B, the surface (upper surface) 111a of the substrate main body 111 and the surface (lower surface) 121b of the substrate main body 121 on the outer side and the center side of the first sealing material 161, The substrate main body 121 warps in a direction in which the distance between the two becomes smaller than the predetermined value.
Further, when the third substrate 130 and the fourth substrate 140 are stacked via the second sealant 162, when the fourth substrate 140 is pressed toward the third substrate 130, the third seal Pressure is also applied to the second substrate 120 through the material 163. Therefore, the distance between the surface (upper surface) 111a of the substrate body 111 and the surface (lower surface) 121b of the substrate body 121 is further smaller than the predetermined value on the outer side and the center side of the first sealing material 161. became.
If the pressing method is not uniform, not only the simple deformation (warping) of the substrate as described above but also partial distortion may occur. That is, the distance between the substrates varies.

(Example)
Next, an example of the image acquisition apparatus 150 of the present embodiment will be described with reference to FIG.
6A is a schematic plan view showing the image acquisition apparatus of the embodiment, and FIG. 6B is a stack of a plurality of substrates in the image acquisition apparatus of the embodiment cut along the line AA ′ of FIG. It is a schematic sectional drawing which shows a state.

As shown in FIGS. 6A and 6B, in the image acquisition apparatus 150 of the embodiment, the second sealing material 162 that bonds the third substrate 130 and the fourth substrate 140, and the second substrate The third sealing material 163 that bonds 120 and the third substrate 130 is a first sealing material 161 on which the first sealing material 161 that bonds the first substrate 110 and the second substrate 120 is arranged in plan view. It is arranged in the arrangement area. The width of the first sealing material 161 is approximately 2.0 mm, the width of the second sealing material 162 is approximately 1.2 mm, and the width of the third sealing material 163 is approximately 1.0 mm. A second sealing material 162 and a third sealing material 163 are arranged on the center line in the width direction of the first sealing material 161. That is, the third sealing material 163 is arranged in a third arrangement region common to the first arrangement region of the first seal material 161 and the second arrangement region of the second seal material 162. Yes.
Moreover, although mentioned later in detail, the board | substrates are bonded together in order with the large width | variety of a sealing material. Therefore, when laminating a plurality of substrates, even if the other substrate is pressed against one substrate via the sealing material, pressure is applied evenly for each sealing material, and the distance between the substrates is maintained at a predetermined value. The Therefore, the first substrate 110 that is the lowermost substrate and the fourth substrate 140 that is the uppermost substrate are laminated into the second substrate 120 and the third substrate 130 that are the intermediate layer substrates. Is unlikely to occur.

  In the comparative example and the example of this embodiment, the second substrate 120 as the intermediate layer substrate and the second substrate 120 as the intermediate layer substrate are compared with the thicknesses of the first substrate 110 as the lowermost substrate and the fourth substrate 140 as the uppermost substrate. Although the thickness of the third substrate 130 is reduced, the present invention is not limited to this. For example, even if these substrates have the same thickness, the intermediate layer substrate can be prevented from being deformed.

<Method for Manufacturing Image Acquisition Device>
Next, a manufacturing method of the image acquisition apparatus 150 of the present embodiment will be described with reference to FIG. 7A to 7D are schematic cross-sectional views illustrating a method for manufacturing an image acquisition device.

  In manufacturing the image acquisition device 150, a mother substrate is actually used. The mother board is laid out in a matrix. Hereinafter, the symbol W is added after the symbol indicating the substrate to represent the mother substrate of the substrate.

  In the manufacturing method of the image acquisition apparatus 150 of the present embodiment, as shown in FIG. 7A, the first step of laminating the first substrate 110W and the second substrate 120W via the first sealing material 161 is performed. 7B, a second step of laminating the third substrate 130W and the fourth substrate 140W via the second sealant 162, and as shown in FIG. 7C. And a third step of laminating the second substrate 120W and the third substrate 130W with the third sealant 163 interposed therebetween. Further, as shown in FIG. 7D, the stacked first substrate 110W, second substrate 120W, third substrate 130W, and fourth substrate 140W are cut along a predetermined scribe line SL. The fourth step of taking out the individual image acquisition devices 150 is included.

