JP6396183B2 - Thermal spray equipment - Google Patents

Description

  The present invention relates to a thermal spraying apparatus.

  The thermal spraying device applies a high voltage between two wires that are continuously sent in the direction crossing each other from the two tips provided on the thermal spray nozzle, and melts the wires by the generated arc discharge to generate droplets. The droplets are sprayed toward the target surface while being refined by an air flow. Thus, the droplets adhering to the target surface form a sprayed coating.

  For example, as shown in Patent Document 1, in this type of thermal spraying apparatus, the wire is guided from the wire reel so as to draw a gentle loop so that an extreme bending portion does not occur, and thermal spraying is performed. When being introduced into the nozzle, the two wires are guided so as to be parallel, and further, at the tip of the spray nozzle, the two wires are guided so as to approach each other.

  The directions of the tip portions of the two chips are set so that their axes intersect at one point (arc point) that is a predetermined distance away from the tip of each chip. Therefore, if the two wires delivered from each chip are oriented in a certain and accurate direction, the two wires come into contact at the arc point described above, and arc discharge and droplet generation are stabilized.

  However, in practice, the wires sent from each chip do not point in a precise and constant direction because the two wires are bent due to being wound around the wire reel. Sometimes. As a result, the tip of the wire irregularly shifts in the thickness direction and in-plane direction of the plane near the arc point with respect to the plane including the axis of the tip of the two tips described above, and the direction and amount of the shift is 2 The wires of the book will vary and may change over time. In such a case, the arc discharge and the formation of droplets become unstable, resulting in a decrease in spray quality.

JP 2009-263683 A

  The present invention has been conceived under the circumstances described above, and is a thermal spraying apparatus in which the tips of two wires delivered from two tips of a thermal spray nozzle can accurately face the arc point. The issue is to provide

  In order to solve the above problems, the present invention employs the following technical means.

Spray apparatus more is provided to the onset Ming, a first wire supply, a second wire supply source, a first wire fed out from said first wire supply source, the fed out from the second wire supply source Two wire, a thermal spray nozzle to which the first wire and the second wire are supplied, a first guide means for guiding the first wire fed from the first wire supply source to the thermal spray nozzle, and the second Second guide means for guiding the second wire fed from the wire supply source to the thermal spray nozzle, and the thermal spray nozzle sends the first wire from the tip toward the arc point; and A thermal spraying device including a second tip for feeding the second wire from the tip toward the arc point, wherein the first tip and the second tip can be viewed in parallel on the left and right. In a front view of the thermal spraying device, the bending direction of the bent portion formed in the first wire that is guided by the first guide means and reaches the tip of the first chip is the same direction, and is guided by the second guide means. And the bending direction of the bent portion formed in the second wire reaching the tip of the second chip is the same direction, and is the opposite direction to the bending direction of the bent portion formed in the first wire. Features.

  In a preferred embodiment, in the side view of the thermal spraying device, the bending direction of the bending portion formed in the first wire guided by the first guide means and reaching the tip of the first chip is the same direction. The bending direction of the bent portion formed in the second wire guided by the second guide means and reaching the tip of the second chip is the same direction, and the bending direction of the bent portion formed in the first wire is also the same direction. Is in the same direction.

In a preferred embodiment, in a front view of the spraying device and the upper Symbol first chip and the second chip are visible in parallel to the right and left, and the said first chip and said first wire source, the right and left opposite The second chip and the second wire supply source are located on the opposite sides.

  In a preferred embodiment, in the front view of the thermal spraying apparatus, the first wire is guided by the first guide means and reaches the tip of the first chip, and is guided by the second guide means. The second wire reaching the tip of the chip intersects once.

  In a preferred embodiment, the first wire supply source is a first wire reel for winding and holding the first wire, and the second wire supply source is a second wire for winding and holding the second wire. It is a wire reel, and these first wire reel and second wire reel are integrally mounted on a member that supports the thermal spray nozzle.

In a preferred embodiment, the thermal spraying apparatus is rotated entirely around the center line of the thermal spray nozzle .

