JP6292066B2 - Power semiconductor device - Google Patents

Description

  The present invention relates to a power semiconductor device.

  Conventional power semiconductor devices include devices in which wiring terminals are mounted on semiconductor elements, devices in which wiring terminals for external connection are mounted on circuit patterns, and the like. When a wiring terminal is mounted on a semiconductor element or a circuit pattern, high stress is applied to the joint portion under the wiring terminal due to the difference in coefficient of linear expansion between the wiring terminal, the insulating sealing material, and the insulating substrate.

  In view of this, the wiring terminal bonded on the semiconductor element or the circuit pattern is provided with a C vent structure as in Patent Document 1, for example, to relieve the stress applied to the bonding portion under the wiring terminal. In some cases, the wiring terminal is provided with a terminal block of a U-shape rotated 90 degrees to relieve stress (for example, Patent Document 2).

JP-A-8-8374 JP 2010-103222 A

  In such a power semiconductor device, the insulating sealing material expands and contracts in response to repeated heat generation of the semiconductor element, and the tensile stress in the vertical direction that the wiring terminal receives from the expansion and expansion, It occurs between the joint portion under the wiring terminal and the structural portion that relieves the stress of the wiring terminal, or at a part of the structural portion that relieves the stress of the wiring terminal. And there existed a problem that the lifetime of the junction part under a wiring terminal fell by this tensile stress.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a highly reliable power semiconductor device by improving the life of a junction under a wiring terminal in the power semiconductor device. And

A power semiconductor device according to the present invention is housed in a resin housing, a first substrate housed in the resin housing and having a circuit pattern formed on a metal plate via an insulating layer, and in the resin housing. A power semiconductor device comprising: a semiconductor element disposed on a circuit pattern; a wiring terminal connected to the semiconductor element; and an insulating sealing material filled in a resin casing, wherein the wiring terminal has a folded structure The outer surface that contacts the semiconductor element of the folded structure is fixed to the semiconductor element, and the two inner surfaces that are included in the folded structure and face each other by being folded can be separated from each other, and an insulating seal is provided between the two inner surfaces. It is characterized by the absence of a stop material .
A power semiconductor device according to the present invention is housed in a resin housing, a first substrate housed in the resin housing and having a circuit pattern formed on a metal plate via an insulating layer, and the resin housing. And a power semiconductor device comprising: a semiconductor element disposed on the circuit pattern; a wiring terminal connected to the semiconductor element; and an insulating sealing material filled in a resin casing. Has a folded structure, the outer surface contacting the semiconductor element of the folded structure is fixed to the semiconductor element, and the two inner surfaces facing each other by being folded in the folded structure are in contact with each other. Are characterized by being separable from each other.

  According to the power semiconductor device of the present invention, the folded structure of the wiring terminal is fixed to the semiconductor element on the outer surface that contacts the semiconductor element, so that the vertical tensile stress received by the wiring terminal from the insulating sealing material is the wiring. Generation | occurrence | production between the junction part under a terminal and the folding structure of a wiring terminal is suppressed, and a folding structure relieves the stress received from an insulating sealing material. Therefore, the power semiconductor device according to the present invention can improve the life of the joint portion under the wiring terminal and provide a highly reliable power semiconductor device.

1 is a perspective view showing a power semiconductor device 100 according to a first embodiment of the present invention. 1 is a cross-sectional view showing a power semiconductor device 100 according to a first embodiment of the present invention. It is a front view which shows the wiring terminal 4 concerning Embodiment 1 of this invention. It is a side view which shows the wiring terminal 4 concerning Embodiment 1 of this invention. It is sectional drawing of the semiconductor device 110 for electric power concerning Embodiment 2 of this invention. It is sectional drawing of the power semiconductor device 100 concerning Embodiment 2 of this invention, and is a figure which shows as an example the direction of the wiring terminal 4 when the power semiconductor device 100 is warped in operation. It is sectional drawing of the semiconductor device 100 for electric power concerning Embodiment 2 of this invention, and is a figure which shows as an example the direction of the wiring terminal 4 when the semiconductor device 100 for electric power warps at the time of operation | movement. It is a side view which shows the wiring terminal 41 concerning Embodiment 3 of this invention.

