JP6297327B2 - Patterned roll for continuous plating and manufacturing method thereof - Google Patents

Description

  The present invention relates to a roll with a pattern for continuous plating in which a conductive pattern is formed of a conductive material on the surface of a base material whose surface is a nonconductive layer, and a method for manufacturing the roll.

  The roll for continuous plating is used for a continuous plating apparatus. For example, a continuous plating is performed by continuously winding a strip-shaped workpiece such as a steel sheet wound around a reel through a plating bath. is there. As an example of the roll for continuous plating, there exist rolls, such as a sink roll disclosed by patent document 1 or patent document 2, for example.

JP 2006-283044 A JP 2001-89836 A International Publication WO2011 / 125926

  An object of the present invention is to provide a roll with a pattern for continuous plating and a method for manufacturing the roll that can realize a simple manufacturing process, low manufacturing cost, and light weight.

  In order to solve the above-mentioned problems, the roll with a pattern for continuous plating according to the present invention includes a pattern forming portion in which a conductive pattern is formed on the surface of a substrate whose surface is a nonconductive layer, and the nonconductive layer is It has an exposed pattern non-formation part.

  With this configuration, the manufacturing process is simple, the manufacturing cost is low, and a non-conductive material is used, so that the weight can be reduced.

  Moreover, since it has a pattern formation part in which a conductive pattern is formed and a pattern non-formation part in which the nonconductive layer is exposed, metal is deposited on the conductive part during plating, and the nonconductive part Since no metal is deposited on the film, it becomes a roll with a pattern for continuous plating having excellent selectivity.

  The non-conductive layer is preferably made of at least one non-conductive synthetic resin material selected from the group consisting of plastic, ABS resin, epoxy resin, FRP (fiber reinforced plastic), and CFRP (carbon fiber reinforced plastic). .

  The conductive pattern is preferably made of metal or conductive DLC.

The conductive pattern preferably has a volume resistivity of 1.0 × 10 ⁻³ Ω · cm to 1.0 × 10 ⁰ Ω · cm.

  When the conductive pattern is conductive DLC, the height of the pattern forming portion is preferably 0.1 μm to 20 μm, more preferably 0.1 μm to 10 μm, and further preferably 0.1 μm to 5 μm.

  The product of the present invention is characterized in that it is plated by a roll with a pattern for continuous plating.

The 1st aspect of the manufacturing method of the roll with a pattern for continuous plating of this invention is a manufacturing method of the roll with a pattern for continuous plating for manufacturing the said roll with a pattern for continuous plating,
A conductive layer was formed on the surface of the base material whose surface was a non-conductive layer, and the conductive layer was etched to expose the pattern forming portion where the conductive pattern was formed and the non-conductive layer. A pattern non-formation part is formed.

  By doing so, the manufacturing process is simple, the manufacturing cost is low, and the use of a non-conductive material makes it possible to reduce the weight.

  The second aspect of the method for producing a roll with a pattern for continuous plating according to the present invention is a method for producing a roll with a pattern for continuous plating for producing the roll with a pattern for continuous plating, wherein the surface is a non-conductive layer. A photosensitive material is applied to the surface of the base material, and exposed and developed to form a resist pattern forming portion where a resist pattern is formed and a resist pattern non-forming portion where the non-conductive layer is exposed, A conductive coating film is formed on the surface of the resist pattern non-forming part and the resist pattern forming part, and the conductive coating film formed on the resist pattern forming part is peeled off together with the resist pattern forming part, thereby making the non-conductive A pattern forming portion in which a conductive pattern is formed and a pattern non-forming portion in which the nonconductive layer is exposed are formed on the surface of the layer.

  By doing so, the manufacturing process is simple, the manufacturing cost is low, and the use of a non-conductive material makes it possible to reduce the weight. In addition, since the conductive coating film formed on the substrate whose surface is a non-conductive layer is peeled off by so-called lift-off together with the resist pattern forming portion, the side surface of the concave portion of the pattern becomes nearly vertical, and side etching is performed. There is an advantage that the problem is solved.

  The non-conductive layer is preferably made of at least one non-conductive synthetic resin material selected from the group consisting of plastic, ABS resin, epoxy resin, FRP, and CFRP.

  The conductive pattern is preferably made of metal or conductive DLC.

