JP6380247B2 - Electronic device casing and image sensor using the same - Google Patents

Description

  The present invention relates to an electronic device casing of an EMC compatible electronic device and an image sensor using the same.

  EMC (electromagnetic compatibility) refers to two performances for suppressing electrical noise emitted from electrical products (EMI) and preventing electrical products from causing trouble due to electrical noise from the surroundings (EMS). In recent years, an increase in the operating frequency accompanying an increase in performance of a product tends to increase the radiation intensity of unnecessary radiation and deteriorate the EMI characteristics of the product.

  There are basically two types of approaches for improving EMI performance. One is to devise an electronic circuit to reduce the emitted noise, and the other is to provide an electromagnetic shield on the device to prevent leakage to the outside of the device. Is to prevent.

  As an invention using the latter, that is, an approach in which an electromagnetic shield is provided in an apparatus, there is, for example, Japanese Patent Application Laid-Open No. 2004-177602 (see Patent Document 1). In Patent Document 1, in an image forming apparatus including an image forming unit in a housing, a shield chassis unit 2 is integrally formed on a housing frame 1 itself that forms a skeleton of the housing. It is described that one or a plurality of substrates 6 (for example, 6a, 6b) on which the power supply circuit 3, the control circuit 4, and the image processing circuit 5 that enable the image forming process by the image forming unit are mounted are directly attached.

  As another invention, JP-A-2004-205714 (see Patent Document 2) can be cited. Patent Document 2 is a lid for electronic equipment that is attached to an electronic equipment casing, and includes a lid body and a shield plate that is provided inside the lid body and shields electromagnetic waves. Describes a lid member for an electronic device, in which a drop-off preventing portion for preventing the attachment member used for attachment to the case of the electronic device from being dropped is formed.

JP 2004-177602 A JP 2004-205714 A

  In the invention described in Patent Document 1, it is necessary to mold the shield chassis part separately from the exterior frame, and the structure is complicated.

  The invention described in Patent Document 2 has a complicated structure because a fastening member is separately required for preventing slipping.

  The present invention has been made to solve the above-described problems, and is an electronic device casing having an EMI shield structure that is lightweight, has a shielding effect, and is excellent in assemblability, and uses the same. An image sensor is provided.

  An electronic device casing and an image sensor using the same according to the present invention include a first opening, a first flat portion facing the first opening, and the first opening side with respect to the first flat portion. The second planar part recessed in the longitudinal direction of the first planar part and the second planar part at the end in the short axis direction, over the longitudinal direction of the first planar part and the longitudinal direction of the second planar part, Provided in a side surface portion standing over the first plane portion and the second plane portion, and a step portion between the first plane portion and the second plane portion, the side surface portion, the first plane portion, A second opening portion surrounded by the second flat portion and opened in the longitudinal direction has a step structure, and the convex portion of the step structure is in contact with the first flat portion, and the concave portion of the step structure is the second portion. The second opening portion is covered with the second opening portion by covering the standing portion of the step structure contacting the flat portion and interposed between the convex portion and the concave portion. A conductive member disposed, in which with a.

  According to the present invention, the step structure has a step structure, the convex portion of the step structure contacts the first flat portion, the concave portion of the step structure contacts the second flat portion, and the standing portion of the step structure is the second opening. Because of the use of the conductive member arranged in the above, it is possible to realize an electronic device casing having an EMI shield structure that is simple in structure, lightweight, has a shielding effect, and is excellent in assembling, and an image sensor using the same. .

It is an exploded view of the image sensor which concerns on Embodiment 1 of this invention. 1 is an external view of an image sensor according to Embodiment 1 of the present invention. It is a XZ plane view of an image sensor according to Embodiment 2 of the present invention. It is a YZ plane view of the image sensor according to the first embodiment of the present invention. It is a YZ plane sectional view of an image sensor concerning Embodiment 1 of this invention. It is a figure which shows the example of an optical path of the image sensor which concerns on Embodiment 1 of this invention. It is an enlarged view of the board | substrate holding plate part in FIG. It is the perspective view seen from the reverse side to the reading target object which combined the cover 13, the cover plate 31, and the electromagnetic wave shielding sheet 32 which concern on Embodiment 1 of this invention. It is the perspective view seen from the reading target object side which combined the cover 13, the cover plate 31, and the electromagnetic wave shielding sheet 32 which concern on Embodiment 1 of this invention. It is an exploded view of the cover 13, the cover plate 31, the electromagnetic wave shield sheet 32, and the seal 33 according to Embodiment 1 of the present invention. 2 is an exploded view of a cover 13 and an assembly of a cover plate 31, an electromagnetic wave shielding sheet 32, and a seal 33 according to Embodiment 1 of the present invention. FIG. FIG. 3 is a YZ plane cross-sectional view of the cover 13 and the assembly of the cover plate 31, the electromagnetic wave shielding sheet 32, and the seal 33 according to Embodiment 1 of the present invention. It is an expanded view of the cover 13 which concerns on Embodiment 1 of this invention. It is an expanded view of the cover plate 31 which concerns on Embodiment 1 of this invention. It is the perspective view seen from the reverse side to the reading target object which combined the cover 13, the cover plate 31, and electromagnetic wave shield sheet 32 which concern on Embodiment 2 of this invention. It is the perspective view seen from the reading target object side which combined the cover 13, the cover plate 31, and electromagnetic wave shield sheet 32 which concern on Embodiment 2 of this invention. It is an exploded view of the cover 13, the cover plate 31, the electromagnetic wave shield sheet 32, and the seal 33 according to Embodiment 2 of the present invention. FIG. 6 is an exploded view of a cover 13 and an assembly of a cover plate 31, an electromagnetic wave shielding sheet 32, and a seal 33 according to Embodiment 2 of the present invention. FIG. 6 is a YZ plane cross-sectional view of a cover 13 and an assembly of a cover plate 31, an electromagnetic wave shielding sheet 32, and a seal 33 according to Embodiment 2 of the present invention.

