JP6337643B2 - Thin plate-like substrate cutting apparatus and cutting method - Google Patents

Description

  The present invention relates to a thin plate-like substrate cutting apparatus and cutting method.

  As a thin plate-like substrate, for example, a separator substrate for a separator used in an electric device such as a secondary battery can be exemplified. The separator substrate is a very thin long member. By cutting the separator substrate, one separator is obtained. A method of cutting a separator base material with a heating element (for example, a nichrome wire) is known (see, for example, Patent Document 1).

JP 2011-3381 A

  By the way, in the above cutting method, generally, a large current is constantly applied to the heating element so that the heating element has a high temperature at which the separator substrate can be cut. As described above, in the above cutting method, the heating element is heated even while the heating element is not cutting the separator substrate. Since the heating element to which a large current is constantly applied is always at a high temperature, it is burned and deteriorates. In addition, a heating element to which a large current is constantly applied has an excessive power supply, and has a problem in terms of energy saving.

  The present invention has been made to solve the problems associated with the above-described prior art, and in the case of cutting a thin plate-like substrate with a heating element, the deterioration of the heating element due to heating is delayed to extend the tool life, and the heat generation. An object of the present invention is to provide a cutting device and a cutting method for a thin plate-like substrate capable of heating a body with energy saving.

A thin plate-like substrate cutting device according to the present invention that achieves the above object includes a cutting member that cuts a thin plate-like substrate with a heating element that generates heat when a current is applied, and a current supply unit that supplies current to the heating element. A drive unit connected to the cutting member and moving the cutting member toward and away from the thin plate-like substrate; and a control unit for controlling the operation of the current supply unit and the drive unit. Have. First, the control unit moves the cutting member in a direction in which the cutting member approaches the thin plate-like substrate by the driving unit. Next, when the cutting member comes into contact with the thin plate-like substrate, the control unit starts to apply a current from the current supply unit to the heating element. Next, the control unit heats the heating element to a temperature at which the thin plate-like substrate can be cut. Next, the control unit ends the application of current from the current supply unit to the heating element before the heating element finishes cutting the thin plate-like substrate. Further, the cutting member includes a plate-like member to which the heating element is attached, and has a heat retaining function that covers a portion of the heating element attached to the plate-like member excluding a tip portion that contacts the thin plate-like substrate. It further has a base provided with a base provided or a heat dissipation function.

The method for cutting a thin plate-like substrate according to the present invention that achieves the above object is a cutting method in which a thin plate-like substrate is cut by a heating element that is provided on a cutting member and generates heat when a current is applied. First, to start the application of the current cutting member from the cutting member in contact with the thin plate-shaped substrate current supply unit to move in a direction to approach to the thin plate-shaped substrate to the heating element. Then, the heating element is heated to a temperature at which the thin plate-like substrate can be cut, and before the heating element finishes cutting the thin plate-like substrate, an electric current is applied from the current supply unit to the heating element. Exit. Furthermore, a plate-like member to which the heating element is attached is used as the cutting member, and a portion excluding a tip portion that comes into contact with the thin-plate-like base member of the heating element attached to the plate-like member has a heat retaining function. By covering with a base portion provided, the heating element is kept warm when the heating element is heated.
The method for cutting a thin plate-like substrate according to the present invention that achieves the above object is a cutting method in which a thin plate-like substrate is cut by a heating element that is provided on a cutting member and generates heat when a current is applied. First, when the cutting member is moved in a direction approaching the thin plate-like substrate and the cutting member comes into contact with the thin plate-like substrate, application of current from the current supply unit to the heating element is started. Then, the heating element is heated to a temperature at which the thin plate-like substrate can be cut, and before the heating element finishes cutting the thin plate-like substrate, an electric current is applied from the current supply unit to the heating element. Exit. Furthermore, as the cutting member, a plate-like member to which the heating element is attached is used, and a portion excluding a tip portion that comes into contact with the thin-plate-like substrate among the heating elements attached to the plate-like member has a heat dissipation function. By covering with the base part provided, when the application of current to the heating element is finished, heat is radiated from the heating element.

  According to the thin plate-like substrate cutting device of the present invention configured as described above, when the cutting member comes into contact with the thin plate-like substrate, the heating element is capable of cutting the thin plate-like substrate by starting to apply current. Until heated. Before the cutting member finishes cutting the thin plate-like substrate, the application of the current to the heating element is finished. For this reason, when the heating element is heated to a temperature necessary for cutting the thin plate-like substrate, the application of the current is cut off, and then the thin plate-like substrate is cut by residual heat. Thereby, since a heat generating body is heated only at the moment which contacted the thin-plate-shaped base material, it can prevent that a baking arises in a heat generating body. Therefore, deterioration of the heating element can be delayed, and the tool life of the heating element can be extended. Further, since the heating element is not always heated, the heating element can be heated with energy saving.

  According to the method for cutting a thin plate-like substrate of the present invention configured as described above, when the cutting member comes into contact with the thin plate-like substrate, the heating element is capable of cutting the thin plate-like substrate by starting to apply current. Until heated. Before the cutting member finishes cutting the thin plate-like substrate, the application of the current to the heating element is finished. For this reason, when the heating element is heated to a temperature necessary for cutting the thin plate-like substrate, the application of the current is cut off, and then the thin plate-like substrate is cut by residual heat. Thereby, since a heat generating body is heated only at the moment which contacted the thin-plate-shaped base material, it can prevent that a baking arises in a heat generating body. Therefore, deterioration of the heating element can be delayed, and the tool life of the heating element can be extended. Further, since the heating element is not always heated, the heating element can be heated with energy saving.

It is a schematic diagram which shows the processing machine incorporating the cutting device of the thin plate-shaped base material which concerns on embodiment. FIG. 2A is a diagram showing an example of a packaged electrode, and FIG. 2B is a perspective view schematically showing a state in which electrodes and a pair of separators are sequentially stacked from the front end side in the carrying direction. . It is a front view which shows the structure of the cutting device of the thin plate-shaped base material which concerns on 1st Embodiment. It is a perspective view which shows the structure of the cutting device of the thin plate-shaped base material which concerns on 1st Embodiment. 5A to 5D are schematic views illustrating an operation in which the cutting device according to the first embodiment cuts the thin plate-like substrate. FIG. 6A is a graph showing the displacement of the position of the tip of the heating element when the cutting device cuts the separator substrate, and FIG. 6B shows the position of the tip of the heating element and the current to the heating element. It is the graph which matched the timing of application. It is a front view which shows the structure of the cutting device of the thin plate-shaped base material which concerns on 2nd Embodiment. It is a perspective view which shows the structure of the cutting device of the thin plate-shaped base material which concerns on 2nd Embodiment. FIGS. 9A to 9D are schematic views illustrating an operation in which the cutting device according to the second embodiment cuts the thin plate-like substrate.

<First Embodiment>
Embodiments according to the present invention will be described below with reference to the accompanying drawings. The size and ratio of each member in the drawings are exaggerated for convenience of explanation and may be different from the actual size and ratio. In addition, as a thin plate-shaped base material, the base material for separators used for the secondary battery as an electrical device is mentioned as an example, for example.

  A processing machine 10 incorporating a cutting device 100 for a separator base material (corresponding to a thin plate-like base material) 60 and a cutting device 100 for a separator base material 60 according to the present embodiment will be described with reference to FIGS. .

