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JP6417115B2 - Damping mechanism and grinding device - Google Patents
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JP6417115B2 - Damping mechanism and grinding device - Google Patents

Damping mechanism and grinding device Download PDF

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JP6417115B2
JP6417115B2 JP2014106032A JP2014106032A JP6417115B2 JP 6417115 B2 JP6417115 B2 JP 6417115B2 JP 2014106032 A JP2014106032 A JP 2014106032A JP 2014106032 A JP2014106032 A JP 2014106032A JP 6417115 B2 JP6417115 B2 JP 6417115B2
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vibration
weight
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grinding
side plates
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JP2015222090A (en
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裕樹 阿部
裕樹 阿部
暢行 高田
暢行 高田
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Disco Corp
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Description

本発明は、被加工物の加工時に発生する振動の制振を行う制振機構と、その制振機構を備え被加工物を研削する研削装置とに関する。   The present invention relates to a vibration damping mechanism that suppresses vibration generated during processing of a workpiece, and a grinding apparatus that includes the vibration damping mechanism and grinds the workpiece.

被加工物である板状ワークを研削する研削装置は、板状ワークを保持するチャックテーブルと、砥石を備える研削手段とを少なくとも備えており、板状ワークの上面に回転する砥石を当接させて押圧することにより、板状ワークが所定の厚みに至るまで研削している。   A grinding apparatus for grinding a plate-shaped workpiece, which is a workpiece, includes at least a chuck table that holds the plate-shaped workpiece and a grinding means that includes a grindstone, and a rotating grindstone is brought into contact with the upper surface of the plate-shaped workpiece. The plate-like workpiece is ground until it reaches a predetermined thickness.

砥石で研削しようとする板状ワークが硬い場合には、単位時間当たりに板状ワークを削り取る量が少なくなるため、板状ワークの被研削面(砥石が接触して研削される面)に対して砥石が滑走しているような状態となり、研削できていない状態となることがある。このような状態が続くと、板状ワークの厚みは減少しない。研削手段は所定の研削送り速度で研削送りされ板状ワークに砥石を押し当てているが、板状ワークの厚みが減少しない症状が発生すると、研削手段が振動してしまい、その振動を砥石が受けて急激に砥粒が脱落を起こしたりして砥石の異常磨耗が発生する場合が有る。また、砥石が振動すると、振動の影響によって板状ワークの被研削面に砥石が一定圧力で当たらなくなるため、板状ワークの被研削面に縞模様を形成してしまい、板状ワークの厚み精度の均一性に悪影響を及ぼすという問題も生じる。   When the plate-shaped workpiece to be ground with a grindstone is hard, the amount of scraping the plate-shaped workpiece per unit time decreases, so the surface to be ground of the plate-shaped workpiece (surface to be ground by contact with the grindstone) As a result, the grindstone may be in a sliding state, and may not be ground. If such a state continues, the thickness of the plate-like workpiece does not decrease. The grinding means is ground at a predetermined grinding feed speed and presses the grindstone against the plate-like workpiece. However, when a symptom that the thickness of the plate-like workpiece does not decrease occurs, the grinding means vibrates, and the grindstone vibrates the vibration. In some cases, the abrasive grains may drop off suddenly, resulting in abnormal wear of the grindstone. In addition, when the grinding wheel vibrates, the grinding stone does not hit the surface to be ground of the plate-like workpiece at a constant pressure due to the influence of the vibration, so a striped pattern is formed on the surface to be ground of the plate-like workpiece, and the thickness accuracy of the plate-like workpiece There is also a problem of adversely affecting the uniformity of the image.

振動による弊害が生じるのを回避するために、例えば下記の特許文献1及び2には、砥石の振動が板状ワークに伝達されないようにするために、砥石とホイールマウントとの間に緩衝剤を介在させて板状ワークを研削する方法が提案されている。また、下記の特許文献3には、ゴム製の制振パッドを砥石頭の上に置き、その上に砥石頭の振動を受けて自発的に振動を減衰できる小型の制振装置を載せた構成を有する研削装置が提案されている。   In order to avoid the occurrence of harmful effects due to vibration, for example, in Patent Documents 1 and 2 below, a buffer is provided between the grindstone and the wheel mount in order to prevent the vibration of the grindstone from being transmitted to the plate-like workpiece. There has been proposed a method for grinding a plate-like workpiece by interposing. In Patent Document 3 below, a rubber damping pad is placed on the grinding wheel head, and a small damping device capable of spontaneously damping the vibration by receiving the vibration of the grinding wheel head is mounted thereon. Has been proposed.

特開2005−335014号公報JP 2005-335014 A 特開2009−095947号公報JP 2009-095947 A 特開2007−152460号公報JP 2007-152460 A

しかし、上記したような研削方法や研削装置では、板状ワークの研削中に発生する砥石の振動の振動周波数や振幅量に応じた調整を行うことができず、また、適切なタイミングで砥石の振動を減衰させることができないという問題がある。   However, in the grinding method and grinding apparatus as described above, adjustment according to the vibration frequency and amplitude amount of the grinding wheel vibration that occurs during grinding of the plate-like workpiece cannot be performed, and the grinding wheel is adjusted at an appropriate timing. There is a problem that vibration cannot be attenuated.

本発明は、上記の事情にかんがみてなされたものであり、砥石の振動の振動周波数や振動の振幅量に応じて、砥石の振動の制振を可能とすることを目的としている。   The present invention has been made in view of the above circumstances, and an object of the present invention is to make it possible to control the vibration of the grindstone according to the vibration frequency and the amplitude of the vibration of the grindstone.

