JP6422673B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a substrate using a processing liquid. Substrates to be processed include, for example, semiconductor wafers, glass substrates for liquid crystal display devices, plasma display substrates, FED (Field Emission Display) substrates, OLED (organic electroluminescence) substrates, optical disk substrates, and magnetic disk substrates. Substrates such as a substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, and a solar cell substrate are included.

In the manufacturing process of a semiconductor device or a liquid crystal display device, a treatment liquid is supplied to the surface of a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel, and the surface of the substrate is washed with the treatment liquid. The substrate processing apparatus includes a processing unit that processes substrates one by one and a processing liquid supply device that supplies a processing liquid to the processing unit.
In the following Patent Document 1, a method of providing an energy saving mode for each processing unit is disclosed. In Patent Document 1, the time required for recovery (recovery time) is stored, and the recovery start time is calculated in consideration of this recovery time. When the recovery start time is reached, recovery of the corresponding processing unit is started. .

Japanese Patent No. 5091413

In the method of Patent Document 1, since the recovery start time is calculated in consideration of the recovery time, it is necessary to grasp the time used by the processing unit.
However, there is a case where the timing at which the substrate is carried into each processing unit is not known in advance. Further, in an apparatus or the like in which a plurality of processing units operate simultaneously, a change in the operating status of a specific processing unit may cause a change in the operating status of another processing unit. In such a case, there is a risk that the reliability of the relatively calculated recovery start time may be reduced.

In the method of Patent Document 1, it is necessary to review the processing schedule based on the calculated recovery start time.
In any case, the technique of Patent Document 1 cannot suitably provide the power saving mode (energy saving mode).
SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus that can suitably provide a power saving mode, thereby reducing the power used in the processing liquid supply apparatus.

In order to achieve the above object, according to the first aspect of the present invention, there is provided a substrate holding means (63) for holding the substrate (W), and a processing liquid is discharged to the substrate held by the substrate holding means. A processing liquid nozzle (64, 65), and a position of the processing liquid nozzle positioned above the substrate held by the substrate holding means, and a home position positioned on the side of the substrate held by the substrate holding means. A processing unit for performing processing using a processing liquid on a substrate held by the substrate holding means. 8), a processing liquid tank (11, 31) for storing the processing liquid , and a circulation pipe (12, 32) having both ends connected to the processing liquid tank, and the processing liquid tank and the circulation pipe are connected to each other. a treatment liquid circulating in the circulation path including A serial processing process liquid supply apparatus which subjected the sheet to the unit (5,6), as a trigger a predetermined second machine operation of the processing unit, the processing liquid supply apparatus can be used in the processing liquid processing of the processing unit From the process mode capable of supplying a simple processing liquid to the processing unit, the power saving mode in which the power for maintaining at least one of the temperature and the flow rate of the processing liquid circulating in the circulation path at a predetermined value is reduced as compared with the process mode. And a mode switching means (7) for switching the processing liquid supply device from the power saving mode to the process mode using a predetermined first machine operation of the processing unit as a trigger, and the first machine operation After, the nozzle moving unit is controlled to start moving the processing liquid nozzle from the home position toward the processing position. And a turning control means (7), said predetermined value in the Ministry for force mode, before the timing of the treatment liquid nozzle is disposed in the processing position by the nozzle moving unit, said processing to said process mode is set to the liquid supply device so that the recoverable state, a substrate processing apparatus (1).

In this section, the alphanumeric characters in parentheses represent reference signs of corresponding components in the embodiments described later, but the scope of the claims is not limited to the embodiments by these reference numerals.
According to this configuration, the evacuation from the process mode and the power saving mode is performed using the machine operation as a trigger. That is, it is not necessary to set in advance the time for evacuation from the process mode and the power saving mode. Therefore, in a situation where it is difficult to determine the transition time, it is possible to retreat from the process mode and the power saving mode with good timing. Therefore, it is possible to suitably provide a power saving mode in the processing liquid supply device, thereby reducing the power used in the processing liquid supply device.

In other words , the state of the processing liquid supply apparatus that is controlled to the power saving mode assumes that the processing liquid supply apparatus performs the processing when the process mode is executed subsequent to the saving of the power saving mode. a short period of time (return immediately) that can be returned to the liquid can be supplied state situations that der.

Also, the second machine operation is used as a trigger to switch from the process mode to the power saving mode. The first machine operation is a trigger to switch from the power saving mode to the process mode. Since the power saving mode returns to the process mode without passing through the intermediate mode such as the recovery mode, the processing liquid supply device can be changed to a state in which the processing liquid ready for processing liquid processing can be immediately supplied to the processing unit. It can be restored in time.

