JP6322797B2 - High-speed electrodeposition wire manufacturing method and manufacturing apparatus thereof - Google Patents

Description

  The present application relates to a high-speed electrodeposition wire manufacturing method and a manufacturing apparatus therefor, and more specifically, in a process of forming a composite plating film containing fine particles on a wire such as a piano wire having a wire diameter of 200 μm or less, an input current is increased. The present invention relates to a manufacturing method capable of manufacturing an electrodeposited wire at high speed and a manufacturing apparatus that can be easily miniaturized using the same.

In order to cut various ingots, fixed abrasive wires, particularly diamond electrodeposited wires, have been used in recent years from the viewpoint of improving processing efficiency and dealing with difficult-to-process materials. However, the electrodeposition wire has a problem in that the production speed is low and the price is high compared to the resin bond wire and the like. Generally, an electrodeposition wire is manufactured by electrodepositing coated diamond abrasive grains having a particle diameter of several tens of μm on a piano wire having a diameter of 100 to 200 μm. In a general manufacturing method, the manufacturing speed is several tens of mm per second. Since the concentration of the plating solution cannot be increased, the plating tank becomes long, and the manufacturing apparatus is large, with several tens of meters. In order to increase the production speed in this method, the plating bath must be lengthened and enlarged.

  In Patent Document 1, Patent Document 2, Non-Patent Document 1, and Non-Patent Document 2, a rotary drum type plating apparatus and a liquid flow type plating method are proposed, respectively, and a method of eliminating the speed difference between the piano wire and the abrasive grains is proposed. However, it is possible to reduce the size of the device and cope with non-coated abrasive grains, but its manufacturing speed is several tens of mm per second, which is not much different from the conventional manufacturing method.

  In Patent Document 3 and Non-Patent Document 3, the vicinity of the piano wire is vigorously stirred using a brush or fin to realize high-speed production (300 mm per second) by high-speed plating at a high current density. In order to achieve this, it is inevitable that the apparatus will become larger and more complicated.

JP 2006-110703 A JP 2010-274355 A JP 2011-038171 A

Hitoshi Suwabe, Mitsuru Aki, Kenichi Ishikawa, “Study on the development of high-speed production method of diamond wire tools with a rotating drum type plating device”, Journal of Abrasive Technology Society, Vol. 56, no. 10, October 2012, pages 703 to 708 Hitoshi Suwabe, Atsushi Oguchi, Yoshihiro Nakamura, Kenichi Ishikawa, “Development of high-speed manufacturing method of diamond wire tools using liquid-flow electrodeposition plating and its processing characteristics”, Journal of Abrasive Technology, Vol. 54, no. 5, May 2010, pp. 298 to 303 Yasuhiro Tani, Koji Kirino, “Development of High-Speed Manufacturing Technology for Electrodeposited Diamond Wire”, Journal of Abrasive Technology, Vol. 57, no. 8, August 2013, pp. 498 to 501

  The present invention has been proposed in order to solve the above-mentioned problems, and an object of the present invention is to easily increase the production speed in the production of electrodeposited wires, and the production speed is several hundred mm or more per second. Another object of the present invention is to provide a high-speed electrodeposition wire manufacturing method and a manufacturing apparatus thereof that can reduce the size of the device.

The high-speed electrodeposition wire manufacturing method according to an embodiment of the present invention reduces a metal ion in a plating solution using a wire as a cathode and a counter electrode as an anode in a plating solution in which fine particles are dispersed, and grows a plating film on the wire. An electrodeposited wire manufacturing method comprising an electrodeposited plating layer formed by electrodepositing the fine particles on the wire, wherein a current is applied to a part of the wire in the circumferential direction with respect to the counter electrode by a shielding portion. Shielding, having a process of concentrating current on the exposed part of the wire and growing the electrodeposition plating layer, rotating the exposed part of the wire by rotating the wire with respect to its axis The electrodeposition plating layer is grown on the entire circumference of the wire.

The high-speed electrodeposition wire manufacturing method according to the embodiment of the present invention uses a guide groove as the shielding part, and the wire and the wall of the guide groove are in contact with each other by at least two lines parallel to the wire traveling direction. The back portion of the wire is shielded from the counter electrode.

