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JP6316652B2 - Grinding equipment - Google Patents
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JP6316652B2 - Grinding equipment - Google Patents

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JP6316652B2
JP6316652B2 JP2014100371A JP2014100371A JP6316652B2 JP 6316652 B2 JP6316652 B2 JP 6316652B2 JP 2014100371 A JP2014100371 A JP 2014100371A JP 2014100371 A JP2014100371 A JP 2014100371A JP 6316652 B2 JP6316652 B2 JP 6316652B2
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grinding
workpiece
grinding wheel
holding table
fluid supply
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JP2015217443A (en
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ウィリアム ガド マイケル
ウィリアム ガド マイケル
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Disco Corp
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Disco Corp
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Priority to JP2014100371A priority Critical patent/JP6316652B2/en
Priority to TW104111613A priority patent/TW201600226A/en
Priority to KR1020150060181A priority patent/KR102165796B1/en
Priority to CN201510244033.5A priority patent/CN105081980B/en
Publication of JP2015217443A publication Critical patent/JP2015217443A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Description

本発明は、被加工物に対して研削を行う研削装置に関する。   The present invention relates to a grinding apparatus for grinding a workpiece.

被加工物を研削する研削装置は、被加工物を保持する保持テーブルと、研削砥石が環状に固着された研削ホイールを有する研削手段と、被加工物と研削砥石とに研削液を供給する研削液供給手段とを少なくとも備えており、研削液供給手段によって被加工物の上面に研削液を供給しながら研削砥石で被加工物の上面を押圧して被加工物を研削している。このような研削装置では、研削液供給手段によって被加工物の上面と研削砥石との間に研削液を供給しながら研削を行うため、研削砥石で被加工物を研削する際に発生する研削屑を除去することができる。また、研削液を被加工物の上面と研削砥石の研削面とが当接する加工領域に供給することで研削に伴う発熱を冷却して面焼けの発生を防止するとともに、被加工物の被研削面が粗く仕上がってしまうことも防止することができる。   A grinding apparatus for grinding a workpiece includes a holding table for holding the workpiece, a grinding means having a grinding wheel to which a grinding wheel is fixed in an annular shape, and grinding for supplying a grinding liquid to the workpiece and the grinding wheel. And at least a liquid supply means. While the grinding liquid is supplied to the upper surface of the workpiece by the grinding liquid supply means, the upper surface of the workpiece is pressed with a grinding wheel to grind the workpiece. In such a grinding apparatus, since grinding is performed while supplying the grinding liquid between the upper surface of the workpiece and the grinding wheel by the grinding liquid supply means, grinding dust generated when the workpiece is ground with the grinding wheel. Can be removed. In addition, the grinding fluid is supplied to the processing area where the upper surface of the workpiece and the grinding surface of the grinding wheel come into contact with each other, so that the heat generated by the grinding is cooled to prevent the occurrence of surface burn and the workpiece to be ground. It is also possible to prevent the surface from being rough and finished.

研削液供給手段としては、研削ホイールの外側に配設されたノズルを有し、該ノズルから研削砥石と被加工物とに研削液を供給するタイプのものがある(例えば下記の特許文献1を参照)。また、研削ホイールの内部に形成された研削液供給路を介して研削砥石と被加工物とに研削液を供給するタイプのものもある(例えば下記の特許文献2を参照)。   As the grinding liquid supply means, there is a type that has a nozzle disposed outside the grinding wheel and supplies the grinding liquid from the nozzle to the grinding wheel and the workpiece (for example, Patent Document 1 below). reference). There is also a type that supplies a grinding fluid to a grinding wheel and a workpiece through a grinding fluid supply path formed inside the grinding wheel (see, for example, Patent Document 2 below).

特開平07−223152号公報Japanese Patent Laid-Open No. 07-223152 実開平07−031268号公報Japanese Utility Model Publication No. 07-031268

しかし、上記したような研削装置において被加工物を研削する際には、研削砥石の周囲に研削砥石の回転によって空気の層が形成されており、研削液が研削砥石に到達しにくいという問題があり、また、回転する研削砥石に衝突した研削液が周囲に飛散してしまって上記加工領域に効率よく研削液が供給されない上、研削液に含まれる切削屑が被加工物上に飛散し付着してしまうという問題もある。   However, when the workpiece is ground in the grinding apparatus as described above, an air layer is formed around the grinding wheel by the rotation of the grinding wheel, so that the grinding liquid is difficult to reach the grinding wheel. In addition, the grinding fluid that collides with the rotating grinding wheel scatters to the surrounding area, so that the grinding fluid is not efficiently supplied to the processing area, and the cutting waste contained in the grinding fluid scatters and adheres to the workpiece. There is also the problem of doing.

本発明は、上記の事情にかんがみてなされたものであり、研削装置において、従来に比べて効果的に加工領域に研削液を供給できるようにすることを目的としている。   The present invention has been made in view of the above circumstances, and an object of the present invention is to enable a grinding apparatus to supply a grinding liquid to a processing region more effectively than in the past.

