JP6331142B2 - IC card manufacturing method - Google Patents

Description

  The present invention relates to a manufacturing method for manufacturing an IC (Integrated Circuit) card.

  The IC card is used for certifying an individual's identity such as an employee ID card or student ID card, and incorporates an integrated circuit called an inlet having an IC chip and an antenna.

  Typically, a receiving layer is provided on the surface of the IC card for receiving a color material transferred from the thermal transfer sheet by heat. In addition to this receiving layer, preprint information common to other IC cards, such as a pattern, a pattern, or a frame, is printed in advance before the IC card is manufactured. After the IC card is manufactured, print information unique to each IC card, such as an image relating to an individual and personal information, is further printed on the receiving layer.

JP 2007-287070 A

  As a typical example of the manufacturing method, a common receiving layer is applied in advance in a roll paper state or a sheet-like sheet state to a base material to be the surface of an IC card, and then pre-printing of cards for each application It is cost effective for mass production.

  By the way, when printing information specific to each IC card such as an individual image is further printed on the receiving layer on which the pre-print information is printed, the color material for pre-printing is changed to the color material receiving layer for individual printing. Will be disturbed. For this reason, for example, from the viewpoint of preventing card counterfeiting, when a high-security thin pattern or the like is pre-printed on the entire card surface in advance, print information unique to each IC card such as a face image is transferred to a general direct printing printer. Therefore, it was difficult to print on the surface of the IC card with high definition.

  For such card printing applications, a retransfer printing method (intermediate transfer printing method) printer is often used, but the retransfer printing method printer requires a long printing time, requires an intermediate transfer medium, and has a running cost. There is a problem such as high, and it is not suitable for printing and issuing a large number of cards at high speed at low cost.

  In addition, there is a method of printing the receiving layer on the pre-printed sheet or the card after the IC card is manufactured, but it is not suitable for mass card production and tends to be expensive. In addition, it is generally difficult to impart additional functions such as a cushion function to the receiving layer.

  On the other hand, in the case of an IC card manufacturing method called a heat press method in which a plurality of thermoplastic resin sheets are pressure-bonded, a pre-printed resin sheet is placed inside a transparent resin sheet on which a receiving layer is printed, for example. It is known that a receptive layer can be formed on a preprinted layer by overworking. However, in the heat press method, unevenness of IC chips and antennas are likely to appear on the card surface, and a smooth card that can be printed directly on the card surface with a general direct printing printer is mass-produced in high yield. It ’s difficult.

  The present invention has been made in view of these points, and has smoothness that enables high-definition printing of personal information performed after the creation of an IC card even with a general direct printing system printer. An object of the present invention is to provide an IC card manufacturing method.

A method of manufacturing an IC card according to the present invention is a method of manufacturing an IC card in which an inlet including an IC chip and an antenna is laminated between a pair of base materials via a bonding agent,
Supplying a first substrate sheet including a preprinted layer and a first substrate layer;
Supplying a second base sheet;
A plurality of the inlets and the bonding agent are interposed between the supplied first base sheet and the second base sheet, and the first base sheet and the second base sheet are added by a laminating roller. Pressing, and
A sheet-fed IC card containing the first base sheet, the bonding agent, a plurality of inlets, and the second base sheet by cutting the pressurized first base sheet and the second base sheet. Prior to the step of producing a formed body sheet, the step of supplying a print receiving sheet comprising a substrate having releasability and a receiving layer, and the step of producing the IC card forming body sheet, Bonding the surface on the receiving layer side and the surface on the printed layer side of the first base sheet;
Is provided.

  In the method of manufacturing an IC card according to the present invention, the step of bonding the print receiving sheet and the first base sheet may be performed immediately before the step of supplying a bonding agent to the first base sheet. .

  In the method of manufacturing an IC card according to the present invention, the step of joining the print receiving sheet and the first base sheet may be performed after the step of pressing with the laminating roller.

  The method for producing an IC card according to the present invention includes the step of peeling the substrate from the print receiving sheet bonded to the first substrate sheet prior to the step of producing the IC card-forming main body sheet. You may further provide the peeling process which forms only a layer on the said 1st base material sheet.

  In the method of manufacturing an IC card according to the present invention, the substrate of the print receiving sheet has an air permeability based on JISP8117 of 1000 seconds or less, and in the step of producing the IC card forming body sheet, the print receiving sheet is The sheet-like IC card forming main body sheet in which the first base sheet and the second base sheet are cut in a state of being pasted, and the print receiving sheet is being pasted. And a step of curing the bonding agent contained in the IC card forming main body sheet in a state where the sheet-like IC card forming main body sheets to which the print receiving sheet is attached are stacked. May be.

  In the method for producing an IC card according to the present invention, after the step of curing the bonding agent, peeling the substrate from the print receiving sheet, and transferring only the receiving layer onto the first substrate sheet; After the peeling step, a step of punching out the IC card forming main body sheet to obtain each IC card may be further provided.

  The bonding agent may be a moisture curable adhesive.