Further, in another preferred embodiment, the first wire supply source, the first wire is wound around the lead straight axis, the first wire is fed unwinds from the outer periphery, a floor standing type, said second wire source, the second wire is wound around the lead straight axis, the second wire is extended unwinds from the outer periphery is a floor standing type.

  According to the thermal spraying apparatus having the above-described configuration, the bending direction of the bending portion generated in the wire in the wire feeding path from each wire supply means to the thermal spray nozzle through the guide means is generally the same direction. Therefore, arc discharge and droplet generation at the arc point are stabilized. As a result, the quality of the sprayed coating formed on the target surface is also stabilized.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the drawings.

It is a simplified front view of the thermal spraying device concerning a 1st embodiment. 1 is a schematic side view of a thermal spraying apparatus according to a first embodiment. It is a simplified front view of the thermal spraying device concerning a 2nd embodiment. It is a schematic side view of the thermal spraying device concerning a 2nd embodiment. It is a simplified front view of the thermal spraying device concerning a 3rd embodiment. It is a simplified front view of the thermal spraying device concerning a 4th embodiment.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 and 2 show a thermal spraying apparatus 10A according to the first embodiment of the present invention. First, the basic configuration of this thermal spraying apparatus 10A will be described.

  The thermal spraying apparatus 10A includes a first wire supply source 210, a second wire supply source 220, a first wire W1 fed out from the first wire supply source 210, and a second wire W2 fed out from the second wire supply source 220. The thermal spray nozzle 500, the first guide means 310 for guiding the first wire W1 fed from the first wire supply source 210 to the thermal spray nozzle 500, and the second wire W2 fed from the second wire supply source 220 are sprayed. Second guide means 320 for guiding to the nozzle 500. The thermal spray nozzle 500 includes a first tip 410 that sends the first wire W1 from the tip toward the arc point AP, and a second tip 420 that sends the second wire W2 from the tip toward the arc point AP.

  In the present embodiment, the first wire supply source 210 and the second wire supply source 220 each have a form of a first wire reel 210A and a second wire reel 220A around which wires are wound and support the thermal spray nozzle 500. Is integrally mounted on a supporting member (not shown). The present invention has a characteristic feature in the arrangement of the first wire supply source 210 and the second wire supply source 220, which will be described later.

  The first wire W1 and the second wire W2 are made of metal having a diameter of about 1.6 mm, for example, and the material thereof is, for example, iron.

  In the present embodiment, the first guide means 310 and the second guide means 320 use the cylindrical members 310A and 320A in which the wires W1 and W2 are inserted and bendable, respectively. 310A and 320A are generally called conduits. In the present invention, there is a characteristic end in the feeding path of the wires W1 and W2 to the thermal spray nozzle 500 by the first guide unit 310 and the second guide unit 320, which will be described later.

  The thermal spray nozzle 500 includes a cylindrical body portion 510 that extends in the vertical direction with an axis, and a first chip 410 and a second chip 420 that are disposed below the body portion 510. The first guide means 310 and the second guide means 320 penetrate through the upper wall portion 511 of the body portion 510 and are introduced into the internal space of the body portion 510 and reach the lower portion of the body portion 510 in parallel. Yes. The first tip 410 and the second tip 420 are supported on the bottom wall portion 512 of the body portion 510 while being insulated from each other. The lower ends of the first guide means 310 and the second guide means 320 The first chip 410 and the second chip 420 are connected to each other. An air nozzle portion 520 that communicates with the internal space of the body portion 510 and extends downward and is located on the back side of the first tip 410 and the second tip 420 is also provided below the thermal spray nozzle 500.

  Air is introduced into the internal space of the body portion 510 of the thermal spray nozzle 500 from the outside through an introduction port 530 provided in the upper wall portion 511, and this air is injected from a nozzle hole 521 provided in the air nozzle portion 520. .

  The first chip 410 and the second chip 420 have guide holes 411 and 421 having an inner diameter slightly larger than the outer diameter of each wire. The first chip 410 and the second chip 420 are formed of a conductive metal and are electrically connected to a power supply path (not shown), and the inner surfaces of the guide holes 411 and 421 are in contact with the wires, whereby the first wire W1. A voltage can be applied between the second wire W2.