The conductive pattern preferably has a volume resistivity of 1.0 × 10 ⁻³ Ω · cm to 1.0 × 10 ⁰ Ω · cm.

  The height of the pattern forming portion is preferably 0.1 μm to 20 μm, more preferably 0.1 μm to 10 μm, and still more preferably 0.1 μm to 5 μm. In the case of the second aspect of the method for producing a roll with a pattern for continuous plating of the present invention, the height of the pattern forming portion is the same as the thickness of the conductive coating film.

  In forming the conductive layer or the conductive coating film, any known method such as plating, vapor deposition, CVD, PVD (Physical Vapor Deposition), sputtering, or the like can be applied. However, for the treatment that increases the film formation temperature such as vapor deposition, CVD, PVD (Physical Vapor Deposition), sputtering, etc., the non-conductive layer is made of a non-conductive synthetic resin material having high heat resistance (for example, heat-resistant engineering plastic). It is necessary to select a material having a high melting point, such as For the etching of the conductive layer, any known method such as wet etching or dry etching can be applied, but the etching of the conductive DLC layer is preferably dry etching. In the case of dry etching, it is necessary to select a non-conductive layer having a high melting point such as a non-conductive synthetic resin material (for example, heat-resistant engineering plastic) having high heat resistance.

  Further, a fully automatic roll manufacturing system with a pattern for continuous plating, in which a plurality of processing devices for processing the processing roll are provided, and the processing roll is sequentially transferred to the processing device by a robot arm and processed. It is preferable to produce a roll with a pattern for continuous plating using

  The fully automatic roll manufacturing system with a pattern has a processing chamber A having a handling area of a first industrial robot for chucking and handling the roll to be processed, and a handling of a second industrial robot for chucking and handling the roll to be processed. A processing chamber B having an area, communicating the processing chamber A and the processing chamber B, and in a handling area of the first industrial robot in the processing chamber A, a roll stock device, a photosensitive material coating device, Processing selected from electronic engraving equipment, laser exposure equipment, degreasing equipment, grinding wheel polishing equipment, ultrasonic cleaning equipment, metal plating equipment, development equipment, corrosion equipment, resist stripping equipment, paper sanding equipment, vacuum film forming equipment, and dry etching equipment At least one of the devices is disposed, and the handling area of the second industrial robot in the processing chamber B In the processing apparatus, at least one of the processing apparatuses not disposed in the processing chamber A is disposed, and the processing apparatuses in the processing chamber A and the processing chamber B can be installed and removed. It is preferable that a roll with a pattern for continuous plating is manufactured by sequentially transferring and processing the roll to be processed to the processing apparatus by the first industrial robot and the second industrial robot.

  According to the present invention, the manufacturing process is simple, the manufacturing cost is low, and a roll with a pattern for continuous plating that can realize weight reduction and a manufacturing method thereof can be provided.

It is explanatory drawing which shows typically the 1st aspect of the manufacturing method of the roll with a pattern for continuous plating of this invention, (a) is a conductive layer on this surface of the base material by which the surface was made into the nonelectroconductive layer. FIG. 4B is a cross-sectional view of the main part in a state where the resist layer is formed. FIG. 5B is a cross-sectional view of the main part in a state where a photosensitive material is applied to the surface of the conductive layer. (D) is a principal part sectional view in the state where the conductive layer was etched, and (e) is a principal part sectional view showing the state where the resist pattern was removed to form a roll with a pattern for continuous plating. It is a flowchart which shows the process order of the manufacturing method of the roll with a pattern for continuous plating shown in FIG. It is explanatory drawing which shows typically the 2nd aspect of the manufacturing method of the roll with a pattern for continuous plating of this invention, (a) is a photosensitive material on this surface of the base material by which the surface was made into the nonelectroconductive layer. The main part sectional view of the applied state, (b) shows the main part in a state where a resist pattern forming part in which a resist pattern is formed by exposure and development and a resist pattern non-forming part in which the nonconductive layer is exposed is formed. Cross-sectional view, (c) is a cross-sectional view of the principal part in a state where a resist pattern is formed by exposure and development, and (d) is a state where a conductive coating film is formed on the surfaces of the resist pattern non-formation part and the resist pattern formation part (E) is a cross-sectional view of the main part showing a state in which the conductive coating film formed on the resist pattern forming part is peeled off together with the resist pattern forming part to form a roll with a pattern for continuous plating. It is. It is a flowchart which shows the process order of the manufacturing method of the roll with a pattern for continuous plating shown in FIG. It is a schematic plan view which shows one embodiment of the fully automatic manufacturing system of the roll with a pattern used for the manufacturing method of the roll with a pattern for continuous plating of this invention.