  First, the structure of the processing machine 10 provided with the cutting device 100 for the separator base 60 and the packaged electrode 50 employed in the secondary battery formed by the processing machine 10 will be described with reference to FIGS. 1 and 2. .

  FIG. 1 is a schematic diagram showing a processing machine 10 incorporating a cutting device 100 for a separator base material 60 according to the first embodiment. FIG. 2A is a diagram showing an example of the packaged electrode 50, and FIG. 2B schematically shows a state in which the electrode 70 and the pair of separators 61 and 61 are sequentially stacked from the front end side in the transport direction. It is a perspective view shown.

  The processing machine 10 forms a packaged electrode 50 by laminating a pair of separators 61, 61 on both surfaces of the electrode 70. The individual separators 61 are formed by cutting the long separator substrate 60 at regular intervals by the cutting device 100 incorporated in the processing machine 10. 1 and FIGS. 2A and 2B indicate the conveyance direction in which the electrode 70 and the pair of separators 61 and 61 are conveyed when the packaged electrode 50 is manufactured. In FIGS. 1 and 2A and 2B, the right side in the drawing is the downstream side in the transport direction and is referred to as “front” in each member, and the left side in the drawing is the upstream side in the transport direction. " Further, the edge of the separator located in the direction intersecting the transport direction is referred to as “side edge”, and the edge of the separator located in the transport direction is referred to as “front edge” or “rear edge”. A laminated body in which the electrode 70 is sandwiched between the pair of separators 61 and 61 and before the separators 61 and 61 are joined together is referred to as “work W”.

  Referring to FIGS. 2A and 2B, the packaged electrode 50 is formed by packaging a positive electrode or a negative electrode 70 in a bag shape with a pair of separators 61 and 61. In the present embodiment, the positive electrode is the packaged electrode 50. The electrode 70 includes a main body 71 in which an active material is applied to both surfaces of a metal foil, and a tab 72 that is electrically connected to another member formed from a part of the metal foil. The separator base material 60 is a thin film made of a resin material, and has a size slightly larger than the main body portion 71 of the electrode 70. Only the main body 71 of the electrode 70 is sandwiched between the pair of separators 61, 61, and the tab 72 of the electrode 70 is exposed to the outside. The side edges 62 of the pair of separators 61 and 61 are joined to each other. Further, at least one edge of the front edge 63 or the rear edge 64 of the pair of separators 61 and 61 that are overlapped is joined. In the example shown in FIG. 2A, the rear edges 64 of the pair of separators 61, 61 that are overlapped are joined together.

  2A and 2B, the “front end 65” for joining the separators 61 and 61 can be freely set from the viewpoint of suppressing the so-called opening of the separators 61 and 61 that are overlapped. For example, it may be a position aligned with the body portion 71 of the electrode 70, a literal corner portion of the separator 61, or a position aligned with the active material application line.

  With reference to FIG. 1, the processing machine 10 generally includes a conveyance unit 20, a first bonding unit 30, and a second bonding unit 40. The conveyance unit 20 sequentially stacks the electrode 70 and the pair of separators 61 and 61 from the front end 65 side in the conveyance direction while conveying the electrode 70 and the pair of separators 61 and 61. The first joint 30 joins the side edges 62 of the pair of separators 61 and 61. The second joint 40 joins at least one of the front edge 63 or the rear edge 64 of the pair of separators 61, 61. Then, the side edges 62 of the pair of separators 61 and 61 that are sequentially overlapped while being transported by the transport unit 20 are sequentially joined by the first joining unit 30 from the front end 65 side in the transport direction. Further, at least one edge of the front edge 63 or the rear edge 64 of the pair of separators 61, 61 is joined by the second joining part 40 in a state where the transportation by the transportation unit 20 is stopped. In the illustrated example, the second joint portion 40 joins the rear edges 64 of the pair of separators 61 and 61. The junction point 66 at the side edge 62 is, for example, five points, and the junction point 66 at the rear edge 64 is, for example, four points. The processing machine 10 incorporates a cutting device 100 that cuts the long separator substrate 60 at regular intervals.

  The transport unit 20 includes an electrode carry-in unit 21 disposed on the upstream side of the pair of transport members 22 that holds and transports the pair of separators 61, 61, and a plurality of transport units disposed on the downstream side of the pair of transport members 22. The downstream conveyance parts 23 and 24 are included. A nip portion N that sandwiches the workpiece W is formed between the pair of conveying members 22. The gap size of the nip portion N is appropriately adjusted according to the thickness of the workpiece W. The electrode carrying-in part 21 feeds the electrode 70 formed in a predetermined shape into the nip part N along the tangential direction. A plurality of downstream transport units 23 and 24 are provided to transport the stacked electrode 70 and the pair of separators 61 and 61. In the illustrated example, two downstream transport units 23 and 24 are provided, and the second joint unit 40 is disposed between the downstream transport units 23 and 24.

  The electrode carrying-in unit 21 includes, for example, an adsorption device 25 that can adsorb and convey the electrode 70, a support roller 26 that supports the electrode 70 conveyed by the adsorption device 25, and the electrode 70 in the tangential direction to the nip portion N. It has a pair of carrying-in roller 27 sent along. The adsorption device 25 descends vertically to adsorb the electrode 70, moves up while maintaining the substantially horizontal state of the electrode 70, and then moves downstream in the transport direction. Each of the carry-in rollers 27 is provided so as to be movable toward and away from the electrode 70 conveyed by the suction device 25, and feeds the electrode 70 into the nip portion N along the tangential direction by sandwiching and rotating the electrode 70. Note that the position of the electrode 70 that is attracted by the suction device 25 may be shifted in the transport direction or may be shifted obliquely with respect to the transport direction. In the electrode carry-in unit 21, before the electrode 70 is adsorbed by the adsorbing device 25, a positional deviation of the electrode 70 to be adsorbed and conveyed is detected in advance by a sensor camera. After attracting the electrode 70, the suction device 25 moves while correcting the posture of the electrode 70 to an appropriate posture. Thus, the electrode 70 is conveyed to the nip portion N in a proper posture state.

  As shown in FIG. 1, the pair of transport members 22 are, for example, cylindrical drums. The pair of transport members 22 are arranged in such a manner that the rotation shafts face each other in parallel with a predetermined gap therebetween while being orthogonal to the transport direction. Each of the pair of transport members 22 has a holding surface 22 a that holds the separator 61 on the peripheral surface. The pair of conveying members 22 conveys the separator 61 formed in a predetermined shape while holding it on the holding surface 22a.

  The means for holding the separator 61 on each holding surface 22a of the pair of conveying members 22 is not particularly limited, and suction adsorption or electrostatic adsorption can be applied. For example, in the suction adsorption type, the holding surface 22a has a plurality of air suction holes. By sucking air from these air suction holes, the separator 61 is held on the holding surface 22a.

  The pair of transport members 22 rotate in the same direction toward the front in the transport direction at the nip portion N. That is, the upper conveying member 22 conveys the separator 61 attached to the holding surface 22a toward the nip portion N by rotating counterclockwise in FIG. The lower conveyance member 22 conveys the separator 61 attached to the holding surface 22a toward the nip portion N by rotating in the clockwise direction. The pair of transport members 22 are rotationally driven in synchronization by a drive motor (not shown) connected to the rotation shaft. The control unit 300 (see FIG. 3) controls the rotation of the drive motor.

