JP6414599B2 - Inductor component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an inductor component in which an inductor is provided on an insulating layer and a method for manufacturing the same.

  Conventionally, an inductor component in which an inductor is formed inside an insulating layer is known. For example, as shown in FIG. 10, the inductor component 100 described in Patent Document 1 includes a multilayer substrate 101 in which an inductor 102 is built. Here, the multilayer substrate 101 is configured by a laminated body of a plurality of magnetic layers 101a. The inductor 102 includes in-plane conductors 103a to 103d formed on one main surface of a predetermined magnetic layer 101a and columnar conductors 104a to 104c that connect the in-plane conductors 103a to 103d between the layers. 101 is formed as one conductor inside 101. With such a configuration, the inductor 102 functions as an inductor element.

Japanese Patent Laying-Open No. 2005-183890 (see paragraph 0051, FIG. 5, etc.)

  When the inductor 102 is built in the multilayer substrate 101, the columnar conductors 104a to 104c are formed by forming via conductors or through-hole conductors for each magnetic layer 101a and stacking these conductors on top of each other. . According to such a method of forming the columnar conductors 104a to 104c, the connection area between adjacent conductors (via conductors or through-hole conductors) is reduced due to the stacking deviation of the magnetic layer 101a, so that the columnar conductors 104a to 104c as a whole. , And the resistance value of the inductor 102 increases. In addition, variations in stacking deviation cause variations in the resistance value of the inductor 102. In addition, in the structure of the inductor component 100 shown in FIG. 10, there is a concern that the coil characteristics are reduced (for example, the Q value is reduced) due to the parasitic capacitance generated between the columnar conductors 104a to 104c.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to improve the coil characteristics of an inductor and reduce variations in the characteristics of an inductor component in which an inductor is provided in an insulating layer.

In order to achieve the above object, an inductor component according to the present invention includes an insulating layer in which a plurality of gaps are formed so as to be accommodated therein, two metal pins erected in the insulating layer, and the two metals. An inductor having a connecting conductor that connects one end of each pin, and the plurality of gaps are between the two metal pins in a plan view and are a region where the two metal pins overlap in a side view It is characterized by being arranged in order of one said metal pin, a part of said space | gap, the said insulating layer, a different part of said space | gap, and the other said metal pin .

  The metal pins are formed by, for example, shearing a wire formed of a metal such as Cu, so that the specific resistance is lower than that of a via conductor formed by filling a via hole with a conductive paste. The variation is small. Therefore, it is possible to form an inductor having excellent coil characteristics (for example, high Q value) and small variations in characteristics.

In addition, in an inductor component using a high-frequency signal, it is known that the parasitic capacitance of the inductor causes a decrease in coil characteristics (for example, a decrease in Q value). In the case of an inductor having two metal pins erected on an insulating layer and a connection conductor that connects one end of both metal pins, it is necessary to reduce the parasitic capacitance between both metal pins, which increases the potential difference. Therefore, in the present invention, a gap is provided in a region between the metal pins in plan view and where the metal pins overlap in side view. In this way, by forming a region without an insulating material constituting the insulating layer between the metal pins, the parasitic capacitance generated between the two metal pins can be reduced, so that the coil characteristics of the inductor can be improved. it can. In addition, since the gap is formed so as to fit inside the insulating layer, the main surface of the insulating layer has no gap, so that the connection conductor can be easily formed on the main surface of the insulating layer.

  Further, the gap may be provided so as not to contact the connection conductor. If it does in this way, a connection conductor can be easily arranged in an insulating layer.

  Moreover, the said space | gap and the arrangement | positioning space of the said metal pin in the said insulating layer may be continuing. According to this configuration, since the gap due to the gap can be formed between the metal pin and the insulating layer, it is possible to reduce the damage to the insulating layer when stress is applied to the metal pin. Further, for example, when the insulating layer is molded with a mold, the void can be easily formed.

  Moreover, the said space | gap may be provided only in the said pin opposing area | region. In this way, the metal pin can be easily fixed at a desired position while reducing the parasitic capacitance generated between the metal pins.

