JP6338951B2 - Electrodeposition whetstone and method for manufacturing the same - Google Patents

Description

  The present invention relates to an electrodeposition grindstone having abrasive grains fixed to a base metal via a plating layer and a method for manufacturing the same.

  FIG. 8 is a longitudinal sectional view of a main part of a conventionally known electrodeposition grindstone 1 described in Patent Document 1. As shown in FIG. As is well known, the electrodeposition grindstone 1 has an abrasive layer composed of a plurality of abrasive grains 4 fixed to a base metal 2 via a plating layer 3. The plating layer 3 is formed by electrolytic plating, electroless plating, or the like, and the layer thickness T is about 30 to 75% of the average particle diameter of the abrasive grains 4 as described in Patent Document 1 (generally, Is set to about 50 to 70%.

  Accordingly, a part of the abrasive grains 4 is exposed from the plating layer 3, and a workpiece (not shown) is ground at the exposed portion. Chips generated during grinding are discharged through a clearance between the abrasive grains 4, that is, through a chip pocket. Here, if the abrasive grains 4 are dense and dense, the volume of the chip pocket becomes small, so that it becomes difficult to discharge chips, and clogging and welding are likely to occur. On the other hand, when the abrasive grains 4 have a low density, it becomes difficult to grind the workpiece itself. For this reason, in the electrodeposition grindstone 1, the density of the abrasive grains 4 is set so that the workpiece can be easily ground and the chips can be easily discharged.

  The abrasive grains 4 wear as the workpiece is ground repeatedly. As shown in FIG. 9, the abrasive grains 4 have a grain size (in other words, the layer thickness of the abrasive layer) of the plating layer 3. It is approximately the same as the layer thickness T. In this state, grinding becomes difficult and so-called sharpness decreases. Further, since it becomes difficult to discharge the chips, clogging and welding are likely to occur as described above. When such a situation is confirmed, it is determined that the electrodeposition grindstone 1 has reached the end of its life and is replaced with a new one.

  In order to extend the life of this type of electrodeposition grindstone, Patent Document 2 proposes forming a step in the abrasive grain layer by providing a step on the base metal. According to Patent Document 2, abrasive grains located at a higher stage are involved in grinding in the initial stage of grinding, and after the abrasive grains are worn or dropped, abrasive grains located at a lower stage are involved in grinding. The service life of the grinding stone is expected to be extended.

Japanese Patent Laid-Open No. 5-138537 JP-A-9-193023

  Although various studies have been made on the extension of the life of the electrodeposition grindstone, including the above-mentioned Patent Document 2, it is still not sufficient. That is, there is a demand for an electrodeposition grindstone that can easily grind a workpiece and that can easily discharge chips.

  The present invention has been made in order to solve the above-described problems, and is an electrodeposition grindstone having a chip pocket with a sufficient volume and capable of easily discharging chips even after the abrasive grains are worn. And it aims at providing the manufacturing method.

In order to achieve the above object, the present invention provides an electrodeposition grindstone having abrasive grains fixed to a base metal through a plating layer,
The plating layer is formed on the opposite side of the concave portion with the abrasive grains sandwiched between the concave portion that exposes a part of the abrasive grains from the plating layer and that is depressed toward the base metal. It has a layer thickness part with a larger layer thickness than that .

  In the electrodeposition grindstone according to the present invention, the concave portion functions as a chip pocket in addition to between the abrasive grains. For this reason, the volume of the chip pocket is large. And since the recessed part is formed in the plating layer, this recessed part does not lose | disappear. That is, it can function as a chip pocket even after the abrasive is worn. For this reason, it is easy to discharge chips over a long period of time.

The plating layer is located on the opposite side of the concave portion with the abrasive grains interposed therebetween, and further has a layer thickness changing portion in which the layer thickness gradually decreases starting from the abrasive grains. Therefore, the plating layer, continuous with the recess, and extending to the groove at a position facing in between the layer thickness portion and the layer thickness change section Ru is formed. Since the recessed portions and the grooves are formed, the exposed volume of the abrasive grains is increased, but the abrasive grains are sufficiently held on the plating layer or the base metal by the layer thickness changing portion having a large layer thickness. For this reason, it is difficult for the abrasive grains to fall off. Therefore, it is possible to continue cutting.

  If the depth of the recess is excessively small, the volume of the chip pocket becomes small, and chip discharge becomes difficult. On the other hand, if the depth of the recess is excessively large, it is difficult to hold the abrasive grains. For this reason, it is preferable that the depth of a recessed part is 5-35% of the average particle diameter of an abrasive grain.