Embodiment 1 FIG.
In the first embodiment of the present invention, an image sensor and a manufacturing method thereof will be described. In all the embodiments of the present invention, the conveyance of the reading object includes not only the case where the reading object itself is conveyed but also the case where the image sensor itself is conveyed relative to the reading object.

  Embodiment 1 of the present invention will be described with reference to FIGS. 1 is an exploded view of an image sensor according to Embodiment 1 of the present invention. FIG. 2 is an external view of the image sensor according to Embodiment 1 of the present invention. FIG. 3 is an XZ plane view of the image sensor according to the first embodiment of the present invention. 4 is a YZ plane view of the image sensor according to Embodiment 1 of the present invention. FIG. 5 is a YZ plane cross-sectional view of the image sensor according to Embodiment 1 of the present invention. FIG. 6 is a diagram showing an example of the optical path of the image sensor according to Embodiment 1 of the present invention. FIG. 7 is an enlarged view of the substrate holding plate portion in FIG.

  In all of the embodiments of the present invention, the three axes denoted as X, Y, and Z in the figure indicate that X indicates the X axis and the main scanning direction of the image sensor (the longitudinal direction of the image sensor). ). Y indicates the Y axis and indicates the sub-scanning direction of the image sensor (conveyance direction of the reading object, short direction of the image sensor). Z indicates the Z axis and indicates the depth of focus direction of the image sensor (the thickness direction of the image sensor). Here, the origin of the X axis is the center of the length of the image sensor in the X axis direction, and the direction of the arrow in the figure is the + direction (positive direction). The origin of the Y axis is the center of the length of the image sensor in the Y axis direction, and the direction of the arrow in the drawing is the + direction (positive direction). The origin of the Z-axis is the center of the length of the image sensor in the Z-axis direction, and the direction of the arrow in the figure is the + direction (positive direction). Furthermore, in all embodiments of the present invention, the reading width of the image sensor refers to the reading width of the image sensor in the main scanning direction. In the figure, the same or equivalent components are denoted by the same reference numerals, and description thereof will be omitted.

  The image sensor includes a first housing 1, a first transparent plate 2, a lens body (imaging optical system) 4, a sensor (light receiving unit) 6, a sensor substrate 7, a substrate holding plate 9, and signal processing. A substrate 10, a bracket 11, a sealing plate 12, a second housing 15 having a heat radiation surface (heat radiation fin) 15 e, a second transparent plate 16, a light source 20, and a cover 13 are provided.

  The 1st housing | casing 1 consists of a frame manufactured by extrusion, injection molding, or cutting using a metal, resin, etc. FIG. The first housing 1 has an opening penetrating from the reading object side to the opposite side of the reading object side, and the first transparent plate 2 is provided at least along the X direction at the edge portion of the opening on the reading object side. A stepped portion to be supported is formed. That is, the step of the step portion is formed in a step shape in the Y direction. Since this opening is an optical path through which image information passes, it is longer than the reading length in the X direction and longer than the lens body 4 in the Y direction. Further, the first housing 1 is formed with a hole extending in the X direction for holding the lens body 4, and this hole is located in the Y direction and the Z direction more than the lens body 4 and the lens support plate 5. large.

  The first housing 1 has a convex shape in which the YZ surface shape has a flat portion and a protruding portion in which the lens body 4 storage portion protrudes in the Z direction. The first transparent plate 2 is supported at the tip of the protruding portion.

  The surface of the first housing 1 that is located on the opposite side of the reading object is the surface that supports the first transparent plate 2. A holding groove for holding the substrate holding plate 9 holding the sensor 6 and the sensor substrate 7 is formed on the facing surface along the X direction. This holding groove is formed in a portion shifted in the Y direction with respect to the hole into which the lens body 4 of the first housing 1 is inserted. In addition, a groove deeper in the Z direction than the above-described holding groove is formed along the X direction, which is located on the same surface on the opposite side of the above-mentioned holding groove with the optical path in the Y direction. It is assumed that the groove has a larger size in the Y direction and the Z direction than the mounted component on the sensor substrate 7 so as not to interfere with the mounted component on the sensor substrate 7.

  The first housing 1 has a bracket mounting hole 1a on the YZ plane at both ends in the X direction, and a cover mounting hole 1b and a light source mounting hole 1c on the XZ plane at both ends in the Y direction.

  The first housing 1 has a YZ-plane cross-sectional shape that narrows toward the reading object side. In the YZ plane cross section across the thinned portion, that is, the slanted portion, the first housing 1 has the light source mounting reference surface of the first housing 1 and the first transparent on the reading object side. A surface on which the plate 2 is placed is formed.

  The first transparent plate 2 is formed of glass or resin and serves as a cover for the first housing 1 and is made of a transparent material in order to suppress attenuation of light reflected from the reading object. The reading object is placed at a position away from the first transparent plate 2 in the Z direction, and image information from the reading object passes through the first transparent plate 2 and is passed to the subsequent imaging optical system.