第一の発明は、振動体の振動を制振する制振機構であって、錘と、水平方向において該錘を挟む2枚の側板と、該錘と該2枚の側板との間にそれぞれ配設される振動吸収性のある緩衝材と、該2枚の側板の間隔を調整する間隔調整部と、を備え、該間隔調整部は、該側板の上側の間隔を調整する上側調整部と、該側板の下側の間隔を調整する下側調整部とを備え、該下側調整部と該錘との間に、振動吸収性のある第2の緩衝材を備え、該間隔調整部によって該2枚の側板の間隔を調整し、振動を減衰させることを特徴とする。 The first invention is a damping mechanism for damping the vibration of a vibrating body, and includes a weight, two side plates sandwiching the weight in the horizontal direction, and the weight and the two side plates, respectively. A vibration-absorbing cushioning material disposed, and an interval adjusting unit that adjusts an interval between the two side plates, and the interval adjusting unit includes an upper adjusting unit that adjusts an upper interval between the side plates. A lower adjustment portion that adjusts the lower space of the side plate, and a second shock absorbing material that absorbs vibration between the lower adjustment portion and the weight . The distance between the two side plates is adjusted to attenuate the vibration.

この制振機構は、前記錘が、該錘の重さを増減可能とする重量増減部を備え、該重量増減部で該錘の重さを増減させ、振動を減衰させることが望ましい。   In the vibration control mechanism, it is preferable that the weight includes a weight increase / decrease unit that can increase / decrease the weight of the weight, and the weight increase / decrease unit increases / decreases the weight of the weight to attenuate the vibration.

第二の発明は、板状ワークを保持する保持手段と、該保持手段が保持した板状ワークに砥石を当接させて加工する加工手段と、該加工手段の振動を制振する上記の制振機構と、を備えた研削装置であって、板状ワークに該砥石を当接させ加工時に該加工手段に発生する振動の振動周波数および振幅量を計測する振動測定手段と、該振動測定手段が計測した計測値に応じて前記間隔調整部を作動させて前記2枚の側板の間隔を調整する制御部と、を備える。   According to a second aspect of the present invention, there is provided a holding means for holding a plate-shaped work, a processing means for making a grinding stone contact with the plate-like work held by the holding means, and the above-described control for damping the vibration of the processing means. And a vibration measuring means for measuring a vibration frequency and an amplitude of vibration generated in the processing means when the grindstone is brought into contact with a plate-shaped workpiece, and the vibration measuring means. And a control unit that adjusts the interval between the two side plates by operating the interval adjusting unit in accordance with the measured value measured by.

本発明の制振機構は、錘と、錘を挟む2枚の側板と、錘と2枚の側板との間に配設する振動吸収性のある緩衝材と、2枚の側板の間隔を調整する間隔調整部とを備えているため、2枚の側板の間隔を調整することにより、緩衝材のつぶれの度合いを調整して振動体の振動周波数を変化させることができる。したがって、振動体の振動周波数と錘側の振動周波数とを同じにすることができ、振動の振幅を減衰させることができる。   The vibration damping mechanism of the present invention adjusts the distance between the weight, the two side plates sandwiching the weight, the shock absorbing shock absorbing material disposed between the weight and the two side plates, and the two side plates. Therefore, by adjusting the distance between the two side plates, the degree of crushing of the buffer material can be adjusted to change the vibration frequency of the vibrating body. Therefore, the vibration frequency of the vibrating body and the vibration frequency on the weight side can be made the same, and the vibration amplitude can be attenuated.

制振機構を構成する錘に、錘の重さを増減可能とする重量増減部を備えれば、錘の重さを調整することにより振幅量を調整することができる。   If the weight constituting the vibration control mechanism is provided with a weight increasing / decreasing unit that can increase or decrease the weight of the weight, the amplitude can be adjusted by adjusting the weight of the weight.

本発明の加工装置は、板状ワークに砥石を当接させ加工時に加工手段に発生する振動の振動周波数および振幅量を計測し、その計測値に応じて制御部が2枚の側板の間隔を調整するため、適切なタイミングで砥石の振動を減衰させることができる。したがって、砥石に異常磨耗が発生するのを防止し、板状ワークの厚み精度を良好にして均一な状態で仕上げることが可能となる。   In the processing apparatus of the present invention, a grindstone is brought into contact with a plate-like workpiece to measure the vibration frequency and amplitude of vibration generated in the processing means during processing, and the control unit determines the interval between the two side plates according to the measured value. In order to adjust, the vibration of the grindstone can be attenuated at an appropriate timing. Therefore, it is possible to prevent abnormal wear from occurring on the grindstone and to finish the plate-like workpiece in a uniform state with good thickness accuracy.

研削装置の構成を示す斜視図である。It is a perspective view which shows the structure of a grinding apparatus. 制振機構の第1例を示す断面図である。It is sectional drawing which shows the 1st example of a damping mechanism. 錘の構成を示す斜視図である。It is a perspective view which shows the structure of a weight. 制振機構において緩衝材がつぶれた状態を示す断面図である。It is sectional drawing which shows the state where the buffer material was crushed in the damping mechanism. 制振機構の第2例を示す断面図である。It is sectional drawing which shows the 2nd example of a damping mechanism. 制振機構の第2例において緩衝材がつぶれた状態を示す断面図である。It is sectional drawing which shows the state which the shock absorbing material was crushed in the 2nd example of a damping mechanism. 制振機構の第3例を示す断面図である。It is sectional drawing which shows the 3rd example of a damping mechanism. 制振機構の第3例において緩衝材がつぶれた状態を示す断面図である。It is sectional drawing which shows the state which the shock absorbing material was crushed in the 3rd example of a damping mechanism.

図1に示す研削装置1は、Y軸方向にのびる装置ベース2を有している。装置ベース2の上面2aには、Y軸方向に移動可能でかつ回転可能な保持テーブル4が配設されている。保持テーブル4の周囲は、カバー3によって覆われている。保持テーブル4は、板状ワークを下方から吸引保持する保持面4aを有している。保持テーブル4は、蛇腹5の伸縮をともなってY軸方向に移動することができる。   A grinding device 1 shown in FIG. 1 has a device base 2 extending in the Y-axis direction. A holding table 4 that is movable and rotatable in the Y-axis direction is disposed on the upper surface 2 a of the apparatus base 2. The periphery of the holding table 4 is covered with a cover 3. The holding table 4 has a holding surface 4a for sucking and holding the plate-like workpiece from below. The holding table 4 can move in the Y-axis direction with the expansion and contraction of the bellows 5.

装置ベース2のY軸方向後部(+Y方向側)には、Z軸方向にのびるコラム6が立設されている。コラム6の側方側においては、板状ワークに研削加工を施す加工手段である研削手段10と、保持テーブル4に保持される板状ワークに対して接近及び離反する方向(Z軸方向)に研削手段10を昇降させる昇降手段20とが配設されている。   A column 6 extending in the Z-axis direction is erected on the rear side (+ Y direction side) of the apparatus base 2 in the Y-axis direction. On the side of the column 6, the grinding means 10, which is a processing means for grinding the plate-like workpiece, and the direction (Z-axis direction) approaching and separating from the plate-like workpiece held by the holding table 4. Elevating means 20 for elevating and lowering the grinding means 10 is provided.

研削手段10は、Z軸方向の軸心を有するスピンドルユニット11と、スピンドルユニット11を支持するホルダ12と、スピンドルユニット11の一端に接続されたモータ13と、スピンドルユニット11の下端にマウント14を介して装着された研削ホイール15とを少なくとも備えている。研削ホイール15の下部には、砥石16が円環状に固着されている。研削手段10では、モータ13による駆動により研削ホイール15を所定の回転速度で回転させることができる。   The grinding means 10 includes a spindle unit 11 having an axis in the Z-axis direction, a holder 12 that supports the spindle unit 11, a motor 13 connected to one end of the spindle unit 11, and a mount 14 at the lower end of the spindle unit 11. And a grinding wheel 15 mounted thereon. A grindstone 16 is fixed to the lower part of the grinding wheel 15 in an annular shape. In the grinding means 10, the grinding wheel 15 can be rotated at a predetermined rotational speed by driving by the motor 13.

昇降手段20は、Z軸方向にのびるボールネジ21と、ボールネジ21の一端に接続されたモータ22と、ボールネジ21と平行にのびる一対のガイドレール23と、内部に備えたナットがボールネジ21に螺合するとともに側部がガイドレール23に摺接する昇降板24とを備えている。昇降手段20では、モータ22によって駆動されてボールネジ21が回動することにより、一対のガイドレール23に沿って昇降板24がZ軸方向に移動するとともに、昇降板24に連結された研削手段10をZ軸方向に昇降させることができる。   The elevating means 20 includes a ball screw 21 extending in the Z-axis direction, a motor 22 connected to one end of the ball screw 21, a pair of guide rails 23 extending in parallel with the ball screw 21, and nuts provided therein are screwed into the ball screw 21. In addition, a side plate is provided with a lifting plate 24 slidably contacting the guide rail 23. In the elevating means 20, the ball screw 21 is rotated by being driven by the motor 22, whereby the elevating plate 24 moves in the Z-axis direction along the pair of guide rails 23, and the grinding means 10 coupled to the elevating plate 24. Can be moved up and down in the Z-axis direction.

研削装置1には、研削手段10によって板状ワークを研削する際に研削手段10に発生する振動を制振する制振機構30を備えている。図示の例では2つの制振機構30を備えている。制振機構30は、ケーシング31を有しており、スピンドルユニット11の上面11a上に配設されている。図2に示すように、制振機構30は、ケーシング31の内部に配設された錘32と、2枚の側板310,311と、錘32と側板310,311との間にそれぞれ配設された振動吸収性のある緩衝材33と、側板310と側板311との間隔を調整する間隔調整部36a,36bとを備えている。なお、図2においては図1に示したケーシング31の図示を省略している。   The grinding apparatus 1 includes a vibration control mechanism 30 that controls vibration generated in the grinding means 10 when the grinding means 10 grinds the plate workpiece. In the illustrated example, two vibration control mechanisms 30 are provided. The vibration damping mechanism 30 has a casing 31 and is disposed on the upper surface 11 a of the spindle unit 11. As shown in FIG. 2, the vibration damping mechanism 30 is disposed between the weight 32 disposed inside the casing 31, the two side plates 310 and 311, and the weight 32 and the side plates 310 and 311. In addition, the vibration absorbing buffer 33 and the distance adjusting portions 36a and 36b for adjusting the distance between the side plate 310 and the side plate 311 are provided. 2, illustration of the casing 31 shown in FIG. 1 is omitted.

緩衝材33は、変形可能な材料によって形成され、錘32と側板310との間及び錘32と側板311との間に2つずつ配設されている。緩衝材33の材料は、例えばウレタンやソルボセインである。   The cushioning material 33 is formed of a deformable material, and two cushioning materials 33 are disposed between the weight 32 and the side plate 310 and between the weight 32 and the side plate 311. The material of the buffer material 33 is urethane or sorbosein, for example.

間隔調整部36aは、錘32の上方側に配設されている。間隔調整部36aは、X軸方向にのびる一対の対向する調整ネジ360と、それぞれの調整ネジ360の先端の雄ねじに螺合する雌ねじを有する上板361とを少なくとも備えている。間隔調整部36bは、錘32の下方側に配設されている。間隔調整部36bについても間隔調整部36aと同様の構成となっており、X軸方向にのびる一対の対向する調整ネジ360と、それぞれの調整ネジ360の先端の雄ねじに螺合する雌ねじを有する底板362とを少なくとも備えている。このように構成される間隔調整部36a,36bでは、例えば作業者が各調整ネジ360を回すことにより、各調整ネジ360が上板361及び底板362に対して前進又は後退し、これにより側板310と側板311とをX軸方向に移動させて互いに接近又は離反させ、側板310と側板311との間隔を調整することができる。   The interval adjusting unit 36 a is disposed on the upper side of the weight 32. The distance adjusting unit 36a includes at least a pair of opposing adjusting screws 360 extending in the X-axis direction and an upper plate 361 having a female screw that is screwed into a male screw at the tip of each adjusting screw 360. The interval adjusting unit 36 b is disposed on the lower side of the weight 32. The interval adjusting unit 36b has the same configuration as the interval adjusting unit 36a, and has a pair of opposing adjusting screws 360 extending in the X-axis direction, and a bottom plate having a female screw that is screwed into a male screw at the tip of each adjusting screw 360. 362 at least. In the interval adjusting portions 36a and 36b configured as described above, for example, when an operator turns each adjusting screw 360, each adjusting screw 360 moves forward or backward with respect to the upper plate 361 and the bottom plate 362, thereby the side plate 310. And the side plate 311 are moved in the X-axis direction so as to approach or separate from each other, and the distance between the side plate 310 and the side plate 311 can be adjusted.

図3に示すように、錘32には、複数の収容穴320が形成されている。この収容穴320には、その形状に対応する錘部材39を収容可能である。図1に示した研削手段10の振動の振幅量に応じて、複数の収容穴320に対して錘部材39を収容したり収容穴320から錘部材39を抜き取ったりすることにより、錘32の重さを調整することができる。すなわち、錘部材39は、錘32の重量を増減させる重量増減部として機能する。なお、図3の例における錘部材39はバー状に形成されているが、この形状には限定されない。   As shown in FIG. 3, the weight 32 is formed with a plurality of receiving holes 320. In the accommodation hole 320, the weight member 39 corresponding to the shape can be accommodated. Depending on the amplitude of vibration of the grinding means 10 shown in FIG. 1, the weight member 39 is accommodated in the plurality of accommodation holes 320, or the weight member 39 is removed from the accommodation holes 320. Can be adjusted. That is, the weight member 39 functions as a weight increasing / decreasing unit that increases or decreases the weight of the weight 32. The weight member 39 in the example of FIG. 3 is formed in a bar shape, but is not limited to this shape.

図1に示す研削装置1は、板状ワークに砥石16を当接させて研削する時に発生する研削手段10の振動の振動周波数および振幅量を計測する振動測定手段40と、振動測定手段40が計測した計測値に応じて図2に示した制振機構30の間隔調整部36a,36bを作動させ2枚の側板310,311の間隔を調整する制御部50とを備えている。   The grinding apparatus 1 shown in FIG. 1 includes a vibration measuring means 40 that measures the vibration frequency and amplitude of vibration of the grinding means 10 that is generated when the grindstone 16 is brought into contact with a plate-like workpiece and is ground, and the vibration measuring means 40 includes A control unit 50 is provided that operates the interval adjusting units 36a and 36b of the vibration damping mechanism 30 shown in FIG. 2 in accordance with the measured values to adjust the interval between the two side plates 310 and 311.

振動測定手段40は、スピンドルユニット11の上面11aに配設されている。この振動測定手段40は、制御部50に接続されており、砥石16が板状ワークを研削する際に生じる研削手段10の振動の振動周波数および振幅量を計測してそのデータを制御部50に送ることができる。制御部50は、CPU及びメモリを少なくとも備えており、各制振機構30に接続されている。制御部50は、振動測定手段40から送られてきた振動周波数に応じて図2に示した間隔調整部36a,36bを作動させ、側板310と側板311との間隔を調整することができる。   The vibration measuring means 40 is disposed on the upper surface 11 a of the spindle unit 11. The vibration measuring unit 40 is connected to the control unit 50, measures the vibration frequency and amplitude of the vibration of the grinding unit 10 generated when the grindstone 16 grinds the plate-like workpiece, and sends the data to the control unit 50. Can send. The control unit 50 includes at least a CPU and a memory, and is connected to each vibration control mechanism 30. The control unit 50 can adjust the interval between the side plate 310 and the side plate 311 by operating the interval adjusting units 36 a and 36 b shown in FIG. 2 in accordance with the vibration frequency sent from the vibration measuring means 40.

次に、研削装置1において板状ワークWを研削する際の研削装置1の動作及び制振機構30を用いて研削手段10の振動を制振する動作について説明する。板状ワークWは、被加工物の一例であって、その表面Waには、格子状の分割予定ラインSによってそれぞれ区画された各領域にデバイスDがそれぞれ形成されている。板状ワークWの表面Waと反対側の面である裏面Wbは、砥石16によって研削される被研削面となっている。   Next, the operation of the grinding device 1 when grinding the plate-like workpiece W in the grinding device 1 and the operation of damping the vibration of the grinding means 10 using the vibration damping mechanism 30 will be described. The plate-like workpiece W is an example of a workpiece, and devices D are formed on the surface Wa in each region partitioned by a grid-like division planned line S, respectively. A back surface Wb that is the surface opposite to the surface Wa of the plate-like workpiece W is a surface to be ground that is ground by the grindstone 16.

板状ワークWの表面Waに保護テープを貼着し、保持テーブル4は、吸引源の作動により板状ワークWの表面Wa側を保持面4aで吸引保持した後、+Y方向に移動し、保持テーブル4を研削手段10の下方に移動させる。   A protective tape is attached to the surface Wa of the plate-like workpiece W, and the holding table 4 moves to the + Y direction and holds after holding the surface Wa side of the plate-like workpiece W by the holding surface 4a by the operation of the suction source. The table 4 is moved below the grinding means 10.

次いで、モータ13が砥石16を回転させるとともに、モータ22がボールネジ21を駆動して研削手段10を−Z方向に下降させ、回転する砥石16を板状ワークWの裏面Wbに押圧して所望の厚みに達するまで研削する。   Next, the motor 13 rotates the grindstone 16, and the motor 22 drives the ball screw 21 to lower the grinding means 10 in the −Z direction, and presses the rotating grindstone 16 against the back surface Wb of the plate-like workpiece W to obtain a desired value. Grind until the thickness is reached.

砥石16を板状ワークWの裏面Wbに当接させて研削する際には、研削抵抗に起因して研削手段10に例えばX軸方向やZ軸方向の振動が発生する。研削手段10の振動の振幅が大きいと、砥石16を構成する砥粒が脱落を起こしたりして砥石16に異常磨耗が発生する。また、振動の影響によって板状ワークWの裏面Wbに砥石16が一定圧力で当たらなくなり板状ワークWの厚み精度の均一性に悪影響を及ぼすという問題も生じる。そこで、制振機構30が研削手段10の振動を制振する。   When grinding is performed with the grindstone 16 in contact with the back surface Wb of the plate-like workpiece W, vibration in the X-axis direction or the Z-axis direction is generated in the grinding means 10 due to the grinding resistance. When the amplitude of the vibration of the grinding means 10 is large, the abrasive grains constituting the grindstone 16 drop off, and abnormal wear occurs on the grindstone 16. Further, there is a problem that the uniformity of the thickness accuracy of the plate-like workpiece W is adversely affected because the grinding stone 16 does not hit the back surface Wb of the plate-like workpiece W at a constant pressure due to the influence of vibration. Therefore, the vibration control mechanism 30 controls the vibration of the grinding means 10.

振動測定手段40は、研削手段10に発生している振動の振動周波数および振幅量を計測し、その値を制御部50に送る。制御部50は、研削手段10に発生している振動周波数に応じて、間隔調整部36a,36bを作動させ、2枚の側板310,311の間隔を調整する。   The vibration measuring unit 40 measures the vibration frequency and amplitude of the vibration generated in the grinding unit 10 and sends the values to the control unit 50. The control unit 50 operates the interval adjusting units 36 a and 36 b in accordance with the vibration frequency generated in the grinding means 10 to adjust the interval between the two side plates 310 and 311.

図4に示すように、間隔調整部36a,36bによって、側板310,311を例えば両者が近づく方向に移動させ、側板310,311で緩衝材33を錘32に向けて押しつぶして側板310と側板311との間隔を狭くする。緩衝材33を押しつぶす度合いを調整することで、錘32の振動周波数を調整することができる。このようにして錘32の振動周波数を調整し、振動測定手段40が計測した研削手段10の振動周波数と錘32の振動周波数とが概ね一致し、研削手段10の振動を打ち消すように錘32を振動させると、研削手段10の振動の振幅を減衰させることができる。   As shown in FIG. 4, the side plates 310 and 311 are moved by, for example, the direction in which the side plates 310 and 311 approach each other by the distance adjusting units 36 a and 36 b, and the side plates 310 and 311 are crushed toward the weight 32 by the cushioning material 33. Narrow the interval. By adjusting the degree of crushing the buffer material 33, the vibration frequency of the weight 32 can be adjusted. In this way, the vibration frequency of the weight 32 is adjusted so that the vibration frequency of the grinding means 10 measured by the vibration measuring means 40 and the vibration frequency of the weight 32 are substantially the same, so that the vibration of the grinding means 10 is canceled. When vibrated, the amplitude of vibration of the grinding means 10 can be attenuated.

また、砥石16に発生する振動の振動測定手段40が計測した振幅量に応じて、図3に示した重量増減部39を用いて錘32の重さを調整する。例えば、硬質の板状ワークを研削することにより振幅が大きくなると、複数の収容穴320に収容する重量増減部39の個数を増やして錘32の重量を大きくする。一方、振幅が小さければ、収容穴320に収容されている重量増減部39を収容穴320から抜き出して錘32の重量を小さくする。このように、研削する板状ワークWの種類や、研削している板状ワークWの状態によって研削手段10の振動の振幅が異なったとしても、錘32は、その重さによって研削手段10の振動の振幅を調整することができる。   Further, the weight 32 is adjusted by using the weight increasing / decreasing unit 39 shown in FIG. 3 according to the amplitude measured by the vibration measuring means 40 of the vibration generated in the grindstone 16. For example, when the amplitude is increased by grinding a hard plate-shaped workpiece, the weight 32 is increased in weight by increasing the number of weight increase / decrease portions 39 accommodated in the plurality of accommodation holes 320. On the other hand, if the amplitude is small, the weight increasing / decreasing portion 39 accommodated in the accommodation hole 320 is extracted from the accommodation hole 320 to reduce the weight of the weight 32. In this way, even if the amplitude of vibration of the grinding means 10 varies depending on the type of the plate-like workpiece W to be ground and the state of the plate-like workpiece W being ground, the weight 32 has the weight of the grinding means 10 depending on its weight. The amplitude of vibration can be adjusted.

また、研削手段10の固有振動数は、錘32の重量によって調整することができる。したがって、収容穴320に収容する重量増減部39の個数を調整して研削手段10の固有振動数を調整することにより、研削手段10の振動を打ち消して研削手段10の振動の振幅を減衰させることができる。   Further, the natural frequency of the grinding means 10 can be adjusted by the weight of the weight 32. Therefore, by adjusting the number of the weight increase / decrease portions 39 accommodated in the accommodation holes 320 and adjusting the natural frequency of the grinding means 10, the vibration of the grinding means 10 is canceled and the vibration amplitude of the grinding means 10 is attenuated. Can do.

以上のように、研削装置1では、錘32の重さを変化させることにより、研削手段10の振動の振幅を調整することができるとともに、固有振動数を調整することができる。また、緩衝材33がつぶれる度合いを調整し振動の周波数を調整して研削手段10の振動を打ち消すように錘32を振動させることにより、研削手段10の振動の振幅を減衰させることができる。したがって、研削手段10の振動の振動周波数や振幅に応じて、研削手段10の振動の制振が可能となる。なお、緩衝材33の個数や材質は、特に限定されるものではないが、緩衝材33としてソルボセインを使用すると、研削手段10の振動をより効果的に抑制することが可能となる。   As described above, in the grinding apparatus 1, by changing the weight of the weight 32, the amplitude of vibration of the grinding means 10 can be adjusted, and the natural frequency can be adjusted. Further, the amplitude of vibration of the grinding means 10 can be attenuated by adjusting the degree of crushing of the buffer material 33 and adjusting the frequency of vibration to vibrate the weight 32 so as to cancel the vibration of the grinding means 10. Therefore, the vibration of the grinding means 10 can be controlled according to the vibration frequency and amplitude of the vibration of the grinding means 10. The number and material of the buffer material 33 are not particularly limited, but if sorbosein is used as the buffer material 33, vibration of the grinding means 10 can be more effectively suppressed.

図5に示す制振機構30aは、制振機構の第2例である。制振機構30aは、側板310と側板311との間隔を調整する間隔調整部36a,36bと、錘32と間隔調整部36bの底板363との間に配設された振動吸収性のある緩衝材35とを備え、底板363は上面11aに載置された構成となっており、それ以外の構成は、制振機構30と同様となっている。緩衝材35は、錘32と底板363との間に少なくとも1つ配設されている。なお、緩衝材35の個数や材質は、特に限定されるものではない。   A vibration damping mechanism 30a shown in FIG. 5 is a second example of the vibration damping mechanism. The vibration damping mechanism 30a is a vibration-absorbing cushioning material disposed between the space adjusting portions 36a and 36b for adjusting the space between the side plate 310 and the side plate 311 and the weight 32 and the bottom plate 363 of the space adjusting portion 36b. 35, and the bottom plate 363 is configured to be placed on the upper surface 11 a, and the other configuration is the same as that of the vibration damping mechanism 30. At least one cushioning material 35 is disposed between the weight 32 and the bottom plate 363. The number and material of the buffer material 35 are not particularly limited.

制振機構30aを用いて図1に示した研削手段10の振動の制振を行う場合は、板状ワークWの研削時において、図1に示した制御部50が間隔調整部36a,36bを作動させ、図6に示すように、側板310,311をX軸方向に互いが近づく方向に移動させ、側板310及び側板311で緩衝材33を錘32に向けて押しつぶしていく。また、緩衝材35がZ軸方向の振動を吸収し、Z軸方向の振動の振幅量を小さくする。このように、制振機構30aでは、錘32と底板363との間に緩衝材35を介在させた構成としたため、Z軸方向の振動も減衰させることができる。   When the vibration of the grinding means 10 shown in FIG. 1 is controlled using the vibration control mechanism 30a, the control unit 50 shown in FIG. As shown in FIG. 6, the side plates 310 and 311 are moved in the X-axis direction so as to approach each other, and the cushioning material 33 is crushed toward the weight 32 by the side plates 310 and 311. In addition, the buffer material 35 absorbs vibration in the Z-axis direction and reduces the amplitude of vibration in the Z-axis direction. Thus, since the damping mechanism 30a has a configuration in which the buffer material 35 is interposed between the weight 32 and the bottom plate 363, vibration in the Z-axis direction can also be attenuated.

図7に示す制振機構30bは、制振機構の第3例である。制振機構30bは、ケーシング37を有しており、ケーシング37の内部に配設された錘32と、ケーシング37を構成する側板370,側板371と、錘32と側板370,371との間に配設された振動吸収性のある緩衝材33と、側板370と側板371との間隔を調整する一対の間隔調整部38とを備えている。側板370,側板371は、断面L字形に形成されており、それぞれの間隔調整部38によって下方から支持されている。   A vibration damping mechanism 30b shown in FIG. 7 is a third example of the vibration damping mechanism. The vibration damping mechanism 30 b includes a casing 37, and includes a weight 32 disposed inside the casing 37, a side plate 370 and a side plate 371 constituting the casing 37, and the weight 32 and the side plates 370 and 371. The vibration-absorbing shock absorbing material 33 and a pair of interval adjusting portions 38 that adjust the interval between the side plate 370 and the side plate 371 are provided. The side plate 370 and the side plate 371 are formed in an L-shaped cross section, and are supported from below by the respective spacing adjustment portions 38.

間隔調整部38は、X軸方向にのびる調整ネジ380と、調整ネジ380の一端に接続されたモータ381と、側板370,側板371をそれぞれ下方から支持する支持台382と、調整ネジ380と平行に配設されたガイドレール383とを少なくとも備えている。側板370,側板371の下部には、脚部372と2つの脚部373とがそれぞれ連結されており、脚部372の中央に形成されたナットが調整ネジ380に螺合している。そして、モータ381が駆動されて調整ネジ380が回動することにより、図8に示すように、側板370,371をガイドレール383に沿ってX軸方向に移動させて両者の間隔を狭め、緩衝材33を押しつぶすことができる。   The interval adjustment unit 38 is parallel to the adjustment screw 380 extending in the X-axis direction, the motor 381 connected to one end of the adjustment screw 380, the support plate 382 for supporting the side plate 370 and the side plate 371 from below, and the adjustment screw 380. And at least a guide rail 383 disposed on the surface. A leg portion 372 and two leg portions 373 are connected to the lower portions of the side plate 370 and the side plate 371, respectively, and a nut formed at the center of the leg portion 372 is screwed into the adjustment screw 380. Then, when the motor 381 is driven and the adjustment screw 380 is rotated, as shown in FIG. 8, the side plates 370 and 371 are moved along the guide rail 383 in the X-axis direction to reduce the distance between the two. The material 33 can be crushed.

また、制振機構30bでは、図7に示すように、錘32の下方に振動測定手段40aが配設されており、振動測定手段40aは制御部50aに接続されている。振動測定手段40aは、スピンドルユニット11側の振動の振動周波数および振幅量を計測して制御部50aに送ることができる。制御部50aは、各制振機構30dに接続されており、振動測定手段40aから送られてきた振動周波数に応じて間隔調整部38が作動し、側板370,371で緩衝材33を押しつぶす。   In the vibration damping mechanism 30b, as shown in FIG. 7, vibration measuring means 40a is disposed below the weight 32, and the vibration measuring means 40a is connected to the control unit 50a. The vibration measuring means 40a can measure the vibration frequency and amplitude of vibration on the spindle unit 11 side and send it to the control unit 50a. The control unit 50a is connected to each vibration control mechanism 30d, and the interval adjustment unit 38 operates according to the vibration frequency sent from the vibration measuring means 40a, and crushes the buffer material 33 with the side plates 370 and 371.

このように、制振機構30bでは、錘32の重さを変化させることにより研削手段10の振動の振幅及び固有振動数を調整することができ、緩衝材33がつぶれる度合いを調整して研削手段10の振動を打ち消すように錘32を振動させて研削手段10の振動の振幅を減衰させることができることに加えて、研削手段10のZ軸方向の振動を吸収して振幅を減衰させることができる。さらに、制御部50aは、振動測定手段40aによる研削手段10の振動周波数の計測値を読み込み、その値に基づきモータ381を制御して側板370,371を移動させて緩衝材33のつぶれ度合いを変化させることができるため、振動周波数に応じて自動的に加工手段10の振動周波数及び振幅量を調整することができる。   Thus, in the vibration damping mechanism 30b, the amplitude of the vibration and the natural frequency of the grinding means 10 can be adjusted by changing the weight of the weight 32, and the grinding means can be adjusted by adjusting the degree to which the cushioning material 33 is crushed. In addition to being able to attenuate the amplitude of the vibration of the grinding means 10 by canceling the weight 32 so as to cancel out the vibration of 10, it is possible to attenuate the amplitude by absorbing the vibration of the grinding means 10 in the Z-axis direction. . Further, the control unit 50a reads the measured value of the vibration frequency of the grinding means 10 by the vibration measuring means 40a, controls the motor 381 based on the value, and moves the side plates 370 and 371 to change the degree of collapse of the buffer material 33. Therefore, it is possible to automatically adjust the vibration frequency and amplitude amount of the processing means 10 according to the vibration frequency.

なお、上記第1〜3の例では、2つの側板310,311がX軸方向に移動して緩衝材をX軸方向につぶす構成としたが、2つの側板310,311に代えて、又は2つの側板310,311に加えて、Y軸方向に移動する2つの側板を設け、緩衝材をY軸方向につぶす構成とすることもできる。
また、振動体には、研削装置1の加工手段10に限らず、他の加工装置の加工手段も含まれる。
In the first to third examples, the two side plates 310 and 311 move in the X-axis direction to crush the cushioning material in the X-axis direction. However, instead of the two side plates 310 and 311, or 2 In addition to the two side plates 310 and 311, two side plates that move in the Y-axis direction may be provided, and the cushioning material may be crushed in the Y-axis direction.
Further, the vibrator includes not only the processing means 10 of the grinding apparatus 1 but also processing means of other processing apparatuses.

2つの側板310,311の間隔を調整して緩衝材33のつぶれ度合いを変更したり、錘32の重さを変更したりしても、それだけでは打ち消すことができない振動が発生することもある。その場合には、緩衝材33の錘32に接する部分の面積及び厚みを調整する。振幅量が大きい場合は、錘32を重くするとともに、緩衝材33の厚みを厚くし、さらに緩衝材33の錘32に接触する部分の面積を大きくする。振幅量が小さい場合は、錘32を軽くするとともに、緩衝材33の厚みを薄くし、さらに緩衝材33の錘32に接触する部分の面積を小さくする。   Even if the distance between the two side plates 310 and 311 is adjusted to change the degree of crushing of the cushioning material 33 or the weight 32 is changed, vibration that cannot be canceled by itself may occur. In that case, the area and thickness of the portion of the cushioning material 33 that contacts the weight 32 are adjusted. When the amplitude is large, the weight 32 is made heavy, the thickness of the buffer material 33 is increased, and the area of the portion of the buffer material 33 that contacts the weight 32 is increased. When the amplitude is small, the weight 32 is lightened, the thickness of the buffer material 33 is reduced, and the area of the portion of the buffer material 33 that contacts the weight 32 is reduced.

1:研削装置 2:装置ベース 2a:上面 3:移動基台 4:保持テーブル
4a:保持面 5:蛇腹 6:コラム
10:研削手段 11:スピンドルユニット 11a 上面
12:ホルダ 13:モータ 14:マウンタ 15:研削ホイール
16:砥石
20:昇降手段 21:ボールネジ 22:モータ 23:ガイドレール 24:昇降板
30,30a,30b,30c,30d,30e:制振機構
31:ケーシング 310,311:側板
32:錘 320:収容穴 33,35:緩衝材
36a,36a,36c:間隔調整部 360:調整ネジ
361:上板 362:底板 363:底板
37:ケーシング 370,371:側板 372:脚部 373:脚部
38:間隔調整部 380:調整ネジ 381:モータ 382:支持台
39:錘部材(重量増減部)
40,40a:振動測定手段 50,50a:制御部
1: Grinding device 2: Device base 2a: Upper surface 3: Moving base 4: Holding table 4a: Holding surface 5: Bellows 6: Column 10: Grinding means 11: Spindle unit 11a Upper surface 12: Holder 13: Motor 14: Mounter 15 : Grinding wheel 16: Grinding wheel 20: Lifting means 21: Ball screw 22: Motor 23: Guide rail 24: Lift plate 30, 30a, 30b, 30c, 30d, 30e: Damping mechanism 31: Casing 310, 311: Side plate 32: Weight 320: receiving hole 33, 35: cushioning material 36a, 36a, 36c: interval adjusting portion 360: adjusting screw 361: upper plate 362: bottom plate 363: bottom plate 37: casing 370, 371: side plate 372: leg portion 373: leg portion 38 : Space adjustment unit 380: Adjustment screw 381: Motor 382: Support base 39: Weight member (weight increase / decrease unit)
40, 40a: Vibration measuring means 50, 50a: Control unit

Claims (3)

振動体の振動を制振する制振機構であって、
錘と、水平方向において該錘を挟む2枚の側板と、該錘と該2枚の側板との間にそれぞれ配設される振動吸収性のある緩衝材と、該2枚の側板の間隔を調整する間隔調整部と、を備え、
該間隔調整部は、該側板の上側の間隔を調整する上側調整部と、該側板の下側の間隔を調整する下側調整部とを備え、
該下側調整部と該錘との間に、振動吸収性のある第2の緩衝材を備え、
該間隔調整部によって該2枚の側板の間隔を調整し、振動の振幅量を減衰させることを特徴とする制振機構。
A vibration control mechanism for controlling vibration of a vibrating body,
A weight, two side plates sandwiching the weight in the horizontal direction, a shock absorbing shock absorbing material disposed between the weight and the two side plates, and a distance between the two side plates. An interval adjusting unit to adjust,
The interval adjustment unit includes an upper adjustment unit that adjusts the upper interval of the side plate, and a lower adjustment unit that adjusts the lower interval of the side plate,
Between the lower adjustment portion and the weight, a second cushioning material having vibration absorption is provided,
A vibration damping mechanism characterized by adjusting the distance between the two side plates by the distance adjusting section to attenuate the amplitude of vibration.
前記錘は、該錘の重さを増減可能とする重量増減部を備え、
該重量増減部で該錘の重さを増減させ、振動を減衰させることを特徴とする請求項1記載の制振機構。
The weight includes a weight increasing / decreasing portion that can increase or decrease the weight of the weight,
2. The vibration control mechanism according to claim 1, wherein the weight is increased or decreased to attenuate the vibration.
板状ワークを保持する保持手段と、該保持手段が保持した板状ワークに砥石を当接させて加工する加工手段と、該加工手段の振動を制振する請求項1又は2に記載の制振機構と、を備えた研削装置であって、
板状ワークに該砥石を当接させ加工時に発生する振動の振動周波数および振幅量を計測する振動測定手段と、
該振動測定手段が計測した計測値に応じて前記間隔調整部を作動させて前記2枚の側板の間隔を調整する制御部と、を備える研削装置。
The holding means for holding the plate-like workpiece, the processing means for making a grinding stone contact with the plate-like workpiece held by the holding means, and the vibration of the processing means are damped. A grinding device comprising a vibration mechanism,
Vibration measuring means for measuring the vibration frequency and amplitude of vibration generated during processing by bringing the grindstone into contact with a plate-like workpiece;
A grinding apparatus comprising: a control unit that operates the interval adjusting unit according to a measurement value measured by the vibration measuring unit to adjust an interval between the two side plates.
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