JP6294073B2 - Resistor manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a resistor, and more particularly to a method for manufacturing a shunt resistor using a resistance material made of a metal material as a resistor.

  A shunt resistor is used for the purpose of monitoring the charge / discharge current of the battery and controlling the charge / discharge current of the battery. The shunt resistor is inserted into the current path to be monitored, detects a voltage generated across the resistor of the shunt resistor by the current, and detects the current from a known resistance value. As a structure of such a shunt resistor, a structure in which a circular or square metal electrode is joined to both end faces of a circular or square metal resistor has been proposed (see, for example, Patent Document 1).

  However, when the resistor is manufactured, the resistor and the electrode are first manufactured as a metal member, and then the end surfaces thereof are brought into contact with each other and bonded by pressure welding, welding, brazing, or the like. For this reason, a resistor will be manufactured from an individual metal member alone, and there is a problem that mass production is difficult. In addition, if the resistor and the electrode do not have a certain length in the direction in which the current flows, there is a problem in that they cannot be held in the joining process and there is a limit to downsizing. Further, for example, when a wire is cut to form a resistor or an electrode, there is a problem that flatness of the bonding surface is difficult to obtain, and sufficient bonding strength is difficult to obtain unless the bonding surface is flat.

International Publication WO2013 / 005824

  The present invention has been made based on the above-described circumstances, and an object thereof is to provide a method for manufacturing a shunt resistor made of a metal material that is small in size and excellent in mass productivity.

  The method of manufacturing a resistor according to the present invention includes a step of preparing a resistance plate material made of a metal material made of a resistance material and having an upper surface and a lower surface, drilling the resistance plate material, a carrier portion, and a plurality of individual resistors. A step of forming a body, a connecting portion for connecting the carrier portion and the individual resistor, a step of bonding an electrode material used as an electrode to the upper surface and the lower surface of the individual resistor, and a step of cutting the connecting portion; It is characterized by comprising.

  According to the present invention, since the resistor is constituted by the resistor plate material, the thickness of the resistor plate material becomes the length of the resistor in the current direction. And since an electrode material is joined to the upper surface and lower surface of a resistance board material, manufacture of the shunt resistor which miniaturized the resistance body between both electrodes very thinly is attained. Resistive plate material can be controlled with high dimensional accuracy, and the cross-sectional shape of the resistor and electrode can be formed by patterning such as press punching. Therefore, the dimensional accuracy of the resistor can be easily secured even in mass production, and the resistance value accuracy is high. A resistor is obtained. And, by joining the metal plate material patterned with a large number of resistors and electrodes, and removing the connecting parts to form individual resistors, various designs are possible, and production with high mass productivity is possible Become.

  Furthermore, the joining position accuracy of each resistor and electrode can be easily ensured by overlapping and joining the patterned resistance plate material and the electrode plate material. And since a resistance board material and an electrode board material can be joined by pressure welding (solid phase joining), compared with welding by a laser or an electron beam, joining is stabilized. In particular, in welding by laser or electron beam, both metals are mixed at the interface to be joined, and the interface is formed with a predetermined width. Therefore, when the current direction length of the resistor is small, the electrode is connected to the resistor. Although the material melts and the characteristic of the original resistor cannot be obtained, the uniform bonding surface can be easily obtained by pressure welding, and the original characteristic can be easily obtained.