  The seal 3 is a sheet-like material whose both surfaces are adhesive surfaces. The outer shape of the seal 3 is smaller than the step that supports the first transparent plate 2 of the first housing 1. Since there is an opening at the center of the seal 3, it is possible not to block image information from the reading object that passes through the first transparent plate 2.

  The lens body 4 is an optical member (for example, an erecting equal-magnification optical system using a lens array such as a rod lens array or a microlens array) that focuses and forms image information from an object to be read or a composite of optical members ( For example, a reduction optical system in which a mirror group and a lens are combined. The sensor 6 is a sensor array including a sensor IC (light receiving element) that receives light that has passed through the lens body 4.

  In the first embodiment of the present invention, the lens body 4 is described as a rod lens array. However, the rod lens array includes a large number of erecting equal-magnification rod lenses arranged in the main scanning direction of the image sensor. It is fixed with a frame. In the first embodiment of the present invention, for the sake of simplicity, only a box-like outer shape that is elongated in the main scanning direction is shown.

  The lens support plate 5 is a plate material extending in the X direction and reinforces the lens body 4.

  The sensor substrate 7 is a plate on which the sensors 6 are mounted by being arranged in the X direction by the reading width, and extends in the X direction. The sensor 6 is a photoelectric conversion element, arranged on the sensor substrate 7 in the X direction by the reading width of the document, and is electrically connected to the sensor driving substrate 8 using wire bonding or the like. The sensor 6 receives the image information converged by the lens body 4 and performs photoelectric conversion. The sensor 6 is electrically connected to the sensor drive board 8, is driven from the sensor drive board 8, and outputs image information converted into an electric signal to the drive board 8.

  The sensor drive board 8 is a circuit board extending in the X direction, and has a connector 8a that can be connected to the subsequent stage. The sensor drive board 8 has a fitting hole 8 b for fixing to the first housing 1. The sensor driving substrate 8 has a circuit for driving the sensor 6 arranged in the X direction by the reading width, a pad for connecting to the circuit, and the like.

  The substrate holding plate 9 is a plate material extending in the XY plane direction, and includes a housing mounting surface 9a, a sensor substrate mounting reference surface 9b, a sensor mounting reference 9c, a fitting hole 9e, and a fitting hole 9f. When viewed from the YZ plane direction, the housing mounting surface 9a protrudes stepwise toward the reading object at the end in the Y direction. The sensor board attachment reference surface 9b is a surface connecting the housing attachment surface 9a and the main body surface 9g. The sensor mounting reference 9c is located on the housing mounting surface 9a. The sensor mounting reference 9c, the fitting hole 9e, and the fitting hole 9f protrude on the opposite side to the reading object. The housing attachment surface 9a extends in the X direction, and the protruding surface on the side of the reading object is parallel to the main body surface 9g. The sensor board mounting reference surface 9b is a surface that connects the housing mounting surface 9a and the main body surface 9g, and is perpendicular to the main body surface 9g. The sensor mounting standard 9c is information written by a concavo-convex structure or printing located on the housing mounting surface 9a, and a plurality of sensor mounting standards 9c are arranged in the X direction as necessary. The reinforcing structure 9d has the same position in the Y direction as the sensor IC 6 when the sensor substrate 7 is assembled, and is positioned on the back surface, that is, on the opposite side to the reading object in the Z direction with respect to the main body surface 9g. The fitting hole 9e is a hole for fixing the substrate holding plate 9 to the first housing 1, and is provided on the housing mounting surface 9a. The fitting hole 9f is a hole for fixing the substrate holding plate 9 and the sensor drive substrate 8 to the first housing 1, and is provided on the main body surface 9g.

  The signal processing board 10 is a circuit board, and includes a connector 10a that can be connected to the sensor driving board 8, a connector 10b for driving the light source, a connector 10c that can be connected to the outside, and a fitting hole 10d. The signal processing board 10 has a fitting hole 10 e for fixing to the first housing 1. The sensor drive board 8 includes a power supply circuit that drives the light source 17 and an ASIC (Application Specific Integrated Circuit) that is a signal processing circuit. The signal processing board 10 and the sensor driving board 8 may be integrated as necessary.

  The bracket 11 is a plate material composed of an L-shaped metal plate having a plane in the YZ plane direction and the XY plane direction, and has a housing fitting hole 11a and a sealing plate fitting hole 11b on the YZ plane. The YZ plane portion of the bracket 11 has an area that is the same as or larger than the opening portion in the YZ plane direction of the first housing 1, and the YZ plane portion of the first housing 1 when assembled with the first housing 1. The opening can be shielded. The bracket 11 may have an L-shaped basic configuration and may be provided with a reinforcing structure such as a box shape according to the required strength.