  Embodiments of the present invention will be described below, but these embodiments are exemplarily shown, and it goes without saying that various modifications can be made without departing from the technical idea of the present invention. In addition, the same member is represented with the same code | symbol.

  The 1st aspect of the manufacturing method of the roll with a pattern for continuous plating of this invention is demonstrated based on FIG.1 and FIG.2. In FIG. 1, the code | symbol 10A shows the roll with a pattern for continuous plating. Reference numeral 12 denotes a base material whose surface is the non-conductive layer 11, and is made of at least one non-conductive synthetic resin material selected from the group consisting of non-conductive plastic, ABS resin, epoxy resin, FRP, and CFRP. Can be used. The substrate 12 is cylindrical. In addition, since the surface should just be a nonelectroconductive layer, what formed the nonelectroconductive layer in the surface of electroconductive materials, such as a metal, may be used.

  First, the conductive layer 14 is formed on the surface of the base material 12 whose surface is the non-conductive layer 11 (FIG. 1A and step 100 in FIG. 2). In forming the conductive layer 14, in the case of a metal, any of known methods such as plating, vapor deposition, CVD, PVD (Physical Vapor Deposition), and sputtering can be applied. In the case of the conductive DLC layer, any known method such as a CVD method or a sputtering method can be applied.

  Next, the photosensitive material 16 is applied to the surface of the conductive layer 14 (step 102 in FIG. 1B and FIG. 2). The resist pattern 18 is formed by exposure and development (step 104 in FIG. 1C and FIG. 2). The photosensitive composition used as the photosensitive material can be either a negative type or a positive type. In this way, the conductive layer 14 is exposed in the portion where the resist pattern 18 is not formed.

  Next, the exposed conductive layer 14 is etched to form a conductive pattern 20 (step 106 in FIG. 1D and FIG. 2). Although any known technique such as wet etching or dry etching can be applied to the etching of the conductive layer 14, the etching of the conductive DLC layer is preferably dry etching.

  Next, the resist pattern 18 is removed, and the continuous plating pattern-attached roll 10A is formed, in which the pattern forming portion 22 where the conductive pattern 20 is formed and the pattern non-forming portion 24 where the nonconductive layer 11 is exposed are formed ( FIG. 1E and step 108 in FIG.

  A second embodiment of the method for producing a patterned roll for continuous plating according to the present invention will be described with reference to FIGS. In FIG. 3, the code | symbol 10B shows the roll with a pattern for continuous plating. Reference numeral 12 denotes a base material whose surface is the non-conductive layer 11, and is made of at least one non-conductive synthetic resin material selected from the group consisting of non-conductive plastic, ABS resin, epoxy resin, FRP, and CFRP. Can be used. The substrate 12 is cylindrical. In addition, since the surface should just be a nonelectroconductive layer, what formed the nonelectroconductive layer in the surface of electroconductive materials, such as a metal, may be used.

  First, the photosensitive material 16 is applied to the surface of the base material 12 whose surface is the nonconductive layer 11 (FIG. 3A and step 200 in FIG. 4). A resist pattern forming portion 26 where the resist pattern 18 is formed by exposure and development and a resist pattern non-forming portion 28 where the nonconductive layer 11 is exposed are formed (step 202 in FIGS. 3B and 4).

  Next, the conductive coating film 30 is formed on the surfaces of the resist pattern forming portion 26 and the resist pattern non-forming portion 28 (step 204 in FIGS. 3C and 4). Then, the conductive coating film 30 formed on the resist pattern forming portion 26 is peeled off together with the resist pattern forming portion 26 to form a conductive pattern 32 (step 206 in FIGS. 3D and 4). . In this manner, the continuous plating pattern-equipped roll 10 </ b> B in which the pattern forming portion 34 in which the conductive pattern 32 is formed and the pattern non-forming portion 36 in which the nonconductive layer 11 is exposed is formed.