Embodiment 1 FIG.
The configuration of the power semiconductor device 100 according to the first embodiment of the present invention will be described. FIG. 1 is a perspective view showing a power semiconductor device 100 according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the power semiconductor device 100 according to the first embodiment of the present invention, and shows a cross section obtained by cutting the power semiconductor device 100 in FIG. 1 in the longitudinal direction. 1 and 2, a power semiconductor device 100 includes a case 5 as a resin casing, and an insulating substrate 1 as a first substrate in which a circuit pattern 13 is formed on a metal plate 11 with an insulating layer 12 interposed therebetween. And semiconductor elements 8 and 9 disposed on the insulating substrate 1. In the power semiconductor device 100, the aluminum wire 6, the wiring terminals 4 connected to the semiconductor elements 8 and 9 and the circuit pattern 13 with the conductive resin 10, and the circuit pattern 21 are formed on both surfaces of the printed circuit board 2. A printed wiring board 25 as a second substrate, a case lid 51, a case terminal 3, and an insulating sealing material 7 filled in the case 5 are provided.

  The wiring terminal 4 uses, for example, a flat rectangular copper wire as a wire, instead of a stranded wire in which resin may enter between thin wires.

  An insulating substrate 1 as a first substrate has a circuit pattern 13 formed on a metal plate 11 via an insulating layer 12. The metal plate 11 is made of copper having a thickness of 2 mm, for example. What is necessary is just to be excellent in thermal conductivity, and may consist of aluminum. The insulating layer 12 is a resin in which an insulating material having a high thermal conductivity is filled. For example, the insulating layer 12 has a thickness of 0.1 mm, and an epoxy resin matrix is filled with boron nitride as a filler. Insulating materials with high thermal conductivity used as fillers include aluminum oxide, silicon nitride, aluminum nitride, and the like. The circuit pattern 13 is made of, for example, a metal mainly made of copper having a thickness of 105 μm. The size of the insulating substrate 1 in which the circuit pattern 13 is formed on the metal plate 11 via the insulating layer 12 is, for example, an area of 80 mm × 40 mm. The insulating substrate 1 is housed in the case 5 and, as is apparent from FIG. 2, one side surface of the metal plate 11 that is the surface opposite to the surface on which the circuit pattern 13 is formed is exposed.

  In the semiconductor elements 8 and 9, for example, the semiconductor element 8 is an IGBT (Insulated Gate Bipolar Transistor) and the semiconductor element 9 is a diode. The semiconductor element 8 has, for example, an area of 7 mm × 7 mm and a thickness of 250 μm, and has a gate electrode as a control electrode and an emitter electrode as a main wiring electrode on the surface, and a main electrode on the back surface. It has a collector electrode which is a wiring electrode. The semiconductor element 9 has, for example, an area of 7 mm × 5 mm and a thickness of 250 μm. The semiconductor element 9 has an anode electrode as a main wiring electrode on the front surface and a cathode electrode as a main wiring electrode on the back surface. The semiconductor elements 8 and 9 are housed in the case 5, and their back surfaces are connected to the circuit pattern 13 of the insulating substrate 1 by the conductive resin 10. A control signal is extracted from the gate electrode of the semiconductor element 8 to the circuit pattern 13 by the aluminum wire 6.

  Here, the semiconductor elements 8 and 9 are not limited to the above types, and may be any semiconductor element that generates heat. For example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) may be used.

  On the emitter electrode of the semiconductor element 8 and the anode electrode of the semiconductor element 9, the wiring terminal 4 is connected by a conductive resin 10. Further, the wiring terminals 4 are also connected to the circuit pattern 13 by the conductive resin 10. The wiring terminal 4 is made of flat copper having a thickness of 0.3 mm, for example, but may be made of aluminum. The wiring terminals 4 connected to the semiconductor elements 8 and 9 and the circuit pattern 13 by the conductive resin 10 are connected to a printed wiring board 25 as a second substrate.

  The conductive resin 10 is, for example, a silver paste in which an epoxy resin is filled with a silver filler, and the filling rate of the silver filler is 60 to 95 wt%. Thermal characteristics and electrical characteristics are obtained by contact between the silver fillers and the interface of the silver filler adhesion part. The filler filled in the resin may be copper, nickel or the like.

  In addition to the conductive resin 10, solder is used for the connection between the circuit pattern 13 and the semiconductor elements 8 and 9, the connection between the circuit pattern 13 and the wiring terminal 4, and the connection between the semiconductor elements 8 and 9 and the wiring terminal 4. May be.

