JP6322962B2 - Electronics - Google Patents

Description

The technology of the present disclosure relates to an electronic device having a cooling function for causing a circulated refrigerant to absorb heat with respect to a heat-generating component housed in a case.

  Electronic devices that perform information processing use, for example, a large number of electronic components such as LSI (Large Scale Integration) and IC (Integrated Circuit) made of semiconductors. These electronic components generate heat due to information processing and become a high temperature state. However, if the temperature exceeds a limit temperature, thermal runaway or the like occurs, and information processing cannot be performed accurately and may be damaged. Electronic devices avoid the occurrence of thermal runaway of electronic components by installing a cooling mechanism for the electronic components that generate heat.

  For example, a cooling mechanism mounted on an electronic device may be a so-called liquid-cooled type in which an electronic component to be cooled is supplied with a liquid refrigerant or the like to exchange heat, and cooling air is circulated inside the electronic device. There is an air-cooled type that releases heat generated by heat-generating components to the outside. In addition, a cooling mechanism is known in which a heat absorption circuit is connected to a heat exchanger brought into contact with an electronic component, for example, and heat in the case is released by air cooling.

  With regard to such a cooling function, heat sinks and heat pipes are connected to the cooling body through which the refrigerant flows, and the heat collected by the heat sink fins and heat pipes is exchanged with the refrigerant in the cooling body to recover the heat in the equipment. What to do is known. (For example, Patent Documents 1 and 2).

JP 2008-60515 A JP 2010-199179 A

  By the way, an electronic device performs a liquid cooling process by bringing a cooling mechanism into contact with a specific electronic component among many electronic components inside, and the other electronic components dissipate heat inside the case, and the air is discharged outside the case. There is something to make. As an electronic device, for example, an electronic component that becomes high temperature is selected as an electronic component that performs liquid cooling. However, depending on the function and structure of the electronic component, there is an electronic device that cannot install heat absorption means by contact. Such an electronic component is cooled by heat dissipation using air cooling, but since the heat generation temperature is high, the temperature of the air in the entire case increases as the driving time of the electronic device elapses.

  Electronic devices have limited heat radiating means for radiating heat outside the case. If the temperature of the air in the case rises, the heat radiating efficiency of other low heat-generating components may be reduced, or heat radiation may not be possible. A conventional electronic device 100 includes a substrate 110 on which a plurality of electronic components are mounted in a case 102, for example, as shown in FIG. On the substrate 110, for example, a high heat generating component 104 and low heat generating components 106 and 108 are mounted. In the high heat generating component 104, for example, a cooling component provided with a heat sink 112 is installed in an exterior portion on the upper surface side, and a heat radiating fan 114 that is disposed in the vicinity of the cooling component or integrated with the cooling component is installed. This cooling component dissipates heat generated from the high heat generating component 104 to the air in the case 102. In the low heat generating component 106, for example, a cooling component 116 having a heat sink is installed in the exterior portion, and heat generated by driving is radiated to the air in the case 102. The low heat generating component 108 radiates heat, for example, from the exterior portion to the air in the case 102.

  The case 102 is provided with an air-cooling heat dissipating component 120 for discharging the air in the case 102 to the outside, for example, at a part of the exterior side. Some cases 102 include fans 124 and 126 that allow air to flow toward the air-cooling heat radiating component 120, and fans 128 that guide air from the air-cooling heat radiating component 120 to the outside of the case 102. In such an electronic device 100, if high-temperature air radiated from the heat generating components 104, 106, and 108 stays in the case 102, the temperature of the air in the case 102 increases, and the air cooling function may be deteriorated.

  In addition, there is a cooling mechanism in which, for example, an endothermic fin or a heat pipe that recovers heat in the case is installed in a cooling body that cools a specific electronic component, and the heat transferred by the cooling body exchanges heat with the refrigerant. . However, the cooling mechanism may not be able to absorb the refrigerant when the heat collected by the heat sink fins or the heat pipe is low when the temperature of the refrigerant increases as the specific electronic component in contact with the cooling mechanism becomes high. Furthermore, the heat absorption means for recovering the heat in the case transfers heat to the refrigerant through components such as heat absorption fins, heat pipes, and cooling bodies, for example, so that heat transfer loss increases and heat recovery efficiency is low. There is a problem of becoming.

Therefore, an object of the technology of the present disclosure is to efficiently transfer heat generated in the case to the refrigerant and improve the cooling function.

In order to achieve the above object, one aspect of the technology of the present disclosure includes a case storing a plurality of heat generating components, a flow path portion, a first heat absorbing portion, a second heat absorbing portion, and a heat radiating portion. The refrigerant flows through the flow path portion. The first heat absorbing portion contacts one or more heat generating components among the plurality of heat generating components, and causes the refrigerant flowing through the flow path to absorb heat generated from the heat generating components in contact therewith. The second heat absorption part is disposed downstream of the first heat absorption part with respect to the flow path part , and the heat generation component having the heat generation density of a heat generation part in which the first heat absorption part is not installed is equal to or higher than a set value. disposed proximate to the position, the heat emitted from the plurality of heat-generating components in the air inside the case, is absorbed by the refrigerant flowing in the flow path unit. The heat radiating part communicates with the flow path part outside the case, and releases heat of the refrigerant flowing through the flow path part. The case houses the flow path portion, the first heat absorption portion, and the second heat absorption portion.

  According to the technique of the present disclosure, any of the following effects can be obtained.

  (1) A heat recovery function from the air in the case is ensured, and the cooling function of the electronic device can be improved.

  (2) Since the heat absorption function is ensured and the temperature inside the case is not increased, it is possible to ensure the stability of the operation of the electronic device in which a large number of electronic components are arranged and to improve the reliability.

(3) The heat of the air in the collected case is directly transferred to the flow path, eliminating heat loss during the heat transfer process and improving the efficiency of the cooling function.

