JP6279326B2 - Manufacturing method of sputtering target - Google Patents
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本発明は、溶解鋳造法によって製造される磁性材スパッタリングターゲットであって、特に漏洩磁束密度が高い磁性材スパッタリングターゲット及びその製造方法に関する。 The present invention relates to a magnetic material sputtering target manufactured by a melt casting method, and particularly to a magnetic material sputtering target having a high leakage magnetic flux density and a manufacturing method thereof.
次世代の高速記録素子として、磁気記録素子(MRAM)の研究開発が進められており、そのMRAMを構成する層に用いられる材料として、ホウ素(B)を含有する磁性材料が用いられている。例えば、Co、Fe、Ni等とBからなる組成、すなわち、Co−B、Co−Fe−B、あるいは、これらにNi、Al、Cu、Mn等を添加した組成が知られている。 Research and development of a magnetic recording element (MRAM) is underway as a next-generation high-speed recording element, and a magnetic material containing boron (B) is used as a material used for a layer constituting the MRAM. For example, a composition composed of Co, Fe, Ni or the like and B, that is, Co-B, Co-Fe-B, or a composition obtained by adding Ni, Al, Cu, Mn or the like to these is known.
一般に、これらのMRAMを構成する磁性材層は、Co、Fe、Ni等とBとからなる組成を有するスパッタリングターゲットを用いて作製される。しかし、このような組成のスパッタリングターゲットは、Bを含有しているため非常に脆く、ターゲット元材となるインゴットの鋳造や加工をする際に、亀裂や割れが生じることがあった。 Generally, the magnetic material layer constituting these MRAMs is produced using a sputtering target having a composition composed of Co, Fe, Ni, etc. and B. However, since the sputtering target having such a composition contains B, it is very fragile, and cracks and cracks may occur when casting or processing an ingot as a target base material.
このようなことから、本出願人は以前、溶解鋳造物を30〜60℃/分で急冷することにより、ターゲットの亀裂の発生などを低減する技術を提供した(特許文献1)。しかし、このような方法を用いてもなお、脆性を十分に改善することができず、冷間加工が困難で、冷間加工による漏洩磁束密度(PTF)を向上させるのが困難という問題があった。 For this reason, the present applicant has previously provided a technique for reducing the occurrence of cracks in the target by rapidly cooling the molten casting at 30 to 60 ° C./min (Patent Document 1). However, even if such a method is used, the brittleness cannot be sufficiently improved, cold working is difficult, and it is difficult to improve the leakage magnetic flux density (PTF) by cold working. It was.
本発明は、Bを含有する磁性材スパッタリングターゲットにおいて、溶解鋳造工程での鋳造条件を制御することにより、亀裂や割れ等を発生させることなく、漏洩磁束密度を向上させたターゲットを提供することを課題とする。これにより、マグネトロンスパッタリングによる良好な成膜を可能にすることを目的とする。 The present invention provides a target having an improved leakage magnetic flux density without causing cracks or cracks by controlling the casting conditions in the melt casting process in a magnetic material sputtering target containing B. Let it be an issue. Accordingly, an object is to enable good film formation by magnetron sputtering.
上記の課題を解決するために、本発明者は鋭意研究を行った結果、溶解鋳造物の冷却速度を遅くすることで、合金インゴットの組織を改変することができ、これにより、漏洩磁束密度を向上できるとの知見を得た。 In order to solve the above problems, the present inventor has conducted intensive research, and as a result, the structure of the alloy ingot can be modified by slowing down the cooling rate of the molten casting, thereby reducing the leakage magnetic flux density. The knowledge that it can improve was obtained.
本発明はこの知見に基づき、下記の発明を提供する。
1)Bを10at%以上30at%以下含有し、Coを30at%以上50at%以下含有し、Feを30at%以上50at%以下含有するスパッタリングターゲットであって、ターゲットの共晶組織中の視野25μm×25μm内に長径が2μm以下のBプア粒子が平均20個以下であることを特徴とするスパッタリングターゲット。
2)Bを10at%以上30at%以下含有し、Coを30at%以上50at%以下含有し、Feを30at%以上50at%以下含有する原料を溶解・鋳造してインゴットを作製し、これを機械加工してターゲットを作製するスパッタリングターゲットの製造方法であって、原料を溶解鋳造後、5〜30℃/分で冷却してインゴットを作製することを特徴とするスパッタリングターゲットの製造方法。
Based on this finding, the present invention provides the following inventions.
