JP6389755B2 - Cutting apparatus and cutting method - Google Patents

Description

  The present invention relates to a cutting device for cutting a plate-like workpiece and a method for cutting a plate-like workpiece.

  In a cutting apparatus for cutting a plate-like workpiece such as a semiconductor wafer, the plate-like workpiece is attached to a dicing tape to which an annular frame is attached in order to facilitate the handling of the plate-like workpiece, and the annular frame is further chucked. Cutting is performed by cutting a cutting blade into a plate-like workpiece in a state of being fixed on the table (see, for example, Patent Documents 1 and 2). However, since the inner periphery of the annular frame is circular, when the outer shape of the plate-like workpiece is rectangular, if the entire bottom surface of the plate-like workpiece is attached to the dicing tape, the portion of the plate-like workpiece not attached There is a problem in that the area of the dicing tape is widened, and the amount of dicing tape used is unnecessarily increased to increase the cost. As a means of reducing the cost and ensuring the holding of the plate-shaped workpiece, the plate-shaped workpiece is used so that the end of the dicing tape protrudes from the plate-shaped workpiece without using the annular frame. It is conceivable that a workpiece is attached and the dicing tape is sucked and held on a chuck table for cutting (Japanese Patent Application No. 2013-103414).

Japanese Patent Laid-Open No. 08-069985 JP 2010-118426 A

  Here, when a plate-like workpiece is cut using a cutting device, it is necessary to prevent the chips generated by cutting from staying on the plate-like workpiece and contaminating the device. Therefore, a cutting fluid nozzle that ejects cutting fluid around the cutting blade of the cutting device is disposed, and cutting is performed while jetting cutting fluid at a high pressure from the cutting fluid nozzle, thereby preventing stagnation of cutting waste.

  However, in this case, when the cutting process is performed without using the annular frame, the high-pressure cutting fluid sprayed from the cutting fluid nozzle enters between the dicing tape and the chuck table, and the dicing tape is drawn by the pressure of the cutting fluid. Sometimes. For this reason, the suction holding of the dicing tape by the chuck table cannot be maintained, and cutting of the plate-shaped workpiece can be hindered by the plate-shaped workpiece being displaced or blown off from the chuck table together with the dicing tape.

  The present invention has been proposed in view of the above problem. That is, even when a plate work is held on a chuck table without using an annular frame and cutting is performed by ejecting high-pressure cutting fluid from a cutting fluid nozzle to remove cutting waste, dicing tape is used. It is intended to prevent the plate-like workpiece from being wound on the chuck table and to stably hold the plate-like workpiece by suction on the chuck table.

  In order to achieve the above object, the present invention provides a chuck table that sucks and holds a dicing tape to which one side of a rectangular plate-shaped work is attached, and a plate-like work that is sucked and held by the chuck table via the dicing tape. A dicing tape, and a dicing tape, wherein the dicing tape is provided with an extruding portion on which the extruding plate-like work is not adhered, and the chuck table is attached to the dicing tape. A workpiece suction surface that sucks the area where the plate-shaped workpiece is adhered, and a tape suction that is inclined so as to descend toward the outer periphery of the chuck table and sucks the protruding portion where the plate-shaped workpiece is not adhered to the dicing tape. And the protruding portion is sucked by the tape suction surface to prevent the dicing tape from curling during the cutting process. A cutting device comprising.

  The chuck table preferably includes an insertion groove for inserting the outer peripheral edge of the dicing tape at the inclined peripheral part of the tape suction surface.

  Moreover, this invention for achieving the said objective is a cutting method using the said cutting device, Comprising: The sticking process which forms the said protrusion part in the single side | surface of a rectangular plate-shaped workpiece, and sticks the said dicing tape, A holding step of sucking the dicing tape to the workpiece suction surface and the tape suction surface of the chuck table and holding a plate-like workpiece adhered to the dicing tape, and the chuck table held in the holding step A cutting step of cutting a plate-like workpiece with the cutting means.

  In the cutting apparatus, the dicing tape includes a protruding portion to which a plate-like workpiece is not attached, and a workpiece suction surface that sucks an area to which the plate-like workpiece is attached, and descends toward the outer periphery of the chuck table. The chuck table is provided with a tape suction surface that sucks the protruding portion where the plate workpiece is not attached to the dicing tape so that the plate workpiece is not adhered to the dicing tape. Even when holding and cutting the high pressure cutting fluid from the cutting fluid nozzle, the cutting fluid ejected from the cutting fluid nozzle is chucked by sucking the protruding portion with the tape suction surface. It is possible to prevent entry into the gap between the table and the dicing tape, and to prevent the dicing tape from curling. .