  As clearly shown in FIG. 1, the first tip 410 and the second tip 420 are closer to each other as the axis lines L <b> 1 and L <b> 2 (the axis lines of the guide holes 411 and 421) move downward in the front view of the thermal spray nozzle 500. Facing. More specifically, the first chip 410 and the second chip 420 approach each other as their axis lines L1 and L2 move downward in a plane parallel to the paper surface of FIG. 1, and are referred to as a predetermined point (hereinafter referred to as an arc point AP). ) And their orientations are set to intersect.

  The direction of the nozzle hole 521 of the air nozzle portion 520 is set so that air is ejected from the back side of the first tip 410 and the second tip 420 toward the arc point AP. In addition, the structure for injecting air toward the arc point AP is not limited to the above-described structure, and it is only necessary to provide a nozzle that is connected to the air supply source and faces the arc point AP.

  In the present embodiment, interrupted portions 311 and 321 are formed in the first guide means 310 and the second guide means 320 in the upper part of the spray nozzle 500, and the first wire W1 and the second wire W2 are formed in the interrupted portions 311 and 321. Are fed toward the first chip 410 and the second chip 420, respectively. The feed rollers 351 and 352 are integrally supported by the spray nozzle 500 or a support member (not shown) on which the spray nozzle 500 is mounted.

  In the basic configuration described above, the first wire fed from the first wire supply source 210 (first wire reel 210A) and the second wire supply source 220 (second wire reel 220A) by the operation of the feed rollers 351 and 352. W1 and the second wire W2 are sent to the thermal spray nozzle 500 through the first guide means 310 and the second guide means 320 called conduits, and are fed from the tips of the first tip 410 and the second tip 420 at a predetermined feeding speed. A predetermined voltage is applied between them while being sent out. The first wire W1 and the second wire W2 thus sent contact at the arc point AP. At this time, arc discharge occurs due to the voltage described above, and droplets are continuously generated by the high heat generated thereby. The droplet is refined by the dynamic pressure of the air flow ejected by the nozzle hole 521 of the air nozzle portion 520 in the generated moment, and is made to fly toward the object to be sprayed.

  In this thermal spraying apparatus 10A, the feeding paths of the first wire W1 and the second wire W2 by the first guide means 310 and the second guide means 320 are set as follows.

  As shown in FIG. 1 showing a front view of the thermal spraying apparatus 10A, in the thermal spray nozzle 500, the first guide means 310 and the first chip 410 connected thereto, the second guide means 320 and the second guide means 320 are connected. The second tip 420 is arranged on the left and right sides of the center line L0 of the thermal spraying apparatus 10A, and the first guide means 310 and the second guide means 320 extend in the vertical direction in parallel. The first guide means 310 located on the left side with respect to the center line L0 is bent in the counterclockwise direction in the vicinity of the connection portion with the first chip 410 in the delivery direction of the first wire W1. Next, contrary to the first chip 410, the first wire reel 210A is arranged on the right side with respect to the center line L0. The area between the first wire reel 210A and the thermal spray nozzle 500 is the first. The one guide means 310 draws a loop exceeding one turn and reaches the thermal spray nozzle 500 while curving, but the bending direction and the curving direction of the loop are always counterclockwise with respect to the delivery direction of the first wire W1. Direction. That is, the bent portion in the feeding path of the first wire W1 up to the first tip 410 by the first guide means 310 is always in the counterclockwise direction with respect to the feeding direction of the first wire W1 in front view.

  Similarly, the second wire W2 by the second guide means 320 from the second wire reel 220A arranged on the left side with respect to the center line L0 to the second chip 420 located on the right side with respect to the center line L0. The feeding path is symmetrical to the feeding path of the first wire W1 described above with respect to the center line L0, and in the feeding path of the second wire W2 to the second tip 420 by the second guide means 320. The bent portion is always in the clockwise direction with respect to the feeding direction of the second wire W2 in front view. Thereby, the 1st guide means 310 and the 2nd guide means 320 have crossed once in front view.

  Further, as shown in FIG. 2, the feeding path of the first wire W1 by the first guide means 310 and the feeding path of the second wire W2 by the second guide means 320 always have a bent portion even in a side view. , And the same direction (counterclockwise in the right side view).

