JP6364227B2 - Holding table - Google Patents

Description

  The present invention relates to a holding table that holds a package substrate.

  A package substrate called a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded Package) substrate has a package device formed in each region partitioned by a grid-like division line formed on the surface. Device portion and an outer peripheral surplus portion surrounding the device portion. The package substrate configured as described above is divided into individual package devices using, for example, a cutting blade.

  For example, a cutting device is used for dividing the package substrate. The cutting apparatus includes at least a holding table that holds a package substrate via a jig, for example, and a cutting unit that cuts the package substrate held by the holding table, and the cutting unit includes, for example, a disk containing diamond particles A cutting blade having a shape and cutting water spraying means for spraying cutting water onto the cutting blade are provided. In the cutting apparatus, the package substrate is divided into individual package devices by cutting along a planned division line with a cutting blade.

  When the package substrate is formed of a metal (for example, copper) lead frame, the cutting blade is worn and damaged particularly when cutting the outer peripheral surplus part. There has been proposed a cutting method in which the device portion is cut after the removal (see, for example, Patent Document 1).

  The holding table that holds the package substrate is of the type in which suction holes are formed at positions corresponding to each package device, and a cutting blade relief groove is formed in accordance with the position of the planned division line of the package substrate. (See, for example, Patent Document 2).

JP 2006-261525 A JP 2009-142992 A

  However, the above holding table holds the entire back surface of the package substrate including the outer peripheral surplus portion of the package substrate, so that stable cutting is possible. However, the surface tension is increased due to the accumulation of cutting water in the above-described relief groove. When the outer peripheral surplus portion is cut off, the outer peripheral surplus portion is stuck on the holding table due to the surface tension, and the cutting blade is cut when the device portion is cut. In addition, there is a problem of contact with the remaining end material and damage or wear.

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to reliably remove the outer peripheral surplus portion of a package substrate when the package substrate is cut.

The present invention sucks the back side of a package substrate that is composed of a device portion that is partitioned by a plurality of scheduled division lines and has a plurality of package devices formed on the surface, and an outer peripheral surplus portion that is formed on the outer periphery of the device portion. A holding table that divides the package substrate along the line to be divided by the cutting blade while supplying cutting water to the cutting blade and having a holding surface for holding the back side of the package substrate on the surface , A plurality of suction holes formed at positions corresponding to each package device of the holding part, a suction path communicating with a suction source that applies a suction action to the suction hole, and the plurality of division schedules of the holding surface A clearance groove formed at a position corresponding to the line and avoiding contact with the cutting blade, and the holding portion supports the back side of the outer peripheral surplus portion of the package substrate A plurality of a peripheral marginal support portions that space to block the surface tension of the cutting water, the該逃up grooves separately, characterized in that it is intermittently formed over the entire circumference of the outer circumferential surplus support portion .

The holding table of the present invention comprises a plurality of cutting blade relief grooves formed corresponding to a plurality of division lines that avoid contact with the cutting blade, and a holding portion that holds the back side of the package substrate, The holding portion has a plurality of outer peripheral surplus support portions that support the back surface side of the outer peripheral surplus portion of the package substrate, and the outer perimeter surplus support portion includes a space that blocks the surface tension of cutting water. Therefore, the cutting water does not flow into the space when the package substrate is cut, and the cutting water does not collect in the escape groove.
Therefore, when cutting the package substrate, it is possible to suppress the generation of surface tension of the cutting water in the escape groove, and to scatter the outer peripheral surplus part that has been cut off and to remove it reliably, and the cutting blade contacts the outer peripheral surplus part and breaks. No wear or wear.

It is a perspective view which shows the structure of a cutting device. It is a top view which shows the structure of a holding table. It is sectional drawing which shows the state which cuts the package board | substrate hold | maintained at the holding table from the front side. It is a side view which shows the state which cuts the package board | substrate hold | maintained at the holding table. It is sectional drawing which shows the state which cuts a package board | substrate using the holding table which is not equipped with the outer periphery excessive support part from the front side.

  A cutting apparatus 1 shown in FIG. 1 has an apparatus base 2, a holding table 4 that holds a package substrate on an upper surface 2a of the apparatus base 2, and a cutting feed means 5 that cuts and feeds the holding table 4 in the X-axis direction. And. The cutting feed means 5 includes a ball screw 50 extending in the X-axis direction, a motor 51 connected to one end of the ball screw 50, a pair of guide rails 52 extending in parallel with the ball screw 50, and a movable table that supports the holding table 4 from below. 53 at least. A pair of guide rails 52 are in sliding contact with the lower part of the moving table 53, and a ball screw 50 is screwed into a nut formed at the center of the moving table 53. Then, the holding table 4 can be moved in the X-axis direction together with the moving table 53 by being driven by the motor 51 and rotating the ball screw 50.