It is a perspective view of the various shunt resistors manufactured with the said manufacturing method. The left figure which shows the example of pattern formation of the resistance board material based on 1st Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. The left figure which shows the pattern formation example of the electrode plate material which concerns on 1st Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. (A) is a disassembled perspective view, (b) is a perspective view of a laminated state, and (c) is an AA line view of (b), according to the method of manufacturing a resistor of the first embodiment of the present invention. It is sectional drawing of a direction. The left figure which shows the state which has arrange | positioned the metal film to the resistance board material which concerns on 2nd Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. The left figure which shows the example of pattern formation of the said resistance board material is a top view, and the right figure is sectional drawing along the AA line of the left figure. The left figure which shows the example of pattern formation of the resistance board material based on 3rd Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. The left figure which shows the pattern formation example of the intermediate electrode board | plate material which concerns on 3rd Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. The left figure which shows the pattern formation example of the electrode plate material concerning 3rd Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. (A) is a disassembled perspective view, (b) is a perspective view of a laminated state, and (c) is an AA line arrow view of (b), according to a method of manufacturing a resistor of a third embodiment of the present invention. It is sectional drawing of a direction. The left figure which shows the example of pattern formation of the resistance board material based on 4th Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. The left figure which shows the pattern formation example of the electrode plate material which concerns on 4th Example of this invention is a top view, The right figure is sectional drawing along the AA line of the left figure. (A) is a disassembled perspective view, (b) is a perspective view of a laminated state, and (c) is an AA line arrow view of (b), according to a method of manufacturing a resistor of a fourth embodiment of the present invention. It is sectional drawing of a direction, (d) is a perspective view of the shunt resistor manufactured with the said manufacturing method. It is a disassembled perspective view which concerns on the manufacturing method of the resistor of 5th Example of this invention. It is a disassembled perspective view which concerns on the manufacturing method of the resistor of 6th Example of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 9. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.

  FIGS. 1A to 1D show structural examples of shunt resistors manufactured by the manufacturing method of the present invention. A resistor 10 a shown in FIG. 1A is an example in which square electrodes 12, 12 are fixed to both end faces of a columnar (or disc-shaped) resistor 11. The resistor 11 is made of a metal material made of a resistance material such as Cu—Mn—Ni, Cu—Ni, Ni—Cr, or Fe—Cr, and a resistor plate made of the above resistance material having an upper surface and a lower surface. It was cut out and produced. Similarly, the electrode 12 is made of a metal material such as Cu having better electrical conductivity than the resistance material, and is produced by cutting out an electrode plate material made of the above metal material having an upper surface and a lower surface.

  The resistor shown in FIG. 1B is smaller in the diameter of the resistor 11 than the resistor shown in FIG. 1A, and a protrusion 14 for use as a voltage detection terminal is provided on the end face of the electrode 12. It is a standing structure. By providing the protrusion 14 on the resistor-side end surface of the electrode 12, the voltage formed at both ends of the resistor 11 can be detected at the nearest position, and the connection of the voltage detection wiring is facilitated. The resistor shown in FIG. 1C has a structure in which a metal film 13 is further interposed between the resistor 11 and the electrode 12. As will be described later, by interposing the metal film 13, it is possible to prevent the oxide film from adhering to the interface between the resistor 11 and the electrode 12 in the manufacturing process and to obtain good bondability.

  In addition, the resistor shown in FIG. 1D is an intermediate electrode made of a metal material having better electrical conductivity than the resistance material of the resistor, between the rectangular (or square plate) resistor 11A and the electrode 12. The intermediate electrode 12A is integrally provided with a protrusion 14 for use as a voltage detection terminal protruding from the intermediate electrode. The intermediate electrode 12A is a thin square plate electrode having the same cross-sectional shape as the resistor 11A and the electrode 12, and is bonded and fixed to the end surfaces of the resistor 11A and the electrode 12. As a result, the voltage formed at both ends of the resistor 11 can be detected at the nearest position, and the connection of the voltage detection wiring is facilitated as in the above embodiment.

  Since these resistors constitute a resistor by a resistor plate made of a resistor material, the thickness of the resistor plate becomes the length of the resistor in the current direction. And since the electrode material used as an electrode is joined to the upper surface and the lower surface of the resistor, it becomes possible to manufacture a miniaturized shunt resistor having a very short resistor length between both electrodes.