本発明は、被加工物を保持し所定の方向に回転可能な保持テーブルと、該保持テーブルで保持された被加工物を研削する研削砥石を含む研削ホイールを有した研削手段と、被加工物と該研削砥石とに研削液を供給する研削液供給手段と、を備えた研削装置であって、該研削ホイールは、基台の自由端に複数の研削砥石が互いに所定の間隔を有して環状に配設されて構成され、該研削液供給手段は、被加工物に対して該研削砥石が作用する加工領域より該保持テーブルの回転方向後方側から被加工物の上面に向けて研削液を供給する研削液供給口と、該研削液供給口と該加工領域の該研削砥石との間で被加工物の上面側に所定の間隔を有し、該研削液供給口から被加工物の上面に供給された研削液が該保持テーブルの回転に伴って該加工領域の該研削砥石に向かって流動する研削液供給層を形成する上壁部と、該加工領域より該保持テーブルの回転方向前方側に配設され、該研削液供給口から被加工物の上面に供給され該加工領域に到達した後に該研削砥石の外側に排出された研削液を吸引する吸引口を有する吸引部と、を備える。 The present invention relates to a holding table that holds a workpiece and is rotatable in a predetermined direction, a grinding means having a grinding wheel including a grinding wheel for grinding the workpiece held by the holding table, and the workpiece And a grinding fluid supply means for supplying a grinding fluid to the grinding wheel , wherein the grinding wheel has a plurality of grinding wheels at a predetermined interval at a free end of a base. The grinding fluid supply means is configured to be arranged in an annular shape, and the grinding fluid supply means has a grinding fluid from a processing region where the grinding wheel acts on the workpiece toward the upper surface of the workpiece from the rear side in the rotation direction of the holding table. A predetermined gap on the upper surface side of the workpiece between the grinding fluid supply port and the grinding wheel in the machining area, and the workpiece from the grinding fluid supply port Grinding fluid supplied to the upper surface moves along the processing area as the holding table rotates. An upper wall portion forming the grinding fluid supply layer which flows toward the grinding wheel, is arranged in the rotation direction front side of the holding table from the processing region, supplied to the upper surface of the workpiece from the grinding fluid supply inlet A suction part having a suction port for sucking the grinding liquid discharged to the outside of the grinding wheel after reaching the processing region .

本発明の研削装置に備える研削液供給手段は、被加工物に対して研削砥石が作用する加工領域より該保持テーブルの回転方向後方側で被加工物の上面に向けて研削液を供給する研削液供給口と、研削液供給口と加工領域の研削砥石との間で被加工物の上面側に所定の間隔を有する上壁部とを備えているため、被加工物の研削中は、被加工物の上面に供給された研削液が保持テーブルの回転に伴って上壁部と被加工物の上面との間を流れていき、加工領域の研削砥石の周辺において流動する研削液供給層を形成する。これにより、回転する研削砥石の周囲に発生する空気の層を研削液供給層が遮断するため、研削液の流れが空気の層によって阻まれることがなく、加工領域に十分に研削液を到達させることができる。
また、研削液供給手段では、研削液供給口から被加工物の上面に向けて研削液を供給することから、研削砥石の側壁に研削液が衝突して周囲に飛散するおそれも低減する。よって、従来に比べて使用する研削液の使用量を抑えるとともに、研削液を効果的に加工領域に供給することができる。更に、研削屑を含んだ研削液が飛散し被加工物上に研削屑が付着することも防止できる。
The grinding fluid supply means provided in the grinding apparatus of the present invention is a grinding for supplying the grinding fluid toward the upper surface of the workpiece on the rear side in the rotation direction of the holding table from the machining area where the grinding wheel acts on the workpiece. Since there is a liquid supply port and an upper wall portion having a predetermined interval on the upper surface side of the workpiece between the grinding liquid supply port and the grinding wheel in the machining area, the workpiece is ground during grinding. The grinding fluid supplied to the upper surface of the workpiece flows between the upper wall and the upper surface of the workpiece as the holding table rotates, and a grinding fluid supply layer that flows around the grinding wheel in the machining area is provided. Form. As a result, the grinding fluid supply layer blocks the air layer generated around the rotating grinding wheel, so that the grinding fluid flow is not obstructed by the air layer, and the grinding fluid sufficiently reaches the machining area. be able to.
Further, since the grinding fluid supply means supplies the grinding fluid from the grinding fluid supply port toward the upper surface of the workpiece, the possibility that the grinding fluid collides with the side wall of the grinding wheel and is scattered around is reduced. Therefore, it is possible to suppress the amount of the grinding fluid used compared to the prior art and to effectively supply the grinding fluid to the processing region. Furthermore, it is possible to prevent the grinding liquid containing the grinding scraps from scattering and the grinding scraps from adhering to the workpiece.

研削装置の一例を示す斜視図である。It is a perspective view which shows an example of a grinding device. 研削液供給手段の構成を示す斜視図である。It is a perspective view which shows the structure of a grinding fluid supply means. 研削ホイールと保持テーブルとの間に配置された研削液供給手段の構成を示す断面図である。It is sectional drawing which shows the structure of the grinding fluid supply means arrange | positioned between the grinding wheel and the holding table. 研削液を被加工物と研削砥石とに供給しつつ被加工物を研削する状態を示す断面図である。It is sectional drawing which shows the state which grinds a workpiece, supplying a grinding fluid to a workpiece and a grinding wheel. 研削液供給口から加工領域に研削液を供給する状態の説明図である。It is explanatory drawing of the state which supplies a grinding fluid to a process area | region from a grinding fluid supply port. 研削液供給口の変形例から加工領域に研削液を供給する状態の説明図である。It is explanatory drawing of the state which supplies a grinding fluid to a process area | region from the modification of a grinding fluid supply port. 研削砥石が磨耗した状態で研削液を被加工物と研削砥石とに供給しつつ被加工物を研削する状態を示す断面図である。It is sectional drawing which shows the state which grinds a to-be-processed object, supplying a grinding fluid to a to-be-processed object and a grinding wheel in the state in which the grinding wheel was worn out.