The invention according to claim 2, wherein the process liquid supply apparatus, prior Symbol circulation pipe further includes a temperature adjusting mechanism for adjusting the temperature of the process liquid flowing through (13, 33), said Ministry for force mode, the temperature adjustment The substrate processing apparatus according to claim 1, comprising a mode in which a power consumption of the mechanism is reduced as compared with the process mode.

According to this configuration, the power saving mode is a mode in which the power consumption of the temperature adjustment mechanism that adjusts the temperature of the processing liquid flowing through the circulation pipe is reduced compared to that in the process mode. Therefore, the power consumption can be reduced in the substrate processing apparatus by executing the power saving mode.
In the case where a plurality of the processing units are provided, a circulation pipe may be shared by the plurality of the processing units.

According to a third aspect of the present invention, the processing liquid supply device further includes a pump (14) for sending the processing liquid stored in the processing liquid tank to the circulation pipe , wherein the power saving mode is the circulation. 3. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus includes a mode in which a circulation flow rate of the processing liquid in the pipe is reduced as compared with the process mode.

According to this configuration, the power saving mode is a mode in which the circulating flow rate is reduced as compared with that in the process mode. Therefore, by using the power saving mode, it is possible to reduce the driving air usage in the substrate processing apparatus. Such a saving for the force mode, Ru Oh in a mode to reduce the driving air of the pump. More specifically, it is possible to exemplify a mode in which the driving air pressure and / or the number of times of driving of the pump that pumps the processing liquid stored in the processing liquid tank to the processing liquid supply pipe is lower than the process mode. .

In the case where a plurality of the processing units are provided, a circulation pipe may be shared by the plurality of the processing units.
As described in claim 4, wherein the processing unit is pre SL has further Chang bus (62) for accommodating the substrate holding means, said first machine operation, the substrate carries the substrate into the chamber carrying It may be an action.

Further, as described in claim 5 , the chamber has a side wall (61) surrounding the substrate holding means and an opening (67) formed in the side wall for carrying the substrate in and out. The substrate processing apparatus according to claim 4 , further comprising: a shutter (68) that closes, wherein the substrate carry-in operation is an opening operation of the shutter.
Further, as described in claim 6 , the substrate carrying-in operation may be a holding operation of the substrate by the substrate holding means.

The invention according to claim 7, before Symbol second machine operation may be a retreating operation of the treatment liquid nozzle from the processing position.

The invention according to claim 8 is a machine operation-saving-power mode correspondence that defines a correspondence relationship between the first and / or second machine operation and the evacuation state from the process mode and / or the saving-power mode. table storage unit for storing a table comprises a (53), said mode switching means, the table storage unit to the stored previous SL machine械動work - on the basis of the saving for the power mode correspondence table, the said processing liquid supply unit controlling the evacuation from the process mode and / or the Ministry for force mode, a substrate processing apparatus according to any one of claims 1-7.

According to this configuration, the process mode from the power saving mode and / or the saving from the power saving mode of the processing liquid supply device is controlled based on the stored table machine operation-saving power mode correspondence table. Therefore, evacuation from the process mode and / or the power saving mode can be executed at an appropriate timing.
The invention according to claim 9 is the method according to any one of claims 1 to 8 , wherein a plurality of the process mode and the power saving mode are provided corresponding to the targets of the power to be reduced in the power saving mode. The substrate processing apparatus according to the item.

According to this configuration, it is possible to execute a separate power saving mode for each target of power to be reduced (for example, power consumption of the temperature adjustment mechanism, power of driving air, etc.), and thus fine power saving A mode can be realized.
The invention according to claim 1 0, wherein the process liquid supply apparatus is provided in plural, corresponding to the respective process liquid supply apparatus, said process mode and the Ministry for force mode is provided, according to claim 1 The substrate processing apparatus according to claim 9 .

  According to this configuration, a separate power saving mode can be executed for each processing liquid supply apparatus. In this case, the power saving mode can be provided in accordance with the type of the processing liquid, and therefore a fine power saving mode can be realized.

1 is a schematic plan view showing a layout of a substrate processing apparatus according to an embodiment of the present invention. It is a schematic side view of the substrate processing apparatus. It is a figure which shows the structure of the said substrate processing apparatus typically. It is a figure which shows typically the structure of the 1st (2nd) temperature adjustment mechanism of the said substrate processing apparatus. It is sectional drawing which shows typically the structure of the 1st (2nd) temperature adjustment unit of the said 1st (2nd) temperature adjustment mechanism. It is a figure which shows typically the structure of the processing unit of the said substrate processing apparatus. It is a flowchart for demonstrating the example of a process performed with the said processing unit. It is a timing chart for explaining an example of processing performed by one processing unit. It is a timing chart for demonstrating the example of a process performed with the other processing unit. It is a timing chart for demonstrating mode switching. It is a flowchart which shows the flow of the opening control of the shutter of the said processing unit. It is a flowchart which shows the flow of substrate carrying-in control to the chamber of the said processing unit. It is a flowchart which shows the flow of a movement control of the chemical | medical solution nozzle of the said processing unit. It is a flowchart which shows the flow of the movement control of the rinse liquid nozzle of the said processing unit. It is a flowchart which shows the flow of the chemical | medical solution temperature control of a said 1st process liquid supply apparatus. It is a flowchart which shows the flow of the 1st power saving mode shown in FIG. It is a flowchart which shows the flow of the chemical | medical solution pressure control of a said 1st process liquid supply apparatus. It is a flowchart which shows the flow of the 2nd power saving mode (4th power saving mode shown in FIG. 21) shown in FIG. It is a flowchart which shows the flow at the time of the start of said 2nd power saving mode (4th power saving mode). It is a flowchart which shows the flow at the time of retraction | saving of said 2nd power saving mode (said 4th power saving mode). It is a flowchart which shows the flow of the rinse liquid temperature control of the said process liquid supply apparatus. It is a flowchart which shows the flow of the 3rd power saving mode shown in FIG. It is a flowchart which shows the flow of the rinse liquid pressure control of the said process liquid supply apparatus. It is a flowchart which shows the flow of the 1st (3rd) power saving mode which concerns on a modification. It is a flowchart which shows the flow of the 2nd (4th) power saving mode which concerns on a modification. It is a flowchart which shows the flow at the time of the start of the 2nd (4th) power saving mode which concerns on the modification shown in FIG. It is a flowchart which shows the flow at the time of retraction | saving of the 2nd (4th) power saving mode which concerns on the modification shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view showing a layout of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic side view thereof. The substrate processing apparatus includes an indexer section 3 and a processing section 2. The processing section 2 includes a delivery unit PASS for delivering the substrate W to and from the indexer section 3. The indexer section 3 delivers the unprocessed substrate W to the delivery unit PASS and receives the processed substrate W from the delivery unit PASS. The processing section 2 receives an unprocessed substrate W from the delivery unit PASS and performs processing using the processing fluid (processing liquid or processing gas) on the substrate W. Then, the processing section 2 delivers the processed substrate W to the delivery unit PASS.

The indexer section 3 includes a plurality of stages ST1 to ST4 and an indexer robot IR.
Stages ST <b> 1 to ST <b> 4 are substrate container holders that can respectively hold a substrate container C that houses a plurality of substrates W (for example, semiconductor wafers) in a stacked state. The substrate container C may be a FOUP (Front Opening Unified Pod) that stores the substrate W in a sealed state, a SMIF (Standard Mechanical Inter Face) pod, an OC (Open Cassette), or the like. For example, when the substrate container C is placed on the stages ST <b> 1 to ST <b> 4, the substrate container C is in a state where a plurality of horizontal substrates W are stacked in the vertical direction with a space between each other.

  As shown in FIGS. 1 and 2, the indexer robot IR includes two hands H having a U shape in plan view. Each hand H supports the substrate W in a horizontal posture. The indexer robot IR moves the hand H in the horizontal direction and the vertical direction. Further, the indexer robot IR changes the direction of the hand H by rotating (spinning) around the vertical axis. The plurality of substrate containers C that store the plurality of substrates W are arranged in the horizontal arrangement direction D1. The indexer robot IR moves in the arrangement direction D1. The indexer robot IR makes the hand H face the arbitrary substrate container C and the transfer unit PASS held on any of the stages ST1 to ST4. Then, the indexer robot IR operates to unload a single unprocessed substrate W from the substrate container C with the hand H and pass it to the delivery unit PASS by the movement of the hand H in the horizontal direction and the vertical direction. Further, the indexer robot IR receives one processed substrate W from the delivery unit PASS by the hand H by the movement of the hand H in the horizontal direction and the vertical direction, and accommodates the substrate held in any of the stages ST1 to ST4. It operates to be accommodated in the container C.