  The sealing plate 12 has an L shape extending in the YZ plane and the XY plane, is a plate material made of metal or resin, and has a fitting hole 12a and a glass pressing surface 12b. The fitting hole 12a is a hole for fixing to the bracket 11 provided on the YZ plane, and the YZ coordinates coincide with the sealing plate fitting hole 11b. The glass pressing surface 12b is an XY surface and is continuous with the YZ surface, that is, the surface having the fitting hole 12a. Further, the Y-direction dimension of the glass pressing surface 12b is equal to the Y-direction dimension of the second transparent plate 16, and the Z-direction dimension is equal to 1/2 of the difference between the Z dimension of the second transparent plate 16 and the Z dimension of the plate 18. And

  The cover 13 will be described with reference to FIGS. FIG. 8 is a perspective view of the cover 13, the cover plate 31, and the electromagnetic wave shielding sheet 32 according to the first embodiment of the present invention, as viewed from the side opposite to the reading object. FIG. 9 is a perspective view of the cover 13, the cover plate 31, and the electromagnetic wave shielding sheet 32 according to Embodiment 1 of the present invention, as viewed from the reading object side. FIG. 10 is an exploded view of the cover 13, the cover plate 31, the electromagnetic wave shielding sheet 32, and the seal 33 according to Embodiment 1 of the present invention. FIG. 11 is an exploded view of the cover 13 and the cover plate 31, the electromagnetic wave shielding sheet 32, and the seal 33 according to Embodiment 1 of the present invention assembled. FIG. 12 is an XZ plane cross-sectional view of the cover 13 and the assembly of the cover plate 31, the electromagnetic wave shielding sheet 32, and the seal 33 according to Embodiment 1 of the present invention. FIG. 13 is a development view of the cover 13 according to Embodiment 1 of the present invention. FIG. 14 is a development view of the cover plate 31 according to the first embodiment of the present invention.

  The cover 13 is a metallic box-shaped electronic device housing formed of a sheet metal or a molded product having an opening 13f in the direction of the object to be read, and includes a planar bottom surface 13a, a fastening surface 13b, A hand side surface 13d and a bent surface 13e are provided. The fastening surface 13b is a planar surface for fastening with the signal processing board 10 that is recessed from the bottom surface 13a toward the opening 13f. The short side surface 13d is erected across the X direction at both ends of the bottom surface 13a and the fastening surface 13b in the Y direction, and the long side surface 13c fastened to the first housing 1 and the −X direction end of the bottom surface 13a. Are erected over the Y direction. The bending surface 13e is disposed at a position that is folded inside the cover 13 and cannot be seen from the outside of the product. The fastening surface 13b is a surface parallel to the signal processing board 10, and the stepped portion 13g between the fastening surface 13b and the bottom surface 13a has a Z-direction dimension longer than the Z-direction dimension of the connector fastened to the fastening surface 13b.

  That is, the cover 13 is formed by bending the long side surface 13c inward with respect to the bottom surface 13a, and the fastening surface 13b is recessed toward the opening 13f with respect to the bottom surface 13a and bent inward with respect to the long side surface 13c. , And is formed in parallel with the bottom surface 13a. By adopting this structure, it is possible to prevent the connector from interfering with the installation surface and failing when the product is installed with the bottom surface 13a facing downward. Needless to say, when the cable connecting the connector and the external device is difficult to bend, the difference in height between the fastening surface 13b and the bottom surface 13a is further taken into consideration to the bent portion of the cable.

  The step portion 13g between the fastening surface 13b and the bottom surface 13a has a step structure in the X direction. The step portion 13g has no continuous metal surface and opens in the X direction at the opening portion 13h.

  The longitudinal side surface 13 c extends in the XZ plane so as to be fastened to the first housing 1, and has the same dimension in the X direction as the first housing 1. The short side surface 13d extends in the YZ plane and has the same Y dimension as that of the first housing 1. The long side surface 13 c and the short side surface 13 d form an opening having the same area as the XY plane of the cover 13 fastening portion of the first housing 1. The bent surface 13e is used for bonding or welding when the cover 13 is formed. It goes without saying that the dimensions are adjusted according to the intended strength and weight limit. By adopting this configuration, the cover 13 can be manufactured with a simple sheet metal structure. Needless to say, the shape is optimized for the type and number of connectors required for each product. Further, in the case of a long image sensor, it is often impossible to integrate the connector into one place. In this case, it goes without saying that the cover 13 is provided with a plurality of fastening surfaces 13b.

  The cover plate 31 is made of a lightweight material such as a non-conductive material film or plate, has a shape bent in the X direction as shown in FIG. 10, and is printed as shown in FIGS. A surface 31a, a shielding surface 31b, and a fixed surface 31c are provided. The printing surface 31a extends in the XY plane, the X dimension is equal to or smaller than the fastening surface 13b, the Y dimension is equal to or smaller than the Y dimension of the opening 13h of the cover 13, and the connector fastening portion has an opening. . This opening may be provided in each connector, or the openings of a plurality of connector fastening portions may be connected as shown in FIGS. The shielding surface 31b extends in the YZ plane, the Y dimension is equal to or smaller than the Y dimension of the opening of the cover 13, the Z dimension is equal to or smaller than the Z dimension of the opening of the cover 13, and one end in the X direction. Is adjacent to the printing surface 31a, and one end on the opposite side is adjacent to the fixed surface 31c. The fixed surface 31c extends in the XY plane, the X dimension is equal to or smaller than the X dimension of the bottom surface 13a, and the Y dimension is equal to or smaller than the Y dimension of the opening 13h of the cover 13. That is, the cover plate 31 has a step structure in the X direction in which the shielding surface 31b interposed between the printing surface 31a and the fixed surface 31c forms a standing structure on the printing surface 31a and the fixed surface 31c. Although the structure is slightly complicated, it is needless to say that when the cover plate 31 is desired to have further strength, the strength can be improved by adding a bent surface in the Y direction of the shielding surface 31b or the Y direction of the fixed surface 31c. Yes.

  The electromagnetic wave shielding sheet 32 is formed of a thin, sheet-like material made of a conductive material, and is in close contact with the cover plate 31. Therefore, the electromagnetic wave shielding sheet 32 has a step structure in the X direction. The electromagnetic shielding sheet 32 has an X dimension that is greater than or equal to the X dimension of the fixed surface 31 c and less than or equal to the X dimension of the bottom surface 13 a, and the Y dimension is equal to or greater than the Y dimension of the opening 13 h of the cover 13.