図1に示す研削装置1は、被加工物を研削加工する研削装置の一例であり、Y軸方向にのびる装置ベース2を有している。装置ベース2の上面2aには、研削前の被加工物を収容するカセット4a及び研削後の被加工物を収容するカセット4bが配設されている。カセット4aとカセット4bとの間には、研削前の被加工物をカセット4aから搬出するとともに研削後の被加工物をカセット4bへ搬入する搬送手段5が配設されている。搬送手段5の可動領域には、被加工物が仮置きされる仮置き手段6と、研削後の被加工物を洗浄する洗浄手段7とが配設されている。   A grinding device 1 shown in FIG. 1 is an example of a grinding device that grinds a workpiece, and has a device base 2 that extends in the Y-axis direction. On the upper surface 2a of the apparatus base 2, a cassette 4a for accommodating a workpiece before grinding and a cassette 4b for accommodating a workpiece after grinding are disposed. Between the cassette 4a and the cassette 4b, there is disposed a conveying means 5 for carrying out the workpiece before grinding from the cassette 4a and carrying the workpiece after grinding into the cassette 4b. Temporary placing means 6 for temporarily placing the workpiece and cleaning means 7 for washing the workpiece after grinding are disposed in the movable region of the conveying means 5.

装置ベース2には、被加工物を保持し回転可能な保持テーブル10が配設されている。保持テーブル10の周囲は、保持テーブルカバー11によってカバーされており、Y軸方向にのびる蛇腹9の伸縮をともなって保持テーブルカバー11とともに保持テーブル10がY軸方向に往復移動可能となっている。仮置き手段6の近傍には、研削前の被加工物を仮置き手段6から保持テーブル10に搬送する第1の搬送手段8aが配設されている。また、第1の搬送手段8aに隣接して研削後の被加工物を保持テーブル10から洗浄手段7に搬送する第2の搬送手段8bが配設されている。   The apparatus base 2 is provided with a holding table 10 that holds and rotates a workpiece. The periphery of the holding table 10 is covered by a holding table cover 11, and the holding table 10 can reciprocate in the Y-axis direction together with the holding table cover 11 with the expansion and contraction of the bellows 9 extending in the Y-axis direction. In the vicinity of the temporary placement means 6, a first transport means 8 a for transporting the workpiece before grinding from the temporary placement means 6 to the holding table 10 is disposed. In addition, a second transport unit 8b is disposed adjacent to the first transport unit 8a to transport the workpiece after grinding from the holding table 10 to the cleaning unit 7.

装置ベース2のY軸方向後部には、Z軸方向にのびるコラム3が立設されており、コラム3の側方において昇降手段30を介して被加工物に対して研削を行う研削手段20が配設されている。研削手段20は、Z軸方向の軸心を有するスピンドル21(図2(a)において図示する)と、スピンドル21を回転可能に囲繞するスピンドルハウジング22と、スピンドルハウジング22を支持する支持部27と、スピンドル21の一端に接続されたモータ23と、スピンドル21の下端においてマウント24を介して装着された研削ホイール25と、研削ホイール25の自由端(下部)において互いに所定の間隔を有して環状に固着された複数の研削砥石26とを備えている。研削手段20は、モータ23による駆動により研削ホイール25を所定の回転速度で回転させることができる。   A column 3 extending in the Z-axis direction is erected on the rear side of the apparatus base 2 in the Y-axis direction, and a grinding means 20 for grinding the workpiece on the side of the column 3 via the elevating means 30 is provided. It is arranged. The grinding means 20 includes a spindle 21 (shown in FIG. 2A) having an axis in the Z-axis direction, a spindle housing 22 that rotatably surrounds the spindle 21, and a support portion 27 that supports the spindle housing 22. The motor 23 connected to one end of the spindle 21, the grinding wheel 25 mounted via the mount 24 at the lower end of the spindle 21, and the free end (lower part) of the grinding wheel 25 having a predetermined interval with each other And a plurality of grinding wheels 26 fixed to each other. The grinding means 20 can rotate the grinding wheel 25 at a predetermined rotational speed by being driven by the motor 23.

昇降手段30は、Z軸方向にのびるボールネジ31と、ボールネジ31の一端に接続されたモータ32と、ボールネジ31と平行にのびる一対のガイドレール33と、一方の面がスピンドルハウジング22を支持する支持部27に連結された昇降板34とを備えている。昇降板34の他方の面には一対のガイドレール33が摺接し、昇降板34の中央部に形成されたナットにはボールネジ31が螺合している。そして、モータ32によって駆動されてボールネジ31が回動すると、一対のガイドレール33に沿って昇降板32をZ軸方向に昇降させて研削手段20をZ軸方向に昇降させることができる。   The elevating means 30 includes a ball screw 31 extending in the Z-axis direction, a motor 32 connected to one end of the ball screw 31, a pair of guide rails 33 extending in parallel with the ball screw 31, and one surface supporting the spindle housing 22. And an elevating plate 34 connected to the portion 27. A pair of guide rails 33 are in sliding contact with the other surface of the elevating plate 34, and a ball screw 31 is screwed into a nut formed at the center of the elevating plate 34. When the ball screw 31 is rotated by being driven by the motor 32, the lifting plate 32 can be moved up and down in the Z-axis direction along the pair of guide rails 33, and the grinding means 20 can be moved up and down in the Z-axis direction.

図1に示すように、研削装置1は、研削手段20と保持テーブル10との間において、保持テーブル10が保持する被加工物と研削手段20の研削砥石26とに研削液を供給する研削液供給手段40を備えている。研削液供給手段40は、図2(a)に示すように、ほぼ円板状に形成されたプレート部41と、両端が保持テーブル10の外周側から下方に折り曲げられたカバー部45とを備えている。カバー部45は、基台2aなどに固設され移動しない構成となっているが、保持テーブルカバー11に配設されていてもよい。   As shown in FIG. 1, the grinding apparatus 1 is a grinding liquid that supplies a grinding liquid between a grinding means 20 and a holding table 10 to a workpiece held by the holding table 10 and a grinding wheel 26 of the grinding means 20. Supply means 40 is provided. As shown in FIG. 2A, the grinding fluid supply means 40 includes a plate portion 41 formed in a substantially disc shape, and a cover portion 45 whose both ends are bent downward from the outer peripheral side of the holding table 10. ing. The cover 45 is fixed to the base 2 a and the like and does not move, but may be disposed on the holding table cover 11.