  As an example, by using a resistance plate material having a thickness of 0.7 mm, a resistor having a length of 0.7 mm in the direction of current flow can be realized. When the diameter of the resistor 11 is 2 mm, the resistance is approximately 0.1 mΩ. A small shunt resistor having a value can be realized. Although the length of the electrode is arbitrary, for example, by setting the length to 2 mm to 5 mm, it is possible to manufacture a shunt resistor that is downsized so that the entire length of the resistor is about 5 mm to 10 mm.

  And, in the present invention, a plain sheet such as a resistor plate material and an electrode plate material is patterned, and a multi-cavity pattern is formed by drilling, and a plurality of resistors made of a laminate are collectively pressed. Manufacture and cut connections to individual resistors. Therefore, the cross-sectional shape of the resistor can be set by patterning, so that it is possible to design resistors having various shapes and to manufacture with high productivity.

  Here, the resistance plate material can be controlled with high dimensional accuracy and the cross-sectional shape can be controlled with high dimensional accuracy by patterning, so that the dimensional accuracy of the resistor can be easily secured even in mass production, and a resistor with high resistance value accuracy can get. Since the resistance plate material and the electrode plate material can be joined by pressure welding (solid phase joining), the joining is stable as compared with welding by laser or electron beam, and resistance characteristics that are electrically and mechanically stable can be obtained.

  Next, the manufacturing process of the first embodiment of the present invention relating to the shunt resistor 10a (see FIG. 1A) will be described. FIG. 2A shows an example of pattern formation of a resistance plate material. First, a resistance plate material (sheet) 20a is prepared. As an example, the dimensions are about 100 mm × 100 mm and the thickness is about 0.7 mm. The sheet is then drilled by patterning to form a carrier portion (frame portion) 21, a plurality of individual resistors 22, and a connecting portion 23 a that connects the carrier portion and the individual resistors. The other part is a through hole. The carrier part (frame part) 21 is provided with positioning holes H at its four corners.

  Drilling by patterning can be performed using press punching, etching, laser beam processing, or the like. In the illustrated example, the individual resistor 22 has a disk shape, but the resistor 10c shown in FIG. 1C forms an annular individual resistor 22a, and the resistor 10d shown in FIG. The individual resistor 22b is formed. Thus, it can be processed into an arbitrary shape and size by patterning. The connecting portion 23a serves to connect and fix a large number of individual resistors 22 to the carrier portion 21, and is formed thinner than the thickness of the plate material to facilitate subsequent cutting.

  FIG. 2B shows an example of pattern formation of the electrode plate material. First, an electrode plate material (sheet) 20b made of a Cu material or the like is prepared, a hole is formed by patterning in the sheet 20b, and the carrier portion 21, a plurality of rectangular individual electrode materials 24, and the carrier portion and the individual electrode material are connected. The connecting portion 23b to be formed is formed. The thickness of the sheet is arbitrary, but if the thickness of the resistor is about 0.7 mm, for example, about 2 mm to 5 mm is appropriate.

  The drilling process by patterning can be performed in the same manner as described above, and the connection portion can be formed thin, and the individual electrode 24 can be formed in an arbitrary shape and size. Similarly, the positioning holes H are provided at the four corners of the carrier portion 21. Here, the arrangement of the individual electrode material 24 in the plate material 20b is formed to coincide with the arrangement of the individual resistor 22 in the plate material 20a.

  The plate material 20a and the plate material 20b are preferably subjected to surface finishing by mechanical polishing or chemical polishing after pattern formation. Thereby, an oxide film and a foreign material are removed from the surface which becomes the bonding surface between the resistor and the electrode, and good bonding is obtained. Moreover, since the said board | plate material is a sheet form, the said finishing process is easy.

  FIG. 3 shows a manufacturing process of the resistor according to the first embodiment of the present invention. The electrode plate material 20b formed with the pattern shown in FIG. 2B is overlapped and joined to the upper and lower surfaces of the resistance plate material 20a formed with the pattern shown in FIG. 2A (see FIG. 3A). At this time, by aligning the positioning holes H with pins, the positions of the individual resistor 22 and the individual electrode material 24 can be aligned and fixed as shown in FIG.