  As described above, the feeding path of the first wire W1 and the feeding path of the second wire W2 are such that the bending direction of the bent portion is always the same in both the front view and the side view. The bends of the wires leading up to the first chip 410 and the second chip 420 are always stabilized in the same direction. As a result, the first wire W1 sent out from the first chip 410 and the second wire W2 sent out from the second chip 420 are in a plane including the axes L1 and L2 of the tip portions of the two chips 410 and 420. On the other hand, in the vicinity of the arc point AP, there is no irregular displacement in the thickness direction of the plane and in the vertical direction in the plane, and the contact is made stably at the arc point AP, and the wire W1 is generated by the arc discharge and the heat generated thereby. , W2 is dissolved and the formation of droplets is stabilized. As a result, the quality of the sprayed coating formed on the target surface is also stabilized.

  For example, when a thermal spray coating is formed on a cylindrical inner surface such as a cylinder bore using the thermal spraying apparatus 10A, the thermal spraying apparatus 10A is installed in a fixed state, and the work is rotated and moved up and down. In a state in which the thermal spraying apparatus 10 is fixed, the entire thermal spraying apparatus 10A can be configured to rotate around a vertical line (center line L0) and to move up and down.

  3 and 4 show a thermal spraying apparatus 10B according to the second embodiment of the present invention. In these drawings, members or portions that are the same as or equivalent to 10A shown in FIGS. 1 and 2 are assigned the same reference numerals, and detailed descriptions thereof are omitted. In this thermal spraying apparatus 10B, the configuration of the thermal spray nozzle 500, the first tip 410 and the first wire supply source 210 sandwich the center line L0 only in the degree of curvature of the first guide means 310 and the second guide means 320. The second tip 420 and the second wire supply source 220 are located on the opposite side across the center line L0, and the first guide means 310 and the second guide are once in front view. The intersecting points are the same as the thermal spraying apparatus 10A according to the first embodiment.

  In this thermal spraying apparatus 10B, the first guide means 310 and the second guide means 320 reach the thermal spray nozzle 500 while drawing a substantially half-circular loop, but the feeding path of the first wire W1 and the feeding of the second wire W2. In the feeding path, the bending direction of the bent portion is always the same in both the front view and the side view. Therefore, the bending of the wires W1 and W2 leading to the first chip 410 and the second chip 420 is always performed. Stable to be in the same direction. As a result, the first wire W1 sent out from the first chip 410 and the second wire W2 sent out from the second chip 420 are in a plane including the axes L1 and L2 of the tip portions of the two chips 410 and 420. On the other hand, there is no irregular displacement in the thickness direction of the plane or in the vertical direction in the plane in the vicinity of the arc point AP, and the contact is made stably at the arc point AP, and the wire W1 is generated by the arc discharge and the heat generated thereby. , W2 is dissolved and the formation of droplets is stabilized. As a result, the quality of the sprayed coating formed on the target surface is also stabilized.

  FIG. 5 shows a thermal spraying apparatus 10C according to the third embodiment of the present invention. In this figure, the same or equivalent members or portions as those of the thermal spraying apparatus 10A according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The configuration of the thermal spray nozzle 500 of this thermal spray apparatus is the same as the configuration of the thermal spray nozzle 500 in the thermal spray apparatus according to the first and second embodiments. The first chip 410 and the first wire supply source 210 are located on the opposite side across the center line L0, and the second chip 420 and the second wire supply source 220 are located on the opposite side across the center line L0. And the bending direction of the bent portion in the feeding path of the first wire W1 by the first guide means 310 is the same direction, and the bending of the bent portion in the feeding path of the second wire W2 by the second guide means 320. The point that the directions are the same is also similar to the thermal spraying apparatuses 10A and 10B according to the first and second embodiments.

  In the present embodiment, the configurations of the first wire supply source 210 and the second wire supply source 220 and the configurations of the first guide means 310 and the second guide means 320 are the thermal spraying apparatuses according to the first and second embodiments. Different from 10A and 10B.

In the spraying apparatus 10C, a first wire supply source 210 and a second wire supply source 220, the wire is wound around the lead straight shaft, the wires W1, W2 which unraveling from the outer periphery is extended upward, A so-called floor wire type so-called pack wire is used.

  In this thermal spraying apparatus 10C, the first guide means 310 and the second guide means 320 are bare wires W1 and W2 by a plurality of rollers 310a to 310e and 320a to 320e until they reach the thermal spray nozzle 500. Is configured to form a feeding route. In this embodiment, the wires W1 and W2 draw a loop of one round in the feeding path. In FIG. 5, rollers denoted by reference numerals 310c and 320c are supported by swingable arms 313 and 323 while being biased downward by springs 312 and 322, respectively. This is to absorb a sudden change in the feeding speed of the wires W1 and W2 by the feeding rollers 351 and 352 by changing the loop size while maintaining the loop size within a predetermined range. Because.

  Also in this thermal spraying apparatus 10C, the feeding path of the first wire W1 from the first wire supply source 210 to the tip of the first tip 410 in the thermal spray nozzle 500 is such that the bending direction of the bent portion is the feeding direction of the wire W1. The feed path of the second wire W2 from the second wire supply source 220 to the tip of the second tip 420 in the thermal spray nozzle 500 is always constant in the counterclockwise direction. The bending direction is always constant in the clockwise direction. Therefore, the first wire W1 sent out from the first chip 410 and the second wire W2 sent out from the second chip 420 are in relation to the plane including the axes L1 and L2 of the tip portions of the two chips 410 and 420. In the vicinity of the arc point AP, the plane W does not move irregularly in the thickness direction of the plane or in the vertical direction in the plane, and the contact is made stably at the arc point AP. Formation of droplets formed by dissolving W2 is stabilized. As a result, the quality of the sprayed coating formed on the target surface is also stabilized.

  FIG. 6 shows a thermal spraying apparatus 10D according to the fourth embodiment of the present invention. In this figure, the same or equivalent members or parts as those of the thermal spraying apparatus 10A according to the first embodiment or the thermal spraying apparatus 10C according to the third embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The configuration of the thermal spray nozzle 500 of the thermal spray apparatus 10D is the same as the configuration of the thermal spray nozzle 500 in the thermal spray apparatus according to the first and second embodiments. The first chip 410 and the first wire supply source 210 are located on the opposite side across the center line L0, and the second chip 420 and the second wire supply source 220 are located on the opposite side across the center line L0. And the bending direction of the bent portion in the feeding path of the first wire W1 by the first guide means 310 is the same direction, and the bending of the bent portion in the feeding path of the second wire W2 by the second guide means 320. The point that the directions are the same is also similar to the thermal spraying apparatuses 10A and 10B according to the first and second embodiments.

Also in the structure of the spraying apparatus 10D, similarly to the spraying apparatus 10C according to the third embodiment, the first wire supply source 210 and a second wire supply source 220, the wire is wound around the lead direct axis, A floor installation type so-called pack wire is adopted in which the wires W1 and W2 unwound from the outer periphery are drawn upward.

  In this thermal spraying apparatus 10D, the first guide means 310 and the second guide means 320 guide the bare wires W1 and W2 by the rollers 310a and 320a, similarly to the thermal spraying apparatus 10C according to the third embodiment. However, the loop formed by the wires W1 and W2 has a substantially half circumference. The rollers 310a and 320a for supporting the wires W1 and W2 near the top of the loop are supported by swingable arms 313 and 323 while being urged upward by a spring 312. Can be absorbed by changing the size of the loop while maintaining the value in a predetermined range while the feed rollers 351 and 352 feed the wires W1 and W2.

  In the thermal spraying apparatus 10D, similarly to the above-described thermal spraying apparatus 10C according to the third embodiment, the first wire W1 is fed from the first wire supply source 210 to the tip of the first tip 410 in the thermal spray nozzle 500. The path is such that the bending direction of the bent portion is always constant in the counterclockwise direction with respect to the feeding direction of the wire W1, and the second wire W2 from the second wire supply source 220 to the tip of the second tip 420 in the thermal spray nozzle 500 is provided. In the feeding path, the bending direction of the bent portion is always constant in the clockwise direction with respect to the feeding direction of the wire W2. Therefore, the first wire W1 sent out from the first chip 410 and the second wire W2 sent out from the second chip 420 are in relation to the plane including the axes L1 and L2 of the tip portions of the two chips 410 and 420. In the vicinity of the arc point AP, the plane W does not move irregularly in the thickness direction of the plane or in the vertical direction in the plane, and the contact is made stably at the arc point AP. Formation of droplets formed by dissolving W2 is stabilized. As a result, the quality of the sprayed coating formed on the target surface is also stabilized.