  In the method for manufacturing a roll with a pattern for continuous plating according to the present invention, a plurality of processing devices for processing the roll to be processed are provided, and the processing roll is sequentially transferred to the processing device by a robot arm. It is preferable to produce a roll with a pattern for continuous plating by using a fully automatic production system for a roll with a pattern for continuous plating.

  FIG. 5 shows an embodiment of such a continuous plating pattern roll fully automatic manufacturing system used in the method for manufacturing a continuous plating pattern roll of the present invention.

  In FIG. 5, the code | symbol 40 shows the roll with a continuous plating pattern fully automatic manufacturing system.

  The fully automatic manufacturing system 40 is roughly divided into a processing chamber A and a processing chamber B. The processing chamber A is further divided into processing chambers C. The processing chamber A and the processing chamber B, and the processing chamber A and the processing chamber C are separated by walls 42 and 43, and are communicated with each other via a shutter 44 that can be opened and closed.

  The configuration of the processing chamber A will be described. In the processing chamber A, reference numeral 46 is a first industrial robot, and has a multi-axis robot arm 48 that can turn freely.

  Reference numeral 50 is a roll to be treated, and the roll to be treated 50 is the base material 12 described above. Reference numerals 52a and 52b denote roll stock apparatuses in which the turntable is a rotary type. As the roll stock apparatus, for example, a roll stock apparatus of a fully automatic gravure plate making processing system described in Patent Document 3 can be applied.

  A chuck means 92 is provided at the tip of the robot arm 48, and the processing roll 50 can be detachably chucked by the chuck means 92.

  Next, the configuration of the processing chamber B will be described. In the processing chamber B, reference numeral 60 denotes a second industrial robot, which has a multi-axis robot arm 62 that can turn freely.

  A chuck means 94 is provided at the tip of the robot arm 62, and the processing roll 50 can be detachably chucked by the chuck means 94.

  Reference numeral 54 denotes a photosensitive material coating apparatus, and reference numeral 56 denotes a laser exposure apparatus. In the illustrated example, a photosensitive material coating device 54 is provided on a laser exposure device 56. Conventionally known apparatuses can be applied to these apparatuses. For example, a photosensitive material coating apparatus and a laser exposure apparatus as disclosed in Patent Document 3 can be used.

  Reference numeral 84 is a corrosion apparatus, and reference numeral 86 is a resist stripping apparatus. In the illustrated example, a resist stripping device 86 is provided on the corrosion device 84. Conventionally known apparatuses can be applied to these apparatuses. For example, a corrosion apparatus and a resist stripping apparatus disclosed in Patent Document 3 can be used.

  Reference numerals 66 and 68 denote a vacuum film forming apparatus and a dry etching apparatus, and the vacuum film forming apparatus only needs to be able to form a conductive layer such as a metal layer or a conductive DLC layer or a conductive coating film. Any vacuum film forming apparatus for performing sputtering, CVD, plasma CVD, vacuum deposition, or the like is included. In the illustrated example, as the vacuum film forming apparatus 68, an example of a vapor phase film forming apparatus that forms a film using a raw material in a gas phase state is shown.

  The dry etching apparatus 68 only needs to be capable of dry etching a conductive layer such as a metal layer or a conductive DLC layer, and a known dry etching apparatus can be used. For example, ion milling equipment, reactive ion beam etching (RIBE) equipment, reactive ion etching (RIE) equipment, reactive ion etching (MERIE) equipment with improved magnetism, barrel type, parallel plate type, downflow type A dry etching apparatus such as a plasma etching apparatus or a chemical dry etching apparatus can be used.

  The vacuum film forming apparatus 66 and the dry etching apparatus 68 can accommodate a plurality of rolls to be processed 50 in an upright state, and can process the plurality of rolls to be processed 50 simultaneously.

  Reference numeral 70 denotes a roll relay mounting table for placing the processing roll 50 for relay, and is provided at a position where the handling area of the first industrial robot 46 and the handling area of the second industrial robot 60 overlap. ing. Reference numeral 90 denotes an ultrasonic cleaning device with a drying function for performing an ultrasonic cleaning process and a drying process on the roll 50 to be processed. The ultrasonic cleaning device 90 with a drying function comes close to the roll relay mounting table 70. Is provided.

  The ultrasonic cleaning apparatus 90 with a drying function includes a storage tank for storing cleaning water and an ultrasonic vibrator provided at a lower portion of the storage tank, and cleaning is performed by ultrasonic vibration of the ultrasonic vibrator. It is an apparatus that can perform cleaning by vibrating water. The ultrasonic cleaning device with a drying function 90 is further provided with a drying function. The ultrasonic cleaning device 90 with a drying function can perform ultrasonic cleaning and drying as necessary for each process.

  Further, the fully automatic roll manufacturing system 40 with a pattern for continuous plating is electrically controlled by a computer 58, and the first industrial robot 46 and the second industrial robot 60 are also controlled by the computer 58.

  Reference numeral 72 denotes a developing device. For example, a developing device disclosed in Patent Document 3 can be used.

  Reference numeral 57 is a degreasing apparatus, and reference numeral 59 is a metal plating apparatus. In the illustrated example, a degreasing device 57 is provided on the metal plating device 59. Conventionally known devices can be applied to these devices. For example, an electrolytic degreasing device and a copper plating device as disclosed in Patent Document 3 can be used.

  Although omitted in the illustrated example, an ultrasonic cleaning device may be provided in the handling area of the second industrial robot 60 as necessary. The ultrasonic cleaning apparatus has a storage tank for storing cleaning water and an ultrasonic vibrator provided at a lower portion of the storage tank, and vibrates the cleaning water by ultrasonic vibration of the ultrasonic vibrator. It is an apparatus that can be cleaned.

  Next, the configuration of the processing chamber C will be described. In the processing chamber C, reference numeral 51 is a paper polishing apparatus for performing paper polishing, and reference numeral 64 is a grindstone polishing apparatus. A conventionally well-known apparatus can be applied to the grindstone polishing apparatus 64. For example, a grindstone polishing apparatus as disclosed in Patent Document 3 can be used. In the illustrated example, a paper polishing device 51 is provided on a grindstone polishing device 64. As the paper polishing apparatus 51, for example, a paper polishing apparatus as disclosed in Patent Document 3 can be used.

  The processing chamber A and the processing chamber C are communicated with each other via a shutter 44, and the grindstone polishing device 64 and the paper polishing device 51 are disposed in the handling area of the first industrial robot 46.

  In the illustrated example, the processing chamber A is a clean room. The processing chamber A and the processing chamber B can each be a clean room as required.

  Doors 78 and 80 are provided on the wall 76 of the processing chamber A, and the manufactured rolls 10A and 10B with a pattern for continuous plating are taken out or a new roll to be processed (cylindrical base material) is put therein. The manufactured rolls with patterns 10A and 10B are placed on either one of the roll stock devices 52a and 52b and then carried out. On the other hand, the roll to be processed from now on is placed on the other roll stock device. A computer 58 is placed outside the processing chamber A, where various information is checked and managed, various programs are set, etc., and the fully automatic manufacturing system 40 for the patterned roll is controlled. Do.

  In the illustrated example, an example is shown in which the roll 50 to be processed is placed on the roll stock apparatus 52a, and the patterned roll 10A manufactured on the roll stock apparatus 52b is placed.

  Thus, the fully automatic manufacturing system 40 of the roll with a pattern for continuous plating used in the method for manufacturing a roll with a pattern for continuous plating according to the present invention includes the first industrial robot 46 for chucking and handling the roll 50 to be processed. A processing chamber A having a handling area and a processing chamber B having a handling area for the second industrial robot 60 for chucking and handling the roll to be processed, and communicating the processing chamber A and the processing chamber B. In the handling area of the first industrial robot 46 in the processing chamber A, roll stock devices 52a and 52b, a photosensitive material coating device 54, a laser exposure device 56, a degreasing device 57, a grindstone polishing device 64, and an ultrasonic cleaning device. 90, a paper polishing apparatus 51, and the handling of the second industrial robot in the processing chamber B. A) a degreasing device 57, a metal plating device 59, a developing device 72, a corrosion device 84, a resist stripping device 86, a vacuum film forming device 66, and a dry etching of a processing device not disposed in the processing chamber A among the processing devices. The apparatus 68 is arranged, and the processing apparatuses in the processing chamber A and the processing chamber B can be installed and removed.

  The first industrial robot 46 and the second industrial robot 60 sequentially transfer the roll 50 to the processing apparatus and process it as shown in FIGS. A roll with a pattern for continuous plating having a pattern forming portion in which a conductive pattern is formed on the surface of the substrate made into a layer and a pattern non-forming portion in which the nonconductive layer is exposed is manufactured.

  The present invention will be described more specifically with reference to the following examples. However, it is needless to say that these examples are shown by way of illustration and should not be construed in a limited manner.

Example 1
A cylindrical base material made of ABS resin having a circumference of 600 mm, a surface length of 1100 mm, and a thickness of 1 mm was prepared, and the continuous process shown in FIG. 5 was performed using NewFX (a fully automatic laser plate making system manufactured by Sink Laboratory Co., Ltd.) The processing apparatus was arrange | positioned similarly to the roll with plating pattern fully automatic manufacturing system, and the roll with a pattern mentioned below was manufactured. First, a cylindrical base material (ABS resin roll), which is a roll to be treated, was mounted on a pretreatment device, the surface of the base material was roughened, and a palladium catalyst was adsorbed to form a 1 μm nickel plating layer. Then, it mounted | worn to the copper plating tank, the hollow roll was completely immersed in the plating solution, and formed the copper plating layer of 40 micrometers at ^{2 A} / dm <2>, 6.0V. The plating surface was free of bumps and pits, and a uniform copper plating layer serving as a substrate was obtained. The surface of this copper plating layer was polished using a two-head type polishing machine (Sink Laboratory Co., Ltd. polishing machine) to make the surface of the copper plating layer a uniform polishing surface.

Next, a photosensitive film (thermal resist: TSER2104 E4 (manufactured by Sink Laboratories)) was applied to the surface of the copper plating layer formed (Fountain coater) and dried. The film thickness of the obtained photosensitive film was 4 μm as measured by a film thickness meter (F20 manufactured by FILLMETRICS, sold by Matsushita Techno Trading). The image was then developed with laser exposure. In the laser exposure, a laser stream FX was used and a predetermined pattern exposure was performed under an exposure condition of 500 mJ / cm ² . The development was performed at 24 ° C. for 90 seconds at a developer dilution ratio (stock solution 1: water 7) using a TLD developer (Sink Laboratory Co., Ltd. developer) to form a predetermined resist pattern. Next, using the formed resist pattern as an etching mask, the copper plating layer and the nickel plating layer were corroded, and the ABS resin surface was exposed where there was no resist pattern. A cupric chloride solution was used as the corrosive solution and sprayed at 35 ° C. for 100 seconds. Subsequently, using sodium hydroxide, the resist pattern was peeled off at 40 ° C. for 180 seconds at a dilution ratio of 20 g / L.

Thus, the pattern for continuous plating which has the pattern formation part in which the electroconductive pattern was formed in this surface of the base material by which the surface was made into the nonelectroconductive layer, and the pattern non-formation part which this nonelectroconductive layer exposed An attached roll was obtained. The volume resistivity of the conductive pattern was 5.0 × 10 ⁻² Ω · cm.

The obtained roll with a pattern for continuous plating is mounted in a copper plating tank, and the roll with pattern is completely immersed in a plating solution to perform continuous plating of 20 μm of copper at ^{2 A} / dm ² and 6.0 V. I confirmed that I can do it.

(Example 2)
A cylindrical base material made of ABS resin having a circumference of 600 mm, a surface length of 1100 mm, and a thickness of 1 mm was prepared, and the continuous process shown in FIG. 5 was performed using NewFX (a fully automatic laser plate making system manufactured by Sink Laboratory Co., Ltd.) The processing apparatus was arrange | positioned similarly to the roll with plating pattern fully automatic manufacturing system, and the roll with a pattern mentioned below was manufactured. First, a photosensitive film (thermal resist: TSER2104 E4 (manufactured by Sink Laboratory Co., Ltd.)) was applied (fountain coater) to the surface of a cylindrical substrate (ABS resin roll) that was a roll to be treated, and dried. The film thickness of the obtained photosensitive film was 4 μm as measured by a film thickness meter (F20 manufactured by FILLMETRICS, sold by Matsushita Techno Trading). The image was then developed with laser exposure. In the laser exposure, a laser stream FX was used and a predetermined pattern exposure was performed under an exposure condition of 500 mJ / cm ² . The development was performed at 24 ° C. for 90 seconds at a developer dilution ratio (stock solution 1: water 7) using a TLD developer (Sink Laboratory Co., Ltd. developer) to form a predetermined resist pattern. Where there was no resist pattern, the ABS resin surface was exposed.