  Specifically, in the first step, first, a sealing material is applied to the first substrate 110W. For the application of the sealing material, for example, a quantitative discharge method in which an uncured sealing material is applied from a nozzle is used. The sealing material is drawn in a frame shape corresponding to each substrate body 111. And a transparent resin material is apply | coated to the area | region enclosed by the sealing material. The application of a transparent resin material also uses a quantitative discharge method. The second substrate 120W is disposed opposite to the first substrate 110W on which the sealing material and the transparent resin material are applied, and presses the second substrate 120W. When the sealing material is pressed and the first substrate 110W and the second substrate 120W are at a predetermined interval, the sealing material is cured. As a result, the first substrate 110W and the second substrate 120W are stacked via the first sealing material 161, and the region surrounded by the first sealing material 161 is filled with the filling material 171.

  In the second step, a sealing material is applied to the third substrate 130W. For the application of the sealing material, for example, a quantitative discharge method is used as in the first step. The sealing material is drawn in a frame shape corresponding to each substrate body 131. The fourth substrate 140W is disposed opposite to the third substrate 130W to which the sealing material is applied at a predetermined position, and the fourth substrate 140W is pressed. When the sealing material is pressed and the third substrate 130W and the fourth substrate 140W are at a predetermined interval, the sealing material is cured. As a result, the third substrate 130 </ b> W and the fourth substrate 140 </ b> W are stacked via the second sealing material 162.

  In the third step, a sealing material is applied to the second substrate 120W stacked on the first substrate 110W. For the application of the sealing material, for example, a quantitative discharge method is used as in the first step. The sealing material is drawn in a frame shape corresponding to each substrate body 121. And a transparent resin material is apply | coated to the area | region enclosed by the sealing material. The application of a transparent resin material also uses a quantitative discharge method. A third substrate 130W in which a fourth substrate 140W is laminated at a predetermined position is disposed opposite to the second substrate 120W on which the sealing material and the transparent resin material are applied, and the fourth substrate 140W is disposed. Press. When the sealing material is pressed and the second substrate 120W and the third substrate 130W become a predetermined distance, the sealing material is cured. As a result, the second substrate 120 </ b> W and the third substrate 130 </ b> W, which are a plurality of intermediate layer substrates, are stacked via the third sealing material 163.

  In the fourth step, the stacked mother substrates are cut along the scribe line SL. Examples of the cutting method include a dicing method and a laser cutting method.

  As shown in the above-described embodiments, the width of the sealing material in plan view is the largest for the first sealing material 161, followed by the second sealing material 162 and the third sealing material 163 in this order. The first to third steps are performed in the order of the width of the sealing material, and when the sealing material is fixed between the substrates, a force is uniformly applied to the applied sealing material. The second substrate 120W and the third substrate 130W are not easily deformed.

  Further, when the distance between the finger F, which is the subject, and the light receiving unit 112 is shortened, unnecessary light such as external light is less likely to enter the light receiving unit 112. The thickness of the first substrate 110 as the lower layer substrate and the fourth substrate 140 as the uppermost layer substrate is 0.5 mm, which is less than 1 mm. The thicknesses of the second substrate 120 and the third substrate 130 which are intermediate layer substrates are 0.15 mm which is even thinner than the lowermost layer substrate and the uppermost layer substrate. Therefore, in the process of laminating these substrates, if gas (air) is present in the area surrounded by the sealing material after laminating, the substrates are likely to be deformed by expansion and contraction of the gas (air). It is preferable to laminate the substrates. In particular, the second step of laminating the fourth substrate 140W having the condensing unit 142 on the third substrate 130W is a substrate from the viewpoint of reliably condensing the reflected light RL onto the light receiving unit 112 by the condensing unit 142. Since no filler is filled in between, the second step is preferably carried out under reduced pressure.

