JP6367664B2 - Partial plating method and apparatus - Google Patents

Description

  The present invention relates to a partial plating method and an apparatus thereof, and more particularly, to a partial plating method and an apparatus for plating a part of a material to be plated.

  Conventionally, as a method of plating a part of the material to be plated, a tape is previously applied to a portion (non-plating region) where the material to be plated is not plated, and a part of the material to be plated is masked by this tape. A method of plating a material to be plated and removing the tape after plating is known.

  Also, in an electroplating apparatus for plating a tape-shaped product conductor conveyed along the anode while facing the anode in the plating tank, the width of the tape-shaped product conductor between the anode and the tape-shaped product An insulating shielding plate having a narrower opening is provided, and the plating becomes thick at the end of the tape-like product due to the current component that reaches the end of the conductor of the tape-like product from the outside, and near the center. It has been proposed to suppress the thinning (see, for example, Patent Document 1).

JP 2009-293114 A (paragraph number 0010-0020)

  However, strip-shaped strips masking the non-plating regions so that the plurality of strip-shaped plating regions and non-plating regions extend along the longitudinal direction and are alternately arranged in the width direction are continuously placed in the plating bath. In the case where the strip is electroplated by feeding, even if the shielding plate of Patent Document 1 is used, the current tends to concentrate on the peripheral edge extending in the longitudinal direction of each strip-shaped plating region. It is difficult to suppress this, and it is difficult to make uniform the thickness distribution of the plating in the width direction of each strip-shaped plating region. Further, when the width of each strip-shaped plating region is different, for example, when there is a narrow strip-shaped plating region, even if the shielding plate of Patent Document 1 is used, the narrow strip-shaped plating region is used. It is difficult to suppress the current from being easily concentrated, and the plating tends to be thicker than other strip-shaped plating regions.

  Therefore, in view of such a conventional problem, the present invention masks the non-plating regions so that the plurality of strip-shaped plating regions and non-plating regions extend along the longitudinal direction and are alternately arranged in the width direction. Provided is a partial plating method and apparatus capable of substantially uniforming the thickness distribution of the plating in the width direction of each strip-shaped plating region when strip-shaped electroplating is performed on a strip-shaped strip. For the purpose.

  Further, the present invention can prevent the plating from becoming thicker in the band-shaped plating region having a narrow width than the other band-shaped plating regions even when the widths of the respective band-shaped plating regions are different from each other. An object is to provide a plating method and an apparatus therefor.

  As a result of diligent research to solve the above-mentioned problems, the inventors of the present invention have a plurality of strip-like plating regions and non-plating regions extending along the longitudinal direction and arranged alternately in the width direction on at least one surface. A strip-shaped strip with the non-plated area masked is continuously fed into the plating bath, and a current is passed between the strip and the anode in the plating bath to stripe on at least one surface of the strip. In the method of partial plating in which electroplating is performed, a plurality of strip plate-shaped shielding plates are disposed on the plating region and the anode so as to face the peripheral edge portion extending in the longitudinal direction of each of the plurality of strip-shaped plating regions in the plating bath. The width direction of each strip-shaped plating region is reduced by reducing the current density between the peripheral edge extending in the longitudinal direction of each of the strip-shaped plating regions in the plating bath and the anode. Of plating It found that can have a thickness distribution substantially uniform, thereby completing the present invention.

  That is, in the partial plating method according to the present invention, a plurality of strip-shaped plating regions and non-plating regions extend along the longitudinal direction on at least one surface and are non-plated regions masked so that they are alternately arranged in the width direction. Partial plating in which plate-shaped strip material is continuously fed into the plating bath, and current is passed between the strip material in the plating bath and the anode to apply electroplating to at least one side of the strip material in stripes. In the method, a plurality of strip-shaped shielding plates are disposed between the plating region and the anode so as to face the peripheral edge extending in the longitudinal direction of each of the plurality of strip-shaped plating regions in the plating bath, It is characterized in that the current density between the peripheral edge extending in the longitudinal direction of each of the plurality of strip-shaped plating regions in the plating bath and the anode is reduced.

  In this partial plating method, it is preferable that the plurality of strip-shaped shielding plates extend over substantially the entire length of the plurality of strip-shaped plating regions in the plating bath. In addition, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, a strip-shaped narrow plating region shielding plate, Arranged between the narrow plating region and the anode so as to face the central portion extending in the longitudinal direction of the narrow plating region in the plating bath over a part of the entire length of the narrow plating region in the plating bath, It is preferable to reduce the current density between the narrow plating region in the plating bath and the anode during part of the plating time of the strip plating region.

