JP6418740B2 - Holding apparatus, lithographic apparatus, and article manufacturing method - Google Patents

Description

  The present invention relates to a holding device, a lithographic apparatus, and an article manufacturing method.

  In a lithography process which is a manufacturing process of a semiconductor device, a lithography apparatus such as an exposure apparatus is used to transfer an original pattern such as a reticle onto a substrate (a wafer coated with a resist). For example, it is known that a reticle used in an exposure apparatus is deformed (thermally deformed) by causing thermal expansion and contraction. Therefore, if exposure is performed with the reticle deformed, the pattern transferred to the substrate is also deformed (that is, a pattern different from the pattern to be transferred to the substrate is transferred), which affects the overlay accuracy. End up. In view of this, in order to reduce the thermal deformation of the reticle due to exposure light, a technique of flowing a gas over the upper surface of the reticle has been proposed (see Patent Document 1).

JP-A-11-26376

  However, if there is a difference (temperature difference) between the temperature inside the exposure apparatus and the temperature outside the exposure apparatus, immediately after the reticle is carried into the exposure apparatus, the temperature between the exposure apparatus and the reticle is between A difference (temperature difference) occurs. In such a case, since the reticle is deformed due to thermal expansion and contraction, the overlay accuracy is affected as described above. Accordingly, it is necessary to leave (hold) the reticle for a certain period of time until the temperature of the reticle reaches the temperature in the exposure apparatus (that is, the temperature of the reticle is stabilized). Thus, the time provided for removing the difference between the temperature in the exposure apparatus and the temperature of the reticle reduces the productivity (throughput) of the exposure apparatus.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a holding device that is advantageous for stabilizing the temperature of a plate.

In order to achieve the above object, a holding device according to one aspect of the present invention is a holding device that holds a plate, and is opposed to the plate supported by the support member and the plate supported by the support member. The plate-shaped member arranged and the jet port for ejecting fluid, and the jet port in the space between the plate and the plate-shaped member so that a part of the fluid hits the side surface of the plate-shaped member An amount of fluid that is ejected from the ejection port and impinges on the side surface of the plate-like member. than, as the amount of fluid is reduced to hitting the sides of the plate is injected from the injection port, the injection port is remote from the plate and the plate-like member in a direction parallel to the surface of the plate-position In there, and is characterized in that in a position closer to the plate-like member than said plate in a direction perpendicular to a surface of the plate.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide a holding device advantageous for stabilizing the temperature of a plate.

It is the schematic which shows the structure of the holding | maintenance apparatus as 1 side surface of this invention. It is an enlarged view of the vicinity of the injection port of a supply mechanism. It is an enlarged view of the vicinity of the injection port of the supply mechanism in 1st Embodiment. It is the schematic which shows the structure of the holding | maintenance apparatus as 1 side surface of this invention. It is an enlarged view of the vicinity of the injection port of the supply mechanism in 2nd Embodiment. It is an enlarged view of the vicinity of the injection port of the supply mechanism in 3rd Embodiment. It is an enlarged view of the vicinity of the injection port of the supply mechanism in 4th Embodiment. It is an enlarged view of the vicinity of the injection port of the supply mechanism in 5th Embodiment. It is a figure which shows an example of the shape of a plate-shaped member. 1 is a schematic diagram showing a configuration of a lithographic apparatus as one aspect of the present invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

<First Embodiment>
FIG. 1 is a schematic view showing a configuration of a holding device 100 according to one aspect of the present invention. The holding device 100 is applied to an exposure apparatus having a projection optical system that projects a reticle or mask (original) pattern onto a substrate. The holding device 100 is suitable as a holding device that holds a plate such as a reticle on which a pattern is formed or a substrate (wafer or glass plate) on which the pattern is formed. The holding device 100 holds the reticle and the substrate carried into the exposure apparatus for a certain period of time until the temperature of the reticle or substrate reaches the temperature in the exposure apparatus (temperature stabilizes), that is, the temperature in the exposure apparatus and the outside of the exposure apparatus. It is a holding | maintenance apparatus for removing the temperature difference with the temperature of.

  In the present embodiment, the holding device 100 includes a base plate 101, a support member 102, a plate-like member 103, and a supply mechanism 104 as shown in FIG. 1. In the present embodiment, a case where the holding device 100 holds a reticle will be described as an example.