  According to the present invention, when the substrate is peeled from the print receiving sheet bonded to the surface of the first substrate sheet on the pre-printing layer side, the receiving layer is exposed. For this reason, it is possible to print the printing information specific to each IC card on the exposed receiving layer of the IC card with high definition even with a general direct printing printer.

The top view which shows an example of the IC card manufactured using the manufacturing method of the IC card by the 1st Embodiment of this invention. Sectional drawing which shows the laminated constitution of the IC card shown in FIG. Schematic for demonstrating the manufacturing method of the IC card by the 1st Embodiment of this invention. Schematic for demonstrating the manufacturing method of the IC card by the 2nd Embodiment of this invention. The perspective view which shows the state which accumulated the IC card formation main body sheet | seat with which the printing receiving sheet was affixed. Sectional drawing along line VI-VI shown in FIG. FIG. 6 is a cross-sectional view corresponding to FIG. 5, showing a state in which conventional IC card forming main body sheets are stacked.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product. 1 and 2 are diagrams showing an example of an IC card 70 manufactured using the method of manufacturing the IC card 70 according to the present embodiment. FIG. 3 is a diagram for explaining a method of manufacturing the IC card 70 according to the present embodiment. 4 to 7 are views for explaining a method of manufacturing the IC card 70 according to the second embodiment.

  First, the IC card 70 will be described with reference to FIGS. FIG. 1 is a plan view showing an example of the IC card 70. An IC card 70 shown in FIG. 1 is a card in which an integrated circuit called an inlet 80 is incorporated in order to record information and perform calculations. The IC card 70 is used, for example, to prove an individual's identity such as an employee ID card or student ID card.

  FIG. 2 shows a layer structure of the IC card 70 shown in FIG. As shown in FIG. 2, the IC card 70 includes a card body 70 a in which an inlet 80 is included between a pair of base materials 72 and 74 via a bonding layer 73. The card body 70a shown in FIG. 2 includes a pre-print layer 71, a first base material layer 72, a bonding layer 73, and a second base material layer 74 in this order from the front surface side to the back surface side. An inlet 80 having an IC chip 82 and an antenna 83 is accommodated in the bonding layer 73.

  Furthermore, the print receiving sheet 9 is affixed on the surface of the card body 70a where the pre-print layer 71 is formed. As an example, the print receiving sheet 9 includes a base 91, a release layer 92, a receiving layer 93, a cushion layer 94, and an adhesive layer 95 in this order from the side away from the card body 70a to the side approaching. Yes. When the substrate 91 and the release layer 92 are peeled from the print receiving sheet 9 affixed to the card body 70a, the IC card 70 including the card body 70a, the receiving layer 93, the cushion layer 94, and the adhesive layer 95 is obtained. The IC card 70 may include a card body 70a and a receiving layer 93. Hereinafter, each layer constituting the IC card 70 will be described.

  The pre-print layer 71 is typically formed by offset printing or the like. The preprinted layer 71 shown in FIG. 2 is printed on the first base material layer 72 in advance before the IC card 70 is manufactured. As an example of information printed as the pre-print layer, print information common to other IC cards 70 such as a pattern, a pattern, a common character string, or a frame can be cited.

  The first base material layer 72 and the second base material layer 74 protect the inlet 80 accommodated in the IC card 70 and impart rigidity to the IC card 70 to form a smooth card front and back surface. To do. Although it does not specifically limit as a material which makes the 1st base material layer 72 and the 2nd base material layer 74, For example, polyester resins, such as a polyethylene terephthalate, are mentioned. Also, PET-G, polycarbonate, and vinyl chloride resin are preferably used depending on applications. Note that a writing layer, a second receiving layer, and a second pre-printing layer may be further laminated on the second base material layer 74 as necessary.

  A bonding layer 73 is disposed between the first base material layer 72 and the second base material layer 74. The bonding layer 73 bonds the first base material layer 72 and the second base material layer 74 and accommodates and protects the IC card 70. A typical example of a material forming the bonding layer 73 is a hot melt adhesive. Examples of the hot melt adhesive include a thermosetting type, a two-component curable type, an ultraviolet curable type, and a moisture curable type. In the present invention, a moisture curable adhesive is preferably used.

  An inlet 80 is accommodated in the bonding layer 73. The inlet 80 includes a film-like inlet base 81, an IC chip 82 disposed on the inlet base 81, an antenna 83 electrically connected to the IC chip 82, and a reinforcing plate 84 that protects the IC chip 82. And. Among these, the inlet base material 81 is comprised, for example with a nonwoven fabric or PET resin, the antenna 83 is comprised with conductors, such as a metal (for example, Al, Cu, Ag), for example, and the reinforcement board 84 is stainless steel, for example. It can be made of metal.

  The IC chip 82 includes a memory unit (not shown) for storing information, and a control unit that controls an operation for storing information in the memory unit, an operation for reading information from the memory unit, and a wireless communication operation (Not shown). The IC chip 82 reads information to an interrogator such as a reader / writer (not shown) via the antenna 83, or stores information inputted from the interrogator via the antenna 83. ing.

  Next, the print receiving sheet 9 attached to the pre-print layer 71 of the card body 70a will be described.

  The substrate 91 and the release layer 92 of the print receiving sheet 9 are portions that are peeled off from other portions of the print receiving sheet 9. While the base material 91 functions as a base material to be peeled off, the release layer 92 has weak adhesiveness between the receiving layer 93 and the base material 91 so that the base material 91 can be peeled off. To do. As the base material 91 and the release layer 92, a base material and a release layer used for a known release tape or the like can be applied. As an example, paper or a polyester resin film can be used as a material forming the base material 91. On the other hand, the release layer 92 is obtained, for example, by performing a release treatment on an adhesive layer. It is also possible to select a resin film having releasability as the base material 91 and make the release layer 92 unnecessary.

  The receiving layer 93 is a layer configured to receive a color material that is transferred by heat from the thermal transfer sheet. In the receiving layer 93 of the present embodiment, it is intended that printing information unique to each IC card 70 is printed after the base material 91 and the release layer 92 are peeled off. As an example of the specific print information printed on the receiving layer 93, there are an image and personal information related to an individual. As a material for forming the receiving layer 93, a resin material that can easily receive a heat transferable color material such as a sublimation dye or a heat-meltable ink is used. As an example, as a material forming the receiving layer 93, vinyl chloride resin, acrylic-styrene resin, polyester resin, or the like can be given.

  The cushion layer 94 exhibits an appropriate cushioning property and contributes to stably recording the print layer thermally transferred to the receiving layer 93. As an example, the cushion layer 94 is obtained by dispersing hollow particles made of an inorganic material in a binder resin made of gelatin. Another example is an acrylic UV curable resin that is designed to have an appropriate softening property by heating during printing. Depending on the selection of the receiving layer 93, the cushion layer 94 may be unnecessary.

  The adhesive layer 95 has a function of joining the print receiving sheet 9 to the card body 70a. As the adhesive layer 95, an adhesive layer used for a known release tape or the like can be applied, and thus detailed description thereof is omitted here. Depending on the selection of the receiving layer 93, the adhesive layer 95 may be unnecessary. The print receiving sheet 9 may be provided with a functional layer other than these layers. For example, an ultraviolet absorption layer, a dye diffusion suppression layer, a heat-resistant layer, a color tone adjustment layer, a release layer, and the like can be given.

  Next, a method for manufacturing an IC card according to the present embodiment will be described with reference to FIG. FIG. 3 is a schematic diagram for explaining a method of manufacturing the IC card 70 shown in FIG.

  As shown in FIG. 3, the manufacturing method of the IC card 70 includes a first supply process A for supplying the first base sheet 10, a first application process B for applying the bonding agent 20 to the first base sheet 10, and , An arrangement step C for arranging a plurality of inlets 80 on the surface of the first base material sheet 10 to which the bonding agent 20 is applied, and a second supply step for supplying the second base material sheet 30 from the roll-shaped raw fabric 30a. D, the second application step E for applying the bonding agent 20 to the second base material sheet 30, the first base material sheet 10 on which the bonding agent 20 and the inlet 80 are disposed, and the second base material on which the bonding agent 20 is applied. And a laminating step F in which the base sheet 30 is pressed by a laminating roller 116.

  In the 1st supply process A, many sheet-like 1st base material sheets 10 are piled up. The sheet-like first base sheet 10 includes the above-described pre-printed layer 71 and the first base layer 72 that form part of the IC card 70. As described above, preprint information such as a pattern, a pattern, or a frame is formed in advance on the preprint layer 71 of the first base sheet 10. The sheet-like first base sheet 10 is conveyed to the laminating roller 116 by the roller 111.

  In the process in which the first base sheet 10 is conveyed to the laminating roller 116, the first application process B is performed. In the first application step B, the bonding agent 20 is applied from the die 112 to the surface 10 a (see FIG. 2) on the first substrate layer 72 side of the first substrate sheet 10. In the example shown in FIG. 3, the bonding agent 20 is supplied from the tank 113 to the die 112. The supplied bonding agent 20 is heated in the die 112 to be in a molten state. Subsequently, the molten bonding agent 20 is applied from the die 112 to the first base sheet 10. In particular, it is preferable that the bonding agent 20 is intermittently applied in accordance with the arrangement of the IC cards 70 from the viewpoint of keeping the thickness of the bonding agent 20 constant in the plane.

  In the illustrated example, a die coating method in which the bonding agent 20 is applied from the die 112 is shown. However, the present invention is not limited to such an example, and a gravure method or a roll method may be used.

  Subsequently, in the arranging step C, the plurality of inlets 80 are two-dimensionally arranged on the surface 10a on the first substrate layer 72 side of the first substrate sheet 10 to which the bonding agent 20 is applied. In the present embodiment, the plurality of inlets 80 are arranged in a so-called lattice pattern. That is, the inlet group which consists of the some inlet 80 arranged in the conveyance direction d1 of the 1st base material sheet 10 is arranged in the width direction d2 orthogonal to the conveyance direction d1.