It is a figure which shows the structural example of the electronic device which concerns on 1st Embodiment. It is a figure which shows the structural example of an electronic device. It is a figure which shows an example of the circulation state and heat dissipation state of the air in a case. It is a figure which shows an example of the temperature change of a refrigerant | coolant. It is a figure which shows an example of the cooling state in case there exist multiple high heat-emitting components. It is a figure which shows the structural example of the electronic device which concerns on 2nd Embodiment. It is a figure which shows the example of a state which set the flow direction of the air in a case. It is a figure which shows the cooling control block of the electronic device which concerns on 3rd Embodiment. It is a figure which shows the computer structural example of an electronic device. It is a flowchart which shows an example of cooling control. It is a figure which shows the structural example of the electronic device which concerns on 4th Embodiment. It is a figure which shows the cooling control block of an electronic device. It is a flowchart which shows an example of cooling control. It is a figure which shows the structural example of the conventional electronic device.

  Other aspects, features, and advantages of the technology of the present disclosure are not limited to the contents described above, and will become more apparent with reference to the accompanying drawings and each embodiment.

  [First Embodiment]

  FIG. 1 shows a configuration example of an electronic device according to the first embodiment.

  The electronic device 2 includes, for example, a plurality of heat generating components including a high heat generating component 6 and a low heat generating component (not shown) in the case 4. The electronic device 2 is installed in, for example, the high heat generating component 6 or a first heat absorbing portion 10 disposed in the vicinity thereof, and a second heat absorbing portion 12 connected to the first heat absorbing portion 10 by a heat absorbing pipe line 16. Formed. In addition, the electronic device 2 includes a heat radiating portion 14 outside the case 4. The heat radiating part 14, the first heat absorbing part 10 and the second heat absorbing part 12 in the case 4 are connected by a refrigerant pipe 16. The first heat absorbing unit 10, the second heat absorbing unit 12, and the heat radiating unit 14 connected by the refrigerant pipe 16 form a cooling mechanism 8 of the electronic device 2 by circulating the refrigerant 18 through the refrigerant pipe 16. . The electronic device 2 includes, for example, a PC (Personal Computer), a server device, a communication base station that forms a communication network such as a mobile phone network and the Internet, or other information processing devices including a computer.

  The case 4 is formed of, for example, a so-called closed type or hermetically sealed container that houses therein the electronic components forming the electronic device 2 and a part of the cooling mechanism 8 and blocks the intrusion of foreign matter and the inflow or discharge of air therein. Has been. In the case 4, for example, an insertion hole through which the refrigerant pipe 16 is inserted is formed in part. Electronic devices 2 that house closed or sealed containers can include fish detectors used on ships and communication devices used in radio base stations installed outdoors. The electronic device 2 to be stored may be used.

  The high heat generating component 6 is an example of a plurality of electronic components that drive the electronic device 2, and includes, for example, an electronic component that generates a large amount of heat due to execution of arithmetic processing or the like. The high heat generating component 6 includes, for example, one having the highest heat generation density, which is a heat generation amount per unit area, and includes one or a plurality of electronic components having a heat generation density equal to or higher than a predetermined set value.

  The cooling mechanism 8 is an example of means for cooling electronic components mounted in the case 4 by the refrigerant 18 that has flowed into the refrigerant pipe 16. This refrigerant pipe line 16 is an example of a flow path part of the present disclosure, and by causing the refrigerant 18 to flow inside, the refrigerant 18 absorbs heat in the first heat absorption part 10 and the second heat absorption part 12, and the heat radiation part 14 side. A flow path is formed for heat transfer toward the surface.

  The first heat absorption unit 10 is an example of a unit that makes contact with the set high heat-generating component 6 or absorbs heat by the refrigerant 18 in the refrigerant line 16 that is arranged and connected in the vicinity of the heat receiving part 6 and is a heat source. It absorbs heat directly from the high heat generating component 6. The first heat absorbing unit 10 transfers heat Q1 generated by driving or in close contact with the high heat generating component 6 to the refrigerant 18 to absorb the heat. The first heat absorption unit 10 functions as a heat exchanger that exchanges heat of the heat-transferred high heat-generating component 6 with the low-temperature refrigerant 18.

  The second heat absorbing portion 12 is an example of means for recovering heat Q2 radiated in the case 4 and absorbing the heat to the refrigerant 18, for example, and indirectly through the air in the case 4 to the heat-generating component that is a heat source. Endothermic. The heat Q2 recovered by the second heat absorbing unit 12 includes, for example, heat radiated from a plurality of electronic components (not shown) that cause the electronic device 2 to function, as well as heat released by the high heat generating component 6 to the air in the case 4. May be included. The second heat absorption unit 12 is installed in series on the refrigerant pipe 16 on the downstream side of the first heat absorption unit 10 with respect to the flow direction of the refrigerant 18.

  The heat dissipating part 14 is an example of a unit that communicates with the refrigerant pipe 16 outside the case 4 and dissipates the heat of the refrigerant 18 heated by the heat absorption by the first heat absorbing part 10 and the second heat absorbing part 12. The heat radiating section 14 is formed of, for example, a radiator, and radiates heat by exchanging heat with low-temperature outside air while allowing the refrigerant 18 to flow inside.

  The cooling mechanism 8 circulates the refrigerant 18 through the heat absorbing portions 10 and 12 and the heat radiating portion 14 through the refrigerant pipe 16 and repeats heat absorption and heat dissipation to maintain the cooling function. The temperature of the is maintained at a low temperature.

  Since the heat conductivity of the refrigerant 18 is better than that of air, the heat generated in the case like the present electronic device 2 is used as the refrigerant rather than the air cooling in which the heat of the air in the case is discharged outside the case by the heat sink as in the prior art. The liquid cooling that absorbs heat and discharges it outside the case is more efficient.

  <Configuration Example of Electronic Device 2>

  FIG. 2 shows an internal configuration example of the electronic device 2.