  Furthermore, by providing the chuck table with an insertion groove at the inclined peripheral portion of the tape suction surface, the cutting fluid enters the gap between the dicing tape and the chuck table by inserting the outer peripheral edge of the dicing tape into the insertion groove. In addition to preventing the dicing tape from being caught, the outer peripheral edge of the dicing tape is caught in the insertion groove, so that it is possible to more reliably prevent the dicing tape from curling due to the ejected cutting fluid.

  In addition, using the cutting device, a sticking step of sticking the dicing tape by forming a protruding portion on one surface of a rectangular plate-like work, and sucking the dicing tape to the work suction surface and the tape suction surface of the chuck table By performing a holding step for holding the plate-like workpiece adhered to the dicing tape and a cutting step for cutting the plate-like workpiece held on the chuck table by the cutting means in the holding step, It is possible to prevent the dicing tape from curling when cutting is performed by ejecting the cutting fluid.

It is a perspective view which shows the state by which the plate-shaped workpiece was affixed on the dicing tape. It is a perspective view which shows an example of a cutting device. It is a perspective view which expands and shows the A section of FIG. (A) is a top view of the chuck table of Embodiment 1, (B) is a top view of Embodiment 2 of a chuck table. 4A is a cross-sectional view of the chuck table of FIG. 4A taken along line BB, and FIG. 4B is a cross-sectional view of the chuck table of FIG. 4B taken along line CC. (A) is a top view which shows the state by which the plate-shaped workpiece | work was hold | maintained via the dicing tape on the chuck table of Embodiment 1. FIG. (B) is a top view which shows the state by which the plate-shaped workpiece | work was hold | maintained via the dicing tape on the chuck table of Embodiment 2. FIG. (A) is sectional drawing of the state in which the plate-shaped workpiece is cutting-feeded in the cutting method using the cutting device provided with the chuck table of FIG. 4 (A). FIG. 4B is a cross-sectional view of a state in which a plate-like workpiece is being cut and fed in a cutting method using a cutting apparatus including the chuck table of FIG.

  The plate-like workpiece W shown in FIG. 1 has a rectangular shape, and the plate-like workpiece upper surface Wa of the plate-like workpiece W is partitioned by streets S. The adhesive surface Ta of the dicing tape T is attached to the plate-like workpiece bottom surface Wb of the plate-like workpiece W. The adhesive surface Ta has an area covering the entire surface of the plate-like workpiece bottom surface Wb. Further, the dicing tape T includes a sticking area Tc where the plate-like workpiece W is stuck and a protruding portion Td where the dicing tape T sticks out of the plate-like workpiece W and the plate-like workpiece W is not stuck. In addition, the ratio of the area of the sticking area Tc and the area of the protruding portion Td can be appropriately changed depending on the type and size of the plate-like workpiece W to be held.

  The cutting device 1 shown in FIG. 2 performs cutting feed by reciprocating the plate-like workpiece W sucked and held by the chuck table 3 in the cutting feed direction (X-axis direction) by the cutting feed means 5, and cutting by the cutting means 6. Is to be applied.

  The cutting feed means 5 disposed on the base 2 of the cutting apparatus 1 shown in FIG. 2 includes a ball screw 50 having an axis in the X-axis direction, and a pair of guide rails 51 disposed in parallel to the ball screw 50. The motor 52 includes a motor 52 for rotating the ball screw 50, a movable plate 53 whose inner nut is screwed into the ball screw 50 and whose bottom is in sliding contact with the guide rail 51, and a scale 54 indicating the position of the movable plate 53. When the ball screw 50 is rotated, the movable plate 53 is guided by the guide rail 51 to reciprocate in the X-axis direction, and the head (not shown) provided on the movable plate 53 detects the scale 54, thereby moving the ball screw 50. The position of the plate 53 is recognized. On the movable plate 53, index feeding means 7 is disposed.