  A gate-shaped column 3 is erected so as to straddle the movement path (X-axis direction) of the holding table 4 at the rear portion of the upper surface 2a of the apparatus base 2 in the X-axis direction. On the side of the column 3, cutting means 6a and 6b for cutting the package substrate, an index feeding means 7a for indexing and feeding the cutting means 6a in the Y-axis direction, and an indexing feed for indexing and feeding the cutting means 6b in the Y-axis direction Means 7b, elevating means 8a for elevating the cutting means 6a in the Z-axis direction, and elevating means 8b for elevating the cutting means 6b in the Z-axis direction are provided.

  The cutting means 6a and 6b include a spindle 60 having an axis in the Y-axis direction, a spindle housing 61 that rotatably surrounds the spindle 60, a cutting blade 62 that is attached to the tip of the spindle 60 and cuts a workpiece, A cutting water supply nozzle 63 for supplying cutting water to the cutting blade 62 is provided. The cutting means 6a and 6b can rotate the spindle 60 at a predetermined rotational speed and rotate the cutting blade 62 at a predetermined rotational speed when driven by a motor.

  The index feeding means 7a, 7b includes a ball screw 70 extending in the Y-axis direction, a motor 71 connected to the ball screw 70, a guide rail 72 extending parallel to the ball screw 70, and an internal nut structure screwed into the ball screw 70. Each has a moving plate 73 slidably contacting the guide rail 72. When the ball screw 70 is rotated by being driven by the motor 71, the cutting means 6a and 6b can be moved together with the moving plate 73 in the Y-axis direction.

  Lifting means 8a and 8b are connected to the respective guide plates 73 constituting the index feeding means 7a and 7b. The elevating means 8a and 8b include a ball screw 80 extending in the Z-axis direction, a motor 81 connected to each ball screw 80, a pair of guide rails 82 extending parallel to the ball screw 80, and an internal nut structure attached to the ball screw 80. Elevating plates 83 that are screwed and whose side portions are in sliding contact with the pair of guide rails 82 are provided. Then, the ball screw 80 is driven by the motor 81 to rotate, whereby the cutting means 6a and 6b can be moved up and down together with the lifting plate 83 in the Z-axis direction.

  For example, the package substrate 10 is held on the holding table 4. The package substrate 10 is an example of a workpiece, and is, for example, a CSP substrate or a QFN substrate. The package substrate 10 has a package device 11 formed in each region defined by a plurality of grid-like division lines 14 on the surface 10a. For example, a mold resin 15 (see FIG. 3) is sealed on the back surface 10 b that is the surface opposite to the front surface 10 a of the package substrate 10, and the back surface 10 b side is held by the holding table 4. In the package substrate 10 in the example of FIG. 1, two device portions 12 each having a plurality of package devices 11 are formed, and an outer peripheral surplus portion 13 is formed outside the device portion 12. Note that there may be one device unit 12 or there may be three or more device units 12.

  The holding table 4 includes a holding portion 40 having a holding surface 40a for holding the back side of the workpiece on the surface, and the holding portion 40 is fixed on the upper surface 4a of the holding table 4 via a base 41. It has become. The base 41 is made of, for example, SUS.

  As shown in FIG. 2, the holding portion 40 includes a device holding portion 400 a that holds the back side of each package device 11 formed on the package substrate 10, and an outer peripheral surplus portion 13 that is connected to the outer peripheral side of the device portion 12. It is comprised by the outer periphery excess support part 400b which supports a back surface side. The device holding part 400a and the outer peripheral surplus support part 400b are made of, for example, high hardness (60 to 90) chloroprene rubber (CR), and are bonded to the upper surface of the base 41 with a water-resistant adhesive. .

  The holding table 4 is formed in a lattice shape at positions corresponding to the plurality of division lines 14 of the package substrate 10 on the holding surface 40 a of the holding unit 40 shown in FIG. 1, and escape grooves that avoid contact with the cutting blade 62. 42 is provided. The escape groove 42 is formed between the adjacent device holding portions 400a and at the boundary between the device holding portion 400a and the outer peripheral surplus support portion 400b, and has a configuration corresponding to the planned division line 14 of the package substrate 10 to be cut. Yes. Although the package substrate 10 is shown in an enlarged manner in FIG. 1, the actual size of the package substrate 10 is equivalent to the holding unit 40.

