JP6366289B2 - Status reporting apparatus, substrate processing apparatus, and status reporting method - Google Patents

Description

  The present invention relates to a status report device, a substrate processing apparatus, and a status report method.

  In recent years, a substrate processing apparatus has been used to perform various processes on a substrate such as a semiconductor wafer. As an example of the substrate processing apparatus, there is a CMP (Chemical Mechanical Polishing) apparatus for polishing a substrate.

  The CMP apparatus is a polishing unit for performing a polishing process on a substrate, a cleaning unit for performing a cleaning process and a drying process on a substrate, a substrate that is transferred to the polishing unit and receives a substrate that has been cleaned and dried by the cleaning unit. Equipped with a load / unload unit.

  The substrate processing apparatus is connected to a host computer via a LAN cable or the like. The substrate processing apparatus sequentially performs various processes such as polishing, cleaning, and drying of the substrate based on a command sent from the host computer. The substrate processing apparatus transmits data indicating the state of the substrate processing apparatus to the host computer. The host computer manages the substrate processing apparatus based on the data received from the substrate processing apparatus.

  Communication between the substrate processing apparatus and the host computer is generally based on a communication standard such as SEMI (Semiconductor Equipment and Materials International). For example, the substrate is automatically transferred to each unit of the substrate processing apparatus and processed based on processing conditions instructed by the host computer. Further, for example, an event report in the SEMI communication standard is used to notify the host computer of a change in the state of the substrate processing apparatus.

  The event report is used to report a change in the state of the substrate processing apparatus to the host computer. In the event report, for example, whenever the state of the substrate processing apparatus changes (event) such as “process started”, the change in the state of the substrate processing apparatus is reported to the host computer. In order to identify various state changes, an event ID (CEID) that can be reported by the substrate processing apparatus is defined in the communication specification of the substrate processing apparatus. The communication specification of the substrate processing apparatus defines a variable (VID) that can be reported in addition to a change in the state of the substrate processing apparatus. The variable (VID) includes various information such as a carrier ID and a lot ID.

  In addition, detailed information such as the state of the substrate processing apparatus and processing results can be added to the event report. The contents that can be added differ depending on the event. A report ID (RPTID) that defines a variable (VID) that can be reported for each event is defined. When an event occurs, the contents of a variable (VID) linked to the event are reported to the host computer as an event report.

  Note that linking an event and a report is called an event link. The event link is performed using the SEMI communication standard. By executing the event link, the content of the event report to the host computer is determined. The contents reported to the host computer are the same until the event link is made again.

Here, the event report includes a report of process data unique to the substrate processing apparatus in addition to the items defined by SEMI. For example, each unit of the substrate processing apparatus is provided with a sensor for detecting various data. When a process related to substrate processing is executed in the unit of the substrate processing apparatus, data detected by the sensor is transmitted (reported) to the host computer as process data. For example, when a unit of a substrate processing apparatus executes the same processing content a plurality of times (a plurality of steps) based on different parameters, in the conventional technique, after the execution of a plurality of steps is completed, the process data at each step is stored. It was reported to the host computer collectively.

JP 2009-141289 A JP 2000-260676 A JP 2006-93641 A

  The prior art does not consider reducing the communication load between the substrate processing apparatus and the host computer.

  That is, process data is increasing with the recent diversification of substrate processing apparatuses. In addition, in the prior art, when the unit executes a plurality of steps, the process data in each step is collectively reported to the host computer at the timing when the execution of the plurality of steps is completed. For this reason, communication traffic between the substrate processing apparatus and the host computer increases intensively at a certain timing, and as a result, the communication load between the substrate processing apparatus and the host computer increases.

  Accordingly, an object of the present invention is to reduce the communication load between the substrate processing apparatus and the host computer.

  One form of the status reporting device of the present invention is made in view of the above problems, and a sensor provided in the processing unit when a process related to substrate processing is executed for each of a plurality of processing units included in the substrate processing apparatus. And a communication unit that transmits the process data collected by the collection unit to a management device of the substrate processing apparatus, and the process includes a plurality of unit processes. And each time the execution of the unit processing is completed, the communication unit uses unit management data collected by the collection unit in response to the execution of the unit processing as process data relating to the unit processing. It is characterized by transmitting to.

  Further, in one form of the status reporting device, the communication unit may process the unit process data and an identifier for identifying the unit process each time the execution of the unit process is completed. To the management device.

  Further, in one form of the status reporting device, a common transmission format is set for the plurality of unit processes, and the communication unit uses the transmission format every time execution of the unit processes is completed. The unit process data and an identifier for identifying the unit process can be transmitted to the management apparatus as process data relating to the unit process.

In one form of the status reporting device, the communication unit uses the transmission format to execute the unit processing executed among the plurality of unit processings every time the unit processing is completed. Process data and an identifier for identifying the unit process can be transmitted to the management apparatus as process data relating to the unit process.

  Further, in one form of the status reporting device, the plurality of unit processes may be a plurality of steps for executing the same processing content in the processing unit based on different parameters.

  In one form of the status report device, the collection unit collects measurement results output from a film thickness measuring device that measures the film thickness of the substrate processed by the substrate processing apparatus, and the measurement of the film thickness , Including measurement of film thickness at a plurality of measurement points of the substrate, and the communication unit is configured to measure the partial film thickness each time measurement of a part of the plurality of measurement points is completed. The unit measurement results collected by the collection unit in response to the measurement can be transmitted to the management apparatus as film thickness data relating to the measurement of the partial film thickness.

  Further, one form of the substrate processing apparatus of the present invention is a plurality of processing units, an operation unit for inputting a recipe of a process to be executed by the plurality of processing units, and a recipe input via the operation unit. A storage unit for storing, a control unit that causes the plurality of processing units to execute the process based on a recipe stored in the storage unit, and any one of the above-described status reporting devices, To do.

  In one embodiment of the substrate processing apparatus, the plurality of processing units include a polishing unit for performing a polishing process on the substrate, a cleaning unit for performing a cleaning process and a drying process on the substrate, and a substrate to the polishing unit. And a load / unload unit that receives the substrate cleaned and dried by the cleaning unit.

  Further, according to one aspect of the status reporting method of the present invention, process data detected by a sensor provided in the processing unit when a process related to substrate processing is executed for each of a plurality of processing units included in the substrate processing apparatus. A collecting step for collecting, and a communication step for transmitting the process data collected by the collecting unit to a management device of the substrate processing apparatus, wherein the process includes a plurality of unit processes, and the communication step includes: The unit process data collected by the collection unit corresponding to the execution of the unit process is transmitted to the management apparatus as process data related to the unit process each time execution of the unit process ends. And

  According to the present invention, the communication load between the substrate processing apparatus and the host computer can be reduced.

FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus of the present embodiment. FIG. 2 is a perspective view schematically showing the polishing unit. FIG. 3A is a plan view showing the cleaning unit, and FIG. 3B is a side view showing the cleaning unit. FIG. 4 is a diagram showing the configuration of the status reporting device and the CMP device. FIG. 5 is a diagram illustrating an example of a processing recipe. FIG. 6 is a diagram showing message exchange between the CMP apparatus and the host computer at the time of general event linking. FIG. 7 is a diagram showing a message format of event setting (S2F37). FIG. 8 is a diagram showing a message format of the report definition (S2F33). FIG. 9 is a diagram showing a message format of the event link report (S2F35). FIG. 10 is a diagram illustrating an example of an event link created by the conventional technique. FIG. 11 is a diagram illustrating an example of an event link created according to the present embodiment. FIG. 12 is a diagram showing an outline of process data reporting in response to a request from the host computer. FIG. 13 is a diagram illustrating an example of a process data report according to a conventional technique. FIG. 14 is a diagram illustrating a message format of S6F11. FIG. 15 is a diagram illustrating an example of a process data report according to the present embodiment. FIG. 16 is a diagram illustrating a configuration of a state reporting device and a CMP device that report film thickness data measured by a film thickness measuring instrument. FIG. 17 is a diagram showing an outline of reporting of film thickness measurement data according to the prior art. FIG. 18 is a diagram showing an outline of reporting of film thickness measurement data according to the present embodiment.

  Hereinafter, a status report device, a substrate processing apparatus, and a status report method according to an embodiment of the present invention will be described with reference to the drawings. Hereinafter, a CMP apparatus will be described as an example of a substrate processing apparatus, but the present invention is not limited to this. Hereinafter, a substrate processing apparatus including the load / unload unit 2, the polishing unit 3, and the cleaning unit 4 will be described, but the present invention is not limited to this.

  First, the configuration of the CMP apparatus will be described, and then the reduction of communication load between the substrate processing apparatus and the host computer will be described.

<Substrate processing equipment>
FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the CMP apparatus includes a substantially rectangular housing 1, and the inside of the housing 1 is divided into a load / unload unit 2, a polishing unit 3, and a cleaning unit 4 by partition walls 1a and 1b. Has been. The load / unload unit 2, the polishing unit 3, and the cleaning unit 4 are assembled independently and exhausted independently. Further, the cleaning unit 4 has a control device 5 that controls the substrate processing operation.

<Load / Unload unit>
The load / unload unit 2 includes two or more (four in this embodiment) front load units 20 on which wafer cassettes for stocking a large number of wafers (substrates) are placed. These front load portions 20 are arranged adjacent to the housing 1 and are arranged along the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus. The front load unit 20 can be equipped with an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). Here, SMIF and FOUP are sealed containers that can maintain an environment independent of the external space by accommodating a wafer cassette inside and covering with a partition wall.

The load / unload unit 2 has a traveling mechanism 21 laid along the front load portion 20, and two transfer robots that can move along the arrangement direction of the wafer cassettes on the traveling mechanism 21. (Loader, transport mechanism) 22 is installed. The transfer robot 22 can access the wafer cassette mounted on the front load unit 20 by moving on the traveling mechanism 21. Each transfer robot 22 has two hands up and down. The upper hand is used when returning processed wafers to the wafer cassette. The lower hand is used when a wafer before processing is taken out from the wafer cassette. In this way, the upper and lower hands can be used properly. Furthermore, the lower hand of the transfer robot 22 is configured to be able to reverse the wafer by rotating around its axis.

  Since the load / unload unit 2 is an area where it is necessary to maintain the cleanest state, the load / unload unit 2 has a higher pressure inside the CMP apparatus, the polishing unit 3 and the cleaning unit 4 than the CMP apparatus. Always maintained. The polishing unit 3 is the most dirty region because slurry is used as the polishing liquid. Therefore, a negative pressure is formed inside the polishing unit 3, and the pressure is maintained lower than the internal pressure of the cleaning unit 4. The load / unload unit 2 is provided with a filter fan unit (not shown) having a clean air filter such as a HEPA filter, a ULPA filter, or a chemical filter. From the filter fan unit, particles, toxic vapor, Clean air from which toxic gases have been removed is constantly blowing out.

<Polishing unit>
The polishing unit 3 is a region where the wafer is polished (flattened), and includes a first polishing unit 3A, a second polishing unit 3B, a third polishing unit 3C, and a fourth polishing unit 3D. The first polishing unit 3A, the second polishing unit 3B, the third polishing unit 3C, and the fourth polishing unit 3D are arranged along the longitudinal direction of the substrate processing apparatus as shown in FIG.

  As shown in FIG. 1, the first polishing unit 3A includes a polishing table 30A to which a polishing pad 10 having a polishing surface is attached, and polishing while holding the wafer and pressing the wafer against the polishing pad 10 on the polishing table 30A. A top ring 31A for polishing, a polishing liquid supply nozzle 32A for supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad 10, and a dresser 33A for dressing the polishing surface of the polishing pad 10. And an atomizer 34A for spraying a mixed fluid of liquid (for example, pure water) and gas (for example, nitrogen gas) or a liquid (for example, pure water) to the polishing surface in the form of a mist.

  Similarly, the second polishing unit 3B includes a polishing table 30B to which the polishing pad 10 is attached, a top ring 31B, a polishing liquid supply nozzle 32B, a dresser 33B, and an atomizer 34B. The third polishing unit 3C includes a polishing table 30C to which the polishing pad 10 is attached, a top ring 31C, a polishing liquid supply nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth polishing unit 3D includes a polishing table 30D to which the polishing pad 10 is attached, a top ring 31D, a polishing liquid supply nozzle 32D, a dresser 33D, and an atomizer 34D.

  Since the first polishing unit 3A, the second polishing unit 3B, the third polishing unit 3C, and the fourth polishing unit 3D have the same configuration, the first polishing unit 31A will be described below.

FIG. 2 is a perspective view schematically showing the first polishing unit 3A. The top ring 31 </ b> A is supported by the top ring shaft 36. A polishing pad 10 is affixed to the upper surface of the polishing table 30A, and the upper surface of the polishing pad 10 constitutes a polishing surface for polishing the wafer W. Note that fixed abrasive grains may be used in place of the polishing pad 10. The top ring 31 </ b> A and the polishing table 30 </ b> A are configured to rotate around their axial centers as indicated by arrows. The wafer W is held on the lower surface of the top ring 31A by vacuum suction. At the time of polishing, the polishing liquid is supplied from the polishing liquid supply nozzle 32A to the polishing surface of the polishing pad 10, and the wafer W to be polished is pressed against the polishing surface by the top ring 31A and polished.

  Next, a transport mechanism for transporting the wafer will be described. As shown in FIG. 1, a first linear transporter 6 is disposed adjacent to the first polishing unit 3A and the second polishing unit 3B. The first linear transporter 6 has four transfer positions (first transfer position TP1, second transfer position TP2, and third transfer in order from the load / unload unit side) along the direction in which the polishing units 3A and 3B are arranged. This is a mechanism for transferring the wafer between the position TP3 and the fourth transfer position TP4.

  Further, the second linear transporter 7 is disposed adjacent to the third polishing unit 3C and the fourth polishing unit 3D. The second linear transporter 7 has three transfer positions (a fifth transfer position TP5, a sixth transfer position TP6, and a seventh transfer in order from the load / unload unit side) along the direction in which the polishing units 3C and 3D are arranged. This is a mechanism for transporting the wafer between the positions TP7.

  The wafer is transferred to the polishing units 3A and 3B by the first linear transporter 6. The top ring 31A of the first polishing unit 3A moves between the polishing position and the second transport position TP2 by the swing operation of the top ring head. Therefore, the wafer is transferred to the top ring 31A at the second transfer position TP2. Similarly, the top ring 31B of the second polishing unit 3B moves between the polishing position and the third transfer position TP3, and the delivery of the wafer to the top ring 31B is performed at the third transfer position TP3. The top ring 31C of the third polishing unit 3C moves between the polishing position and the sixth transfer position TP6, and the delivery of the wafer to the top ring 31C is performed at the sixth transfer position TP6. The top ring 31D of the fourth polishing unit 3D moves between the polishing position and the seventh transfer position TP7, and the delivery of the wafer to the top ring 31D is performed at the seventh transfer position TP7.

  A lifter 11 for receiving a wafer from the transfer robot 22 is disposed at the first transfer position TP1. The wafer is transferred from the transfer robot 22 to the first linear transporter 6 through the lifter 11. A shutter (not shown) is provided between the lifter 11 and the transfer robot 22 in the partition wall 1a. When the wafer is transferred, the shutter is opened so that the wafer is transferred from the transfer robot 22 to the lifter 11. It has become. A swing transporter 12 is disposed between the first linear transporter 6, the second linear transporter 7, and the cleaning unit 4. The swing transporter 12 has a hand that can move between the fourth transfer position TP4 and the fifth transfer position TP5, and transfers the wafer from the first linear transporter 6 to the second linear transporter 7. Is performed by the swing transporter 12. The wafer is transferred to the third polishing unit 3C and / or the fourth polishing unit 3D by the second linear transporter 7. Further, the wafer polished by the polishing unit 3 is conveyed to the cleaning unit 4 via the swing transporter 12.

<Washing unit>
FIG. 3A is a plan view showing the cleaning unit 4, and FIG. 3B is a side view showing the cleaning unit 4. As shown in FIGS. 3A and 3B, the cleaning unit 4 includes a first cleaning chamber 190, a first transfer chamber 191, a second cleaning chamber 192, a second transfer chamber 193, and a drying unit. It is partitioned into a chamber 194. In the first cleaning chamber 190, an upper primary cleaning module 201A and a lower primary cleaning module 201B arranged in the vertical direction are arranged. The upper primary cleaning module 201A is disposed above the lower primary cleaning module 201B. Similarly, in the second cleaning chamber 192, the upper secondary cleaning module 20 arranged along the vertical direction.
2A and the lower secondary cleaning module 202B are arranged. The upper secondary cleaning module 202A is disposed above the lower secondary cleaning module 202B. The primary and secondary cleaning modules 201A, 201B, 202A, and 202B are cleaning machines that clean the wafer using a cleaning liquid. Since these primary and secondary cleaning modules 201A, 201B, 202A, 202B are arranged along the vertical direction, there is an advantage that the footprint area is small.

  A temporary wafer placement table 203 is provided between the upper secondary cleaning module 202A and the lower secondary cleaning module 202B. In the drying chamber 194, an upper drying module 205A and a lower drying module 205B arranged in the vertical direction are arranged. These upper drying module 205A and lower drying module 205B are isolated from each other. Filter fan units 207 and 207 for supplying clean air into the drying modules 205A and 205B are provided above the upper drying module 205A and the lower drying module 205B, respectively. The upper primary cleaning module 201A, the lower primary cleaning module 201B, the upper secondary cleaning module 202A, the lower secondary cleaning module 202B, the temporary placement table 203, the upper drying module 205A, and the lower drying module 205B are arranged on a frame (not shown). It is fixed via bolts.

  A first transfer robot (transfer mechanism) 209 that can move up and down is arranged in the first transfer chamber 191, and a second transfer robot 210 that can move up and down is arranged in the second transfer chamber 193. The first transfer robot 209 and the second transfer robot 210 are movably supported by support shafts 211 and 212 extending in the vertical direction. The first transfer robot 209 and the second transfer robot 210 have a drive mechanism such as a motor inside thereof, and are movable up and down along the support shafts 211 and 212. The first transfer robot 209 has two upper and lower hands like the transfer robot 22. As shown by the dotted line in FIG. 3A, the first transfer robot 209 is disposed at a position where the lower hand can access the temporary table 180 described above. When the lower hand of the first transfer robot 209 accesses the temporary table 180, a shutter (not shown) provided on the partition wall 1b is opened.

  The first transfer robot 209 transfers the wafer W between the temporary placing table 180, the upper primary cleaning module 201A, the lower primary cleaning module 201B, the temporary placing table 203, the upper secondary cleaning module 202A, and the lower secondary cleaning module 202B. Operates to carry. The first transfer robot 209 uses the lower hand when transferring the wafer before cleaning (the wafer to which the slurry is attached), and uses the upper hand when transferring the cleaned wafer. The second transfer robot 210 operates to transfer the wafer W between the upper secondary cleaning module 202A, the lower secondary cleaning module 202B, the temporary placement table 203, the upper drying module 205A, and the lower drying module 205B. Since the second transfer robot 210 transfers only the cleaned wafer, it has only one hand. The transfer robot 22 shown in FIG. 1 takes out the wafer from the upper drying module 205A or the lower drying module 205B using the upper hand, and returns the wafer to the wafer cassette. When the upper hand of the transfer robot 22 accesses the drying modules 205A and 205B, a shutter (not shown) provided on the partition wall 1a is opened.

<Reduction of communication load between substrate processing apparatus and host computer>
Next, the reduction of communication load between the substrate processing apparatus and the host computer will be described.

  FIG. 4 is a diagram showing the configuration of the status reporting device and the CMP device. As described above, the CMP apparatus includes a plurality of units such as the load / unload unit 2, the polishing unit 3, and the cleaning unit 4.

  The load / unload unit 2 is provided with a sequencer 260 for controlling the operations of a plurality of components 250-1 to 250-m (such as the transfer robot 22) in the load / unload unit 2. The load / unload unit 2 is provided with a plurality of sensors 270-1 to 270-a that detect data related to the control of the load / unload unit 2. The sensors 270-1 to 270-a include, for example, a sensor that detects whether or not a wafer is placed on the transfer robot 22.

  The polishing unit 3 is provided with a sequencer 360 for controlling the operation of a plurality of components 350-1 to 350-n (polishing table, top ring, etc.) in the polishing unit 3. In addition, the polishing unit 3 is provided with a plurality of sensors 370-1 to 370-b that detect data related to the control of the polishing unit 3. The sensors 370-1 to 370-b include, for example, a sensor that detects the flow rate of the polishing liquid supplied to the polishing pad 10, a sensor that detects the rotational speed of the polishing table 30, and the rotational torque of the polishing table 30 or the top ring 31. And a sensor for detecting.

  The cleaning unit 4 is provided with a sequencer 460 for controlling operations of a plurality of components 450-1 to 450 -p (cleaning module, transfer robot, etc.) in the cleaning unit 4. Further, the cleaning unit 4 is provided with a plurality of sensors 470-1 to 470-c that detect data related to the control of the cleaning unit 4. The sensors 470-1 to 470-c include, for example, a sensor that detects the flow rate of the cleaning liquid supplied to the wafer.

  The control device 5 is connected to the load / unload unit 2 (sequencer 260), the polishing unit 3 (sequencer 360), and the cleaning unit 4 (sequencer 460). The control device 5 includes a status reporting device 510, an operation unit 520, a storage unit 530, and a control unit 540.

  The operation unit 520 serves as an input interface for an operator or the like to input a recipe of a process to be executed by the load / unload unit 2, the polishing unit 3, and the cleaning unit 4. The storage unit 530 is a storage medium for storing a recipe input via the operation unit 520. The control unit 540 transmits a command signal that causes the load / unload unit 2, the polishing unit 3, and the cleaning unit 4 to execute processes based on the recipe stored in the storage unit 530.

  The status reporting device 510 includes a collection unit 512 and a communication unit 514.

  The collection unit 512 performs load / unload unit 2, polishing unit 3, and cleaning when a process related to substrate processing is performed for each of load / unload unit 2, polishing unit 3, and cleaning unit 4 included in the CMP apparatus. Process data detected by sensors 270, 370, and 470 provided in the unit 4 are collected. Process data detected by the sensors 270, 370, and 470 is stored in the storage unit 530.

  The communication unit 514 transmits data indicating the state of the CMP apparatus (for example, process data collected by the collection unit 512) to the management apparatus (host computer) 600 of the CMP apparatus. The host computer 600 is a device for instructing the CMP apparatus to perform processing and managing the state of the CMP apparatus based on data indicating the state of the CMP apparatus.

  Here, in at least one of the load / unload unit 2, the polishing unit 3, and the cleaning unit 4, a process related to substrate processing may include a plurality of unit processes.

<Recipe example>
This point will be described. FIG. 5 is a diagram illustrating an example of a processing recipe. As shown in FIG. 5, the processing recipe 610 defines control parameters for devices in processing units such as the polishing unit 3 and the cleaning unit 4 for each step. The processing recipe 610 is stored in the storage unit 530. The control unit 540 instructs the processing unit to start processing, and the sequencer of the processing unit controls the operation of each unit based on the processing recipe 610 stored in the storage unit 530. Taking a part of the processing recipe (processing conditions) of the polishing unit 3 as an example, the control parameter 1 (for example, the flow rate of polishing liquid per unit time) is 50 in step 1 and 100 in step 2. Further, the control parameter 2 (for example, the rotation speed of the top ring 31) is 100 in Step 1 and 200 in Step 2. Further, the control parameter 3 (for example, the rotational torque of the top ring 31) is 25 in Step 1 and 30 in Step 2.

  The processing recipe 610 can be input via the operation unit 520 by an operator or the like. Further, the processing recipe 610 can be transmitted from the host computer 600.

  In this way, the substrate polishing process uses different parameters for the same processing content (for example, polishing the substrate with a predetermined polishing flow rate, a predetermined top ring 31 rotation speed, and a predetermined top ring 31 rotation torque). It includes a plurality of steps to be executed based on (control parameter). In this case, each step can be said to be a unit process. That is, the substrate polishing process includes a plurality of unit processes (steps).

  In this case, the communication unit 514 transmits the unit process data collected by the collection unit 512 corresponding to the execution of the unit process to the host computer 600 as process data related to the unit process every time the execution of the unit process ends. .

  Specifically, the communication unit 514 transmits unit process data and an identifier for identifying the unit process to the host computer 600 as process data related to the unit process every time execution of the unit process (step) ends. To do.

  In addition, when a common transmission format is set for a plurality of unit processes, the communication unit 514 uses the transmission format to execute unit process data and a unit each time execution of the unit process ends. An identifier for identifying the process is transmitted to the host computer 600 as process data relating to the unit process. Further, the communication unit 514 uses the transmission format to identify the unit process data and the unit process for the unit process executed among the plurality of unit processes every time the execution of the unit process ends. The identifier is transmitted to the host computer 600 as process data relating to unit processing.

  These points will be described in detail below. The status reporting device 510 and the host computer 600 are connected via a LAN cable or the like, and communication between the status reporting device 510 and the host computer 600 conforms to a standard such as SEMI, for example.

<Event report>
For example, an event report in the SEMI communication standard is used to notify the host computer of a change in the state of the CMP apparatus. The event report is used to report a change in the state of the CMP apparatus to the host computer 600. In the event report, for example, whenever the state of the CMP apparatus changes (event) such as “process started”, the change in the state of the CMP apparatus is reported to the host computer 600. In order to identify various state changes, an event ID (CEID) that can be reported by the CMP apparatus is defined in the communication specifications of the CMP apparatus. Further, a variable (VID) that can be reported in addition to a change in the state of the CMP apparatus is defined in the communication specification of the CMP apparatus. The variable (VID) includes various information such as a carrier ID and a lot ID.

  In addition, detailed information such as the state of the CMP apparatus and processing results can be added to the event report. The contents that can be added differ depending on the event. A report ID (RPTID) that defines a variable (VID) that can be reported for each event is defined. When an event occurs, the contents of a variable (VID) linked to the event are reported to the host computer as an event report.

<Event link>
Here, linking an event and a report is called an event link. The event link is performed using the SEMI communication standard. By executing the event link, the content of the event report to the host computer is determined. The contents reported to the host computer are the same until the event link is made again.

  FIG. 6 is a diagram illustrating message exchange between the CMP apparatus and the host computer 600 during a general event link. First, the host computer 600 transmits a message for invalidating the event to the CMP apparatus using the event setting (S2F37). The S2F37 message format is a format for designating validity / invalidity of an event. Thereby, the host computer 600 invalidates the event of the CMP apparatus. FIG. 7 is a diagram showing a message format of event setting (S2F37).

  Subsequently, the host computer 600 transmits a message for invalidating all the event link reports to the CMP apparatus using the event link report (S2F35). As a result, the host computer 600 clears the report currently linked to the event (contents to be reported to the host computer 600).

  Subsequently, the host computer 600 transmits a message for invalidating all report definitions to the CMP apparatus using report creation (S2F33). As a result, the host computer 600 clears all report definitions.

  Subsequently, the host computer 600 transmits a message for defining a report to the CMP apparatus using the report definition (S2F33). S2F33 is a format for associating a VID with an RPTID. As a result, the host computer 600 creates a report. FIG. 8 is a diagram showing a message format of the report definition (S2F33).

  Subsequently, the host computer 600 uses the event link report (S2F35) to transmit a message for linking the report and the event to the CMP apparatus. S2F35 is a format for associating RPTID with CEID. As a result, the host computer 600 associates CEID and RPTID. FIG. 9 is a diagram showing a message format of the event link report (S2F35).

  Subsequently, the host computer 600 transmits a message for validating the event to the CMP apparatus using the event setting (S2F37). The S2F37 message format is a format for designating validity / invalidity of an event. As a result, the host computer 600 validates the event of the CMP apparatus.

<Conventional event link example>
FIG. 10 is a diagram illustrating an example of an event link created by the conventional technique. As shown in FIG. 10, the event link created by the conventional technique defines report data of all steps (for example, 10 steps) for one event (for example, polishing unit process completion report). In other words, the event link created by the prior art defines report data of a plurality of steps for one event and defines a plurality of control parameters for each step.

<Event link example of this embodiment>
FIG. 11 is a diagram illustrating an example of an event link created according to the present embodiment. As shown in FIG. 11, in the event link created by this embodiment, report data (step report data) of one step is defined for one event (for example, polishing unit step report). In other words, in this embodiment, the report data is not allocated for each step, and the definition is common to all steps. When transmitting the step report data, the communication unit 514 substitutes each process data for each VID and transmits it to the host computer 600.

  Further, in the step report data, identification data for identifying the step number is defined in addition to the control parameter. Thus, in this embodiment, the method of defining the report data created by the event link is changed. In the present embodiment, since identification data for identifying which step is the information is added to the report data in step units, it is possible to determine which step the report is for.

<Types of process data reports>
Here, there are mainly two types of process data reports from the CMP apparatus to the host computer 600. One is to return the CMP apparatus status at that time in response to a request from the host computer 600. Data for returning the state of the CMP apparatus is defined on the CMP apparatus side as SVID, such as the number of times of the top ring 31: 101, the rotational torque of the top ring 31: 102, and the like. FIG. 12 is a diagram showing an outline of process data reporting in response to a request from the host computer 600.

  As shown in FIG. 12, when the substrate is transferred to the processing unit and the process is started, the state reporting device 510 transmits a start event (S6F11) to the host computer 600. Receiving the process start event, the host computer 600 transmits a CMP apparatus status inquiry (S1F3) to the status reporting apparatus 510. Data for returning the state of the CMP apparatus is defined on the CMP apparatus side as SVID. The status reporting device 510 returns the contents of the inquired SVID to the host computer 600 (S1F4). For example, when the host computer 600 adds SVID = 101 to S1F3 and transmits it to the CMP apparatus, the CMP apparatus returns information on the number of times of the top ring 31 in S1F4. A detailed description of the S1F3 / S1F4 message format is omitted.

  The host computer 600 monitors the state of the CMP apparatus based on the returned content. The status reporting device 510 and the host computer 600 repeat the CMP device status inquiry (S1F3) and reply (S1F4).

  When the process ends, the status reporting device 510 transmits an end event (S6F11) to the host computer 600. Then, the host computer 600 stops the inquiry about the state of the CMP apparatus.

On the other hand, the second process data report from the CMP apparatus to the host computer 600 is to report a set value, an average value, a maximum value, or a minimum value of each process data after the process is completed. DVID is defined as an ID for classifying data for reporting the process data. For example, the number of times of the top ring 31 (average value): 1001, the number of rotations of the top ring 31 (maximum value): 1002, and the like. The present embodiment mainly relates to the second process data report.

<Process data report>
The process data report can be transmitted to the host computer 600 using, for example, the S6F11 message format defined in SEMI-E5. CEID, RPTID, and VID are defined on the CMP apparatus side, and event reports that can be reported by the CMP apparatus are disclosed in the communication specifications of the CMP apparatus. In addition to the items defined by SEMI, the event report includes a report of process data unique to the CMP apparatus.
<Example of conventional process data report>
FIG. 13 is a diagram illustrating an example of a process data report according to a conventional technique. As shown in FIG. 13, first, the status reporting device 510 transmits a processing start (S6F11) message format to the host computer 600.

  Subsequently, when the process of a plurality of steps (for example, 10 steps) is completed in the CMP apparatus, the status reporting apparatus 510 transmits a process end (S6F11) to the host computer 600.

  S6F11 is a format for transmitting report data to the host computer 600. As a result, the status reporting device 510 transmits report data to the host computer 600. FIG. 14 is a diagram illustrating a message format of S6F11.

  Here, as described with reference to FIG. 10, in the prior art, the process data includes all the steps, and the report data is defined for each step. As shown in FIG. 13, in the prior art, the status reporting device 510 transmits the process data of all steps to the host computer 600 at the time when all the processes are completed.