  In addition, the partial plating apparatus according to the present invention extends along the longitudinal direction of at least one surface of the strip-like strip material continuously fed into the plating tank and is arranged apart from each other in the width direction. In the partial plating apparatus for performing electroplating on a plurality of strip-shaped plating regions, the plurality of strip-shaped shielding plates are opposed to the peripheral edge portions extending in the longitudinal direction of the plurality of strip-shaped plating regions in the plating tank. It is characterized by being arranged between the strip material conveyance path and the anode.

  In this partial plating apparatus, it is preferable that the plurality of strip-shaped shielding plates extend over substantially the entire length of the plurality of strip-shaped plating regions in the plating tank. Further, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating region, the strip-shaped narrow plating region shielding plate, It is arranged between the conveying path of the strip material and the anode so as to face the central portion extending in the longitudinal direction of the narrow plating region in the plating tank over a part of the entire length of the narrow plating region in the plating tank. It is preferable.

  Moreover, the manufacturing method of the plating material by this invention cut | disconnects the strip | belt material which electroplated in stripe shape by said partial plating method, It is characterized by manufacturing a several plating material.

  According to the present invention, a plurality of strip-shaped plating regions and non-plating regions extend in the longitudinal direction and are striped on the strip-shaped strip material that masks the non-plating regions so that they are alternately arranged in the width direction. When electroplating is performed, the thickness distribution of the plating in the width direction of each strip-shaped plating region can be made substantially uniform.

  Moreover, even when the width of each strip-shaped plating region is different, the strip-shaped shielding plate for the narrow plating region is applied to the narrow plating in the plating bath over a part of the entire length of the narrow plating region in the plating bath. If the strip is disposed between the strip conveying path and the anode so as to face the central portion extending in the longitudinal direction of the region, the plating becomes thicker in the narrow strip-shaped plating region than in the other strip-shaped plating regions. Can be prevented.

It is a top view which shows typically embodiment of the partial plating apparatus by this invention. 1B is a cross-sectional view schematically shown by cutting along line IB-IB in FIG. 1A. FIG. It is the typical side view which looked at the shielding board of the partial plating apparatus shown to FIG. 1A and FIG. 1B from the right side of FIG. 1A. It is sectional drawing cut | disconnected typically by the ID-ID line | wire of FIG. 1C. It is sectional drawing which shows typically the modification of the shielding board of the partial plating apparatus shown to FIG. 1A and FIG. 1B. It is a top view which shows the state which affixed the masking tape on the strip used in the Example and the comparative example.

  In the embodiment of the partial plating method according to the present invention, a plurality of strip-like plating regions and non-plating regions extend along the longitudinal direction of the strip and are alternately arranged in the width direction on at least one surface. The strip-shaped strip with the masked area is continuously fed into the plating bath (including the plating solution in the plating tank), and the current flows between the strip (as the cathode) in the plating bath and the anode. In the partial plating method in which electroplating is performed on at least one surface of the strip in a striped manner, a plurality of strip-shaped shielding plates (preferably, substantially the entire length of the plurality of strip-shaped plating regions in the plating bath) A plurality of strip-shaped plating regions in the plating bath disposed between the plating region and the anode so as to oppose a longitudinally extending peripheral edge of each of the plurality of strip-shaped plating regions in the plating bath. Each Reducing the current density between the longitudinally extending peripheral portion and the anode of the. In addition, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, a strip-shaped narrow plating region shielding plate, Arranged between the narrow plating region and the anode so as to face the central portion extending in the longitudinal direction of the narrow plating region in the plating bath over a part of the entire length of the narrow plating region in the plating bath, In part of the plating time of the strip plating area, the current density between the narrow plating area and the anode in the plating bath is reduced.

  Further, in the embodiment of the partial plating apparatus according to the present invention, it extends along the longitudinal direction of at least one surface of the strip-shaped strip fed continuously into the plating tank and is separated from each other in the width direction. In the partial plating apparatus for performing electroplating on the plurality of strip-shaped plating regions arranged in a manner, preferably, a plurality of strip-shaped shielding plates (preferably over substantially the entire length of the plurality of strip-shaped plating regions in the plating tank) It arrange | positions between the conveyance path of a strip, and an anode so that the peripheral part extended in the longitudinal direction of each of several strip | belt-shaped plating area | regions in a plating tank may be opposed. Further, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating region, the strip-shaped narrow plating region shielding plate, It is arranged between the conveying path of the strip material and the anode so as to face the central portion extending in the longitudinal direction of the narrow plating region in the plating tank over a part of the entire length of the narrow plating region in the plating tank. Yes.

  Embodiments of a partial plating method and apparatus according to the present invention will be described below in detail with reference to the accompanying drawings.

  As shown in FIGS. 1A and 1B, a partial plating apparatus 10 of the present embodiment includes a plating cell 14 to which a plating solution 12 (such as a silver plating solution) is supplied, and the plating cell 14 accommodated therein. A plating tank 18 including an overflow tank 16 for storing the plating solution 12 overflowed from the plating cell 14 is provided.

  An opening for allowing a predetermined amount or more of the plating solution 12 in the plating cell 14 to overflow as shown by an arrow A and to be stored in the overflow tank 16 at the upper part of the side walls on both sides in the width direction of the plating cell 14 of the plating tank 18. 14b is formed.

  The plating solution 12 accumulated at the bottom of the overflow tank 16 of the plating tank 18 flows as indicated by an arrow B by the pump 20 and is stored in the reserve tank 22. The plating cell 14 of the plating tank 18 is indicated by the pump 20 as indicated by the arrow C. It is supplied inside and circulates.

  A pair of slits 14a serving as inlets and outlets for strips 24 (conductive metal such as copper strips) are respectively provided in the upper part of the widthwise central portion of the side walls at both ends in the longitudinal direction of the plating cell 14 of the plating tank 18. Are formed through the side walls, and a pair of slits 16a serving as inlets and outlets for the strips 24 are respectively provided at the upper portions of the widthwise central portions of the side walls at both ends in the longitudinal direction of the overflow tank 16 (respectively, The slits 14a and 16a extend in the vertical direction so that the width direction of the strip-shaped strip material 24 becomes the vertical direction (opposite the slit 14a).

  In the plating cell 14 of the plating tank 18, a pair of anodes 26 are provided so as to face each of both surfaces of the strip material 24 fed into the plating cell 14. Further, on the outside of the overflow tank 16 of the plating tank 18, a power feeding plate (or power feeding roll) 28 is provided to face each of the pair of slits 16 a on the side walls at both ends in the longitudinal direction. The anode 26 is connected to the plus (+) side of a rectifier (external DC power source) 30 provided outside the plating tank 18, and the power feeding plate (or feeding roll) 28 is connected to the minus (−) side of the rectifier 30. Then, the current flows between the strip 24 (as the cathode) and the anode 26 fed into the plating tank 16 in the direction of arrow D while being in contact with the power supply plate 28 (or being sandwiched between the power supply rolls 28). Can be shed.

  A plurality of (two in the illustrated embodiment) masking tapes 32 are spaced from each other and extend along the strip 24 in parallel to each of both surfaces of the strip 24 fed into the plating tank 16. A strip-shaped non-plated region is formed by being pasted, and a plating film 34 is formed on a stripe-shaped portion (a plurality of strip-shaped plated regions) where the masking tape 32 on the surface of the strip 24 is not pasted. It has become.

  In the plating cell 14 of the plating tank 18, a pair of struts 36 extending vertically upward from the bottom surface of the plating cell 14 so as to face one surface of the strip 24 on each of the inlet side and the outlet side. And a pair of support columns 36 extending vertically upward from the bottom surface of the plating cell 14 so as to face the other surface of the strip. A pair of support columns 36 provided so as to oppose each of both surfaces of the strip 24 have a longitudinal direction of each of the plurality of strip-shaped plating regions of the strip 24 over substantially the entire length of the strip 24 in the plating cell 14. A plurality of (three in the illustrated embodiment) shielding plates 38 (for the belt-shaped plating region peripheral portion) arranged so as to face the peripheral portion extending in the direction are fixed. 24 to reduce the current density between the peripheral edges in the longitudinal direction of the striped plating region 24 (the portions of the shielding widths a, b, c, and d) and the anode 26, thereby reducing the striped plating region of the strip 24. The plating film 34 at the peripheral edge in the longitudinal direction is prevented from becoming thicker than the central part. In addition, the width | variety (shielding width) of the peripheral part extended in the longitudinal direction of each of the some strip | belt-shaped plating area | region of the strip | belt material 24 can be suitably determined from the width | variety etc. of a plating area | region.