図2(b)に示すように、プレート部41の外周部410とカバー部45の内周壁450との間には、リング状の開口部411が形成されている。図1に示した研削手段20がZ軸方向に下降することにより、研削ホイール25の自由端に固着された研削砥石26が、図2(c)に示すように開口部411に挿通される構成となっている。開口部411は、環状に配設された研削砥石26のうち、少なくとも保持テーブル10に保持された被加工物に接触して加工を行う部分が下方に突出するように形成されている。したがって、図3に示すように、開口部411は、研削砥石26が被加工物Wの上面Waを押圧して研削作用を発揮する領域である加工領域Pにおいて上下に貫通している。一方、研削ホイール25の回転中心をはさんで加工領域Pの反対側においては、研削砥石26をプレート部41に接触させないための円弧状の逃げ溝412が形成されている。逃げ溝412の溝底413と研削砥石26の研削面260との間には所定の間隔が形成されている。また、プレート部41とカバー部45とは、一体的に形成されていてもよいし、別体に形成されていてもよい。なお、図2(c)においては、カバー部45の下部を切り出して示しているが、カバー部45は、図1及び図3に示したように、下方に伸長している構造となっている。   As shown in FIG. 2B, a ring-shaped opening 411 is formed between the outer peripheral portion 410 of the plate portion 41 and the inner peripheral wall 450 of the cover portion 45. A configuration in which the grinding wheel 26 fixed to the free end of the grinding wheel 25 is inserted into the opening 411 as shown in FIG. 2C by lowering the grinding means 20 shown in FIG. 1 in the Z-axis direction. It has become. The opening 411 is formed such that, of the grinding wheel 26 arranged in an annular shape, at least a portion to be processed in contact with the workpiece held on the holding table 10 protrudes downward. Therefore, as shown in FIG. 3, the opening 411 penetrates vertically in the processing region P, which is a region where the grinding wheel 26 exerts a grinding action by pressing the upper surface Wa of the workpiece W. On the other hand, on the opposite side of the processing region P across the rotation center of the grinding wheel 25, an arc-shaped escape groove 412 is formed to prevent the grinding wheel 26 from contacting the plate portion 41. A predetermined gap is formed between the groove bottom 413 of the escape groove 412 and the grinding surface 260 of the grinding wheel 26. Moreover, the plate part 41 and the cover part 45 may be formed integrally, and may be formed separately. In addition, in FIG.2 (c), although the lower part of the cover part 45 is cut out and shown, the cover part 45 has the structure extended below, as shown in FIG.1 and FIG.3. .

研削液供給手段40は、図3に示すように、プレート部41に形成され保持テーブル10に保持された被加工物Wの上面Wa側との間に空間440を形成する上壁部44とを備えている。上壁部44は、プレート部41の下面である。   As shown in FIG. 3, the grinding fluid supply means 40 includes an upper wall portion 44 that forms a space 440 with the upper surface Wa side of the workpiece W formed on the plate portion 41 and held on the holding table 10. I have. The upper wall portion 44 is the lower surface of the plate portion 41.

研削液供給口42は、例えば図2(c)に示す複数の噴出孔420により構成されており、図3に示した研削砥石26の加工領域P(研削砥石26が被加工物Wの上面Waを押圧して研削作用を発揮する領域)に沿って円弧状に形成されている。図3に示すように、プレート部41の内部には、一端が研削液供給口42に連通するとともに他端が研削液供給源46に接続される研削液供給路43が形成されている。   The grinding fluid supply port 42 is composed of, for example, a plurality of ejection holes 420 shown in FIG. 2C, and the processing region P of the grinding wheel 26 shown in FIG. 3 (the grinding wheel 26 is the upper surface Wa of the workpiece W). Are formed in a circular arc shape along a region where the grinding action is exerted by pressing. As shown in FIG. 3, a grinding fluid supply path 43 is formed inside the plate portion 41, one end communicating with the grinding fluid supply port 42 and the other end connected to a grinding fluid supply source 46.

上壁部44は、保持テーブル10に保持された被加工物Wの上面Waとの間に空間440を形成し、被加工物Wの上面Waに供給された研削液を、この空間440内において、保持テーブル10の回転に伴って加工領域Pの研削砥石26に向けて流動させることができる。   The upper wall portion 44 forms a space 440 between the upper surface Wa of the workpiece W held on the holding table 10, and the grinding liquid supplied to the upper surface Wa of the workpiece W is placed in the space 440. As the holding table 10 rotates, it can be made to flow toward the grinding wheel 26 in the processing region P.

なお、図示していないが、研削液供給手段40に昇降機構を備えるようにしてもよい。その場合は、昇降機構によって、プレート部41を上下方向に移動させて上壁部44の高さを調整することができる。   Although not shown, the grinding fluid supply means 40 may be provided with a lifting mechanism. In that case, the height of the upper wall portion 44 can be adjusted by moving the plate portion 41 in the vertical direction by the lifting mechanism.

