JP6310705B2 - Substrate holding apparatus and film forming apparatus - Google Patents

Description

  The present invention relates to a substrate holding apparatus that holds a substrate and a mask, and a film forming apparatus including the substrate holding apparatus.

  As a technique for forming a thin film in a predetermined region of a substrate, a film forming mask is used. For example, Patent Document 1 discloses an in-line method for depositing vapor of a deposition material generated in a deposition source on a deposition surface while a processing substrate having a plate-like mask disposed on the deposition surface is conveyed in the deposition chamber. A membrane device is described.

JP 2010-118157 A

  In a method of forming a film while fixing a mask to a substrate, the substrate is typically sandwiched between a tray that supports the substrate and the mask. At this time, if the force for sandwiching the substrate is too weak, the substrate may be displaced with respect to the mask. On the other hand, if the force for sandwiching the substrates is too strong, the surface of the substrate contacting the tray or mask may be damaged.

  In view of the circumstances as described above, an object of the present invention is to provide a substrate holding device and a film forming apparatus provided with the substrate holding device that can prevent the positional displacement of the substrate with respect to the mask and the damage of the substrate.

In order to achieve the above object, a substrate holding apparatus according to an embodiment of the present invention includes a tray, a mask, a clamp mechanism, and a pad portion.
The tray has a support surface that supports the substrate.
The mask is disposed to face the support surface and covers a non-film formation region of the substrate supported by the support surface.
The clamp mechanism detachably couples the tray and the mask.
The pad portion is disposed on the tray and elastically supports the substrate supported on the support surface.

A film formation apparatus according to one embodiment of the present invention includes a film formation chamber, an evaporation source, and a transport mechanism.
The evaporation source is disposed in the film formation chamber.
The transport mechanism includes a tray, a mask, a clamp mechanism, and a pad unit, and transports the tray to a film formation position facing the evaporation source. The tray has a support surface that supports the substrate. The mask is disposed to face the support surface and covers a non-film formation region of the substrate supported by the support surface. The clamp mechanism detachably couples the tray and the mask. The pad portion is disposed on the tray and elastically supports the substrate supported on the support surface.

It is a schematic sectional side view which shows the film-forming apparatus which concerns on one Embodiment of this invention. It is a schematic diagram explaining the conveyance form of the board | substrate in the film-forming apparatus. 1 is an exploded perspective view schematically showing a configuration of a substrate holding device according to an embodiment of the present invention. It is a schematic plan view of the tray in the said board | substrate holding apparatus. It is a schematic sectional side view of the clamp unit in the said board | substrate holding apparatus. It is a schematic sectional side view explaining operation | movement of the said clamp unit. It is a schematic sectional side view explaining operation | movement of the said clamp unit. It is a schematic plan view of the pad member in the substrate holding device. It is a schematic sectional side view which shows the relationship between the recessed part provided in the said tray, and the said pad member, A has shown the state after mounting | wearing of the mask M to a tray, and B is respectively the state after mounting | wearing of the mask. .

A substrate holding device according to an embodiment of the present invention includes a tray, a mask, a clamp mechanism, and a pad portion.
The tray has a support surface that supports the substrate.
The mask is disposed to face the support surface and covers a non-film formation region of the substrate supported by the support surface.
The clamp mechanism detachably couples the tray and the mask.
The pad portion is disposed on the tray and elastically supports the substrate supported on the support surface.

  In the substrate holding apparatus, the mask is disposed to face the non-film formation region of the substrate on the support surface by being coupled to the tray via the clamp mechanism. At this time, the substrate is elastically supported by the pad portion arranged on the tray. Thus, the substrate can be stably held without causing the substrate to be displaced, and damage to the contact surface of the substrate with the tray or the mask can be prevented.

The pad portion may include a plurality of pad members arranged to face the mask.
Accordingly, the substrate can be elastically supported at a plurality of positions on the tray, so that the substrate can be stably held.

The plurality of pad members may each include a plurality of cone-shaped convex portions made of an elastic material.
Thereby, multipoint support of a board | substrate is attained in each pad member.