In addition, the inductor component manufacturing method of the present invention is provided with two accommodation holes for accommodating the metal pins in an upright state on one main surface, and a plurality of gaps are formed so as to be accommodated therein. In addition, a preparation step for preparing the first insulating layer, a housing step for housing the metal pin in each of the housing holes, and one ends of the two metal pins located on one main surface side of the first insulating layer A connecting step of connecting the connecting conductor with a connecting conductor, and a laminating step of laminating a second insulating layer on one main surface of the first insulating layer so as to cover the connecting conductor. A plurality of gaps are located between the two accommodation holes in a plan view of the first insulating layer, and one of the metal pins, a part of the gaps, and the first in a region where the accommodation holes overlap in a side view . One insulating layer, a part of the different gaps, the other metal pin As arranged in, it is characterized by forming a plurality of voids.

  In this case, in the step of preparing the insulating layer, the housing hole for accommodating both metal pins and the gap are formed in advance, and both the metal pins are arranged in the housing hole to manufacture the inductor component. An inductor component that can reduce parasitic capacitance generated between pins can be easily manufactured. In addition, compared with the case where the metal pin portion is formed of a conventional via conductor, it is possible to manufacture an inductor component in which the connection resistance does not increase due to the stacking deviation and the variation in coil characteristics is small.

  In the preparation step, the gap may be formed so as to be continuous with one of the two accommodation holes. In this case, for example, when the insulating layer is molded with a mold, the accommodation hole and the gap can be easily formed.

  According to the present invention, a part of the inductor is formed of a metal pin having a low specific resistance and a small variation. Therefore, it is possible to form an inductor having excellent coil characteristics (for example, high Q value) and small variations in characteristics. Further, a gap is provided in a region between the metal pins in a plan view and where the metal pins overlap in a side view. In this way, a region without an insulating material that constitutes an insulating layer is formed between the metal pins, so that the parasitic capacitance generated between the two metal pins can be reduced.

It is a figure which shows the inductor components concerning 1st Embodiment of this invention. It is a figure for demonstrating the pin opposing area | region of FIG. It is a figure for demonstrating the formation method of a resin layer. It is a figure for demonstrating the manufacturing method of the inductor components of FIG. It is a figure which shows the modification of the space | gap of FIG. It is a figure which shows the inductor components concerning 2nd Embodiment of this invention. It is a figure which shows the inductor components concerning 3rd Embodiment of this invention. It is a figure which shows the inductor components concerning 4th Embodiment of this invention. It is a figure which shows the modification of the space | gap of FIG. It is sectional drawing of the conventional inductor components.

<First Embodiment>
An inductor component 1a according to a first embodiment of the present invention will be described with reference to FIGS. 1A is a cross-sectional view of the inductor component 1a, FIG. 1B is a plan view of the inductor component 1a, and FIG. 2 is a diagram for explaining the pin facing region R. Here, FIG. 1A is a cross-sectional view taken along the line AA of FIG. 1B, and FIG. 1B does not show the second resin layer 2b. FIG. 2 shows the metal pin 4 and the first resin layer 2a when the inductor component 1a is viewed in plan.

  The inductor component 1a according to this embodiment corresponds to the first resin layer 2a ("insulating layer" and "first insulating layer" of the present invention), as shown in FIGS. ), An inductor 3, and a second resin layer 2 b (corresponding to the “second insulating layer” of the present invention) laminated on the upper surface of the first resin layer 2 a, for example, an electronic device such as a mobile phone Installed in equipment.

  The first and second resin layers 2a and 2b are each formed of, for example, a magnetic substance-containing resin obtained by mixing an insulating thermosetting resin such as an epoxy resin and a magnetic filler such as ferrite powder.

  The inductor 3 includes two metal pins 4 erected in the first resin layer 2a, respectively, and a connection conductor 5 that connects the upper ends of the metal pins 4 (corresponding to “one end” of the present invention). Have. Each of the metal pins 4 has an upper end surface exposed at the upper surface of the first resin layer 2a and a lower end surface exposed at the lower surface of the first resin layer 2a. Moreover, in this embodiment, both the metal pins 4 are arrange | positioned substantially parallel in the 1st resin layer 2a. And each upper end surface of both metal pins 4 is used as a connection surface with the connection conductor 5, and each lower end surface is used as an external electrode for external connection.

  Here, the metal pin 4 is formed of a Cu alloy such as Cu or Cu—Ni alloy or a metal material such as Fe. Note that the metal pin 4 is formed in a columnar shape by shearing a wire formed of any of these metal materials.