  A printed wiring board 25 as a second board has circuit patterns 21 formed on both sides of the printed board 2. The printed wiring board 25 has a through-hole portion, and the wiring terminal 4 is connected to the through-hole portion by soldering. The printed wiring board 25 as the second substrate is placed at a position facing the insulating substrate 1 as the first substrate.

  The case terminal 3 is supported by the case 5, and both ends are exposed from the case 5, and one end of the exposed ends is connected to the circuit pattern 21 of the printed wiring board 25 by soldering. The other end is connected to an external device to which the power semiconductor device 100 is connected. As described above, the case terminal 3 is electrically connected to the wiring terminal 4 through the printed wiring board 25. The case lid 51 covers the case 5 so as to cover the semiconductor elements 8 and 9, the wiring terminals 4, the printed wiring board 25, and the like in the case 5 disposed on the insulating substrate 1.

  The case 5 and the case lid 51 are made of any suitable material, and are made of a thermoplastic resin such as polyphenylene sulfide or polybutylene terephthalate, for example. As the thermoplastic resin, for example, polyamide (polyamide), polyethylene (poly ether), polyester (poly ester), and the like can also be used.

  The insulating sealing material 7 is provided in the case 5 between the insulating substrate 1 and the printed wiring board 25 to protect the wiring terminals 4 in order to ensure the insulation of the semiconductor elements 8 and 9 in the case 5. The semiconductor elements 8 and 9, the wiring terminals 4 and the like are sealed. For example, an epoxy resin is used as the material of the insulating sealing material 7, but the material is not limited to this. For example, a silicon resin, urethane resin, polyimide resin, polyamide resin, polyamideimide resin, acrylic resin, rubber A material etc. are used suitably. Further, powders such as aluminum oxide, silicon oxide, aluminum nitride, and boron nitride may be added, and resin powder such as silicon resin and acrylic resin may be added. May be added. The shape of the powder is often spherical, but is not limited thereto, and a crushed shape, a granular shape, a flake shape, an aggregate, or the like may be used. The filling amount of the powder may be an amount that can provide the fluidity, insulation, and adhesiveness required for the insulating sealing material 7.

  Further details of the structure of the wiring terminal 4 will be described. FIG. 3 is a front view of the wiring terminal 4 according to the first embodiment of the present invention, and an A portion surrounded by a broken line in FIG. 2 is enlarged. FIG. 4 is a side view of the wiring terminal 4 according to the first exemplary embodiment of the present invention, and shows a view from the direction B in FIG. The wiring terminal 4 has a folded structure, and an outer surface that contacts the semiconductor element 9 having the folded structure is fixed to the semiconductor element 9, and two inner faces that are faced by being folded in the folded structure are fixed to each other. It has no degree of freedom in the vertical direction. Here, the two inner surfaces facing each other indicate two inner surfaces where the insulating sealing material 7 does not exist between the two inner surfaces, and a gap may exist between the two inner surfaces. Even in this case, it goes without saying that the same effect can be obtained as long as the insulating resin sealing material 7 does not flow into the gap.

  Both the wiring terminal 4 connected to the semiconductor element 8 and the wiring terminal 4 connected to the circuit pattern 13 are folded back in the same manner as the wiring terminal 4 connected to the semiconductor element 9 shown in FIGS. It has a structure.

  In the printed wiring board 25 of the power semiconductor device 100 described above, the circuit pattern 21 is formed on both surfaces of the printed circuit board 2, but the circuit pattern 21 may be formed only on one surface of the printed circuit board 2, The case terminal 3 may be a printed wiring board 25 that is electrically connected to the wiring terminal 4 via the printed wiring board 25. Needless to say, the same effect can be obtained even in this case.

  Next, the operation of the power semiconductor device 100 according to the first embodiment of the present invention will be described. A current of about 100 A flows through the power semiconductor device 100 during operation. The semiconductor elements 8 and 9 generate a large amount of heat, and the temperature rises about 100 degrees. In the power semiconductor device 100, a temperature change occurs due to a change in the magnitude of the flowing current, and the members constituting the power semiconductor device 100 repeatedly expand and contract. Here, the insulating sealing material 7 having a larger linear expansion coefficient than the other constituent members expands and contracts more greatly, and the wiring terminal 4 in the power semiconductor device 100 is compressed with the stress in the lifting direction. Will be repeatedly subjected to stress in a certain direction.