  The electrode carry-in portion 21 conveys the electrode 70 in a substantially horizontal state in synchronization with the rotation of the pair of conveying members 22 and feeds the electrode 70 into the nip portion N along the tangential direction. On the other hand, the pair of transport members 22 feeds the separators 61 attached to the respective holding surfaces 22a into the nip portion N according to the rotation. Thereby, the conveyance part 20 can be laminated | stacked sequentially from the front end 65 side of a conveyance direction, conveying the electrode 70 and a pair of separators 61 and 61 sequentially.

  Separator substrate 60 is, for example, polyethylene, polypropylene, a copolymer obtained by copolymerizing ethylene and propylene as monomer units (ethylene-propylene copolymer), or other than ethylene or propylene and ethylene and propylene. It is made of a polymer resin material such as a copolymer obtained by copolymerizing a monomer.

  A timing roller (not shown) that sandwiches the separator substrate 60 is disposed in the conveyance path of the separator substrate 60. The control unit 300 controls the operation of the timing roller, and controls the timing at which the separator substrate 60 is sent to the conveying member 22. In order to cut the separator base 60, the separator base 60 cutting device 100 is provided above and below the transport path of the electrode 70. When the timing roller (not shown) feeds the separator base 60, the separator base 60 is transported while being sucked by the holding surface 22 a of the transport member 22. By operating each cutting device 100 at the timing when the separator base material 60 is conveyed to a predetermined position, the separator base material 60 is cut at a predetermined interval to form the separator 61.

  The downstream transport unit 23 is, for example, a first conveyor that places and transports the workpiece W fed from the nip portion N of the pair of transport members 22. The downstream conveyance unit 24 is, for example, a second conveyor that is placed on the downstream side of the downstream conveyance unit 23 that is the first conveyor and that carries the workpiece W on which the joining of the side edges 62 of the separator 61 has been completed. It is a conveyor. A second joint 40 is disposed between the downstream transport unit 23 and the downstream transport unit 24. After the rear edges 64 of the separator 61 are joined to each other by the second joining portion 40, the downstream transport portion 24 transports the manufactured packed electrode 50 toward the stage that performs the next process. The downstream side conveyance parts 23 and 24 can be comprised from a suction conveyor, for example. The widths of the downstream transport units 23 and 24 are smaller than the width of the separator 61 so that they do not interfere with the reciprocating movement of the first joining unit 30. The downstream conveyance units 23 and 24 are rotationally driven in synchronization with the conveyance of the workpiece W by a conveyor drive motor (not shown) connected to the rollers. The controller 300 controls the rotation of the conveyor drive motor. In addition, although the conveyor is used as the downstream conveyance parts 23 and 24, you may use other conveying apparatuses, such as a suction hand.

  A pair of the first joint portions 30 are provided on the upper and lower sides so as to face each other across the conveyance path for conveying the stacked electrode 70 and the pair of separators 61, 61, that is, the conveyance path for the workpiece W. A pair of second joining portions 40 are also provided on the upper and lower sides facing each other across the conveyance path of the workpiece W. Since it joins from each of both surfaces of the separator base material 60 which makes a pair, compared with the case where it joins from only one side, a uniform joining state can be created. In addition, when the separator base material 60, particularly the separator base material 60 having different thermal properties, is applied, adjustment for optimizing the joining conditions is facilitated.

  In the first and second joint portions 30 and 40, the means for joining the edges of the pair of separators 61 and 61 overlapped is not particularly limited, and any means of heat welding, pressure bonding, adhesion, or welding is used. Can be applied. In this embodiment, joining is performed by heat welding. This is because the resin separators 61 and 61 can be easily joined together.

  Next, the configuration of the separator substrate 60 cutting apparatus 100 will be described with reference to FIGS.

  FIG. 3 is a front view showing the configuration of the separator 100 cutting device 100. FIG. 4 is a perspective view showing the configuration of the cutting device 100 for the separator substrate 60. 5A to 5D are schematic diagrams illustrating an operation in which the cutting device 100 cuts the separator substrate 60. FIG. 6A is a graph showing the displacement of the position H of the tip 111b of the heating element 111 when the cutting device 100 cuts the separator substrate 60. FIG. 6B is a graph of the tip 111b of the heating element 111. FIG. 6 is a graph in which a position H and a timing of current application to the heating element 111 are associated with each other.

  In summary, the separator substrate 60 cutting device 100 includes a cutting member 110 that cuts the separator substrate 60 with a heating element 111 that generates heat when a current is applied, a current supply unit 200 that supplies current to the heating element 111, A drive unit 120 that is connected to the cutting member 110 and moves the cutting member 110 in a direction in which the cutting member 110 approaches and separates from the separator substrate 60; and a control unit 300 that controls the operation of the current supply unit 200 and the driving unit 120. Have. First, the controller 300 causes the drive unit 120 to move the cutting member 110 in the direction in which the cutting member 110 approaches the separator substrate 60. Next, when the cutting member 110 comes into contact with the separator substrate 60, the control unit 300 starts to apply a current from the current supply unit 200 to the heating element 111. Next, the controller 300 heats the heating element 111 to a temperature at which the separator substrate 60 can be cut. Next, the control unit 300 ends the application of current from the current supply unit 200 to the heating element 111 before the heating element 111 finishes cutting the separator substrate 60. This will be described in detail below.

  The cutting member 110 is provided to cut the separator base material 60 placed on the placement surface 170 a in a direction that intersects the transport direction of the separator base material 60. The cutting member 110 is configured to be movable toward and away from the mounting member 170 (movable up and down in the drawing). More specifically, the cutting member 110 moves the heating element 111 for cutting the separator base material 60 in a direction toward the mounting member 170 or in a direction away from the mounting member 170 (up and down movement in the drawing). The drive unit 120 is connected via a base 130 having a heat retaining function described later. The drive unit 120 is constituted by, for example, a hydraulic cylinder, and the cutting member 110 is attached to the distal end of the operating rod 121 via a base 130 having a heat retaining function. The cutting member 110 is disposed in contact with the base 130.

  The cutting member 110 includes a plate-like member 112 to which the heating element 111 is attached. The heating element 111 is, for example, a heat ray, and is held along the three side surfaces 112d, 112e, and 112f among the four side surfaces of the plate-like member 112 with both ends being pulled. On the three side surfaces 112d, 112e, and 112f of the plate-like member 112, concave portions (not shown) are processed in order to hold the heat generating element 111 that generates heat. The diameter of the recess is processed to be smaller than the diameter of the heating element 111. As a result, the heating element 111 is held in a pulled state without being displaced on the side surface of the plate-like member 112. The plate-like member 112 is arranged along the direction that faces the placement surface 170 a on the side surface 112 e and intersects the transport direction of the separator base material 60.