1) A sputtering target containing B at 10 at% or more and 30 at% or less, Co at 30 at% or more and 50 at% or less, and Fe at 30 at% or more and 50 at% or less, and a visual field in the eutectic structure of the target 25 μm × A sputtering target characterized in that the average number of B poor particles having a major axis of 2 μm or less within 25 μm is 20 or less.
2) An ingot is produced by melting and casting a raw material containing B at 10 at% to 30 at%, Co at 30 at% to 50 at%, and Fe at 30 at% to 50 at%, and machining it. A sputtering target manufacturing method for manufacturing a sputtering target, wherein the raw material is melted and cast and then cooled at 5 to 30 ° C./min to prepare an ingot.
Bを含有する磁性材スパッタリングターゲットは、脆性が高いため、冷間加工が困難で、冷間加工によって漏洩磁束密度を向上させにくいということがあったが、本発明によれば、冷却速度の低下によりターゲットの組織が変化して、漏洩磁束密度が向上するという優れた効果を有する。 The magnetic material sputtering target containing B has high brittleness, so it is difficult to cold work, and it is difficult to improve the leakage magnetic flux density by cold working. According to the present invention, the cooling rate decreases. As a result, the structure of the target is changed and the leakage magnetic flux density is improved.
本発明のスパッタリングターゲットは、B含有量が10at%以上30at%以下、Co含有量が30at%以上50at%以下、Fe含有量が30at%以上50at%以下から構成される。本発明のターゲットは、MRAMなどにおける磁性材層を形成するために使用されるものであるが、ターゲットの成分組成は、所望する磁気特性に応じて、上記の数値範囲内で適宜選択される。 The sputtering target of the present invention is composed of a B content of 10 at% to 30 at%, a Co content of 30 at% to 50 at%, and an Fe content of 30 at% to 50 at%. The target of the present invention is used for forming a magnetic material layer in MRAM or the like, and the component composition of the target is appropriately selected within the above numerical range according to the desired magnetic properties.
これらの原料を調合した後、溶解鋳造してインゴットを作製する。このインゴットを、スパッタリング装置の中でターゲットとしての機能を発揮できるように、ターゲット形状の調整やターゲット面の研磨等の機械加工を行い、スパッタリングターゲットを作製する。溶解温度等の溶解条件は、合金種と配合割合で当然変わってくるが、およそ1100℃〜1500℃の範囲で溶解する。 After preparing these raw materials, melt casting is performed to produce an ingot. The ingot is subjected to mechanical processing such as adjustment of the target shape and polishing of the target surface so that the function as a target can be exhibited in the sputtering apparatus, thereby producing a sputtering target. The melting conditions such as the melting temperature naturally vary depending on the alloy type and the blending ratio, but dissolve in the range of approximately 1100 ° C to 1500 ° C.
上記の製造工程において特に重要なことは、上記溶解後、溶湯が入った坩堝から鋳型へ出湯し、そのインゴットを5〜30℃/分で冷却することである。インゴットの冷却速度を制御する方法としては、鋳型の肉厚や材質を変化させたり、鋳型を保温や断熱したり、また、後述するように溶湯を振動させながら冷却する方法が挙げられる。これによって、共晶組織中の視野25μm×25μm内に長径が2μm以下のBプア粒子が平均20個以下のターゲットを得ることができる。そして、このような組織を有するターゲットは、漏洩磁束密度が向上するという優れた効果を有する。 What is particularly important in the manufacturing process described above is that after the melting, the molten metal is poured out from the crucible into the mold and the ingot is cooled at 5 to 30 ° C./min. Methods for controlling the cooling rate of the ingot include changing the thickness and material of the mold, keeping the mold warm and insulating, and cooling the molten metal while vibrating it as will be described later. This makes it possible to obtain a target having an average of 20 or less B poor particles having a major axis of 2 μm or less within a visual field of 25 μm × 25 μm in the eutectic structure. And the target which has such a structure | tissue has the outstanding effect that a leakage magnetic flux density improves.
図1に、後述する実施例1のスパッタリングターゲットの組織写真(倍率:10倍)を示す。通常、溶融合金を冷却していくと、最初に初晶が晶出し、さらに冷却が進んでいくと、ある温度で残りの溶融合金が凝固する。そして、このときの凝固する組織が共晶組織と呼ばれる。図1に示す通り、本発明のターゲットは初晶と共晶組織から構成されており、前記共晶組織は、Bリッチ相とBプア相から構成されている。ここで、Bリッチ相とは、Bの含有量が15at%以上の相を意味し、Bプア相とは、Bの含有量が15at%未満の相を意味する。 FIG. 1 shows a structure photograph (magnification: 10 times) of the sputtering target of Example 1 described later. Normally, when the molten alloy is cooled, the primary crystal is first crystallized, and when the cooling proceeds further, the remaining molten alloy is solidified at a certain temperature. The structure that solidifies at this time is called a eutectic structure. As shown in FIG. 1, the target of the present invention is composed of a primary crystal and a eutectic structure, and the eutectic structure is composed of a B rich phase and a B poor phase. Here, the B-rich phase means a phase having a B content of 15 at% or more, and the B poor phase means a phase having a B content of less than 15 at%.
鋳型には、Cu、Fe、Coなどの金属製やカーボン製のものを使用することができる。カーボン製の鋳型は、金属製のものに比べて熱伝導性が低いため、より好ましい。また、現時点ではメカニズムが不明であるが、冷却時に振動を与えることで、冷却速度を遅くすることができ、組織が変化するという効果があると推測される。振動方法は、振動子や超音波振動子などの公知の手段を利用することができ、また、その周波数に特に制限はない。 The mold can be made of a metal such as Cu, Fe, Co, or carbon. Carbon molds are more preferred because they have lower thermal conductivity than metal molds. Further, although the mechanism is unknown at present, it is presumed that there is an effect that the cooling rate can be slowed by applying vibration during cooling, and the structure is changed. As the vibration method, known means such as a vibrator or an ultrasonic vibrator can be used, and the frequency is not particularly limited.
以下、実施例および比較例に基づいて説明する。なお、本実施例はあくまで一例であり、この例によって何ら制限されるものではない。すなわち、本発明は特許請求の範囲によってのみ制限されるものであり、本発明に含まれる実施例以外の種々の変形を包含するものである。 Hereinafter, description will be made based on Examples and Comparative Examples. In addition, a present Example is an example to the last, and is not restrict | limited at all by this example. In other words, the present invention is limited only by the scope of the claims, and includes various modifications other than the examples included in the present invention.
(実施例1)
原料として、Co、Fe、Bを使用し、これをCo:40at%、Fe:40at%、B:20at%に調合した。次に、これをセラミックス製坩堝に入れ、約1200℃で加熱溶解し、金属製鋳型直下の振動機を30Hzで作動させた後、溶湯を金属製鋳型に移し、5〜30℃/分で冷却し、炉から取り出した。次に、これを直径164mm、厚さ4mmの形状へ切削加工して、スパッタリングターゲットとした。ターゲットの組織写真(倍率:300倍)を図2に示す。このターゲットの共晶組織中の視野25μm×25μm内をランダムに4箇所観察した結果、長径が2μm以下(直径2μmの円の中に収まるサイズ)のBプア粒子は平均2個と少なかった。また、このターゲットの漏洩磁束密度を測定した結果、30.4%と後述する比較例1に比べて向上した。以上の結果を表1に示す。
なお、ターゲットのどの部分を観察しても、共晶組織に関しては、粒子径に大きな変化はなく、そのばらつきは小さいが、初晶に関しては、ターゲットの端の方が小さく、中心の方が大きいという傾向にある。
Example 1
Co, Fe, and B were used as raw materials, and these were prepared at Co: 40 at%, Fe: 40 at%, and B: 20 at%. Next, this is put in a ceramic crucible, heated and melted at about 1200 ° C., the vibrator directly under the metal mold is operated at 30 Hz, and then the molten metal is transferred to the metal mold and cooled at 5 to 30 ° C./min. And removed from the furnace. Next, this was cut into a shape having a diameter of 164 mm and a thickness of 4 mm to obtain a sputtering target. A structure photograph of the target (magnification: 300 times) is shown in FIG. As a result of observing four spots in the visual field of 25 μm × 25 μm in the eutectic structure of this target at random, the average number of B poor particles having a major axis of 2 μm or less (size that fits in a circle of 2 μm in diameter) was small. Moreover, as a result of measuring the leakage magnetic flux density of this target, it improved 30.4% compared with the comparative example 1 mentioned later. The results are shown in Table 1.
Note that no matter what part of the target is observed, the eutectic structure has no significant change in particle diameter and the variation is small, but for the primary crystal, the end of the target is smaller and the center is larger. It tends to be.