  At this time, the wiring terminal 4 relaxes the stress received from the insulating sealing material 7 by deforming the folded structure. Specifically, when the two facing inner surfaces are in contact with each other, the stress in the lifting direction and the stress in the compressing direction are alleviated by separating the two facing inner surfaces and separating or shrinking the distance. When there is a gap that does not allow the insulating sealing material 7 to flow between the two inner surfaces facing each other, the gap is further separated to relieve the tensile stress on the wiring terminal 4. That is, the folded structure that has been bent (folded) by 180 degrees is deformed in a direction in which the bending angle becomes smaller, whereby the wiring terminal 4 relaxes the stress received from the insulating sealing material 7.

  When the wiring terminal 4 relaxes the stress received from the insulating sealing material 7, even if the two inner surfaces facing each other are separated due to the folding structure being folded back, the surrounding insulating sealing material is between the surfaces. 7 does not enter.

  In the first embodiment of the present invention, the configuration as described above increases the life of the junction under the wiring terminal 4 connected to the semiconductor elements 8 and 9, and provides a highly reliable power semiconductor device 100. Can be obtained. The insulating sealing material 7 expands and contracts due to a change in internal temperature caused by a change in the magnitude of the current flowing through the power semiconductor device 100, and the wiring terminal 4 is stressed in a lifting direction and a stress in a compressing direction. However, since the outer surface in contact with the semiconductor elements 8 and 9 is fixed to the semiconductor elements 8 and 9 in the folded structure of the wiring terminal 4, the stress that the wiring terminal 4 receives from the insulating sealing material 7 is Occurrence between the joint portion below the wiring terminal 4 and the folded structure of the wiring terminal 4 is suppressed. Further, the folded structure of the wiring terminal 4 can relieve the stress that the wiring terminal 4 receives from the insulating sealing material 7 because the two inner surfaces facing each other can be separated by being folded. As a result, the conductive resin 10 under the wiring terminal 4 is not subjected to a force affected by the stress that the wiring terminal 4 repeatedly receives from the insulating sealing material 7, so that the wiring terminals connected to the semiconductor elements 8 and 9 are connected. 4 The life of the lower joint can be improved.

  In addition, the wiring terminal 4 is connected not only to the semiconductor elements 8 and 9 but also to the circuit pattern 13, and the wiring terminal 4 connected to the circuit pattern 13 has a folded structure, so that it is connected to the circuit pattern 13. In addition, it is possible to obtain a highly reliable power semiconductor device 100 in which the life of the joint portion under the wiring terminal 4 is improved.

  Furthermore, in the manufacture of the power semiconductor device 100, there is an effect that productivity is improved. When the wiring terminal 4 is mounted on the semiconductor elements 8, 9 or the circuit pattern 13, the power semiconductor device 100 is manufactured using the wiring terminal 4 that already has a folded structure. Therefore, since the surface of the wiring terminal 4 connected to the semiconductor elements 8 and 9 or the circuit pattern 13 is flat, the pick-up property of the wiring terminal 4 is good in manufacturing the power semiconductor device 100. In addition, it is possible to apply pressure evenly to the surface of the wiring terminal 4 connected to the semiconductor elements 8 and 9 or the circuit pattern 13. Therefore, productivity is improved in the manufacture of semiconductor devices. In addition, when the conductive resin 10 is used and the wiring terminal 4 is mounted, a good joint having a small inclination and a stable thickness can be formed. Therefore, the thermal characteristics and electrical characteristics of the power semiconductor device 100 are improved. It has the effect of stabilizing.

  Furthermore, in the power semiconductor device 100 according to the first exemplary embodiment of the present invention, when the wiring terminal 4 is mounted on the semiconductor elements 8, 9 or the circuit pattern 13, the wiring terminal 4 and the semiconductor element 8, Since the conductive resin 10 is used as the bonding material with the circuit pattern 13 or 9, it is not necessary to perform front metallization on the connection surfaces of the semiconductor elements 8, 9 or the circuit pattern 13 with the wiring terminals 4. Therefore, the productivity of the power semiconductor device 100 can be improved. And the manufacturing cost of the power semiconductor device 100 can be reduced.

Embodiment 2. FIG.
In the second embodiment of the present invention, portions that are different from the first embodiment of the present invention will be described, and descriptions of the same or corresponding portions will be omitted. The second embodiment of the present invention differs from the first embodiment of the present invention in the configuration of the second substrate, and a wiring terminal 40 is added as will be described later. That is, in the first embodiment of the present invention, the second substrate is the printed wiring board 25 in which the circuit pattern 21 is formed on the printed circuit board 2, but in the second embodiment of the present invention, the second substrate is a case. A terminal substrate 55 in which the case terminal 3 is incorporated in the lid 51 is provided. And the wiring terminal 40 which consists of the part which connects two semiconductor elements, and the part extended from there to the case terminal 3 is provided.

  FIG. 5 is a cross-sectional view of the power semiconductor device 110 according to the second embodiment of the present invention. 5, a power semiconductor device 110 includes a case 5 as a resin casing, an insulating substrate 1 as a first substrate in which a circuit pattern 13 is formed on a metal plate 11 via an insulating layer 12, and an insulating substrate. Semiconductor elements 8 and 9 disposed on 1, an aluminum wire 6, a wiring terminal 4 connected on the circuit pattern 13 with a conductive resin 10, and a wiring terminal 40 connected on the semiconductor elements 8 and 9. It has. Furthermore, the power semiconductor device 110 includes a terminal substrate 55 as a second substrate in which case terminals are incorporated in the case lid 51, and an insulating sealing material 7 filled in the case 5.

  The terminal substrate 55 as the second substrate is placed at a position facing the insulating substrate 1 as the first substrate. The terminal substrate 55 is formed on a case lid 51 that covers the case 5 so as to cover the semiconductor elements 8 and 9, the wiring terminals 4 and 40, etc. in the case 5 disposed on the insulating substrate 1. It is a built-in configuration. The case terminal 3 is connected to an external device to which the power semiconductor device 100 is connected at the upper end exposed from the case lid 51 in FIG. 5, and the other lower end is connected to the wiring terminals 4 and 40.

  The wiring terminal 40 has a folded structure like the wiring terminal 4. The outer surface of the folded structure is fixed to the semiconductor elements 8 and 9, and the two inner surfaces facing each other by being folded included in the folded structure are not fixed to each other and have a degree of freedom in the vertical direction. Here, the two inner surfaces facing each other indicate two inner surfaces where the insulating sealing material 7 does not exist between the two inner surfaces, and a gap may exist between the two inner surfaces. Even in this case, it goes without saying that the same effect can be obtained as long as the insulating resin sealing material 7 does not flow into the gap. The wiring terminal 40 electrically connects the semiconductor elements 8 and 9 and is connected to the case terminal 3 of the terminal substrate 55 as the second substrate.

  The second embodiment of the present invention shows an example of a second substrate different from the first embodiment of the present invention, and shows an example in which a wiring terminal connects two semiconductor elements. In this way, the wiring terminal may be a lead frame-like one connected to the outside, such as the wiring terminal 40, or a semiconductor device and a circuit pattern. For example, the aluminum wire 6 Instead of this, the control circuit may be extracted from the gate electrode of the semiconductor element 8 to the circuit pattern 13. However, the fact that the wiring terminal, which is a feature of the present invention, has a folded structure is the same as in the first embodiment of the present invention, so the second embodiment of the present invention is similar to the first embodiment of the present invention. Needless to say, an effect can be obtained.

Embodiment 3 FIG.
In the third embodiment of the present invention, portions that are different from the first embodiment of the present invention and the second embodiment of the present invention will be described, and description of the same or corresponding portions will be omitted. The third embodiment of the present invention differs from the first embodiment of the present invention and the second embodiment of the present invention in the direction of the wiring terminals 4.

  FIG. 6 is a cross-sectional view of the power semiconductor device 200 according to the second embodiment of the present invention, showing the direction of the wiring terminal 4 when the power semiconductor device 200 is warped during operation as an example. is there. FIG. 7 is a cross-sectional view of the power semiconductor device 300 according to the second embodiment of the present invention, showing the direction of the wiring terminal 4 when the power semiconductor device 300 is warped during operation as an example. is there. The power semiconductor device shown in FIG. 6 and FIG. 7 differs from the first embodiment of the present invention only in the direction of the wiring terminal 4, and in the perspective view, the wiring terminal 4 is in an invisible state. Therefore, the figure is the same as that of the power semiconductor device 100 according to the first embodiment of the present invention shown in FIG. The power semiconductor device shown in FIGS. 6 and 7 represents a cross section of the power semiconductor device in FIG. 1 cut in the longitudinal direction.