The tray may further include a recess provided on the support surface. A plurality of pad members are arranged in the concave portion, and the plurality of convex portions have a height that protrudes toward the mask side from the support surface in a natural state.
Thereby, the holding force of a board | substrate can be easily adjusted with the protrusion amount from the support surface of each convex part.

The clamp mechanism may include a plurality of clamp units arranged around the substrate supported by the support surface.
As a result, the in-plane uniformity of the pressing force of the mask against the substrate can be achieved.

The plurality of clamp units may include a first engagement portion and a second engagement portion. The first engaging portion is disposed on the tray. The second engagement portion is disposed on the mask and configured to be detachable from the first engagement portion.
Thereby, size reduction of a clamp unit and simplification of a structure can be achieved.

A film forming apparatus according to an embodiment of the present invention includes a film forming chamber, an evaporation source, and a transport mechanism.
The evaporation source is disposed in the film formation chamber.
The transport mechanism includes a tray, a mask, a clamp mechanism, and a pad unit, and transports the tray to a film formation position facing the evaporation source. The tray has a support surface that supports the substrate. The mask is disposed to face the support surface and covers a non-film formation region of the substrate supported by the support surface. The clamp mechanism detachably couples the tray and the mask. The pad portion is disposed on the tray and elastically supports the substrate supported on the support surface.

  According to the film forming apparatus, it is possible to prevent the substrate from being displaced relative to the mask while preventing the substrate from being damaged, and thus it is possible to realize a highly accurate film forming process.

The film forming apparatus may further include a posture changing unit. The posture conversion unit selectively switches between a first posture in which the support surface is located on the upper surface side of the tray and a second posture in which the support surface is located on the lower surface side of the tray.
Thereby, even in a film forming apparatus in which the film forming position is set above the evaporation source, it is possible to easily align the substrate and the mask.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic sectional side view showing a film forming apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram for explaining a substrate transfer mode in the film forming apparatus. In the figure, the X-axis direction and the Y-axis direction indicate horizontal directions orthogonal to each other, and the Z-axis direction indicates a vertical direction.

[Configuration of deposition system]
The film forming apparatus 100 includes a film forming chamber 10, an evaporation source 20, a transport mechanism 30, a shutter mechanism 40, and a controller 50. The film forming apparatus 100 constitutes a through film forming type vacuum deposition apparatus.

(Deposition room)
The film forming chamber 10 is connected to a vacuum pump 102 via an exhaust valve 101, and has a sealed structure in which the inside can be reduced or maintained at a predetermined vacuum pressure.

  The film forming apparatus 100 is configured as an in-line vacuum film forming apparatus including a plurality of processing chambers. The film forming chamber 10 constitutes a part of the processing chamber. The film forming chamber 10 is connected to the upstream processing chamber 11 via the gate valve G1, and is connected to the downstream processing chamber 12 via the gate valve G2.

  In the present embodiment, the processing chamber 11 is configured as a load chamber, and as shown in FIG. 2, a mask mounting portion 111 for mounting the substrate W and the mask M on the tray 32, and the substrate W and the mask M are mounted. A posture changing unit 112 that reverses the tray 32;

  The posture conversion unit 112 includes a first posture in which the support surface 32 a (FIG. 3) supporting the substrate W is located on the upper surface side of the tray 32, and a second posture in which the support surface 32 a is located on the lower surface side of the tray 32. To switch selectively. Thereby, even in the film forming apparatus in which the film forming position P0 is set above the evaporation source 20, the alignment of the substrate W and the mask M can be easily performed.

  The processing chamber 12 is configured as an unload chamber, and after reversing the tray 32 and removing the mask from the tray 32, only the substrate W is carried out of the apparatus. The processing chambers 11 and 12 are connected to a vacuum pump (not shown) and are configured so that the inside of each can be reduced or maintained at a predetermined vacuum pressure.

(Evaporation source)
The evaporation source 20 is disposed in the film forming chamber 10. The evaporation source 20 is disposed substantially at the center of the bottom of the film formation chamber 10 and generates vapor of a vapor deposition material to be vapor deposited on the substrate W that passes through the film formation position P0. The vapor of the vapor deposition material is emitted toward the substrate W on the tray 32 passing through the film forming position P0 at a predetermined solid angle centered on the axis 20T orthogonal to the transfer line 30T of the substrate W.