図3に示すように、プレート部41には、被加工物の厚みを測定する非接触式の厚み測定部12が埋設されている。厚み測定部12は、例えば光学式のセンサを備えており、保持テーブル10に保持される被加工物の上方から被加工物の厚みを測定できる。この厚み測定部12は、研削液供給口42から離れた位置に配置されている。厚み測定部12を研削液供給口42から離れた位置に配置することで、研削中に研削液が厚み測定部12と被加工物Wの上面Wa間に介在することがないため、非接触型の厚み測定部による測定において研削液の影響を受けることなく高精度に測定が可能となる。   As shown in FIG. 3, a non-contact type thickness measuring unit 12 that measures the thickness of the workpiece is embedded in the plate unit 41. The thickness measuring unit 12 includes, for example, an optical sensor, and can measure the thickness of the workpiece from above the workpiece held on the holding table 10. The thickness measuring unit 12 is disposed at a position away from the grinding fluid supply port 42. By disposing the thickness measuring unit 12 at a position away from the grinding fluid supply port 42, the grinding fluid does not intervene between the thickness measuring unit 12 and the upper surface Wa of the workpiece W during grinding. In the measurement by the thickness measuring unit, it is possible to measure with high accuracy without being affected by the grinding fluid.

研削液供給手段40は、研削液供給口42から被加工物Wの上面Waに供給され加工領域Pに到達し研削砥石26の外側に排出された研削液を吸引する吸引部47を備えている。吸引部47は、保持テーブル10に保持された被加工物に対面する吸引口470と、一端が吸引口470に連通するとともに他端がバルブ48を介して吸引源49に接続される吸引路471とを備えている。図2(c)に示すように、吸引口470は、噴出口420の円弧状の列よりも長く形成されており、研削砥石26の外側に排出された研削液を十分に吸引することができる。   The grinding fluid supply means 40 includes a suction portion 47 that sucks the grinding fluid that is supplied from the grinding fluid supply port 42 to the upper surface Wa of the workpiece W, reaches the processing region P, and is discharged outside the grinding wheel 26. . The suction unit 47 includes a suction port 470 that faces the workpiece held on the holding table 10, and a suction path 471 that has one end communicating with the suction port 470 and the other end connected to the suction source 49 via the valve 48. And. As shown in FIG. 2C, the suction port 470 is formed longer than the arc-shaped row of the ejection ports 420, and can sufficiently suck the grinding liquid discharged to the outside of the grinding wheel 26. .

次に、図1に示した研削装置1の動作例について説明する。図3に示す被加工物Wは、特に材質等が限定されるものではなく、研削砥石26によって研削される面が上面Waとなっている。研削前の被加工物Wは、カセット4aに複数収容されている。   Next, an operation example of the grinding apparatus 1 shown in FIG. 1 will be described. The material to be processed W shown in FIG. 3 is not particularly limited, and the surface to be ground by the grinding wheel 26 is the upper surface Wa. A plurality of workpieces W before grinding are accommodated in the cassette 4a.

まず、搬送手段5は、カセット4aから研削前の被加工物Wを取り出し、仮置き手段6に搬送する。仮置き手段6によって被加工物Wの位置合わせをした後、第1の搬送手段8aは、保持テーブル10に被加工物Wを搬送する。その後、保持テーブル10において被加工物Wを吸引保持するとともに、蛇腹9の伸縮をともない保持テーブルカバー11がY軸方向に移動し、図4に示すように、保持テーブル10を研削手段20の下方に移動させる。このとき、図示しない回転手段によって、保持テーブル10を例えば矢印B方向に回転させる。   First, the conveying means 5 takes out the workpiece W before grinding from the cassette 4 a and conveys it to the temporary placing means 6. After the workpiece W is aligned by the temporary placement means 6, the first transport means 8 a transports the work W to the holding table 10. Thereafter, the workpiece W is sucked and held by the holding table 10 and the holding table cover 11 is moved in the Y-axis direction along with the expansion and contraction of the bellows 9, and the holding table 10 is moved below the grinding means 20 as shown in FIG. Move to. At this time, the holding table 10 is rotated, for example, in the direction of arrow B by a rotating means (not shown).

図4に示すように、研削ホイール25を例えば矢印A方向に回転させながら、図1で示した昇降手段30によって研削ホイール25を保持テーブル10に保持された被加工物Wに向けて下降させる。このようにして、回転しながら下降する研削砥石26が、研削液供給手段40のリング状の開口部411に挿通されるとともに被加工物Wの上面Waを押圧しながら研削する。研削中は、研削砥石26が常に被加工物Wの中心を通る。研削砥石26の回転軌跡の直径は、被加工物Wの直径と同等以上である。図3及び図4では明示していないが、保持テーブル10において被加工物Wを保持する保持面100は、中心を頂点とする勾配の緩やかな円錐面(例えば直径φ200mmで頂点と横断面底面との高低差が20μm)に形成されており、保持面100と研削砥石26の研削面260とが加工領域Pにおいて平行となるようにスピンドル21の軸心が保持テーブル10の回転軸に対して相対的に傾斜しているため、図5に示す加工領域Pにおいて研削砥石26が被加工物Wの上面Waに接触して研削が行われる。すなわち、被加工物Wの上方に位置する研削砥石26のうち、その半分が被加工物Wの上面Waに作用して研削が行われる。   As shown in FIG. 4, the grinding wheel 25 is lowered toward the workpiece W held on the holding table 10 by the lifting / lowering means 30 shown in FIG. 1 while rotating the grinding wheel 25 in the direction of arrow A, for example. In this way, the grinding wheel 26 that descends while rotating is inserted into the ring-shaped opening 411 of the grinding liquid supply means 40 and is ground while pressing the upper surface Wa of the workpiece W. During grinding, the grinding wheel 26 always passes through the center of the workpiece W. The diameter of the rotation trajectory of the grinding wheel 26 is equal to or greater than the diameter of the workpiece W. Although not explicitly shown in FIGS. 3 and 4, the holding surface 100 that holds the workpiece W in the holding table 10 is a conical surface with a gentle slope with the center as the apex (for example, a diameter φ of 200 mm and the apex and the bottom of the cross section). And the axis of the spindle 21 is relative to the rotation axis of the holding table 10 so that the holding surface 100 and the grinding surface 260 of the grinding wheel 26 are parallel to each other in the processing region P. Therefore, the grinding wheel 26 comes into contact with the upper surface Wa of the workpiece W in the processing region P shown in FIG. In other words, half of the grinding wheel 26 positioned above the workpiece W acts on the upper surface Wa of the workpiece W to perform grinding.