  Therefore, it was necessary to define report data for all the steps in each unit. Further, depending on the setting of the report data, the data of the step that has not been processed was also reported, so that unnecessary report data was generated. Also, depending on the event link, the number of steps to report was decided. Further, communication traffic between the CMP apparatus (status reporting apparatus 510) and the host computer 600 increases intensively at a certain timing, and as a result, the communication load between the CMP apparatus and the host computer 600 increases. . For this reason, when a communication timeout or the like occurs, there is a possibility that the communication is disconnected.

<Example of process data report of this embodiment>
FIG. 15 is a diagram illustrating an example of a process data report according to the present embodiment. In the present embodiment, as illustrated in FIG. 15, when the processing of step 1 is completed, the communication unit 514 completes the process data collected by the collection unit 512 in the processing of step 1 (control parameter 1, VID10002 of VID 10001 in step 1). Unit process data such as control parameter 2 of VID 10003 and control parameter 3 of VID 10003 are transmitted to the host computer 600. Subsequently, when the process of step 2 is completed, the communication unit 514 transmits the process data (unit process data) collected by the collection unit 512 in the process of step 2 to the host computer 600. The communication unit 514 repeats the transmission of the unit process data every time the processing of the step is finished, and when the processing of the final step 10 is finished, the process data (unit process data) collected by the collection unit 512 in the processing of step 10 is obtained. To the host computer 600.

  That is, the communication unit 514 hosts the unit process data collected by the collection unit 512 corresponding to the execution of the unit process (step) as process data related to the unit process every time the execution of the unit process (step) ends. Send to computer 600.

  Further, as shown in FIG. 15, the communication unit 514 includes not only the control parameter 1 of VID 10001, the control parameter 2 of VID10002, and the control parameter 3 of VID10003, but also identification data (step No.) of VID10000. Send to. For example, when the processing of step 1 is completed, identification data indicating that it is step 1 is put in the identification data of VID10000, control parameter 1 of VID10001 in step 1, control parameter 2 of VID10002, and control parameter 3 of VID10003. At the same time, it is transmitted to the host computer 600.

  That is, every time the execution of the unit process (step) ends, the communication unit 514 transmits unit process data and an identifier for identifying the unit process to the host computer 600 as process data related to the unit process.

  Thus, in this embodiment, the process data defines report data for one step. The communication unit 514 reports the event by assigning the result to each variable (VID) at the end of the step. According to the present embodiment, since process data is reported in units of steps, data of steps not processed is not reported. As a result, generation of useless report data can be suppressed.

  Further, according to the present embodiment, since report data is transmitted in units of steps, communication traffic between the CMP apparatus (status report apparatus 510) and the host computer 600 is distributed. As a result, communication traffic between the CMP apparatus and the host computer 600 is reduced, so that the communication load between the CMP apparatus and the host computer 600 can be reduced. Further, according to the present embodiment, the load for the host computer 600 to receive process data is distributed. Further, according to the present embodiment, when the process is processed in a plurality of steps, the state of the CMP apparatus at the time when each step is completed is transmitted to the host computer 600. By reporting the process data at an earlier stage, the host computer 600 can confirm the report data earlier. Further, according to the present embodiment, since it is only necessary to define report data that has conventionally been defined for a plurality of steps, it is possible to reduce the amount of report data. For example, in the present embodiment, only the step that is actually executed out of the plurality of steps is transmitted to the host computer 600 each time the execution of this step is completed, and thus the step that has not been executed. There is no need to send data about. As a result, communication traffic between the CMP apparatus (status reporting apparatus 510) and the host computer 600 can be reduced.

  In the above embodiment, the case where the unit process is one step has been described, but the present invention is not limited to this. The unit process can be a plurality of steps as a part of all the steps.

<Application to film thickness measuring instrument>
In the above description, the process data detected by the sensors 270, 370, and 470 is reported to the host computer 600. However, the present invention is not limited to this. The viewpoint of the process data can be applied to the film thickness data measured by the film thickness measuring instrument.

FIG. 16 shows a state reporting device and CM for reporting film thickness data measured by a film thickness measuring instrument.
It is a figure which shows the structure of P apparatus. As shown in FIG. 16, a film thickness measuring device 700 for measuring the film thickness of a substrate processed by the CMP apparatus (polishing unit 3) is connected to the CMP apparatus.

<Report of conventional film thickness measurement data>
FIG. 17 is a diagram showing an outline of reporting of film thickness measurement data according to the prior art. As shown in FIG. 17, the CMP apparatus outputs a measurement start request to the film thickness measuring device 700. When receiving the measurement start request, the film thickness measuring device 700 starts measuring the film thickness of the substrate.

  For example, if 200 measurement points are set, the film thickness measuring device 700 sequentially measures the film thickness of the substrate at the measurement points 1 to 200. When the film thickness measuring instrument 700 finishes measuring the film thickness of the substrate at all measurement points, it transmits the measurement results for 200 locations to the CMP apparatus. When the CMP apparatus receives the measurement result transmitted from the film thickness measuring instrument 700, the CMP apparatus transmits the received measurement result to the host computer 600.

  According to the report of the film thickness measurement data of the prior art, the measurement results at a plurality of measurement points are collectively transmitted to the host computer 600. Therefore, the communication traffic between the CMP apparatus and the host computer 600 increases intensively at a certain timing, and as a result, the communication load between the CMP apparatus and the host computer 600 increases.