  As shown in FIGS. 6 and 7, the power semiconductor device 100 according to the second embodiment of the present invention is oriented so that the folded direction of the folded structure of the wiring terminal 4 is the longitudinal direction of the power semiconductor device 200. The wiring terminals 4 are arranged.

  A power semiconductor device having a structure in which various members having different linear expansion coefficients are integrated is warped as a whole due to a difference in deformation amount of a component due to a temperature change of the power semiconductor device. In general, the warpage increases in the longitudinal direction of the power semiconductor device, and the stress applied to the component member increases in the longitudinal direction along with the warpage. On the other hand, when the wiring terminal 4 is arranged in such a direction that the folding direction of the wiring terminal 4 is the longitudinal direction of the power semiconductor device, the wiring terminal 4 and the semiconductor element 8, 9 or the conductive resin 10 against the warp. It is possible to reduce the floating of the circuit pattern 13, the floating of the conductive resin 10, and the deformation of the joint portion made of the conductive resin 10. Thereby, the lifetime of the junction part under the wiring terminal 4 further improves.

  Specifically, when the wiring terminals 4 are arranged as shown in FIG. 6, the folding direction of the wiring terminals 4 is oriented so that the folding direction of the power semiconductor device 200 is the longitudinal direction, and the wiring terminals 4 are folded. If the portion extending from the structure to the printed wiring board 25 is arranged on the outer peripheral side of the power semiconductor device 200, the life of the joint portion under the wiring terminal 4 is further increased when the power semiconductor device 200 is convexly warped. improves.

  In FIG. 6, the two right wiring terminals 4 are located under the wiring terminals 4 by the right side of the folded structure of the wiring terminals 4 being connected to the printed wiring board 25 with respect to the convex warp of the power semiconductor device 200. The stress applied to the joint portion is reduced to cope with the convex warp of the power semiconductor device 200. The two wiring terminals 4 on the left in FIG. 6 are located under the wiring terminals 4 when the portion connected to the printed wiring board 25 from the folded structure of the wiring terminals 4 falls to the left with respect to the convex warp of the power semiconductor device 200. The stress applied to the joint portion is reduced to cope with the convex warp of the power semiconductor device 200.

  Further, when the wiring terminals 4 are arranged as shown in FIG. 7, the wiring terminals 4 are printed so that the folding direction of the folding structure of the wiring terminals 4 is the longitudinal direction of the power semiconductor device 300 and from the folding structure of the wiring terminals 4. When the power semiconductor device 300 is arranged so that the portion extending to the wiring board 25 is on the center side of the power semiconductor device 300, the life of the joint below the wiring terminal 4 is further improved when the power semiconductor device 300 is warped.

  In FIG. 7, the two wiring terminals 4 on the right side are located below the wiring terminals 4 when the portion connected to the printed wiring board 25 from the folded structure of the wiring terminals 4 falls to the right with respect to the concave warp of the power semiconductor device 300. The stress applied to the joint portion is reduced to cope with the concave warp of the power semiconductor device 300. The two wiring terminals 4 on the left in FIG. 7 are located below the wiring terminals 4 when the portion connected to the printed wiring board 25 from the folded structure of the wiring terminals 4 falls to the left with respect to the concave warp of the power semiconductor device 300. The stress applied to the joint portion is reduced to cope with the concave warp of the power semiconductor device 300.

  In the third embodiment of the present invention, the same effect as in the first embodiment of the present invention and the second embodiment of the present invention is obtained, and in addition, the effect of further improving the life of the joint portion under the wiring terminal 4 is obtained. can get. Therefore, a more reliable power semiconductor device can be obtained.

Embodiment 4 FIG.
In the fourth embodiment of the present invention, parts different from the first to third embodiments of the present invention will be described, and description of the same or corresponding parts will be omitted. The third embodiment of the present invention is further characterized in the shape of the folded structure of the wiring terminal 41 from the first to third embodiments of the present invention.

  FIG. 8 is a side view of the wiring terminal 41 provided in the power semiconductor device according to the third embodiment of the present invention. As shown in FIG. 8, the wiring terminal 4 according to the third exemplary embodiment of the present invention has a structure in which a portion connected from the folded structure of the wiring terminal 41 to the printed wiring board 25 is a cross-sectional view of the power semiconductor device. It exists outside the outer edge of the element 9.