  The support member 102 is disposed on the base plate 101 and supports the back surface 201 b of the reticle 201. Since the reticle 201 generally has a rectangular shape, the support member 102 supports, for example, four corners of the reticle 201 (that is, supports the reticle 201 at four points). Here, the surface opposite to the surface on which the pattern is formed is the front surface 201a of the reticle 201, and the surface on which the pattern is formed is the back surface 201b of the reticle 201.

  The plate-like member 103 is disposed so as to face the surface on the support side of the reticle 201, that is, the surface 201a opposite to the back surface 201b (at a position away from the surface 201a of the reticle 201 by a certain distance). The plate member 103 forms a flow path for the gas supplied from the supply mechanism 104 in the space SP between the surface 201 a of the reticle 201 and the plate member 103. In the present embodiment, the distance between the surface 201a of the reticle 201 and the plate member 103 is 5 mm. However, the distance between the surface 201a of the reticle 201 and the plate member 103 is not limited to 5 mm, and may be other than 5 mm. Further, the plate-like member 103 is configured such that the thickness of the plate-like member 103 is thinner than the thickness of the reticle 201, and is a sheet metal having a thickness of 1 mm in the present embodiment.

The supply mechanism 104 includes an injection port 105 that injects gas, and supplies gas to the space SP between the surface 201 a of the reticle 201 and the plate-like member 103 via the injection port 105. In the present embodiment, the ejection port 105 is formed by a line-shaped slit, but the ejection port 105 may be formed by tubes arranged at regular intervals. The supply mechanism 104 is not limited to gas, and may be a liquid such as pure water, brine, or cooling oil (C-oil), and can supply a fluid (heat medium). In particular, in this embodiment, clean dry air whose temperature is adjusted to the temperature in the apparatus is supplied as the gas. However, the supply mechanism 104 may supply clean air, nitrogen, oxygen, or a mixed gas thereof in addition to clean dry air.

  The ejection port 105 is disposed at a position away from the reticle 201 and the plate-like member 103 in a direction parallel to the surface 201a of the reticle 201. In this embodiment, the ejection port 105 is disposed at a position where the distance from the side surface 201c of the reticle 201 is 6 mm. ing. However, the distance between the side surface 201c of the reticle 201 and the ejection port 105 is not limited to 6 mm, and may be other than 6 mm. Further, the ejection port 105 is closer to the plate member 103 than the reticle 201 in the direction perpendicular to the surface 201 a of the reticle 201, that is, from an intermediate position IP between the surface 201 a of the reticle 201 and the plate member 103. It arrange | positions at the plate-shaped member side. Further, the injection port 105 (the gas injection direction) faces the direction parallel to the surface 201 a of the reticle 201.

  Here, as shown in FIG. 2, consider a case where the injection port 105 is arranged at an intermediate position IP between the surface 201 a of the reticle 201 and the plate member 103 in the direction perpendicular to the surface 201 a of the reticle 201. Referring to FIG. 2, the gas GS <b> 1 injected from the injection port 105 diffuses while enclosing the surrounding gas GS <b> 2, and a space SP between the surface 201 a of the reticle 201 and the plate-like member 103 while amplifying the flow rate. To be supplied. However, since the gas GS1 injected from the injection port 105 and a part of the surrounding gas GS2 collide with the side surface 201c of the reticle 201, the surface 201a of the reticle 201 and the plate member 103 It is not supplied to the space SP. Further, the gas GS3 colliding with the side surface 201c of the reticle 201 becomes resistance, and the amplification of the flow rate of the gas supplied to the space SP between the surface 201a of the reticle 201 and the plate member 103 is hindered. Therefore, the time required for the temperature of the reticle 201 held by the holding device 100 to reach the temperature in the device is increased, and the productivity (throughput) of the exposure apparatus is reduced.

  Therefore, in the present embodiment, as described above, the ejection port 105 is disposed at a position closer to the plate-like member 103 than the reticle 201 in the direction perpendicular to the surface 201a of the reticle 201, and the ejection port 105 is the reticle 201. It faces the direction parallel to the surface 201a. Thereby, as shown in FIG. 3, the gas GS <b> 1 injected from the injection port 105 diffuses while entraining the surrounding gas GS <b> 2, and does not hit the side surface 201 c of the reticle 201, and the surface 201 a of the reticle 201 and the plate-like member 103. To the space SP.