<Report of film thickness measurement data of this embodiment>
FIG. 18 is a diagram showing an outline of reporting of film thickness measurement data according to the present embodiment. As shown in FIG. 18, the CMP apparatus outputs a measurement start request to the film thickness measuring device 700. When receiving the measurement start request, the film thickness measuring device 700 starts measuring the film thickness of the substrate.

  For example, if 200 measurement points are set, the film thickness measuring device 700 sequentially measures the film thickness of the substrate at the measurement points 1 to 200. The film thickness measuring device 700 transmits the measurement result to the CMP apparatus every time the film thickness measurement at each measurement point is completed.

  The collection unit 512 collects measurement results output from a film thickness measuring device that measures the film thickness of the substrate processed by the CMP apparatus. Specifically, the collection unit 512 collects a part of film thickness measurement results each time measurement of a part of the plurality of measurement points (for example, one measurement point) is completed. Further, the measurement result collected by the collection unit 512 includes a measurement point number and film thickness data (unit film thickness data) at the measurement point in order to identify which measurement point the film thickness data is. It is.

  The collection unit 512 repeats collection of measurement results for each measurement point. The communication unit 514 partially displays the unit measurement results collected by the collection unit 512 in response to the measurement of some film thicknesses, every time measurement of some film thicknesses of the plurality of measurement points is completed. Is transmitted to the management apparatus (host computer 600) as film thickness data relating to the measurement of the film thickness.

According to the present embodiment, film thickness data is transmitted in units of measurement points, for example, so that communication traffic between the CMP apparatus (status report apparatus 510) and the host computer 600 is distributed. As a result, communication traffic between the CMP apparatus and the host computer 600 is reduced, so that the communication load between the CMP apparatus and the host computer 600 can be reduced. Further, according to the present embodiment, the load for the host computer 600 to receive process data is distributed. In addition, according to the present embodiment, the film thickness data of the substrate at an early time point when the measurement at each measurement point is completed is transmitted to the host computer 600. By reporting the film thickness data at an earlier stage, the host computer 600 can quickly confirm the film thickness data. In addition, according to the conventional method, only the number of measurement points linked to the event can be reported. However, according to the present embodiment, since transmission is performed in units of measurement points, there is no upper limit on the number of measurement points that can be reported.

2 Load / unload unit 3 Polishing unit 4 Cleaning unit 5 Control device 270, 370, 470 Sensor 510 Status reporting device 512 Collection unit 514 Communication unit 520 Operation unit 530 Storage unit 540 Control unit 600 Host computer 610 Processing recipe 700 Film thickness measurement vessel

Claims (9)

For each of a plurality of processing units included in the substrate processing apparatus, a collection unit that collects process data detected by a sensor provided in the processing unit when a process related to substrate processing is executed;
A communication unit that transmits the process data collected by the collection unit to a management device of the substrate processing apparatus,
The process includes a plurality of unit processes,
The communication unit transmits unit process data collected by the collection unit corresponding to the execution of the unit process to the management apparatus as process data related to the unit process every time execution of the unit process is completed. ,
A status reporting device characterized by that. The status reporting device according to claim 1,
The communication unit transmits the unit process data and an identifier for identifying the unit process to the management apparatus as process data related to the unit process each time execution of the unit process ends.
A status reporting device characterized by that. The status reporting device according to claim 2,
A common transmission format is set for the plurality of unit processes,
Whenever the execution of the unit process is completed, the communication unit uses the transmission format to convert the unit process data and an identifier for identifying the unit process as process data related to the unit process. Send to the management device,
A status reporting device characterized by that. The status reporting device according to claim 3,
The communication unit identifies the unit process data and the unit process by using the transmission format for each unit process executed out of the plurality of unit processes, every time execution of the unit process ends. And an identifier for transmitting to the management device as process data relating to the unit processing,
A status reporting device characterized by that. In the status reporting device according to any one of claims 1 to 4,
The plurality of unit processes are a plurality of steps for executing the same processing content in the processing unit based on different parameters.
A status reporting device characterized by that. In the status reporting device according to any one of claims 1 to 5,
The collection unit collects measurement results output from a film thickness measuring device that measures the film thickness of a substrate processed by the substrate processing apparatus,
The measurement of the film thickness includes measurement of film thickness at a plurality of measurement points of the substrate,
Each time the measurement of the film thickness of a part of the plurality of measurement points is completed, the communication unit, the unit measurement results collected by the collection unit corresponding to the measurement of the film thickness of the part, Send to the management device as film thickness data relating to the measurement of the part of the film thickness,
A status reporting device characterized by that. Multiple processing units;
An operation unit for inputting a recipe of a process to be executed by the plurality of processing units;
A storage unit for storing a recipe input via the operation unit;
A control unit that causes the plurality of processing units to execute the process based on a recipe stored in the storage unit;
The status reporting device according to any one of claims 1 to 6,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 7,
The plurality of processing units are:
A polishing unit for polishing a substrate;
A cleaning unit for cleaning and drying the substrate;
A load / unload unit that delivers a substrate to the polishing unit and receives a substrate that has been cleaned and dried by the cleaning unit;
A substrate processing apparatus comprising: For each of a plurality of processing units included in the substrate processing apparatus, a collection step of collecting process data detected by a sensor provided in the processing unit when a process related to substrate processing is executed;
A communication step of transmitting the process data collected by the collecting step to a management device of the substrate processing apparatus,
The process includes a plurality of unit processes,
The communication step transmits the unit process data collected by the collecting step corresponding to the execution of the unit process to the management apparatus as process data related to the unit process every time the execution of the unit process ends. ,
A state reporting method characterized by that.

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