  Of course, the scope of the present invention is not limited to the above-described embodiments, and all modifications within the scope of the matters described in the claims are all included in the scope of the invention.

W1 First wire W2 Second wire AP Arc point L0 Center line L1 Axis (of the first tip)
L2 axis (second chip)
10A Thermal spraying device (first embodiment)
10B Thermal spraying device (second embodiment)
10C Thermal Spraying Device (Third Embodiment)
210 1st wire supply source 210A 1st wire reel 220 2nd wire supply source 220A 2nd wire reel 310 1st guide means 311 Cut off part 310A Cylindrical member 320 2nd guide means 321 Cut off part 320A Cylindrical member 351 Feed roller (First)
352 Feeding roller (second)
410 1st chip 411 Guide hole (of 1st chip)
420 Second tip 421 Guide hole (of second tip)
500 Thermal spray nozzle 510 Body portion 511 Upper wall portion 512 Bottom wall portion 520 Air nozzle portion 520
521 Nozzle hole 530 introduction port

Claims (7)

A first wire source;
A second wire source;
A first wire fed from the first wire supply source;
A second wire fed from the second wire supply source;
A thermal spray nozzle supplied with the first wire and the second wire;
First guide means for guiding the first wire fed from the first wire supply source to the thermal spray nozzle;
Second guide means for guiding the second wire fed from the second wire supply source to the thermal spray nozzle;
With
The spray nozzle includes a first tip that sends the first wire from the tip toward the arc point, a second tip that sends the second wire from the tip toward the arc point, and
A thermal spraying device comprising:
In the front view of the thermal spraying device in which the first chip and the second chip can be viewed side by side in parallel, the first wire is guided by the first guide means and formed on the first wire reaching the tip of the first chip. The bending direction of the bending part is the same direction, the bending direction of the bending part formed in the second wire that is guided by the second guide means and reaches the tip of the second chip is the same direction, and The thermal spraying apparatus characterized by being in the direction opposite to the bending direction of the bending part formed in the 1st wire.   In the side view of the thermal spraying apparatus, the bending direction of the bent portion formed in the first wire guided by the first guide means and reaching the tip of the first tip is the same direction, and the second guide means The bending direction of the bent portion formed in the second wire that is guided and reaches the tip of the second chip is the same direction, and is the same direction as the bending direction of the bent portion formed in the first wire. The thermal spraying apparatus according to claim 1. In a front view of the spraying device and the upper Symbol first chip and the second chip are visible in parallel to the left and right, the a first chip and the first wire source, located on the left and right opposite side, said first The thermal spraying device according to claim 1, wherein the two chips and the second wire supply source are located on opposite sides.   In the front view of the thermal spraying apparatus, the first wire guided by the first guide means and reaching the tip of the first chip, and the second wire guided by the second guide means and reaching the tip of the second chip. The thermal spraying device according to any one of claims 1 to 3, wherein the two wires intersect once.   The first wire supply source is a first wire reel that winds and holds the first wire, and the second wire supply source is a second wire reel that winds and holds the second wire. The thermal spraying device according to any one of claims 1 to 4, wherein the first wire reel and the second wire reel are integrally mounted on a member that supports the thermal spray nozzle. The thermal spraying device according to claim 4 or 5, wherein the thermal spraying apparatus rotates as a whole around a center line of the thermal spray nozzle . The first wire supply source is a floor-mounted type in which the first wire is wound around a vertical axis, is unwound from the outer periphery, and the first wire is drawn upward, and the second wire supply source is The thermal spraying device according to any one of claims 1 to 4 , wherein the thermal spraying apparatus is of a floor installation type, wherein the second wire is wound around a vertical axis and unwound from the outer periphery, and the second wire is drawn upward.

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