A conductive DLC coating film was formed on the surfaces of the resist pattern forming portion and the resist pattern non-forming portion by a CVD method. The CVD conditions are as follows. A conductive DLC coating film having a thickness of 2 μm was formed on the source gas with toluene / acetylene, a film forming temperature of 100 ° C., and a film forming time of 60 minutes. The volume resistivity of the conductive DLC coating film was 5.0 × 10 ⁻² Ω · cm.

  Next, the treated roll was subjected to ultrasonic treatment in an aqueous sodium hydroxide solution for 30 minutes. Then, the conductive DLC coating film formed on the resist pattern is peeled off together with the resist pattern, and a pattern forming portion in which the conductive pattern of the conductive DLC is formed on the ABS resin surface, and the ABS resin surface A pattern-attached roll for continuous plating having a non-pattern-formed portion exposed from the surface was obtained.

The obtained roll with a pattern for continuous plating is mounted in a copper plating tank, and the roll with pattern is completely immersed in a plating solution to perform continuous plating of 20 μm of copper at ^{2 A} / dm ² and 6.0 V. I confirmed that I can do it.

(Example 3)
A roll with a pattern for continuous plating was manufactured in the same manner as in Example 1 except that a FRP cylindrical substrate having a circumference of 600 mm and a surface length of 1100 mm and a thickness of 1 mm was used, and it was confirmed that continuous plating was possible. .

Example 4
A roll with a pattern for continuous plating was manufactured in the same manner as in Example 2 except that a FRP cylindrical base material made of FRP having a circumference of 600 mm and a surface length of 1100 mm was used, and it was confirmed that continuous plating was possible. .

(Example 5)
A roll with a pattern for continuous plating was produced in the same manner as in Example 1 except that a cylindrical substrate made of glass fiber reinforced epoxy resin having a circumference of 600 mm and a surface length of 1100 mm was used. I confirmed that I can do it.

(Example 6)
A roll with a pattern for continuous plating was manufactured in the same manner as in Example 2 except that a cylindrical substrate made of glass fiber reinforced epoxy resin having a circumference of 600 mm and a surface length of 1100 mm was used. I confirmed that I can do it.

(Example 7)
A roll with a pattern for continuous plating was manufactured in the same manner as in Example 1 except that a CFRP cylindrical substrate having a circumference of 600 mm and a surface length of 1100 mm and a thickness of 1 mm was used, and it was confirmed that continuous plating was possible. .

(Example 8)
A roll with a pattern for continuous plating was manufactured in the same manner as in Example 2 except that a CFRP cylindrical substrate having a circumference of 600 mm and a surface length of 1100 mm and a thickness of 1 mm was used, and it was confirmed that continuous plating was possible. .

10A, 10B: Roll with a pattern for continuous plating of the present invention, 11: Non-conductive layer, 12: Base material, 14: Conductive layer, 16: Photosensitive material, 18: Resist pattern, 20, 32: Conductive pattern, 22, 34: Pattern forming part, 24, 36: Pattern non-forming part, 26: Resist pattern forming part, 28: Resist pattern non-forming part, 30: Conductive coating film, 40: Roll with pattern for continuous plating fully automatic Manufacturing system, 42, 43, 76: Wall, 44: Shutter, 46: First industrial robot, 48, 62: Robot arm, 50: Roll to be treated, 51: Paper polishing device, 52a, 52b: Roll stock device, 54: photosensitive material coating device, 56: laser exposure device, 57: degreasing device, 58: computer, 59: metal plating device, 60: second industrial robot, 64 Grinding wheel polishing device, 66: vacuum film forming device, 68: dry etching device, 70: roll relay mounting table, 72: developing device, 78, 80: door, 84: corrosion device, 86: resist stripping device, 90: drying function Attached ultrasonic cleaning device, 92: chuck means, 94: chuck means, A, B, C: treatment chamber.