  In the electronic device 2, the temperature of the electronic component installed in the case 4 and the internal temperature of the case 4 are equal to or lower than a set value by causing the refrigerant 18 that flows inside the refrigerant pipe 16 disposed in the sealed case 4 to absorb heat. To lower. The case 4 includes a substrate 20 on which a pattern for electrically connecting, for example, electronic components and peripheral devices (not shown) is formed. For example, computer functional components of the electronic device 2 are mounted on the substrate 20.

  For example, a control chip 22 set as a high heat-generating component is mounted on the substrate 20. The control chip 22 is formed of, for example, an LSI or an IC, and includes a processor that generates heat upon execution of arithmetic processing. In the control chip 22, for example, a cooling plate 24 is installed on the upper side which is a heat radiating surface. The cooling plate 24 is an example of the first heat absorption unit 10 of the present disclosure, and the refrigerant pipe 16 communicates with the refrigerant 18 to flow inside.

  The cooling plate 24 is formed of, for example, a metal having high thermal conductivity, and is formed in a planar shape in which at least one side can be in close contact with the heat dissipation surface of the control chip 22. For example, the cooling plate 24 inserts the refrigerant pipe 16 therein, or causes the refrigerant 18 to flow therein to exchange heat between the heat released from the control chip 22 and the refrigerant 18. Here, as the refrigerant 18, for example, a liquid having good heat absorption such as water, alcohol, or antifreeze may be used.

  For example, a chip component 26 set as a low heat-generating component and other mounting components 28 are mounted on the substrate 20. The chip component 26 is formed of, for example, an LSI or an IC like the control chip 22. The chip component 26 and the mounting component 28 are lower in temperature, power consumption, and heat generation density than the control chip 22, and even when driven, they are below the allowable temperature. In addition, the chip component 26 may be set as a low heat generation component based on, for example, the frequency used for arithmetic processing or the like for functions mounted on the electronic device 2 and whether or not the cooling plate 24 can be installed. The chip component 26 may be provided with, for example, a heat sink 30 on the upper surface side, which is a part of the heat radiating surface, for expanding the heat radiating area for the air in the case 4.

  On the refrigerant line 16, an endothermic radiator 32 is formed as the second endothermic part 12 on the downstream side of the cooling plate 24. The endothermic radiator 32 is provided with, for example, a multi-layered bent portion in a part of the refrigerant pipe 16, and an endothermic fin for increasing the contact area with the air in the case 4 around the end. In addition, the heat absorption radiator 32 includes a fan 34 for efficiently bringing the air in the case 4 into contact with the heat absorption fin side, for example. Thereby, the heat absorption radiator 32 absorbs heat by exchanging heat contained in the refrigerant 18 flowing inside and the air in the case 4. The refrigerant 18 that has absorbed heat by the endothermic radiator 32 flows out of the case 4.

  An exhaust heat radiator 36 is formed outside the case 4 as a heat radiating portion of the refrigerant 18. The exhaust heat radiator 36 forms a bent portion in the refrigerant pipe 16, and exhaust heat fins are formed around the bent portion to exchange heat between the outside air and the refrigerant 18. Further, the exhaust heat radiator 36 may be provided with an exhaust heat fan 38 that forcibly flows outside air so that the heat dissipation efficiency is improved with respect to the heat dissipation fins, for example.

  The refrigerant pipe 16 communicates with the inside of the case 4 again from one end side of the exhaust heat radiator 36. In the case 4, for example, a sealing means such as packing may be provided around a hole through which the forward side and the return side of the refrigerant pipe 16 are inserted while maintaining internal sealing.

  In addition, for example, a pump 40 or a refrigerant tank 42 for forcibly flowing the refrigerant 18 may be provided on the refrigerant pipe 16. The pump 40 is an example of a means for controlling the circulation flow rate of the refrigerant 18 as a flow means of the present disclosure. The refrigerant tank 42 functions as a so-called sys- tern that constantly stores a certain amount of the refrigerant 18 inside and adjusts the amount of the refrigerant 18 that flows into the refrigerant pipe 16, for example, and in the refrigerant pipe 16 that leads to the pump 40 side. Air bubbles are prevented from entering, and the occurrence of air jamming of the pump 40 is avoided.

  A case fan 44 that allows the air in the case 4 to flow in a predetermined direction is set in the case 4. When the case fan 44 is installed on the upper side of the case 4 as shown in FIG. 3, for example, the air can flow in the entire case 4. The electronic device 2 may set the installation position of the heat absorption radiator 32 according to the air flow state set by the case fan 44, for example. That is, the heat absorption radiator 32 can be efficiently absorbed with respect to the heat radiation from the chip component 26 and other mounting components 28 by being installed in accordance with the air convection path, for example. Further, the installation position of the case fan 44 may be set in the case 4 in accordance with, for example, the installation position of the substrate 20 or the installation state of the heat absorption radiator 32.

  <Regarding temperature change of refrigerant 18>

  FIG. 4 is a diagram illustrating an example of a temperature change of the refrigerant.

  The electronic device 2 absorbs heat from the control chip 22 that generates high heat on the upstream side of the refrigerant pipe 16 by the cooling mechanism 8, subsequently absorbs heat from the air in the case 4, and moves to the exhaust heat radiator 36 outside the case 4. Let The refrigerant 18 flows at the lowest temperature t1 at the flow position a (FIG. 2) before flowing into the cooling plate 24 disposed on the upstream side of the refrigerant pipe 16, for example. The temperature t <b> 1 is cooled by heat dissipation from the exhaust heat radiator 36, and thus is lower than the temperature of the air in the case 4. The refrigerant 18 passes through the cooling plate 24 and absorbs heat, so that the temperature rises and reaches the predetermined temperature t2 at the flow position b (FIG. 2) discharged from the cooling plate 24. In the electronic device 2, heat is absorbed by, for example, each heat absorbing portion, and heat radiation and heat absorption during the flow of the refrigerant pipe 16 are small.