なお、漏洩磁束密度は、ASTM F2086−01(Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2)に準拠した。具体的には、ターゲットの中心を固定し、0度、30度、60度、90度、120度と回転させて漏洩磁束密度を測定し、それぞれの測定値をASTMで定義されているreference filedの値で割り返し、100を掛けてパーセントで表わし、これら5点の平均値から平均漏洩磁束密度(%)を求めた。以下の実施例、比較例においても同様とした。 The leakage magnetic flux density conformed to ASTM F2086-01 (Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2). Specifically, the center of the target is fixed, and the leakage magnetic flux density is measured by rotating at 0 degree, 30 degrees, 60 degrees, 90 degrees, and 120 degrees, and each measured value is a reference filed defined by ASTM. The average leakage magnetic flux density (%) was obtained from the average value of these five points. The same applies to the following examples and comparative examples.
(実施例2)
原料として、Co、Fe、Bを使用し、これをCo:40at%、Fe:40at%、B:20at%に調合した。次に、これをセラミックス製坩堝に入れ、約1200℃で加熱溶解し、金属製鋳型直下の振動機を150Hzで作動させた後、溶湯を金属製鋳型に移し、5〜30℃/分で冷却し、炉から取り出した。次に、これを直径164mm、厚さ4mmの形状へ切削加工して、スパッタリングターゲットとした。このターゲットの共晶組織中の視野25μm×25μm内をランダムに4箇所観察した結果、長径が2μm以下のBプア粒子は平均2個と少なかった。また、このターゲットの漏洩磁束密度を測定した結果、32.4%と後述する比較例1に比べて向上した。
(Example 2)
Co, Fe, and B were used as raw materials, and these were prepared at Co: 40 at%, Fe: 40 at%, and B: 20 at%. Next, this is put in a ceramic crucible, heated and melted at about 1200 ° C., the vibrator directly under the metal mold is operated at 150 Hz, and then the molten metal is transferred to the metal mold and cooled at 5 to 30 ° C./min. And removed from the furnace. Next, this was cut into a shape having a diameter of 164 mm and a thickness of 4 mm to obtain a sputtering target. As a result of observing four spots in the visual field 25 μm × 25 μm in the eutectic structure of this target at random, the average number of B poor particles having a major axis of 2 μm or less was small. Moreover, as a result of measuring the leakage magnetic flux density of this target, it improved 32.4% compared with the comparative example 1 mentioned later.
(実施例3)
原料として、Co、Fe、Bを使用し、これをCo:40at%、Fe:40at%、B:20at%に調合した。次に、これをセラミックス製坩堝に入れ、約1200℃で加熱溶解し、溶湯を予め800℃に加温した金属製鋳型に移し、5〜20℃/分で冷却し、炉から取り出した。次に、これを直径164mm、厚さ4mmの形状へ切削加工して、スパッタリングターゲットとした。このターゲットの共晶組織中の視野25μm×25μm内をランダムに4箇所観察した結果、長径が2μm以下のBプア粒子は平均1個と少なかった。また、このターゲットの漏洩磁束密度を測定した結果、31.0%と後述する比較例1に比べて向上した。
(Example 3)
Co, Fe, and B were used as raw materials, and these were prepared at Co: 40 at%, Fe: 40 at%, and B: 20 at%. Next, this was put into a ceramic crucible, heated and melted at about 1200 ° C., the molten metal was transferred to a metal mold preheated to 800 ° C., cooled at 5 to 20 ° C./min, and taken out from the furnace. Next, this was cut into a shape having a diameter of 164 mm and a thickness of 4 mm to obtain a sputtering target. As a result of observing four random locations within a visual field of 25 μm × 25 μm in the eutectic structure of this target, the average number of B poor particles having a major axis of 2 μm or less was small. Moreover, as a result of measuring the leakage magnetic flux density of this target, it was 31.0%, which is an improvement over Comparative Example 1 described later.