  On the other hand, in the 2nd supply process D, the 2nd base material sheet 30 is supplied from the roll-shaped original fabric 30a. The web-like second base material sheet 30 is composed of the second base material layer 74 of the IC card 70. The web-shaped second base sheet 30 is conveyed to the laminating roller 116 by a plurality of rollers 114.

  Before the 2nd base material sheet 30 joins the 1st base material sheet 10 with the laminating roller 116, the 2nd application | coating process E is performed. In the second application step E, the bonding agent 20 is applied from one die 115 to one surface of the second base sheet 30. In the example shown in FIG. 3, the bonding agent 20 is supplied to the die 115 from the tank 113 used in common with the die 112. The bonding agent 20 is heated in the die 115 to be in a molten state. Subsequently, the molten bonding agent 20 is applied from the die 115 to the second base sheet 30. The bonding agent 20 applied at this time may be intermittently applied in accordance with the contour shape of the sheet-like first base sheet 10. In this case, it is possible to suppress the bonding agent 20 from adhering to the cutting blade 117a in the cutting step J to be performed later, and to suppress the generation of cutting residue due to the cut bonding agent 20.

  Next, in the laminating step F, the surface 10a on the first substrate layer 72 side of the first substrate sheet 10 on which the bonding agent 20 and the inlet 80 are arranged, and the second substrate sheet on which the bonding agent 20 is applied. One side of 30 faces each other, and these are pressed by the laminating roller 116. By pressing the first base sheet 10 and the second base sheet 30 with the laminating roller 116, the total thickness of the IC card 70 and the thickness of the bonding agent 20 can be adjusted. The total thickness of the IC card 70 and the thickness of the bonding agent 20 can be adjusted by adjusting the gap between the laminating rollers 116 and the applied pressure.

  Further, in order to stably adjust the total thickness of the IC card 70 and the thickness of the bonding agent 20, when the pressure is applied by the laminating roller 116, the bonding agent 20 is maintained in a molten state at a certain high temperature. It is preferable. In this respect, in order to maintain the molten state of the bonding agent 20 applied to the base material sheets 10 and 30, the laminating roller 116 is heated from the inside and is heated to a high temperature.

  Next, as shown in FIG. 3, the third supply step G for supplying the print receiving sheet 9 including the base material 91, the release layer 92 and the receiving layer 93, the print receiving sheet 9 and the first base sheet 10, And a peeling step I for peeling the base material 91 and the release layer 92 from the print receiving sheet 9 joined to the first base material sheet 10.

  In the third supply step G, the print receiving sheet 9 is supplied from the roll-shaped raw fabric 9a. As an example, the web-shaped print receiving sheet 9 includes the base material 91, the release layer 92, the receiving layer 93, the cushion layer 94, and the adhesive layer 95 in this order as described above. The web-shaped print receiving sheet 9 is conveyed to the joining step H by a plurality of rollers 121.

In the joining step H, the surface 9a (see FIG. 2) on the receiving layer 93 side of the print receiving sheet 9 and the surface 10b on the pre-printing layer 71 side of the first base material sheet 10 face each other. Pressurized with. Thereby, the surface 9a on the receiving layer 93 side of the print receiving sheet 9 and the surface 10b on the pre-printing layer 71 side of the first base sheet 10 are joined. That is, the pre-print layer 71 of the first base sheet 10 is bonded to the adhesive layer 95 of the print receiving sheet 9. In one embodiment, the bonding process H is performed after the laminating process F. In another embodiment, the bonding process H may be performed immediately before the first coating process B.
In the example shown in FIG. 3, the length of the print receiving sheet 9 in the width direction d2 is equal to the length of the first base sheet 10 in the width direction d2.

  As shown in FIG. 3, after the print receiving sheet 9 is attached to the first base sheet 10 pressed by the laminating roller 116, the peeling process I is performed. In the peeling step I, the print receiving sheet 9 attached to the first base sheet 10 comes into contact with the peeling roller 123, and the base 91 and the release layer 92 are peeled from the printing receiving sheet 9 by the peeling roller 123. . The peeled substrate 91 and release layer 92 are taken up by a take-up roller 124.

  Next, a cutting process J for cutting the pressurized first base sheet 10 and second base sheet 30 to produce a sheet-like IC card forming body sheet 3, and a sheet-like IC card forming body sheet 3 is stacked, and in the state where the IC card forming body sheet 3 is stacked, a curing process L for curing the bonding agent 20 included in the IC card forming body sheet 3 is performed.

  In the cutting process J, the cutting machine 117 cuts the first base sheet 10 and the second base sheet 30 conveyed from the laminating process F in the width direction d2. Thereby, the sheet-like IC card formation main body sheet 3 containing the 1st base material sheet 10, the some inlet 80, the bonding agent 20, and the 2nd base material sheet 30 is obtained. As described above, the print receiving sheet 9 is attached to the first base sheet 10 and the second base sheet 30, and the base 91 and the release layer 92 of the print receiving sheet 9 are peeled off. Therefore, the receiving layer 93, the cushion layer 94, and the adhesive layer 95 of the printing receiving sheet 9 are still laminated on the IC card forming main body sheet 3.

  Further, as described above, the bonding agent 20 applied to the web-shaped second base sheet 30 is arranged with a gap in accordance with the contour shape of the sheet-like first base sheet 10, The cutting position by the cutting machine 117 is cut according to the gap portion where the bonding agent 20 is not applied. Thereby, while suppressing that the bonding agent 20 adheres to the blade 117a of the cutting machine 117, generation | occurrence | production of the cutting waste by the cut | disconnected bonding agent 20 can be suppressed.

  In the stacking step K, the cut sheet-like IC card forming main body sheets 3 are stacked with a rigid plate 5 interposed as required (lamination step K). As an example, the rigid plate 5 is made of a metal plate such as stainless steel. The number of the rigid plates 5 that are interposed in the IC card forming body sheet 3 is not particularly limited. For example, the rigid plates 5 may be interposed every 3 to 10 sheets of the IC card forming body sheet 3. Good.

  Thereafter, the stacked IC card forming body sheets 3 are stored in the aging chamber 118, and the bonding agent 20 contained in the IC card forming body sheet 3 is gradually cured (curing step L). In the aging chamber 118, temperature and humidity are controlled. Moreover, it is a clean room in order to suppress that a foreign material adheres to the IC card formation main body sheet | seat 3. FIG. The temperature and humidity conditions in the aging chamber 118 are appropriately determined according to the adhesive specifications and the like. For example, when a moisture curable hot melt adhesive is used as the bonding agent 20, it is stored in the aging chamber 118 for about one week.

  Thereafter, the IC card forming main body sheet 3 in which the bonding agent 20 is cured is punched into a desired card shape, so that the first base sheet 10, the plurality of inlets 80, the bonding agent 20, the second base sheet 30, and printing are performed. Individual IC cards 70 each including the receiving layer 93, the cushion layer 94, and the adhesive layer 95 of the receiving sheet 9 are obtained.

  As described above, according to the present embodiment, the process A for supplying the first base sheet 10 including the pre-print layer 71 and the first base layer 72, and the second base from the roll-shaped raw fabric 30a. Step D for supplying the material sheet 30, and a plurality of inlets 80 and the bonding agent 20 are interposed between the first base sheet 10 and the second base sheet 30 to be supplied, and the first base sheet 10 and Step F of pressing the second base sheet 30 with the laminating roller 116, cutting the pressed first base sheet 10 and the second base sheet 30, and the first base sheet 10, the bonding agent 20, A process J for producing a sheet-like IC card forming main body sheet 3 including a plurality of inlets 80 and the second base sheet 30, and a print receiving sheet 9 including a base material 91 having releasability and a receiving layer 93 are supplied. Process G and IC card forming body sheet 3 Prior to the step J of comprises a surface 9a of the receiving layer 93 side of the print-receiving sheet 9, and the surface 10b of the printed layer 71 side of the first substrate sheet 10, and a step H of joining. According to such a form, when the substrate 91 is peeled from the print receiving sheet 9 bonded to the surface 10 b on the printed layer 71 side of the first substrate sheet 10, the receiving layer 93 is exposed on the surface of the IC card 70. To do. For this reason, it becomes possible to print on the receiving layer 93 of the exposed IC card 70 with high-definition printing information unique to each IC card 70, such as an image and description information about an individual.

  By the way, as described above, the laminating roller 116 is at a high temperature so as to stably adjust the total thickness of the IC card 70 and the thickness of the bonding agent 20. In addition, the receiving layer 93 that receives the colorant that is transferred by heat is inferior in heat resistance and should be prevented from becoming a high temperature. In this regard, according to the present embodiment, the process H for joining the print receiving sheet 9 and the first base sheet 10 is performed after the process F for pressing with the laminating roller 116. In this case, the printing receiving sheet 9 including the receiving layer 93 can be prevented from coming into contact with the high-temperature laminating roller 116, so that deterioration of the quality of the receiving layer 93 due to heat can be prevented. Therefore, according to such a form, the laminating roller 116 can be maintained at a high temperature to adjust the total thickness of the IC card 70 as desired, and quality deterioration due to heat of the receiving layer 93 can be prevented.

  Further, according to the present embodiment, prior to the step J for producing the IC card forming main body sheet 3, the substrate 91 is peeled off from the print receiving sheet 9 bonded to the first substrate sheet 10, and the receiving layer The process I which further forms only 93 on the 1st base material sheet 10 is further provided. In this case, the substrate 91 of the print receiving sheet 9 can be collected in a web-like state before the print receiving sheet 9 attached to the IC card forming main body sheet 3 is cut into a sheet. . That is, since the substrate 91 in the print receiving sheet 9 can be easily collected, the productivity is excellent.

≪Modification≫
In the first embodiment described above, as shown in FIG. 3, the bonding process H for bonding the print receiving sheet 9 and the first base sheet 10 is performed after the laminating process F for pressing with the laminating roller 116. Although the example performed is shown, the timing at which the joining process H is performed is not limited to such an example. As long as the joining process H is performed between the first supply process A and the cutting process J, it may be performed at any timing. For example, the joining process H may be performed prior to the first application process B in which the bonding agent 20 is applied to the first base sheet 10.

<< Second Embodiment >>
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a schematic view showing a method for manufacturing the IC card 70 in the second embodiment of the present invention. The second embodiment described with reference to FIG. 4 differs in the timing at which the substrate 91 and the release layer 92 of the print receiving sheet 9 are peeled, but the other configurations are the first embodiment and modifications thereof. It can be configured similarly to the example. In the following description of the second embodiment and the drawings used in the following description, the parts that can be configured in the same manner as in the first embodiment described above are the same as the corresponding parts in the first embodiment described above. The same reference numerals as those used above will be used, and redundant explanation will be omitted.

  In the manufacturing method shown in FIG. 4, the peeling step I for peeling the base material 91 and the release layer 92 from the print receiving sheet 9 affixed to the first base material sheet 10 is a cutting for producing the IC card forming main body sheet 3. This is not performed before the process J but after the curing process L in which the bonding agent 20 is cured. Therefore, in the cutting process J, the first base sheet 10 and the second base sheet 30 pressed in the laminating process F are cut in a state where the print receiving sheet 9 is adhered, and the print receiving sheet 9 A sheet-like IC card forming main body sheet 3 to which is attached is produced.

  In the stacking step K, the sheet-like IC card forming main body sheets 3 in a state where the print receiving sheet 9 is stuck are stacked. At this time, if necessary, the rigid plate 5 is interposed between the stacked sheet-like IC card forming main body sheets 3.

  The stacked IC card forming body sheets 3 are stored in the aging chamber 118, and the bonding agent 20 contained in the IC card forming body sheet 3 is gradually cured. FIG. 5 and FIG. 6 show a state in which the IC card forming main body sheets 3 with the print receiving sheet 9 attached are stacked and stored in the aging chamber 118. As shown in FIG. 5 and FIG. 6, when the print receiving sheet 9 including the base material 91 having air permeability is attached to the IC card forming main body sheet 3, the IC card is formed as described below. It has been found that the bonding agent 20 contained in the main body sheet 3 can be cured without deviation in the plane.

  First, for comparison, FIG. 7 shows a conventional IC card forming body sheet 503 stacked and subjected to an aging process. As shown in FIG. 7, when the print receiving sheet 9 is not affixed to the stacked IC card forming main body sheets 503, each IC card depends on factors such as the arrangement of the inlets 580, the bonding agent application position, and the self-weight. The formation main body sheet 503 can obtain a slight gap in the surrounding area C2, but overlaps in the central area C1 surrounded by the surrounding area C2 without a gap. For this reason, each IC card forming main body sheet 503 can perform ventilation and moisture absorption to some extent in the peripheral region C2, but hardly perform ventilation and moisture absorption in the central region C1.

  On the other hand, as understood from FIG. 6, when the print receiving sheet 9 including the base material 91 having air permeability is attached to the IC card forming main body sheet 3, each IC card forming main body sheet 3 is printed. Contact with the other IC card forming main body sheet 3 through the base material 91 of the receiving sheet 9 is prevented. Moreover, since air can permeate | transmit the inside of the base material 91 which has air permeability, each IC card formation main body sheet | seat 3 can ventilate and absorb moisture through the base material 91 which has air permeability. For this reason, each IC card forming main body sheet 3 can perform ventilation and moisture absorption not only in the surrounding area C2 but also in the central area C1. As a result, not only the bonding agent 20 located in the peripheral region C2 but also the bonding agent 20 located in the central region C1 can be sufficiently cured, and the bonding agent 20 included in the IC card forming main body sheet 3 is cured uniformly. It becomes possible to make it. From this, when punching out each IC card 70, it is possible to suppress the occurrence of cutting residue from the bonding agent 20 located in the central region C1. As a result, it is possible to prevent deterioration in print quality and reduction in production efficiency due to the cutting residue adhering to the surface of the IC card 70.

  In particular, as shown in FIG. 6, when the IC card forming main body sheets 3 to which the print receiving sheets 9 are attached are stacked, the print receiving sheets 9 and the IC card forming main body sheets 3 are alternately arranged. In this case, each IC card forming main body sheet 3 can perform ventilation and moisture absorption accompanying the ventilation through the base material 91 from both sides. For this reason, it becomes possible to harden the bonding agent 20 contained in the IC card forming main body sheet 3 more evenly.

  As an example, the thickness of the base material 91 of the present embodiment is set to 140 mm or more and 300 mm or less. When the thickness of the base material 91 is 140 mm or more, wrinkles and wrinkles are unlikely to occur even when the base material 91 absorbs moisture in the air. If the base material 91 is not easily wrinkled or wrinkled, it is excellent in terms of handling and storage. When the base material 91 has a thickness of 300 mm or less, when the IC card forming main body sheets 3 to which the print receiving sheet 9 is stuck are stacked, the height in the stacking direction d3 is difficult to increase, which is advantageous in terms of work efficiency. Demonstrate.

  Further, from the viewpoint of sufficiently ensuring the air permeability, the base material 91 has an air permeability based on, for example, JISP8117 set to 1000 seconds or less. When the air permeability is 1000 seconds or less, it is possible to cause the IC card forming main body sheet 3 adjacent to the base material 91 to sufficiently perform ventilation and moisture absorption through the base material 91. Thereby, in the curing step L, the bonding agent 20 located in the central region C1 of the IC card forming main body sheet 3 can also sufficiently absorb moisture, and the bonding agent 20 located in the central region C1 is also sufficiently cured. Can do. In particular, in the example shown in FIG. 5, the base material 91 has an air permeability based on JISP 8117 of 520 seconds or less. In this case, the bonding agent 20 positioned in the central region C1 of the IC card forming main body sheet 3 can be cured to the same extent as the bonding agent 20 positioned in the peripheral region C2 of the IC card forming main body sheet 3.

  Examples of the material forming the base material 91 include paper and a porous resin material. In particular, when the substrate 91 is made of paper, appropriate air permeability and appropriate cushioning properties are imparted. Furthermore, when the base material 91 is made of paper, it has a certain degree of surface roughness, so that appropriate adhesion resistance is also imparted.

  Now, returning to FIG. 4, after the bonding agent 20 is cured in the aging chamber 118, the peeling process M is performed. In the peeling step M, the substrate 91 and the release layer 92 are peeled from the print receiving sheet 9. This peeling may be performed manually by an operator or automatically using a machine. After the base material 91 and the release layer 92 are peeled off, the IC card forming body sheet 3 on which the receiving layer 93, the cushion layer 94, and the adhesive layer 95 of the print receiving sheet 9 are laminated is punched to obtain each IC card 70.

  As described above, also in the present embodiment, the process A for supplying the first base sheet 10 including the pre-print layer 71 and the first base layer 72, and the second base material from the roll-shaped raw fabric 30a. A plurality of inlets 80 and a bonding agent 20 are interposed between the first base sheet 10 and the second base sheet 30 to be supplied, and the first base sheet 10 and the first base sheet 10 (2) Pressing the base material sheet 30 with the laminating roller 116, and cutting the pressurized first base material sheet 10 and the second base material sheet 30 to form the first base material sheet 10, the bonding agent 20, and a plurality of Step J for producing a sheet-like IC card forming main body sheet 3 including the inlet 80 and the second base sheet 30, and a print receiving sheet 9 including a base material 91 having releasability and a receiving layer 93 are supplied. Process G and IC card forming body sheet 3 Prior to Seisuru step J, it comprises the surface 9a of the receiving layer 93 side of the print-receiving sheet 9, and the surface 10b of the printed layer 71 side of the first substrate sheet 10, and a step H of joining. According to such a form, when the base material 91 is peeled from the print receiving sheet 9 bonded to the surface of the first base material sheet 10 on the printed layer 71 side, the receiving layer 93 is exposed on the surface of the IC card 70. . For this reason, it becomes possible to print individual print information, such as an image and description information about an individual, on the receiving layer 93 of the exposed IC card 70 with high definition.

  Moreover, according to this Embodiment, after the hardening process L which hardens the bonding agent 20, the peeling process M which peels the base material 91 from the printing receiving sheet 9, and the peeling process M, the IC card formation main body sheet 3 And obtaining each IC card 70 by punching out the card. In this case, before the print receiving sheet 9 affixed to the IC card forming main body sheet 3 is punched out according to the shape of each IC card 70, the substrate 91 of the print receiving sheet 9 is collected in a sheet-like state. can do. That is, the substrate 91 in the print receiving sheet 9 can be easily collected, which is advantageous in terms of productivity.

  Moreover, according to this Embodiment, in the lamination process K, the rigid board 5 is further arrange | positioned between the IC card formation main body sheet | seats 3 stacked. In this case, by supporting the IC card forming main body sheet 3 on which the rigid plates 5 are stacked, it is possible to prevent the stacked IC card forming main body sheet 3 from being bent by its own weight. Thereby, obstruction | occlusion of local ventilation | gas_flowing by the bending of the IC card formation main body sheet | seat 3 is prevented, and it contributes to hardening the bonding agent 20 contained in the IC card formation main body sheet | seat 3 more uniformly in the hardening process L.

  Next, the investigation results of the characteristics of the base material 91 and the curing state of the bonding agent 20 included in the IC card forming main body sheet 3 performed by the present inventors will be described. As described below, when the base materials according to samples 1 to 4 are prepared and each base material is used, whether the bonding agent contained in the IC card forming main body sheet is uniformly cured in the curing step. evaluated.