  In the fourth embodiment of the present invention, the wiring terminal 41 as described above provides the effects of the first embodiment and the second embodiment of the present invention. The degree of freedom of the 25 circuit patterns 21 can be increased. When the power semiconductor device is viewed in cross section, the wiring terminals 41 that need to be connected to the circuit pattern 21 can be connected to the circuit pattern 21 even if they are not arranged around the through hole portion of the printed wiring board 25. Because.

  In addition, the circuit pattern 21 of the general printed wiring board 2 is thinner than the wiring terminal 41, and heat generation due to current loss becomes a problem. On the other hand, since the power semiconductor device according to the fourth embodiment of the present invention can design the flexible circuit pattern 21, the heat source can be dispersed and the path can be optimized. Thereby, a power semiconductor device with higher performance and reliability can be obtained.

  Further, in the power semiconductor device according to the fourth embodiment of the present invention, the wiring terminal 41 is folded back on the semiconductor element 9 and then pulled out of the semiconductor element 9, so that it is directly under the semiconductor element 9 having a different potential. An insulation distance between the circuit pattern 13 and the wiring terminal 41 can be secured. For this reason, the additional structure for ensuring the insulation distance of the circuit pattern 13 and the wiring terminal 41 directly under the semiconductor element 9 becomes unnecessary, and the cost of the power semiconductor device can be reduced. Further, in the fourth embodiment, as in the first to third embodiments of the present invention, the number of times of bending of the wiring terminals 4 required when manufacturing the power semiconductor device does not change, so that it is inexpensive. The above effects can be obtained.

  Note that the present invention can be freely combined with each other within the scope of the invention, and each embodiment can be modified or omitted as appropriate.

  DESCRIPTION OF SYMBOLS 1 Insulation board | substrate, 2 Printed circuit board, 3 Case terminal, 4,40,41 Wiring terminal, 5 Case, 6 Aluminum wire, 7 Insulating sealing material, 8,9 Semiconductor element, 10 Conductive resin, 11 Metal plate, 12 Insulating layer, 13, 21 Circuit pattern, 25 Printed wiring board, 51 Case lid, 55 Terminal board, 100, 110, 200, 300 Power semiconductor device.

Claims (7)

A resin housing;
A first substrate housed in the resin casing and having a circuit pattern formed on the metal plate via an insulating layer;
A semiconductor element housed in the resin housing and disposed on the circuit pattern;
A wiring terminal connected to the semiconductor element;
An insulating sealing material filled in the resin casing;
A power semiconductor device comprising:
The wiring terminal has a folded structure,
With an outer surface in contact with the semiconductor device of the folded structure is fixed to the semiconductor element, the folded structure of two inner surfaces included opposed by folded into the Ri each other separably der, between the two inner surfaces The absence of an insulating encapsulant ,
A power semiconductor device characterized by the above. A resin housing;
A first substrate housed in the resin casing and having a circuit pattern formed on the metal plate via an insulating layer;
A semiconductor element housed in the resin housing and disposed on the circuit pattern;
A wiring terminal connected to the semiconductor element;
An insulating sealing material filled in the resin casing;
A power semiconductor device comprising:
The wiring terminal has a folded structure,
The outer surface of the folded structure contacting the semiconductor element is fixed to the semiconductor element, and the two inner surfaces facing each other by being folded in the folded structure are in contact with each other, and the two inner surfaces are in contact with each other. Being separable ,
A power semiconductor device characterized by the above. A second substrate placed opposite the first substrate;
The wiring terminal is connected to the second substrate;
The power semiconductor device according to claim 1 or claim 2, characterized in. The folding direction of the folded structure is the longitudinal direction of the power semiconductor device;
The power semiconductor device according to claim 1 , wherein the power semiconductor device is a power semiconductor device. The folding direction of the folded structure is the longitudinal direction of the power semiconductor device;
The power semiconductor device according to claim 3 . A portion connected to the second substrate from the folded structure of the wiring terminal is present outside the outer edge of the semiconductor element when the power semiconductor device is viewed in cross section;
6. The power semiconductor device according to claim 3 or 5 , wherein: Using a conductive resin for connection between the wiring terminal and the semiconductor element;
The power semiconductor device according to any one of claims 1 to 6, wherein.

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