  For example, the connection conductor 5 is formed in a predetermined pattern shape by screen printing or the like using a conductive paste containing a metal such as Cu or Ag. Here, the connection conductor 5 may have a two-layer structure in which a base electrode is formed from a conductive paste and a surface electrode is formed on the surface of the base electrode by, for example, Cu plating. In this way, a part of the connection conductor is formed of a plating film (surface electrode) having a specific resistance lower than that of the base electrode, so that the resistance value of the connection conductor can be lowered. The connection conductor 5 may be a metal plate formed in a predetermined pattern shape. In this case, both the metal pins 4 can be bonded by, for example, ultrasonic bonding.

  By the way, when a high frequency is used, as described above, it is known that the parasitic capacitance of the inductor 3 causes deterioration of coil characteristics (for example, reduction in Q value). In the case of the structure in which both the metal pins 4 are arranged substantially in parallel in the first resin layer 2a as in the inductor 3 of this embodiment, the potential difference between both the metal pins 4 becomes large. It is necessary to reduce the parasitic capacitance generated between the four. Therefore, in this embodiment, the gap 6a is provided between the metal pins 4 so that the parasitic capacitance generated between the metal pins 4 can be reduced.

  In this embodiment, a gap 6a is provided at the periphery of each of the metal pins 4, and a part of each of the gaps 6a is between both the metal pins 4 in a plan view, and both the metal pins 4 are in a side view. It is arranged in a region that overlaps the pin facing region R that is an overlapping region. This pin opposing area | region R is an area | region in the 1st resin layer 2a which overlaps with the area | region by which the point drawing of FIG. 2 was described by planar view. More specifically, when the direction of the arrow F shown in FIG. 2 is viewed from the side, a region where both the metal pins 4 overlap is set as the pin facing region R. Since the gap 6a is occupied by air having a lower dielectric constant than the resin of the first resin layer 2a, the parasitic capacitance generated between the two metal pins 4 can be obtained by disposing a part of the gap 6a in the pin facing region R. Can be reduced.

  The gap 6a will be described in detail. As shown in FIG. 1B, the first resin layer 2a is continuously provided with the space for arranging the metal pins 4 and the gap 6a. The cross-sectional shape when the arrangement space of the metal pin 4 and the gap 6a are combined is a shape in which a horizontally long rectangle (a portion where the gap 6a is formed) and a circle (placement space of the metal pin 4) are combined (see FIG. 1 (b) and FIG. 3 (b)), and a region obtained by removing the arrangement space of the metal pin 4 from the synthesized one becomes the gap 6a.

  Here, the diameter of the circle is formed to be larger than the length of the short side of the horizontally long rectangle, and this circle is arranged approximately in the middle in the longitudinal direction of the horizontally long rectangle. Further, the longitudinal directions of the horizontally long rectangles forming the gap 6 a are arranged so as to be substantially parallel to a straight line connecting both the metal pins 4. Accordingly, in each of the metal pins 4, the gap 6 a is arranged on both the pin facing region R side and the opposite side of the pin facing region R. Then, the connection conductor 5 is drawn from the metal pin 4 in a direction in which the gap 6a is not disposed (the lateral direction of the horizontally long rectangle), and connects one end of both the metal pins 4 to each other. In other words, each of the gaps 6 a is provided so as not to contact the connection conductor 5. Note that the gap 6 a may be provided only at the periphery of one metal pin 4.

(Manufacturing method of inductor component 1a)
Next, a method for manufacturing the inductor component 1a will be described with reference to FIGS. 3A is a cross-sectional view of the first resin layer 2a before the metal pin 4 is disposed, FIG. 3B is a cross-sectional view taken along the line BB in FIG. 3A, and FIG. ) To (c) respectively show the steps of the manufacturing method.

  First, as shown in FIG. 3, two accommodation holes 7 for accommodating the metal pin 4 in an upright state are provided on the upper surface (corresponding to “one main surface” of the present invention), and a gap is formed in the inside. First resin layer 2a provided with 6a is prepared (preparation step). At this time, it arrange | positions so that at least one part of each space | gap 6a may overlap with the pin opposing area | region R of the 1st resin layer 2a. In this embodiment, as described above, the accommodation hole 7 serving as a space for arranging the metal pins 4 and the gap 6a are formed continuously (integrated formation of the accommodation hole 7 and the gap 6a). Here, the cross-sectional shape when the accommodation hole 7 and the gap 6a are combined is formed in a shape that combines a horizontally long rectangle (the gap 6a portion) and a circle (a portion where the metal pin 4 is disposed).