  Next, the refrigerant 18 absorbs heat from the air in the case 4 while passing through the endothermic radiator 32 and is further heated. Since the air in the case 4 does not have a high heat generation density such as the control chip 22, the heating change of the refrigerant 18 becomes gentle. The refrigerant 18 that has passed through the endothermic radiator 32 reaches the highest temperature t3 and is guided to the exhaust heat radiator 36 side outside the case 4. Then, the refrigerant 18 that has passed through the exhaust heat radiator 36 and has been radiated and cooled down again flows to the upstream side of the refrigerant pipe 16.

  The electronic device 2 uses the fact that the heat absorption capacity is higher as the refrigerant temperature is lower, that is, the temperature difference from the object to be cooled is larger, and the high-temperature control chip 22 is cooled upstream of the refrigerant pipe 16. By assigning a high cooling capacity to the control chip 22 that becomes high in temperature first, for example, heat radiation from the control chip 22 is minimized, and air in the case 4 is prevented from becoming high temperature. In the electronic device 2, for example, the temperature t <b> 2 of the refrigerant 18 after passing through the cooling plate 24 is set to be lower than the air in the case 4. Since the heat absorption capability of the refrigerant 18 depends on, for example, the contact area and flow rate of the refrigerant 18 with respect to the heat generation target, the flow rate of the refrigerant 18 is set so that (temperature of the air in the case 4)> (refrigerant temperature t2). Just do it.

  <Cooling mechanism with multiple high heat generation parts>

  FIG. 5 shows an example of a cooling state in the case where there are a plurality of high heat generating components.

For example, as shown in FIG. 5A, the electronic device 2 may include a plurality of cooling plates 24 as the first heat absorbing unit 10, and these cooling plates 24 may be installed in different electronic components to absorb heat. The electronic device 2 is, for example, an electronic component having a heat generation density indicating a heat generation amount per area of a large number of electronic components mounted therein, and requires high cooling performance by the first heat absorbing unit 10. What is necessary is just to select the thing as the high heat-emitting components 6A and 6B, and to install the cooling plate 24. For example, as shown in FIG. 5B, the high heat generating components 6A and 6B require a high cooling performance because the heat generation density value ρ _A of the high heat generation component _A is larger than the heat generation density value ρ _{B of the} high heat generation component B. It becomes. At this time, the cooling mechanism arranges the refrigerant pipe 16 in series in the order of the high heat generating component 6A and the high heat generating component 6B, for example, as the first heat absorbing unit 10. In other words, the cooling mechanism cools components in order starting from parts having high cooling performance required in the first heat absorbing unit 10.

  The refrigerant 18 flowing through the refrigerant pipe 16 has the lowest temperature a1 before flowing into the high heat-generating component 6A, and the refrigerant 18 becomes the temperature a2 by being heated by the high heat-generating component 6A. And the refrigerant | coolant 18 of temperature a2 is guide | induced to the highly heat-emitting component 6B side, is heat-exchanged, and is discharged | emitted from the 1st heat absorption part 10 at the temperature b. As described above, the temperature b of the refrigerant 18 at this time is set lower than the temperature of the air in the case 4 that absorbs heat by the endothermic radiator 32 that is the second endothermic unit 12. The cooling mechanism 8 may increase the flow amount of the refrigerant 18 when the first heat absorbing unit 10 cools the plurality of high heat generating components 6A and 6B, for example.

  The exhaust heat radiator 36 constituting the cooling mechanism 8 is not limited to the case where the exhaust heat radiator 36 is installed outside the case 4 and connected by the refrigerant pipe 16, and may be integrally formed with the case 4.

  According to such a configuration, heat recovery from the air in the case 4 can be reliably performed, and the cooling function of the electronic device 2 can be improved. Since the heat absorption function is ensured and the temperature inside the case 4 is not raised, even when a large number of electronic components are arranged or when the case 4 with a high degree of sealing is used, the stability of the operation of the electronic device 2 is ensured. Reliability can be increased. The recovered heat of the air in the case 4 is directly transferred to the refrigerant pipe 16, eliminating a heat loss in the heat transfer process, and improving the efficiency of the cooling function.

  [Second Embodiment]

  6 and 7 show examples of the configuration of the electronic device according to the second embodiment.

  An electronic device 50 illustrated in FIG. 6 is an example of the electronic device according to the present disclosure, and the heat absorption radiator 32 that absorbs heat from the air in the case 4 is disposed close to the chip component 26 that is a heat generation component. In the electronic device 50, the arrangement position of the case fan 44 and the flow direction of the air flowing in the case 4 are set according to the installation position of the heat absorption radiator 32 in the case 4. The electronic device 50 is set for the case fan 44 so that the heat absorption radiator 32 is positioned on the air flow path in the case 4 in order to increase the flow rate of the air brought into contact with the heat absorption radiator 32, for example.

  The chip component 26 includes, for example, a component that is driven at a predetermined temperature or lower, and a high heat generating component that is driven at a temperature higher than the predetermined temperature, and that cannot be installed with the cooling plate 24 due to its structure. When such a chip component 26 dissipates heat in the case 4, the temperature of the air in the case 4 rises. In particular, the air in the case 4 is circulated by the case fan 44 and the temperature in the case 4 becomes uniform as time elapses, so that the temperature in the entire case 4 rises. When the temperature of the air in the case 4 rises, the temperature difference between the heat radiation temperature of the mounting component 28, which is a low heat-generating component, and the air temperature becomes small, and the cooling function due to heat radiation may be reduced.

  Therefore, the electronic device 50 prevents heat from being circulated in the case 4 by absorbing heat in the vicinity of the chip component 26 that generates a large amount of heat among the electronic components that perform heat radiation cooling. The heat absorption radiator 32 and the fan 34 are formed, for example, at a predetermined position P2 opposed to the mounting position P1 of the specific chip component 26 and the heat sink 30 on the substrate 20 in the heat dissipation direction. The endothermic radiator 32 can prevent high-temperature heat radiation into the case 4 as the distance to the heat sink 30 is shorter.