被加工物Wの研削中は、研削液供給手段40によって研削液を研削砥石26と被加工物Wの上面Waとの間に供給する。具体的には、研削液供給源46が作動し、研削液供給路43を介して研削液供給口42から研削液を保持テーブル10に保持された被加工物Wの上面Waに向けて供給する。図5に示すように、研削液供給口42は、加工領域Pよりも保持テーブル10の回転方向後方側(上流側)に位置しており、この位置において噴出孔420から研削液を噴出する。そして、噴出孔420から噴出され被加工物Wの上面Waに供給された研削液は、図4に示した上壁部44と被加工物Wの上面Waとの間の空間440のうち、研削液供給口42と加工領域Pの研削砥石26との間の所定の間隔を保持テーブル10の回転方向前方側(下流側)に流れる。すなわち、研削液供給口42から被加工物Wの上面Waに供給された研削液は、保持テーブル10の回転に伴って加工領域Pの研削砥石26に向かって流動する研削液供給層50を形成する。図4に示すように、この研削液供給層50は、回転する研削砥石26の周辺に発生している空気層を遮断するため、研削液が加工領域Pに到達するのを阻まれることがない。また、研削中は、厚み測定部12が被加工物Wの厚みを測定するが、厚み測定部12は、研削液供給口42から離れた位置であって、研削液が流れる方向とは逆の方向(研削液供給層50が形成されない位置)に配設されているため、研削液の影響を受けることなく厚みの測定を行うことができる。   During grinding of the workpiece W, the grinding fluid is supplied between the grinding wheel 26 and the upper surface Wa of the workpiece W by the grinding fluid supply means 40. Specifically, the grinding fluid supply source 46 is activated, and the grinding fluid is supplied from the grinding fluid supply port 42 toward the upper surface Wa of the workpiece W held on the holding table 10 through the grinding fluid supply path 43. . As shown in FIG. 5, the grinding fluid supply port 42 is located on the rear side (upstream side) in the rotation direction of the holding table 10 with respect to the processing region P, and the grinding fluid is ejected from the ejection holes 420 at this position. The grinding liquid ejected from the ejection holes 420 and supplied to the upper surface Wa of the workpiece W is ground in the space 440 between the upper wall portion 44 and the upper surface Wa of the workpiece W shown in FIG. A predetermined distance between the liquid supply port 42 and the grinding wheel 26 in the processing region P flows to the front side (downstream side) in the rotation direction of the holding table 10. That is, the grinding fluid supplied from the grinding fluid supply port 42 to the upper surface Wa of the workpiece W forms a grinding fluid supply layer 50 that flows toward the grinding wheel 26 in the processing region P as the holding table 10 rotates. To do. As shown in FIG. 4, the grinding fluid supply layer 50 blocks an air layer generated around the rotating grinding wheel 26, so that the grinding fluid is not prevented from reaching the processing region P. . During grinding, the thickness measuring unit 12 measures the thickness of the workpiece W. The thickness measuring unit 12 is located away from the grinding fluid supply port 42 and is opposite to the direction in which the grinding fluid flows. Since it is disposed in the direction (position where the grinding fluid supply layer 50 is not formed), the thickness can be measured without being affected by the grinding fluid.

吸引部47は、加工領域Pよりも保持テーブル10の回転方向前方側に配設されているため、被加工物Wの上面Waに供給された研削液が保持テーブル10の回転方向前方側に向けて流れて加工領域Pに到達した後、加工領域Pの研削砥石26の外側に排出されると、吸引部47によってその研削液が吸引される。具体的には、吸引源49からの吸引力が吸引口470において作用し、研削液を吸引口470から吸引して装置の外部に廃棄する。研削に供された研削液を吸引部47によって吸引することにより、研削液供給口42から加工領域Pの研削砥石26に向けた研削液の流れを効果的につくりだすことができる。   Since the suction portion 47 is disposed on the front side in the rotation direction of the holding table 10 with respect to the processing area P, the grinding liquid supplied to the upper surface Wa of the workpiece W is directed toward the front side in the rotation direction of the holding table 10. Then, after reaching the machining area P and discharged to the outside of the grinding wheel 26 in the machining area P, the suction fluid is sucked by the suction portion 47. Specifically, the suction force from the suction source 49 acts on the suction port 470, and the grinding liquid is sucked from the suction port 470 and discarded outside the apparatus. By sucking the grinding fluid used for grinding by the suction portion 47, it is possible to effectively create a flow of the grinding fluid from the grinding fluid supply port 42 toward the grinding wheel 26 in the processing region P.

ここで、研削液を加工領域Pに供給する際、加工領域Pで発生する研削屑をより効果的に除去したり、加工領域Pにおける発熱を十分に冷却したりするためには、加工領域Pに到達する研削液の流速が速い程好ましい。本実施形態の研削液供給手段40では、保持テーブル10の回転に伴う遠心力によって十分に速い流速で加工領域Pに研削液を供給することが可能となる。また、図示していない昇降機構によって、被加工物Wの厚みに合わせて上壁部44の高さ位置を調製して上壁部44と被加工物Wの上面Waとの間の間隔を狭くすることで研削液の流速を速くすることもできる。なお、上壁部44の高さ位置の調整は、被加工物Wの研削前に行う。   Here, when supplying the grinding liquid to the processing region P, in order to more effectively remove the grinding dust generated in the processing region P or to sufficiently cool the heat generated in the processing region P, the processing region P The faster the flow rate of the grinding fluid that reaches In the grinding fluid supply means 40 of this embodiment, it becomes possible to supply the grinding fluid to the machining area P at a sufficiently high flow rate by the centrifugal force accompanying the rotation of the holding table 10. Further, the height position of the upper wall portion 44 is adjusted according to the thickness of the workpiece W by an elevating mechanism (not shown), and the interval between the upper wall portion 44 and the upper surface Wa of the workpiece W is narrowed. By doing so, the flow rate of the grinding fluid can be increased. The height position of the upper wall portion 44 is adjusted before the workpiece W is ground.