According to the image acquisition device 150 and the manufacturing method of the first embodiment, the following effects can be obtained.
(1) The third sealing material 163 used when the second substrate 120 and the third substrate 130 as a plurality of intermediate layer substrates between the lowermost layer substrate and the uppermost layer substrate are laminated is The first sealing material 161 is disposed in the first placement region, and the second sealing material 162 is disposed in the third placement region in the second placement region. The second sealing material 162 and the third sealing material 163 are located on the center line in the width direction of the first sealing material 161. Therefore, the second substrate 120 and the third substrate 130 which are a plurality of intermediate layer substrates are compared to the case where the first placement region, the second placement region, and the third placement region are shifted from each other in plan view. Is prevented from being deformed. Therefore, the distance between the first substrate 110 and the second substrate 120, the distance between the second substrate 120 and the third substrate 130, and the distance between the third substrate 130 and the fourth substrate 140 are predetermined. Kept at a distance of That is, the image acquisition device 150 in which the first substrate 110, the second substrate 120, the third substrate 130, and the fourth substrate 140 are stacked can acquire (capture) a vein pattern as a clear image. it can.
(2) A filler 171 made of a transparent resin material is packed between the first substrate 110 having the light receiving portion 112 and the second substrate 120 having the light shielding portion 122 in which the opening 123 is formed. A filler 172 made of a transparent resin material is also packed between the second substrate 120 and the third substrate 130. Therefore, compared with the case where a space exists between these substrates, it is possible to keep the distance between these substrates constant and to prevent the distance between these substrates from fluctuating due to external stress or the like.

(Second Embodiment)
<Electronic equipment>
Next, the electronic apparatus of this embodiment will be described with reference to FIGS. FIG. 8 is a block diagram showing a configuration of a biometric authentication device as an electronic device, and FIG. 9 is a perspective view showing a personal computer as an electronic device.

As shown in FIG. 8, a biometric authentication device 100, which is an example of an electronic device, is a device that performs personal authentication by capturing a vein image (vein pattern) of a finger F as a living body (subject). The image acquisition apparatus 150 of the form, the memory | storage part 80, the output part 90, and the control part 70 which controls these collectively are provided.
As described above, the image acquisition device 150 includes the first substrate 110 having the plurality of light receiving units 112 and the third substrate 130 having the plurality of light emitting units 30 that emit near-infrared light IL. The first substrate 110 and the third substrate 130 are electrically connected to the control unit 70.

  Near-infrared light IL emitted from the light emitting unit 30 is applied to the finger F disposed on the image acquisition device 150 and scattered when it reaches the inside of the finger F, and a part thereof is reflected light RL as the image acquisition device. The light passes through 150 and travels toward the light receiving unit 112. Each light receiving unit 112 converts incident light (reflected light RL from the finger F) into an electrical signal (light receiving signal) having a signal level corresponding to the amount of light.

  The storage unit 80 is a non-volatile memory such as a flash memory or a hard disk. As a master vein image (vein pattern) for personal authentication, a vein image (vein pattern) of a finger F (for example, the index finger of the right hand) registered in advance. Is remembered. The control unit 70 includes a CPU and a RAM, and controls turning on and off of the plurality of light emitting units 30. Further, the control unit 70 reads the light reception signal from each light reception unit 112 and generates a vein image (vein pattern) of the finger F based on the read light reception signal for one frame (for the imaging region). In addition, the control unit 70 collates the generated vein image (vein pattern) with the master vein image (vein pattern) registered in the storage unit 80 and performs personal authentication. For example, the control unit 70 compares the characteristics of two vein images (vein patterns) to be compared (for example, the number and position of vein branches), and if the similarity is equal to or higher than a predetermined threshold, The person who placed F is authenticated as the person whose master vein image (vein pattern) is registered in the storage unit 80. The output unit 90 is, for example, a display unit or a voice notification unit, and notifies the authentication result by display or voice.

  Since the biometric authentication device 100 includes the image acquisition device 150 of the first embodiment, a clear vein image (vein pattern) can be acquired (captured), so that personal authentication can be performed with high accuracy.

As shown in FIG. 9, a personal computer 1000 which is an example of an electronic device is a notebook computer, and includes a main body portion 1001 including a keyboard 1002 and a display unit 1004 including a display portion 1003. Is supported so as to be rotatable with respect to the main body 1001 via a hinge structure.
In the personal computer 1000, the main body 1001 is provided with the biometric authentication device 100 (see FIG. 8).
According to such a personal computer 1000, since the biometric authentication apparatus 100 is provided, a target person who can use the personal computer 1000 can be reliably authenticated. That is, the personal computer 1000 having a high security function can be provided.

