JP6271264B2 - LIGHT SOURCE UNIT AND VEHICLE LIGHTING DEVICE - Google Patents

Description

  The present invention relates to a lighting device mounted on a vehicle. Moreover, this invention relates to the light source unit with which the said illuminating device is mounted | worn.

  As this type of light source unit, one using a semiconductor light emitting element as a light source is known. In order to dissipate heat accompanying light emission, the substrate that supports the semiconductor light emitting element is fixed on the heat dissipation member. Positioning of the substrate with respect to the heat dissipation member is performed using a component called an attachment (see, for example, Patent Document 1).

JP 2012-238501 A

  In the light source unit described in Patent Document 1, the substrate is fixed to the heat dissipation member by screwing the attachment to the heat dissipation member. Therefore, when assembling the light source unit 1, screwing work is essential. The light source unit is fixed in a lamp chamber defined by a housing and a translucent cover. When the semiconductor light-emitting element needs to be replaced, it is necessary to remove the light-transmitting cover, which is normally firmly joined, from the housing and to release the attachment screws. This work takes a lot of time and effort.

  Therefore, an object of the present invention is to provide a technique that enables a work to be performed easily in a short time when a light source unit is assembled or when a semiconductor light emitting element needs to be replaced.

In order to achieve the above object, a first aspect that the present invention can take is a light source unit that is detachably attached to a lighting device mounted on a vehicle,
A semiconductor light emitting device;
A substrate for supporting the semiconductor light emitting element;
A conductive contact provided on the substrate and electrically connected to the semiconductor light emitting element;
A heat dissipation member for supporting the substrate;
A first engagement portion provided on the heat dissipation member;
An attachment provided with a conductive terminal and a second engagement portion;
With
By engaging the second engagement portion with the first engagement portion, the conductive terminal comes into contact with the conductive contact.

  According to such a configuration, the semiconductor light emitting element is electrically connected to the conductive terminal of the attachment only by engaging the first engagement portion of the heat dissipation member with the second engagement portion of the attachment. Since work such as screwing is not required, the light source unit can be assembled in a short time and easily.

  The conductive terminal may be configured to be elastically deformable. In this case, by engaging the second engagement portion with the first engagement portion, the conductive terminal is pressed against the conductive contact while being elastically deformed.

  According to such a configuration, the electrical connection between the conductive terminal and the conductive contact is stably maintained. Further, since the substrate is pressed against the heat radiating member, the positioning of the substrate with respect to the heat radiating member is stably maintained. That is, these effects can be obtained by the above-mentioned short time and easy work.

In order to achieve the above object, a second aspect of the present invention is a lighting device mounted on a vehicle,
A housing that partitions the light chamber;
A light source unit according to the first aspect, at least a part of which is accommodated in the lamp chamber;
A third engagement portion;
With
The light source unit is
A fourth engagement portion provided on at least one of the attachment and the heat dissipation member;
The light source unit is detachably fixed by releasably engaging the fourth engaging portion with the third engaging portion from the outside of the housing.

  According to such a configuration, the light source unit can be fixed to the lighting device only by engaging the fourth engaging portion of the light source unit with the third engaging portion of the lighting device from the outside of the housing. Since operations such as opening / closing the lamp chamber and screwing are unnecessary, the assembly work of the lighting device can be performed in a short time and easily.

  The engagement between the third engagement portion and the fourth engagement portion can be released. Since the light source unit is removed from the lighting device only by the disengagement operation, it is possible to access the semiconductor light emitting element without the operation of opening / closing the lamp chamber or releasing the screwing. Therefore, when the semiconductor light emitting element needs to be replaced, the work can be easily performed in a short time.

  It is good also as a structure provided with the connection terminal provided in the said attachment and electrically connected with the said semiconductor light-emitting device. In this case, in a state where the light source unit is fixed, the connection terminal is disposed outside the housing.

  According to such a configuration, it is possible to provide a conductive path separately from the side supporting the semiconductor light emitting element, such as a substrate or a heat radiating member, and it is easy to standardize and generalize the attachment including the conductive path. . Thereby, component costs are suppressed. In addition, since standardized and general-purpose parts are handled, work when assembling the light source unit or the lighting device or when the semiconductor light emitting element needs to be replaced can be easily performed in a short time.

