JP6320079B2 - Electronic device shield structure and electronic device including the shield structure - Google Patents

Description

  The present disclosure relates to a shield structure for an electronic device, and more particularly, to a shield structure for blocking a disturbing radio wave generated by the operation of an electronic component, and an electronic device including the shield structure.

  When an electronic device equipped with an electronic component operates, electromagnetic waves generated from the electronic circuit may adversely affect the operation of other electronic components. Therefore, a shielding object such as a shield cover for shielding electromagnetic waves from the electronic circuit may be assembled to the circuit board.

  For example, Japanese Patent Application Laid-Open No. 2004-71629 (Patent Document 1) describes a shield structure for an electronic device that can suppress an increase in cost associated with the manufacture of the electronic device. According to Patent Document 1, at least a part of the shield plate is electrically connected to island-shaped ground patterns provided on the wiring board via spring pins.

JP 2004-71629 A

  According to the technique described in Patent Document 1, the shield cover and the ground pattern of the wiring board are made conductive through connection means such as a spring pin, thereby ensuring electromagnetic shielding performance for electronic components. However, in the technique described in Patent Document 1, when the wiring board and the shield cover are connected by a spring pin as a connection means, the strength for connecting the wiring board and the shield cover is required, so the mounting area is large. In other words, it may be necessary to provide a reinforcing hole in the wiring board. Also, when conductive rubber is used as the connection means, the strength required to connect the wiring board and the shield cover is required, so the mounting area is increased, and a reinforcing hole is provided in the wiring board. Action may be required. As another connection method, it is conceivable to connect the shield cover and the wiring board by providing a spring (tongue piece) on the shield plate. However, when a spring is provided on the shield cover, a hole is opened in the shield cover. Electric power can leak from the hole.

  Therefore, there is a need for a technique for reducing a mounting area for mounting a configuration for shielding while blocking a propagation path of a high-frequency signal at an arbitrary location of the shield cover.

  A shield structure for an electronic device according to an embodiment includes a wiring board on which a plurality of electronic component units are mounted, and a shield cover that is assembled to the wiring board in a manner to cover the electronic component unit. The shield cover is formed with an insertion hole at one or more arbitrary positions where the pin can be inserted. In the wiring board, with the shield cover assembled to the wiring board, a receiving member that receives the pin inserted in the shield cover at each position corresponding to the insertion hole of the shield cover and makes the pin and the ground of the wiring board conductive. Is assembled. A pin is inserted into each of the one or more insertion holes of the shield cover so that the shield cover and the top of the pin come into contact with each other, and the pin is received by the receiving member, thereby electrically connecting the shield cover and the ground of the wiring board. .

  According to another embodiment, an electronic device that includes a shield structure and covers an electronic component unit is provided. The electronic device includes a wiring board on which a plurality of electronic component units are mounted, and a shield cover that is assembled to the wiring board in a manner that covers the electronic component unit. The shield cover is formed with an insertion hole at one or more arbitrary positions where the pin can be inserted. In the wiring board, with the shield cover assembled to the wiring board, a receiving member that receives the pin inserted in the shield cover at each position corresponding to the insertion hole of the shield cover and makes the pin and the ground of the wiring board conductive. Is assembled. A pin is inserted into each of the one or more insertion holes of the shield cover so that the shield cover and the top of the pin come into contact with each other, and the pin is received by the receiving member, thereby electrically connecting the shield cover and the ground of the wiring board. .

  According to the one embodiment, since the shield ground is strengthened by inserting the pin through the shield cover and fixing it to the wiring board, the high-frequency signal can be transmitted at any position of the shield without increasing the mounting area. Propagation paths can be hindered, and malfunctions of electronic components and the like due to noise can be suppressed. For example, even when it is difficult to connect the shield cover and the wiring board with a spring, such as when the height of the shield cover with respect to the wiring board is only about 2 mm, insert a pin into the shield cover. While being fixed to the wiring board, the propagation path of the high-frequency signal can be inhibited.

  The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention taken in conjunction with the accompanying drawings.

It is a disassembled perspective view of an electronic device provided with the shield structure concerning this Embodiment. 1 is an overall plan view of a substrate 300. FIG. It is sectional drawing of the III-III 'line | wire in FIG. FIG. 5 is a view showing an insertion portion for inserting the fixing pin 500 into the shield cover 100. FIG. 6 is a view showing a fixing hole portion 21 for inserting the shaft 52 of the fixing pin 500 into the clip 20. FIG. 10 is a diagram showing an insertion portion for inserting a fixing pin 500 into a shield cover 100 in the second embodiment. It is a figure which shows the propagation path which arises when a high frequency signal couple | bonds spatially within a shield cover.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

<Embodiment 1>
FIG. 1 is an exploded perspective view of an electronic device including a shield structure according to the present embodiment. As shown in FIG. 1, in an electronic device, a frame 200 is assembled on a substrate 300, and a shield cover 100 is covered so as to cover the frame 200.

  Various wiring patterns such as a ground (GND) are formed on the surface of the substrate 300, and a plurality of electronic component units such as the electronic component units 10A, 10B, 10C, and 10D are mounted (hereinafter, the electronic component unit 10A, Electronic component units such as 10B, 10C, and 10D may be collectively referred to as an electronic component unit 10). In FIG. 1 and the like, a part of the electronic component unit mounted on the substrate 300 is shown. When the shield cover 100 is assembled, the substrate 300 has clips 20A and 20B (hereinafter referred to as clips 20A and 20B, etc.) at locations where a high-frequency signal propagation path is generated by the operation of the electronic component unit 10 and noise may be generated. Are sometimes collectively referred to as a clip 20).

  The electronic component unit 10 receives power supply and various signals from the substrate 300 and performs processing, and outputs the processing result as a signal. The electronic component unit 10 may emit a high frequency signal during its operation.

  The clip 20 is connected to the ground of the substrate 300. As will be described later, the clip 20 is a member for receiving a pin for assembling the shield cover 100 to the substrate 300 and connecting the shield cover 100 and the ground of the substrate 300. Each of the plurality of clips 20 is mounted immediately below the position of the insertion hole 30 formed in the shield cover 100 in a state where the shield cover 100 is assembled to the substrate 300.

  The frame 200 is a frame-shaped member that surrounds substantially the entire area of the substrate 300. The frame 200 is assembled to the substrate 300. The outer periphery of the frame 200, which is a frame-shaped member, is accommodated in the container-shaped shield cover 100 and is formed so as to be in contact with the shield cover 100 when accommodated in the shield cover 100. The shield cover 100 is fixed to the substrate 300 by pins inserted through the insertion holes 30 (insertion holes 30A and 30B). Further, the shield cover 100 and the frame 200 are in contact with each other, so that the strength of the shield cover 100 is improved.

  The shield cover 100 is a cover having a rectangular surface that covers substantially the entire area of the substrate 300, and is formed so as to reduce the surface resistance by applying gold plating to the inner surface of a container-like member made of stainless steel. . As the shield cover 100, for example, a metal material, a resinous material, or other materials are formed in a container shape, and the inner surface thereof is plated with gold.

FIG. 2 is an overall plan view of the substrate 300.
3 is a cross-sectional view taken along line III-III ′ in FIG.

  As shown in FIG. 3, a fixing pin 500 is inserted into an insertion hole 30 </ b> A formed in the shield cover 100, and the fixing pin 500 is received by a clip 20 </ b> A mounted on the substrate 300. The fixing pin 500 is a conductive member. As shown in the pin insertion part 80, the top of the fixing pin 500 comes into contact with the shield cover 100, and the fixing pin 500 is received by the clip 20A, whereby the shield cover 100 and the ground of the substrate 300 are electrically connected. The That is, the shield cover 100 and the ground of the substrate 300 are electrically connected by the fixing pin 500 and the clip 20A. Details of the pin insertion portion 80 shown in FIG. 3 are shown in FIG. Details of the pin receiving portion 90 shown in FIG. 3 are shown in FIG.

  FIG. 4 is a view showing an insertion portion through which the fixing pin 500 is inserted into the shield cover 100. As shown in FIG. 4, in the fixing pin 500, the thickness of the shaft portion of the pin changes. The fixing pin 500 is configured by a shaft 51 that is in contact with the shield cover 100 in a state of being inserted through the insertion hole 30 of the shield cover 100 and a shaft 52 having a diameter different from that of the shaft 51.

  In the example shown in FIG. 4, the shaft 51 has a larger shaft diameter than the shaft 52. Therefore, the fixing pin 500 can be easily inserted into the shield cover 100, and the fixing pin 500 and the shield cover 100 can be easily brought into contact with each other on the shaft 51. The fixing pin 500 may change the thickness of the shaft by providing a constriction in the shaft portion.

  As shown in FIG. 4, the shield cover 100 is formed by placing the surface of the shield cover 100 on a substrate in order to easily fix the fixing pin 500 in a region where an insertion hole for receiving the insertion of the fixing pin 500 is formed. 300 is deformed into a convex shape (with respect to the lower surface). In the example shown in FIGS. 3 and 4, the surface of the shield cover 100 is deformed around the insertion hole so as to follow the shape of the top of the fixing pin 500. Thereby, it becomes easy for an operator who assembles the shield cover 100 to the substrate 300 to insert the fixing pin 500 into the insertion hole 30 of the shield cover 100.

  FIG. 5 is a view showing the fixing hole 21 for inserting the shaft 52 of the fixing pin 500 into the clip 20. As shown in FIG. 5, the fixing pin 500 inserted through the shield cover 100 is received by the clip 20 through the fixing hole 21, whereby the shield cover 100 and the ground of the substrate 300 are electrically connected.

  The fixing hole portion 21 has a receiving hole of the fixing pin 500 larger than the shaft diameter of the shaft 52, and the diameter of the hole is made smaller as it approaches the substrate 300. Thereby, the clip 20 can receive the fixing pin 500 and facilitate the contact between the fixing pin 500 and the clip 20 while facilitating the insertion of the shaft 52. That is, it becomes easy for an operator who assembles a shield structure of an electronic device to attach the shield cover 100 to the substrate 300 by inserting the fixing pin 500 through the insertion hole 30 after covering the substrate 300 with the shield cover 100.

  In the first embodiment, the fixing pin 500 and the clip 20 may have a screw structure. Thereby, the intensity | strength which assembles the shield cover 100 to the board | substrate 300 improves.

<Summary of Embodiment 1>
As a pin structure for conducting the shield cover and the wiring board, (1) a spring pin is mounted on the board, (2) a conductive rubber pin is mounted on the board, and (3) a spring is mounted on the shield cover. However, according to these configurations, the mounting area may be increased. For example, in the case of (1) a spring pin and (2) a conductive rubber pin, it may be necessary to increase the mounting area or provide a reinforcing hole in the substrate in order to give the shield cover strength. (3) When the spring is provided on the shield plate, a hole is formed in the shield, and there may be electric power leaking from the hole. In addition, when the height from the wiring board to the shield cover is about 2 mm, it is difficult to give the shield cover springiness, and the spring configured on the shield plate becomes large, and the surrounding electronic component unit May interfere.

  On the other hand, the shield structure of the first embodiment obstructs a high-frequency propagation path at an arbitrary location of the shield by inserting a pin into the hole of the shield cover. Specifically, the pin is inserted into the hole of the shield cover, and the pin is received by a clip mounted on the substrate. This pin is inserted after the shield cover is put on the wiring board. Thereby, it is possible to change the frequency at which the shield cover 100 is easily propagated by changing the potential fluctuation of the shield cover 100. The ground of the shield cover is strengthened, and the possibility that the electronic component unit malfunctions due to noise can be reduced. Also, even if the height from the wiring board to the shield cover is about 2 mm and the distance between the top surface of the electronic component unit and the shield cover is very small, the insertion of the pin obstructs the high-frequency propagation path. In addition, malfunction of the electronic component unit due to noise can be suppressed.

<Embodiment 2>
FIG. 6 is a diagram illustrating an insertion portion through which the fixing pin 500 is inserted into the shield cover 100 according to the second embodiment. FIG. 6A shows a cross section of an insertion portion through which the fixing pin 500 is inserted into the shield cover 100. FIG. 6B is a front view and a side view of the washer 600.

  As shown in FIG. 6, a washer 600 is inserted between the top of the fixing pin 500 and the shield cover 100. The upper surface of the shield cover 100 and the washer 600 are in contact with each other, and the washer 600 and the top of the fixing pin 500 are in contact with each other. Thereby, the fixing strength of the fixing pin 500 is improved and the ground is also strengthened. In addition, the strength of fixing the shield cover 100 to the substrate 300 is improved, and leakage of high-frequency signals is also reduced.