  An electronic apparatus to which the image acquisition device 150 according to the first embodiment capable of irradiating near-infrared light IL as illumination light can be applied is not limited to the biometric authentication device 100 described above or the personal computer 1000 including the same. For example, it can be applied as a medical device to measuring devices such as blood pressure, blood sugar, pulse, pulse wave, cholesterol level, hemoglobin level, blood moisture, blood oxygen level. Moreover, liver function (detoxification rate) measurement, blood vessel position confirmation, and cancer site confirmation can be performed by using together with a pigment. Furthermore, it becomes possible to judge the benign / malignant tumor (melanoma) of skin cancer by increasing the knowledge in the specimen. Further, by comprehensively judging a part or all of the above items, it is possible to judge the skin age and skin health index.

  Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1) The number of substrates constituting the image acquisition device 150 is not limited to four. FIG. 10 is a schematic cross-sectional view showing the structure of a modified example of the image acquisition apparatus. As shown in FIG. 10, the image acquisition apparatus 250 according to the modified example includes a first substrate 210, a second substrate 220, a third substrate 230, a fourth substrate 240, and a fifth substrate 260 in the Z direction. They are stacked in order. The first substrate 210 has a plurality of light receiving portions 212 arranged on the upper surface 211 a of the substrate body 211. The second substrate 220 has a light shielding portion 222 formed on the lower surface 221 b of the substrate body 221. An opening 223 is formed in the light shielding part 222 at a position facing the light receiving part 212. The third substrate 230 has a plurality of light collecting portions 232 arranged on the lower surface 231 b of the substrate body 231. The light collecting unit 232 is a microlens and is disposed above the light receiving unit 212. The fourth substrate 240 has a plurality of light emitting units 242 arranged on the upper surface 241 a of the substrate body 241. The light emitting unit 242 is an organic EL element that emits near-infrared light IL, and is provided between adjacent light collecting units 232 in plan view. The fifth substrate 260 is a transparent glass substrate, for example. The lowermost substrate is the first substrate 210, and the uppermost substrate is the fifth substrate 260. The second substrate 220, the third substrate 230, and the fourth substrate 240 are intermediate layer substrates.
A transparent filler 171 is packed between the first substrate 210 and the second substrate 220, and a transparent filler 173 is packed between the third substrate 230 and the fourth substrate 240, A transparent filler 174 is also packed between the fourth substrate 240 and the fifth substrate 260. These five substrates are stacked on each other via a sealant (not shown). The arrangement of the sealing material is the same as that described in the first embodiment.
By disposing the third substrate 230 having the condensing portion 232 directly above the second substrate 220 having the light shielding portion 222 in which the opening 223 is formed, the reflected light RL from the subject is efficiently received by the light receiving portion 212. Can lead to. That is, it is possible to provide the image acquisition device 250 that can obtain a brighter image.

  (Modification 2) The light emitting unit 30 of the image acquisition device 150 is not limited to one that emits near-infrared light IL. For example, it may emit light in the visible light wavelength range. According to this, it is possible to receive the reflected light RL from the surface of the finger as a subject and obtain a fingerprint as an image. It is possible to identify an individual from the acquired fingerprint image.

  The substrate having the light receiving function may not be the lowermost substrate, and the present invention is not limited to the above-described embodiment, and does not contradict the gist or idea of the invention that can be read from the claims and the entire specification. The image acquisition apparatus accompanied by such a change, a method for manufacturing the image acquisition apparatus, and an electronic apparatus to which the image acquisition apparatus is applied are also included in the technical scope of the present invention.

  DESCRIPTION OF SYMBOLS 30 ... Light emission part, 100 ... Biometric authentication apparatus, 110 ... 1st board | substrate, 112 ... Light-receiving part, 120 ... 2nd board | substrate, 122 ... Light-shielding part, 123 ... Opening part, 130 ... 3rd board | substrate, 140 ... 1st Four substrates 142 ... Condensing unit 150 ... Image acquisition device 161 ... First seal material 162 ... Second seal material 163 ... Third seal material 171, 172 ... Filler 1000 ... Electronics Personal computer as a device.

Claims (11)

An image acquisition device in which a plurality of substrates are stacked via a sealing material,
A top layer substrate disposed on the top layer;
A lowermost substrate disposed in the lowermost layer; and
A plurality of intermediate layer substrates disposed between the uppermost layer substrate and the lowermost layer substrate,
Any one of the uppermost substrate and the plurality of intermediate layer substrates is a substrate having a light emitting function,
Of the lowermost substrate and the plurality of intermediate layer substrates, any one of the substrates disposed below the substrate having the light emitting function is a substrate having a light receiving function,
In a state where the image acquisition device is viewed in plan view,
The sealing material used for laminating the plurality of intermediate layer substrates is disposed in a region where the sealing material used for laminating the uppermost layer substrate and the intermediate layer substrate immediately below the uppermost layer substrate, and the lowermost layer substrate. An image acquisition apparatus, wherein the image acquisition apparatus exists in an arrangement region of a sealing material used for stacking with the intermediate layer substrate immediately above the lowermost layer substrate.   2. One of the plurality of intermediate layer substrates has a function of blocking light incident on the substrate having the light receiving function directly from the light emitted from the substrate having the light emitting function. The image acquisition device described in 1.   Any one of the uppermost layer substrate and the plurality of intermediate layer substrates is a substrate having a condensing function for condensing light reflected by a subject toward the substrate having the light receiving function. The image acquisition device according to claim 1 or 2. An image acquisition device in which a plurality of substrates are stacked via a sealing material,
A first substrate having a light receiving portion;
A second substrate having a light shielding portion and stacked on the first substrate;
A third substrate having a light emitting portion and stacked on the second substrate;
A fourth substrate having a condensing part and laminated on the third substrate,
The first substrate and the second substrate are laminated via a first sealing material,
The third substrate and the fourth substrate are laminated via a second sealing material,
The second substrate and the third substrate are laminated via a third sealing material,
In a state where the image acquisition device is viewed in plan, the third sealing material is present in an arrangement area of the first sealing material and in an arrangement area of the second sealing material. Acquisition device. The light shielding part is formed with an opening that transmits light reaching the light receiving part,
The filler is packed in the light path between the first substrate and the second substrate and between the second substrate and the third substrate. Item 5. The image acquisition device according to Item 4. A method for manufacturing an image acquisition device in which a plurality of substrates are laminated via a sealing material,
A top layer substrate disposed on the top layer;
A lowermost substrate disposed in the lowermost layer; and
A plurality of intermediate layer substrates disposed between the uppermost layer substrate and the lowermost layer substrate,
Any one of the uppermost substrate and the plurality of intermediate layer substrates is a substrate having a light emitting function,
Of the lowermost substrate and the plurality of intermediate layer substrates, any one of the substrates disposed below the substrate having the light emitting function is a substrate having a light receiving function,
A first step of laminating the uppermost layer substrate and the intermediate layer substrate immediately below the uppermost layer substrate through a sealing material;
A second step of laminating the lowermost substrate and the intermediate layer substrate immediately above the lowermost substrate via a sealing material;
A third step of laminating the plurality of intermediate layer substrates with a sealant therebetween,
In the third step, the plurality of intermediate layers are arranged by placing a sealing material in the sealing material placement region in the first step and in the sealing material placement region in the second step in a state where the substrate is viewed in plan view. A method for manufacturing an image acquisition device, comprising stacking substrates.   The method according to claim 6, wherein the first step, the second step, and the third step are performed in order of increasing width of the sealing material. A method for manufacturing an image acquisition device in which a plurality of substrates are laminated via a sealing material,
A first step of laminating a first substrate on which a light-receiving unit is formed and a second substrate on which a light-shielding unit is formed via a first sealing material;
A second step of laminating a third substrate on which the light emitting part is formed and a fourth substrate on which the light collecting part is formed, via a second sealing material;
A third step of laminating the second substrate and the third substrate via a third sealing material,
In the third step, the second arrangement of the second sealing material in the second step and in the first arrangement region of the first sealing material in the first step, with the substrate viewed in plan. A method for manufacturing an image acquisition apparatus, comprising: arranging a third sealing material in a third arrangement region in a region and laminating the second substrate and the third substrate.   The first step, the second step, and the third step are performed in order of increasing width of the first sealing material, the second sealing material, and the third sealing material. Item 9. A method for manufacturing the image acquisition device according to Item 8. Forming an opening at a position facing the light receiving portion of the first substrate in the light shielding portion of the second substrate;
Filling a path of light transmitted through the opening between the first substrate and the second substrate and between the second substrate and the third substrate. The method for manufacturing an image acquisition device according to claim 8 or 9,   An electronic apparatus comprising the image acquisition apparatus according to claim 1.

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