  The evaporation source 20 includes a container (crucible) that stores a vapor deposition material and a heating source that heats the vapor deposition material. The vapor deposition material is not particularly limited, and an inorganic material such as metal or an organic material such as resin is used. As the heating source, a resistance heating source, an induction heating source, an electron beam heating source, or the like is used. The evaporation source 20 is controlled by the controller 50.

(Shutter mechanism)
The shutter mechanism 40 has a shutter plate that opens and closes in response to a control signal from the controller 50. The shutter mechanism 40 opens the shutter plate when the substrate W reaches the film formation position P0, and causes vapor of the vapor deposition material to reach the film formation position P0 from the evaporation source 20. Further, the shutter mechanism 40 closes the shutter plate when the substrate W passes the film formation position P0, and blocks the flow of vapor from the evaporation source 20 toward the film formation position P0.

  The film forming position P0 is a predetermined position on the transfer line 30T facing the evaporation source 20. More specifically, when the shutter mechanism 40 described later is fully opened, the vapor of the vapor deposition material released from the evaporation source 20 is the substrate. A region that can reach at least a part of the W film formation surface. Therefore, the film formation position P0 is not limited to one point on the transfer line 30T, but refers to a certain area on the transfer line 30T where the substrate W (film formation area of the substrate W) can be seen from the evaporation source 20.

(controller)
The controller 50 is typically configured by a computer and is disposed outside the film forming chamber 10. The controller 50 controls the overall operation of the film forming apparatus 100 including the evaporation source 20, the transport mechanism 30, the shutter mechanism 40, the mask mounting unit 111, the attitude conversion unit 112, the gate valves G 1 and G 2, and the like.

(Transport mechanism)
The transport mechanism 30 includes a carrier 31 (substrate holding device) that can hold the substrate W. The transport mechanism 30 transports the carrier 31 at a constant speed along a predetermined transport line 30T including the film forming position P0 facing the evaporation source 20.

  The transport mechanism 30 includes a transport rail 300 that transports the carrier 31 along a linear transport line 30 </ b> T parallel to the Y-axis direction in the film forming chamber 10. Instead of the transport rail 300, other transport means such as a transport conveyor may be employed. In the present embodiment, the conveyance rail 300 continuously conveys the carrier 31 in the film formation chamber 10 toward the film formation position P0 at a constant speed in the direction of arrow A in the figure.

  The carrier 31 includes a tray 32 that supports the substrate W and a mask M that defines a film formation region of the substrate W. The carrier 31 is transported through the film forming chamber 10 in a posture (second posture) in which the substrate W is held downward. Note that a plurality of carriers 31 may be sequentially transported on the transport rail 300 to the film forming position P0 at intervals.

  The substrate W is configured by a rectangular glass substrate in the present embodiment, but is not limited thereto, and may be configured by various base materials such as a semiconductor substrate and a resin film.

(Career)
FIG. 3 is an exploded perspective view schematically showing the configuration of the carrier 31. FIG. 4 is a schematic plan view of the tray 32.

  The tray 32 is composed of a substantially rectangular metal plate. The tray 32 has a support surface 32 a that supports the substrate W. The support surface 32 a is formed on the main surface on one side of the tray 32.

  The support surface 32a may incorporate, for example, an electrostatic chuck mechanism in order to increase the adhesion with the substrate W. Or the support surface 32a may be comprised by adhesive surfaces, such as an adhesive sheet.

  The mask M is disposed to face the support surface 32a, and covers the non-film formation region of the substrate W supported by the support surface 32a. In the present embodiment, the mask M is composed of a rectangular plate-like member having a rectangular opening Ma formed in the center, covers the peripheral edge, which is a non-film-forming region of the substrate W, and passes through the opening Ma. A region of the substrate W exposed in this manner is defined as a film formation region.

  A clamp mechanism 33 and a pad portion 34 are provided at predetermined positions of the tray 32. The clamp mechanism 33 couples the mask M to the tray 32 in a separable manner. The pad portion 34 elastically supports the substrate W supported on the support surface 31a.

  The clamp mechanism 33 includes a plurality of clamp units 330 arranged around the substrate W supported by the support surface 32a. FIG. 5 is a schematic sectional side view of the clamp unit 330.

  The plurality of clamp units 330 have a common configuration, and two are provided on each of the two peripheral portions on the long side of the tray 32. The clamp unit 330 includes a first engagement member 331 and a second engagement member 332. The first engagement member 331 is disposed on the tray 32. The second engagement member 332 is disposed on the mask M and is configured to be detachable from the first engagement member 331.

  The first engaging member 331 is fixed to the lower surface of the tray 32 and has a protruding portion 331 a that protrudes toward the mask M through a through hole 32 b provided in the tray 32. The first engagement member 331 is opposed to the lower surface of the support member 333 fixed around the through hole 32 b via a plurality of spring members 334. The first engagement member 331 is accommodated in the support case 335 so as to be movable in the vertical direction (Z-axis direction), and the lower surface of the first engagement member 331 penetrates the bottom of the support case 335. The operation member 336 is in contact with the upper surface.

  The support member 333 includes a guide tube portion 333a that protrudes toward the mask M through the through hole 32b. The protruding portion 331a of the first engaging member 331 is accommodated so as to be movable in the vertical direction (Z-axis direction) inside the guide tube portion 333a. A plurality of ball members 337 are held between the outer peripheral surface of the protruding portion 331a and the guide tube portion 333a.

  The plurality of ball members 337 are accommodated in a plurality of holes that penetrate the guide tube portion 333a in the radial direction. As shown in FIG. 5, when the first engaging member 331 moves to the set position, each ball member 337 is pressed by the protruding portion 331a so as to partially protrude outside the guide tube portion 333a. On the other hand, when the first engagement member 331 moves to the release position moved upward by a predetermined distance from the set position, each ball member 337 retreats in an annular groove 331b that is recessed around the protrusion 331a. By doing so, it is comprised so that it can embed in the inside of the guide cylinder part 333a.

  The second engagement member 332 is fixed to the lower surface of the mask M. The second engagement member 332 is configured by an annular member that can be accommodated in the through hole 32 b of the tray 32. The second engagement member 332 has a claw portion 332 a that can be engaged with the first engagement member 331 via a plurality of ball members 337 on the inner peripheral portion thereof. The claw portion 332a may be formed over the entire inner peripheral surface of the second engagement member 332, or may be formed at a plurality of locations on the inner peripheral surface.

  6A and 6B and FIGS. 7A and 7B are schematic side sectional views for explaining the operation of the clamp unit 330. FIG. That is, FIG. 6A shows a state where the mask M is separated from the tray 32, and FIG. 6B shows a state where the first engagement member 331 is moved from the set position to the release position. 7A shows a state when the mask M is assembled to the tray 32, and FIG. 7B shows a state where the mask M is coupled to the tray.

  The movement of the first engagement member 331 between the set position and the release position is operated by the operation member 336. In the present embodiment, the operation member 336 is operated by a pusher (not shown).

  As will be described later, the second engagement member 332 is attachable to and detachable from the first engagement member 331 when the first engagement member 331 moves to the release position. When the combined member 331 moves to the set position, the engaged state with the first engaging member 331 is maintained.

  Next, the pad portion 34 will be described.

  The pad portion 34 includes a plurality of pad members 340 arranged to face the mask M. The plurality of pad members 340 have a common configuration, and are respectively arranged at positions facing the peripheral portions of the four sides of the substrate W placed on the support surface 32a.

  FIG. 8 is a schematic plan view of the pad member 340. The plurality of pad members 340 include a substantially rectangular plate portion 341 and a plurality of cone-shaped convex portions 342 made of an elastic material. The plurality of convex portions 342 are formed at the same height, and are arranged in a matrix on the surface of the plate portion 341.

  The shape of each of the plurality of convex portions 342 is not particularly limited, and in the present embodiment, it is formed in a cone shape such as a cone or a truncated cone. Accordingly, each convex portion 342 is easily compressed and deformed in the height direction, and good adhesion to the substrate W can be secured without applying excessive stress to the substrate W. Preferably, the tip of the convex portion 342 is formed with a curved surface such as a spherical surface. Thereby, a contact area with the board | substrate W reduces and generation | occurrence | production of the press trace to the board | substrate W can be suppressed.

  The plurality of convex portions 342 are made of an elastic material. As the elastic material constituting the convex portion 342, for example, a synthetic resin material having elasticity such as an elastomer is used, and in this embodiment, an elastic material such as a fluorine-based rubber that emits less gas in vacuum is used. Not only the convex part 342 but also the plate part 341 may be made of the same elastic material.

  The tray 32 further includes a recess 32c provided on the support surface 32a. A plurality of recesses 32c are formed in the arrangement region of the plurality of pad members 340, and the plurality of pad members 340 are respectively arranged at the bottom of the recesses 32c. The recess 32c is formed independently for each side of the tray 32, but may be formed continuously with each other. Or the recessed part 32c formed for every edge | side may be divided | segmented into plurality and formed, respectively.

  9A and 9B are schematic side sectional views showing the relationship between the recess 32c and the pad member 340. A is a state before the mask M is mounted on the tray 32, and B is a state after the mask M is mounted on the tray 32. Each is shown.

  As shown in FIG. 9A, the recess 32c is formed with a depth dimension smaller than the total height of the pad member 340. The plurality of protrusions 342 of the pad member 340 have a height that protrudes toward the mask M from the support surface 32a of the tray 32 in a natural state. Before the mask M is mounted, the substrate W is supported by the tip portions of the plurality of convex portions 342 on the support surface 32a.

  9B, when the mask M is mounted on the tray 32, the plurality of convex portions 342 are sandwiched between the mask M (substrate W) and the tray 32, and the back surface of the substrate W is supported on the support surface 32a. It is crushed to a height that touches or is close to. Accordingly, the substrate W is elastically supported by the plurality of convex portions 342 on the support surface 32a.

  The amount of protrusion H of the plurality of convex portions 342 from the support surface 32a is not particularly limited, and can be appropriately set according to the magnitude of the elastic force when supporting the substrate W. In the present embodiment, the value of H is set to about 2 mm. Each clamp unit 330 constituting the clamp mechanism 33 moves the mask M to the tray so that the peripheral edge of the substrate W supported by the pad member 340 is pressed toward the bottom of the recess 32c by an amount corresponding to the height H. 32 to be coupled.

[Operation of deposition system]
Subsequently, a typical operation of the film forming apparatus 100 will be described.

  The film forming chamber 10 is evacuated to a predetermined film forming pressure. The processing chamber 11 is opened to atmospheric pressure, and the processing chamber 11 stands by inside the processing chamber 11 with the tray 32 and the mask M separated from each other. At this time, the tray 32 is maintained in the first posture with the support surface 32a facing upward.

  The substrate W is carried into the processing chamber 11 from the outside of the film forming apparatus 100 in a lying posture with its film forming surface facing upward. The substrate W is positioned with respect to the tray 32 in the mask mounting portion 111 and then placed on the support surface 32a. At this time, the board | substrate W is supported by the front-end | tip of the some convex part 342 which comprises the pad part 34 (FIG. 4, FIG. 9A). Thereafter, the mask M is coupled to the tray 32 via the clamp mechanism 33 (FIG. 9B).

  In the mounting process of the mask M, first, as shown in FIG. 6A, first and second engaging members 331 and 332 constituting each clamp unit 330 are arranged to face each other. In this state, the first engagement member 331 and the operation member 336 are biased to the set position (downward position) by the plurality of spring members 334. For this reason, the plurality of ball members 337 protrude outward from the peripheral surface of the guide tube portion 333 a of the support member 333.

  Then, as shown in FIG. 6B, the operating member 336 is pushed upward by a pusher (not shown), so that the first engaging member 331 moves from the set position to the release position. Accordingly, the plurality of ball members 337 are accommodated in the groove portion 331b of the protruding portion 331a of the first engaging member 331, and are buried in the guide tube portion 333a.

  Subsequently, as shown in FIG. 7A, in a state where the first engagement member 331 is pushed up to the release position, the mask M is lowered toward the tray 32 to support the claw portion 332a of the second engagement member 332. The member 333 is brought into contact with the upper surface.

  Thereafter, as shown in FIG. 7B, the push-up operation of the operation member 336 by the pusher is released. Then, the first engaging member 331 is moved from the release position to the set position by the spring force of the plurality of spring members 334, and the plurality of ball members 337 are pressed against the peripheral surface of the protruding portion 331a, and the guide cylinder portion 333a is moved outside. Engage with the claw portion 332a located in the direction. As a result, the first engagement member 331 and the second engagement member 332 are engaged with each other via the plurality of ball members 337, and the mask M is coupled to the tray 32.

  As described above, when the substrate W is sandwiched between the tray 32 and the mask M, the carrier 31 that holds the substrate W is configured. At this time, the peripheral edge portion of the substrate W is elastically supported by the pad portion 34 disposed on the tray 32. Thereby, the substrate W can be stably held without causing the positional displacement of the substrate W, and damage to the contact surface of the substrate W with the tray 32 or the mask M can be prevented.

  The carrier 31 is converted from the first posture to the second posture by the posture changing unit 112, and the substrate W and the mask M are arranged on the lower surface side of the tray 32. The attitude conversion method of the carrier 31 is not particularly limited. Typically, the carrier 31 is converted from the first attitude to the second attitude by inverting the carrier 31 around the X axis or the Y axis. Even during this posture change, the stress that acts on the substrate W is relieved by the elastic support structure of the pad member 340, so that the substrate W can be effectively protected.

  On the other hand, the processing chamber 11 is evacuated to a vacuum atmosphere having substantially the same pressure as the film forming chamber 10. Thereafter, the carrier 31 is transferred from the processing chamber 11 to the film forming chamber 10 through the gate valve G1. In the film forming chamber 10, the carrier 31 is transferred to the transport rail 300 and transported along the transport line 30T.

  When the carrier 31 reaches the film formation position P0, the shutter mechanism 40 is opened, and vapor of the vapor deposition material from the evaporation source 20 is thereby deposited on the film formation surface of the substrate W. Since the film forming apparatus 100 of the present embodiment is configured by a passing film forming method, the film forming process on the substrate W is executed while moving the film forming position P0 at a constant speed. When the substrate W passes through the film forming position P0, the shutter mechanism 40 is closed, thereby blocking the vapor path between the evaporation source 20 and the film forming position P0.

  The carrier 31 holding the film-formed substrate W is carried out to the processing chamber 12 via the gate valve G2. The processing chamber 12 is evacuated to a pressure equivalent to that of the film forming chamber 10 in advance, and the carrier 31 is transferred to the processing chamber 12 and the gate valve G2 is closed, and then opened to the atmosphere.

  After the carrier 31 transferred to the processing chamber 12 is converted from the second position to the first position, the mask M is separated from the tray 32, and only the substrate W is transferred from the tray 32 to the outside of the film forming apparatus 100. It is carried out. The separation process of the mask M from the tray 32 is performed in the reverse order to the mask mounting process. That is, the operation member 336 is moved upward by a pusher (not shown) to move the first engagement member 331 from the set position to the release position, and the ball member 337 and the second engagement member 332 (claw portion 332a) are moved. Release the shape state. As a result, the mask M can be easily separated from the tray 32.

  By repeatedly executing the above operation, the film forming process is sequentially performed on the substrate W on the carrier 31.

  According to the present embodiment, since the carrier 31 is configured to elastically support the substrate W by the plurality of pad members 340, it is possible to prevent the substrate from being displaced relative to the mask while preventing the substrate from being damaged. Therefore, a highly accurate film forming process can be realized.

  In addition, according to the present embodiment, since the pad portion 34 is configured by the plurality of pad members 340, the substrate W can be elastically supported at a plurality of positions on the tray 32. Can be kept stable.

  In addition, since each pad member 340 has a plurality of protrusions 342, it is possible to support the substrate W at multiple points, thereby reducing the stress applied to the substrate W and obtaining a stable adhesion with the substrate W. it can.

  Further, since the plurality of pad members 340 are arranged in the concave portions 32c provided on the support surface 32a, and each convex portion 342 has a height that protrudes toward the mask M from the support surface 32a, the substrate W It is possible to easily adjust the holding force or the adhesion force.

  Furthermore, according to the present embodiment, since the clamp mechanism 33 that couples the mask M and the tray 32 is configured by the plurality of clamp units 330 arranged around the substrate W, the pressing force of the mask M on the substrate W can be reduced. In-plane uniformity can be achieved.