  Here, for comparison, an example of an electronic apparatus that does not have the shield structure of Embodiments 1 and 2 will be described.

  FIG. 7 is a diagram illustrating a propagation path generated by spatially coupling high-frequency signals within the shield cover. As shown in FIG. 7, in the electronic device, the frame 2 is assembled to the substrate 4, and the shield cover 1 is covered so as to cover the frame 2.

  A plurality of electronic component units such as the electronic component unit 3A and the electronic component unit 3B are mounted on the substrate 4. These electronic component units generate high-frequency signals, and the high-frequency signals are spatially coupled to generate high-frequency signal propagation paths (high-frequency 6 and high-frequency 7). When there is no configuration (fixing pin 500, clip 20, insertion hole 30, etc.) that hinders the propagation path of the high-frequency signal as described in each embodiment, the power is connected between the electronic component units in the space coupling unit 5, Other electronic component units may be affected via the substrate 4 or the like.

  On the other hand, the electronic apparatus having the shield structure of each embodiment inserts the fixing pin 500 into the shield cover 100 as described above to make the shield cover 100 and the ground of the substrate 300 conductive, thereby transmitting a high-frequency signal propagation path. Therefore, malfunction due to noise can be suppressed while strengthening the shield ground.

  The embodiment disclosed this time must be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  100 Shield Cover, 200 Frame, 300 Substrate, 500 Fixing Pin, 600 Washer, 1 Shield Cover, 2 Frame, 3 Electronic Components, 4 Substrate, 5 Spatial Joint, 6 High Frequency, 7 High Frequency, 10 Electronic Component Unit, 20 Clip 21 Hole for fixing, 30 insertion hole, 51 axis, 52 axis, 80 pin insertion part, 90 pin receiving part.

Claims (4)

A shield structure for electronic equipment,
A wiring board on which a plurality of electronic component units are mounted;
In a mode of covering the electronic component unit, comprising a shield cover assembled to the wiring board,
The shield cover is formed with an insertion hole at one or more arbitrary positions where the pin can be inserted,
The wiring board receives the pins inserted through the shield cover at positions corresponding to the insertion holes of the shield cover in a state where the shield cover is assembled to the wiring board, and the pins and the wiring board. The receiving member that conducts with the ground is assembled.
The pin is inserted into each of the one or more insertion holes of the shield cover so that the shield cover and the top of the pin come into contact with each other, and the pin is received by the receiving member. Conducting with the ground of the wiring board ,
The receiving member includes a hole for receiving the pin,
The diameter of the hole is configured to be a shield structure for an electronic device in which the receiving hole of the pin is larger than the shaft diameter on the tip end side of the pin and becomes smaller as it approaches the wiring board .   The pin includes a first shaft portion that is inserted into the shield cover and is in contact with the shield cover in a state of being received by the receiving member, and a second shaft portion that is in contact with the receiving member, The shield structure for an electronic device according to claim 1, wherein the first shaft portion and the second shaft portion have different diameters. The shield structure of the electronic device further includes
The washer is inserted between the shield cover and the top of the pin, the top surface of the shield cover and the washer abut, and the washer and the top of the pin abut. Shield structure for electronic equipment as described in 1. An electronic device having a shield structure and covering an electronic component unit,
A wiring board on which a plurality of electronic component units are mounted;
In a mode of covering the electronic component unit, comprising a shield cover assembled to the wiring board,
The shield cover is formed with an insertion hole at one or more arbitrary positions where the pin can be inserted,
The wiring board receives the pins inserted through the shield cover at positions corresponding to the insertion holes of the shield cover in a state where the shield cover is assembled to the wiring board, and the pins and the wiring board. The receiving member that conducts with the ground is assembled.
The pin is inserted into each of the one or more insertion holes of the shield cover so that the shield cover and the top of the pin come into contact with each other, and the pin is received by the receiving member. Conducting with the ground of the wiring board ,
The receiving member includes a hole for receiving the pin,
The diameter of the hole is an electronic device configured such that the receiving hole of the pin is larger than the shaft diameter on the tip end side of the pin and becomes smaller as it approaches the wiring board .

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