JP6273992B2 - Metal laminate, method for producing metal laminate - Google Patents

Description

  The present invention relates to a metal laminate having an intermetallic compound layer formed on the surface, and a method for producing the same.

  Conventionally, in order to impart functionality to the surface of a base material made of metal, a plating treatment is performed on the surface of the base material.

  For example, Patent Document 1 discloses a manufacturing method in which a surface of a conductive substrate (base material) is subjected to a plating process to impart sliding characteristics required for connection terminals to the surface of the conductive substrate. . In this manufacturing method, a Ni layer, a Cu layer, and an Sn layer are plated in this order on the surface of a conductive substrate to produce a plated laminate, and the plated laminate is heat treated to cause the Cu layer and the Sn layer to react with each other. The laminate is formed on the surface of the conductive substrate. A metal laminated body is a laminated body which consists of a CuSn intermetallic compound layer, Cu layer, and Ni layer.

JP 2007-247060 A

  However, in the manufacturing method of Patent Document 1, it is necessary to strictly manage the composition of the plating solution, the plating conditions, the heat treatment conditions, and the like, and it is difficult to control the composition and crystal structure of the CuSn intermetallic compound layer.

  Therefore, the manufacturing method of Patent Document 1 has a problem that it is difficult to stably and easily form a metal laminate having a CuSn intermetallic compound layer formed on the surface of the conductive substrate.

  Moreover, in the manufacturing method of patent document 1, since the impurity and hydrogen by a plating solution mix, there exists a problem that it is difficult to form a clean metal laminated body on the surface of an electroconductive base | substrate.

  An object of the present invention is to provide a method for producing a metal laminate capable of stably and easily producing a clean metal laminate having an intermetallic compound layer formed on the surface, and a metal laminate produced by the production method. To provide a body.

The production method of the present invention includes forming a second metal layer on the surface of the first metal layer, and forming a composite of the first metal layer and the second metal layer,
The composite is subjected to at least one of heat treatment and pressure treatment, and is composed of an intermetallic compound composed of the first metal and the second metal between the first metal layer and the second metal layer. A production step for producing an intermetallic compound layer;
A peeling step of mechanically peeling the second metal layer from the first metal layer using the intermetallic compound layer as a peeling layer, and creating a metal laminate in which the intermetallic compound layer is formed on the surface of the first metal layer;
It is characterized by including.

  In this manufacturing method, the metal laminate is prepared by mechanically peeling the second metal layer from the first metal layer using the intermetallic compound layer as a peeling layer without plating. The intermetallic compound layer is a layer satisfying a relationship that a difference between the lattice constant of the second metal and the lattice constant of the intermetallic compound is larger than a difference between the lattice constant of the first metal and the lattice constant of the intermetallic compound, Or it is a brittle layer compared with another layer.

  Therefore, in the peeling step, the second metal layer can be peeled stably and easily from the first metal layer using the intermetallic compound layer as the peeling layer. That is, a metal laminate having an intermetallic compound layer formed on the surface can be stably and easily produced.

  Moreover, in this manufacturing method, since the impurity and hydrogen by a plating solution do not mix, a clean metal laminated body can be created.

  Therefore, according to this manufacturing method, the clean metal laminated body in which the intermetallic compound layer was formed in the surface can be produced stably and easily.

  In the production method of the present invention, the melting point of the first metal is preferably lower than the melting point of the second metal.

In the manufacturing method of the present invention, the first metal is a single metal made of Sn or Zn, or an alloy containing Sn or Zn,
The second metal is preferably a single metal made of Ag, Cu, Au, Al, or Ni, or an alloy containing at least one metal of Ag, Cu, Au, Al, or Ni.

In the manufacturing method of the present invention, the first metal is Sn,
The second metal is a CuNi alloy,
The intermetallic compound is preferably an intermetallic compound of CuNiSn.

  Moreover, it is preferable that the manufacturing method of this invention includes the 1st metal layer formation process which forms a 1st metal layer on the surface of a base material.

  In this production method, a clean metal laminate having an intermetallic compound layer formed on the surface can be stably and easily formed on the surface of the substrate.

  The base material is preferably a single metal made of Cu or Fe, or an alloy containing Cu or Fe.

  Moreover, in the manufacturing method of this invention, it is preferable that a 2nd metal layer is plate shape.

  In this manufacturing method, since the second metal layer has a shape that can be easily gripped in the peeling step, the second metal layer is easily mechanically peeled from the first metal layer.

