Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP6357973B2 - Electronic devices - Google Patents
[go: Go Back, main page]

JP6357973B2 - Electronic devices - Google Patents

Electronic devices Download PDF

Info

Publication number
JP6357973B2
JP6357973B2 JP2014170520A JP2014170520A JP6357973B2 JP 6357973 B2 JP6357973 B2 JP 6357973B2 JP 2014170520 A JP2014170520 A JP 2014170520A JP 2014170520 A JP2014170520 A JP 2014170520A JP 6357973 B2 JP6357973 B2 JP 6357973B2
Authority
JP
Japan
Prior art keywords
stem
flexible substrate
lead terminal
hole
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014170520A
Other languages
Japanese (ja)
Other versions
JP2016046425A (en
Inventor
圭蔵 緒方
圭蔵 緒方
祐士 増山
祐士 増山
端佳 畑
端佳 畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2014170520A priority Critical patent/JP6357973B2/en
Publication of JP2016046425A publication Critical patent/JP2016046425A/en
Application granted granted Critical
Publication of JP6357973B2 publication Critical patent/JP6357973B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

本発明は、フレキシブル基板がステムにはんだで取り付けられた電子デバイスに関する。   The present invention relates to an electronic device in which a flexible substrate is attached to a stem with solder.

電子デバイスの筐体としてステムが用いられる（例えば、特許文献１参照）。近年の電子デバイスの小型化を背景に、可動部品又は立体的な配線用の部品として、フレキシブル基板が用いられている。フレキシブル基板はステムにはんだで取り付けられる。   A stem is used as the housing of the electronic device (see, for example, Patent Document 1). With the recent miniaturization of electronic devices, flexible substrates are used as movable parts or three-dimensional wiring parts. The flexible substrate is attached to the stem with solder.

特開２０００−１８３４４０号公報JP 2000-183440 A

しかし、フレキシブル基板の取り付け時にはんだがリード端子を伝ってフレキシブル基板側からステム側に流れ出し、ステムとリード端子のショートが発生するという問題があった。   However, when the flexible substrate is attached, there is a problem that the solder flows along the lead terminal and flows out from the flexible substrate side to the stem side, causing a short circuit between the stem and the lead terminal.

本発明は、上述のような課題を解決するためになされたもので、その目的はステムとリード端子のショートを防ぐことができる電子デバイスを得るものである。   The present invention has been made to solve the above-described problems, and an object thereof is to obtain an electronic device capable of preventing a short circuit between a stem and a lead terminal.

本発明に係る電子デバイスは、第１の貫通孔を有するステムと、第２の貫通孔を有するフレキシブル基板と、前記第１及び第２の貫通孔を貫通するリード端子と、前記第１の貫通孔内において前記ステムと前記リード端子との間を埋める絶縁性ガラスと、前記フレキシブル基板に設けられた配線パターンと、前記リード端子と前記配線パターンを接続するはんだとを備え、前記絶縁性ガラスは前記第１の貫通孔の内壁を全て覆い、前記絶縁性ガラスは、前記フレキシブル基板側の面に凹部を有し、前記凹部は、前記第１の貫通孔内において前記リード端子の側面を露出させるように前記リード端子に沿って設けられ、前記フレキシブル基板側から流れてきた前記はんだを収容して前記はんだが前記絶縁性ガラスを乗り越えて前記ステム側に流れ出すのを防ぐことを特徴とする。 The electronic device according to the present invention includes a stem having a first through hole, a flexible substrate having a second through hole, a lead terminal penetrating the first and second through holes, and the first through hole. Insulating glass that fills the space between the stem and the lead terminal in the hole, a wiring pattern provided on the flexible substrate, and solder that connects the lead terminal and the wiring pattern, the insulating glass is Covering all inner walls of the first through-hole, the insulating glass has a concave portion on the surface of the flexible substrate, and the concave portion exposes a side surface of the lead terminal in the first through-hole. wherein provided along the lead terminal as the flow in the stem side said housing the solder flowing from the flexible substrate side solder rides over the insulating glass Characterized in that to prevent the out.

本発明では、リード径が他の部分より大きいリード端子の第３の部分によりはんだがフレキシブル基板側からステム側に流れ出すのを防ぐ。この結果、フレキシブル基板の取り付け時のはんだの流れ出しによるステムとリード端子のショートを防ぐことができる。   In the present invention, the third portion of the lead terminal whose lead diameter is larger than the other portions prevents the solder from flowing out from the flexible substrate side to the stem side. As a result, it is possible to prevent a short circuit between the stem and the lead terminal due to the flow of solder when the flexible substrate is attached.