  The index feeding means 7 shown in FIG. 2 includes a ball screw 70 having an axis in the Y-axis direction, a pair of guide rails 71 arranged in parallel to the ball screw 70, a motor 72 that rotates the ball screw 70, an internal The movable plate 73 includes a nut screwed into the ball screw 70 and a bottom portion slidably contacting the guide rail 71, and a scale 74 indicating the position of the movable plate 73. When the motor 72 rotates the ball screw 70, the nut moves. The plate 73 is guided by the guide rail 71 and reciprocates in the Y-axis direction, and the head (not shown) provided on the movable plate 73 detects the scale 74 so that the position of the movable plate 73 is recognized. On the movable plate 73, a rotating means 40 for rotating the chuck table 3 is provided.

  2 includes a ball screw 90 having an axis in the Z-axis direction, a pair of guide rails 91 arranged in parallel to the ball screw 90, a motor 92 for rotating the ball screw 90, an internal When the motor 92 rotates the ball screw 90, the movable plate 93 is guided by the guide rail 91 along with the nut. It is configured to reciprocate in the axial direction.

  As shown in FIGS. 2 and 3, the cutting means 6 includes a spindle 60 having a rotating shaft whose axial direction is a direction (Y-axis direction) perpendicular to the horizontal direction with respect to the moving direction (X-axis direction) of the movable plate 53. , A housing 61 that rotatably supports the spindle 60, and a cutting blade 62 that is fixed to the spindle 60 and is rotatable. An imaging unit 610 for imaging and detecting a position where the plate-like workpiece W is to be cut is fixed to the housing 61. The housing 61 is fixed to the movable plate 93.

  As shown in FIG. 3, the cutting blade 62 is formed in a disk shape, and is configured with a cutting edge 621 fixed to the periphery of a base 620, and is fixed to the spindle 60 by a nut 65. A pair of cutting fluid nozzles 63 are provided on the front and rear sides of the cutting edge 621 in the Y-axis direction to supply cutting fluid to a processing point of the cutting edge 621 with respect to the plate-like workpiece W. Further, a cutting fluid nozzle 64 that ejects the cutting fluid is also provided in the extending direction of the surface direction of the cutting edge 621. The cutting fluid ejected from the cutting fluid nozzles 63 and 64 flows from the cutting fluid inlets 630 and 640, respectively. The cutting fluid ejected from the cutting fluid nozzle 63 cools the contact portion between the cutting edge 621 and the plate-like workpiece W, and the cutting fluid ejected from the cutting fluid nozzle 64 is generated at the processing point of the plate-like workpiece W. Remove cutting debris.

  The chuck table 3a shown in FIGS. 4A and 5A, which is one embodiment of the chuck table 3 provided in the cutting apparatus 1 shown in FIG. 2, has, for example, a plate-shaped workpiece W having a rectangular outer shape. Is provided with a holding surface 30 for sucking and holding the dicing tape T to which the plate-like workpiece W is adhered, and a bottom surface 31 to which the rotating means 40 shown in FIG. 2 is connected. The holding surface 30 is inclined so as to descend toward the outer periphery of the chuck table 3 and the workpiece suction surface 32 that sucks the sticking area Tc (see FIG. 1) to which the plate-like workpiece W is stuck of the dicing tape T. And a tape suction surface 33 for sucking the protruding portion Td (see FIG. 1) where the plate-like workpiece W is not adhered to the dicing tape T.

  The work suction surface 32 and the tape suction surface 33 are made of, for example, porous ceramics. Further, as shown in FIG. 4A, the tape suction surface 33 is preferably provided along all four sides constituting the outer periphery of the rectangular chuck table 3a. Some may be provided along a pair of opposite sides constituting the outer periphery of the chuck table 3a. The area ratio between the workpiece suction surface 32 and the tape suction surface 33 can be appropriately changed depending on the size of the plate-like workpiece W to be attached.

  The workpiece suction surface 32 includes, for example, a plurality of suction grooves 34 formed in an annular shape around the center point of the holding surface 30, and four suction grooves 35 radiating from the center point of the holding surface 30. The tape suction surface 33 includes suction grooves 37 disposed along the outer periphery of the rectangular chuck table 3 a in addition to the suction grooves 34 and 35. The arrangement and number of the suction grooves 34 and 35 are not particularly limited, but the suction grooves 34 and 35 may be arranged at equal intervals on each of the workpiece suction surface 32 and the tape suction surface 33. preferable. Further, as shown in FIG. 4A, the suction grooves 37 are preferably arranged along all four sides constituting the outer periphery of the rectangular chuck table 3a, but depending on the type of the plate-like workpiece W to be held. May be arranged along a pair of opposite sides constituting the outer periphery of the chuck table 3a.