また、回転する保持テーブル10の外周側の方が中央側よりも周速が速く被加工物Wを研削する研削砥石26の仕事量が増えることから、研削液供給手段40は、被加工物Wを研削する研削砥石26の仕事量に比例させて研削液の量を増加させることが望ましい。例えば、回転する保持テーブル10に保持された被加工物Wの外周側に対面する位置において、図5に示すように、噴出孔420の個数を増やすとともに、被加工物Wの外周側に配置された隣り合う噴出孔420間の間隔を狭くする。このようにすれば、加工領域Pの全域に多量の研削液を効率よく供給することができる。   Further, since the outer peripheral side of the rotating holding table 10 has a higher peripheral speed than the central side, and the amount of work of the grinding wheel 26 for grinding the workpiece W increases, the grinding fluid supply means 40 is provided with the workpiece W. It is desirable to increase the amount of the grinding fluid in proportion to the work amount of the grinding wheel 26 for grinding. For example, at a position facing the outer peripheral side of the workpiece W held on the rotating holding table 10, the number of the ejection holes 420 is increased and the outer peripheral side of the workpiece W is arranged as shown in FIG. 5. The interval between the adjacent ejection holes 420 is narrowed. In this way, a large amount of grinding fluid can be efficiently supplied to the entire processing region P.

また、研削液供給手段42には、上記の噴出孔420に代えて、図6に示す加工領域Pに沿ったスリット状のスリット状研削液供給口42aを設けてもよい。スリット状研削液供給口42aは、被加工物Wの外周側にいくほど幅広となるように形成されており、図5に示した研削液供給口42と同様に加工領域Pの全域に多量の研削液を効率よく供給することが可能となっている。   Further, the grinding liquid supply means 42 may be provided with a slit-shaped slit-shaped grinding liquid supply port 42a along the processing region P shown in FIG. The slit-shaped grinding fluid supply port 42a is formed so as to become wider toward the outer peripheral side of the workpiece W, and a large amount of the slit-shaped grinding fluid supply port 42a is formed in the entire processing region P like the grinding fluid supply port 42 shown in FIG. It is possible to supply the grinding fluid efficiently.

図7に示すように、プレート部41は、研削砥石26が使用可能な最短の長さに磨耗し、それにともない研削中に研削ホイール25が下降しても、研削ホイール25とプレート部41とが干渉しない厚みに設定する。これにより、研削砥石26で複数の被加工物Wを継続して研削しても、研削ホイール25がプレート部41に接触することはなく、装置が破損するのを防止できる。   As shown in FIG. 7, the plate portion 41 is worn to the shortest length that the grinding wheel 26 can be used, and even if the grinding wheel 25 is lowered during grinding, the grinding wheel 25 and the plate portion 41 are not connected. Set to a thickness that does not interfere. Thereby, even if it grinds continuously the some workpiece W with the grinding stone 26, the grinding wheel 25 does not contact the plate part 41 and it can prevent that an apparatus is damaged.

以上のようにして、研削液を加工領域Pに供給しながら被加工物Wを研削し、厚み測定部12が被加工物Wの厚みを測定して被加工物Wが所望の厚みに達したら、図1に示した昇降手段30によって研削手段20を上昇させ研削を終了する。研削終了後、保持テーブル10を第2の搬送手段8bの可動範囲に移動させる。第2の搬送手段8bが研削後の被加工物Wを保持テーブル10から洗浄手段7に搬送して洗浄手段7において洗浄後、搬送手段5によって洗浄後の被加工物Wをカセット4bに収容する。   As described above, the workpiece W is ground while supplying the grinding liquid to the processing region P, and the thickness measuring unit 12 measures the thickness of the workpiece W, and the workpiece W reaches a desired thickness. The grinding means 20 is raised by the lifting means 30 shown in FIG. After the grinding, the holding table 10 is moved to the movable range of the second conveying means 8b. The second conveyance means 8b conveys the workpiece W after grinding from the holding table 10 to the cleaning means 7, and after cleaning in the cleaning means 7, the workpiece W after cleaning by the conveyance means 5 is accommodated in the cassette 4b. .