  On the other hand, part of the gas GS4 out of the gas GS1 and the surrounding gas GS2 injected from the injection port 105 collides with the side surface 103a of the plate-like member 103. However, since the plate-like member 103 is a sheet metal (that is, thin), the gas GS4 colliding with the side surface 103a of the plate-like member 103 flows along the surface 103b of the plate-like member 103. Therefore, the amount of gas rebounded on the side surface 103a of the plate-like member 103 is suppressed to a small amount, and the resistance due to the gas GS4 colliding with the side surface 103a of the plate-like member 103 can be reduced compared to the side surface 201c of the reticle 201. it can.

  As described above, according to the holding device 100 of the present embodiment, a large amount of gas is introduced into the space without hindering amplification of the flow rate of the gas supplied to the space SP between the surface 201a of the reticle 201 and the plate member 103. Can be supplied to SP. Therefore, it is possible to shorten the time required for the temperature of the reticle 201 held by the holding device 100 to reach the temperature in the apparatus, and improve the productivity of the exposure apparatus.

In the present embodiment, the injection port 105 is arranged so that the gas GS1 injected from the injection port 105 does not hit the side surface 201c of the reticle 201, but the arrangement of the injection port 105 is not limited to this. . Specifically, the injection port is such that the amount of gas injected from the injection port 105 and hitting the side surface 201c of the reticle 201 is smaller than the amount of gas injected from the injection port 105 and hitting the side surface 103a of the plate-like member 103. 105 may be arranged.

<Second Embodiment>
FIG. 4 is a schematic diagram showing the configuration of a holding device 100A as one aspect of the present invention. The holding device 100A is a holding device that holds a reticle such as a reticle on which a pattern is formed or a substrate (wafer or glass plate) on which the pattern is formed, and has the same configuration as the holding device 100 as shown in FIG. Have The holding device 100 </ b> A differs from the holding device 100 in the arrangement of the ejection ports 105. However, also in this embodiment, the amount of gas injected from the injection port 105 and hitting the side surface 201c of the reticle 201 is smaller than the amount of gas injected from the injection port 105 and hitting the side surface 103a of the plate-like member 103. The injection port 105 is disposed.

  With reference to FIG. 5, arrangement | positioning of the injection port 105 in this embodiment is demonstrated. The ejection port 105 is disposed at a position away from the reticle 201 and the plate-like member 103 in a direction parallel to the surface 201 a of the reticle 201. Further, the ejection port 105 is closer to the reticle 201 than the plate member 103 in the direction perpendicular to the surface 201 a of the reticle 201, that is, from an intermediate position IP between the surface 201 a of the reticle 201 and the plate member 103. Arranged on the reticle side. Further, the injection port 105 (the gas injection direction) faces the plate-like member side, not the direction parallel to the surface 201 a of the reticle 201.

  As shown in FIG. 5, the gas GS <b> 1 injected from the injection port 105 diffuses while entraining the surrounding gas GS <b> 2, and does not hit the side surface 201 c of the reticle 201, so that the space between the surface 201 a of the reticle 201 and the plate member 103 is To the space SP. Further, a part of the gas GS4 out of the gas GS1 and the surrounding gas GS2 injected from the injection port 105 collides with the side surface 103a of the plate-like member 103. However, as described above, the gas GS4 that has collided with the side surface 103a of the plate-like member 103 flows along the surface 103b of the plate-like member 103. Therefore, the amount of gas rebounded on the side surface 103a of the plate-like member 103 is suppressed to a small amount, and the resistance due to the gas GS4 colliding with the side surface 103a of the plate-like member 103 can be reduced compared to the side surface 201c of the reticle 201. it can.

  As described above, according to the holding device 100A of the present embodiment, a large amount of gas is introduced into the space without disturbing amplification of the flow rate of the gas supplied to the space SP between the surface 201a of the reticle 201 and the plate-like member 103. Can be supplied to SP. Therefore, it is possible to shorten the time required for the temperature of the reticle 201 held by the holding apparatus 100A to reach the temperature in the apparatus, and improve the productivity of the exposure apparatus.

<Third Embodiment>
FIG. 6 is an enlarged view of the vicinity of the injection port 105 of the supply mechanism 104 of the holding device according to one aspect of the present invention. The holding device in the present embodiment has the same configuration as the holding device 100 and the holding device 100A. This embodiment differs in arrangement | positioning of the injection port 105 compared with 1st Embodiment or 2nd Embodiment. However, also in this embodiment, as in the first embodiment, the amount of gas that is injected from the injection port 105 and hits the side surface 201c of the reticle 201 and the side surface 103a of the plate-like member 103 satisfies the following relationship: An injection port 105 is disposed. That is, as the amount of gas strikes is injected from the injection port 105 on the side surface 201c of the reticle 201 becomes less than the amount of gas striking is injected from the injection port 105 to the side surface 103a of the plate member 103, place the injection port 105 doing.