  Moreover, the full length of the strip 24 in the plating cell 14 is opposed to the central portion extending in the longitudinal direction of the strip-shaped plating region that is narrower than the other strip-shaped plating regions among the plurality of strip-shaped plating regions of the strip 24. At least one (for the narrow plating region) shielding plate 40 (one for the narrow plating region) arranged so as to extend over a part of the length of the adjacent shielding (for the peripheral portion of the belt-like plating region) The plate 38 is fixed to the plate 38, and the shielding plate 40 reduces the time during which the narrow strip-shaped plating region of the strip 24 conveyed in the plating cell 14 faces the anode 26, thereby plating the strip 24. By reducing the current density between the plating region in the plating tank and the cathode during a part of the plating time in the region, the plating film 34 in the narrow band-shaped plating region is replaced with the plating film in the other band-shaped plating region. 34 So as to prevent consisting of a thick Ri. In addition, the length of the shielding plate 40 can be appropriately determined from the relationship between the width of the narrow band-shaped plating region and the width of the other band-shaped plating region.

  Further, as shown in FIG. 2, a plurality of strip-shaped plating of the strip material 24 is provided between the support column 36 and the shield plate 38 by providing an interval adjusting plate 42 for adjusting the interval between the shield plate 38 and the strip material 24. The reduction in current density between the peripheral edge of each region extending in the longitudinal direction and the anode 26 may be adjustable.

  In this way, when the strip material 24 subjected to striped plating is cut along a cutting line (indicated by a dotted line 44 in FIG. 3) extending along the longitudinal direction, a plurality of plating strip materials can be obtained by one plating. Can do. In addition, the strip 24 plated with stripes in this way can be pressed before or after cutting to produce contacts, terminal parts, etc. such as connectors and switches. When manufacturing contacts and terminal parts such as connectors and switches, the width of the strip 24 is preferably about 30 to 500 mm, and the width of the strip-like plating region on the surface of the strip 24 is several mm. It is preferably about ˜100 mm.

  Moreover, in order to improve the productivity of the plating material by the partial plating apparatus 10 of the present embodiment, a plurality of plating tanks 18 may be arranged in series, and the speed at which the strip material 24 is fed to the plating tank 18 may be increased. .

  Examples of the partial plating method and apparatus according to the present invention will be described below in detail.

[Example 1]
A strip material having a plate width of 100 mm and a plate thickness of 0.6 mm made of a copper alloy (C110R-1 / 2H) is prepared as a strip material (material to be plated) 24, and a reel-to-reel (hoop) plating apparatus is used. As shown in FIG. 3, a portion from 0 to 10 mm and a portion from 56.5 to 74 mm from the end in the width direction of each surface of the strip 24 are striped plating regions (regions indicated by oblique lines). As shown, the masking tape 32 was applied to the portion from 10 to 56.5 mm from the end in the width direction and the portion from 74 to 100 mm. .

Next, a sulfamic acid Ni plating solution is used as the plating solution 12, and the strip width of the strip after the pretreatment (shown by a and d in FIG. 1C) is 2 mm. , (Shown as b and c in FIG. 1C), the shielding width is 3 mm, the length of the shielding plate 38 is 800 mm, and the length of the shielding plate 40 is 300 mm) and is fed to the partial plating apparatus shown in FIGS. 1A to 1D Then, electroplating was performed until the minimum film thickness became 1 μm at a current density of 10 A / dm ² to form a Ni base plating film on the strip.

Next, an Ag strike plating solution (comprising 3 g / L of potassium cyanide cyanide and 90 g / L of potassium cyanide) is used as the plating solution 12, and the strip material subjected to Ni base plating is applied to the same partial plating apparatus as described above. Then, electroplating was performed for 10 seconds at a current density of 2 A / dm ² to form an Ag strike plating film on the Ni base plating film.

Next, the strip material subjected to Ag strike plating using an Ag plating solution (consisting of 160 g / L of potassium cyanide, 100 g / L of potassium cyanide and 180 mg / L of potassium selenocyanate) as the plating solution 12 is described above. Was sent to the same partial plating apparatus, and electroplating was performed until the minimum film thickness became 5 μm at a current density of 5 A / dm ² to form an Ag plating film on the Ag strike plating film.

  When the thickness of the Ag plating film of the strip subjected to Ag plating in this way was measured with a fluorescent X film thickness meter, the maximum thickness of 56 locations measured at intervals of 0.5 mm in the width direction of the Ag plating film. The thickness was 6.96 μm, the minimum thickness was 5.00 μm, and (maximum thickness−minimum thickness) × 100 / (minimum thickness) was 39%. Further, (thickness in the center in the width direction of the thin strip-shaped Ag plating film (μm) −thickness in the center in the width direction of the thick strip-shaped Ag plating film (μm)) × 100 / (the thickness of the ideal Ag plating film ( 5 μm)) was 11%. Further, (average thickness of Ag plating film (μm)) × 100 / (ideal thickness of Ag plating film (5 μm)) was 109%.