  Further, when establishing or releasing the electrical connection between the external power source and the semiconductor light emitting element, it is not necessary to access the interior of the lamp chamber. All that is required is to attach and detach the mating connector to the connection terminal located outside the housing. Therefore, when assembling the light source unit or lighting device, or when the semiconductor light emitting element needs to be replaced, etc. Can be accomplished in a short time and easily.

  In a state where the light source unit is fixed, at least a part of the heat dissipation member may be arranged outside the housing.

  According to such a configuration, the heat generated by the operation of the semiconductor light emitting element can be efficiently dissipated outside the housing. Since the temperature of the entire lighting device including the light source unit can be lowered, the work when the semiconductor light emitting element needs to be replaced can be easily performed in a short time.

It is a disassembled perspective view which shows the light source unit which concerns on one Embodiment of this invention. It is a figure which shows the external appearance of the said light source unit in an assembly state. It is a figure which shows the external appearance of the said light source unit in an assembly state. It is sectional drawing which shows the structure of the said light source unit in an assembly state. It is sectional drawing explaining the assembly operation | work of the said light source unit. It is a partial cross section figure which shows the state with which the said light source unit was mounted | worn with the illuminating device. It is a figure explaining the mounting method to the illuminating device of the said light source unit. It is a figure which shows a part of light source unit which concerns on a 1st modification. It is a figure which shows a part of light source unit which concerns on a 2nd modification. It is a figure which shows a part of light source unit which concerns on a 3rd modification.

  Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In each drawing used in the following description, the scale is appropriately changed to make each member a recognizable size. The expressions “front and rear”, “left and right” and “up and down” are used for convenience of explanation, and do not limit the posture and direction in the actual use state.

  FIG. 1 is an exploded perspective view showing a configuration of a light source unit 1 according to an embodiment of the present invention. The light source unit 1 includes a semiconductor light emitting element 10, a substrate 20, a heat radiating member 30, and an attachment 40.

  2 to 4 show the light source unit 1 in a state in which they are assembled to each other. (A) of FIG. 2 has shown the external appearance seen from upper direction. FIG. 2 (b) shows an appearance as seen from below. (A) of FIG. 3 has shown the external appearance seen from the front. FIG. 3 (b) shows an appearance viewed from the right side. FIG. 4A shows a cross section taken along line IVA-IVA in FIG. FIG. 4B shows a cross section taken along line IVB-IVB in FIG.

  The semiconductor light emitting element 10 is used as a light source of the light source unit 1. The semiconductor light emitting element is, for example, a light emitting diode (LED) that emits light of a predetermined color. A laser diode or an organic EL element may be used instead of the LED.

  The substrate 20 supports the semiconductor light emitting element 10. A first conductive contact 21 a and a second conductive contact 21 b are provided on the substrate 20. The first conductive contact 21 a and the second conductive contact 21 b are electrically connected to the semiconductor light emitting element 10 via circuit wiring (not shown) formed on the substrate 20. The first conductive contact 21a is, for example, a power supply contact, and the second conductive contact 21b is, for example, a ground contact.

  The heat radiating member 30 is formed of a material having high thermal conductivity such as metal or heat radiating resin. The heat dissipation member 30 includes a substrate support portion 31, a flange portion 32, and a plurality of heat dissipation plates 33.

  The substrate support part 31 has a cylindrical appearance. The substrate support portion 31 has a flat upper surface 31a. The flange portion 32 is formed in an annular shape along the outer peripheral surface at the lower portion of the substrate support portion 31. Each of the plurality of heat dissipation plates 33 extends in the vertical direction from the lower portion of the substrate support portion 31.

  As shown to (a) of FIG. 1 and FIG. 2, the heat radiating member 30 is provided with the some lance 34 (an example of a 1st engaging part). The lances 34 are arranged at equal intervals in the circumferential direction of the substrate support portion 31 on the outer peripheral surface of the substrate support portion 31. Each lance 34 protrudes outward in the radial direction of the substrate support portion 31.