  Further, in the present embodiment, the tray 32 and the mask M are operated by the engagement operation or the disengagement operation of the first engagement member 331 installed on the tray 32 and the second engagement member 332 installed on the mask M. And are configured to be separable. Thereby, size reduction of the clamp unit 330 and simplification of a structure can be achieved.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, in the above embodiment, the film forming apparatus 100 using the pass film forming method has been described as an example. However, instead of this, the film forming apparatus using the fixed film forming method in which the substrate is fixed at the film forming position may be used. The invention is applicable.

  Moreover, in the above embodiment, although the pad part 34 was comprised with the some pad member 340, you may comprise with these single pad members which these several pad members continued.

  Further, in the above embodiment, the plurality of pad members 340 constituting the pad portion 34 are arranged in the concave portion 32c of the tray 32. Alternatively, these pad members may be arranged on the same plane as the support surface 32a. Good. As a result, the substrate can be held between the plurality of pad members and the mask. In this case, the plurality of pad members may be disposed not only at the peripheral edge portion of the substrate but also at the in-plane central portion.

DESCRIPTION OF SYMBOLS 10 ... Film-forming chambers 11, 12 ... Processing chamber 20 ... Evaporation source 30 ... Conveyance mechanism 31 ... Carrier 32 ... Tray 32a ... Support surface 32c ... Recess 33 ... Clamp mechanism 34 ... Pad part 40 ... Shutter mechanism 50 ... Controller 100 ... Formation Membrane apparatus 111 ... Mask mounting part 112 ... Posture changing part 330 ... Clamp unit 331 ... First engagement member 332 ... Second engagement member 340 ... Pad member 342 ... Convex part P0 ... Film formation position M ... Mask W ... substrate

Claims (6)

A tray having a support surface for supporting the substrate;
A mask that is disposed to face the support surface and covers a non-film formation region of the substrate supported by the support surface;
A clamp mechanism for detachably coupling the tray and the mask;
A pad portion that is disposed on the tray and elastically supports the substrate supported on the support surface ;
The clamp mechanism includes a plurality of clamp units disposed around the substrate supported by the support surface,
The plurality of clamp units are:
A first engagement member disposed on the tray;
A second engagement member disposed on the mask and configured to be detachable from the first engagement member;
A set position for holding the engagement state between the first engagement member and the second engagement member, and a release for releasing the engagement state, which are disposed on a surface opposite to the support surface of the tray. An operation member configured to be able to move the first engagement member between positions;
Each of the substrate holding devices. The substrate holding apparatus according to claim 1,
The pad unit includes a plurality of pad members arranged to face the mask. The substrate holding apparatus according to claim 2,
The plurality of pad members each have a plurality of cone-shaped convex portions made of an elastic material. The substrate holding apparatus according to claim 3,
The tray further includes a concave portion in which a plurality of pad members are arranged and provided on the support surface,
The plurality of protrusions have a height that protrudes toward the mask side with respect to the support surface in a natural state. A deposition chamber;
An evaporation source disposed in the film forming chamber;
Separating the tray having the support surface for supporting the substrate, the mask that is disposed opposite to the support surface and that covers the non-deposition region of the substrate supported by the support surface, and the tray and the mask. A transport mechanism for transporting the tray to a film forming position facing the evaporation source, and a clamp mechanism for coupling, and a pad portion elastically supporting the substrate disposed on the tray and supported by the support surface; equipped with,
The clamp mechanism includes a plurality of clamp units disposed around the substrate supported by the support surface,
The plurality of clamp units are:
A first engagement member disposed on the tray;
A second engagement member disposed on the mask and configured to be detachable from the first engagement member;
A set position for holding the engagement state between the first engagement member and the second engagement member, and a release for releasing the engagement state, which are disposed on a surface opposite to the support surface of the tray. An operation member configured to be able to move the first engagement member between positions;
Each of the film forming apparatuses. The film forming apparatus according to claim 5 ,
A film forming apparatus further comprising a posture conversion unit that selectively switches between a first posture in which the support surface is located on the upper surface side of the tray and a second posture in which the support surface is located on the lower surface side of the tray. .

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