  As shown in FIG. 5A, the cutting apparatus 1 includes a suction source 41 that generates a suction force for sucking and holding the dicing tape T on the chuck table 3. The suction force generated by the suction source 41 is connected to the suction source 41 and passes through the suction pipe 36a passing through the center inside the chuck table 3a and the suction hole 36b communicating with the suction pipe 36a, and the suction groove communicating with the suction hole 36b. 34, 35, and 37 are transmitted to the workpiece suction surface 32 and the tape suction surface 33. The suction source 41 is, for example, a vacuum generator or a compressor.

  The chuck table 3b shown in FIGS. 4 (B) and 5 (B), which is one embodiment of the chuck table 3 provided in the cutting apparatus 1 shown in FIG. 2, is shown in FIGS. 4 (A) and 5 (A). In addition to the structure of the chuck table 3a, an insertion groove 38 for inserting the tape outer peripheral edge Te of the dicing tape T shown in FIG. In FIG. 4B, the insertion groove 38 is provided along a pair of opposite sides in the peripheral portion of the rectangular chuck table 3b, but may be provided along the entire peripheral portion. Further, as shown in FIG. 5B, it is preferable that the suction groove 37 is also provided inside the insertion groove 38 because the suction holding of the dicing tape T becomes stronger.

(Embodiment 1)
The operation and cutting method of the cutting apparatus 1 when the plate-like workpiece W shown in FIG. 1 is cut by the cutting apparatus 1 will be described below with reference to FIGS. 1, 6A and 7A. . In FIG. 7A, the configuration of the cutting device 1 other than the cutting means 6 is omitted.

(1) Adhesion process First, as shown in FIG. 1, the adhesion process which adheres the dicing tape T to the single side | surface of the plate-shaped workpiece W is performed. In the attaching step, first, the dicing tape attaching surface Ta of the dicing tape T is opposed to the plate-like workpiece bottom surface Wb of the plate-like workpiece W for alignment. At the time of alignment, it is preferable that the entire outer periphery of the dicing tape T protrudes from the plate-like workpiece W.

  After the alignment, the attaching step is completed by attaching the entire surface of the plate-like workpiece bottom surface Wb to the dicing tape Ta. When sticking the plate-like workpiece bottom surface Wb to the dicing tape Ta, as shown in FIG. 1, when sticking so that the protruding portion Td is provided on the outer sides of all four sides constituting the outer periphery of the plate-like workpiece W. Although it is preferable, depending on the type of the plate-like workpiece W, the protruding portion Td may be attached so as to be provided on the outside of a pair of opposite sides constituting the outer periphery of the plate-like workpiece W. In this case, a protruding portion Td may be provided on the outer side of a pair of opposite sides orthogonal to the horizontal direction with respect to the direction in which the nozzles 63 and 64 shown in FIG. 3 discharge the cutting fluid.

(2) Holding step After the adhering step is completed, as shown in FIGS. 6A and 7A, the dicing tape T is sucked to the workpiece suction surface 32 and the tape suction surface 33 of the chuck table 3a, A holding process for holding the plate-like workpiece W to be attached to the dicing tape T is performed.

  In the holding step, first, alignment is performed so that the dicing tape T attached to the plate-like workpiece W in the attaching step is placed on the holding surface 30 of the chuck table 3a with the dicing tape bottom surface Tb facing downward. For alignment, the center line axis of the dicing tape T and the center line axis of the chuck table 3a are aligned so that the four sides constituting the outer periphery of the dicing tape T and the four sides constituting the outer periphery of the chuck table 3a are parallel to each other, As shown in FIG. 6A, the suction grooves 34, 35, and 37 are all covered with the dicing tape T so that the four sides constituting the outer periphery of the chuck table 3a protrude from the dicing tape T. After alignment, the dicing tape T is placed on the holding surface 30 of the chuck table 3a.