  The maximum layer thickness of the layer thickness changing portion is preferably 5 to 25% larger than the average particle size of the abrasive grains compared to the layer thickness of the flat portion of the plating layer. This is because the abrasive grains can be sufficiently retained.

  The concave portion is formed by flowing the plating solution so as to go around the abrasive grains. On the other hand, when adjacent abrasive grains are too close to each other, it becomes difficult for the plating solution to flow as described above, and it becomes difficult to form the recess. In order to avoid such an inconvenience, it is preferable that adjacent abrasive grains are separated by a distance of at least twice the average grain size of the abrasive grains.

  Note that a so-called glossy plating layer may be formed as the plating layer. In other words, the plating layer may include a gloss material.

Further, the present invention is an electrodeposition grindstone manufacturing method for fixing abrasive grains to a base metal via a plating layer.
Storing the base metal to which the abrasive grains are attached in a plating tank;
Performing a plating process while flowing a plating solution in one direction relative to the abrasive grains in the plating tank, and forming a plating layer for fixing the abrasive grains to the base metal;
Have
By colliding the plating solution with the abrasive grains, the plating layer on the upstream side in the flow direction forms a recess that is depressed toward the base metal and exposes a part of the abrasive grains from the plating layer. The plating layer on the downstream side in the flow direction has a layer thickness portion that is thicker than other portions, and the layer thickness gradually decreases as the layer thickness portion starts from the layer thickness portion. And forming a layer thickness changing portion,
In the plating layer, a groove is formed which is continuous with the recess and extends at a position facing the layer thickness part and the layer thickness changing part.

  By this flow, it is also possible to form a layer thickness changing portion that is located on the opposite side of the concave portion with the abrasive grains interposed therebetween and in which the thickness gradually decreases starting from the abrasive grains.

  In this way, an electrodeposition grindstone having a plating layer in which a concave portion and a layer thickness changing portion are formed can be obtained easily and simply by setting the plating solution in a state of flowing relative to the base metal and performing the plating treatment. It is done.

  As described above, in order to form a recess and a layer thickness changing portion around each grindstone, the adjacent abrasive grains are separated by a distance of at least twice the average grain size of the abrasive grains. It is preferable to make it adhere to the said base metal. In this case, it is easy for the plating solution to wrap around the individual abrasive grains.

  In order to form the gloss plating layer, a plating solution containing a gloss material may be used.

  In the electrodeposition grindstone according to the present invention, the concave portion and the layer thickness changing portion are formed in the plating layer that fixes the abrasive grains to the base metal. Since the concave portion functions as a chip pocket in addition to between the abrasive grains, the volume of the chip pocket is large. Moreover, since the recess functions as a chip pocket even after the abrasive grains are worn, it is easy to discharge the chips over a long period of time.

  That is, according to the present invention, it is possible to form a chip pocket having a sufficient volume, and it is possible to easily discharge chips even after the abrasive grains are worn.

  Further, when the layer thickness changing portion is formed, the abrasive grains are sufficiently held by the plating layer or the base metal, so that it is difficult to drop off. Therefore, it is possible to continue cutting.

It is a principal part schematic perspective view of the electrodeposition grindstone concerning embodiment of this invention. It is the II-II arrow directional cross-sectional view in FIG. It is arrow sectional drawing from the A direction in FIG. It is a principal part perspective view which shows the state which mounted the abrasive grain in the base metal and temporarily fixed with the base plating layer. FIG. 4 is a system diagram of a plating apparatus for forming the plating layer shown in FIGS. 1 to 3. It is a model top view explaining the flow of a plating solution when a plating solution contacts with an abrasive grain. It is a graph which shows the relationship between the grinding efficiency in the electrodeposition grindstone of Examples 1, 2 and a comparative example, and rotational torque. It is a principal part longitudinal cross-sectional view of the electrodeposition grindstone which concerns on a prior art. It is a principal part longitudinal cross-sectional view which shows the state which abrasion of the abrasive grain advanced from FIG.

  Hereinafter, preferred embodiments of an electrodeposition grindstone and a method for producing the same according to the present invention will be described in detail with reference to the accompanying drawings.