  The attachment 40 is made of an insulating material such as resin. The attachment 40 includes a cylindrical portion 41, a flange portion 42, and a connector portion 43.

  The cylindrical portion 41 defines a hollow space by an annular peripheral wall 41a. The upper end portion of the peripheral wall 41a extends in an overhang shape toward the radially inner side of the cylindrical portion 41 to form an annular ceiling portion 41b. The opening part opened to an up-down direction is demarcated by the inner peripheral wall 41b1 of the cyclic | annular ceiling part 41b.

  The collar portion 42 is formed in an annular shape along the outer peripheral surface of the lower portion of the cylindrical portion 41. The connector portion 43 is continuously provided on a part of the outer peripheral edge of the flange portion 42. The connector part 43 forms a casing that extends downward from the flange part 42.

  As shown in FIGS. 2B and 4A, a part of the housing of the connector portion 43 is a hollow connection space. A first connection terminal 43a and a second connection terminal 43b made of a conductive material are arranged in the connection space. The first connection terminal 43a is, for example, a power feeding terminal. The second connection terminal 43b is, for example, a grounding terminal.

  As shown in FIGS. 1 and 4A, the attachment 40 further includes a first conductive terminal 44a and a second conductive terminal 44b. The first conductive terminal 44a and the second conductive terminal 44b are made of a conductive material. The first conductive terminal 44a and the second conductive terminal 44b extend from the inner peripheral wall 41b1 of the ceiling portion 41b toward the radially inner side of the cylindrical portion 41, respectively.

  As shown in FIGS. 4A and 4B, the attachment 40 further includes a first conductive path 45a and a second conductive path 45b. The first conductive path 45a and the second conductive path 45b are made of a conductive material. The first conductive terminal 44 a is electrically connected to the first connection terminal 43 a of the connector portion 43 through a first conductive path 45 a that extends inside the attachment 40. The second conductive terminal 44 b is electrically connected to the second connection terminal 43 b of the connector portion 43 via a second conductive path 45 b extending inside the attachment 40.

  As shown to (a) of FIG. 1 and FIG. 2, the attachment 40 is formed with the some through-hole 46 (an example of a 2nd engaging part). The through holes 46 are arranged at equal intervals in the circumferential direction of the cylindrical portion 41. Each through hole 46 is formed so as to penetrate the peripheral wall 41 a in the radial direction of the cylindrical portion 41.

  A method for assembling the light source unit 1 using the semiconductor light emitting element 10, the substrate 20, the heat radiating member 30, and the attachment 40 configured as described above will be described.

  First, the substrate 20 supporting the semiconductor light emitting element 10 is temporarily fixed to the upper surface 31 a of the substrate support portion 31 in the heat dissipation member 30. Temporary fixing is performed by a known appropriate method. For example, it is performed by a positioning protrusion or a heat conductive adhesive. The heat dissipation member 30 supports the substrate 20 by temporary fixing.

  In this state, the attachment 40 is attached to the heat dissipation member 30. Specifically, as shown in FIG. 5A, the cylindrical portion 41 of the attachment 40 is placed on the substrate support portion 31 of the heat radiating member 30 from above. Then, as shown in FIG. 5B, the inner surface of the peripheral wall 41 a of the cylindrical portion 41 comes into contact with the inclined surface 34 a of each lance 34 provided on the heat dissipation member 30.

  When the attachment 40 is further pushed toward the heat radiating member 30 from this state, the peripheral wall 41a is displaced toward the radially outer side of the substrate support portion 31 due to the elasticity of the cylindrical portion 41, and the flange portion 42 is formed. The lower part of the peripheral wall 41 a gets over the inclined surface 34 a of each lance 34. When the lower edge of each through hole 46 gets over the corresponding inclined surface 34a of the lance 34, the lower part of the peripheral wall 41a is elastically returned to its original position. As a result, as shown in FIG. 4B, each lance 34 engages with a corresponding through hole 46. Thereby, engagement of the attachment 40 and the heat radiating member 30 is completed. The attachment 40 is restricted from moving upward by each lance 34.

  At this time, as shown in FIG. 4A, a part of the lower surface of the ceiling portion 41 b of the attachment 40 abuts a part of the upper surface of the substrate 20. Thereby, the substrate 20 supporting the semiconductor light emitting element 10 is fixed to the heat radiating member 30. As shown in FIG. 2A, a part of the substrate 20 is covered with a ceiling portion 41b, and the semiconductor light emitting element 10 is exposed through an opening defined by an inner peripheral wall 41b1.

  2A and 4A, the first conductive terminal 44a and the second conductive terminal 44b of the attachment 40 are connected to the first conductive contact 21a provided on the upper surface of the substrate 20 and the first conductive contact 21a. The two conductive contacts 21b are in contact with each other. Accordingly, the first connection terminal 43 a and the second connection terminal 43 b of the connector portion 43 are electrically connected to the semiconductor light emitting element 10.

  That is, by fixing the substrate 20 supporting the semiconductor light emitting element 10 to the heat radiating member 30 by one-touch operation of pushing the attachment 40 toward the heat radiating member 30 and engaging each lance 34 and each through hole 46. Electrical connection between the semiconductor light emitting element 10 and the connector portion 43 is made.

  As described above, according to the light source unit 1 according to the present embodiment, the semiconductor light emitting element 10 can be attached to the attachment 40 by simply engaging each lance 34 of the heat dissipation member 30 with each through hole 46 of the attachment 40. The first conductive terminal 44a and the second conductive terminal 44b are electrically connected. Since work such as screwing is not necessary, the assembly work of the light source unit 1 can be performed in a short time and easily.

  The engagement between each lance 34 and each through hole 46 may be disengaged. In this case, the lower edge of the peripheral wall 41a of the attachment 40 (the portion where the flange portion 42 is formed) is pushed and expanded toward the radially outer side of the cylindrical portion 41, whereby the lance 34 corresponding to the lower edge of each through hole 46 is formed. It is configured to be able to get over. If the semiconductor light emitting element 10 needs to be replaced, the coupling with the heat dissipation member 30 is released by pulling the attachment 40 upward in this state. Therefore, the attachment 40 can be removed from the heat radiating member and the semiconductor light emitting element 10 can be accessed only by expanding the peripheral wall 41a and pulling out the attachment 40. Therefore, when the semiconductor light emitting element 10 needs to be replaced, the operation can be easily performed in a short time.

  In the above embodiment, the plurality of lances 34 are formed in the heat radiating member 30, and the plurality of through holes 46 are formed in the attachment 40. However, the through hole may be formed in the heat dissipation member 30 and the lance may be formed in the attachment 40. The number of lances and through holes can be determined as appropriate. As long as both can be engaged in a releasable manner, the form of engagement is not limited to that by the lance and the through hole. A well-known engagement structure can be appropriately employed.

  As shown by an arrow A in FIG. 4A, in the light source unit 1 according to the present embodiment, the first conductive terminal 44a and the second conductive terminal 44b included in the attachment 40 are attached and detached from the heat dissipation member 30. It can be elastically deformed. By attaching the attachment 40 to the heat radiating member 30, when each lance 34 of the heat radiating member 30 and each through hole 46 of the attachment 40 are engaged, the first conductive terminal 44a and the second conductive terminal 44b are elastically deformed. Are pressed against the first conductive contact 21a and the second conductive contact 21b, respectively.

  According to such a configuration, the electrical connection between the first conductive terminal 44a and the first conductive contact 21a and between the second conductive terminal 44b and the second conductive contact 21b is stably maintained. Moreover, since the board | substrate 20 is pressed with respect to the heat radiating member 30, positioning of the board | substrate 20 with respect to the heat radiating member 30 is maintained stably. That is, these effects can be obtained by the above-mentioned short time and easy work.

  FIG. 6 is a partial cross-sectional view showing a state in which the light source unit 1 according to the present embodiment is mounted on a lighting device 50 mounted on a vehicle. The lighting device 50 includes a housing 51 and a translucent cover 52. The housing 51 opens forward. The translucent cover 52 is attached to the housing 51 so as to close the opening. The housing 51 and the translucent cover 52 define a lamp chamber 53.