  As shown in FIG. 2, the outer peripheral surplus support part 400 b is arranged along the entire periphery of the device holding part 400 a arranged on the outer side among all the device holding parts 400 a arranged on the base 41. Yes. Moreover, the outer periphery surplus support part 400b provides the predetermined space 401 over the perimeter, and is arrange | positioned intermittently. By disposing the outer peripheral surplus support portion 400b in this way, the outer peripheral surplus portion 13 of the package substrate is held by the outer peripheral surplus support portion 400b and the cutting water used when cutting the package substrate 10 with the cutting blade 62 is used. The cutting water can flow not only in the escape groove 42 but also in the space 401 so that the cutting water does not accumulate in the escape groove 42. The width of the space 401 can be set arbitrarily.

  As shown in FIG. 3, the holding table 4 has a plurality of suction holes 43 formed in each device holding part 400 a at a position corresponding to each package device 11, one end communicating with the suction hole 43 and the other end sucking. And a suction passage 45 communicating with the source 44. When the suction source 44 is activated, the suction hole 43 can exert a suction action via the suction path 45, and the back surface side of the package substrate can be sucked and held. The holding table 4 configured in this manner is rotatably supported by a rotation support base 46 that is erected on the movable base 53 shown in FIG. The holding table 4 can be rotated while the holding portion 40 sucks and holds the back surface 10 b side of the package substrate 10.

  When cutting the package substrate 10 configured in this manner, the outer peripheral surplus portion 13 is separated in advance before dividing each device portion 12 into individual package devices 11.

  First, as shown in FIG. 1, the package substrate 10 is transferred to the holding table 4, and the holding portion 40 sucks and holds the back surface 10 b side of the package substrate 10. Specifically, the holding table 4 shown in FIGS. 2 and 3 operates the suction source 44 to apply a suction force to the suction hole 43 through the suction path 45 to thereby provide the back side of the device unit 12 of the package substrate 10. Is held by the device holding part 400a and the back side of the outer peripheral surplus part 13 of the package substrate 10 is supported by the outer peripheral surplus support part 400b.

  After the holding portion 40 sucks and holds the back surface 10b side of the package substrate 10, the moving base 53 of the cutting feed means 5 shown in FIG. 1 is moved in the X-axis direction and the spindle 60 of the cutting means 6a and 6b. And the cutting blade 62 is lowered by the lifting and lowering means 7a and 7b until it contacts the package substrate 10 while rotating the cutting blade 62.

  Then, two boundaries between the device portion 12 and the outer peripheral surplus portion 13 are first cut by the two cutting blades 62 that rotate. Thereafter, the cutting blade 62 is moved in the Y-axis direction by the index feeding means 7a and 7b, respectively, and the other two boundaries between the device portion 12 and the outer peripheral surplus portion 13 are cut by the two cutting blades 62 that rotate. Subsequently, the package substrate 10 is rotated 90 degrees together with the holding table 4, and the outer peripheral surplus portion 13 is separated from the device portion 12 by cutting the boundary between the device portion 12 and the outer peripheral surplus portion 13 by the same operation as described above.

  After the outer peripheral surplus portion 13 is separated from the device portion 12, the cutting blade 62 performs cutting along all the planned division lines 14 facing the X-axis direction. Next, by rotating the holding table 4 by 90 degrees, the planned division line 14 oriented in the Y-axis direction is oriented in the X-axis direction, and similarly to the above, the planned division line 14 oriented in the X-axis direction by the cutting blade 62. The device portion 12 is divided into individual package devices 11.

  When cutting the package substrate 10, the cutting blade 62 is cut into the package substrate 10 along the scheduled division line 14, and then the tip of the cutting blade 62 is accommodated in the clearance groove 42 shown in FIGS. 2 and 3. It is possible to prevent the cutting edge of the cutting blade 62 from coming into contact with the holding portion 40 and prevent the cutting blade 62 from being damaged or the apparatus from being damaged.