  The accommodation hole 7 is formed so as to penetrate the first resin layer 2a in the thickness direction, but the gap 6a portion (horizontal cross section horizontally long rectangle) has a bottom on the lower surface side of the first resin layer 2a. The bottom is formed (see FIG. 3A). The first resin layer 2a can be formed by a molding technique using a mold, for example.

  Next, as shown in FIG. 4A, the metal pin 4 is accommodated (arranged) in each of the accommodation holes 7 (accommodating step).

  Next, as shown in FIG. 4B, the upper ends (upper end surfaces) of both metal pins 4, that is, one ends of the first resin layers 2 a of both metal pins 4 that are located on one main surface side are connected. Thus, the connection conductor 5 is formed on the upper surface of the first resin layer 2a (connection step). The connection conductor 5 can be formed with a two-layer structure of a base electrode and a surface electrode, for example. In this case, the base electrode is formed by screen printing using a conductive paste containing a metal such as Cu or Ag, and the surface electrode is formed by Cu plating or the like using the metal component on the surface of the base electrode as a plating nucleus. Can do.

  Next, as shown in FIG. 4C, the inductor component 1a is completed by laminating the second resin layer 2b on the upper surface of the first resin layer 2a so as to cover the connection conductor 5 (lamination process). ). In this case, after preparing the second resin layer 2b in a semi-cured (B stage) state, the second resin layer 2b is completely laminated after the second resin layer 2b is laminated on the first resin layer 2a. It is preferable to cure. In this way, it is possible to prevent the resin of the second resin layer 2b from entering the inside of the gap 6a. As another method for forming the gap 6a, for example, a mold release agent or a wax-like material is applied in advance to the peripheral surface of each metal pin 4, and then each metal pin 4 in this state is disposed on the resin layer. There is also a method in which the release agent or the wax-like material is vaporized by heat when the resin layer is cured. This method can also be applied to the void forming method of other embodiments described later.

  Therefore, according to the above-described embodiment, a part of the inductor 3 is formed by the metal pin 4. The metal pins 4 are formed by, for example, shearing a wire formed of a metal such as Cu, and therefore have a specific resistance compared to a via conductor formed by filling a via hole with a conductive paste. Low and its variation is small. Therefore, it is possible to form the inductor 3 having excellent coil characteristics (for example, a high Q value) and small variations in characteristics.

  In addition, since the gap 6a provided in the first resin layer 2a is disposed so that a part thereof overlaps the pin facing region R, the gap between the metal pins 4 is more dielectric than the first resin layer 2a. Low rate air can be placed. In this way, since the parasitic capacitance generated between the two metal pins 4 can be reduced, the coil characteristics (eg, Q value) of the inductor 3 can be improved.

  Further, since both the gaps 6a are provided so as not to contact the connection conductor 5, the connection conductor 5 can be easily arranged on the first resin layer 2a.

  Moreover, it forms so that the space | gap 6a and the arrangement | positioning space (accommodation hole 7) of the metal pin 4 in the 1st resin layer 2a may continue. In this way, a gap due to the gap 6a can be formed between the metal pin 4 and the first resin layer 2a. Therefore, when stress is applied to the metal pin 4, the first resin layer 2a is damaged. Can be reduced. In this embodiment, since the 1st resin layer 2a is magnetic body containing resin, it is more brittle than the thermosetting resin which does not contain a magnetic body filler. Therefore, providing a gap between the metal pin 4 and the first resin layer 2a in this way is effective in preventing damage to the first resin layer 2a.

  Further, according to the above-described method for manufacturing the inductor component 1a, the first resin layer 2a is prepared in the preparation step, the housing hole 7 for housing both metal pins 4 and the gap 6a are formed in advance. Since the inductor component 1a is manufactured by arranging the pins 4 in the receiving holes 7, the inductor component 1a that can reduce the parasitic capacitance generated between the two metal pins 4 can be easily manufactured. Further, compared to the case where the metal pin 4 portion is formed of a conventional via conductor, the inductor component 1a can be manufactured with no increase in connection resistance due to misalignment and small variation in coil characteristics.

  Moreover, since the space | gap 6a and the accommodation hole 7 are formed so that it may continue, when shape | molding the 1st resin layer 2a with a metal mold | die, the accommodation hole 7 and the space | gap 6a can be formed easily, for example. .

(Void deformation example)
Next, a modified example of the gap 6a will be described with reference to FIG. In the above-described embodiment, the case where both the gaps 6a are formed so as to reach the upper surface of the first resin layer 2a has been described. For example, as shown in FIG. It may be formed so as to fit inside one resin layer 2a. In this case, since the entire upper surface of the first resin layer 2a is made of resin, it is possible to prevent the resin from entering the gaps 6b when the second resin layer 2b is laminated. In this case, a liquid resin can be used when forming the second resin layer 2b. Further, since the entire upper surface of the first resin layer 2a is made of resin, the connection conductor 5 can be easily formed.

Second Embodiment
An inductor component 1b according to a second embodiment of the present invention will be described with reference to FIG. 6A is a cross-sectional view of the inductor component 1b, and FIG. 6B is a cross-sectional view taken along the line CC in FIG. 6A.

  The inductor component 1b according to this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIGS. 1 and 2 in that the shape of the gap 6c is different as shown in FIG. . Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

  In this case, the combined shape when the arrangement space (accommodating hole 7) of the metal pin 4 and the gap 6c are combined is formed into a truncated cone shape. In other words, the composite shape is formed in a tapered shape that tapers from the lower surface of the first resin layer 2a toward the upper surface. Even if it does in this way, the effect similar to the inductor component 1a of 1st Embodiment can be acquired.

<Third Embodiment>
An inductor component 1c according to a third embodiment of the present invention will be described with reference to FIG. 7A is a cross-sectional view of the inductor component 1c, and FIG. 7B is a plan view of the inductor component 1c. Here, FIG. 7A is a cross-sectional view taken along the line DD in FIG. 7B, and FIG. 7B does not show the second resin layer 2b.

  The inductor component 1c according to this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIGS. 1 and 2 in that the shape of the gap 6d is different as shown in FIG. . Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

  In this case, each of the gaps 6d is formed only on the pin facing region R side, and in the first embodiment, a part of the gap 6a formed on the opposite side of the pin facing region R is the first resin layer 2a. Filled with resin. Thus, by providing the gap 6d only on the pin facing region R side, the contact area between the peripheral side surface of the metal pin 4 and the resin of the first resin layer 2a can be increased. It is possible to easily fix both metal pins 4 to desired positions while reducing the generated parasitic capacitance.

<Fourth embodiment>
An inductor component 1d according to a fourth embodiment of the present invention will be described with reference to FIG. 8 (a) is a cross-sectional view of the inductor component 1d, FIG. 8 (b) plan view of the inductor component 1 d, FIG. 8 (c) Figure 8 E-E cross-sectional view along a line (a), FIG. 8 (d) is a diagram for explaining the pin facing region R. FIG. Here, in FIG. 8B, the second resin layer 2b is not shown. FIG. 8D is a diagram corresponding to FIG.

Inductor component 1d according to this embodiment is different from the inductor component 1 c of the third embodiment described with reference to FIG. 7, as shown in FIG. 8, the arrangement of the metal pin 4 may differ, connected That is, the conductor 5 is formed in an L shape in plan view and the shape of the gap 6e is different. Since other configurations are the same as those of the inductor component 1c of the third embodiment, the description thereof is omitted by giving the same reference numerals.

  The two metal pins 4 of the third embodiment are arranged along the longitudinal direction of the first resin layer 2a having a horizontally long rectangular shape in plan view. However, one of the metal pins 4 of this embodiment is a horizontally long rectangular shape in plan view. The first metal layer 4a is disposed at one of the four corners of the first resin layer 2a, and the other metal pin 4 is point-symmetric with the one metal pin 4 (the center of the first resin layer 2a is in plan view). (Center point). The upper ends of both metal pins 4 are connected by a connection conductor 5 having an L shape in plan view.

  Moreover, as shown in FIG. 8C, each of the cross-sectional shapes when the arrangement space of the metal pin 4 (accommodating hole 7) and the gap 6e are combined has a circle (accommodating hole 7) and a diameter of the circle. The shape is such that a semicircle of a circle having a larger diameter is synthesized. These circles are arranged so as to be concentric circles, and the large-diameter semicircle that forms the gap 6e is arranged on the pin facing region R (see FIG. 8D) side.

  Even if the gap 6e is configured in this manner, the same effect as that of the inductor component 1c of the third embodiment can be obtained.

(Void deformation example)
A modification of the gap 6e will be described with reference to FIG. Each of FIGS. 9A to 9C is a diagram illustrating a modification of the gap 6e, and corresponds to FIG. 8C. The shape of the gap 6e can be changed as appropriate. For example, as shown in FIG. 9A, in each of the metal pins 4, a plurality of gaps 6 f having a rectangular cross section may be arranged at a plurality of locations along the circumferential direction of the metal pins 4. In this case, since the contact area between the peripheral side surface of the metal pin 4 and the resin of the first resin layer 2a is increased as compared with the inductor component 1d of the fourth embodiment, the metal pin 4 is easily fixed at a desired position. can do.

  Further, as shown in FIG. 9B, the cross section of the gap 6g may be formed in a bowl shape. In this case, since the contact area between the peripheral side surface of the metal pin 4 and the resin of the first resin layer 2a further increases, the position of the metal pin 4 can be more reliably fixed. Further, as shown in FIG. 9 (c), the cross-section when the arrangement space (accommodating hole 7) of the metal pin 4 and the gap 6h are combined is a circle (placement space of the metal pin 4) and an ellipse (gap 6h) It may be formed into a shape that is synthesized with the above-mentioned formation portion.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, in each of the above-described embodiments, the arrangement space of the metal pin 4 (accommodating hole 7) and the gaps 6a to 6h are configured to be continuous, but may be discontinuous. If it does in this way, the position fixation of both metal pins 4 can be performed easily, reducing the parasitic capacitance between both metal pins.

  Moreover, although each above-described embodiment demonstrated the case where the inductor components 1a-1d were provided with the one inductor 3, you may comprise so that the several inductor 3 may be provided.

  Further, in each of the above-described embodiments, the case where the planar shape of the connection conductor 5 is a U-shape or an L-shape has been described, but various shapes such as a spiral shape (spiral shape) may be employed. Can do.

  Further, the present invention can be widely applied to various inductor components including a resin layer and an inductor provided in the resin layer.

1a to 1d Inductor component 2a First resin layer (insulating layer, first insulating layer)
2b Second resin layer (second insulating layer)
3 Inductor 4 Metal pin 5 Connection conductor 6a-6h Air gap 7 Housing hole (space for arranging metal pin)

Claims (6)

An insulating layer in which a plurality of voids are formed so as to fit inside,
An inductor having two metal pins erected in the insulating layer, and a connection conductor connecting one end of both metal pins;
The plurality of gaps are disposed between the two metal pins in a plan view and are arranged in a pin facing region where both the metal pins overlap in a side view, and the one metal pin, a part of the gaps, The inductor component , wherein the insulating layer, the different part of the gap, and the other metal pin are arranged in this order .   The inductor component according to claim 1, wherein the gap is provided so as not to contact the connection conductor. The gap and inductor component according to claim 1 or 2, and an arrangement space of the metal pins of the insulating layer is characterized in that continuous. The gap is, the inductor component according to any one of claims 1 to 3, characterized in that it is provided only on the pin facing region. A preparatory step for preparing a first insulating layer in which two housing holes for housing the metal pin in an upright state are provided on one of the main surfaces, and a plurality of voids are formed so as to be accommodated therein When,
A housing step of housing a metal pin in each of the housing holes;
A connecting step of connecting one ends of the metal pins located on the one main surface side of the first insulating layer with a connecting conductor;
A laminating step of laminating a second insulating layer on one main surface of the first insulating layer so as to cover the connection conductor;
In the preparation step, the plurality of gaps are between the two accommodation holes in a plan view of the first insulating layer, and one of the metal pins is partly disposed in a region where the both accommodation holes overlap in a side view. The plurality of gaps are formed so as to be arranged in the order of the gap, the first insulating layer, the different part of the gap, and the other metal pin. . 6. The method of manufacturing an inductor component according to claim 5 , wherein in the preparation step, the gap is formed so as to be continuous with one of the two accommodation holes.

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