  The illumination device 50 includes an optical unit 54. The optical unit 54 is disposed in the lamp chamber 53. The optical unit 54 includes a lens 54a and a reflector 54b.

  The illumination device 50 includes a light source unit mounting portion 55. In the present embodiment, the light source unit mounting portion 55 is formed on a part of the housing 51 (an example of a part of the lighting device). The light source unit mounting portion 55 includes a through hole 55 a that communicates the inside and the outside of the lamp chamber 53.

  The light source unit 1 according to this embodiment is mounted on the light source unit mounting portion 55 from the outside of the housing 51. The engagement between the light source unit 1 and the light source unit mounting portion 55 is performed by a so-called bayonet method. FIG. 7 is a view for explaining a method of mounting the light source unit 1 on the light source unit mounting portion 55, and shows a state in which the through hole 55a is viewed from the inside of the housing 51 (that is, from the inside of the lamp chamber 53).

  As shown to (a) of FIG. 7, a pair of groove | channel 55b (an example of a 3rd engaging part) is formed in a part of inner peripheral surface of the through-hole 55a. On the other hand, the attachment 40 of the light source unit 1 includes a pair of protrusions 47 (an example of a fourth engagement portion). The protrusion 47 is formed on the outer peripheral surface of the cylindrical portion 41. Each protrusion 47 is inserted into the corresponding groove 55 b and the light source unit 1 is twisted in the direction of the arrow shown in FIG. Thereby, it is prevented that the light source unit 1 falls out of the through hole 55a.

  In this state, the semiconductor light emitting element 10 is disposed at a position facing the lens 54 a of the optical unit 54. The light emitted from the semiconductor light emitting element 10 is subjected to predetermined orientation control by the lens 54 a and the reflector 54 b, and illuminates the front of the illumination device 50 through the translucent cover 52.

  That is, the light source unit 1 is fixed to the illumination device 50 by a one-touch operation in which each protrusion 47 of the light source unit 1 is engaged with the corresponding groove 55b of the light source unit mounting portion 55 and the light source unit 1 is twisted.

  The engagement between each projection 47 and the light source unit mounting portion 55 can be released. When the semiconductor light emitting element 10 needs to be replaced, the projection 47 can be moved in the corresponding groove 55b by twisting the light source unit 1 in the direction opposite to that when the light source unit 1 is mounted. It can be pulled out from the mounting portion 55. Therefore, the light source unit 1 can be detached from the lighting device 50 by simply pulling the light source unit 1 in the direction opposite to that when the light source unit 1 is mounted. Thereafter, access to the semiconductor light emitting element 10 becomes possible.

  As described above, according to the illumination device 50 according to the present embodiment, the illumination device of the light source unit 1 can be obtained by merely engaging the projections 47 of the light source unit 1 with the light source unit mounting portion 55 from the outside of the housing 51. 50 can be fixed. Since operations such as opening and closing the lamp chamber 53 and screwing are unnecessary, the assembly operation of the lighting device 50 can be performed in a short time and easily.

  Further, the engagement between each projection 47 and the light source unit mounting portion 55 can be released. Since the light source unit 1 is removed from the lighting device 50 only by the operation of releasing the engagement, the semiconductor light emitting element 10 can be accessed without the operation of opening / closing the lamp chamber 53 or releasing the screwing. Therefore, when the semiconductor light emitting element 10 needs to be replaced, the operation can be easily performed in a short time.

  In the above embodiment, the pair of protrusions 47 is formed in the light source unit 1, and the pair of grooves 55 b is formed in the light source unit mounting portion 55. However, the groove may be formed in the light source unit 1 and the protrusion may be formed in the light source unit mounting portion 55. The number of protrusions and grooves can be determined as appropriate. The form of engagement is not limited to the bayonet method as long as both can be engaged so as to be releasable. A well-known engagement structure can be appropriately employed.