  The case fan 44 installed in the case 4 adjusts the air direction and the air volume so that the air in the case 4 flows, for example, on the side surface side of the endothermic radiator 32. The case fan 44 is disposed, for example, at the same height as the predetermined position P2 in the case 4 and causes the air to flow in the horizontal direction in the case 4. The flow direction of the air is set so that, for example, the air radiated from the other mounting components 28 is passed to the side surface of the bent portion of the heat absorbing radiator 32.

  Further, the case fan 44 is installed at a position away from the specific chip component 26, for example. As a result, the case fan 44 does not retain air in a part of the case 4, pushes it out to the endothermic radiator 32, and suppresses air flow between the heat sink 30 and the endothermic radiator 32. The electronic device 20 does not cause a large flow of air between the heat sink 30 and the heat absorption radiator 32, so that high-temperature air due to heat radiation from the heat sink 30 is caused to flow away from the heat absorption fan 44 and is released into the case 4. Is avoided.

  In addition, the case fan 44 may be driven at a lower speed than, for example, the fan 34 that causes air to flow toward the endothermic radiator 32.

  <Example of setting the direction of air flow in the case>

  For example, as shown in FIG. 7, wind direction plates 52 and 54 may be installed in the electronic device 50 as wind direction means for setting the flow direction of air in the case 4. The wind direction plates 52 and 54 may be formed integrally with the case 4, for example, or may be installed on the substrate 20 or other mounting components. The airflow direction plate 52 divides the air convected by the case fan 44 in the vertical direction, for example, causes one to flow toward the heat sink 30, and the other flows toward the heat absorption radiator 32.

  As a result, the airflow direction plate 52 reduces or blocks the flow of air between the heat sink 30 and the endothermic radiator 32. Further, the wind direction plate 54 prevents the high-temperature air from diffusing in the case 4 by directing air that has passed through the heat sink 30 toward the endothermic radiator 32, for example.

  In addition, the electronic device 50 may include a wind direction plate that directs air flowing in the case 4 by the case fan 44 or other fans.

  According to such a configuration, the function of recovering heat from the air in the case 4 is ensured, and the cooling function of the electronic device 50 can be improved. Since the temperature inside the case 4 is not increased, the stability of the operation of the electronic device 50 can be ensured and the reliability can be improved. By causing the heat of the air in the case 4 to directly transfer to the refrigerant pipe 16, heat dissipation loss in the heat transfer process is eliminated, and the efficiency of the cooling function is improved. Since heat is recovered in the vicinity of the heat radiation position and high temperature air is not diffused into the case 4 and the exterior temperature of the case 4 is not increased, safety when the user of the electronic device 50 contacts the case 4 is ensured. Can do.

  [Third Embodiment]

  FIG. 8 shows an example of the cooling control function of the electronic device according to the third embodiment.

  The electronic device 60 is an example of the electronic device according to the present disclosure, and includes a cooling control function that combines, for example, heat recovery of a highly heat-generating component by the cooling plate 24 and heat absorption from the air in the case 4 by the heat absorption radiator 32. This cooling control function includes, for example, the temperature control of the refrigerant 18 flowing into the heat absorption radiator 32 connected in series on the refrigerant pipe 16 with respect to the cooling plate 24 and the adjustment function of the cooling function with respect to the temperature of the heat generating component.

  For example, as shown in FIG. 8, the electronic device 60 includes a control unit 62, a storage unit 64 in which a control table 66 including control information and the like is stored, and a temperature sensor 68 installed in the high heat generating component 6.

  The control unit 62 is an example of a unit that executes cooling control. For example, the control unit 62 may include a control function that executes only cooling control, or may use a functional unit that controls the entire function of the electronic device 60. . For example, the control unit 62 uses the temperature information acquired by the temperature sensor 68 to output a control command calculated based on the control table 66 to the pump 40, the fan 34, and the case fan 44.

  The storage unit 64 is an example of means for storing a program and acquired data, and is formed of, for example, a ROM (Read Only Memory), a semiconductor memory, or other non-volatile memory. For example, in addition to the control table 66, the storage unit 64 stores an OS (Operating System) for operating the electronic device 60, other operation control programs, application programs, and the like.

  The temperature sensor 68 is an example of a temperature detection unit of the present disclosure, and detects the heat generation temperature of the high heat generation component 6 or the temperature of the refrigerant 18 heated by the high heat generation component 6. For example, the temperature sensor 68 may be in direct contact with the high heat-generating component 6 or may be installed in the vicinity thereof. Further, the temperature sensor 68 may be laminated, for example, between the high heat generating component 6 and the cooling plate 24. The heat radiation temperature of the high heat generating component 6, the temperature of the radiated air, the contact surface of the cooling plate 24 that has absorbed heat or the cooling. What is necessary is just to detect the temperature of the refrigerant 18 that absorbs heat in the plate 24.

  The control table 66 includes, for example, flow control information of the refrigerant 18 and rotation control information of the fan 34 and the case fan 44 set in advance by experiments or the like for the detected temperature information. The control table 66 may include information such as the arrangement length and pipe diameter of the refrigerant pipe line 16, volume information of the case 4, and the number of mounted parts in the case 4.

  <Regarding Computer Configuration Example of Electronic Device 60>

  FIG. 9 shows a configuration example of a computer of the electronic device 60.

  The computer 70 is an example of hardware that constitutes a control function of the electronic device 60, and includes, for example, a processor 72, a memory 74, a storage unit 64, a display unit 76, and an interface 78, and is electrically connected by a bus 80. The

  The processor 72 is an example of a functional component that executes arithmetic processing such as an OS for operating the electronic device 60, other control programs, and firmware, and forms a control unit 62. For example, the processor 72 expands the control table 66 stored in the storage unit 64 on the memory 74 and executes arithmetic processing. The processor 72 may be the high heat-generating component 6 that is cooled by the cooling plate 24 of the cooling mechanism, for example.