It is preferable to form diffusion bonding by pressure welding by heating from 400 ° C. to 1000 ° C. and pressurizing from 1 kN to 10 kN in a vacuum atmosphere (about 10 ⁻⁴ Pa). As a result, the individual resistors 22 of the resistance plate material 20a and the individual electrode material 24 of the electrode plate material 20b can be uniformly bonded to each other by solid phase bonding. Will be stable. In particular, when joining resistors with a small length in the current direction, welding with a laser or the like may cause the resistor to melt into the electrode, and the original characteristics may not be obtained. A joining surface can be easily obtained. Thereby, the laminated body shown to FIG.3 (b) (c) is obtained.

  Next, each resistor is formed by cutting and removing the connecting portion 23a of the resistor plate member 20a and the connecting portion 23b of the electrode plate member 20b with a press or the like. Therefore, the resistor 10a provided with the prismatic (square plate-like) electrodes 12 and 12 on both end faces of the cylindrical (disc-like) resistor 11 shown in FIG.

  In addition, the resistor 10b shown in FIG.1 (b) is obtained by changing the said process. That is, the electrode plate member 20b forms the connecting member 23b so as to form the same plane as one surface of the electrode plate member 20b as shown in the structure shown in FIG. 2B. 3A to 3C, the electrode plate member 20b is joined so that the upper and lower surfaces of the resistance plate member 20a are in contact with the plane on which the connecting member 23b is formed. Then, the connecting member 23a is completely removed, and the connecting member 23b is cut and removed while leaving a pair of parts with the individual resistor 22 interposed therebetween. Thereby, the resistor 10b provided with the protrusion 14 which is a voltage detection terminal protruding upward from the end surface of the electrode 12 on the resistor side is obtained. In addition, although the resistor 10b makes the diameter of the individual resistor 22 small in the resistance member 20a of FIG. 2A, this is arbitrary.

  Next, the manufacturing process of the second embodiment of the present invention relating to the shunt resistor 10c (see FIG. 1C) will be described. First, as shown in FIG. 4A, a metal film 25 is formed on the upper and lower surfaces of the resistance plate member 20a to be prepared. The metal film 25 is a film made of a metal material such as Sn, Ni, or Cu, and is formed by electrolytic plating or the like. Alternatively, Cu nano paste may be screen-printed and heated and cured.

  Then, as shown in FIG. 4B, the plate member 20a is drilled by patterning to form a carrier portion (frame portion) 21, a plurality of individual resistors 22a, and a connecting portion 23a for connecting the carrier portion and the individual resistors. Form. Therefore, the metal film 25 is formed on both upper and lower surfaces of the individual resistor 22a. Here, the individual resistor 22a is formed as a cylindrical body having a through hole inside the resistor.

  Next, using the plate material 20a, the patterned electrode plate material 20b (see FIG. 2B) is overlapped on the upper and lower surfaces of the patterned plate material 20a by the laminating / crimping process shown in FIG. And then joining by pressure welding while applying pressure and heat. And the connection part 23a of the board | plate material 20a and the connection part 23b of the board | plate material 20b are cut | disconnected and removed, and each resistor 10c shown in FIG.1 (c) is formed.

  The resistor 10c includes an annular resistor 11, and includes metal films 13 on both sides thereof. The annular resistor 11 has a small fluctuation range of a current path due to a skin effect when a high-frequency current flows, and thus a shunt resistor 10c suitable for detecting a high-frequency current can be obtained.

  In the lamination / crimping step, when a resistance material of Cu-Mn-Ni is used as the resistance plate material, if the bonding surface with the electrode is oxidized, sufficient bonding strength may not be obtained. By providing the metal film 25 on the upper and lower surfaces of the individual resistor 22a in advance, even when a Cu-Mn-Ni-based resistance material is used, oxidation of the surface can be prevented, and the bonding surface of the individual electrode material 24 can be prevented. On the other hand, good bondability can be obtained, and the occurrence of the defective product can be prevented.