  In the above embodiment, each protrusion 47 is formed in the attachment 40, and each groove 55 b is formed in the housing 51. However, as long as both can be releasably engaged from the outside of the housing 51, each projection 47 may be provided on at least one of the attachment 40 and the heat dissipation member 30. Each groove 55 b may be provided at an appropriate location in the lamp chamber 53 such as a part of the optical unit 54.

  As described above, the attachment 40 of the light source unit 1 includes the connector portion 43 including the first connection terminal 43a and the second connection terminal 43b. The first connection terminal 43 a and the second connection terminal 43 b are electrically connected to the semiconductor light emitting element 10.

  According to such a configuration, the conductive path can be provided separately from the side supporting the semiconductor light emitting element 10 like the substrate 20 and the heat dissipation member 30, and the attachment 40 including the conductive path is standardized. -Easy to generalize. Thereby, component costs are suppressed. In addition, since standardized and general-purpose parts are handled, operations when assembling the light source unit 1 and the illumination device 50 or when the semiconductor light emitting element 10 needs to be replaced can be performed in a short time and easily.

  As shown in FIG. 6, in a state where the light source unit 1 is fixed to the lighting device 50, the connector portion 43 including the first connection terminal 43 a and the second connection terminal 43 b is disposed outside the housing 51. By connecting the mating connector 60 to the connector portion 43, an external power source (not shown) and the semiconductor light emitting element 10 are electrically connected.

  According to such a configuration, it is not necessary to access the interior of the lamp chamber 53 when establishing or releasing the electrical connection between the external power source and the semiconductor light emitting element 10. All that is required is an operation of attaching / detaching the mating connector 60 to / from the connector portion 43 arranged outside the housing 51. Therefore, it is necessary to replace the semiconductor light emitting element 10 when assembling the light source unit 1 or the lighting device 50. When this occurs, the work can be easily performed in a short time.

  As shown in FIG. 6, a part of the heat radiating member 30 is disposed outside the housing 51 in a state where the light source unit 1 is fixed to the lighting device 50.

  According to such a configuration, heat generated by the operation of the semiconductor light emitting element 10 can be efficiently dissipated to the outside of the housing 51. Since the temperature of the entire lighting device 50 including the light source unit 1 can be lowered, the work when the semiconductor light emitting element 10 needs to be replaced can be easily performed in a short time.

  The above embodiment is for facilitating understanding of the present invention, and does not limit the present invention. The present invention can be modified and improved without departing from the spirit of the present invention, and it is obvious that the present invention includes equivalents thereof.

  In order to improve the waterproofness / dustproofness of the light source unit 1, an appropriate sealing member such as a gasket may be interposed between the flange portion 32 of the heat dissipation member 30 and the flange portion 42 of the attachment 40.

  The structure which fixes the board | substrate 20 which supports the semiconductor light-emitting device 10 to the heat radiating member 30 can be changed suitably.

  For example, as in the first modified example shown in FIG. 8, the first conductive terminal 44a and the second conductive terminal 44b are exposed on the upper surface of the ceiling portion 41b of the attachment 40, and the connection 70 by the wire bonding technique or the ribbon bonding technique is performed. The electrical connection between the first conductive contact 21a and the second conductive contact 21b formed on the substrate 20 may be ensured.

  As in the second modification shown in FIG. 9, a fixing method that does not use the attachment 40 is also conceivable. As shown in FIG. 9A, a pair of elastically deformable conductive terminals 82 (only one is shown) and a positioning projection 83 are provided on the upper surface 81 a of the substrate support portion 81 of the heat radiating member 80. Yes. Each conductive terminal 82 is electrically connected to an external power source via a conductive path (not shown). On the other hand, a through hole 25 is formed in the substrate 20A supporting the semiconductor light emitting element 10. The first conductive contact 21a and the second conductive contact 21b are provided on the opposite side of the through hole 25 with the semiconductor light emitting element 10 interposed therebetween (only the first conductive contact 21a is shown).

  The substrate 20A in this modification is fixed to the heat dissipation member 80 as follows. First, as shown in FIG. 9A, the side on which the first conductive contact 21a and the second conductive contact 21b of the substrate 20A are provided is located between the pair of conductive terminals 82 and the upper surface 81a of the substrate support 81. Sandwich. The pair of conductive terminals 82 are elastically deformed.