(Samples 1-5)
As the base material according to Samples 1 to 5, so-called slip sheets or slip sheets were used. The main physical properties of the base materials according to Samples 1 to 5 are as shown in Table 1.

(Evaluation)
As the first base material layer and the second base material layer, an IC card-forming main body sheet sample in which a PET base material having a thickness of 188 μm was joined with a moisture curable adhesive as a hot melt joining agent was prepared. Next, in a state where the IC card forming main body sheets to which the base materials according to the sample were bonded were stacked, they were stored in the aging chamber, and the bonding agent contained in the IC card forming main body sheet was cured.

  After the standing time elapsed, the degree to which the bonding agent was cured in each IC card forming main body sheet was confirmed.

(Comparative test)
For comparison, the IC card forming main body sheets were stacked and stored in the aging chamber without attaching the base material, and the bonding agent contained in the IC card forming main body sheet was cured under the same conditions as described above. After the standing time elapsed, the degree to which the bonding agent was cured in each IC card forming main body sheet was confirmed.

The obtained evaluation results are shown in Table 2. In Table 2, when the bonding agent contained in the IC card forming main body sheet can be judged to have a relatively low degree of unevenness compared to the bonding agent in the comparative test, it was indicated as Δ. Furthermore, when it can be judged that it hardened | cured almost uniformly, it was set as (circle). Furthermore, when it was judged that there was no difference in the degree of curing between the bonding agent located in the peripheral region of the IC card forming main body sheet and the bonding agent located in the central region, it was marked as ◎.

  As understood from Table 2, when the base materials according to Samples 1 to 4 are attached to the IC card forming main body sheet, the bonding included in the IC card forming main body sheet is compared to the case where the base material layer is not attached. The agent could be cured evenly. In particular, in Samples 1 to 3 in which the air permeability based on JISP 8117 is set to 520 seconds or less, the degree of curing between the bonding agent located in the peripheral region of the IC card forming main body sheet and the bonding agent located in the central region There was almost no difference. That is, it has been found that when the air permeability based on JISP 8117 is set to 520 seconds or less, a remarkable effect is exhibited in that the bonding agent contained in the IC card forming body sheet is uniformly cured.

3 IC Card Forming Main Body Sheet 9 Printing Receiving Sheet 10 First Base Material Sheet 11 Pre-Printed Layer 12 First Base Material Layer 20 Bonding Agent 30 Second Base Material Sheet 30
30a Original 70 IC card 70a Card body 71 Pre-print layer 72 First base layer 73 Bonding layer 74 Second base layer 80 Inlet 82 IC chip 83 Antenna 91 Base layer 92 Release layer 93 Receptive layer 95 Adhesive layer 116 Laminating roller

Claims (7)

A method of manufacturing an IC card in which an inlet including an IC chip and an antenna is laminated between a pair of base materials via a bonding agent,
Supplying a first substrate sheet including a preprinted layer and a first substrate layer;
Supplying a second base sheet;
A plurality of the inlets and the bonding agent are interposed between the supplied first base sheet and the second base sheet, and the first base sheet and the second base sheet are added by a laminating roller. Pressing, and
A sheet-fed IC card containing the first base sheet, the bonding agent, a plurality of inlets, and the second base sheet by cutting the pressurized first base sheet and the second base sheet. Forming a formed body sheet; and
Prior to the step of supplying a printing receiving sheet including a substrate having releasability and a receiving layer, and the step of producing the IC card forming body sheet, the surface of the printing receiving sheet on the receiving layer side, A step of bonding the printed layer side surface of the first base sheet;
A method of manufacturing an IC card.   The method of manufacturing an IC card according to claim 1, wherein the step of bonding the print receiving sheet and the first base sheet is performed immediately before the step of supplying a bonding agent to the first base sheet.   The method for producing an IC card according to claim 1, wherein the step of bonding the print receiving sheet and the first base sheet is performed after the step of pressing with the laminating roller.   Prior to the step of producing the IC card-forming main body sheet, the base material is peeled from the print receiving sheet joined to the first base material sheet, and only the receiving layer is placed on the first base material sheet. The method for manufacturing an IC card according to claim 1, further comprising a peeling step to be formed. The base material of the print receiving sheet has an air permeability based on JISP8117 of 1000 seconds or less,
In the step of producing the IC card forming main body sheet, the first base sheet and the second base sheet are cut in a state where the print receiving sheet is adhered, and the print receiving sheet The step of stacking the sheet-like IC card forming main body sheets with the sheets attached thereto, and the IC card formation in a state where the sheet-like IC card forming main body sheets with the print receiving sheets attached are stacked. The method of manufacturing the IC card according to claim 1, further comprising a step of curing the bonding agent included in the main body sheet.   After the step of curing the bonding agent, the substrate is peeled off from the print receiving sheet, and only the receiving layer is transferred onto the first substrate sheet. After the peeling step, the IC card The method of manufacturing the IC card according to claim 5, further comprising: punching the formed main body sheet to obtain each IC card.   The method for manufacturing an IC card according to claim 1, wherein the bonding agent is a moisture curable adhesive.

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