本発明の実施の形態１に係る電子デバイスを示す断面図である。It is sectional drawing which shows the electronic device which concerns on Embodiment 1 of this invention. 比較例に係る電子デバイスを示す断面図である。It is sectional drawing which shows the electronic device which concerns on a comparative example. 本発明の実施の形態２に係る電子デバイスを示す断面図である。It is sectional drawing which shows the electronic device which concerns on Embodiment 2 of this invention.

本発明の実施の形態に係る電子デバイスについて図面を参照して説明する。同じ又は対応する構成要素には同じ符号を付し、説明の繰り返しを省略する場合がある。   An electronic device according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

実施の形態１．
図１は、本発明の実施の形態１に係る電子デバイスを示す断面図である。ステム１は第１の貫通孔２を有する。フレキシブル基板３は第２の貫通孔４を有する。リード端子５は、第１の貫通孔２を貫通する第１の部分５ａと、第２の貫通孔４を貫通する第２の部分５ｂと、ステム１とフレキシブル基板３の間に配置された第３の部分５ｃとを有する。第３の部分５ｃは第１及び第２の部分５ａ，５ｂよりもリード径が大きい。 Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing an electronic device according to Embodiment 1 of the present invention. The stem 1 has a first through hole 2. The flexible substrate 3 has a second through hole 4. The lead terminal 5 includes a first portion 5 a that penetrates the first through hole 2, a second portion 5 b that penetrates the second through hole 4, and a first portion disposed between the stem 1 and the flexible substrate 3. 3 portion 5c. The third portion 5c has a larger lead diameter than the first and second portions 5a and 5b.

絶縁性ガラス６は、第１の貫通孔２内においてステム１とリード端子５との間を埋める低融点ガラスである。配線パターン７がフレキシブル基板３に設けられている。はんだ８がリード端子５と配線パターン７を接続する。   The insulating glass 6 is a low-melting glass that fills the space between the stem 1 and the lead terminal 5 in the first through hole 2. A wiring pattern 7 is provided on the flexible substrate 3. Solder 8 connects lead terminal 5 and wiring pattern 7.

続いて、本実施の形態の効果を比較例と比較して説明する。図２は、比較例に係る電子デバイスを示す断面図である。比較例のリード端子５はリード径が一定である。このため、フレキシブル基板３の取り付け時にはんだ８がリード端子５を伝ってフレキシブル基板３側からステム１側に流れ出し、ステム１とリード端子５のショートが発生する。   Subsequently, the effect of the present embodiment will be described in comparison with a comparative example. FIG. 2 is a cross-sectional view illustrating an electronic device according to a comparative example. The lead diameter of the lead terminal 5 of the comparative example is constant. For this reason, when the flexible substrate 3 is attached, the solder 8 flows along the lead terminal 5 and flows out from the flexible substrate 3 side to the stem 1 side, and a short circuit between the stem 1 and the lead terminal 5 occurs.

一方、本実施の形態では、リード径が他の部分より大きいリード端子５の第３の部分５ｃによりはんだ８がステム１側に流れ出すのを防ぐことができる。この結果、フレキシブル基板３の取り付け時のはんだ８の流れ出しによるステム１とリード端子５のショートを防ぐことができる。   On the other hand, in the present embodiment, the solder 8 can be prevented from flowing out to the stem 1 side by the third portion 5c of the lead terminal 5 whose lead diameter is larger than the other portions. As a result, a short circuit between the stem 1 and the lead terminal 5 due to the flow of the solder 8 when the flexible substrate 3 is attached can be prevented.

実施の形態２．
図３は、本発明の実施の形態２に係る電子デバイスを示す断面図である。本実施の形態では、実施の形態１のようにリード端子５が第３の部分５ｃを有する代わりに、ステム１のリード固定部である絶縁性ガラス６がフレキシブル基板３側の面に凹部９を有する。この凹部９がフレキシブル基板３側から流れてきたはんだ８を収容するため、はんだ８が絶縁性ガラス６を乗り越えてステム１側に流れ出すのを防ぐことができる。この結果、実施の形態１と同様にステム１とリード端子５のショートを防ぐことができる。 Embodiment 2. FIG.
FIG. 3 is a cross-sectional view showing an electronic device according to Embodiment 2 of the present invention. In the present embodiment, instead of the lead terminal 5 having the third portion 5c as in the first embodiment, the insulating glass 6 that is the lead fixing portion of the stem 1 is provided with the recess 9 on the surface of the flexible substrate 3 side. Have. Since the concave portion 9 accommodates the solder 8 flowing from the flexible substrate 3 side, the solder 8 can be prevented from flowing over the insulating glass 6 to the stem 1 side. As a result, the short circuit between the stem 1 and the lead terminal 5 can be prevented as in the first embodiment.