  The memory 74 is an example of a unit that functions as a work area for executing an OS, firmware, and other operation control programs, and is formed of, for example, a RAM (Random Access Memory).

  The display unit 76 is an example of a notification unit that notifies the cooling control information, for example. The display unit 76 may use, for example, a monitor connected to the electronic device 60, or may be a display lamp that indicates that cooling control has been executed.

  The interface 78 is an example of means for electrically or physically connecting to an external device. For example, the interface 78 transmits and receives data and control information to and from the temperature sensor 68, the pump 40, the fan 34, and the case fan 44. Functions as (Input / Output) section.

  <About cooling control>

  FIG. 10 is a flowchart illustrating an example of the cooling control process.

  This cooling control is an example of a cooling control method or a cooling control program for electronic equipment, and is executed by the computer 70. As shown in FIG. 10, for example, the cooling control includes a refrigerant temperature monitoring process and a cooling function adjusting process.

  In the cooling control, for example, when the electronic device 60 is activated (S1), the cooling mechanism 8 is activated in response to the activation (S2). The activation of the cooling mechanism 8 includes, for example, reading of the cooling control program and starting processing of the exhaust heat fan 38 in addition to the pump 40, the fan 34, and the case fan 44.

  The control unit 62 acquires temperature information from the temperature sensor 68 (S3) and reads the control table 66 from the storage unit 64 (S4).

  <Refrigerant temperature monitoring process>

  As the refrigerant temperature monitoring process, the controller 62 determines whether or not the acquired temperature information is equal to or lower than a set temperature (S5). The set temperature information is set based on, for example, the cooling performance with respect to the flow rate of the refrigerant 18 set in the pump 40 and the operation set values of the fan 34, the case fan 44, and the exhaust heat fan 38.

  As a result of the determination, when the detected temperature is higher than the set temperature (NO in S5), the control unit 62 determines whether the pump 40, the fan 34, the case fan 44, or the exhaust heat fan 38 is based on the set value of the control table 66. An instruction to increase the operation is given (S6). That is, when the detected temperature is higher than the set temperature, the control unit 62 determines that the cooling capacity with respect to the heat generation temperature is low, and increases the cooling capacity. In the control table 66, for example, control information related to the rotational speed of the pump 40, the fan 34, the case fan 44, and the exhaust heat fan 38 is set according to the detected temperature. The cooling capacity set in the control table 66 is set such that the temperature of the refrigerant 18 that has passed through the cooling plate 24 is lower than the temperature set as the temperature in the case 4. The temperature in the case 4 may be set based on information such as the number of chip components 26 and other mounting components 28 installed in the electronic device 60 and the amount of heat exhausted during driving.

  When the detected temperature is equal to or lower than the set temperature (YES in S5), the cooling capacity is sufficient, and the control unit 62 proceeds to, for example, a cooling function adjustment process.

  In addition, in order to increase the cooling capacity, the pump 40, the fan 32, the case fan 44, and the exhaust heat fan 38 may be controlled together, or the increase control may be performed by combining them. In the increase control, for example, a combination of objects to be controlled may be set according to a cooling capacity that is insufficient with respect to the detected temperature.

  <Cooling function adjustment processing>

  In the adjustment process, for example, the control unit 62 determines whether or not the detected temperature is equal to or lower than the set minimum temperature (S7). For this minimum temperature, for example, a predetermined value is set as a threshold value in a temperature range in which stable operation can be performed with respect to the surface temperature of the high heat-generating component 6 and the surrounding refrigerant 18. In other words, the cooling mechanism can maintain the object to be cooled at a low temperature, for example, if it is operated at the maximum capacity, but if the heat generating component is cooled to a temperature lower than an allowable temperature, an excessive cooling process is performed. If such an excessive cooling process is executed, the electronic device 60 causes an increase in power consumption due to the cooling mechanism and an increase in noise due to high-speed operation of the pump 40, the fan 34, the case fan 44, and the exhaust heat fan 38. Therefore, in this adjustment process, a minimum temperature for the detected temperature is set, and the cooling function for the heat generation temperature is optimized based on this temperature.

  When the detected temperature is higher than the minimum temperature (NO in S7), it is determined that the cooling mechanism is operating with an appropriate capacity, and the process proceeds to a refrigerant temperature monitoring process.

  If the detected temperature is equal to or lower than the minimum temperature (YES in S7), it is determined that the cooling mechanism is operating with an excessive capacity, and the pump 40, the fan 34, and the case fan 44 are discharged based on the control table 66. The operating capacity of the heat fan 38 is reduced, and the flow rate of the refrigerant 18 is reduced (S8). When the adjustment of the operation capacity is completed, the cooling mechanism shifts again to the refrigerant temperature monitoring process.

  According to such a configuration, the electronic device 60 can perform the cooling control with the optimum cooling capacity based on the temperature information detected from the high heat-generating component 6. Further, the electronic device 60 can stabilize the temperature in the case 4 by adjusting the temperature of the refrigerant 18 using the control table 66 and maintaining the heat absorption function of the heat absorption radiator 32. Thereby, the stability of the operation of the electronic device 60 can be ensured and the reliability can be improved. The recovered heat of the air in the case 4 is directly transferred to the refrigerant pipe 16, eliminating a heat loss in the heat transfer process, and improving the efficiency of the cooling function.

  [Fourth Embodiment]

  FIG. 11 shows a configuration example of an electronic apparatus according to the fourth embodiment.

  The electronic device 60 shown in FIG. 11 performs cooling control based on the heat absorption capability of the heat absorption radiator 32 and includes, for example, temperature monitoring of the refrigerant 18 and temperature monitoring of the air in the case 4. In the cooling mechanism, for example, a temperature sensor 82 is installed on the refrigerant pipe 16 between the cooling plate 24 and the endothermic radiator 32 in order to monitor the temperature of the refrigerant 18 that has passed through the cooling plate 24. The electronic device 60 is provided with a temperature sensor 84 in the vicinity of the intake side of the heat absorption radiator 32. The temperature sensor 84 is an example of a case temperature detection unit of the present disclosure.