  The seal 33 is formed of a sheet-like material having an adhesive layer on both sides, extends to the XY plane, and has the same shape as 31a. Needless to say, the seal 33 can be replaced with an adhesive or the like.

  Returning to FIG. 1 to FIG. The screw 14 is used as a fastening member in the first embodiment of the present invention. That is, the lens holding plate 5, the sensor driving board 8, the board holding plate 9, the signal processing board 10, the cover 13, the bracket 11, and the second casing 15 are provided with respect to the first casing 1. Conclude. Further, the bracket 11 and the sealing plate 12 are fastened. Needless to say, the fastening strength and the number suitable for the strength required for each fastening point are optimized.

  The second housing 15 is a columnar shape that extends in the X direction and is manufactured by extrusion, injection molding, cutting, or the like using a material having good moldability such as metal or resin. The second housing 15 includes a first housing mounting surface 15a, a first housing mounting hole 15b, a light source mounting surface 15c, a glass mounting surface 15d, and a heat dissipation surface 15e.

  The first housing mounting surface 15a is parallel to the surface of the first housing 1 where the light source mounting hole 1c exists. The first housing mounting hole 15b is disposed on the first housing mounting surface 15a and is provided so that the X direction is the same as that of the light source mounting hole 1c. The light source substrate mounting surface 15c is a flat surface that is continuous with the first housing mounting surface 15a and extends in the X direction having an angle with respect to the first housing mounting surface 15a. When the angle of the housing mounting surface 15a is θ, 90 degrees <θ <180 degrees is obtained. When the irradiation direction of the light source is perpendicular to the light source substrate mounting surface 15c, the incident angle with respect to the reading object is 180−θ. The glass mounting surface 15d is parallel to the first transparent plate 2, has an area sufficient to support the second transparent plate 16 and the plate 18, and does not block the optical path from the light source 20 to the reading object. It shall be short outside.

  The heat radiating surface 15e is a surface located on the opposite side in the Y direction with respect to the light source mounting surface 15c, and has a fin shape protruding in the Y direction in order to dissipate heat generated from the light source 20 into the atmosphere. Needless to say, the number, length, width, pitch, and the like of the fin wings are optimized according to design conditions such as the amount of heat generated by the light source 20 and the external shape restrictions of the image sensor.

  The second transparent plate 16 serves as a cover for an image sensor formed of glass or resin, and is made of a transparent material in order to suppress attenuation of light reflected from the reading object. The reading object is placed on the second transparent plate 16 or at a position away from the second transparent plate 16 in the Z direction.

  The seal 17 is a sheet-like material whose both surfaces are adhesive surfaces, has an outer shape smaller than that of the plate 18, and has an opening at the center so as not to block image information from the reading object passing through the second transparent plate 16. There is.

  The plate 18 is in the form of a sheet or plate formed of resin, and has an outer shape smaller than the glass attachment surface 15 d provided on the second housing 15. The plate 18 has an opening at the center so as not to block image information from the reading object that passes through the second transparent plate 16. This opening has the same shape as the opening of the seal 17 on the XY plane.

  The light source substrate 19 is a plate-shaped glass epoxy substrate or a metal substrate such as aluminum or copper that has a smaller outer shape than the light source substrate mounting surface 15c of the second housing 15 and extends in the X direction, and is used for driving the light source. A connector 19a for supplying power is provided. The light source substrate 19 may be divided in the X direction as necessary.

  The light source 20 is a point light source such as an LED. The light source 20 may combine a plurality of color light sources, for example, red, blue, green, UV light, and infrared light as necessary. Further, a plurality of light sources may be mounted not only in the X direction but also in the Y direction.

  The harness 21 is a cable for driving the light source 20 and has a length sufficient to connect the light source substrate 19 and the signal processing substrate 10.

  The seal 22 is a sheet-like material whose both surfaces are adhesive surfaces, and has the same shape as the light source substrate 19.

Next, a method for manufacturing the image sensor according to the first embodiment of the present invention will be described with reference to FIGS.
The first transparent plate 2 is fixed to the opening portion of the first housing 1 by an adhesive sheet having adhesive surfaces on both sides such as a seal 3.

  The lens support plate 5 and the lens body 4 are bonded using an adhesive or a double-sided tape. The lens support plate 5 and the lens body 4 are not necessarily singular, and a plurality of members may be connected. A lens support plate 5 that supports the lens body 4 is inserted and held in the first housing 1. The focus of the lens body 4 is adjusted to the reading object conveyance surface.

  The substrate holding plate 9 holds the sensor substrate 7 and the sensor driving substrate 8 on the reading object side (first housing 1 side). The sensor substrate 7 is bonded to the substrate holding plate 9 using an adhesive, tape, or the like. When the sensor substrate 7 is bonded, the sensor substrate 7 has a high assembly accuracy in the Y and Z directions by applying a side surface to the sensor substrate mounting reference surface 9b. Secure. The sensor IC 6 is mounted on the sensor substrate 7 based on the sensor mounting standard 9c, thereby ensuring high accuracy in the Y direction. The sensor drive board 8 is arranged on the main body surface 9g of the board holding plate 9 so as to be parallel to the sensor board 7 so that the fitting hole 9f and the fitting hole 8b are located at the same place, and is bonded using bonding or tape. .