  Next, by driving the suction source 41, the suction force generated by the suction source 41 is transmitted to the work suction surface 32 and the tape suction surface 33 through the suction pipes 36 a and the suction holes 36 b and through the suction grooves 34, 35 and 37. The dicing tape bottom surface Tb is sucked by the workpiece suction surface 32 and the tape suction surface 33, whereby the plate-like workpiece W adhered to the dicing tape T is held on the chuck table 3a. At the same time, as shown in FIGS. 6A and 7A, the tape suction surfaces 33 respectively provided on the four sides constituting the outer periphery of the chuck table 3a suck the protruding portion Td of the dicing tape T. The peripheral edge side of the protruding portion Td is held following the inclination of the tape suction surface 33.

(3) Cutting process After the holding process is completed, a cutting process in which the plate-like workpiece W held on the chuck table 3a in the holding process is cut by the cutting means 6 is started. As shown in FIG. 7A, in the cutting process, the plate-like workpiece W fixed to the chuck table 3a is fed in the X-axis positive direction by the cutting feed means 5 shown in FIG. 2 is driven in the Y-axis direction by the index feeding means 7 shown in FIG. 2, the plate-like workpiece W is imaged by the imaging means 610, and the street S to be cut by the cutting blade 62 provided in the cutting means 6 is detected.

  After the alignment of the cutting blade 62 and the detected street S in the Y-axis direction is performed by the index feeding means 7, the cutting feeding means 5 further feeds the plate-like workpiece 2 in the X-axis positive direction, and the cutting feed means 9. Lowers the cutting blade 62 in the negative Z-axis direction. Further, the cutting blade 62 fixed to the spindle 60 cuts into the plate-like workpiece W while rotating at high speed, and the street S is cut. During cutting, the cutting fluid is ejected from the cutting fluid nozzle 63 to the contact portion between the cutting blade 62 and the plate-like workpiece W, and the cutting feed direction (from the cutting fluid nozzle 64 toward the upper surface of the plate-like workpiece W ( Cutting fluid is ejected in the X-axis direction).

  As shown in FIG. 7A, during the main cutting process, the tape suction surface 33 is inclined so as to descend toward the outer periphery of the chuck table 3, and the tape suction surface 33 protrudes from the dicing tape T. By sucking Td, the outer peripheral edge Te of the dicing tape T is also inclined. Therefore, since the cutting fluid ejected from the cutting fluid nozzle 64 does not face between the dicing tape T and the holding surface 30, the cutting fluid ejected from the cutting fluid nozzle 64 is between the chuck table 3a and the dicing tape T. Intrusion into the gap is prevented. As a result, since the dicing tape T is prevented from curling, the plate-like workpiece W is cut down (when the cutting blade is above the plate-like workpiece, the cutting blade is plate-shaped in front of its moving direction. Of course, when cutting the workpiece so as to cut downward, the dicing tape T is likely to curl up (when the cutting blade is above the plate-shaped workpiece, the cutting blade moves forward in the moving direction). In the case of cutting the plate-like workpiece so as to cut upward), the dicing tape T can be stably cut without being rolled. In the present embodiment, as shown in FIGS. 4A and 6A, the tape suction surface 33 is provided along all four sides constituting the outer periphery of the rectangular chuck table 3a. Since the dicing tape T is placed and sucked so that the outer periphery of the chuck table 3a protrudes from the dicing tape T, the cutting fluid ejected from the cutting fluid nozzles 63 and 64 is in any direction. The dicing tape T can be prevented from twisting.

  When the plate-like workpiece W advances to a predetermined position in the + X direction at which the cutting blade 62 finishes cutting the street S, the cutting feed of the plate-like workpiece W by the cutting feed means 5 is once stopped, and the cutting feed means 9 is cut by the cutting blade 62. Is separated from the plate-like workpiece W in the positive direction of the Z-axis. Next, the cutting feed means 5 feeds the plate-like workpiece W in the −X direction and returns it to the original position. Then, all the streets S in the same direction are cut by sequentially performing the same cutting while indexing the cutting blade 62 in the Y-axis direction at intervals of the adjacent streets S.

  Further, when the chuck table 3a is rotated 90 degrees by the rotating means 40 and then the same cutting is performed, all the streets S are all cut vertically and horizontally, and the plate-like workpiece W is divided into individual chips. Since the tape suction surface 33 is provided along all four sides constituting the outer periphery of the rectangular chuck table 3a, the chuck table 3a and the dicing tape T can be cut even when the chuck table 3a is rotated by 90 degrees. It is possible to prevent the cutting fluid from entering the gap between them, and to suppress the dicing tape T from dripping.