(実施例4)
原料として、Co、Fe、Bを使用し、これをCo:40at%、Fe:40at%、B:20at%に調合した。次に、これをセラミックス製坩堝に入れ、約1200℃で加熱溶解した後、溶湯をカーボン製鋳型に移し、5〜30℃/分で冷却し、炉から取り出した。次に、これを直径164mm、厚さ4mmの形状へ切削加工して、スパッタリングターゲットとした。ターゲットの組織写真(倍率:300倍)を図3に示す。このターゲットの共晶組織中の視野25μm×25μm内をランダムに4箇所観察した結果、長径が2μm以下のBプア粒子は平均0個と少なかった。また、このターゲットの漏洩磁束密度を測定した結果、31.7%と後述する比較例1に比べて向上した。
Example 4
Co, Fe, and B were used as raw materials, and these were prepared at Co: 40 at%, Fe: 40 at%, and B: 20 at%. Next, this was put in a ceramic crucible and heated and melted at about 1200 ° C., and then the molten metal was transferred to a carbon mold, cooled at 5 to 30 ° C./min, and taken out from the furnace. Next, this was cut into a shape having a diameter of 164 mm and a thickness of 4 mm to obtain a sputtering target. A structure photograph of the target (magnification: 300 times) is shown in FIG. As a result of observing four spots in the visual field 25 μm × 25 μm in the eutectic structure of this target at random, the average number of B poor particles having a major axis of 2 μm or less was few. Moreover, as a result of measuring the leakage magnetic flux density of this target, it was 31.7%, which was improved compared to Comparative Example 1 described later.
(比較例1)
原料として、Co、Fe、Bを使用し、これをCo:40at%、Fe:40at%、B:20at%に調合した。次に、これをセラミックス製坩堝に入れ約1200℃で加熱溶解した後、金属製鋳型に移し、振動せずに、30〜50℃/分で冷却し、炉から取り出した。次に、これを直径164mm、厚み4mmの形状へ切削加工して、スパッタリングターゲットとした。ターゲットの組織写真(倍率:300倍)を図4に示す。このターゲットの共晶組織中の視野25μm×25μm内をランダムに4箇所に観察した結果、長径が2μm以下のBプア粒子は平均56個であった。また、このターゲットの漏洩磁束密度を測定した結果、15.7%であった。
(Comparative Example 1)
Co, Fe, and B were used as raw materials, and these were prepared at Co: 40 at%, Fe: 40 at%, and B: 20 at%. Next, this was put in a ceramic crucible and heated and melted at about 1200 ° C., then transferred to a metal mold, cooled at 30 to 50 ° C./min without vibration, and taken out from the furnace. Next, this was cut into a shape having a diameter of 164 mm and a thickness of 4 mm to obtain a sputtering target. A structural photograph of the target (magnification: 300 times) is shown in FIG. As a result of observing randomly within the visual field 25 μm × 25 μm in the eutectic structure of this target at four locations, the average number of B poor particles having a major axis of 2 μm or less was 56. Moreover, as a result of measuring the leakage magnetic flux density of this target, it was 15.7%.
本発明のスパッタリングは、溶解鋳造したインゴットから製造されたものであり、脆性が高いため、冷間加工が困難で、冷間加工によって漏洩磁束密度を向上させにくいということがあったが、本発明によれば、冷却速度の低下によりターゲットの組織が変化し、漏洩磁束密度が向上するという優れた効果を有する。本発明は、MRAM用の磁性材層を形成するための磁性材スパッタリングターゲットとして、有用である。 Sputtering of the present invention is manufactured from a melt-cast ingot, and since it is highly brittle, it is difficult to cold work and it is difficult to improve the leakage magnetic flux density by cold working. According to the above, there is an excellent effect that the structure of the target is changed due to a decrease in the cooling rate, and the leakage magnetic flux density is improved. The present invention is useful as a magnetic material sputtering target for forming a magnetic material layer for MRAM.
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| JP4016399B2 (en) * | 2003-04-30 | 2007-12-05 | 日立金属株式会社 | Method for producing Fe-Co-B alloy target material |
| JP5472688B2 (en) * | 2008-06-12 | 2014-04-16 | 日立金属株式会社 | Fe-Co alloy sputtering target material and method for producing the same |
| JPWO2010026704A1 (en) * | 2008-09-04 | 2012-01-26 | キヤノンアネルバ株式会社 | Magnetoresistive element, manufacturing method thereof, and storage medium used in the manufacturing method |
| WO2010029702A1 (en) * | 2008-09-09 | 2010-03-18 | キヤノンアネルバ株式会社 | Method for manufacturing magnetoresistive element, and storage medium used in the manufacturing method |
| JP2010111943A (en) * | 2008-10-10 | 2010-05-20 | Hitachi Metals Ltd | Method for producing sputtering target material |
| WO2011070860A1 (en) * | 2009-12-11 | 2011-06-16 | Jx日鉱日石金属株式会社 | Magnetic material sputtering target |
| JP6227419B2 (en) * | 2014-01-08 | 2017-11-08 | Jx金属株式会社 | Method for manufacturing magnetic material sputtering target |
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