Moreover, the metal laminate of the present invention includes a first metal layer,
An intermetallic compound layer composed of an intermetallic compound composed of a first metal and a second metal, the intermetallic compound layer formed on the surface of the first metal layer,
The first metal layer includes a dispersion layer in which an intermetallic compound is dispersed in the first metal layer.

  In this configuration, the anchor effect is exerted by the dispersion layer, and the adhesive force between the first metal layer and the intermetallic compound layer is increased. Therefore, in the metal laminate of the present invention, the intermetallic compound layer is difficult to peel from the first metal layer. Therefore, according to the metal laminate of the present invention, the sliding characteristics required for the connection terminals are improved.

  According to the production method of the present invention, a clean metal laminate having an intermetallic compound layer formed on the surface can be stably and easily produced. Moreover, according to the metal laminated body of this invention, the sliding characteristic etc. which are requested | required of a connecting terminal improve.

It is a flowchart which shows the manufacturing method of the metal laminated body which concerns on embodiment of this invention. It is an external appearance perspective view which shows typically the manufacturing process of the metal laminated body shown in FIG. It is sectional drawing which shows typically the manufacturing process of the metal laminated body shown in FIG. It is sectional drawing which shows typically the manufacturing process of the metal laminated body shown in FIG. It is sectional drawing which shows typically the manufacturing process of the metal laminated body shown in FIG. It is sectional drawing which shows typically the metal laminated body manufactured by the manufacturing method shown in FIG. 1, and a base material. It is the figure which mapped the cross section of the metal laminated body and base material shown in FIG. 6 with the CuNiSn intermetallic compound. It is the figure which mapped the cross section of the metal laminated body and base material shown in FIG. 6 by Sn. It is sectional drawing which shows typically the manufacturing method of the metal laminated body which concerns on other embodiment of this invention.

  Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. Each embodiment is an exemplification, and needless to say, partial replacement or combination of configurations shown in different embodiments is possible.

<< Embodiment of the Present Invention >>
The manufacturing method of the metal laminated body which concerns on embodiment of this invention is demonstrated below.

  FIG. 1 is a flowchart showing a method for manufacturing a metal laminate according to an embodiment of the present invention. FIG. 2 is an external perspective view schematically showing a manufacturing process of the metal laminate shown in FIG. 3-5 is sectional drawing which shows typically the manufacturing process of the metal laminated body shown in FIG. 6 is a cross-sectional view schematically showing a metal laminate and a base material manufactured by the manufacturing method shown in FIG.

  First, a base material 50 having a predetermined thickness, molten Sn, and a second metal layer 20 having a predetermined thickness are prepared. In this embodiment, the base material 50 is a Cu plate. The base material 50 becomes a connection terminal of an electronic component, for example. The second metal layer 20 is a Cu10Ni alloy plate.

  In addition, the thickness of the base material 50 is 0.2 mm, and the external shape of the base material 50 is a 100 mm square. The thickness of the second metal layer 20 is 0.1 mm, and the outer shape of the second metal layer 20 is 80 mm square.

  Next, the surface of the base material 50 and the surface of the second metal layer 20 (Cu10Ni alloy plate) are cleaned (FIG. 1: S1). This cleaning process is performed by performing an alkali treatment or an acid treatment using a detergent. The cleaning agent is, for example, a chlorine-based flux. By this cleaning process, the surface of the substrate 50 and the surface of the second metal layer 20 (Cu10Ni alloy plate) are easily wetted by molten Sn.

  Next, molten Sn is poured between the base material 50 and the second metal layer 20 (Cu10Ni alloy plate), and the first metal layer 10 composed of Sn is used as the base material as shown in FIGS. The second metal layer 20 is formed on the surface of the first metal layer 10 (FIG. 1: S3).

  A composite of the first metal layer 10 and the second metal layer 20 is formed on the surface of the substrate 50 by the process of S3. Here, the melting point of Sn constituting the first metal layer 10 is lower than the melting point of Cu10Ni constituting the second metal layer 20.

  Next, a heat treatment is performed on the composite of the first metal layer 10 and the second metal layer 20, and the first metal layer 10 and the second metal layer 20, as shown in FIG. The intermetallic compound layer 30 comprised by the intermetallic compound which consists of 1 metal and a 2nd metal is produced | generated (FIG. 1: S4).

  At this time, a dispersion layer 13 in which an intermetallic compound is dispersed is also generated in the first metal layer 10. The intermetallic compound layer 30 is a CuNiSn alloy. Therefore, after the step of S4, the first metal layer 10 is composed of the dispersion layer 13 in which the intermetallic compound is dispersed and the pure metal layer 11 made of only the first metal. In this embodiment, the heat treatment is performed on the composite at 350 ° C. for 60 seconds.

  Next, as shown in FIG. 5, the second metal layer 20 is mechanically peeled from the first metal layer 10 using the intermetallic compound layer 30 as a peeling layer (FIG. 1: S5). Thereby, as shown in FIG. 6, the metal laminate 100 in which the intermetallic compound layer 30 is formed on the surface of the first metal layer 10 is formed on the surface of the substrate 50.

  Note that the peeling force varies depending on the shape and size of the second metal layer 20. In the present embodiment, since the second metal layer 20 has a plate shape that can be easily gripped in the peeling process, the second metal layer 20 is easily peeled from the first metal layer 10 mechanically. Therefore, in this embodiment, a small peeling force is sufficient.

  In the above manufacturing method, the metal laminate 100 is removed from the surface of the substrate 50 by mechanically peeling the second metal layer 20 from the first metal layer 10 using the intermetallic compound layer 30 as a peeling layer without plating. Created above.

  In the peeling step of S5 described above, the second metal layer 20 can be peeled stably and easily from the first metal layer 10 using the intermetallic compound layer 30 as the peeling layer. That is, the metal laminate 100 having the intermetallic compound layer 30 formed on the surface can be stably and easily produced.

  Here, there are two possible reasons why the second metal layer 20 can be stably and easily peeled from the first metal layer 10 using the intermetallic compound layer 30 as a peel layer. The first reason is considered that the intermetallic compound layer 30 is more fragile than the other layers.

  The second reason is considered that the difference between the lattice constant of the second metal and the lattice constant of the intermetallic compound is larger than the difference between the lattice constant of the first metal and the lattice constant of the intermetallic compound. .

  In this embodiment, the lattice constant of Sn corresponding to the first metal is 5.831 、, the lattice constant of Cu10Ni alloy corresponding to the second metal is 3.665 、, and the lattice of CuNiSn alloy corresponding to the intermetallic compound The constant is 6.116 cm.

  Moreover, in this manufacturing method, since the impurities and hydrogen by a plating solution are not mixed, the clean metal laminated body 100 can be created.

  Therefore, according to the above manufacturing method, the clean metal laminated body 100 in which the intermetallic compound layer 30 is formed on the surface can be stably and easily formed on the surface of the substrate 50. That is, a surface layer composed of an intermetallic compound layer can be stably and easily formed on the element body.

  FIG. 7 is a diagram in which the cross section of the metal laminate and the base material shown in FIG. 6 is mapped with a CuNiSn intermetallic compound. FIG. 8 is a diagram in which the cross sections of the metal laminate and the base material shown in FIG. 6 are mapped with Sn.

  In addition, FIG. 7 has shown that the density | concentration of a CuNiSn intermetallic compound is so high that the color in a figure is white. FIG. 8 shows that the darker the color in the figure, the higher the Sn concentration.

  The metal laminate 100 includes a first metal layer 10 and an intermetallic compound layer 30 formed on the surface of the first metal layer 10. As shown in FIGS. 7 and 8, the first metal layer 10 includes a dispersion layer 13 in which an intermetallic compound is dispersed in the first metal layer 10. Further, the intermetallic compound layer 30 is locally inclined toward the first metal layer 10 side. That is, the concentration distribution of the intermetallic compound changes stepwise (the concentration on the surface side is high). This inclination phenomenon is considered to be because the Ni component in the intermetallic compound layer 30 settles toward the first metal layer 10 side.

  In the metal laminate 100, the anchor effect is exerted by the dispersion layer 13, and the adhesive force between the first metal layer 10 and the intermetallic compound layer 30 is increased. Therefore, in the metal laminate 100, the intermetallic compound layer 30 is difficult to peel from the first metal layer 10. Therefore, when the metal laminate 100 is formed on the surface of the connection terminal of the electronic component, the sliding characteristics required for the connection terminal are improved.

<< Other embodiments >>
The manufacturing method of the metal laminated body which concerns on other embodiment of this invention is demonstrated below.