本発明にかかる研削装置1は、保持テーブル10の回転方向後方側で被加工物Wの上面Waに向けて研削液を供給する研削液供給手段40を備え、被加工物Wの研削中は、加工領域Pに沿って形成される研削液供給口42から被加工物Wの上面Waに向けて研削液を供給することにより、研削液が保持テーブル10の回転に伴って上壁部44と被加工物Wの上面Waとの間をつたって加工領域Pに向けて流れていくため、研削砥石26の周辺に研削液供給層50を形成することができる。つまり、研削液を研削砥石26へと導く研削液導出路の一部として被加工物Wの上面Waを利用するとともに、上壁部44と被加工物Wの上面Waとで画成された研削液導出路を研削砥石26の周囲に形成される空気の層の遮断手段として利用する。これにより、回転する研削砥石26の周囲に発生する空気層を研削液供給層50が遮断するため、加工領域Pに十分に研削液を到達させることができる。
また、研削液供給手段40は、被加工物Wの上方側に配置された研削液供給口42から被加工物Wの上面Waに向けて研削液を供給するため、研削砥石26の側壁に研削液が衝突して飛散するおそれも低減する。これにより、従来のように過度に多量の研削液を被加工物Wに供給する必要がなくなる。
The grinding apparatus 1 according to the present invention includes a grinding fluid supply means 40 that supplies a grinding fluid toward the upper surface Wa of the workpiece W on the rear side in the rotation direction of the holding table 10, and during grinding of the workpiece W, By supplying the grinding fluid from the grinding fluid supply port 42 formed along the machining region P toward the upper surface Wa of the workpiece W, the grinding fluid is brought into contact with the upper wall portion 44 and the workpiece with the rotation of the holding table 10. Since it flows toward the processing region P between the workpiece W and the upper surface Wa, the grinding fluid supply layer 50 can be formed around the grinding wheel 26. That is, the upper surface Wa of the workpiece W is used as a part of the grinding fluid outlet path for guiding the grinding fluid to the grinding wheel 26, and the grinding defined by the upper wall portion 44 and the upper surface Wa of the workpiece W is performed. The liquid lead-out path is used as a means for blocking an air layer formed around the grinding wheel 26. Thereby, since the grinding fluid supply layer 50 blocks the air layer generated around the rotating grinding wheel 26, the grinding fluid can sufficiently reach the processing region P.
In addition, the grinding fluid supply means 40 grinds the sidewall of the grinding wheel 26 in order to supply the grinding fluid from the grinding fluid supply port 42 disposed above the workpiece W toward the upper surface Wa of the workpiece W. The risk of liquid collision and scattering is also reduced. This eliminates the need to supply an excessively large amount of grinding fluid to the workpiece W as in the prior art.

1:研削装置 2:装置ベース 2a:上面 3:コラム
4a,4b:カセット 5:搬送手段 6:仮置き手段 7:洗浄手段
8a:第1の搬送手段 8b:第2の搬送手段 9:蛇腹
10:保持テーブル 11:保持テーブルカバー 12:非接触厚み計
20:研削手段 21:スピンドル 22:ハウジング 23:モータ
24:マウント 25:研削ホイール 26:研削砥石 27:支持部
30:昇降手段 31:ボールネジ 32:モータ 33:ガイドレール
34:昇降板
40:研削液供給手段 41:プレート部 410:外周部 411:開口部
42:研削液供給口 420:噴出孔 42a:スリット状研削液供給口
43:研削液供給路 44:上壁部 45:カバー部 46:研削液供給源
47:吸引部 470:吸引口 48:バルブ 49:吸引源
50:研削液供給層
1: Grinding device 2: Device base 2a: Upper surface 3: Columns 4a, 4b: Cassette 5: Conveying means 6: Temporary placing means 7: Cleaning means 8a: First conveying means 8b: Second conveying means 9: Bellows 10 : Holding table 11: Holding table cover 12: Non-contact thickness gauge 20: Grinding means 21: Spindle 22: Housing 23: Motor 24: Mount 25: Grinding wheel 26: Grinding wheel 27: Supporting part 30: Lifting means 31: Ball screw 32 : Motor 33: Guide rail 34: Elevating plate 40: Grinding fluid supply means 41: Plate portion 410: Outer peripheral portion 411: Opening portion 42: Grinding fluid supply port 420: Ejection hole 42a: Slit-shaped grinding fluid supply port 43: Grinding fluid Supply path 44: Upper wall part 45: Cover part 46: Grinding fluid supply source 47: Suction part 470: Suction port 48: Valve 49: Suction source 50: Grinding Liquid supply layer

Claims (1)

被加工物を保持し所定の方向に回転可能な保持テーブルと、該保持テーブルで保持された被加工物を研削する研削砥石を含む研削ホイールを有した研削手段と、被加工物と該研削砥石とに研削液を供給する研削液供給手段と、を備えた研削装置であって、
該研削ホイールは、基台の自由端に複数の研削砥石が互いに所定の間隔を有して環状に配設されて構成され、
該研削液供給手段は、被加工物に対して該研削砥石が作用する加工領域より該保持テーブルの回転方向後方側から被加工物の上面に向けて研削液を供給する研削液供給口と、
該研削液供給口と該加工領域の該研削砥石との間で被加工物の上面側に所定の間隔を有し、該研削液供給口から被加工物の上面に供給された研削液が該保持テーブルの回転に伴って該加工領域の該研削砥石に向かって流動する研削液供給層を形成する上壁部と、
該加工領域より該保持テーブルの回転方向前方側に配設され、該研削液供給口から被加工物の上面に供給され該加工領域に到達した後に該研削砥石の外側に排出された研削液を吸引する吸引口を有する吸引部と、
を備える研削装置。
A holding table that holds a workpiece and is rotatable in a predetermined direction, a grinding means having a grinding wheel including a grinding wheel for grinding the workpiece held by the holding table, a workpiece, and the grinding wheel And a grinding liquid supply means for supplying a grinding liquid to
The grinding wheel is configured such that a plurality of grinding wheels are annularly arranged at a free end of a base with a predetermined interval from each other,
The grinding fluid supply means comprises a grinding fluid supply port for supplying a grinding fluid from a processing region where the grinding wheel acts on the workpiece toward the upper surface of the workpiece from the rear side in the rotation direction of the holding table;
A predetermined interval is provided on the upper surface side of the workpiece between the grinding fluid supply port and the grinding wheel in the processing region, and the grinding fluid supplied from the grinding fluid supply port to the upper surface of the workpiece is An upper wall portion that forms a grinding fluid supply layer that flows toward the grinding wheel in the processing region as the holding table rotates;
Grinding liquid disposed on the front side in the rotation direction of the holding table from the machining area, supplied to the upper surface of the workpiece from the grinding liquid supply port, and discharged to the outside of the grinding wheel after reaching the machining area. A suction part having a suction port for suction;
A grinding apparatus comprising:
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