  Since the sensor drive board 8 is held in the first housing 1 by a screw passing through the fitting hole 8c and the fitting hole 9f, the sensor driving board 8 is assembled even when the cable is inserted into and removed from the connector 8a or the light source driving connector 11b. Will not change. The substrate holding plate 9 is fixed to the first housing 1 with screws 14 using the fitting holes 9e and the fitting holes 9f.

  The substrate holding plate 9 is fixed to the first housing 1 with screws 14 using the fitting holes 9e and the fitting holes 9f. Since the fitting hole 9e and the fitting hole 9f are positioned opposite to each other in the Y direction around the sensor 6, the fitting hole 9e and the fitting hole 9f hold the sensor 6 on the substrate holding plate 9 on both sides in the Y direction. Further, this structure is such that the sensor substrate 7 is not directly fastened, and the sensor IC 6 is not subjected to characteristic fluctuation due to the tension at the time of fastening. With these structures, the sensor 6 can be stably held. Note that the fixing means to the first casing 1 is not limited to the screw 14 and may be held by fitting or bonding with a rivet.

  The signal processing board 10 is electrically connected to the sensor driving board 8 by fitting the connector 10a and the connector 8a. In the signal processing board 10, the fitting hole 10 d is arranged at the same position on the XY plane as the fitting hole 9 f of the board holding plate 9 by assembly. The signal processing board 10 is indirectly fixed to the first casing 1 by being fastened with a screw or the like to a spacer standing on the fitting hole 9f. In addition, when the signal processing board | substrate 10 and the sensor drive board | substrate 8 are integrated, it cannot be overemphasized that the objective can be achieved by fixing the sensor drive board | substrate 8 to the 1st housing | casing 1. FIG.

  The bracket 11 is fixed with screws 14 by superimposing the housing mounting holes 11 a on the bracket mounting holes 1 a at both ends in the X direction of the first housing 1.

  The linear light source is obtained by assembling the light source 20 and the connector 19a on the light source substrate 19 by soldering. The light source substrate 19 and the light source 20 are merely examples, and it is not difficult to imagine that a surface light source such as a lamp or an EL light source can be substituted.

  The light source substrate 19 is fixed to the light source substrate mounting surface 15 c of the second housing 15 using a seal 22.

  The second casing 15 is fixed to the first casing 1 with screws 14 using the first casing casing mounting holes 15b. The assembled second casing 15 having the same shape is assembled from the opposite side of the first casing 1 in the Y direction.

  Further, in the Z direction, the side opposite to the heat radiating surface 15 e of the second housing 15 is in contact with the flat portion of the first housing 1, and the second housing 15 is fixed to the protruding portion of the first housing 1. . The side opposite to the heat radiating surface 15e of the second housing 15 abuts on the flat surface portion of the first housing 1, so that the flat surface portion of the first housing 1 becomes the light source mounting reference surface, and the Z direction of the second housing 1 Position accuracy is obtained.

  By attaching the second housing 15 to the first housing 1, a recess is formed in which the space between the flat portion of the first housing 1 and the heat radiation surface 15 e of the second housing 15 is recessed.

  One terminal of the harness 21 is inserted into the connector 19 a on the light source board 19, and the opposite terminal is inserted into the light source driving connector 10 b on the signal processing board 10. The harness 21 is taken out from the flat surface portion of the first housing 1 to the outside of the first housing 1, and is formed between the flat surface portion of the first housing 1 and the heat radiation surface 15 e of the second housing 15. The light source substrate 19 fixed to the second housing 15 is connected via the recess. For this reason, the outer dimensions of the image sensor do not change even if the thickness and number of the harnesses 21 change.

  The cover 13 will be described with reference to FIGS. The fixing surface 31c of the cover plate 31 is inserted into the opening 13h of the cover 13 formed of sheet metal or a molded product. The shielding surface 31b is inserted into the cover 13 from the opening portion of the cover 13 so as to shield the opening 13h of the cover 13, and is disposed so as to be in close contact with the bottom surface 13a. A seal 33 is inserted between the printing surface 31a and the fastening surface 13b, and the printing surface 31a is fixed to the fastening surface 13b. The electromagnetic wave shielding sheet 32 is sandwiched between a part of the printing surface 31 a of the cover plate 31 and a part of the surface opposite to the opening 13 h of the fastening surface 13 b of the cover 13. The opening 13h of the cover 13 is such that the shielding surface 31b and the fixed surface 31c of the cover plate 31 are in contact with a part of the inside of the opening 13h formed on the bottom surface 13a of the cover 13 and cover the bottom surface 13a. It fixes so that it may contact | adhere to the cover plate 31 and the cover 13 from the inside inside. The cover 13 in which the cover plate 31 and the electromagnetic wave shielding sheet 32 are assembled in this way is fixed to the first housing 1 and the signal processing board 10 with screws 14 with the reading object side as the opening 13f side.

  Returning to FIG. 1 to FIG. The second transparent plate 16 is bonded to the plate 18 by the seal 17 and is inserted into the glass mounting surface 15d of the second housing 15 from the X direction end of the YZ plane. Since the outer shape of the seal 17 is larger than that of the second transparent plate 16 and smaller than the glass mounting surface 15d, the plate 18 serves as a rail. The plate 18 closes the space between the second housing 15 and the second transparent plate 16 and prevents foreign matter from entering.