  Next, the manufacturing process of the third embodiment of the present invention relating to the shunt resistor 10d (see FIG. 1D) will be described. The resistor 10d includes a rectangular resistor 11A, a rectangular intermediate electrode 12A, and a rectangular electrode 12, and includes a protrusion 14 that protrudes from the intermediate electrode 12A and is used as a voltage detection terminal.

  First, as shown in FIG. 5A, the resistance plate material 20c is drilled by patterning to connect the carrier portion (frame portion) 21, a plurality of rectangular individual resistors 22b, and the carrier portion and the individual resistors. A connecting portion 23c is formed. Similarly, as shown in FIG. 5B, the intermediate electrode plate 20d is drilled by patterning to connect the carrier portion (frame portion) 21, the plurality of individual intermediate electrodes 25b, and the carrier portion and the individual intermediate electrodes. A portion 23e is formed. The individual intermediate electrode 25b has a rectangular shape with the same pattern as the individual resistor 22b, and includes a protrusion 25c for use as a voltage detection terminal protruding from the individual intermediate electrode 25b.

  Further, as shown in FIG. 5C, the electrode plate member 20e is drilled by patterning to connect the carrier portion (frame portion) 21, the plurality of individual electrode materials 24b, and the carrier portion and the individual resistor 23d. Form. Both the individual electrode material 24b and the individual intermediate electrode material 25b have the same rectangular pattern shape as the individual resistor 22b, but the material and thickness of the plate material are different. Since the intermediate electrode plate 20d will be part of the electrode 12 later, it is preferable to use the same metal material as the electrode plate 20e.

  Then, as shown in FIGS. 6A, 6B, and 6C, the patterned intermediate electrode plate material 20d is interposed between the upper and lower surfaces of the patterned resistance plate material 20c, and the patterned electrode plate material 20e is overlaid and positioned. The holes are aligned by pins and laminated, and pressure and heat are applied to join the holes by pressure welding. Then, the individual resistor 10d shown in FIG. 1 (d) is formed by cutting and removing the connecting portion 23c of the resistance plate member 20c, the connecting portion 23e of the intermediate electrode plate member 20d, and the connecting portion 23d of the electrode plate member 20e. To do.

  Therefore, by cutting and removing the connecting portions 23c, 23d, and 23e, the individual resistor 22b becomes the square resistor 11A, the individual electrode material 24b becomes the square electrode 12, and the individual intermediate electrode material 25b having the protrusion 25c protrudes. A square intermediate electrode 12 </ b> A having the portion 14 is formed. The protrusion 14 is for use as a voltage detection terminal, and can detect the voltage generated at both ends of the resistor 11A at the nearest position.

  Next, the manufacturing process of the fourth embodiment of the present invention according to FIGS. 7A to 7C will be described. First, as shown to FIG. 7A, the resistance plate material 20f is prepared and this is patterned, The long through-hole E is formed. Therefore, a frame portion (carrier portion) 21 is formed on the outer periphery of the resistance plate material 20f, and a long square plate-shaped resistor 22S partitioned by the long through holes E is formed. Then, as shown in FIG. 7B, an electrode plate material 20g is prepared and patterned to form a long through hole E at the same position as the resistance plate material 20f. Therefore, the frame part (carrier part) 21 is formed on the outer periphery of the electrode plate material 20g, and the long prismatic electrode material 24S partitioned by the long through holes E is formed.

  Next, as shown in FIGS. 7C (a), (b), and (c), the electrode plate material 20g is aligned and laminated on both the upper and lower surfaces of the resistance plate material 20f, and pressure and heat are applied to join them by pressure welding. As a result, a laminate composed of the long rectangular plate-like resistor 22S partitioned by the long through-hole E and the long prismatic electrode material 24S bonded to both sides thereof is formed. And this resistor 10e shown to FIG. 7C (d) is obtained by cut | disconnecting this laminated body by a dicing etc. along the cutting line C (refer FIG. 7C (b)). The resistor 10e includes a square resistor 11A and square electrodes 12 and 12 disposed on both sides thereof. In this embodiment, the connecting part is not clearly distinguished as a part, but a part cut by dicing or the like is understood as the connecting part, and a part in contact with the frame part 21 is understood as the connecting part.