  FIG. 9 is a cross-sectional view schematically showing a method for producing a metal laminate according to another embodiment of the present invention. The arrows in FIG. 9 indicate the traveling direction of the substrate 50.

  The manufacturing method of another embodiment is different from the manufacturing method of the embodiment shown in FIG. 1 in the first metal layer forming step of S2 and the composite forming step of S3. Since the other steps are the same, the description is omitted and only different points will be described below.

  As shown in FIG. 9, a method may be used in which the substrate 50 is brought into contact with a roll-shaped CuNi alloy rod 220 rotating counterclockwise in a molten Sn bath 210 filled in a container 211. Even in this method, a composite body of the first metal layer 10 made of Sn and the second metal layer 20 made of CuNi alloy is formed on the surface of the substrate 50.

  In addition, Sn plating is performed in advance on the surface of the second metal layer 20 or the surface of the base material 50 that is a CuNi alloy plate, and the surface of the second metal layer 20 and the surface of the base material 50 are bonded together. Also good. Even in this method, a composite body of the first metal layer 10 made of Sn and the second metal layer 20 made of CuNi alloy is formed on the surface of the substrate 50.

  Further, a method may be used in which a Sn plate is sandwiched between the second metal layer 20 that is a CuNi alloy plate and the base material 50 and bonded together. Also in this method, a composite of the plate-like first metal layer 10 made of Sn and the plate-like second metal layer 20 made of CuNi alloy is formed on the surface of the substrate 50.

  In the above-described embodiment, the base material 50 is a connection terminal of an electronic component, but is not limited thereto. In implementation, the substrate may be, for example, an external electrode of an electronic component, a solder bump, a pump housing, a tire wheel, a water tap, or a steel plate.

  For example, when the metal laminate 100 is formed on the surface of an external electrode of an electronic component, a solder bump, a pump casing, a tire wheel, a faucet such as a water supply, a solder bump, or a steel plate, the metal laminate 100 is an electronic component. It is possible to prevent corrosion of external electrodes, solder bumps, pump housings, tire wheels, water taps, solder bumps, or steel plates.

  In the above-described embodiment, the heat treatment is performed on the composite at the heating temperature of 350 ° C. and the heating time of 60 seconds in the step of S4, but is not limited thereto. In the implementation, the heating temperature may be a temperature that does not melt the substrate, and if the first metal layer is an Sn-based alloy, 200 to 500 ° C., and if the first metal layer is a Zn-based alloy, about 350 ° C. to 700 ° C. are suitable. Yes. The heating time increases in proportion to the thickness of the intermetallic compound layer to be prepared. However, when an intermetallic compound layer having a thickness of several μm is formed, it can be about 10 seconds to 180 seconds.

  In the above-described embodiment, only the heat treatment is performed on the composite of the first metal layer 10 and the second metal layer 20 in the step S4. However, the present invention is not limited to this. In implementation, for example, at least one of heat treatment and pressure treatment may be performed on the composite. For example, it is possible to form the intermetallic compound layer 30 only by the pressure treatment for the composite of the first metal layer 10 and the second metal layer 20.

  In the above-described embodiment, the material of the base material 50 is a single metal made of Cu, but is not limited thereto. For example, the material of the base material 50 may be a single metal made of Fe or an alloy containing Cu or Fe.

  Similarly, in the above-described embodiment, the first metal layer 10 uses a single metal made of Sn, but is not limited thereto. For example, the first metal layer 10 may use a single metal made of Zn or an alloy containing Sn or Zn.

  In the above-described embodiment, the second metal layer 20 uses a Cu10Ni alloy, but is not limited thereto. For example, the second metal layer 20 may be a single metal made of Ag, Cu, Au, Al, or Ni, or an alloy containing at least one of Ag, Cu, Au, Al, or Ni. I do not care.

  Finally, the above description of the embodiments should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

DESCRIPTION OF SYMBOLS 10 ... 1st metal layer 13 ... Dispersion layer 20 ... 2nd metal layer 30 ... Intermetallic compound layer 50 ... Base material 100 ... Metal laminated body 210 ... Molten Sn bath 211 ... Container 220 ... CuNi alloy rod

Claims (12)