  The sealing plate 12 is attached to the bracket 11. The sealing plate 12 is attached at a position higher in the Z direction than the plate 18, but does not directly press the second transparent plate 16. That is, the second transparent plate 16 is indirectly fixed in the X direction and the Z direction. When the sealing plate 12 is placed on the plate 18, the space between the second housing 15 and the second transparent plate 16 is closed, and foreign matter is prevented from being mixed. The fixing means using these screws 14 is not limited to the screws 14 and may be held by fitting or bonding with rivets.

  Next, the flow of image information in Embodiment 1 of the present invention will be described. FIG. 6 is a diagram showing an example of the optical path of the image sensor according to Embodiment 1 of the present invention. The light source 20 is arranged in the same direction as the image sensor with respect to the reading object 30 and irradiated with light, and the image information of the reflected light from the reading object 30 passes through the first transparent plate 2 and passes through the lens 4. An image is formed on the sensor 6. The photoelectrically converted image information reaches the signal processing board 10 from the sensor 6 through the sensor driving board 9, and outputs the image information to the outside of the image sensor through the connector 10c. In addition, even when the light from the light source 20 arranged facing the image sensor with the reading object 30 interposed therebetween passes through the reading object 30 and enters the image sensor, the operation after entering the image sensor Is the same.

  The first housing 1 mounts a light source using a light source attachment reference surface provided with a light source attachment hole 1c and a lower surface perpendicular to the light source attachment reference surface. A surface existing between the light source mounting reference surface and the surface on which the first transparent plate 2 on the reading object side is placed is slanted. That is, the YZ plane section is narrowed toward the reading object side. By adopting this configuration, there is a degree of freedom in the incident angle of the light source, and it is possible to take the illumination angle and position according to the purpose with respect to the reading object. For example, when direct light illumination is required, the light source is brought close to the first housing 1 to reduce the incident angle. On the other hand, when scattered light illumination is required, the light source should be separated from the first housing and have a wide incident angle. When light source illuminance is required, the light source is brought close to the reading object. On the other hand, when a ripple (deviation) occurs in a light source in which point light sources are arranged in an array, the light source is separated from the reading object.

  Next, the flow of heat conduction from the light source according to Embodiment 1 of the present invention will be described with reference to FIGS.

  The light source 20 conducts heat to the light source substrate 19 through the mounting surface, the light source substrate 19 conducts heat from the back surface of the surface on which the light source 20 is mounted (the seal 22 contact surface) to the seal 22, and the seal 22 passes through the light source substrate mounting surface 15c. Heat is transferred to the two housings 15. The second housing 15 diffuses heat from the light source substrate mounting surface 15c into the housing and radiates heat from the housing surface including the heat radiating surface 15e to the atmosphere.

  The harness 21 uses a portion recessed in the Y direction with respect to the maximum outer shape in the Y direction formed between the first casing 1 and the second casing 15 as a harness route. For this reason, since the harness enters the inside of the outer shape of the second housing 15, the product has a simple structure, and it is possible to prevent the product from being destroyed due to a work mistake such as catching the harness 21 during work such as product installation. it can.

  Next, effects obtained by taking the first embodiment of the present invention will be described. Since the substrate holding plate 9 indirectly holds the sensor substrate 7, it becomes difficult to apply stress due to fastening to the sensor 6, and the sensor substrate 7 uses the sensor substrate mounting reference surface 9 b as a reference surface in the Y direction. Is held by the substrate holding plate 9. Since the position of the substrate holding plate 9 is determined with high accuracy in the Y direction and the Z direction with respect to the first housing 1 by using the fitting holes 9e and 9f, the sensor substrate 7 and the sensor 6 are consequently high in height. It is held with high accuracy in the Y direction and the Z direction. Further, the cover plate 31 is physically shielded by the cover plate 31 and covered with the electromagnetic shield sheet 32 from the inside including the cover 13 opening portion. A low-cost EMI shield structure can be realized. Further, by providing the cover plate 31 with the printing surface 31a, information on the fastened connector can be beautifully described. Further, in the EMI process in which the shield layer is provided, the efficiency of the EMI process is improved by electrically connecting the shield surface to the ground strongly and forming a stable shield layer. As a result, it is possible to provide an EMI countermeasure device that can be designed with a low cost and without using expensive EMI countermeasure parts such as a ferrite core.

  Next, the foreign matter mixing prevention effect of the present embodiment will be described. The upper surface of the first housing 1 parallel to the object to be read is entirely sealed with the first transparent plate 2, the lower surface is sealed with the sensor driving substrate 8 and the substrate holding plate 9, and the hole in the YZ section is sealed with the bracket 11. Covered with a stop plate 12. That is, the first housing 1 has a sealing structure on the entire surface, and has high dust resistance against the internal lens body 4 and the sensor 6. Further, since the opening 13h of the cover 13 is shielded by the cover plate 31, it is possible to prevent the inside of the apparatus from being mixed when a minute part such as a screw slides down during assembly work.

Embodiment 2. FIG.
Embodiment 2 of the present invention will be described with reference to the drawings. In the second embodiment of the present invention, another example of the cover 13 which is an electronic device casing will be described. FIG. 15 is a perspective view of the cover 13, the cover plate 31, and the electromagnetic wave shielding sheet 32 according to the second embodiment of the present invention, as viewed from the side opposite to the reading object. FIG. 16 is a perspective view in which the cover 13, the cover plate 31, and the electromagnetic wave shielding sheet 32 according to the second embodiment of the present invention are combined and viewed from the reading object side. FIG. 17 is an exploded view of the cover 13, the cover plate 31, the electromagnetic wave shielding sheet 32, and the seal 33 according to Embodiment 2 of the present invention. FIG. 18 is an exploded view of the cover 13 and the assembly of the cover plate 31, the electromagnetic wave shielding sheet 32, and the seal 33 according to Embodiment 2 of the present invention. FIG. 19 is an XZ plane cross-sectional view of the cover 13 and an assembly of the cover plate 31, the electromagnetic wave shielding sheet 32, and the seal 33 according to Embodiment 2 of the present invention. 15 to FIG. 19, the same or equivalent components as those in FIG. 8 to FIG.