A portion (front end 111 b) provided on the side surface 112 e of the heating element 111 facing the separator substrate 60 of the plate-like member 112 is arranged along a direction intersecting the transport direction of the separator substrate 60. The heating element 111 cuts the long separator base 60 with a certain width. The width in the longitudinal direction of the heating element 111 is longer than the width in the direction intersecting with the conveying direction of the separator substrate 60. The heating element 111 is heated to a temperature at which the separator substrate 60 can be cut (for example, 200 ° C.) by applying electric power. The temperature of the heating element 111 is detected by a temperature sensor (not shown), and is controlled by the control unit 300 so as to be heated to the above temperature (for example, 200 ° C.). The temperature at which the separator substrate 60 can be cut varies depending on the material of the separator substrate 60. The heating element 111 is, for example, a nichrome wire. The heating element 111 is not limited to nichrome wire, and may be any material that generates heat at a high temperature. The heating element 111 cuts the separator substrate 60 by bringing the tip 111b into contact with the separator substrate 60. The mounting surface 170 a of the mounting member 170 is formed with a recess 170 b for receiving the tip 111 b of the heating element 111 held by the plate-like member 112.

  The material of the plate-like member 112 may be an insulating material that insulates the heating element 111, and is made of, for example, fine ceramics that is an insulator. This fine ceramic is made of, for example, alumina, aluminum nitride, or the like. The material of the plate-like member 112 is not limited to fine ceramics, and may be any insulating material that can be held without being softened even when the heating element 111 generates heat.

  The base portion 130 is provided to keep the heating element 111 that generates heat by applying a current covering a portion that does not contribute to cutting. More specifically, the base 130 has a heat retaining function that covers a portion of the heating element 111 attached to the plate-like member 112 excluding the tip 111b that contacts the separator base 60. The heating element 111, which is mostly covered with the base portion 130 having a heat retaining function, is heated to a high temperature instantly because it is difficult to dissipate the heat to the outside when a current is applied to generate heat. For this reason, the heating element 111 is heated to a high temperature by applying a current for a short time, and the separator substrate 60 can be cut. The base 130 is connected to the drive unit 120, and approaches or separates in the direction toward the mounting member 170 together with the cutting member 110 based on the operation of the operation rod 121.

  The base 130 having a heat retaining function includes a pair of clamping members 131 and 132 that clamp the cutting member 110, and a cutting member that can move in a direction in which the pair of clamping members 131 and 132 approach and separate from the cutting member 110. 110 and a holding member 133 that holds the pair of sandwiching members 131 and 132. When the holding members 131 and 132 are separated from the cutting member 110, the heating element 111 heated to a temperature at which the separator substrate 60 can be cut in a short time quickly dissipates heat. Therefore, seizure of the heating element 111 can be prevented, thereby delaying the deterioration of the heating element 111 and extending the tool life. In addition, since the current is applied to the heating element 111 only for a short time, the heating element 111 can be heated with energy saving.

  Here, the material of the base 130 will be described. The material of the base 130 is preferably a material in which heat from the heating element 111 is not easily radiated to the outside. For this reason, it is preferable that the material of the base 130 is a heat-resistant resin such as silicon having low thermal conductivity. The material of the base 130 is not limited to the above heat-resistant resin such as silicon, and may be any material having a low thermal conductivity.

  The holding member 133 is joined to the tip of the operating rod 121 and is provided to hold the cutting member 110 and the pair of clamping members 131 and 132. The cutting member 110 is detachably attached to the pair of holding members 131 and 132. That is, the holding member 133 is engageable (insertable) with the rear end 112c of the plate member 112 of the cutting member 110 (the side surface farthest from the placement surface 170a among the four side surfaces of the plate member 112). Provided. The cutting member 110 can be attached to and detached from the holding member 133 when the pair of holding members 131 and 132 held by the holding member 133 are separated from the cutting member 110. Thus, in the cutting apparatus 100, the cutting member 110 can be removed from the base 130, and only the cutting member 110 that is a consumable item can be replaced. Therefore, compared with a configuration in which the cutting member 110 and the base portion 130 are integrated, it is only necessary to remove the cutting member 110, so that the number of man-hours required for tool change can be reduced. For this reason, parts exchange property can be improved and, thereby, the setability of the apparatus can be improved. Moreover, since the cutting member 110 can be easily attached or detached from the base 130, the maintenance including the cleaning frequency can be improved.

  The holding member 133 has a slidable configuration so that the pair of clamping members 131 and 132 can approach or separate from the cutting member 110. The holding member 133 moves the pair of clamping members 131 and 132 in a direction approaching or separating from the cutting member 110 under the control of the control unit 300.

  Next, the exposed portion 110a of the uncovered cutting member 110 in a state where the pair of clamping members 131 and 132 are close to the cutting member 110 and covers most of the cutting member 110 will be described. The exposed portion 110a of the cutting member 110 is provided so as to be exposed by a length of, for example, 0.5 mm from the respective distal end portions 131a and 132a of the pair of sandwiching members 131 and 132 toward the separator substrate 60. Thus, by setting the length of the portion of the cutting member 110 exposed from the base 130 to a slight length such as 0.5 mm, only the tip 111b of the heating element 111 contacts the separator base 60. Further, it is possible to prevent the separator base material 60 from coming into contact with both surfaces 112g and 112h of the plate-like member 112. In the present embodiment, the case where the length of the exposed portion 110a is 0.5 mm is illustrated because the amount by which the cutting member 110 is pushed into the concave portion 170b of the mounting member 170 of the separator base material 60 is 1 mm. However, the present invention is not limited to this, and the length of the exposed portion 110a can be determined as appropriate based on the pushing amount of the separator base material 60 of the cutting member 110. Thus, since only the part which contributes to a cutting | disconnection member 110 contacts the separator base material 60, the resin adhering to the cutting member 110 can be reduced. Thereby, the deterioration of the cutting property of the heating element 111 can be delayed, and the tool life of the heating element 111 can be extended.

  Suppressing that heat transferred from the heating element 111 to the base 130 is prevented from being transmitted to the separator base 60 at the tips 131b and 132b on the side facing the separator base 60 of the base 130 (the pair of sandwiching members 131 and 132). A member 140 is included. The suppressing member 140 is provided at least in a portion of the surface of the base portion 130 that faces the separator substrate 60 and that contacts the separator substrate 60 (a portion that requires heat suppression).

  The heat suppression necessary part is a part where the pair of sandwiching members 131 and 132 are in contact with the separator base member 60 while the cutting member 110 is cutting the separator base member 60. The parts 131a and 132a are shown. The tip portions 131a and 132a are portions having a predetermined length T from the tips 131b and 132b of the pair of sandwiching members 131 and 132, respectively. The predetermined length T is set according to the size of the concave portion 170b of the mounting member 170 and the shape of the base portion 130, and thus is not determined to be a unique value. In the present embodiment, the case where the suppressing member 140 is provided on the entire surface of the base portion 130 facing the separator substrate 60 is illustrated.

  As the material of the suppressing member 140, for example, a material composed of a woven fabric, a nonwoven fabric, a foam material, a vacuum heat insulating material, and a heat absorbing material is used. It is affixed so that the part (heat suppression required part) which contacts the separator base material 60 among the surfaces of the base 130 may be covered. The suppression member 140 is affixed to the base 130 via an adhesive (not shown). A known adhesive can be used as the adhesive, and is not limited. The suppression member 140 is configured to be detachable from the base 130 together with the cutting member 110.

  As described above, the suppression member 140 is provided on a portion of the surface of the base portion 130 that comes into contact with the separator substrate 60 (a portion that requires heat suppression). For this reason, since the said part (part which needs heat suppression) contacts the separator base material 60 via the suppression member 140 among the surfaces of the base 130 to which the heat from the heating element 111 has been transferred, It does not melt the contact area. Therefore, by providing the suppressing member 140 on the base portion 130, the portion other than the cut portion of the separator base 60 is not melted, so that it is possible to suppress deterioration in quality related to the cutting shape, dimensions, and the like.

  The thermal conductivity of the material forming the suppression member 140 is lower than the thermal conductivity of the material forming the base portion 130.

  As described above, the material forming the suppressing member 140 is, for example, the woven fabric, the nonwoven fabric, the foam material, the vacuum heat insulating material, and the heat absorbing material, and the material forming the base 130 is, for example, steel such as stainless steel. is there. The thermal conductivity of the woven fabric, the nonwoven fabric, the foam material, the vacuum heat insulating material, and the heat absorbing material is lower than that of steel such as stainless steel. Thus, by using a material having a lower thermal conductivity than the material of the base 130 as the material of the restraining member 140, the separator base 60 in which the exothermic heating element 111 is melted when cutting the separator base 60 is the base. Adhering to the tip of 130 can be prevented.

  The current supply unit 200 is provided to supply power to each unit of the processing machine 10 including the cutting device 100. The current supply unit 200 supplies power to the heating element 111. The current supply unit 200 is an outlet power source, for example.

  The control unit 300 controls the entire processing machine 10, and controls the operations of the heating element 111, the driving unit 120, and the holding member 133 in the cutting device 100. The control unit 300 includes a ROM, a CPU, and a RAM. A ROM (Read Only Memory) stores various control programs for controlling each part of the cutting apparatus 100. A CPU (Central Processing Unit) controls each unit based on various control programs. A RAM (Random Access Memory) temporarily stores various data under control.

  The control unit 300 can adjust the timing of applying the current from the current supply unit 200 to the heating element 111 (current application ON) or stopping the application of the current (current application OFF). Thereby, the heating element 111 is applied with a current only when the separator substrate 60 is cut. The timing control by the control unit 300 will be described later in detail.

  The control unit 300 can adjust the operation timing of the vertical movement of the cutting member 110 so that the cutting member 110 approaches or separates in the direction toward the mounting member 170. Thereby, the cutting member 110 can cut the separator base material 60.

  The control unit 300 can adjust the operation timing of sliding the pair of holding members 131 and 132 held by the holding member 133 so as to approach or separate from the cutting member 110. Thereby, the clamping members 131 and 132 can approach or separate from the cutting member 110.

  Next, the cutting method of the cutting apparatus 100 (the cutting method of the separator base material 60) will be outlined.

  The method for cutting the separator base material 60 according to the present embodiment is a cutting method in which the separator base material 60 is cut by a heating element 111 that is provided on the cutting member 110 and generates heat when a current is applied. First, when the cutting member 110 is moved in a direction in which the cutting member 110 approaches the separator base 60 and the cutting member 110 comes into contact with the separator base 60, application of current from the current supply unit 200 to the heating element 111 is started. The heating element 111 is heated to a temperature at which the separator base material 60 can be cut, and application of current from the current supply unit 200 to the heating element 111 is completed before the heating element 111 finishes cutting the separator base material 60. To do. The above-described cutting device 100 is a device that embodies a method for cutting the separator substrate 60. The method procedure will be described in detail below.

  Next, operation | movement of the cutting device 100 is demonstrated, referring FIG. 5 and FIG.

  At the point of time when the cutting by the cutting device 100 is started, the cutting member 110 is disposed at a position that is not in contact with the separator substrate 60 as shown in FIG. At this time, the position H of the tip 111b of the heating element 111 of the cutting member 110 is at least 100 mm from the surface 60a of the separator substrate 60 before cutting, as shown in FIG. Further, as shown in FIG. 6B, no current is applied to the heating element 111 during the time TA which is the cutting start time (current application OFF (current value is zero)). At this time, the pair of clamping members 131 and 132 are in contact with the cutting member 110 under the control of the control unit 300.

  First, as illustrated in FIG. 5B, the control unit 300 pushes the cutting member 110 through the operating rod 121 until the tip 111 b of the heating element 111 contacts the separator substrate 60. At this time, the position H of the tip 111b of the heating element 111 is at least 0 mm from the surface 60a of the separator substrate 60 before cutting, as shown in FIG. Also, as shown in FIG. 6B, application of current to the heating element 111 starts at time TB, which is the point of contact (current application ON). At this time, the pair of sandwiching members 131 and 132 remain in contact with the cutting member 110 under the control of the control unit 300. For this reason, the heating element 111 that is mostly covered by the sandwiching members 131 and 132 is heated to a temperature (200 ° C.) at which the separator substrate 60 can be cut instantaneously by the supply of electric power.

  Next, as shown in FIG. 5C, the controller 300 moves the cutting member 110 until the tip 111 b of the heating element 111 pushes the separator substrate 60 into the recess 170 b of the mounting member 170 via the operating rod 121. Extrude. At this time, the position H of the tip 111b of the heating element 111 is -0.1 mm from the surface 60a of the separator substrate 60 before cutting, as shown in FIG. In addition, since the heating element 111 is mostly covered by the base portion 130 having a heat retaining function, the heating element 111 is sufficiently hot to cut the separator base material 60. For this reason, as shown in FIG. 6B, the application of current to the heating element 111 is completed (current application OFF (current value is zero)) at the time TC, which is the time of pressing. For this reason, as shown in FIG. 5C, the control unit 300 controls the holding member 133 so that the pair of clamping members 131 and 132 are separated from the cutting member 110 and the heat of the heating element 111 is started to be dissipated. To do. Accordingly, the pair of clamping members 131 and 132 held by the holding member 133 is separated from the cutting member 110 little by little.

  Next, as shown in FIG. 5D, the control unit 300 further moves the cutting member 110 into the concave portion of the mounting member 170 until the tip 111 b of the heating element 111 cuts the separator substrate 60 via the operating rod 121. Push toward 170b. At this time, the position H of the tip 111b of the heating element 111 is −0.3 mm from the surface 60a of the separator substrate 60 before cutting, as shown in FIG. Further, as shown in FIG. 6B, application of current to the heating element 111 remains stopped (current application OFF (current value is zero)) at a time TD that is the cutting time point. The heating element 111 maintains a high temperature at which the separator substrate 60 can be cut, although the application of current is stopped. At this time, as shown in FIG. 5D, the control unit 300 causes the pair of sandwiching members 131 and 132 to be further away from the cutting member 110 so that the heat of the heating element 111 is further dissipated. The holding member 133 is controlled. The tip 111b of the extruded heating element 111 cuts the separator substrate 60 to generate the separator 61. As described above, the heating element 111 cuts the separator substrate 60 by the residual heat.

  Next, the controller 300 controls the pulling back of the operating rod 121 so that the tip 111b of the heating element 111 is at the position shown in FIG. As a result, the cutting member 110 attached to the operating rod 121 via the base 130 is separated from the separator substrate 60 and the mounting member 170.

  The cutting device 100 for the separator base 60 according to the embodiment described above provides the following operational effects.

  The cutting device 100 is connected to the cutting member 110 that cuts the separator substrate 60 by the heating element 111 that generates heat by application of current, the current supply unit 200 that supplies current to the heating element 111, and the cutting member 110. It has the drive part 120 which moves the member 110 to the direction which makes the separator base material 60 approach and separate, and the control part 300 which controls the action | operation of the electric current supply part 200 and the drive part 120. First, the controller 300 causes the drive unit 120 to move the cutting member 110 in the direction in which the cutting member 110 approaches the separator substrate 60. Next, when the cutting member 110 comes into contact with the separator substrate 60, the control unit 300 starts to apply a current from the current supply unit 200 to the heating element 111. Next, the controller 300 heats the heating element 111 to a temperature at which the separator substrate 60 can be cut. Next, the control unit 300 ends the application of current from the current supply unit 200 to the heating element 111 before the heating element 111 finishes cutting the separator substrate 60.

  According to such a configuration, in the cutting apparatus 100, when the cutting member 110 comes into contact with the separator base 60, the heating element 111 is heated to a temperature at which the separator base 60 can be cut by the start of application of current. . Before the cutting member 110 finishes cutting the separator substrate 60, the application of the current to the heating element 111 is completed. For this reason, when the heating element 111 is heated to a temperature necessary for cutting the separator substrate 60, the application of current is cut off, and then the separator substrate 60 is cut by residual heat. Thereby, since the heat generating body 111 is heated only at the moment of contact with the separator base material 60, it is possible to prevent the heat generating body 111 from being baked. Therefore, deterioration of the heating element 111 can be delayed, and the tool life of the heating element 111 can be extended. Further, since the heating element 111 is not constantly heated, the heating element 111 can be heated with energy saving.

  Further, in the cutting apparatus 100, the cutting member 110 includes a plate-like member 112 to which the heating element 111 is attached. It has the base 130 provided with the heat retention function which covers the location except the front-end | tip 111b which contacts the separator base material 60 among the heat generating bodies 111 attached to the plate-shaped member 112.

  According to such a configuration, in this cutting apparatus 100, since most of the heating element 111 attached to the plate-like member 112 is covered with the base portion 130 having a heat retaining function, the heating element 111 is instantaneously applied by applying a current. The separator substrate 60 is heated to a temperature at which it can be cut. For this reason, the heating element 111 can cut the separator substrate 60 by being heated for a short time. Therefore, seizure of the heating element 111 can be prevented, thereby delaying the deterioration of the heating element 111 and extending the tool life. In addition, since it is sufficient to apply a current to the heating element 111 only for a short time, the heating element 111 can be heated with energy saving.

  Further, in the cutting apparatus 100, the base portion 130 having a heat retaining function is provided in a direction in which the pair of sandwiching members 131 and 132 that sandwich the cutting member 110 and the pair of sandwiching members 131 and 132 approach and separate from the cutting member 110. A cutting member 110 and a holding member 133 that holds the pair of clamping members 131 and 132 are provided so as to be movable.

  According to such a configuration, since the pair of sandwiching members 131 and 132 are separated from the cutting member 110, the heat of the heating element 111 heated to a temperature at which the separator substrate 60 can be cut in a short time by the application of electric power. , Quickly dissipate heat. Therefore, it is possible to prevent the heating element 111 from being burned, thereby delaying the deterioration of the heating element 111 and extending the tool life.

  Further, in this cutting apparatus 100, the heat transferred from the heating element 111 to the base 130 is transferred to the separator base 60 at the tips 131 b and 132 b of the base 130 on the side facing the separator base 60 of the pair of clamping members 131 and 132. It further has a suppressing member 140 that suppresses transmission. The thermal conductivity of the material forming the suppression member 140 is lower than the thermal conductivity of the material forming the base portion 130.

  According to such a configuration, in the present cutting device 100, the suppressing member 140 is provided on a portion of the surfaces of the pair of sandwiching members 131 and 132 that comes into contact with the separator substrate 60 (a portion where heat suppression is necessary). For this reason, since the said part (part which needs heat suppression) contacts the separator base material 60 via the suppression member 140 among the surfaces of a pair of clamping members 131 and 132 to which heat from the heating element 111 is transferred, It does not melt the contact area. Therefore, by providing the suppressing member 140, portions other than the cut portion of the separator base 60 are not melted, so that it is possible to suppress deterioration in quality related to the cut shape, dimensions, and the like.

  Further, in the cutting apparatus 100, the cutting member 110 is detachably attached to the base 130.

  According to such a configuration, the holding member 133 is provided so that the rear end portion 112c of the plate-like member 112 to which the heating element 111 is attached can be engaged (inserted). When the pair of holding members 131 and 132 held by the holding member 133 are separated from the cutting member 110, the cutting member 110 can be attached to and detached from the holding member 133. Thus, in the cutting member 110, the cutting member 110 can be removed from the base 130, and only the cutting member 110 that is a consumable item can be replaced. Therefore, compared with the case of the cutting member integrated with the base, the man-hour required for tool change can be reduced, so that the part exchangeability can be improved, and thereby the setability of the apparatus can be improved. Moreover, since the cutting member 110 can be easily attached or detached from the base 130, the maintenance including the cleaning frequency can be improved.

  Further, in the present cutting apparatus 100, the thin plate-like substrate is a separator substrate 60 used for an electric device.

  According to such a configuration, the cutting apparatus 100 cuts the separator base material 60 that is a base material for a separator used in the electric device by the cutting member 110. At this time, since the current can be applied to the cutting member 110 from the cutting member 110 only for a short time, the tool life can be extended.

  The following effects are achieved by the method for cutting the separator substrate 60 according to the embodiment described above.

  This cutting method is a method in which the separator substrate 60 is cut by a heating element 111 provided on the cutting member 110 and generating heat by application of current. First, when the cutting member 110 is moved in a direction in which the cutting member 110 approaches the separator base 60 and the cutting member 110 comes into contact with the separator base 60, application of current from the current supply unit 200 to the heating element 111 is started. The heating element 111 is heated to a temperature at which the separator base material 60 can be cut, and application of current from the current supply unit 200 to the heating element 111 is completed before the heating element 111 finishes cutting the separator base material 60. To do.

  According to this method, when the cutting member 110 comes into contact with the separator substrate 60, the heating element 111 is heated to a temperature at which the separator substrate 60 can be cut by the start of application of current. Before the cutting member 110 finishes cutting the separator substrate 60, the application of the current to the heating element 111 is completed. For this reason, when the heating element 111 is heated to a temperature necessary for cutting the separator substrate 60, the application of the current is cut off, and then the separator substrate 60 is cut by the residual heat. Thereby, since the heat generating body 111 is heated only at the moment of contact with the separator base material 60, it is possible to prevent the heat generating body 111 from being baked. Therefore, deterioration of the heating element 111 can be delayed, and the tool life of the heating element 111 can be extended. Further, since the heating element 111 is not constantly heated, the heating element 111 can be heated with energy saving.

<Second Embodiment>
Next, the configuration of the cutting device 400 for the separator base 60 according to the second embodiment will be described with reference to FIGS.

  FIG. 7 is a front view showing the configuration of the separator 400 cutting device 400. FIG. 8 is a perspective view showing the configuration of the cutting device 400 for the separator substrate 60. FIGS. 9A to 9D are schematic diagrams illustrating an operation in which the cutting device 400 cuts the separator substrate 60.

  Since the second embodiment has a heat dissipation function, the configuration using the base portion 430 made of a material having high thermal conductivity is different from the configuration according to the first embodiment. Moreover, since it is such a structure, it is the place which made it the structure which can radiate | emit the heat transmitted from the heat generating body 111 from the base part 430, without making the base part 430 separable with respect to the heat generating body 111. This is different from the configuration according to the first embodiment. In the second embodiment, the same reference numerals are used for components having the same configuration as in the first embodiment described above, and the above description is omitted.

  The cutting device 400 includes a base 430 unique to the second embodiment in addition to the cutting member 110, the drive unit 120, and the suppression member 140 similar to those of the first embodiment described above. In the second embodiment, description will be made centering on the base 430.

  As shown in FIG. 7 and FIG. 8, the base 430 is provided such that a portion excluding the tip 111 b of the heating element 111 in the plate-like member 112 to which the heating element 111 is attached can be engaged (inserted). Accordingly, the base 430 covers the heating element 111 except for the tip 111b, as in the first embodiment described above. In this way, the cutting member 110 that is mostly covered with the base portion 430 is heated to a high temperature at which the separator substrate 60 can be cut instantaneously. For this reason, the cutting member 110 can cut the separator substrate 60 by heating in a short time, as in the first embodiment. The base 430 is connected to the drive unit 120, and approaches or separates in the direction toward the mounting member 170 together with the cutting member 110 based on the operation of the operation rod 121.

  The cutting member 110 includes a plate-like member 112 to which the heating element 111 is attached, and the base 430 covers a portion of the heating element 111 attached to the plate-like member 112 excluding the tip 111b that contacts the separator substrate 60, Provide heat dissipation function.

  Here, the material of the base 430 having a heat dissipation function will be described. Unlike the material of the base 130 according to the first embodiment, the material of the base 430 is preferably a material that easily transfers heat from the cutting member 110. For this reason, as a material of the base part 430, it is preferable that it is high heat conductivity, for example, is copper. The material of the base 430 is not limited to copper, and may be any material having high thermal conductivity.

  The base portion 430 having a heat dissipation function is processed to increase the surface area.

  As shown in FIG. 8, the base 430 has a corrugated uneven surface processing (heat radiation processing) on the surface of the base 430. In the present embodiment, among the surface of the base 430, only the side surface that intersects the separator base material 60 and the mounting member 170 in the vertical direction and is parallel to the transport direction of the separator base material 60 is subjected to heat dissipation. As described above, the base 430 is subjected to a heat dissipation process that increases the surface area of the base 430, so that the heating element 111 heated to a temperature at which the separator substrate 60 can be cut in a short time by applying an electric current quickly To dissipate heat. Therefore, seizure of the cutting member 110 can be prevented, thereby delaying the deterioration of the cutting member 110 and extending the tool life.

  The base 430 has a suppressing member 140 that suppresses heat transfer from the heating element 111 to the separator base 60 at the tip 430 b facing the separator base 60. The suppressing member 140 is provided at least on a portion of the surface of the base portion 430 that faces the separator substrate 60 and is in contact with the separator substrate 60 (a portion that requires heat suppression).

  The heat suppression necessary part is a part where the base part 430 contacts the separator base material 60 while the cutting member 110 cuts the separator base material 60, and indicates the tip part 430 a of the base part 430. The distal end portion 430a is a portion having a predetermined length T from the distal end 430b of the base portion 430. The predetermined length T is set according to the size of the concave portion 170b of the mounting member 170 and the shape of the base portion 430, and thus is not determined to be a unique value. In the present embodiment, the case where the suppressing member 140 is provided on the entire surface of the base portion 430 facing the separator substrate 60 is illustrated.

  The control unit 500 controls the entire processing machine 10, and in the cutting device 400, controls the operation of the cutting member 110 and the current supply unit 200. The control of the current application timing to the heating element 111 by the control unit 500 is the same as the control of the current application timing to the heating element 111 by the control unit 300 in the first embodiment. Further, the control of the operation timing of the cutting member 110 by the control unit 500 is the same as the control of the operation timing of the cutting member 110 by the control unit 300 in the first embodiment.

  Next, the operation of the cutting device 400 will be described with reference to FIG.

  At the point of time when cutting by the cutting device 400 is started, the cutting member 110 is disposed at a position that is not in contact with the separator substrate 60 as shown in FIG. At this time, the position H of the tip 111b of the heating element 111 of the cutting member 110 is at least 100 mm from the surface 60a of the separator substrate 60 before cutting. In addition, during the time when the cutting is started, no current is applied to the heating element 111 (current application OFF (current value is zero)). At this time, the pair of clamping members 131 and 132 are in contact with the cutting member 110 under the control of the control unit 500.

  First, as shown in FIG. 9B, the controller 500 pushes the cutting member 110 through the operating rod 121 until the tip 111 b of the heating element 111 comes into contact with the separator substrate 60. At this time, the position H of the tip 111b of the heating element 111 is at least 0 mm from the surface 60a of the separator base 60 before cutting. In addition, application of current to the heating element 111 starts at the time when this contact is made (current application ON). The heating element 111 that is mostly covered by the base 430 is heated to a temperature (for example, 200 ° C.) at which the separator substrate 60 can be instantaneously cut by the supply of electric power.

  Next, as shown in FIG. 9C, the controller 500 moves the cutting member 110 until the tip 111 b of the heating element 111 pushes the separator substrate 60 into the recess 170 b of the mounting member 170 via the operating rod 121. Extrude. At this time, the position H of the tip 111b of the heating element 111 is -0.1 mm from the surface 60a of the separator substrate 60 before cutting. In addition, since most of the heating element 111 is covered with the base portion 430, the heating element 111 is sufficiently hot to cut the separator substrate 60. For this reason, the application of current to the heating element 111 is completed during the time at which it is pushed in (current application OFF (current value is zero)). When the current application is turned off, the base portion 430 having a heat dissipation function quickly starts the heat dissipation of heat transfer from the heating element 111 by the heat dissipation processing portion 430g processed on the surface of the base portion 430.

  Next, as shown in FIG. 9D, the controller 500 further moves the cutting member 110 into the concave portion of the mounting member 170 until the tip 111 b of the heating element 111 cuts the separator substrate 60 through the operating rod 121. Push toward 170b. At this time, the position H of the tip 111b of the heating element 111 is −0.3 mm from the surface 60a of the separator substrate 60 before cutting. In addition, during the time when the cutting is performed, application of current to the heating element 111 remains stopped (current application OFF (current value is zero)). The heating element 111 is kept at a high temperature at which the separator substrate 60 can be cut, although the application of current is stopped and heat dissipation is started. The extruded tip end 111 b of the cutting member 110 cuts the separator substrate 60 to generate the separator 61. As described above, the heating element 111 cuts the separator substrate 60 by the residual heat.

  Next, the control unit 500 pulls back the operating rod 121 to control the tip 111b of the heating element 111 to the position shown in FIG. Thereby, the cutting member 110 attached to the operating rod 121 via the base portion 430 is separated from the separator substrate 60 and the mounting member 170.

  The cutting device 400 for the separator substrate 60 according to the second embodiment described above provides the following operational effects.

  In the cutting device 400, the base 430 covers a portion of the heating element 111 attached to the plate-like member 112 excluding the tip 111b that contacts the separator base 60, and has a heat dissipation function.

  According to such a configuration, in this cutting apparatus 400, most of the heating element 111 attached to the plate-like member 112 is covered with the base portion 430 having a heat dissipation function, so that a current is applied and the separator base material can be obtained in a short time. The heating element 111 heated to a temperature capable of cutting 60 quickly dissipates heat. Therefore, seizure of the cutting member 110 can be prevented, thereby delaying the deterioration of the cutting member 110 and extending the tool life. In addition, since the base 430 provided with a heat radiating function does not need a function of forcibly opening compared with the base 130 provided with a heat retaining function according to the first embodiment, the configuration can be simplified.

  Further, in the cutting device 400, the base 430 having a heat dissipation function is subjected to processing for increasing the surface area.

  According to such a configuration, the heating element 111 heated to a temperature at which the separator substrate 60 can be cut in a short time by applying a current by applying heat dissipation processing to the base portion 430 to increase the surface area of the base portion 430. Dissipate heat quickly. Therefore, seizure of the cutting member 110 can be prevented, thereby delaying the deterioration of the cutting member 110 and extending the tool life.

  As to the base of the cutting device according to the present invention, which of the base 130 provided with the heat retaining function according to the first embodiment or the base 430 provided with the heat dissipation function according to the second embodiment is used. The function can be appropriately selected depending on whether the function is important.

  In addition, the present invention can be variously modified based on the configurations described in the claims, and these are also within the scope of the present invention.

  In the present embodiment, the separator base material is exemplified as the thin plate-like base material, but the present invention is not limited to this, and any thin plate-like base material can be widely applied.

  Moreover, in this embodiment, the separator base material which consists of a single layer structure was illustrated as the separator base material 60, However, it is not restricted to this, For example, from the two-layer structure formed by laminating | stacking a melting material and a heat-resistant material The present invention can also be applied to the separator substrate.

  In the present embodiment, the cutting devices 100 and 400 have been described as a configuration for cutting the separator base material 60 placed on the curved placement surface 170a, but the present invention is not limited to this. For example, the cutting devices 100 and 400 can cut the separator base material 60 placed on a planar placement surface.

  Further, in the second embodiment, the case where heat radiation processing is performed on only a part of the surface of the base 430 has been described as an example. However, the present invention is not limited thereto, and for example, heat radiation processing may be performed on the entire surface.

  In the present embodiment, the heating element 111 has been described as a configuration in which application of current starts from a state where the current value is zero when the separator base 60 starts cutting, but the present invention is not limited to this. For example, a current having a value that does not cause the heating element 111 to be burned into the heating element 111 before the start of cutting is applied in advance, and further current is applied to heat the heating element 111 to a high temperature at the start of cutting. It is applicable also to the structure to do.

10 processing machine,
20 transport section,
21 Electrode carrying part,
22 conveying member,
22a holding surface,
23, 24 Downstream transport section,
25 adsorption device,
26 support rollers,
27 Loading roller,
30 first joint,
40 second joint,
50 Packed electrodes,
60 separator substrate (thin plate-like substrate),
61 separator,
62 lateral edges,
63 Front edge,
64 Rear edge,
65 Front end,
66 junctions,
70 electrodes,
71 body,
72 tabs,
100, 400 cutting device,
110 cutting member,
110a exposed part,
111 heating elements,
111b tip,
111c rear end,
112 plate member,
112c rear end,
112d, 112e, 112f side surface,
120 drive unit,
121 actuating rod,
130, 430 base,
131, 132 A pair of clamping members,
131a, 132a, 430a tip,
131b, 132b, 430b tip,
133 holding member,
140 restraining member,
170 mounting member,
170a mounting surface,
170b recess,
200 current supply,
300, 500 control unit,
430g heat dissipation processing part,
a Transport direction,
N Nip part.

Claims (8)

A cutting member that cuts the thin plate-like substrate with a heating element that generates heat upon application of current;
A current supply unit for supplying current to the heating element;
A drive unit that is connected to the cutting member and moves the cutting member toward and away from the thin plate-like substrate;
A control unit for controlling the operation of the current supply unit and the drive unit,
The control unit causes the driving unit to move the cutting member in a direction in which the cutting member approaches the thin plate-like substrate, and when the cutting member comes into contact with the thin plate-like substrate, the current is supplied from the current supply unit to the heating element. The heating element is heated to a temperature at which the thin plate-like base material can be cut, and before the heating element finishes cutting the thin plate-like base material, the current supply unit moves to the heating element. The current application of
The cutting member includes a plate-like member to which the heating element is attached,
A thin plate-like base material further comprising a base portion having a heat retaining function covering a portion excluding a tip portion contacting the thin plate-like base material among the heating elements attached to the plate-like member, or a base portion having a heat radiation function . Cutting device. The base having a heat retaining function is:
A pair of clamping members for clamping the cutting member;
The thin plate shape according to claim 1, further comprising: a holding member that holds the cutting member and the pair of clamping members so that the pair of clamping members can move in a direction approaching and separating from the cutting member. Substrate cutting device. Said base comprising a heat radiation function is made is decorated processed to increase the surface area, the cutting device of the thin plate-shaped substrate according to claim 1. The tip of the base facing the thin plate-like substrate further has a suppressing member that suppresses heat transferred from the heating element to the base from being transmitted to the thin plate-like substrate,
The thin plate-like substrate cutting device according to any one of claims 1 to 3 , wherein a thermal conductivity of a material forming the suppressing member is lower than a thermal conductivity of a material forming the base. The thin-plate-like substrate cutting device according to any one of claims 1 to 4 , wherein the cutting member is detachably attached to the base portion. The thin plate-like base material cutting device according to any one of claims 1 to 5 , wherein the thin plate-like base material is a base material for a separator used in an electric device. A cutting method in which a thin plate-like substrate is cut by a heating element that is provided in a cutting member and generates heat by application of an electric current,
The started application of current cutting member from the cutting member when the contact with the thin plate-shaped substrate current supply unit to move in a direction to approach to the thin plate-shaped substrate to said heating element,
Heating the heating element to a temperature at which the thin plate-like substrate can be cut;
Said up before the heating element has finished cutting the thin plate-shaped substrate to exit the application of current to the heating element from the current supply unit,
As the cutting member, using a plate-like member to which the heating element is attached,
The heating element is heated when the heating element is heated by covering a portion of the heating element attached to the plate-like member, excluding the tip portion that comes into contact with the thin plate-like substrate, with a base having a heat retaining function. A method of cutting a thin plate-like substrate that keeps the temperature warm .   A cutting method in which a thin plate-like substrate is cut by a heating element that is provided in a cutting member and generates heat by application of current,
  When the cutting member moves in a direction approaching the thin plate-like substrate and the cutting member comes into contact with the thin plate-like substrate, application of current from the current supply unit to the heating element is started,
  Heating the heating element to a temperature at which the thin plate-like substrate can be cut;
  Before the heating element finishes cutting the thin plate-like substrate, the application of current from the current supply unit to the heating element is terminated,
  As the cutting member, using a plate-like member to which the heating element is attached,
  The application of current to the heating element is completed by covering the heating element attached to the plate-like member with a base having a heat dissipation function except for the tip part that contacts the thin plate-like substrate. A method for cutting a thin plate-like substrate, in which heat is radiated from the heating element.