Forming a second metal layer on the surface of the first metal layer, and forming a composite of the first metal layer and the second metal layer; and
An intermetallic compound composed of a first metal and a second metal is provided between the first metal layer and the second metal layer, and at least one of heat treatment and pressure treatment is performed on the composite. A production step for producing an intermetallic compound layer constituted;
A peeling step of peeling off the second metal layer from the first metal layer using the intermetallic compound layer as a peeling layer, and creating a metal laminate in which the intermetallic compound layer is formed on the surface of the first metal layer; ,
Including
The difference between the lattice constant of the second metal lattice constant as the intermetallic compound of the greater than the difference between the lattice constant of the intermetallic compound with the first metal lattice constants, wherein a to Rukin genus that A manufacturing method of a layered product. Forming a second metal layer on the surface of the first metal layer, and forming a composite of the first metal layer and the second metal layer; and
An intermetallic compound composed of a first metal and a second metal is provided between the first metal layer and the second metal layer, and at least one of heat treatment and pressure treatment is performed on the composite. A production step for producing an intermetallic compound layer constituted;
A peeling step of peeling off the second metal layer from the first metal layer using the intermetallic compound layer as a peeling layer, and creating a metal laminate in which the intermetallic compound layer is formed on the surface of the first metal layer; ,
Including
Wherein the first metal has a melting point lower than the melting point of the second metal, the manufacturing method of the characteristics and to Rukin genus laminate that.   The method for producing a metal laminate according to claim 1, wherein the melting point of the first metal is lower than the melting point of the second metal. The first metal is a single metal made of Sn or Zn, or an alloy containing Sn or Zn,
The second metal is a single metal composed of Ag, Cu, Au, Al, or Ni, or an alloy containing at least one metal of Ag, Cu, Au, Al, or Ni. The manufacturing method of the metal laminated body of any one of Claims 1-3. Forming a second metal layer on the surface of the first metal layer, and forming a composite of the first metal layer and the second metal layer; and
An intermetallic compound composed of a first metal and a second metal is provided between the first metal layer and the second metal layer, and at least one of heat treatment and pressure treatment is performed on the composite. A production step for producing an intermetallic compound layer constituted;
A peeling step of peeling off the second metal layer from the first metal layer using the intermetallic compound layer as a peeling layer, and creating a metal laminate in which the intermetallic compound layer is formed on the surface of the first metal layer; ,
Including
The first metal is Sn;
The second metal is a CuNi alloy;
The intermetallic compound is an intermetallic compound of Cu-Ni-Sn, the manufacturing method of the characteristics and to Rukin genus laminate that.   The first metal is Sn;
  The second metal is a CuNi alloy;
  The said intermetallic compound is an intermetallic compound of CuNiSn, The manufacturing method of the metal laminated body of any one of Claims 1-4 characterized by the above-mentioned. Forming a second metal layer on the surface of the first metal layer, and forming a composite of the first metal layer and the second metal layer; and
An intermetallic compound composed of a first metal and a second metal is provided between the first metal layer and the second metal layer, and at least one of heat treatment and pressure treatment is performed on the composite. A production step for producing an intermetallic compound layer constituted;
A peeling step of peeling off the second metal layer from the first metal layer using the intermetallic compound layer as a peeling layer, and creating a metal laminate in which the intermetallic compound layer is formed on the surface of the first metal layer; ,
Including
The manufacturing method of the metal laminated body characterized by including the 1st metal layer formation process which forms the said 1st metal layer on the surface of a base material.   The manufacturing method of the metal laminated body of any one of Claims 1-6 including the 1st metal layer formation process which forms the said 1st metal layer in the surface of a base material. The method for producing a metal laminate according to claim 7 or 8 , wherein the material of the base material is a single metal made of Cu or Fe, or an alloy containing Cu or Fe. The method for producing a metal laminate according to any one of claims 1 to 9 , wherein the second metal layer has a plate shape. A first metal layer;
An intermetallic compound layer composed of an intermetallic compound composed of a first metal and a second metal, the intermetallic compound layer formed on the surface of the first metal layer,
The first metal layer is seen containing dispersion layer in which the intermetallic compound on the first metal layer is present in a dispersed,
The difference between the lattice constant of the second metal and the lattice constant of the intermetallic compound is larger than the difference between the lattice constant of the first metal and the lattice constant of the intermetallic compound. .   A first metal layer;
  An intermetallic compound layer composed of an intermetallic compound composed of a first metal and a second metal, the intermetallic compound layer formed on the surface of the first metal layer,
  The first metal layer includes a dispersion layer in which the intermetallic compound is dispersed in the first metal layer,
  The metal laminate according to claim 1, wherein the melting point of the first metal is lower than the melting point of the second metal.