Claims (9)

Surface and a pattern forming portion where the conductive pattern is formed on the surface of the substrates with non-conductive layers, Ri Na and a pattern-free portion of said non-conductive layer is exposed,
Wherein the conductive pattern, and wherein Rukoto to have a conductivity of metals or conductive consists DLC, and a volume resistivity of ^{1.0 × 10 -3 Ω · cm~1.0 ×} 10 0 Ω · cm Roll with pattern for continuous plating.   The pattern for continuous plating according to claim 1, wherein the non-conductive layer is made of at least one non-conductive synthetic resin material selected from the group consisting of plastic, ABS resin, epoxy resin, FRP, and CFRP. With roll. A product plated with the roll with a pattern for continuous plating according to claim 1 or 2 . It is a manufacturing method of the roll with a pattern for continuous plating for manufacturing the roll with a pattern for continuous plating of Claim 1 or 2 ,
A conductive layer was formed on the surface of the base material whose surface was a non-conductive layer, and the conductive layer was etched to expose the pattern forming portion where the conductive pattern was formed and the non-conductive layer. Ri Na to form a pattern-free portion,
Wherein the conductive pattern, and wherein Rukoto to have a conductivity of metals or conductive consists DLC, and a volume resistivity of ^{1.0 × 10 -3 Ω · cm~1.0 ×} 10 0 Ω · cm The manufacturing method of the roll with a pattern for continuous plating. It is a manufacturing method of the roll with a pattern for continuous plating for manufacturing the roll with a pattern for continuous plating of Claim 1 or 2 ,
A resist pattern forming portion where a resist pattern is formed by applying a photosensitive material to the surface of a base material whose surface is a nonconductive layer, exposing and developing, and a resist pattern non-forming portion where the nonconductive layer is exposed And forming a conductive coating film on the surfaces of the resist pattern non-formed portion and the resist pattern forming portion, and the conductive coating film formed on the resist pattern forming portion together with the resist pattern forming portion. peeling allowed, the surface of the non-conductive layer, Ri Na form a conductive pattern is formed patterned portion and the non-conductive layer is exposed pattern-free portion,
Wherein the conductive pattern, and wherein Rukoto to have a conductivity of metals or conductive consists DLC, and a volume resistivity of ^{1.0 × 10 -3 Ω · cm~1.0 ×} 10 0 Ω · cm The manufacturing method of the roll with a pattern for continuous plating. The non-conductive layer, plastic, ABS resin, epoxy resin, FRPP, continuous plating according to claim 4 or 5, wherein in that it consists of non-conductive synthetic resin material of at least one selected from the group consisting of CFRP For manufacturing a roll with a pattern. The height of the said pattern formation part is 0.1 micrometer-20 micrometers, The manufacturing method of the roll with a pattern for continuous plating of Claim 4 or 5 characterized by the above-mentioned. Using a fully automatic roll manufacturing system with a pattern for continuous plating, in which a plurality of processing devices for processing the roll to be processed are provided, and the roll to be processed is sequentially transferred to the processing device by a robot arm and processed. The method for producing a roll with a pattern according to any one of claims 4 to 7 , wherein a roll with a pattern for continuous plating is produced. The continuous plating pattern fully automatic manufacturing system for the continuous plating,
A processing chamber A having a handling area of a first industrial robot for chucking and handling the roll to be processed; and a processing chamber B having a handling area for a second industrial robot for chucking and handling the roll to be processed. And connecting the processing chamber A and the processing chamber B,
In the handling area of the first industrial robot in the processing chamber A, a roll stock device, a photosensitive material coating device, an electronic engraving device, a laser exposure device, a degreasing device, a grindstone polishing device, an ultrasonic cleaning device, a metal plating device, a development At least one processing device selected from an apparatus, a corrosion apparatus, a resist stripping apparatus, a paper polishing apparatus, a vacuum film forming apparatus, and a dry etching apparatus is disposed, and in the handling area of the second industrial robot in the processing chamber B, Arranging at least one of the processing apparatuses not disposed in the processing chamber A among the processing apparatuses,
The processing apparatuses in the processing chamber A and the processing chamber B can be installed and removed, and the rolls to be processed are sequentially transferred to the processing apparatus by the first industrial robot and the second industrial robot. By placing and processing,
The roll with a pattern for continuous plating is manufactured, The manufacturing method of the roll with a pattern for continuous plating of Claim 8 characterized by the above-mentioned.

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