  Next, as shown in FIG. 9B, the side on which the through hole 25 of the substrate 20 </ b> A is provided is brought close to the upper surface 81 a of the substrate support portion 81. When the positioning projection 83 penetrates the through hole 25 from below to above, the substrate 20 </ b> A is positioned with respect to the substrate support portion 81. The pair of conductive terminals 82 elastically return to their original positions and shapes.

  Or the structure like the 3rd modification shown in FIG. 10 can be considered. As shown in FIG. 10A, an elastically deformable slot 92 and an elastically deformable locking piece 93 are provided on the upper surface 91 a of the substrate support portion 91 of the heat radiating member 90. Inside the slot 92, a pair of conductive terminals 92a are provided (only one is shown). Each conductive terminal 92a is electrically connected to an external power source through a conductive path (not shown). On the other hand, in the substrate 20B supporting the semiconductor light emitting element 10, the first conductive contact 21a and the second conductive contact 21b are provided only on one side of the semiconductor light emitting element 10 (only the first conductive contact 21a is illustrated). Shown).

  The substrate 20B in the present modification is fixed to the heat dissipation member 90 as follows. First, as shown in FIG. 10A, the side on which the first conductive contact 21a and the second conductive contact 21b of the substrate 20B are provided is inserted into the slot 92. As a result, electrical connection is ensured between the pair of conductive terminals 92a and the first conductive contact 21a and the second conductive contact 21b.

  Next, as shown in FIG. 10B, the slot 92 is elastically deformed, and the end of the substrate 20B on the side where the first conductive contact 21a and the second conductive contact 21b are not provided is connected to the upper surface of the substrate support 91. Approach 91a. When the end portion is sandwiched between the locking piece 93 and the upper surface 91a while being elastically deformed, the substrate 20B is positioned with respect to the substrate support portion 91. The slot 92 may be configured to be rotatable about the rotation axis by providing a rotation axis at the base end.

  1: light source unit, 10: semiconductor light emitting element, 20: substrate, 21a: first conductive contact, 21b: second conductive contact, 30: heat dissipation member, 34: lance, 40: attachment, 43: connector portion, 43a: first 1 connection terminal, 43b: second connection terminal, 44a: first conductive terminal, 44b: second conductive terminal, 46: through hole, 47: protrusion, 50: lighting device, 51: housing, 53: lamp chamber, 55: Light source unit mounting part, 55b: groove

Claims (4)

A light source unit detachably attached to a housing of a lighting device mounted on a vehicle,
A semiconductor light emitting device;
A substrate for supporting the semiconductor light emitting element;
A conductive contact provided on the substrate and electrically connected to the semiconductor light emitting element;
A heat dissipation member for supporting the substrate;
A first engagement portion provided on the heat dissipation member;
An attachment provided with a conductive terminal , a second engagement portion , and a connector portion ;
With
By engaging the second engagement portion with the first engagement portion, the conductive terminal comes into contact with the conductive contact,
The connector portion has a connection terminal electrically connected to the conductive terminal,
The conductive terminal is disposed so as to be located inside the housing when mounted on the lighting device,
The connection terminal is a light source unit arranged so as to be located outside the housing when mounted on the lighting device . The conductive terminal is elastically deformable,
The light source unit according to claim 1, wherein the conductive terminal is pressed against the conductive contact while being elastically deformed by engaging the second engagement portion with the first engagement portion. A lighting device mounted on a vehicle,
A housing that partitions the light chamber;
The light source unit according to claim 1 or 2, wherein at least a part of the light source unit is accommodated in the lamp chamber;
A third engagement portion;
With
The light source unit is
A fourth engagement portion provided on at least one of the attachment and the heat dissipation member;
The illumination device, wherein the light source unit is detachably fixed by releasably engaging the fourth engagement portion with the third engagement portion from the outside of the housing. The lighting device according to claim 3 , wherein in a state where the light source unit is fixed, at least a part of the heat dissipation member is disposed outside the housing.

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