[Example 2]
When the thickness of the Ag plating film was measured by performing Ag plating of the strip material by the same method as in Example 1 except that the shielding plate 40 was not used (maximum thickness). Was 8.67 μm, the minimum thickness was 5.01 μm, and (maximum thickness−minimum thickness) × 100 / (minimum thickness) was 73%. Further, (thickness in the center in the width direction of the thin strip-shaped Ag plating film (μm) −thickness in the center in the width direction of the thick strip-shaped Ag plating film (μm)) × 100 / (the thickness of the ideal Ag plating film ( 5 μm)) was 29%, and (average Ag plating thickness (μm)) × 100 / (ideal Ag plating film thickness (5 μm)) was 125%.

[Comparative example]
Except for not using the shielding plate 38 (for the periphery of the belt-shaped plating region) and the shielding plate 40 (for the narrow plating region), Ag plating of the strip material was performed in the same manner as in Example 1, and Ag plating was performed. When the thickness of the film was measured, the maximum thickness was 15.06 μm, the minimum thickness was 5.03 μm, and (maximum thickness−minimum thickness) × 100 / (minimum thickness) was 201%. . Further, (thickness in the center in the width direction of the thin strip-shaped Ag plating film (μm) −thickness in the center in the width direction of the thick strip-shaped Ag plating film (μm)) × 100 / (the thickness of the ideal Ag plating film ( 5 μm)) was 42%, and (average Ag plating thickness (μm)) × 100 / (ideal Ag plating film thickness (5 μm)) was 140%.

DESCRIPTION OF SYMBOLS 10 Partial plating apparatus 12 Plating solution 14 Plating cell 14a Slit 14b Opening part 16 Overflow tank 16a Slit 18 Plating tank 20 Pump 22 Reserve tank 24 Strip material 26 Anode 28 Power supply plate (or power supply roll)
Reference Signs List 30 Rectifier 32 Masking Tape 34 Plating Film 36 Prop 38 (For Belt-Plating Area Perimeter) Shielding Plate 40 (For Narrow Plating Area) Shielding Plate 42 Spacing Adjustment Plate 44 Cutting Line

Claims (6)

A strip-shaped strip material in which non-plating regions are masked in a plating bath so that a plurality of strip-like plating regions and non-plating regions extend along the longitudinal direction on at least one surface and are arranged alternately in the width direction. In a partial plating method in which electroplating is performed on at least one surface of the strip by feeding current continuously between the strip in the plating bath and the anode, a plurality of strip-shaped shields A plurality of plates in the plating bath are disposed between the plating region and the anode so as to face the shielding width portion of the peripheral edge extending in the longitudinal direction of each of the plurality of strip-shaped plating regions in the plating bath. A partial plating method comprising reducing a current density between a peripheral edge portion extending in the longitudinal direction of each of the belt-shaped plating regions and the anode. The partial plating method according to claim 1, wherein the plurality of strip-shaped shielding plates extend over substantially the entire length of the plurality of strip-shaped plating regions in the plating bath. At least one strip-shaped plating region of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, and the strip-shaped narrow plating region shielding plate includes the plating bath. It is arranged between the narrow plating region and the anode so as to face a central portion extending in the longitudinal direction of the narrow plating region in the plating bath over a part of the entire length of the narrow plating region. The current density between the narrow plating region in the plating bath and the anode is reduced in a part of the plating time of the plating region of the strip material, according to claim 1 or 2. Partial plating method. Electroplating a plurality of strip-shaped plating areas extending along the longitudinal direction of at least one surface of the strip-shaped strip material fed continuously into the plating tank and spaced apart from each other in the width direction In the partial plating apparatus to be applied, the strip material is conveyed so that the plurality of strip plate-shaped shielding plates face the shield width portion of the peripheral edge extending in the longitudinal direction of each of the plurality of strip-shaped plating regions in the plating tank. The strip-shaped plating region is disposed between the path and the anode, and at least one strip-shaped plating region of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions. Conveying the strip material so that the shielding plate for the plating region is opposed to the central portion extending in the longitudinal direction of the narrow plating region in the plating bath over a part of the entire length of the narrow plating region in the plating bath. Between the road and the anode Characterized in that it is location, partial plating system. The partial plating apparatus according to claim 4, wherein the plurality of strip-shaped shielding plates extend over substantially the entire length of the plurality of strip-shaped plating regions in the plating tank. A method for producing a plating material, comprising: cutting a strip material subjected to electroplating in a stripe shape by the partial plating method according to claim 1 to produce a plurality of plating materials.

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