１ ステム、２ 第１の貫通孔、３ フレキシブル基板、４ 第２の貫通孔、５ リード端子、５ａ 第１の部分、５ｂ 第２の部分、５ｃ 第３の部分、６ 絶縁性ガラス、７ 配線パターン、８ はんだ、９ 凹部 DESCRIPTION OF SYMBOLS 1 Stem, 2 1st through-hole, 3 Flexible substrate, 2nd through-hole, 5 Lead terminal, 5a 1st part, 5b 2nd part, 5c 3rd part, 6 Insulating glass, 7 Wiring Pattern, 8 solder, 9 recess

Claims (1)

第１の貫通孔を有するステムと、
第２の貫通孔を有するフレキシブル基板と、
前記第１及び第２の貫通孔を貫通するリード端子と、
前記第１の貫通孔内において前記ステムと前記リード端子との間を埋める絶縁性ガラスと、
前記フレキシブル基板に設けられた配線パターンと、
前記リード端子と前記配線パターンを接続するはんだとを備え、
前記絶縁性ガラスは前記第１の貫通孔の内壁を全て覆い、
前記絶縁性ガラスは、前記フレキシブル基板側の面に凹部を有し、
前記凹部は、前記第１の貫通孔内において前記リード端子の側面を露出させるように前記リード端子に沿って設けられ、前記フレキシブル基板側から流れてきた前記はんだを収容して前記はんだが前記絶縁性ガラスを乗り越えて前記ステム側に流れ出すのを防ぐことを特徴とする電子デバイス。 A stem having a first through hole;
A flexible substrate having a second through hole;
Lead terminals that pass through the first and second through holes;
Insulating glass filling the space between the stem and the lead terminal in the first through hole;
A wiring pattern provided on the flexible substrate;
Comprising solder for connecting the lead terminal and the wiring pattern;
The insulating glass covers all the inner walls of the first through hole,
The insulating glass has a recess on the surface of the flexible substrate,
The recess is provided along the lead terminal so as to expose a side surface of the lead terminal in the first through hole, and accommodates the solder flowing from the flexible substrate side so that the solder is insulated. An electronic device that prevents the glass from flowing over the stem glass over the glass.
JP2014170520A 2014-08-25 2014-08-25 Electronic devices Expired - Fee Related JP6357973B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014170520A JP6357973B2 (en) 2014-08-25 2014-08-25 Electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014170520A JP6357973B2 (en) 2014-08-25 2014-08-25 Electronic devices

Publications (2)

Publication Number Publication Date
JP2016046425A JP2016046425A (en) 2016-04-04
JP6357973B2 true JP6357973B2 (en) 2018-07-18

Family

ID=55636705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014170520A Expired - Fee Related JP6357973B2 (en) 2014-08-25 2014-08-25 Electronic devices

Country Status (1)

Country Link
JP (1) JP6357973B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6924641B2 (en) * 2017-07-17 2021-08-25 日本特殊陶業株式会社 Light emitting element mounting package and its manufacturing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4824526Y1 (en) * 1969-03-18 1973-07-17
JPH0547508Y2 (en) * 1987-02-27 1993-12-14
JP2002176251A (en) * 2000-12-05 2002-06-21 Sanyo Electric Co Ltd Method of manufacturing electronic parts

Also Published As

Publication number Publication date
JP2016046425A (en) 2016-04-04

Similar Documents

Publication Publication Date Title
JP5909660B2 (en) Wiring board
JP2016207957A5 (en)
JP2015122608A5 (en)
JP2014072205A5 (en)
US20170353803A1 (en) Microphone
JP6357973B2 (en) Electronic devices
JP2015176966A (en) Electronic device
JP2015035531A5 (en)
JP2016092138A5 (en)
JP6213780B2 (en) Wiring board
JP6531292B2 (en) Printed wiring board
JP6597916B2 (en) Circuit module and manufacturing method thereof
JP2016225395A (en) Printed circuit board and electronic device
JP6323622B2 (en) Component mounting board
US9374897B2 (en) Printed wiring board
JP6121830B2 (en) Wiring board
JP6361102B2 (en) Semiconductor device and flexible circuit board
JP2015211109A (en) Electronic circuit board
JP2016115697A (en) Electronic device
JP2016025690A (en) Electronic module
JP6601943B2 (en) Circuit board, electronic component, and circuit board manufacturing method
JP3187469U (en) Main board structure for mounting sub boards upright
JP6370652B2 (en) Semiconductor device
JP2018107389A5 (en)
JP2017157701A (en) Printed Wiring Board

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161208

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171017

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171024

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180123

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180522

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180604

R150 Certificate of patent or registration of utility model

Ref document number: 6357973

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees