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JP6414965B2 - Porous layer manufacturing method, interpenetrating layer manufacturing method, metal and resin bonding method - Google Patents
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JP6414965B2 - Porous layer manufacturing method, interpenetrating layer manufacturing method, metal and resin bonding method - Google Patents

Porous layer manufacturing method, interpenetrating layer manufacturing method, metal and resin bonding method Download PDF

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JP6414965B2
JP6414965B2 JP2014217323A JP2014217323A JP6414965B2 JP 6414965 B2 JP6414965 B2 JP 6414965B2 JP 2014217323 A JP2014217323 A JP 2014217323A JP 2014217323 A JP2014217323 A JP 2014217323A JP 6414965 B2 JP6414965 B2 JP 6414965B2
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眞 小橋
眞 小橋
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Nagoya University NUC
Tokai National Higher Education and Research System NUC
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Description

本発明は、多孔質層の作製方法、相互浸透層の作製方法、金属と樹脂との接合方法に関する。 The present invention relates to a method for manufacturing a multi-porous layer, a method for manufacturing a interpenetration layer, to a bonding method of a metal and a resin.

例えば自動車や航空機等の輸送機器を始めとする様々な分野で、優れた材料を適材適所に配置するマルチマテリアル化が進んでいる。特に炭素繊維強化樹脂複合材料(CFRP:carbon fiber reinforced plastic)を用いることで、著しい軽量化が可能となる。例えば自動車ではキャビン部分にCFRPが用いられたり、航空機ではジェットエンジンのファンブレード部分にCFRPが用いられたりする動きがあり、何れの場合も金属と樹脂との強固な接合が不可欠である。   For example, in various fields including transportation equipment such as automobiles and airplanes, multi-materialization is progressing in which excellent materials are arranged at appropriate places. In particular, by using a carbon fiber reinforced plastic (CFRP), a significant weight reduction can be achieved. For example, there is a movement in which CFRP is used for a cabin portion in an automobile and CFRP is used for a fan blade portion of a jet engine in an aircraft. In any case, a strong bond between a metal and a resin is indispensable.

金属と樹脂とを接合する方法として、金属の表面に開気孔型の多孔質層を付与し、樹脂を多孔質層の空隙部(気孔)に浸透させる方法がある。この方法では、植物が根付くように樹脂が空隙部に浸透して相互浸透層を形成し、金属と樹脂とが相互浸透層を介して接合する(例えば非特許文献1から3参照)。   As a method for joining a metal and a resin, there is a method in which an open pore type porous layer is provided on the surface of the metal and the resin is infiltrated into voids (pores) of the porous layer. In this method, the resin penetrates into the void portion so that the plant takes root, thereby forming an interpenetrating layer, and the metal and the resin are joined through the interpenetrating layer (see, for example, Non-Patent Documents 1 to 3).

Materials Letters 59 (2005)2178−2182Materials Letters 59 (2005) 2178−2182 Journal of Materials Processing Technology 212 (2012)1061−1069Journal of Materials Processing Technology 212 (2012) 1061-1069 一般社団法人軽金属学会 第124回春季大会 講演予稿集(平成25年4月18日発行)Proceedings of the 124th Spring Conference of the Japan Institute of Light Metals (April 18, 2013)

図18は、Al(アルミニウム)基板上に多孔質層を作製し、エポキシ樹脂を多孔質層の空隙部に浸透させて作製した試料について、軸方向(矢印D1、D2方向)への引張試験を行った結果を示している。相互浸透層の樹脂体積分率が70%の試料の接合強度はエポキシ樹脂の接合強度の50%程度であることが確認された。このとき、破断はエポキシ樹脂と相互浸透層との境界(エポキシ樹脂の相互浸透層への浸入部)で発生しており、相互浸透層側の破断面(観察位置A)ではAlとエポキシ樹脂が観察され、エポキシ樹脂が浸入する側の破断面(観察位置B)ではAlは観察されずにエポキシ樹脂のみが観察された。破断状態を模式的に示すと、図19に示すようになる。エポキシ樹脂と相互浸透層との破断面において、エポキシ樹脂がAlに接していた部分では剥離が発生し、エポキシ樹脂が相互浸透層に浸入していた部分では破断が発生していたことが確認された。   FIG. 18 shows a tensile test in the axial direction (arrows D1 and D2 directions) of a sample prepared by preparing a porous layer on an Al (aluminum) substrate and infiltrating an epoxy resin into the void of the porous layer. The results are shown. It was confirmed that the bonding strength of the sample having a resin volume fraction of 70% of the interpenetrating layer was about 50% of the bonding strength of the epoxy resin. At this time, the rupture occurred at the boundary between the epoxy resin and the interpenetrating layer (the intrusion portion of the epoxy resin into the interpenetrating layer), and Al and the epoxy resin are on the fracture surface (observation position A) on the interpenetrating layer side. As observed, Al was not observed on the fracture surface (observation position B) on the side where the epoxy resin entered, and only the epoxy resin was observed. When the fracture state is schematically shown, it is as shown in FIG. In the fracture surface of the epoxy resin and the interpenetrating layer, it was confirmed that peeling occurred at the portion where the epoxy resin was in contact with Al, and fracture occurred at the portion where the epoxy resin entered the interpenetrating layer. It was.

図20は、試料をX線CTで撮像し、三次元モデルを作成し、有限要素解析(FEM:Finite Element Method)により試料内部に発生する応力分布を計算した結果を示している。計算結果において濃淡が最も濃い部分(模式図において矢印Pで示すハッチング部分)、即ち、エポキシ樹脂と相互浸透層との境界付近で高い応力が発生することが確認された。これら図18から図20により、エポキシ樹脂内部において相互浸透層との境界に近い部分で局所的に高い応力が発生し、その部分が破断の起点となっていること確認された。   FIG. 20 shows the result of imaging a sample with X-ray CT, creating a three-dimensional model, and calculating the stress distribution generated inside the sample by finite element analysis (FEM). In the calculation results, it was confirmed that high stress was generated near the darkest portion (hatched portion indicated by arrow P in the schematic diagram), that is, near the boundary between the epoxy resin and the interpenetrating layer. From these FIG. 18 to FIG. 20, it was confirmed that high stress was locally generated in a portion near the boundary with the interpenetrating layer inside the epoxy resin, and that portion was the starting point of fracture.

ところで、接合強度は高ければ高いほど品質向上に繋がることが明らかであり、接合強度を高めることが要望されている。
本発明は、上記した事情に鑑みてなされたものであり、その目的は、樹脂との間で高い接合強度を実現し得る相互浸透層を形成可能な多孔質層の作製方法、相互浸透層の作製方法、金属と樹脂との接合方法を提供することにある。
By the way, it is clear that the higher the joint strength, the higher the quality, and there is a demand for increasing the joint strength.
The present invention has been made in view of the above, the object is achieved by a method for manufacturing a multi-porous layer high bonding strength capable of forming an interpenetration layer may be implemented between resin interpenetration layer It is in providing the manufacturing method of this, and the joining method of a metal and resin.

本開示の多孔質層は、金属と樹脂との間に介在され、前記樹脂が浸透可能な空隙部を有する多孔質層であって、金属に接する側の気孔率が相対的に低く、樹脂が浸入する側の気孔率が相対的に高く構成されていることを特徴とする。
請求項に記載した多孔質層の作製方法は、金属粉末とスペーサー粉末とを含む原料粉末を、前記スペーサー粉末が圧壊又は分解しない圧力及び温度の条件下で加圧及び加熱して前記金属粉末を焼結させ、その後に前記スペーサー粉末を除去して空隙部を形成する方法により、金属に接する側の気孔率が相対的に低く、樹脂が浸入する側の気孔率が相対的に高くなるように多孔質層を作製することを特徴とする。
The porous layer of the present disclosure is a porous layer that is interposed between a metal and a resin and has a void that allows the resin to permeate, and has a relatively low porosity on the side in contact with the metal. It is characterized by having a relatively high porosity on the intrusion side.
The method for producing a porous layer according to claim 1 , wherein the raw material powder containing a metal powder and a spacer powder is pressurized and heated under conditions of pressure and temperature at which the spacer powder is not crushed or decomposed. , And thereafter the spacer powder is removed to form a void, so that the porosity on the side in contact with the metal is relatively low and the porosity on the side in which the resin enters is relatively high A porous layer is prepared.

樹脂が多孔質層の空隙部(気孔)に浸透して相互浸透層が形成され、金属と樹脂とが相互浸透層を介して接合される構造では、[発明が解決しようとする課題]で記載したように、樹脂内部において相互浸透層との境界に近い部分が破断の起点となることが確認されている。この点に関し、本開示の多孔質層によれば、金属に接する側では気孔率が相対的に低く、樹脂が浸入する側では気孔率が相対的に高く構成されているので、金属上に作製された多孔質層の空隙部に樹脂が浸透すると、金属に接している側では樹脂体積分率が相対的に低くなり、樹脂が浸入している側では樹脂体積分率が相対的に高くなる。即ち、樹脂と相互浸透層との境界において、樹脂が金属に接している面の境界面全体に対する樹脂面積比(接触面積比)が相対的に小さくなり、逆に樹脂が相互浸透層に浸入している面の境界面全体に対する樹脂面積比(浸入面積比)が相対的に大きくなり、境界で相互浸透層へと浸入している樹脂の量が多くなる。図19に示した樹脂と相互浸透層との破断は、樹脂内部において相互浸透層との境界に近い部分で発生するので、このように樹脂と相互浸透層との境界で樹脂が相互浸透層に浸入する面の樹脂面積比が相対的に大きくなることで、樹脂内部に発生する応力が低下する。その結果、樹脂と相互浸透層との境界で破断が発生し難くなり、樹脂と相互浸透層との間の接合強度を高めることができる。 In the structure in which the resin penetrates into the voids (pores) of the porous layer to form an interpenetrating layer, and the metal and the resin are joined through the interpenetrating layer, the description is given in [Problems to be solved by the invention] As described above, it has been confirmed that the portion close to the boundary with the interpenetrating layer inside the resin is the starting point of the fracture. In this regard, according to the porous layer of the present disclosure, the porosity is relatively low on the side in contact with the metal, and the porosity is relatively high on the side into which the resin enters, so that it is fabricated on the metal. When the resin penetrates into the voids of the porous layer, the resin volume fraction is relatively low on the side in contact with the metal, and the resin volume fraction is relatively high on the side in which the resin is infiltrated. . That is, at the boundary between the resin and the interpenetrating layer, the resin area ratio (contact area ratio) relative to the entire boundary surface of the surface where the resin is in contact with the metal is relatively small, and conversely, the resin enters the interpenetrating layer. The resin area ratio (penetration area ratio) with respect to the entire boundary surface of the existing surface becomes relatively large, and the amount of the resin that has entered the interpenetrating layer at the boundary increases. Since the breakage between the resin and the interpenetrating layer shown in FIG. 19 occurs near the boundary between the resin and the interpenetrating layer inside the resin, the resin becomes an interpenetrating layer at the boundary between the resin and the interpenetrating layer in this way. Since the resin area ratio of the surface to be infiltrated becomes relatively large, the stress generated in the resin is reduced. As a result, breakage hardly occurs at the boundary between the resin and the interpenetrating layer, and the bonding strength between the resin and the interpenetrating layer can be increased.

請求項に記載した多孔質層の作製方法によれば、本開示の多孔質層と同様に、樹脂と相互浸透層との境界において、樹脂が金属に接している面の境界面全体に対する樹脂面積比である接触面積比が相対的に小さくなり、逆に樹脂が相互浸透層に浸入している面の境界面全体に対する樹脂面積比である浸入面積比が相対的に大きくなり、境界で相互浸透層へと浸入している樹脂の量が多くなる。その結果、樹脂と相互浸透層との境界で破断が発生し難くなり、樹脂と相互浸透層との間の接合強度を高めることができる。
According to the method for producing a porous layer according to claim 1 , as with the porous layer of the present disclosure , the resin with respect to the entire boundary surface of the surface where the resin is in contact with the metal at the boundary between the resin and the interpenetrating layer. The contact area ratio, which is the area ratio, becomes relatively small, and conversely, the infiltration area ratio, which is the resin area ratio with respect to the entire boundary surface of the surface where the resin intrudes into the interpenetrating layer, becomes relatively large and The amount of resin that penetrates into the permeation layer increases. As a result, breakage hardly occurs at the boundary between the resin and the interpenetrating layer, and the bonding strength between the resin and the interpenetrating layer can be increased.

本発明の一実施形態を示し、多孔質層単体を作製する態様を示す図The figure which shows one Embodiment of this invention and shows the aspect which produces the porous layer single-piece | unit Ti基板と多孔質層との接合体を作製する態様を示す図The figure which shows the aspect which produces the conjugate | zygote of Ti substrate and a porous layer 試料を作製する手順を示す図Diagram showing the procedure for preparing a sample 試料が作製されるまでの遷移を示す図Diagram showing the transition to sample preparation Ti粉末の焼結の態様を示す図The figure which shows the aspect of sintering of Ti powder Ti粉末、Al粉末、NaCl粉末のSEM画像を示す図The figure which shows the SEM image of Ti powder, Al powder, NaCl powder 試料の外観画像及び断面のSEM画像を示す図The figure which shows the external appearance image of a sample, and the SEM image of a cross section モデルを示す図Diagram showing model (a)はモデルを示す図、(b)は計算結果を示す図、(c)は模式図(A) is a diagram showing a model, (b) is a diagram showing a calculation result, and (c) is a schematic diagram. (a)はモデルを示す図、(b)は計算結果を示す図、(c)は模式図(A) is a diagram showing a model, (b) is a diagram showing a calculation result, and (c) is a schematic diagram. (a)はモデルを示す図、(b)は計算結果を示す図、(c)は模式図(A) is a diagram showing a model, (b) is a diagram showing a calculation result, and (c) is a schematic diagram. (a)はモデルを示す図、(b)は計算結果を示す図、(c)は模式図(A) is a diagram showing a model, (b) is a diagram showing a calculation result, and (c) is a schematic diagram. (a)は全体のX線CT画像を示す図、(b)はAlのみ抽出したイメージを示す図、(c)はエポキシ樹脂のみ抽出したイメージを示す図(A) is a figure which shows the whole X-ray CT image, (b) is a figure which shows the image which extracted only Al, (c) is a figure which shows the image which extracted only the epoxy resin 傾斜体積分率のモデルについて、水平断面のAlの分布とエポキシ樹脂の分布を示す図Diagram showing the distribution of Al and epoxy resin in the horizontal section for the slope volume fraction model 一定体積分率のモデルについて、(a)は全体のX線CT画像を示す図、(b)及び(c)は垂直断面のAl部分の応力分布を示す図(A) shows the entire X-ray CT image of the constant volume fraction model, and (b) and (c) show the stress distribution in the Al portion of the vertical section. 傾斜体積分率のモデルについて、(a)は全体のX線CT画像を示す図、(b)及び(c)は垂直断面のAl部分の応力分布を示す図垂直断面の応力分布を示す図(A) is a diagram showing an entire X-ray CT image, and (b) and (c) are diagrams showing a stress distribution in an Al portion of a vertical section, showing a stress distribution in a vertical section. 傾斜体積分率の試料が作製されるまでの遷移を示す図Diagram showing the transition until a sample with an inclined volume fraction is made 破断面を示すSEM画像SEM image showing fracture surface 破断状態を模式的に示す図Diagram showing the broken state 試料内部に発生する応力分布を示す図Diagram showing the stress distribution generated inside the sample

以下、本発明の一実施形態について図面を参照して説明する。最初に多孔質層を作製する方法について説明する。本実施形態では、金属として軽量化に優れた特性を持つTiを用い、Tiを焼結させるための補助剤としてTiよりも融点が低いAlを用い、スペーサー粉末としてAlよりも融点が高いNaCl粉末を用いて多孔質層を作製する場合を説明する。Tiの融点は約1668℃であり、Alの融点は約660℃であり、NaClの融点は約800℃である。又、NaClは静水に溶解する特性を持つ。多孔質層を作製する場合としては、多孔質層のみを作製する(多孔質層単体を作製する)場合と、Ti基板上(金属の表面上)に多孔質層を作製する(Ti基板と多孔質層との接合体を作製する)場合とがある。以下、多孔質層単体及び接合体を試料と総称する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, a method for producing a porous layer will be described. In this embodiment, Ti having excellent characteristics for weight reduction is used as a metal, Al having a melting point lower than that of Ti is used as an auxiliary for sintering Ti, and NaCl powder having a melting point higher than that of Al is used as a spacer powder. The case where a porous layer is produced using will be described. The melting point of Ti is about 1668 ° C., the melting point of Al is about 660 ° C., and the melting point of NaCl is about 800 ° C. NaCl has the property of dissolving in still water. The porous layer is produced by producing only the porous layer (producing a porous layer alone) or producing the porous layer on the Ti substrate (on the metal surface) (Ti substrate and porous). In some cases, a joined body with a porous layer is produced. Hereinafter, the porous layer alone and the joined body are collectively referred to as a sample.

本実施形態では、原料粉末(Ti粉末とAl粉末とNaCl粉末との混合粉末)を加圧及び加熱する手段として、図1及び図2に示す装置1を用いる。装置1は、円筒状の型(黒鉛型)2と、上側部材3と、下側部材4とが組み合わされており、上側部材3及び下側部材4が型2の中空部2aを軸方向に移動可能となっている。装置1を用いて以下の条件及び図3に示す手順により、原料粉末から試料を作製する。   In this embodiment, the apparatus 1 shown in FIG.1 and FIG.2 is used as a means to pressurize and heat raw material powder (mixed powder of Ti powder, Al powder, and NaCl powder). The apparatus 1 includes a cylindrical mold (graphite mold) 2, an upper member 3, and a lower member 4, and the upper member 3 and the lower member 4 extend the hollow portion 2 a of the mold 2 in the axial direction. It is movable. A sample is produced from the raw material powder using the apparatus 1 under the following conditions and the procedure shown in FIG.

・Ti粉末の粒径:<45μm,<150μm
・Al粉末の粒径:<45μm
・NaCl粉末の粒径:330−430μm
・Ti粉末とAl粉末との原子組成比:Ti−0,20,50at%Al
・NaCl粉末の体積分率(原料粉末全体に対するNaCl粉末の割合):0−70vol%
・圧力:1.8MPa,10MPa
・昇温速度:1℃/sec
・設定温度:500−650℃
・保持時間(設定温度で保持する時間):0h,1h
尚、設定温度は、型2において原料粉末を充填する箇所付近に熱電対を設けて測定する。
-Particle size of Ti powder: <45 μm, <150 μm
-Particle size of Al powder: <45 μm
-Particle size of NaCl powder: 330-430 μm
-Atomic composition ratio of Ti powder and Al powder: Ti-0, 20, 50 at% Al
-Volume fraction of NaCl powder (ratio of NaCl powder to the whole raw material powder): 0-70 vol%
・ Pressure: 1.8MPa, 10MPa
・ Raising rate: 1 ℃ / sec
・ Set temperature: 500-650 ° C
-Holding time (holding time at set temperature): 0h, 1h
The set temperature is measured by providing a thermocouple in the vicinity of the portion where the raw material powder is filled in the mold 2.

手順1:Ti粉末とAl粉末とを所定の原子組成比で混合し、そのTi−Al混合粉末にNaCl粉末を所定の体積分率で添加し、原料粉末を作製する。
手順2:多孔質層単体を作製する場合であれば、下側部材4を型2に装着した状態で、原料粉末を型2の中空部2aに充填する。接合体を作製する場合であれば、最初にTi基板を型2の中空部2aに充填し、続いて原料粉末を型2の中空部2aに充填する。尚、Ti基板のサイズは、例えば直径20mm、高さ5mmである。
Procedure 1: Ti powder and Al powder are mixed at a predetermined atomic composition ratio, and NaCl powder is added to the Ti-Al mixed powder at a predetermined volume fraction to produce a raw material powder.
Procedure 2: In the case of producing a single porous layer, the raw material powder is filled in the hollow portion 2 a of the mold 2 with the lower member 4 mounted on the mold 2. In the case of producing a joined body, first, the Ti substrate is filled in the hollow portion 2a of the mold 2, and then the raw material powder is filled in the hollow portion 2a of the mold 2. The size of the Ti substrate is, for example, 20 mm in diameter and 5 mm in height.

手順3:上方から上側部材3を型2に装着し、所定の圧力で加圧し、所定の昇温速度で所定の設定温度まで加熱する。このとき、設定温度(500−650℃)をAlの融点(約660℃)に近い温度まで加熱するので、図4及び図5に示すように、Al粉末がTi粉末同士の隙間に拡散し、その拡散したAl粉末とTi粉末との間で以下の反応が進む。   Procedure 3: The upper member 3 is mounted on the mold 2 from above, pressurized at a predetermined pressure, and heated to a predetermined set temperature at a predetermined temperature increase rate. At this time, since the set temperature (500-650 ° C.) is heated to a temperature close to the melting point of Al (about 660 ° C.), as shown in FIGS. 4 and 5, the Al powder diffuses into the gap between the Ti powders, The following reaction proceeds between the diffused Al powder and Ti powder.

Ti(S)+3Al(S)→TiAl(S)
このようにして生成されたTiAl(化合物)は、Ti粉末同士を結合させるバインダーとして機能する。即ち、Al粉末を添加していることで、TiAlが生成され、その生成されたTiAlがTi粉末同士を結合させることで、空隙部(気孔)が形成される。尚、このとき、設定温度によっては拡散しないAl粉末が残留している場合もあり得る。又、設定温度をNaCl粉末の融点(約800℃)よりも十分に低い温度に抑えているので、Ti粉末同士の結合が進んでいる最中にNaCl粉末が分解することはない。即ち、Ti粉末同士のTiAlを介した結合によるTi粉末の焼結により空隙部が形成され、且つNaCl粉末が散在されている(原形を留めている)Ti−Al合金が作製される。
Ti (S) + 3Al (S) → TiAl 3 (S)
The TiAl 3 (compound) thus produced functions as a binder for bonding Ti powders together. That is, by adding Al powder, TiAl 3 is generated, and the generated TiAl 3 bonds the Ti powder to form voids (pores). At this time, Al powder that does not diffuse may remain depending on the set temperature. Further, since the set temperature is suppressed to a temperature sufficiently lower than the melting point (about 800 ° C.) of the NaCl powder, the NaCl powder is not decomposed while the bonding between the Ti powders proceeds. That is, a Ti-Al alloy in which voids are formed by sintering of Ti powder by bonding of Ti powders via TiAl 3 and NaCl powder is dispersed (preserving the original shape) is produced.

手順4:設定温度で所定の保持時間だけ保持する。
手順5:Ti−Al合金を常温まで冷却した後に型2から離型し、静水が注入されている容器(ビーカー)5内に放置し、Ti−Al合金を静水で水洗する。このとき、NaCl粉末が静水に溶解して除去されるので、図4に示すように、NaCl粉末が散在していた箇所にも空隙部(気孔)が形成される。
手順6:NaCl粉末が除去されたTi−Al合金を容器5から取り出す。
このような手順1から6を行うことで、Ti粉末の焼結による空隙部と、NaCl粉末の除去による空隙部とが形成された試料を作製することができる。
Procedure 4: Hold for a predetermined holding time at the set temperature.
Procedure 5: After cooling the Ti—Al alloy to room temperature, it is released from the mold 2 and left in a container (beaker) 5 into which still water is poured, and the Ti—Al alloy is washed with still water. At this time, since the NaCl powder is dissolved and removed in the still water, voids (pores) are also formed at locations where the NaCl powder was scattered, as shown in FIG.
Procedure 6: Take out the Ti—Al alloy from which the NaCl powder has been removed from the container 5.
By performing such procedures 1 to 6, it is possible to produce a sample in which voids formed by sintering of Ti powder and voids formed by removing NaCl powder are formed.

図6は、原料を示し、(a)は粒径<45μmのTi粉末、(b)は粒径<45μmのAl粉末、(c)は粒径330−430μmのNaCl粉末のSEM(Scanning Electron Microscope)画像を示す。
図7は、Ti粉末の粒径:<45μm、Al粉末の粒径:<45μm、NaCl粉末の粒径:330−430μm、Ti粉末とAl粉末との原子組成比:Ti−50at%Al、NaCl粉末の体積分率:70vol%、圧力:1.8MPa、昇温速度:1℃/sec、設定温度:600℃、保持時間:0hを条件とし、手順1から6を行うことで作製した試料を示し、(a)は外観を撮像した外観画像、(b)は断面(垂直断面)の組織を撮像したSEM画像を示す。上記した条件で作製した試料では、断面のEDX(Energy Dispersive X-ray Spectroscopy)分析により、TiAlが生成されていることが確認された。図7(b)において丸数字「1」の部分がNaCl粉末の除去による形成された空隙部である。即ち、添加したNaCl粉末の粒径が数100μm程度であるので、NaCl粉末の除去により数100μm程度の空隙部が形成されていることが確認された。図7(c)において丸数字「2」の部分がTi粉末の焼結により形成された空隙部である。NaCl粉末の除去により形成される空隙部ほどのサイズではないが、Ti粉末の焼結により数〜数10μm程度の空隙部が形成されていることが確認された。このようにTi粉末よりも融点が低いAl粉末を添加することで、高い気孔率と十分な焼結性とを両立することが可能となる。尚、気孔率は、外部と連通する空隙部の容積と内部に封入されている空隙部の容積との和を、全容積(見かけ上の容積)で除した値であり、試料の質量と容積を用いて計算している。
FIG. 6 shows raw materials, (a) Ti powder with particle size <45 μm, (b) Al powder with particle size <45 μm, (c) SEM (Scanning Electron Microscope) with NaCl powder with particle size 330-430 μm. ) Show the image.
FIG. 7 shows the particle size of Ti powder: <45 μm, the particle size of Al powder: <45 μm, the particle size of NaCl powder: 330-430 μm, the atomic composition ratio of Ti powder to Al powder: Ti-50 at% Al, NaCl A sample prepared by performing steps 1 to 6 under the conditions of powder volume fraction: 70 vol%, pressure: 1.8 MPa, temperature rising rate: 1 ° C./sec, set temperature: 600 ° C., holding time: 0 h (A) shows the appearance image which imaged the external appearance, (b) shows the SEM image which imaged the structure | tissue of the cross section (vertical cross section). In the sample manufactured under the above conditions, it was confirmed that TiAl 3 was generated by EDX (Energy Dispersive X-ray Spectroscopy) analysis of the cross section. In FIG. 7B, the circled number “1” is a void formed by removing NaCl powder. That is, since the added NaCl powder has a particle size of about several hundred μm, it was confirmed that a void of about several hundred μm was formed by removing the NaCl powder. In FIG. 7C, the circled number “2” is a void formed by sintering of Ti powder. Although not as large as the gap formed by removing the NaCl powder, it was confirmed that a gap of several to several tens of μm was formed by sintering the Ti powder. Thus, by adding Al powder having a lower melting point than Ti powder, it is possible to achieve both high porosity and sufficient sinterability. The porosity is a value obtained by dividing the sum of the volume of the void portion communicating with the outside and the volume of the void portion enclosed inside by the total volume (apparent volume), and the mass and volume of the sample. It is calculated using

次に、上記した手順により作製した多孔質層の空隙部に樹脂を浸透させて相互浸透層を作製し、金属と樹脂とを相互浸透層を介して接合する構造における接合強度について考察する。金属と樹脂とを相互浸透層を介して接合する構造では、[発明が解決しようとする課題]で記載したように、樹脂内部において相互浸透層との境界に近い部分が破断の起点となることが確認されている。この点に関し、図8に示すように相互浸透層の構造を単純化した3タイプのモデルを作成し、相互浸透層の構造が樹脂内部の応力に及ぼす影響を有限要素解析により計算した。図8(a)に示す一定体積分率のモデルは、相互浸透層の樹脂体積分率が、金属に接する側から樹脂が浸入する側に向かって一定の(変化しない)モデルである。図8(b)に示す傾斜体積分率のモデルは、相互浸透層の樹脂体積分率が、金属に接する側から樹脂が浸入する側に向かって線形的に増加するモデルである。図8(c)に示す逆傾斜体積分率のモデルは、相互浸透層の樹脂体積分率が、金属に接する側から樹脂が浸入する側に向かって線形的に低下するモデルである。   Next, the bonding strength in a structure in which a resin is infiltrated into the void portion of the porous layer produced by the above-described procedure to produce an interpenetrating layer and the metal and the resin are joined through the interpenetrating layer will be considered. In a structure in which a metal and a resin are joined via an interpenetrating layer, as described in [Problems to be Solved by the Invention], a portion close to the boundary with the interpenetrating layer inside the resin is the starting point of fracture. Has been confirmed. In this regard, as shown in FIG. 8, three types of models in which the structure of the interpenetrating layer was simplified were created, and the influence of the structure of the interpenetrating layer on the stress inside the resin was calculated by finite element analysis. The model of the constant volume fraction shown in FIG. 8A is a model in which the resin volume fraction of the interpenetrating layer is constant (does not change) from the side in contact with the metal toward the side in which the resin enters. The slope volume fraction model shown in FIG. 8B is a model in which the resin volume fraction of the interpenetrating layer increases linearly from the side in contact with the metal toward the side into which the resin enters. The model of the reverse gradient volume fraction shown in FIG. 8C is a model in which the resin volume fraction of the interpenetrating layer linearly decreases from the side in contact with the metal toward the side in which the resin enters.

これらのモデルについて、有限要素解析(FEM:Finite Element Method)により樹脂内部に発生する応力分布を計算した結果を図9から図12に示す。尚、図8から図12では、樹脂のみ図示し、金属の図示を省いている。又、図9及び図12では、計算結果において濃淡が最も濃い部分(模式図において矢印Pで示すハッチング部分)が、応力が最大となる部分であり、その応力が最大となる部分から離れるにしたがって応力が低下している。この場合、応力の最大値は例えば約1.3×10Pa(N/m)程度である。 FIG. 9 to FIG. 12 show the results of calculating the stress distribution generated in the resin by finite element analysis (FEM) for these models. In FIGS. 8 to 12, only the resin is shown and the metal is not shown. In FIGS. 9 and 12, the darkest shaded portion in the calculation results (the hatched portion indicated by the arrow P in the schematic diagram) is the portion where the stress is maximized, and as the distance from the portion where the stress is maximized is increased. The stress is decreasing. In this case, the maximum value of stress is about 1.3 × 10 4 Pa (N / m 2 ), for example.

図9は、一定体積分率のモデルについて、相互浸透層の中の樹脂径(太さ)を変化させたときの計算結果を示す。相互浸透層の中の樹脂径が太くなるほど樹脂体積分率が大きくなる。樹脂内部に発生する応力は相互浸透層の中の樹脂径に依存し、相互浸透層の中の樹脂径が太くなる(樹脂体積分率が大きくなる)ほど局所的に発生する応力が低下することが確認された。ただし、相互浸透層の中の樹脂径が太くなるほど金属内部に発生する応力が大きくなり、金属との境界で破断する虞があるので、無暗に相互浸透層の中の樹脂径を太くすることはできない。   FIG. 9 shows the calculation results when the resin diameter (thickness) in the interpenetrating layer is changed for the constant volume fraction model. The resin volume fraction increases as the resin diameter in the interpenetrating layer increases. The stress generated in the resin depends on the resin diameter in the interpenetrating layer, and the locally generated stress decreases as the resin diameter in the interpenetrating layer increases (the resin volume fraction increases). Was confirmed. However, the greater the resin diameter in the interpenetrating layer, the greater the stress generated inside the metal, and there is a risk of breakage at the boundary with the metal. I can't.

図10は、一定体積分率のモデルについて、相互浸透層の中の樹脂厚さ(高さ)を変化させたときの計算結果を示す。樹脂内部に発生する応力は相互浸透層の中の樹脂厚さに殆ど依存せずに一定であることが確認された。ただし、相互浸透層の中の樹脂厚さが薄いと、樹脂が浸透する部分の側面で剥離が発生し、樹脂が引き抜ける虞があるので、一定以上の厚さが必要である。   FIG. 10 shows a calculation result when the resin thickness (height) in the interpenetrating layer is changed for the constant volume fraction model. It was confirmed that the stress generated in the resin was constant without depending on the resin thickness in the interpenetrating layer. However, if the resin thickness in the interpenetrating layer is thin, peeling occurs on the side surface of the portion into which the resin penetrates, and the resin may be pulled out, so a certain thickness is required.

図11は、傾斜体積分率のモデルの計算結果を示す。傾斜体積分率のモデルでは、一定体積分率のモデルと比較すると、樹脂内部に発生する応力が低下しており、即ち、接合強度が向上していることが確認された。接合強度が向上するのは以下の理由による。傾斜体積分率のモデルでは、樹脂が空隙部に浸透された状態で相互浸透層において樹脂との境界に近くなるほど樹脂体積分率が大きくなる。そのため、樹脂と相互浸透層との境界において、樹脂が金属に接する面の境界面全体に対する樹脂面積比(接触面積比)が相対的に小さくなり、逆に樹脂が相互浸透層に浸入する面の境界面全体に対する樹脂面積比(浸入面積比)が相対的に大きくなることで、境界で相互浸透層へと浸入する樹脂の量が多くなる。その結果、図9で示した一定体積分率のモデルと同様の効果(相互浸透層の中の樹脂径が太くなるほど局所的に発生する応力が低下する効果)により、樹脂内部において相互浸透層との境界に近い部分で発生する応力が低下する(樹脂母材内部に発生する応力と同等レベルまで低下する)。又、図9で示した一定体積分率のモデルでは相互浸透層の中の樹脂径が太くなるほど金属内部に発生する応力が増加するが、傾斜体積分率のモデルでは、金属に接している側では樹脂径が細いので、金属内部に発生する応力が増加することはなく、金属と相互浸透層との境界で破断が発生する虞はない。   FIG. 11 shows the calculation result of the model of the gradient volume fraction. In the slope volume fraction model, it was confirmed that, compared with the constant volume fraction model, the stress generated in the resin was reduced, that is, the joint strength was improved. The bonding strength is improved for the following reason. In the slope volume fraction model, the resin volume fraction increases as it approaches the boundary with the resin in the interpenetrating layer in a state where the resin is infiltrated into the gap. Therefore, at the boundary between the resin and the interpenetrating layer, the resin area ratio (contact area ratio) relative to the entire boundary surface of the surface where the resin is in contact with the metal is relatively small, and conversely the surface where the resin enters the interpenetrating layer. By relatively increasing the resin area ratio (penetration area ratio) with respect to the entire boundary surface, the amount of resin that enters the interpenetrating layer at the boundary increases. As a result, due to the same effect as the constant volume fraction model shown in FIG. 9 (the effect that the locally generated stress decreases as the resin diameter in the interpenetrating layer increases) The stress generated in the portion near the boundary is reduced (reduced to the same level as the stress generated in the resin base material). In addition, in the constant volume fraction model shown in FIG. 9, the stress generated in the metal increases as the resin diameter in the interpenetrating layer increases, but in the gradient volume fraction model, the side in contact with the metal increases. However, since the resin diameter is small, the stress generated in the metal does not increase, and there is no possibility that fracture occurs at the boundary between the metal and the interpenetrating layer.

これに対し、図12は、逆傾斜体積分率のモデルの計算結果を示す。逆傾斜体積分率のモデルでは、一定体積分率のモデルと比較すると、樹脂内部に発生する応力が増加しており、即ち、樹脂内部で局所的に非常に高い応力が発生していることが確認された。   On the other hand, FIG. 12 shows the calculation result of the model of the reverse gradient volume fraction. Compared with the constant volume fraction model, the reverse slope volume fraction model has increased stress generated inside the resin, that is, very high stress is locally generated inside the resin. confirmed.

図13は、Al(アルミニウム)基板上に、Al基板側からエポキシ樹脂が浸入する側までの気孔率が40%から60%まで線形的に変化する多孔質層を作製し、エポキシ樹脂を多孔質層の空隙部に浸透させて作製した試料のX線CT画像を示す。このような傾斜体積分率のモデルでは、図14に示すように、Al基板側の水平断面ではAlの分布が60%であり且つエポキシ樹脂の分布が40%であり、エポキシ樹脂が浸入する側の水平断面ではAlの分布が40%であり且つエポキシ樹脂の分布が60%であり、エポキシ樹脂の体積分率がAl基板側からエポキシ樹脂が浸入する側に向かって増加している(傾斜している)。   FIG. 13 shows the production of a porous layer on the Al (aluminum) substrate in which the porosity from the Al substrate side to the side into which the epoxy resin enters linearly changes from 40% to 60%. The X-ray CT image of the sample produced by making it osmose | permeate the space | gap part of a layer is shown. In such a gradient volume fraction model, as shown in FIG. 14, in the horizontal section on the Al substrate side, the Al distribution is 60% and the epoxy resin distribution is 40%. In the horizontal cross section, the Al distribution is 40% and the epoxy resin distribution is 60%, and the volume fraction of the epoxy resin increases from the Al substrate side toward the side where the epoxy resin enters (inclined). ing).

図15は、一定体積分率のモデルについて垂直断面のAl部分の応力分布を示し、図16は、傾斜体積分率のモデルについて垂直断面のAl部分の応力分布を示す。図15及び図16でも濃淡の濃い部分(模式図において矢印Pで示すハッチング部分)が高い応力を示しており、傾斜体積分率のモデルでは、一定体積分率のモデルと比較すると、相互浸透層においてAl部分に発生する応力が大幅に低減していることが確認された。   FIG. 15 shows the stress distribution in the Al portion of the vertical section for the constant volume fraction model, and FIG. 16 shows the stress distribution in the Al portion of the vertical section for the tilt volume fraction model. In FIGS. 15 and 16, the dark and shaded portions (hatched portions indicated by arrows P in the schematic diagrams) show high stress, and the slope volume fraction model has an interpenetrating layer as compared with the constant volume fraction model. It was confirmed that the stress generated in the Al portion was significantly reduced.

図17は、このように高い接合強度が期待される傾斜体積分率の多孔質層を実際に作製する手順の一例を示す。上述した図1から図3で説明したように原料粉末を型2の中空部2aに充填して加圧及び加熱する方法では、NaCl粉末の原料粉末全体に対する体積分率を複数段階で区分することで、気孔率を傾斜化することができる。即ち、例えば最初にNaCl粉末の体積分率を50%とした原料粉末を型2の中空部2aに充填し、続いてNaCl粉末の体積分率を60%、70%、80%と順次増加させることで、気孔率を傾斜化した多孔質層を作製可能となり、樹脂を浸透させることで、傾斜体積分率の相互浸透層を作製可能となる。ただし、NaCl粉末の体積分率が90%を超えるとTi粉末同士が結合しなくなるので、NaCl粉末の体積分率を最大でも90%までとすることが望ましい。NaCl粉末の体積分率を複数段階で区分する方法としては、充填するNaCl粉末の個数や粒径を変えれば良い。即ち、例えば粒径が一定のNaCl粉末を充填するのであれば、充填するNaCl粉末の個数を段階的に増加すれば良く、又、個数を一定としてNaCl粉末を充填するのであれば、充填するNaCl粉末の粒径を段階的に増加すれば良い。勿論、充填するNaCl粉末の個数と粒径との両方を調整しても良い。尚、NaCl粉末の体積分率を区分する段階数を多くするほど気孔率を線形的に増加させ、多孔質層における気孔率の変化を線形とすることができ、樹脂を浸透させたときの相互浸透層における樹脂体積分率の変化を線形とすることができる。   FIG. 17 shows an example of a procedure for actually manufacturing a porous layer having an inclined volume fraction that is expected to have such a high bonding strength. As described above with reference to FIGS. 1 to 3, in the method of filling the raw material powder into the hollow portion 2 a of the mold 2 and pressurizing and heating, the volume fraction of the NaCl powder with respect to the whole raw material powder is divided into a plurality of stages. Thus, the porosity can be inclined. That is, for example, first, a raw material powder having a volume fraction of NaCl powder of 50% is filled in the hollow portion 2a of the mold 2, and then the volume fraction of NaCl powder is sequentially increased to 60%, 70%, and 80%. Thus, it becomes possible to produce a porous layer having an inclined porosity, and it is possible to produce an interpenetrating layer having an inclined volume fraction by infiltrating the resin. However, when the volume fraction of the NaCl powder exceeds 90%, the Ti powders are not bonded to each other. Therefore, the volume fraction of the NaCl powder is desirably set to 90% at the maximum. As a method of dividing the volume fraction of NaCl powder in a plurality of stages, the number and particle diameter of NaCl powder to be filled may be changed. That is, for example, when filling NaCl powder with a constant particle size, the number of NaCl powders to be filled may be increased stepwise, and when filling the NaCl powder with a constant number, NaCl to be filled is filled. What is necessary is just to increase the particle size of a powder in steps. Of course, both the number of NaCl powders to be filled and the particle size may be adjusted. In addition, the porosity can be increased linearly as the number of steps for dividing the volume fraction of NaCl powder is increased, and the change in porosity in the porous layer can be made linear. The change in the resin volume fraction in the permeation layer can be made linear.

以上に説明したように本実施形態によれば、樹脂が多孔質層の空隙部に浸透して相互浸透層が形成され、金属と樹脂とが相互浸透層を介して接合される構造において、多孔質層を、金属に接する側の気孔率が相対的に低く、樹脂が浸入する側の気孔率が相対的に高くなるように構成した。これにより、樹脂と相互浸透層との境界において、樹脂が金属に接している面の境界面全体に対する樹脂面積比(接触面積比)が相対的に小さくなり、逆に樹脂が相互浸透層に浸入している面の境界面全体に対する樹脂面積比(浸入面積比)が相対的に大きくなり、境界で相互浸透層へと浸入している樹脂の量が多くなる。このように樹脂と相互浸透層との境界で樹脂が相互浸透層に浸入している面の樹脂面積比が相対的に大きくなることで、樹脂内部に発生する応力が低下する。その結果、樹脂と相互浸透層との境界で破断が発生し難くなり、樹脂と相互浸透層との間の接合強度を高めることができる。   As described above, according to the present embodiment, in the structure in which the resin penetrates into the void portion of the porous layer to form the interpenetrating layer, and the metal and the resin are joined via the interpenetrating layer, The porous layer was configured such that the porosity on the side in contact with the metal was relatively low and the porosity on the side where the resin entered was relatively high. As a result, at the boundary between the resin and the interpenetrating layer, the resin area ratio (contact area ratio) relative to the entire boundary surface of the surface where the resin is in contact with the metal is relatively small, and conversely, the resin enters the interpenetrating layer The resin area ratio (penetration area ratio) with respect to the entire boundary surface of the surface that is in operation is relatively large, and the amount of resin that has entered the interpenetrating layer at the boundary increases. As described above, since the resin area ratio of the surface where the resin enters the interpenetrating layer at the boundary between the resin and the interpenetrating layer is relatively increased, the stress generated in the resin is reduced. As a result, breakage hardly occurs at the boundary between the resin and the interpenetrating layer, and the bonding strength between the resin and the interpenetrating layer can be increased.

又、この場合、金属に接する側では樹脂が浸入する側よりも金属体積分率が大きくなっているので、金属と相互浸透層との間の接合強度が低下することはない。即ち、金属に接する側から樹脂が浸入する側にかけて全体的に気孔率を高くしてしまうと、金属と相互浸透層との境界で高い応力が発生し、金属と相互浸透層との接合強度の低下を招く可能性があるが、金属に接する側から樹脂が浸入する側にかけて気孔率を高くなるように傾斜化することで、金属と相互浸透層との間の接合強度をある程度維持しつつ、樹脂と相互浸透層との間の接合強度を高めることができる。   In this case, since the metal volume fraction is larger on the side in contact with the metal than on the side in which the resin enters, the bonding strength between the metal and the interpenetrating layer does not decrease. That is, if the porosity is increased as a whole from the side in contact with the metal to the side into which the resin enters, high stress is generated at the boundary between the metal and the interpenetrating layer, and the bonding strength between the metal and the interpenetrating layer is increased. Although there is a possibility of causing a decrease, by inclining so as to increase the porosity from the side in contact with the metal to the side into which the resin enters, while maintaining the bonding strength between the metal and the interpenetrating layer to some extent, Bonding strength between the resin and the interpenetrating layer can be increased.

本発明は、上記した実施形態にのみ限定されるものではなく、以下のように変形又は拡張することができる。
本実施形態では、基板として用いる金属として比重が比較的小さいTi(比重は約4.54g/cm)を例示したが、軽量化の要求が小さければ比重がTiよりも大きい例えばCu(銅、融点は約1085℃、比重は約8.96g/cm)、Ni(ニッケル、融点は約1455℃、比重は約8.902g/cm)、Fe(鉄、融点は約1538℃、比重は約7.874g/cm)、W(タングステン、融点は約3422℃、比重は約19.3g/cm)等の別の金属を用いても良い。Tiを焼結させるための補助剤として用いる金属としてAlを例示したが、スペーサー粉末であるNaCl粉末よりも融点が低い条件を満たせばMg(融点は約650℃)、Pb(融点は約327.5℃)等の別の金属を用いても良い。
The present invention is not limited to the above-described embodiment, and can be modified or expanded as follows.
In the present embodiment, Ti having a relatively small specific gravity (specific gravity is about 4.54 g / cm 3 ) is exemplified as a metal used as a substrate. However, if the demand for weight reduction is small, the specific gravity is larger than Ti, for example, Cu (copper, Melting point is about 1085 ° C., specific gravity is about 8.96 g / cm 3 ), Ni (nickel, melting point is about 1455 ° C., specific gravity is about 8.902 g / cm 3 ), Fe (iron, melting point is about 1538 ° C., specific gravity is about Another metal such as about 7.874 g / cm 3 ), W (tungsten, melting point is about 3422 ° C., specific gravity is about 19.3 g / cm 3 ) may be used. Al is exemplified as a metal used as an auxiliary agent for sintering Ti, but Mg (melting point is about 650 ° C.) and Pb (melting point is about 327.degree. C.) if the melting point is lower than that of NaCl powder as a spacer powder. Another metal such as 5 ° C.) may be used.

本実施形態では、スペーサー粉末としてNaCl粉末を用いた場合を例示したが、補助剤として用いる金属よりも融点が高く、焼結時に溶融せず、水洗や揮発や燃焼等の方法により除去可能である条件を満たせばスペーサー粉末としてどのような物質を用いても良い。例えばKCl(塩化カリウム)粉末を用いても良い。又、NaCl粉末を静水に溶解させて除去する方法を例示したが、例えば燃やして除去する等のどのような方法で除去しても良い。   In the present embodiment, the case where NaCl powder is used as the spacer powder is exemplified, but the melting point is higher than that of the metal used as an auxiliary agent, it does not melt at the time of sintering, and can be removed by a method such as washing with water, volatilization or combustion. Any material may be used as the spacer powder as long as the conditions are satisfied. For example, KCl (potassium chloride) powder may be used. Moreover, although the method of dissolving NaCl powder in still water was illustrated, it may be removed by any method such as burning.

本実施形態では、金属に接する側から樹脂が浸入する側に向かって気孔率が常に増加する(低下する領域が存在しない)場合を説明したが、気孔率が必ずしも常に増加しなくても(低下する領域が存在しても)良い。例えば原料粉末を型2の中空部2aに充填する場合に、NaCl粉末の体積分率を50%、60%、50%、70%、80%の順序としても良い。   In the present embodiment, the case has been described in which the porosity always increases from the side in contact with the metal toward the side where the resin enters (there is no area to decrease), but the porosity does not always increase (decreases). (There may be an area to do). For example, when the raw material powder is filled in the hollow portion 2a of the mold 2, the volume fraction of the NaCl powder may be in the order of 50%, 60%, 50%, 70%, and 80%.

本実施形態では、NaCl粉末の体積分率を複数段階で区分し、傾斜体積分率の相互浸透層を作製する手順を例示したが、原料粉末を加圧する圧力及び加熱する温度を調整する(差別化する)ことで、傾斜体積分率の相互浸透層を作製しても良い。即ち、NaCl粉末の体積分率を一定とし、金属に接する側では、加熱する温度を相対的に高くして粉末の緻密化を促進することで、気孔率を相対的に低くし、樹脂が浸入する側では、加熱する温度を相対的に低くして粉末の緻密化を抑制することで、気孔率を相対的に高くしても良い。   In the present embodiment, the volume fraction of the NaCl powder is divided into a plurality of stages, and the procedure for producing the interpenetrating layer having the gradient volume fraction is exemplified. However, the pressure for heating the raw material powder and the temperature for heating are adjusted (discrimination). In this case, an interpenetrating layer having an inclined volume fraction may be produced. That is, the volume fraction of NaCl powder is kept constant, and on the side in contact with the metal, the heating temperature is relatively high to promote densification of the powder, so that the porosity is relatively low and the resin penetrates. On the other hand, the porosity may be made relatively high by lowering the heating temperature to suppress densification of the powder.

Claims (11)

金属粉末とスペーサー粉末とを含む原料粉末を、前記スペーサー粉末が圧壊又は分解しない圧力及び温度の条件下で加圧及び加熱して前記金属粉末を焼結させ、その後に前記スペーサー粉末を除去して空隙部を形成する方法により、金属に接する側の気孔率が相対的に低く、樹脂が浸入する側の気孔率が相対的に高くなるように多孔質層を作製することを特徴とする多孔質層の作製方法。   The raw material powder containing the metal powder and the spacer powder is pressurized and heated under conditions of pressure and temperature at which the spacer powder is not crushed or decomposed to sinter the metal powder, and then the spacer powder is removed. A porous layer characterized by producing a porous layer by a method of forming a void portion so that the porosity on the side in contact with the metal is relatively low and the porosity on the side into which the resin enters is relatively high Method for making the layer. 請求項に記載した多孔質層の作製方法において、
金属に接する側ではスペーサー粉末の原料粉末全体に対する体積分率を相対的に低くし、樹脂が浸入する側ではスペーサー粉末の原料粉末全体に対する体積分率を相対的に高くして前記金属粉末を焼結させ、多孔質層を作製することを特徴とする多孔質層の作製方法。
The method for producing a porous layer according to claim 1 ,
On the side in contact with the metal, the volume fraction of the spacer powder relative to the entire raw material powder is relatively low, and on the side where the resin permeates, the volume fraction of the spacer powder relative to the entire raw material powder is relatively increased to burn the metal powder. A method for producing a porous layer, characterized in that the porous layer is produced by bonding.
請求項に記載した多孔質層の作製方法において、
金属に接する側では原料粉末を加圧する圧力及び加熱する温度のうち少なくとも何れかを相対的に高くし、樹脂が浸入する側では原料粉末を加圧する圧力及び加熱する温度のうち少なくとも何れかを相対的に低くして前記金属粉末を焼結させ、多孔質層を作製することを特徴とする多孔質層の作製方法。
The method for producing a porous layer according to claim 1 ,
At least one of the pressure to press the raw material powder and the heating temperature is relatively high on the side in contact with the metal, and at least one of the pressure to press the raw material powder and the heating temperature is relatively high on the side where the resin enters. A method for producing a porous layer, characterized in that the metal powder is sintered at a low temperature to produce a porous layer.
請求項からの何れか一項に記載した多孔質層の作製方法において、
金属に接する側から樹脂が浸入する側に向かって気孔率が常に高くなるように多孔質層を作製することを特徴とする多孔質層の作製方法。
In the manufacturing method of the porous layer as described in any one of Claim 1 to 3 ,
A method for producing a porous layer, comprising producing a porous layer so that the porosity is constantly increased from a side in contact with a metal toward a side into which a resin enters.
請求項からの何れか一項に記載した多孔質層の作製方法において、
前記スペーサー粉末として、静水に溶解する粉末を用いて作製することを特徴とする多孔質層の作製方法。
In the manufacturing method of the porous layer as described in any one of Claim 1 to 4 ,
A method for producing a porous layer, wherein the spacer powder is produced using a powder that dissolves in still water.
金属からなる基板上で、金属粉末とスペーサー粉末とを含む原料粉末を、前記スペーサー粉末が圧壊又は分解しない圧力及び温度の条件下で加圧及び加熱して前記金属粉末を焼結させ、その後に前記スペーサー粉末を除去して多孔質層を作製し、樹脂を前記多孔質層の空隙部に浸透させる方法により、金属に接している側の樹脂体積分率が相対的に低く、樹脂が浸入している側の樹脂体積分率が相対的に高くなるように相互浸透層を作製することを特徴とする相互浸透層の作製方法。   On a metal substrate, a raw material powder containing a metal powder and a spacer powder is pressed and heated under pressure and temperature conditions that prevent the spacer powder from being crushed or decomposed, and then the metal powder is sintered. By removing the spacer powder to prepare a porous layer, the resin volume fraction on the side in contact with the metal is relatively low due to the method of allowing the resin to penetrate into the voids of the porous layer, and the resin penetrates. A method for producing an interpenetrating layer, comprising producing an interpenetrating layer so that the resin volume fraction on the side of the inner side is relatively high. 請求項に記載した相互浸透層の作製方法において、
金属に接している側ではスペーサー粉末の原料粉末全体に対する体積分率を相対的に低くし、樹脂が浸入する側ではスペーサー粉末の原料粉末全体に対する体積分率を相対的に高くして前記金属粉末を焼結させ、相互浸透層を作製することを特徴とする相互浸透層の作製方法。
The method for producing an interpenetrating layer according to claim 6 ,
On the side in contact with the metal, the volume fraction of the spacer powder relative to the entire raw material powder is relatively low, and on the side where the resin penetrates, the volume fraction of the spacer powder relative to the entire raw material powder is relatively high. A method for producing an interpenetrating layer, which comprises sintering an interpenetrating layer to produce an interpenetrating layer.
請求項に記載した相互浸透層の作製方法において、
金属に接している側では原料粉末を加圧する圧力及び加熱する温度のうち少なくとも何れかを相対的に高くし、樹脂が浸入する側では原料粉末を加圧する圧力及び加熱する温度のうち少なくとも何れかを相対的に低くして前記金属粉末を焼結させ、相互浸透層を作製することを特徴とする相互浸透層の作製方法。
The method for producing an interpenetrating layer according to claim 6 ,
At least one of the pressure to press the raw material powder and the heating temperature is relatively high on the side in contact with the metal, and at least one of the pressure to press the raw material powder and the heating temperature on the side where the resin enters A method for producing an interpenetrating layer, wherein the metal powder is sintered with a relatively low value to produce an interpenetrating layer.
請求項からの何れか一項に記載した相互浸透層の作製方法において、
金属に接している側から樹脂が浸入している側に向かって樹脂体積率が常に高くなるように相互浸透層を作製することを特徴とする相互浸透層の作製方法。
In the method for producing an interpenetrating layer according to any one of claims 6 to 8 ,
A method for producing an interpenetrating layer, characterized in that the interpenetrating layer is produced so that the resin volume fraction is constantly increased from the side in contact with the metal toward the side in which the resin has entered.
請求項からの何れか一項に記載した相互浸透層の作製方法において、
前記スペーサー粉末として、静水に溶解する粉末を用いて作製することを特徴とする相互浸透層の作製方法。
In the method for producing an interpenetrating layer according to any one of claims 6 to 9 ,
A method for producing an interpenetrating layer, wherein the spacer powder is produced using a powder that dissolves in still water.
請求項から10の何れか一項に記載した相互浸透層の作製方法を含み、
前記金属と前記樹脂とを前記相互浸透層を介して接合することを特徴とする金属と樹脂との接合方法。
A method for producing an interpenetrating layer according to any one of claims 6 to 10 ,
A method of joining a metal and a resin, wherein the metal and the resin are joined through the interpenetrating layer.
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