  Next, the manufacturing process of the fifth embodiment according to the present invention shown in FIG. 8 will be described. This manufacturing process is a modification of the first embodiment described above, and square electrode members 24d having a square cross section are individually provided on both the upper and lower surfaces of the individual resistor 22 of the resistor plate member 20a (without using a plate member on which a pattern is formed). Bonding by pressure welding or the like.

  That is, as described above, the resistance plate member 20a includes the carrier portion 21, the plurality of individual resistors 22, and the connecting portion 23a that connects the carrier portion and the individual resistors. And the resistor 10a is completed by the process of joining the single-piece | electrode electrode material 24d to the upper surface and lower surface of the separate resistor 22 by pressure welding etc., and cut | disconnecting the connection part 23a. Accordingly, by making the individual electrode material 24 and the single electrode material 24d the same, the resistor 10a (see FIG. 1A) is the same as that manufactured by the first embodiment.

  Next, the manufacturing process of the sixth embodiment according to the present invention shown in FIG. 9 will be described. In the first to fifth embodiments, a single resistor plate material is prepared and drilled to form a carrier portion, a plurality of individual resistors, and a connecting portion for connecting the carrier portion and the individual resistors. Then, two electrode materials were prepared, and these were joined to the upper surface and the lower surface of the individual resistor of the resistance plate material, respectively. However, as the resistance plate material and the electrode plate material become thicker, there is a problem that drilling by patterning becomes difficult.

  Therefore, in this embodiment, a laminated resistance plate material and a laminated electrode plate material in which a resistance plate material and an electrode plate material are laminated in several layers are used. By laminating the layers into several layers, the thickness of the plate material per layer can be reduced, and this has the advantage of facilitating patterning. In particular, the connecting portion needs to be controlled to a thickness that can be easily cut and removed later, but this control becomes unnecessary by dividing the number of layers. In addition, there is a merit that the resistance characteristic can be adjusted by the number of layers of the resistance plate material.

  Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

  The present invention can be suitably used for manufacturing a shunt resistor using a resistance material made of a metal material as a resistor.

Claims (6)

A step of preparing a resistance plate material made of a metal material made of a resistance material and having an upper surface and a lower surface;
Drilling the resistance plate material to form a carrier portion, a plurality of individual resistors, and a connecting portion for connecting the carrier portion and the individual resistors;
Bonding an electrode material used as an electrode to the upper and lower surfaces of the individual resistor;
And a step of cutting the connecting portion. A method of manufacturing a resistor. A step of preparing a plurality of electrode plate members made of a metal material having better electrical conductivity than the resistance material and having an upper surface and a lower surface;
Drilling the electrode plate material, and forming a carrier portion, a plurality of individual electrode materials, and a connecting portion for connecting the carrier portion and the individual electrode material,
The method of manufacturing a resistor according to claim 1, wherein the step of bonding the electrode material is a step of bonding the electrode plate material to an upper surface and a lower surface of the resistance plate material.   The method for manufacturing a resistor according to claim 2, wherein the electrode plate member is formed with a protrusion that protrudes from the individual electrode material and is used as a voltage detection terminal.   4. The method of manufacturing a resistor according to claim 1, wherein a metal film is formed in advance on an upper surface and a lower surface of the resistance plate material.   The method for manufacturing a resistor according to claim 1, wherein a metal material having better electrical conductivity than the resistance material is interposed between the resistance plate material and the electrode material or the individual electrode material.   The method of manufacturing a resistor according to claim 2, wherein the resistor plate member and the electrode plate member are joined by pressure welding.

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