(Embodiment 2)
Hereinafter, with reference to FIGS. 6B and 7B, the operation and cutting method of the cutting apparatus 1 when the plate-like workpiece W shown in FIG. 1 is cut by the cutting apparatus 1 including the chuck table 3b. explain. In FIG. 7B, the configuration of the cutting device 1 other than the cutting means 6 is omitted.

(1) Adhesion process The adhesion process which adheres the dicing tape T to the single side | surface of the plate-shaped workpiece W is performed similarly to the case where the cutting device 1 provided with the chuck table 3a is used.

(2) Holding process In the holding process of holding the plate-like workpiece W adhered to the dicing tape T, as shown in FIGS. The adhered dicing tape T is placed on the chuck table 3b with the bottom surface Tb of the dicing tape facing downward. Further, when placing on the chuck table 3 b, the tape outer peripheral edge Te of the dicing tape Tb is inserted into the insertion groove 38 of the chuck table 3 b, and the tape outer peripheral edge Te is hooked on the insertion groove 38. Next, by driving the suction source 41, the holding step is completed as in the case of using the chuck table 3a.

(3) Cutting process The cutting process is the same as the case of using the cutting apparatus 1 including the chuck table 3a. As shown in FIG. 7B, the chuck table 3b has an insertion groove 38 for inserting the tape outer peripheral edge Te of the dicing tape T into the inclined peripheral portion of the tape suction surface 33 during the main cutting process. Thus, the tape outer peripheral edge Te is caught in the insertion groove 38, so that a portion that can be an entrance into which the cutting fluid ejected from the cutting fluid nozzle 64 enters the chuck table 3b covers the direction in which the cutting fluid is ejected. Thus, it is possible to more reliably prevent the dicing tape T from being bent.

1: Cutting device 2: Base 3: Chuck table 3a: Chuck table 3b: Chuck table 30: Holding surface 31: Bottom surface 32: Workpiece suction surface 33: Tape suction surface
34: Suction groove 35: Suction groove 36a: Suction tube 36b: Suction hole
37: Suction groove 38: Insertion groove 40: Rotating means 41: Suction source 5: Cutting feed means
50: Ball screw 51: Guide rail 52: Motor 53: Movable plate 54: Scale 6: Cutting means 60: Spindle 61: Housing 610: Imaging means 62: Cutting blade 620: Base 621: Cutting edge
63: Cutting fluid nozzle 64: Cutting fluid nozzle 630: Cutting fluid inlet 640: Cutting fluid inlet 65: Nut 7: Index feeding means
70: Ball screw 71: Guide rail 72: Motor 73: Movable plate 74: Scale 9: Cutting feed means
90: Ball screw 91: Guide rail 92: Motor 93: Movable plate W: Plate work
Wa: Plate workpiece upper surface Wb: Plate workpiece bottom S: Street T: Dicing tape
Ta: Adhesive surface Tb: Dicing tape bottom surface Tc: Adhesion area
Td: protruding portion Te: outer periphery of the tape

Claims (3)

A chuck table for sucking and holding a dicing tape to which one side of a rectangular plate-shaped workpiece is adhered, and a cutting means for cutting the plate-like work sucked and held by the chuck table via the dicing tape with a cutting blade; A cutting device provided,
The dicing tape includes a protruding portion where the protruding plate-shaped workpiece is not attached to the protruding plate-shaped workpiece,
The chuck table is tilted so as to descend toward the outer periphery of the chuck table, and a workpiece suction surface for sucking an area where the plate workpiece is adhered to the dicing tape, and the plate workpiece is adhered to the dicing tape. A tape suction surface for sucking the protruding portion that is not,
A cutting apparatus characterized in that the protruding portion is sucked by the tape suction surface to prevent the dicing tape from curling during cutting.   The cutting apparatus according to claim 1, wherein the chuck table includes an insertion groove for inserting an outer peripheral edge of the dicing tape at an inclined peripheral portion of the tape suction surface. A cutting method using the cutting device according to claim 1 or 2,
An attaching step of forming the protruding portion on one side of a rectangular plate-like workpiece and attaching the dicing tape;
A holding step of holding the plate-like workpiece adhered to the dicing tape by sucking the dicing tape to the workpiece suction surface and the tape suction surface of the chuck table;
A cutting step of cutting the plate-like workpiece held on the chuck table by the cutting means in the holding step;
A cutting method comprising:

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