  With reference to FIG. 6, the arrangement | positioning of the injection port 105 in this embodiment is demonstrated. The ejection port 105 is disposed at a position away from the reticle 201 and the plate-like member 103 in a direction parallel to the surface 201 a of the reticle 201. Further, the ejection port 105 is closer to the plate member 103 than the reticle 201 in the direction perpendicular to the surface 201 a of the reticle 201, that is, from an intermediate position IP between the surface 201 a of the reticle 201 and the plate member 103. It arrange | positions at the plate-shaped member side. Further, the injection port 105 (the gas injection direction) faces the plate-like member side, not the direction parallel to the surface 201 a of the reticle 201.

  As shown in FIG. 6, the gas GS <b> 1 ejected from the ejection port 105 diffuses while enclosing the surrounding gas GS <b> 2, and does not hit the side surface 201 c of the reticle 201, so that the space between the surface 201 a of the reticle 201 and the plate member 103. To the space SP. Further, a part of the gas GS4 out of the gas GS1 and the surrounding gas GS2 injected from the injection port 105 collides with the side surface 103a of the plate-like member 103. However, as described above, the gas GS4 that has collided with the side surface 103a of the plate-like member 103 flows along the surface 103b of the plate-like member 103. Therefore, the amount of gas rebounded on the side surface 103a of the plate-like member 103 is suppressed to a small amount, and the resistance due to the gas GS4 colliding with the side surface 103a of the plate-like member 103 can be reduced compared to the side surface 201c of the reticle 201. it can.

  Thus, according to the holding device of the present embodiment, a large amount of gas is allowed to flow into the space SP without hindering amplification of the flow rate of the gas supplied to the space SP between the surface 201a of the reticle 201 and the plate member 103. Can be supplied to. Therefore, it is possible to shorten the time required for the temperature of the reticle 201 held by the holding device to reach the temperature in the apparatus, and improve the productivity of the exposure apparatus.

<Fourth Embodiment>
FIG. 7 is an enlarged view of the vicinity of the injection port 105 of the supply mechanism 104 of the holding device according to one aspect of the present invention. The holding device in the present embodiment further includes an adjustment mechanism 109 in addition to the same configuration as the holding device 100 and the holding device 100A.

  The adjustment mechanism 109 includes, for example, a holding mechanism that holds the supply mechanism 104, a moving mechanism that moves the supply mechanism 104 in a direction perpendicular to the surface 201a of the reticle 201, a rotation tilt mechanism that rotates or tilts the supply mechanism 104, and the like. In this embodiment, the adjustment mechanism 109 adjusts the position of the ejection port 105 and the direction of the ejection port 105 in the direction perpendicular to the surface 201 a of the reticle 201. The adjusting mechanism 109 is configured so that the amount of gas injected from the injection port 105 and hitting the side surface 201c of the reticle 201 is smaller than the amount of gas injected from the injection port 105 and hitting the side surface 103a of the plate-like member 103. 105 can be arranged.

  For example, in FIG. 7, the adjustment mechanism 109 arranges the ejection port 105 at a position closer to the plate-like member 103 than the reticle 201 in the direction perpendicular to the surface 201 a of the reticle 201, and the ejection port 105 is located on the reticle 201. It faces the direction parallel to the surface 201a. In other words, the adjustment mechanism 109 determines the position of the injection port 105 in the direction perpendicular to the surface 201a of the reticle 201 and the injection port so that the arrangement of the injection port 105 is the arrangement shown in FIG. 3 (first embodiment). The direction of 105 is adjusted. Further, the adjustment mechanism 109 is perpendicular to the surface 201a of the reticle 201 so that the injection port 105 is arranged as shown in FIG. 5 (second embodiment) or as shown in FIG. 6 (third embodiment). It is also possible to adjust the position of the injection port 105 and the direction of the injection port 105 in any direction.

  In the present embodiment, the adjustment mechanism 109 adjusts both the position of the ejection port 105 and the direction of the ejection port 105 in the direction perpendicular to the surface 201 a of the reticle 201. However, the adjustment mechanism 109 may be configured to adjust at least one of the position of the ejection port 105 in the direction perpendicular to the surface 201 a of the reticle 201 and the direction of the ejection port 105.

  According to the holding device of the present embodiment, as in the above-described embodiment, a large amount of gas is supplied without hindering the amplification of the flow rate of the gas supplied to the space SP between the surface 201a of the reticle 201 and the plate-like member 103. Gas can be supplied to the space SP. Therefore, it is possible to shorten the time required for the temperature of the reticle 201 held by the holding device to reach the temperature in the apparatus, and improve the productivity of the exposure apparatus.

<Fifth Embodiment>
FIG. 8 is an enlarged view of the vicinity of the injection port 105 of the supply mechanism 104 of the holding device according to one aspect of the present invention. The holding device in the present embodiment further includes an adjustment mechanism 109, a first detection unit 110, a second detection unit 111, and a control unit 112 in addition to the same configuration as the holding device 100 and the holding device 100A.

  The first detection unit 110 includes a flow rate sensor that detects the flow rate of gas, and the gas that is injected from the injection port 105 of the supply mechanism 104 and passes through the space SP between the surface 201 a of the reticle 201 and the plate-like member 103. Detect the amount of.

  Similar to the first detection unit 110, the second detection unit 111 includes a flow rate sensor that detects a gas flow rate. The second detection unit 111 detects the amount of gas that is injected from the injection port 105 of the supply mechanism 104 and flows along the surface 103 b of the plate-like member 103.

  The control unit 112 controls the adjustment mechanism 109 to adjust at least one of the position of the ejection port 105 and the direction of the ejection port 105 in the direction perpendicular to the surface 201 a of the reticle 201. In the present embodiment, the control unit 112 controls the adjustment of the position and orientation of the injection port 105 by the adjustment mechanism 109 so that the flow rate of the gas detected by the first detection unit 110 becomes a predetermined amount or more, for example, the maximum. To do. Further, the control unit 112 determines the position and orientation of the ejection port 105 by the adjustment mechanism 109 so that the gas flow rate detected by the first detection unit 110 is larger than the gas flow rate detected by the second detection unit 110. It is also possible to control the adjustment of. Specifically, the position of the injection port 105 by the adjustment mechanism 109 is adjusted so that the gas flow rate detected by the first detection unit 110 is maximized and the gas flow rate detected by the second detection unit 110 is minimized. Control orientation adjustment.

  As described above, according to the holding device of the present embodiment, the position of the injection port 105 is set so that the amount of the gas that has passed through the space SP between the surface 201a of the reticle 201 and the plate-like member 103 is equal to or greater than a predetermined amount. And the orientation can be adjusted. In other words, the position and orientation of the ejection port 105 can be adjusted so that the gas ejected from the ejection port 105 is efficiently supplied to the space SP. In FIG. 8, the arrangement of the injection ports 105 is the arrangement shown in FIG. 3 (first embodiment), but the arrangement shown in FIG. 5 (second embodiment) and FIG. 6 (third embodiment). The arrangement shown in (form) may be sufficient.

  According to the holding device of the present embodiment, as in the above-described embodiment, a large amount of gas is supplied without hindering the amplification of the flow rate of the gas supplied to the space SP between the surface 201a of the reticle 201 and the plate-like member 103. Gas can be supplied to the space SP. Therefore, it is possible to shorten the time required for the temperature of the reticle 201 held by the holding device to reach the temperature in the apparatus, and improve the productivity of the exposure apparatus.

  In the first to fifth embodiments, the plate-like member 103 has been described as a flat plate shape. However, the plate-like member 103 causes the gas colliding with the side surface 103b of the plate-like member 103 to flow to the surface of the plate-like member 103. You may have the shape for flowing more efficiently along 103a. In other words, the plate-like member 103 has a shape for reducing the amount of gas bounced off at the side surface 103 a of the plate-like member 103. For example, as shown in FIG. 9A and FIG. 9C, the plate-like member 103 has the surface of the gas injected from the injection port 105 in the cross section perpendicular to the surface 201a and the side surface 201c of the reticle 201. It has a curved surface shape for flowing along 103a at the end on the injection port side. Specifically, the plate-like member 103 has a blade shape at the end on the injection port side in FIG. 9A, and has an elliptical shape at the end on the injection port side in FIG. 9C. Further, as shown in FIG. 9B, the plate-like member 103 causes the gas injected from the injection port 105 to flow along the surface 103a in a cross section perpendicular to the surface 201a and the side surface 201c of the reticle 201. May be provided at the end on the injection port side. Specifically, in FIG. 9B, the plate-like member 103 has a cutting edge shape at the end on the injection port side.

<Sixth Embodiment>
FIG. 10 is a schematic diagram showing a configuration of a lithographic apparatus 1 as one aspect of the present invention. The lithographic apparatus 1 is an apparatus for forming an original pattern on a substrate, and is embodied as an exposure apparatus in this embodiment. Note that the lithography apparatus 1 is not limited to an exposure apparatus. For example, an imprint material (resin or the like) on a substrate is molded (molded) with an original plate (mold) to form a pattern on the substrate. It may be an imprint apparatus.

  The lithography apparatus 1 includes a reticle transport system 10, a foreign matter inspection unit 20, a processing unit 30, and a holding device 100. However, the holding device 100 can be replaced with any of the holding devices in the above-described embodiments.

  The reticle transport system 10 includes a transport hand, and transports the reticle among the reticle carry-in port RT, the holding device 100, the foreign matter inspection unit 20, and the processing unit 30. The foreign matter inspection unit 20 inspects whether foreign matter is attached to the reticle. The processing unit 30 includes a reticle stage that holds the reticle, an illumination optical system that illuminates the reticle, a projection optical system that projects the reticle pattern onto the substrate, a substrate stage that holds the substrate, and the like, and performs exposure processing on the substrate. . Here, the exposure process is a process in which the reticle is illuminated by the illumination optical system, and light from the reticle pattern is projected onto the substrate through the projection optical system (that is, the reticle pattern is transferred to the substrate). is there.

  The holding device 100 conveys the reticle between a reticle carry-in port RT for carrying a reticle as an original into the lithography apparatus 1 and a processing position for forming a reticle pattern on the substrate (that is, the processing unit 30). Placed in the path. The holding apparatus 100 holds the reticle for a certain period of time until the temperature of the reticle carried into the lithography apparatus 1 reaches the temperature inside the apparatus.

  As described above, the lithographic apparatus 1 can supply a large amount of gas to the space between the surface of the reticle and the plate-like member 103 by using the holding device 100, and the temperature of the reticle is increased in the apparatus. The time required to reach the temperature can be shortened. Therefore, the lithographic apparatus 1 can manufacture articles such as semiconductor devices with excellent productivity.

<Seventh Embodiment>
The method for manufacturing an article in the embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. Such a manufacturing method includes a step of forming a pattern on a substrate coated with a photosensitive agent using the lithography apparatus 1 and a step of processing (for example, developing) the substrate on which the pattern is formed. Further, following the above formation step, the manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist peeling, dicing, bonding, packaging, and the like). The method for manufacturing an article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

Claims (19)