  In the high-speed electrodeposition wire manufacturing method according to the embodiment of the present invention, a plurality of guide grooves formed in the circumferential direction of a roll-shaped wire guide roll are provided at a constant pitch with respect to the axial direction of the roll. Two guide rolls having at least a non-conductive surface are arranged in parallel with the guide roll axis and the guide grooves are shifted by a half pitch, and alternately alternate between the two guide rolls along the guide grooves, A method of manufacturing an electrodeposition wire by winding a wire spirally while shifting by half a pitch and rotating the two guide rolls to produce an electrodeposited wire, where the guide roll and the wire are in contact with each other Thus, electrodeposition is performed in a section where the plating solution is in contact with the counter electrode and the wire and at least the back surface of the wire is shielded against the counter electrode. And the axial rotation of the wire to be generated by the wire travels helically, each time the wire fits in the guide groove, characterized in that it is possible to vary the exposed portion of the wire.

The high-speed electrodeposition wire manufacturing apparatus according to an embodiment of the present invention arranges a feeding roll so as to contact a wire that travels linearly between the two guide rolls and parallel to the axis of the guide roll, and the wire And the guide groove at each pitch, and the contact point acts as a feeding point.

In the high speed electrodeposition wire manufacturing apparatus according to the embodiment of the present invention, a plurality of guide grooves formed in the circumferential direction of the wire guide roll are provided at a constant pitch with respect to the roll axial direction, and at least the surface thereof is non-conductive. The two guide rolls, which are the same, are arranged with the guide roll axis parallel and the guide grooves shifted by a half pitch, and the two guide rolls are alternately shifted by half a pitch along the guide grooves while the wires are being moved. In a section where the guide roll and the wire are in contact with each other, the plating solution is in contact with the counter electrode and the wire in the section where the guide roll and the wire are in contact with each other. The wall of the guide groove is in contact with at least two lines parallel to the wire traveling direction, so that at least the wire with respect to the counter electrode Electrodeposition is performed in the section where the back part of the wire is shielded, and the exposed part of the wire changes every time the wire fits in the guide groove due to the axial rotation of the wire that occurs when the wire runs spirally It can be made to be characterized.

  According to the embodiment of the present invention, a part of the side surface of the wire is shielded from the counter electrode, and the plating is grown on the exposed portion, thereby increasing the current density even with the same input current and the same wire length. In addition, the abrasive grains can be fixed in a short section.

According to the embodiment of the present invention, when the guide groove is used, the electrodeposition plating part can be rotated by rotating the wire with respect to its axis, and the electrodeposition plating layer can be formed on the entire side surface of the wire. .

  According to the embodiment of the present invention, it is possible to take a plurality of feeding points by running wires arranged in a narrow pitch in a spiral and taking a feeding point for each loop of the spiral. Since the maximum current that can be input for each loop is determined, a large current can be input by increasing the number of spiral loops.

  According to the embodiment of the present invention, there is an effect that the structure of the electrodeposition portion can be reduced in size by running the wires arranged at a narrow pitch in a spiral manner.

  According to the embodiment of the present invention, it is easy to increase the manufacturing speed in electrodeposition wire manufacturing, and the manufacturing speed of several hundred mm or more per second and the size of the apparatus can be reduced.

It is a figure which shows the outline | summary of the electrodeposition wire manufacturing apparatus by one Embodiment of this invention. It is a conceptual diagram which shows the wire supply part in the plating tank by one Embodiment of this invention. It is the top view which looked at FIG. 2 from the top. It is detail drawing which shows the electrodeposition part of the electrodeposition wire manufacturing apparatus by one Embodiment of this invention. It is sectional drawing which shows the formation process of the electrodeposition plating layer by one Embodiment of this invention. It is sectional drawing which shows the formation process of the electrodeposition plating layer by a prior art. (A) is a conceptual diagram which shows the current pathway to the electrodeposition wire by embodiment of this invention, (b) is a conceptual diagram which shows the current pathway to the electrodeposition wire by a prior art example. It is an enlarged view of the electrodeposition wire manufactured by experiment. (A) is a figure which shows the state before the silicon ingot cutting | disconnection of the electrodeposition wire manufactured with electric current value 5A, (b) is a figure which shows the state after the silicon ingot cutting | disconnection of the electrodeposition wire manufactured with electric current value 5A. is there. (A) is a figure which shows the state before the silicon ingot cutting | disconnection of the electrodeposition wire manufactured by electric current value 8A, (b) is a figure which shows the state after the silicon ingot cutting | disconnection of the electrodeposition wire manufactured by electric current value 8A. is there. It is a figure which shows the state of the silicon ingot cut | disconnected by the electrodeposition wire manufactured with the electric current value 8A.

  Embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art (hereinafter, those skilled in the art) can easily understand the embodiments. The technical idea of the present invention is not limited to the embodiments disclosed herein, and can be applied to various forms. Detailed descriptions of widely known parts are omitted for simplicity.

  FIG. 1 is a diagram showing an outline of an electrodeposited wire manufacturing apparatus according to an embodiment of the present invention.

  The electrodeposition wire manufacturing apparatus 10 includes a pre-cleaning tank / pre-processing tank 20, a plating tank 30, a plating power source 40, a motor M, a pump P, and a final cleaning tank 50.

  In the pre-cleaning tank / pre-processing tank 20, the wire before plating is cleaned and pre-processed.

  In the plating tank 30, metal ions in the plating solution are reduced, and a plating film is grown on the wire.

  The plating power supply 40 supplies power for plating.

  The motor M rotates the guide roll whose non-conductive surface is at least described later for feeding the wire.

  The pump P circulates the plating solution in the plating tank.

  The final cleaning tank 50 cleans the electrodeposited wire after plating.

FIG. 2 is a conceptual diagram illustrating a wire supply unit in a plating tank according to an embodiment of the present invention.
FIG. 3 is a plan view of FIG. 2 viewed from above.
FIG. 4 is a detailed view showing an electrodeposition portion of the electrodeposition wire manufacturing apparatus according to the embodiment of the present invention.
2 to 4, the wire supply unit 100 in the plating tank 30 includes at least two guide rolls 120 whose surfaces are non-conductive, one power supply roll 130, and a counter electrode 140 that is an anode.

  The guide roll 120 has a narrow pitch guide groove 150 provided on the circumference of its side surface. Since the surface of the guide roll 120 is non-conductive, the guide groove 150 is also non-conductive to the wire. As the guide roll 120 rotates, the wire 160 wound along the guide groove 150 is caused to travel. Here, the “narrow pitch” refers to a pitch having an interval in which adjacent wires can travel without contact, and is at least 1.5 times the wire diameter.

  The power supply roll 130 contacts the wire 160, acts as a power supply point, and uses the wire as a cathode.

  Here, in order to flow a large current through a wire 160 such as a piano wire having a wire diameter of 200 μm or less, it is necessary to take feeding points at a plurality of locations. However, since the feeding point causes the fixed abrasive grains to fall off, it is necessary to pass the wire 160 through the contact in a sufficiently electrodeposition state. In order to shorten the distance between the feeding points and obtain a sufficient electrodeposition state in a short time, plating with a high current is essential.

  In the configuration shown in FIGS. 2 to 4, a plurality of guide grooves formed in the circumferential direction of the guide roll are provided at a constant pitch with respect to the axial direction of the roll, and at least two of the surfaces are nonconductive. The guide roll is arranged parallel to the guide roll axis and the guide groove is shifted by a half pitch, and the wire is spirally wound around the two guide rolls alternately while shifting by a half pitch along the guide groove. A wire is run by rotating the two guide rolls, and a feed roll is arranged in parallel with the axis of the guide roll so as to contact the wire running linearly between the two guide rolls, By making contact with each pitch of the wire and the guide groove, and a contact location acts as a feeding point, a plurality of feeding points can be taken. In addition, since the maximum current that can be input for each loop is determined, a large current can be input by increasing the number of spiral loops.

  In addition, according to the configuration shown in FIGS. 2 to 4, the structure of the electrodeposition portion can be reduced in size by running the wires 160 arranged in a narrow pitch in a spiral manner.

  Furthermore, by reducing the pitch between the wires 160, a larger number of wires can be processed at one time, so that the apparatus can be downsized.

A part of the side surface of the wire 160 in the circumferential direction is shielded by a shielding part, and the plating is grown on the remaining part, so that the current density is increased and shortened even with the same input current and the same wire length. Abrasive grains can be fixed thicker in the section.
Taking a large number of feeding points to realize a short electrodeposition interval has been described with reference to FIGS.
Hereinafter, a method of shielding a part of the side surface of the wire 160 with the guide groove 150 will be described with reference to FIGS.

FIG. 5 is a cross-sectional view showing a process of forming an electrodeposition plating layer according to an embodiment of the present invention.
FIG. 6 is a cross-sectional view showing a process of forming an electrodeposition plating layer according to the prior art.
Fig.7 (a) is a conceptual diagram which shows the current pathway to the electrodeposition wire by embodiment of this invention, (b) is a conceptual diagram which shows the current pathway to the electrodeposition wire by a prior art example.

  Referring to FIG. 5, the back surface of the wire 160 is shielded by the guide groove 150 with respect to the counter electrode 140 by the wires 160 and the walls of the guide groove 150 contacting at least two lines (two points in the sectional view). Then, the electrode is electrodeposited at least in a section where the back portion of the wire is shielded with respect to the counter electrode, and the wire is accommodated in the guide groove by the axial rotation of the wire generated when the wire travels spirally. Every time, the exposed portion of the wire is changed, and while traveling through a plurality of spiral loops, the electrodeposition plating layer 170 is formed on the entire circumference of the wire 160.

  On the other hand, in the conventional method shown in FIGS. 6 and 7B, since the electrodeposition plating layer 170 is simultaneously formed on the entire circumference of the wire 160, as shown in FIG. As a result, the current density D decreases.

The formation rate T of the electrodeposition plating layer 170 is proportional to the current density D, the length L of the wire immersed in the plating solution and forming a plating film, the number N of spiral loops, and inversely proportional to the wire speed V. And given by:

T∝D ・ L ・ N / V

That is, even if the current density is the same, the wire speed can be increased by A times by increasing the spiral loop count N by A times. For example, if the current density is 200 A / dm ² , the wire speed is 100 mm / sec, and the number of spiral loops is 10 times, double, 20 times, an equivalent electrodeposition wire can be manufactured at a double wire speed of 200 mm / sec. If it is 40 times, which is 4 times, an equivalent electrodeposition wire can be manufactured at a wire speed of 400 mm / sec. Furthermore, if the current density is doubled to 400 A / dm ² , an equivalent electrodeposition wire can be produced at a doubled wire speed of 800 mm / sec.

  On the other hand, by increasing the number of spiral loops of the wire, the thickness of the guide roll 120 becomes somewhat thicker, but if the guide groove 150 is formed at a narrow pitch, the increase in the height H is slight. For example, even if a groove is produced with a pitch twice as large as the wire diameter of φ200 μm, the groove pitch is 400 μm, 4 mm when the number of spiral loops is 10 times, and 16 mm when the number of spiral loops is 40 times, electrodeposition plating It can be seen that the size of the layer 170 is almost unchanged, and the plating method is excellent in miniaturization and high speed.

  In the case of a method in which a part of the side surface of the wire 160 is shielded by the guide groove 150, in order to form the electrodeposition plating layer 170 on the entire side surface of the wire 160, the wire 160 must be rotated with respect to the wire axis. . The rotation is such that the pitch of the guide grooves 150 formed on the side surfaces of the two guide rolls 120 around which the wire 160 is wound is shifted from each other in the axial direction of the guide rolls 120 so that the axis of the wire has an angle with respect to the guide grooves, By causing the wire to run and causing the wire 160 to rotate, the electrodeposition plating part can be rotated and the electrodeposition plating layer 170 can be formed all around.

In order to investigate the current density at which a good electrodeposited wire can be obtained, using two guide rolls with a non-conductive surface of φ100 mm, the structure shown in FIGS. An electrodeposited wire was manufactured by electrodeposition of 10 to 20 μm nickel-coated abrasive grains. As the plating bath, a nickel sulfamate plating bath was used. The experiment was carried out under the conditions of a distance of 150 mm between the two guide rolls, a guide roll diameter of 100 mm, a guide groove pitch of 5 mm, a spiral loop count of 10 times, a wire speed of 100 mm / sec, and a current value of 5 to 10A. At this time, the current density calculated from the distance at which the wire faces the counter electrode is 150 to 300 A / dm ² .

FIG. 8 shows an enlarged view of an electrodeposition wire manufactured by experiment.
As shown in FIG. 8, the electrodeposition plating layer was able to be formed in the whole wire periphery. The degree of abrasive grain concentration increased with increasing current value and plating time.

Using electrodeposition wires manufactured with current values of 5A and 8A, silicon was cut under the conditions of a wire feed rate of 200 mm / sec for cutting, a cutting time of 20 minutes, a feed rate in the depth direction of 10 μm / sec, and a total feed amount in the depth direction of 12 mm. An ingot cutting test was conducted.

FIG. 9A is a diagram showing a state before cutting a silicon ingot of an electrodeposited wire manufactured with a current value of 5A, and FIG. 9B shows a state after cutting the silicon ingot of an electrodeposited wire manufactured with a current value of 5A. FIG.
FIG. 10 (a) is a diagram showing a state before cutting a silicon ingot of an electrodeposited wire manufactured with a current value 8A, and FIG. 10 (b) shows a state after cutting the silicon ingot of an electrodeposited wire manufactured with a current value 8A. FIG.
The electrodeposition wire manufactured with a current value of 5A did not have sufficient electrodeposition strength and the electrodeposition plating layer dropped off, but the electrodeposition wire manufactured with a current value of 8A provided sufficient electrodeposition strength.

FIG. 11 shows a state of a silicon ingot cut by an electrodeposition wire manufactured with a current value of 8A.
It can be seen that the cutting depth is 12 mm, which is the same as the total feed amount in the depth direction, and has a sufficient cutting performance.
As a result, a good electrodeposition wire was obtained in a region having a current density of 200 A / dm ² or more.

  Here, the experiment was performed at a wire speed of 100 mm / sec during the production of the electrodeposited wire. However, as described above, the wire speed can be increased by increasing the number of spiral loops.

  In the above description, the example in which the length directions of the guide roll 120, the power supply roll 130, and the counter electrode 140 are in the vertical direction is shown, but the present application is not limited to this, and the guide roll 120, the power supply roll 130, and the counter electrode are not limited thereto. The length direction of 140 includes a case where it is oriented in the horizontal direction or a direction inclined from the horizontal.

DESCRIPTION OF SYMBOLS 10 Electrodeposition wire manufacturing apparatus 20 Pre-cleaning tank and pretreatment tank 30 Plating tank 40 Plating power supply 50 Final cleaning tank 100 Wire supply part in plating tank 120 Guide roll 130 Power supply roll 140 Counter electrode 150 Guide groove 160 Wire 170 Electrodeposition plating layer

Claims (4)

In a plating solution in which fine particles are dispersed, a wire is used as a cathode, a counter electrode is used as an anode, metal ions in the plating solution are reduced, a plating film is grown on the wire, and the fine particles are electrodeposited on the wire. A method of manufacturing an electrodeposited wire having an electrodeposited plating layer, wherein a current is shielded by a shielding portion in a circumferential direction of the wire with respect to the counter electrode, and the current is concentrated on an exposed portion of the wire. A step of growing the electrodeposition plating layer, rotating the wire with respect to its axis, rotating an exposed portion of the wire, and growing the electrodeposition plating layer on the entire circumference of the wire; ,
A guide groove is used as the shielding portion, and the wire and the wall of the guide groove are in contact with at least two lines parallel to the wire traveling direction, whereby the back portion of the wire is shielded against the counter electrode. A method for producing a high-speed electrodeposition wire, comprising: A guide roll of a roll-shaped wire, wherein a plurality of guide grooves formed in the circumferential direction are provided at a constant pitch with respect to the axial direction of the roll, and at least the surface thereof is non-conductive. The roll is arranged in parallel with the guide roll axis and the guide groove is shifted by a half pitch, and the wire is spirally wound around the two guide rolls alternately along the guide groove while being shifted by a half pitch. A method of manufacturing an electrodeposited wire by running a wire by rotating two guide rolls, where the plating solution is in contact with the counter electrode and the wire in a section where the guide roll and the wire are in contact with each other, Wire generated by electrodeposition being performed at least in a section where the back surface of the wire is shielded with respect to the counter electrode, and the wire traveling spirally By axial rotation, each time the wire fits in the guide groove, fast electrodeposited wire production method according to claim 1, characterized in that it is possible to vary the exposed portion of the wire. A power supply roll is arranged in parallel with the guide roll axis so as to contact the wire that runs linearly between the two guide rolls, and is in contact with each pitch of the wire and the guide groove. The high-speed electrodeposition wire manufacturing method according to claim 2 , which acts as a point. A plurality of guide grooves formed in the circumferential direction of the guide roll of the wire are provided at a constant pitch with respect to the axial direction of the roll, and at least the two guide rolls whose surfaces are non-conductive are connected to the guide roll spindle. The guide grooves are arranged parallel to each other with a half pitch, and the two guide rolls are alternately wound around the two guide rolls while being wound around the guide grooves by half a pitch, and the two guide rolls are rotated. In the section where the guide roll and the wire are in contact with each other, the plating solution is in contact with the counter electrode and the wire, and the wire and the wall of the guide groove are at least parallel to the wire running direction. By making contact with two wires, electrodeposition is performed on the counter electrode in a section where at least the back surface of the wire is shielded, and The axial rotation of the wire over occurs by running spirally, each time the wire fits in the guide groove, fast electrodeposited wire manufacturing apparatus characterized by capable of changing the exposed portion of the wire.

Images