  As shown in FIG. 4, when the package substrate 10 is cut by the rotating cutting blade 62 while moving the package substrate 10 in the X-axis direction, the cutting water supply nozzle 63 shown in FIG. Is supplied toward the cutting blade 62. When cutting with the cutting blade 62 from the surface 10 a side of the package substrate 10, the cutting water also flows into the escape groove 42. However, the cutting water that has flowed into the escape groove 42 also flows into the intermittent space 401 of the outer peripheral surplus support portion 400b. Therefore, since cutting water does not accumulate in the escape groove 42 during cutting of the package substrate 10, cutting water does not accumulate in the escape groove 42 and the outer peripheral surplus portion 13 does not stick due to the surface tension. Therefore, the outer peripheral surplus part 13 separated from the device part 12 is likely to scatter, and the outer peripheral surplus part 13 does not remain on the holding surface 40 a of the holding part 40.

  As shown in FIG. 2, if an open space is provided on the extended line of the escape groove 42, it is possible to more reliably prevent cutting water from accumulating in the escape groove 42.

  As described above, in the holding table 4 of the present invention, the space 401 for cutting off the surface tension of the cutting water is intermittently formed over the entire circumference of the outer peripheral surplus support portion 400b. Does not flow into the space 401 and the cutting water does not accumulate in the escape groove 42. Therefore, when the device part 12 is divided into the individual package devices 11, it is possible to suppress the surface tension from being generated in the escape groove 42 and to disperse and remove the outer peripheral surplus part 13 separated from the device part 12. Therefore, the cutting blade 63 does not come into contact with the outer peripheral surplus portion 13 to be damaged or worn.

  Further, in order to prevent cutting water from accumulating in the escape groove 42 of the outer peripheral surplus support part 400b and sticking the outer peripheral surplus part 13 to the outer peripheral surplus support part 400b due to surface tension, for example, only the device holding part 400a shown in FIG. It is conceivable that the back surface 10b side of the package substrate 10 is held only by the device holding portion 400a using the holding portion 40A that is provided and does not have a portion that supports the outer peripheral surplus portion 13. However, in the holding portion 40A having this configuration, when the outer peripheral surplus portion 13 is separated from the device portion 12, the outer peripheral surplus portion 13 of the package substrate 10 is bent, and the device shape cross section of the package substrate 10 after cutting becomes oblique. In some cases, the desired processing quality cannot be obtained.

  On the other hand, in the holding table 4 according to the present invention, since the outer peripheral surplus portion 13 of the package substrate 10 is supported from below by the outer peripheral surplus support portion 400b shown in FIG. 3, the entire back surface 10b of the package substrate 10 is supported from below. In addition, it is possible to prevent surface tension from being generated in the escape groove 42 in the outer peripheral surplus support portion 400b and to disperse the outer peripheral surplus portion 13 during cutting.

1: Cutting device 2: Device base 2a: Upper surface 3: Column 4: Holding table 4a: Upper surface 10: Package substrate 10a: Front surface 10b: Back surface 11: Package device 12: Device portion 13: Peripheral surplus portion 14: Scheduled division line 15 : Mold resin 40, 40A: Holding part 40a: Holding surface 400a: Device holding part 400b: Excess outer peripheral support part 401: Space 41: Base 42: Escape groove 43: Suction hole 44: Suction source 45: Suction path 46: Rotation Support base 5: Cutting feed means 50: Ball screw 51: Motor 52: Guide rail 53: Moving base 6a, 6b: Cutting means 60: Spindle 61: Spindle housing 62: Cutting blade 63: Cutting water supply nozzles 7a, 7b: Index feed Means 70: Ball screw 71: Motor 72: Guide rail 73: Moving plates 8a, 8 : Lifting means 80: ball screw 81: motor 82: Guide rail 83: elevating plate

Claims (1)

Suction and hold the back side of the package substrate, which is composed of a device part that is partitioned by a plurality of scheduled division lines and has a plurality of package devices formed on the surface, and an outer peripheral surplus part that is formed on the outer periphery of the device part. A holding table that divides the package substrate along the division line by the cutting blade while supplying water to the cutting blade,
A holding part having a holding surface on the surface for holding the back side of the package substrate;
A plurality of suction holes formed at positions corresponding to each package device of the holding unit;
A suction path that communicates with a suction source that applies suction to the suction holes;
A relief groove formed at a position corresponding to the plurality of division lines on the holding surface and avoiding contact with the cutting blade,
The holding portion has a plurality of outer peripheral surplus support portions that support the back side of the outer peripheral surplus portion of the package substrate, and a space for cutting off the surface tension of the cutting water is separate from the escape groove and the outer peripheral surplus support portion. The holding table is formed intermittently over the entire circumference of the part.

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