  1 and 2 are a schematic perspective view of a main part of an electrodeposition grindstone 10 according to the present embodiment, and a cross-sectional view taken along line II-II in FIG. The electrodeposition grindstone 10 includes a base metal 12 and abrasive grains 16 fixed to the base metal 12 through a plating layer 14. 1 and 2, one abrasive grain 16 is shown including the vicinity thereof, but actually, as shown in FIG. 3 which is a cross-sectional view from the direction A in FIG. A plurality of abrasive grains 16 are fixed to the base metal 12, thereby forming an abrasive grain layer.

  In the present embodiment, the thickness of the plating layer 14 is not constant, and differs depending on the site because the recess 20 and the layer thickness changing portion 22 exist. This point will be described in detail. First, the recess 20 surrounds one abrasive grain 16 and has a substantially C shape. That is, the recess 20 does not extend over the plurality of abrasive grains 16, but is formed around each abrasive grain 16.

  The layer thickness of the recess 20 is smaller than other parts. For this reason, the part which faces the recessed part 20 in the abrasive grain 16 is exposed. That is, in the electrodeposition grindstone 10 according to the present embodiment, the volume of the exposed portion on the front side in the processing direction of the abrasive grains 16 is larger than that of the electrodeposition grindstone 1 (see FIG. 8) in which the layer thickness of the plating layer 3 is constant. And get bigger.

  The suitable depth D (refer FIG. 2) of the recessed part 20 is 5 to 35% of the average particle diameter of the abrasive grain 16. When the average particle size is less than 5%, the volume of the exposed portion of the abrasive grains 16 becomes small. On the other hand, when the average particle size exceeds 35%, the thickness of the plating layer 14 below the concave portion 20 is small, so that it is not easy to fix the abrasive grains 16.

  Here, the average particle diameter of the abrasive grains 16 is determined from the sieve openings used when classification is performed in accordance with JIS B 4130. For example, the average particle size of the abrasive grains that have passed through the 60 mesh sieve and remained on the 80 mesh sieve is 250 μm. In addition, although the average particle diameter of the abrasive grain 16 is not specifically limited, For example, it exists in the range of 40-1200 micrometers.

  The layer thickness on the front side in the processing direction of the recess 20 is substantially the same as the layer thickness T1 of the flat portion 24 described later.

  As will be described later, the plating layer 14 is formed while flowing the plating solution relative to the abrasive grains 16. That is, the plating solution contacts the abrasive grains 16 while flowing from upstream to downstream. The concave portion 20 is formed in the vicinity of the contact portion, in other words, the upstream end portion (front end portion) of the abrasive grains 16.

  On the other hand, on the opposite side of the recess 20 across the abrasive grains 16, that is, on the downstream end (rear end) of the abrasive grains 16, the layer thickness is the maximum at the portion where the abrasive grains 16 come into contact. A layer thickness changing portion 22 is formed which gradually decreases as the distance from 16 increases. In other words, in the layer thickness changing portion 22, the layer thickness is reduced starting from the rear end side of the abrasive grains 16.

  The layer thickness is substantially constant further downstream in the flow direction of the layer thickness changing portion 22. That is, the flat portion 24 is connected downstream of the layer thickness changing portion 22 in the flow direction. When the layer thickness of the flat portion 24 is T1 and the maximum layer thickness of the layer thickness changing portion 22 is T2, T2 is an extent obtained by adding the average particle diameter of the abrasive grains 16 to 0.05 to 0.25 to T1. Preferably there is.

  In the present embodiment, the plated layer 14 includes a gloss material (see reference numeral 26 in FIG. 6). For this reason, the plating layer 14 shows gloss.

  As shown in FIG. 3, the abrasive grain layer includes a plurality of abrasive grains 16. The spacing distance L between adjacent abrasive grains 16 is preferably at least twice the average grain size of the abrasive grains 16. The reason for this will be described later.

  Next, the manufacturing method according to the present embodiment for obtaining the above-described electrodeposition grindstone 10 will be described.

  First, as shown in FIG. 4, the abrasive grains 16 are placed on the base metal 12, and the abrasive grains 16 are attached to the base metal 12 via the base plating layer 28. That is, temporary fixing is performed. For this temporary fixing, for example, electrodeposition may be performed while using a known grindstone manufacturing apparatus described in JP 2010-234492 A. In addition, according to this grindstone manufacturing apparatus, it is also possible to classify the abrasive grains 16.

  At this time, the abrasive grains 16 are preferably arranged on the base metal 12 so that the distance L between the adjacent abrasive grains 16 is at least twice the average grain diameter of the abrasive grains 16. The said grindstone manufacturing apparatus can also arrange | position the abrasive grain 16 so that adjacent things may space apart at predetermined intervals. That is, by using the grindstone manufacturing apparatus, it becomes easy to dispose the abrasive grains 16 so that the separation distance L is twice or more the average particle diameter.

  After temporarily fixing the abrasive grains 16 to the base metal 12 as described above, a plating process is performed by the plating apparatus 30 shown in FIG. 5 to form a plating layer 14 for performing the main fixing.

  The plating apparatus 30 will be briefly described. The plating apparatus 30 includes a fluid treatment tank 32 and a circulation supply line 34, and the plating solution is circulated and supplied to the fluid treatment tank 32 via the circulation supply line 34. As the plating solution, for example, a solution capable of obtaining the nickel plating layer 14 may be selected.

  Specifically, the fluid treatment tank 32 is accommodated in a collection tank 35 that stores the plating solution overflowed from the fluid treatment tank 32. That is, the plating solution is continuously supplied to the fluid treatment tank 32 during the plating process. For this reason, the plating solution overflows from the flow treatment tank 32 as indicated by an arrow OF and flows into the collection tank 35. Eventually, the overflowed plating solution is collected by the collection tank 35.

  On the other hand, the circulation supply line 34 is provided with a first pump 36, a filter 38 and a recovery tank 40. The plating solution in the collection tank 35 is sucked under the action of the first pump 36, passes through the filter 38, removes foreign matter, and then temporarily stored in the collection tank 40.

  In the circulation supply line 34, a second pump 42 is provided on the downstream side of the collection tank 40. The plating solution in the collection tank 40 is sucked by the second pump 42 and supplied to the discharge nozzle 44 provided in the flow treatment tank 32. Of course, the plating solution is discharged from the discharge nozzle 44 into the flow treatment tank 32. By performing the above circulation, the plating solution is circulated and supplied into the fluid treatment tank 32.

  As shown in FIG. 5, the flow treatment tank 32 has a substantially perfect circle shape in a plan view. And the discharge nozzle 44 is arrange | positioned so that it may be unevenly distributed in the inner peripheral wall vicinity of the flow processing tank 32. FIG. Therefore, after the plating solution discharged from the discharge nozzle 44 contacts the inner peripheral wall, it flows along the inner peripheral wall. For this reason, as indicated by an arrow X, an arc-shaped flow is generated in the plating solution in the flow treatment tank 32.

  In the fluid treatment tank 32, the base metal 12 on which the abrasive grains 16 are temporarily fixed is immersed in the plating solution in advance. For this reason, the plating solution contacts the abrasive grains 16 while flowing. This state is shown in FIG. Note that reference numeral 26 in FIG. 6 is a known gloss material contained in the plating solution.

  The plating solution first contacts the front end portion (the upstream end portion in the flow direction) of the abrasive grains 16. Along with this, the plating solution branches along the front end portion and then flows along the side portion of the abrasive grain 16. Further, the plating solution joins downstream of the rear end portion (downstream end portion in the flow direction) of the abrasive grains 16. When the separation distance L between adjacent abrasive grains 16 (see FIG. 3) is twice or more the average grain diameter of the abrasive grains 16, the above flow is formed in the vicinity of the individual abrasive grains 16.

  Since the flow of the plating solution is blocked by the abrasive grains 16 on the front end side of the abrasive grains 16 with which the plating solution comes into contact, the glossy material 26 tends to stay. Further, the gloss material 26 tends to stay on the side portions of the abrasive grains 16. That is, the concentration of the gloss material 26 locally increases on the front end portion side and the side portion side of the abrasive grains 16. On the other hand, the gloss material 26 hardly reaches the rear end side of the abrasive grains 16. For this reason, the density | concentration of the glossy material 26 becomes small in the rear-end part side of the abrasive grain 16 compared with the front-end part side and the side part side.

  Under such circumstances, for example, when electroplating is performed, the current efficiency decreases at a location where the gloss material 26 is concentrated at a high concentration, while the current efficiency increases at a location where the concentration of the gloss material 26 is low. . That is, a difference in current efficiency occurs in the vicinity of the abrasive grains 16.

  The amount of plating deposition is small at locations where the current efficiency is small, and conversely increases at locations where the current efficiency is large. That is, the layer thickness of the plating layer 14 decreases on the front end side where current efficiency is small, and increases on the rear end side where current efficiency is large. In the plated layer 14, the reason why the recess 20 is formed on the front end side of the abrasive grains 16 and the layer thickness changing portion 22 is formed on the rear end side is presumed to be this.

  The depth of the recess 20 and the maximum layer thickness of the layer thickness changing part 22 can be controlled by adjusting the flow rate of the plating solution in the flow treatment tank 32. For example, when the average grain size of the abrasive grains 16 is 0.12 mm and the discharge pressure is set so that the plating solution flows at a flow rate of 75 cm / second, the recess 20 having a depth of about 15 μm, the maximum layer thickness As a result, the layer thickness changing portion 22 is formed which is approximately 10 μm larger than the flat portion 24. In this case, the maximum layer thickness (T2) of the layer thickness changing portion 22 is a thickness obtained by adding 8% of the average particle diameter to the thickness (T1) of the flat portion 24.

  The abrasive grains 16 are permanently fixed (fixed) to the base metal 12 by the plating layer 14 formed as described above. As a result, the electrodeposition grindstone 10 having the plating layer 14 in which the concave portion 20 and the layer thickness changing portion 22 are formed so as to sandwich the abrasive grains 16 is obtained.

  The electrodeposition grindstone 10 is used when grinding a workpiece. At this time, the processing direction is the arrow Z direction in FIG. That is, the chips are generated toward the arrow Z and discharged to the side opposite to the arrow Z direction.

  The chips are discharged using the gaps between the abrasive grains 16 and the recesses 20 as chip pockets. Thus, in the present embodiment, in addition to the gap between the abrasive grains 16, the recess 20 functions as a chip pocket. That is, the chip pocket has a large volume. Therefore, clogging and welding are unlikely to occur. For this reason, it is suppressed that grinding load rises even if grinding is repeated.

  Further, the volume of the exposed portion of the abrasive grains 16 is large because of the presence of the recesses 20, but the rear end portion side of the abrasive grains 16 is fixed by a layer thickness changing portion 22 having a large layer thickness. For this reason, the abrasive grains 16 are sufficiently held via the plating layer 14. That is, the abrasive grains 16 are difficult to drop off.

  Furthermore, even when the abrasive grains 16 are worn by repeated grinding, the recess 20 functions as a chip pocket, so that the function of discharging chips is maintained. For this reason, it is possible to continue cutting.

  In combination with the above, grinding can be carried out over a long period of time. That is, the life of the electrodeposition grindstone 10 can be extended.

  The present invention is not particularly limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

  For example, it is not necessary to include the gloss material 26 in the plating solution or the plating layer 14. Even in this case, the plating solution contacts the abrasive grains 16 during the plating process and the above-described flow occurs, so that it is possible to form the plating layer 14 having a different layer thickness depending on the part.

  Moreover, you may make it make a plating liquid flow by stirring using a stirring blade. Alternatively, the plating solution may be made to flow relative to the base metal 12 by moving the base metal 12 in the plating solution.

  Electrolytic degreasing, water washing, acid activation treatment, and water washing were performed on a base metal 12 having a diameter of 150 mm and a thickness of 10 mm made of steel. Next, the abrasive grains 16 having an average particle diameter of 0.12 mm that have passed through the 170 mesh sieve and remained on the 200 mesh sieve are separated on the base metal 12 by a separation distance L between the adjacent abrasive grains 16. Was placed to be 0.24 mm.

  Thereafter, by forming a base plating layer 28, the abrasive grains 16 were fixed to the base metal 12. The classification of the abrasive grains 16, the placement on the base metal 12, and the formation of the base plating layer 28 were performed by a grindstone manufacturing apparatus described in JP 2010-234492 A.

Next, the base metal 12 is accommodated in the flow treatment tank 32 of the plating treatment apparatus 30 shown in FIG. 5, and the nickel plating solution containing the gloss material 26 is discharged so that the flow rate becomes 30 cm / second or 75 cm / second. The plating solution was flowed by circulating supply through the nozzle 44. Furthermore, the current density was set to 1.7 A / cm ² and the current was applied for 100 minutes to perform electrolytic plating. As a result, when the flow rate is 30 cm / sec, the depth 20 is 6 μm (5% of the average particle diameter) and the maximum layer thickness is 82 μm (equivalent to adding 8% of the average particle diameter). The electrodeposition grindstone 10 having the nickel plating layer 14 in which the changing portion 22 was formed around the abrasive grains 16 was obtained. This is Example 1.

  In addition, when the flow rate is 75 cm / sec, the recess 20 has a depth of 18 μm (15% of the average particle diameter) and the layer thickness change has a maximum layer thickness of 84 μm (corresponding to addition of 10% of the average particle diameter). The electrodeposition grindstone 10 having the nickel plating layer 14 with the portion 22 formed around the abrasive grains 16 was obtained. This is Example 2.

  For comparison, an electrodeposition grindstone having a nickel plating layer 14 having a substantially constant layer thickness was obtained using a general plating bath in which the nickel plating solution does not flow. This is a comparative example. In this comparative example, the thickness of the nickel plating layer 14 was approximately 72 μm (60% of the average particle diameter).

  To rotate the electrodeposition grindstone 10 while changing the grinding efficiency with respect to SCM420 (chromium molybdenum steel standardized by JIS) using the electrodeposition grindstones of Example 1, Example 2 and Comparative Example above. The required rotational torque was measured. The results are graphed and shown in FIG.

In the electrodeposition grindstone of the comparative example, the rotational torque significantly increased at 10 mm ³ / sec or more. That is, the grinding resistance increased. Furthermore, clogging occurred at 20 mm ³ / sec, and further grinding could not be performed.

On the other hand, in both Examples 1 and 2, the rotational torque only increased gently until the grinding efficiency reached 20 mm ³ / sec. That is, even when the grinding efficiency is increased, grinding for a long time was possible. The reason for this is considered to be that in Examples 1 and 2, the volume of the chip pocket is large, and after the abrasive grains 16 are worn, the recess 20 functions as a chip pocket and chips are discharged.

DESCRIPTION OF SYMBOLS 1,10 ... Electrodeposition grindstone 2,12 ... Base metal 3,14 ... Plating layer 4,16 ... Abrasive grain 20 ... Concavity 22 ... Layer thickness change part 24 ... Flat part 26 ... Glossy material 30 ... Plating treatment apparatus 32 ... Flow Treatment tank 34 ... Circulation supply line

Claims (7)

In the electrodeposition grindstone having abrasive grains fixed to the base metal through the plating layer,
The plating layer is formed on the opposite side of the concave portion with the abrasive grains sandwiched between the concave portion that exposes a part of the abrasive grains from the plating layer and that is depressed toward the base metal. A layer thickness portion having a larger layer thickness, and a layer thickness changing portion where the layer thickness gradually decreases as the distance from the abrasive begins from the layer thickness portion,
An electrodeposition grindstone characterized in that a groove is formed in the plating layer so as to be continuous with the concave portion and extend at a position facing each other with the layer thickness portion and the layer thickness changing portion interposed therebetween.   2. The electrodeposition grindstone according to claim 1, wherein a depth of the concave portion of the plating layer is 5 to 35% of an average particle diameter of the abrasive grains, and a maximum layer thickness of the layer thickness changing portion is the plating layer. An electrodeposition grindstone characterized by being 5 to 25% larger than the average particle size of the abrasive grains than the layer thickness of the flat portion.   The electrodeposition grindstone according to claim 1 or 2, wherein the adjacent abrasive grains are separated by a distance of at least twice the average particle diameter of the abrasive grains.   The electrodeposition grindstone according to any one of claims 1 to 3, wherein the plating layer includes a brightening material. In the manufacturing method of the electrodeposition grindstone that fixes the abrasive grains to the base metal through the plating layer,
Storing the base metal to which the abrasive grains are attached in a plating tank;
Performing a plating process while flowing a plating solution in one direction relative to the abrasive grains in the plating tank, and forming a plating layer for fixing the abrasive grains to the base metal;
Have
By colliding the plating solution with the abrasive grains, the plating layer on the upstream side in the flow direction forms a recess that is depressed toward the base metal and exposes a part of the abrasive grains from the plating layer. The plating layer on the downstream side in the flow direction has a layer thickness portion that is thicker than other portions, and the layer thickness gradually decreases as the layer thickness portion starts from the layer thickness portion. And forming a layer thickness changing portion,
Wherein the plating layer, continuous with the recess, and a manufacturing method of the electrodeposited grindstone, which comprises forming the extended grooves in a sandwiched therebetween facing located between the layer thickness portion and the layer thickness change section.   6. The electrodeposition grindstone according to claim 5, wherein the adjacent abrasive grains are attached to the base metal so as to be separated by a distance of at least twice the average particle diameter of the abrasive grains. Production method.   7. The method of manufacturing an electrodeposition grindstone according to claim 5, wherein the plating solution contains a brightening material.

Images