A holding device for holding a plate,
A support member for supporting the plate;
A plate-like member disposed to face the plate supported by the support member;
Supplying the fluid via the ejection port to a space between the plate and the plate-like member so that a part of the fluid hits a side surface of the plate-like member, including an ejection port for ejecting the fluid A mechanism, and
The plate-like member is thinner than the plate,
The injection port is a surface of the plate so that the amount of fluid that is injected from the injection port and hits the side surface of the plate is smaller than the amount of fluid that is injected from the injection port and hits the side surface of the plate-like member. The holding device is located at a position away from the plate and the plate-like member in a direction parallel to the plate and at a position closer to the plate-like member than the plate in a direction perpendicular to the surface of the plate. .   The holding device according to claim 1, wherein the ejection port faces a direction parallel to the surface of the plate. A holding device for holding a plate,
A support member for supporting the plate;
A plate-like member disposed to face the plate supported by the support member;
A supply mechanism for supplying fluid to the space between the plate and the plate-like member through the injection port,
The plate-like member is thinner than the plate,
The injection port is a surface of the plate so that the amount of fluid that is injected from the injection port and hits the side surface of the plate is smaller than the amount of fluid that is injected from the injection port and hits the side surface of the plate-like member. The holding device is located at a position away from the plate and the plate-like member in a direction parallel to the plate, and faces the plate-like member side of the plate and the plate-like member. A holding device for holding a plate,
A support member for supporting the plate;
A plate-like member disposed to face the plate supported by the support member;
A supply mechanism for supplying fluid to the space between the plate and the plate-like member through the injection port,
The plate-like member is thinner than the plate,
The injection port is a surface of the plate so that the amount of fluid that is injected from the injection port and hits the side surface of the plate is smaller than the amount of fluid that is injected from the injection port and hits the side surface of the plate-like member. In a direction parallel to the plate and the plate-like member, in a direction perpendicular to the surface of the plate, closer to the plate-like member than the plate, and the plate and the plate-like member The holding device characterized by facing the plate-like member side of the member.   The holding device according to claim 1, wherein the fluid includes clean dry air.   An adjusting means for reducing the amount of fluid impinging on the side surface of the plate by adjusting at least one of the position of the injection port in the direction perpendicular to the surface of the plate and the direction of the injection port. Item 6. The holding device according to any one of Items 1 to 5. A detection unit that detects an amount of fluid that has been ejected from the ejection port and passed through the space;
The holding device according to claim 6, further comprising a control unit that controls adjustment by the adjustment unit so that the amount of fluid detected by the detection unit is equal to or greater than a predetermined amount.   The plate-like member has a curved surface shape for flowing the fluid ejected from the ejection port along the surface at the end on the ejection port side in a cross section in a direction perpendicular to the surface of the plate and the side surface of the plate. The holding device according to claim 1, wherein the holding device is provided.   The plate-like member has an acute-angled shape for flowing the fluid ejected from the ejection port along the surface at the end portion on the ejection port side in a cross section perpendicular to the surface of the plate and the side surface of the plate. The holding device according to claim 1, wherein the holding device is provided. A holding device for holding a plate,
A support member for supporting the plate;
A plate-like member disposed to face the plate supported by the support member;
A supply mechanism for supplying fluid to the space between the plate and the plate-like member through the injection port,
The injection port is located away from the plate and the plate-like member in a direction parallel to the surface of the plate, and is closer to the plate-like member than the plate in a direction perpendicular to the surface of the plate Therefore, the amount of the fluid ejected from the ejection port and hitting the side surface of the plate is smaller than the amount of the fluid ejected from the ejection port and hitting the side surface of the plate-like member. . A holding device for holding a plate,
A support member for supporting the plate;
A plate-like member disposed to face the plate supported by the support member;
A supply mechanism for supplying fluid to the space between the plate and the plate-like member through the injection port,
The injection port is located away from the plate and the plate-like member in a direction parallel to the surface of the plate, and is disposed facing the plate-like member side of the plate and the plate-like member. Accordingly, the amount of the fluid ejected from the ejection port and hitting the side surface of the plate is smaller than the amount of the fluid ejected from the ejection port and hitting the side surface of the plate-like member. A holding device for holding a plate,
A support member for supporting the plate;
A plate-like member disposed to face the plate supported by the support member;
A supply mechanism for supplying fluid to the space between the plate and the plate-like member through the injection port,
The injection port is located away from the plate and the plate member in a direction parallel to the surface of the plate, and is closer to the plate member than the plate in a direction perpendicular to the surface of the plate. And it arrange | positions facing the said plate-shaped member side among the said plate and the said plate-shaped member, from the said injection port rather than the quantity of the fluid which is injected from the said injection port and hits the side surface of the said plate-shaped member. A holding device, wherein the amount of fluid that is jetted and impinges on a side surface of the plate is reduced.   The holding device according to any one of claims 10 to 12, wherein a thickness of the plate-like member is thinner than a thickness of the plate.   The holding device according to any one of claims 1 to 13, wherein the ejection port is located between the plate and the plate-like member in a direction perpendicular to a surface of the plate.   15. The holding apparatus according to claim 1, wherein the plate is an original plate on which a pattern is formed or a substrate on which a pattern is formed. A lithographic apparatus for forming an original pattern on a substrate,
A lithographic apparatus, comprising the holding device according to claim 1, wherein the original plate is held as the plate.   The holding device is disposed in a transport path of the original plate between a carry-in port for carrying the original plate into the lithography apparatus and a processing position for forming a pattern of the original plate on the substrate. A lithographic apparatus according to claim 16, characterized in that   The lithographic apparatus according to claim 16, further comprising a projection optical system that projects the pattern of the original plate onto the substrate. Forming a pattern on a substrate using the lithographic apparatus according to any one of claims 16 to 18,
Processing the substrate on which the pattern has been formed in the step;
And manufacturing the article from the processed substrate.

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