  The cover 13 of the second embodiment has a bottom surface 13a and an opening 13h at both ends in the X direction of the fastening surface 13b. Also in this case, similarly to the first embodiment of the present invention, the shielding surface 31b and the fixing surface 31c are provided at both ends of the cover plate 31 in the X direction so as to shield each of the two openings 13h. . Further, by inserting the cover plate 31 and the electromagnetic wave shielding sheet 32 into the two openings 13h in the same manner as in the first embodiment of the present invention, the EMI shield and dustproofness of the respective openings 13h are ensured. The same effects as those of the first embodiment are obtained.

1 first housing, 1a bracket mounting hole, 1b cover mounting hole, 1c light source mounting hole,
2 first transparent plate, 3 seal, 4 lens body (imaging optical system), 5 lens support plate,
6 sensor (light receiving part), 7 sensor substrate, 8 sensor drive substrate, 8a connector,
8b fitting hole, 9 substrate holding plate, 9a housing mounting surface, 9b sensor substrate mounting reference surface,
9c sensor mounting standard, 9d reinforcing structure, 9e fitting hole, 9f fitting hole, 9g body surface,
10 signal processing board, 10a connector, 10b light source drive connector,
10c connector, 10d fitting hole, 10e fitting hole, 11 bracket,
11a housing fitting hole, 11b sealing plate fitting hole, 12 sealing plate, 12a fitting hole,
12b glass holding surface, 13 cover (electronic equipment housing),
13a bottom surface (first flat surface portion), 13b fastening surface (second flat surface portion), 13c long side surface,
13d short side surface, 13e bent surface, 13f opening (first opening),
13g stepped portion, 13h opening (second opening), 14 screws, 15 second housing,
15a first housing mounting surface, 15b first housing housing mounting hole, 15c light source substrate mounting surface,
15d glass mounting surface, 15e heat dissipation surface, 16 second transparent plate, 17 seal,
18 plate, 19 light source board, 19a connector, 20 light source, 21 harness,
22 seal, 30 object to be read, 31 cover plate, 31a marking surface,
31b shielding surface, 31c fixing surface, 32 electromagnetic wave shielding sheet (conductive member),
33 Seal.

Claims (9)

A first opening;
A first flat portion facing the first opening;
A second planar portion recessed toward the first opening with respect to the first planar portion;
The first plane part and the second plane are arranged at the short axis direction ends of the first plane part and the second plane part over the longitudinal direction of the first plane part and the longitudinal direction of the second plane part. A side surface standing over the flat surface,
A second opening portion provided in a step portion between the first plane portion and the second plane portion, surrounded by the side surface portion, the first plane portion, and the second plane portion and opened in a longitudinal direction;
A step structure having a step structure in which a convex portion of the step structure is in contact with the first flat portion, a concave portion of the step structure is in contact with the second flat portion, and is interposed between the convex portion and the concave portion; A conductive member disposed in the second opening by closing the second opening with a standing part;
Electronic equipment housing with The side part is formed by bending inward with respect to the first flat part,
2. The electronic device casing according to claim 1, wherein the second flat portion is formed to be recessed toward the first opening with respect to the first flat portion and bent inward with respect to the side portion. The second plane portion includes a connector,
3. The electronic device housing according to claim 1, wherein a recess height of the second plane portion with respect to the first plane portion is equal to or higher than a height of the connector. The conductive member is
The convex part of the step structure is inserted from the second opening part to the first plane part side, and contacts the surface of the first plane part on the first opening part side,
The concave portion of the step structure is in contact with the surface of the second plane portion opposite to the first opening side,
The electronic device housing according to any one of claims 1 to 3. The conductive member is composed of a conductive sheet and a non-conductive sheet in order from the first opening side,
5. The electronic device housing according to claim 1, wherein, in the first plane portion, the conductive sheet extends in a longitudinal direction from the non-conductive sheet. The non-conductive sheet has a step structure in the longitudinal direction at an end in the longitudinal direction,
The electronic device casing according to claim 5, wherein the conductive sheet is in close contact with the stepped structure portion of the non-conductive sheet. 7. The electron according to claim 1, wherein the first planar portion extending in the longitudinal direction through the second opening is provided at one end portion in the longitudinal direction of the second planar portion. Equipment housing. 7. The electronic device housing according to claim 1, wherein the first planar portion extending in the longitudinal direction through the second opening is provided at both ends in the longitudinal direction of the second planar portion. body. The electronic device housing according to any one of claims 1 to 8,
Has an opening in a direction perpendicular to the conveying direction of the object to be read, and a first housing fixed to the first opening of the electronic machine Utsuwakatamitai opposite the object to be read side,
A lens body that is disposed inside the opening of the first housing and focuses light from the reading object;
A light receiving element for receiving the light focused by the lens body;
A light receiving element substrate fixed to at least one of the electronic device casing and the first casing and mounted with the light receiving element;
Image sensor equipped with.

Images