  In the electronic device 60, for example, as shown in FIG. 12, the control unit 62 takes in the temperature information of the refrigerant 18 flowing in the refrigerant pipe 16 from the temperature sensor 82, and the temperature information of the air in the case 4 from the temperature sensor 84. Capture. Then, the controller 62 adjusts the heat absorption capacity of the air in the case 4 according to the temperature of the refrigerant 18 supplied to the heat absorption radiator 32. In this adjustment process, the operation control of the pump 40, the fan 32, the case fan 44, and the exhaust heat fan 38 is performed based on whether or not the heat absorption radiator 32 can absorb heat or based on the heat absorption capability.

  <About cooling control>

  FIG. 13 is a flowchart illustrating an example of cooling control.

  This cooling control is an example of a cooling control method and a cooling control program for the electronic device 60, and is executed by the computer 70 described above. In the cooling control, for example, when the electronic device 60 is activated (S11), the cooling mechanism is activated in response to the activation (S12). The activation of the cooling mechanism includes, for example, reading of the cooling control program and starting processing of the exhaust heat fan 38 in addition to the pump 40, the fan 34, and the case fan 44.

  When the control unit 62 of the cooling mechanism acquires the temperature information of the refrigerant 18 and the temperature information of the air in the case 4 from the temperature sensors 82 and 84 (S13), the refrigerant temperature adjustment in the endothermic radiator 32 is performed.

  Based on the acquired temperature information, the control unit 62 determines whether or not the temperature in the case 4 is higher than the detected temperature of the refrigerant 18 (S14). That is, in this process, it is determined whether or not an endothermic heat treatment by the endothermic radiator 32 can be performed in the current operation setting of the cooling mechanism.

  When the temperature in the case 4 is higher than the temperature of the refrigerant 18 (YES in S14), the heat absorption by the heat absorption radiator 32 is possible, so the flow rate setting of the pump 40 is maintained (S15) and temperature monitoring is continued.

  When the temperature in the case 4 is lower than the temperature of the refrigerant 18 (NO in S14), the endothermic radiator 32 cannot absorb heat from the air in the case 4. Therefore, the control unit 62 increases the flow rate of the refrigerant 18 that is flowed by the pump 40 (S16), and increases the circulation amount of the refrigerant 18 so that the temperature of the refrigerant 18 that has passed through the cooling plate 24 becomes low, thereby increasing the cooling function. Plan.

  Also in this embodiment, as described above, it may be determined whether or not the cooling function of the cooling mechanism is excessive and adjustment processing is performed.

According to such a configuration, the endothermic function in the endothermic radiator 32 is monitored and maintained in a state where an endothermic heat treatment can be performed, a function of recovering heat from the air in the case 4 is ensured, and the cooling function of the electronic device 60 is improved. Can be made. Since the heat absorption function is secured and the temperature inside the case 4 is not raised, the stability of the operation of the electronic device in which a large number of electronic components are arranged and the electronic device using the case with a high sealing degree is secured and the reliability is improved. Can do. Further, by not increasing the temperature in the case 4, the amount of heat released from the surface of the case is reduced, and it is possible to improve safety without causing burns or the like against the user's contact with the case 4.
With respect to the embodiment described above, the features and modifications thereof are listed below.

  (1) In the above embodiment, an information processing apparatus such as a PC, a server apparatus, or a communication base station has been described as an electronic device, but the present invention is not limited thereto. The electronic device may be used for, for example, a mobile phone or a tablet terminal device.

  (2) In the above embodiment, the case where the heat radiating portion 14 is formed only on the downstream side of the refrigerant pipe 16 in the cooling mechanism 8 is shown, but the present invention is not limited to this, and a plurality of the heat radiating sections 14 are formed on the refrigerant pipe 16. Also good.

  (3) In the above embodiment, it has been shown that the rotation control of the pump 40, the fan 34, and the like is performed based on the detected temperature in the cooling control. The electronic device 60 may notify the display unit 76 that the cooling function is deteriorated or not in a sufficient state, for example, as a result of the rotation control performed by the cooling mechanism 8.

  Next, the following additional notes are disclosed with respect to the embodiment described above. The technology of the present disclosure is not limited to the following supplementary notes.

(Appendix 1) A case containing a plurality of heat generating components;
A flow path section through which the refrigerant flows;
A first heat-absorbing part that contacts one or more heat-generating parts among the plurality of heat-generating parts and absorbs heat generated from the heat-generating parts in contact with the refrigerant flowing through the flow path part;
A second heat absorbing portion that is formed on the downstream side of the flow path portion with respect to the first heat absorbing portion and absorbs heat released from the plurality of heat generating components to the air in the case by the refrigerant flowing through the flow path portion. When,
A heat dissipating part that communicates with the flow path part outside the case and releases heat of the refrigerant flowing through the flow path part;
With
The electronic device according to claim 1, wherein the case houses the flow path portion, the first heat absorption portion, and the second heat absorption portion.

  (Supplementary note 2) The second heat absorption part is characterized in that heat released to the air in the case from a heat generating component not in contact with the first heat absorption part is absorbed by the refrigerant flowing through the flow path part. The electronic device according to attachment 1.

  (Supplementary note 3) The amount of heat generated from the heat-generating component in contact with the first heat-absorbing part is larger than the amount of heat generated from a heat-generating component not in contact with the first heat-absorbing part. Electronics.

  (Supplementary Note 4) In any one of Supplementary Notes 1 to 3, wherein the second heat absorption unit is supplied with a refrigerant having a temperature lower than the temperature of air in the case from the first heat absorption unit side. The electronic device described.

  (Additional remark 5) The said 1st heat absorption part is formed with the heat exchanger which absorbs the heat which the said heat-emitting components generate | occur | produce in a contact part, and heat-exchanges with a refrigerant | coolant, Any one of Additional remark 1 thru | or 4 Electronic equipment described in one.

  (Supplementary Note 6) When there are a plurality of the heat generating parts having a heat generation density equal to or higher than a set value, the first heat absorbing part is installed in the heat generating parts in descending order of the heat generation density from the upstream side of the refrigerant flow path. The electronic device according to any one of appendix 1 to appendix 5.

(Additional remark 7) Furthermore, it is installed in the case and includes a fan for flowing the air in the case.
The fan causes air radiated from the heat-generating component to flow toward the second heat absorption part,
The electronic device according to any one of appendix 1 to appendix 6, wherein the second heat absorption unit absorbs heat of air that has flowed toward the second heat absorption unit by driving the fan.

  (Supplementary note 8) The electronic device according to any one of supplementary notes 1 to 7, wherein the case is formed of a sealed container formed so that a part of the flow path portion can be inserted to the outside.

  (Supplementary Note 9) The second heat absorption part has a bent part formed in a part of the flow path part, and includes a heat absorption fin around the bent part, and transfers heat in the case to the refrigerant flowing inside. The electronic device according to any one of appendices 1 to 8, wherein the electronic device is heated.

  (Additional remark 10) The said 2nd heat absorption part is arrange | positioned adjacent to the installation position of the said heat generation component from which the heat generation density becomes more than a preset value among the said heat generation components in which the said 1st heat absorption part is not installed, It is characterized by the above-mentioned. The electronic device according to any one of appendix 1 to appendix 9.

  (Supplementary note 11) The electronic device according to any one of supplementary notes 1 to 10, further comprising a wind direction unit that guides air to be circulated in the case toward the second heat absorption unit.

(Additional remark 12) Furthermore, the flow means which flows a refrigerant in the channel part,
Temperature detecting means for detecting the temperature of the heat generating component or the refrigerant;
A control unit that generates control information for the flow unit based on the temperature detected by the temperature detection unit, and controls the flow rate of the refrigerant in the flow path unit;
The electronic apparatus according to any one of Supplementary Note 1 to Supplementary Note 11, wherein

  (Additional remark 13) The said control part judges whether the detection temperature of the said heat-emitting component is below setting temperature, and when it is below this setting temperature, it reduces the flow volume of a refrigerant | coolant characterized by the above-mentioned. machine.

(Supplementary note 14) Further, a case temperature detecting means for detecting the temperature in the case is provided,
The control unit compares the temperature in the case with the temperature of the refrigerant that has passed through the first heat absorption unit, and controls the flow rate of the flow means so that the temperature of the refrigerant is lower than the temperature in the case. 14. The electronic device according to appendix 12 or appendix 13, which is characterized.

The preferred embodiments of the configuration of the present disclosure have been described above. However, the technology of the present disclosure is not limited to the description of the above embodiment. It goes without saying that various modifications and changes can be made by those skilled in the art based on the gist of the technology described in the claims or disclosed in the specification. Needless to say, such modifications and changes are included in the technology of the present disclosure.

2, 50, 60 Electronic device 4 Case 6, 6A, 6B High heat generation component 8 Cooling mechanism 10 First heat absorption portion 12 Second heat absorption portion 14 Heat radiation portion 16 Refrigerant pipe 18 Refrigerant 20 Substrate 22 Control chip 24 Cooling plate 26 Chip component 28 mounted parts 30 heat sink 32 heat absorption radiator 34 fan 36 exhaust heat radiator 38 exhaust heat fan 40 pump 42 refrigerant tank 44 case fan 52, 54 wind direction plate 62 control unit 64 storage unit 66 control table 68, 82, 84 temperature sensor 70 computer

Claims (7)

A case containing a plurality of heat generating components;
A flow path section through which the refrigerant flows;
A first heat-absorbing part that contacts one or more heat-generating parts among the plurality of heat-generating parts and absorbs heat generated from the heat-generating parts in contact with the refrigerant flowing through the flow path part;
Arranged close to the installation position of the heat generating component where the heat generation density of the heat generating component in which the first heat absorbing portion is not installed is equal to or higher than a set value, downstream of the first heat absorbing portion with respect to the flow path portion. A second heat absorbing portion that absorbs heat released from the plurality of heat generating components to the air in the case by the refrigerant flowing through the flow path portion;
A heat dissipating part that communicates with the flow path part outside the case and releases heat of the refrigerant flowing through the flow path part;
With
The electronic device according to claim 1, wherein the case houses the flow path portion, the first heat absorption portion, and the second heat absorption portion. The second heat absorbing part, claims, characterized in that the heat released from the heat-generating component that is not in contact with the first heat absorbing part to the air in the case, is absorbed by the refrigerant flowing in the flow path portion 1. The electronic device according to 1. The amount of heat generated from the heat generating components, the electronic device according to claim 2, wherein greater than the amount of heat generated from the heat generating components which are not in contact with the first heat absorbing part in contact with the first heat absorbing portion . Furthermore, the fan is installed in the case, and includes a fan for flowing the air in the case.
The fan causes air radiated from the heat-generating component to flow toward the second heat absorption part,
4. The electronic device according to claim 1, wherein the second heat absorption unit absorbs heat of air that has flowed toward the second heat absorption unit when the fan is driven. 5.   5. The electronic device according to claim 1, wherein the case is formed of a sealed container formed so that a part of the flow path portion can be inserted to the outside.   The second heat absorption part has a bent part formed in a part of the flow path part, and includes a heat absorption fin around the bent part, and transfers the heat in the case to the refrigerant flowing inside. The electronic device according to claim 1, wherein the electronic device is characterized in that: Furthermore, a flow means for flowing a refrigerant in the flow path section,
The heat-generating component or a temperature detector for detecting the temperature of the refrigerant,
A control unit that generates control information for the flow unit based on the temperature detected by the temperature detection unit, and controls the flow rate of the refrigerant in the flow path unit;
Electronic device according to any one of claims 1 to 6, characterized in that it comprises a.

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