The processing section 2 includes a plurality (eight in this embodiment) of processing units 81 to 88 (processing liquid unit 8), the main transfer robot CR, and the above-described delivery unit PASS.
The processing units 81 to 88 are three-dimensionally arranged in this embodiment. More specifically, a plurality of processing units 81 to 88 are arranged so as to form a two-story structure, and four processing units are arranged on each floor portion. That is, four processing units 81, 83, 85, 87 are arranged on the first floor portion, and four other processing units 82, 84, 86, 88 are arranged on the second floor portion. More specifically, the main transfer robot CR is arranged at the center of the processing section 2 in plan view, and the transfer unit PASS is arranged between the main transfer robot CR and the indexer robot IR. A first processing unit group G1 in which two processing units 81 and 82 are stacked so as to face each other across the delivery unit PASS, and a second processing unit group G2 in which two other processing units 83 and 84 are stacked Is arranged. A third processing unit group G3 in which two processing units 85 and 86 are stacked is arranged so as to be adjacent to the first processing unit group G1 on the side far from the indexer robot IR. Similarly, a fourth processing unit group G4 in which two processing units 87 and 88 are stacked is arranged so as to be adjacent to the second processing unit group G2 on the side far from the indexer robot IR. The main transfer robot CR is surrounded by the first to fourth processing unit groups G1 to G4.

As with the indexer robot IR, the center robot CR includes two hands H that are U-shaped in plan view. Each hand H supports the substrate W in a horizontal posture. The center robot CR moves the hand H in the horizontal direction and the vertical direction. Further, the center robot CR changes the direction of the hand H by rotating (spinning) around the vertical axis.
The center robot CR makes the hand H face the arbitrary processing unit 8 and the delivery unit PASS. Then, the center robot CR moves the hand H in the horizontal direction and the vertical direction, so that the main transfer robot CR receives the unprocessed substrate W from the delivery unit PASS with the hand H, and receives the unprocessed substrate W. Carry in one of the processing units 81-88. Further, the center robot CR receives the processed substrate W processed by the processing units 81 to 88 by the hand H by the movement of the hand H in the horizontal direction and the vertical direction, and transfers the substrate W to the transfer unit PASS.

FIG. 3 is a diagram schematically showing the configuration of the substrate processing apparatus 1. FIG. 4 is a diagram schematically showing the configuration of the first (second) temperature adjustment mechanism 13 (33). FIG. 5 is a cross-sectional view schematically showing the configuration of the first (second) temperature adjustment unit 25 (45) of the first (second) temperature adjustment mechanism 13 (33).
The processing units 81 to 88 are single wafer processing units that process the substrates W one by one. The processing units 81 to 88, for example, supply a processing solution (chemical solution or rinsing solution) to the spin chuck 63 (see FIG. 7 and the like) that holds and rotates one substrate W in a horizontal posture, and the spin chuck 63. This is a rotating liquid processing unit provided with processing liquid nozzles 64 and 65 in the chamber 62.

  As shown in FIG. 3, the substrate processing apparatus 1 performs operations of the first processing liquid supply apparatus 5, the second processing liquid supply apparatus 6, the apparatus provided in the substrate processing apparatus 1, and opening / closing of valves. And a control device 7 for controlling. The first processing liquid supply device 5 supplies the temperature-adjusted chemical liquid to the processing section 2 as a processing liquid. The second processing liquid supply device 6 supplies the temperature adjusted rinse to the processing section 2 as a processing liquid. In FIG. 3, the case where the 1st and 2nd process liquid supply apparatuses 5 and 6 are provided for every process unit group G1-G4 is shown as a continuous line. 3, only the processing units 81 and 82 included in the first processing unit group G1 and the first and second processing liquid supply devices 5 and 6 corresponding to the first processing unit group G1 are illustrated. Show. In the following description, the first and second processing liquid supply devices 5 and 6 corresponding to the first processing unit group G1 will be described as an example, and the processing liquid supply devices corresponding to the other processing unit groups G2 to G4 will be described. The explanation about 5 and 6 is omitted.

The first processing liquid supply device 5 stores a chemical liquid tank 11 for storing the chemical liquid and the chemical liquid stored in the chemical liquid tank 11 to the plurality of processing units 8 included in the first processing unit group G1. And a first circulation pipe 12 for guiding, the chemical liquid is circulated in the first circulation pipe 12, and the chemical liquid flowing through the first circulation pipe 12 is maintained at a desired temperature.
Both ends of the first circulation pipe 12 are connected to the chemical tank 11. In the first circulation pipe 12, a first temperature adjusting mechanism 13, a first pump 14, a first circulation valve 15, a first regulator 16, A first feedback valve 17 is interposed. The 1st temperature adjustment mechanism 13 heats or cools the chemical | medical solution which distribute | circulates the 1st circulation piping 12, and adjusts temperature to desired temperature. The first pump 14 pumps the chemical solution from the chemical solution tank 11 and sends it to the first circulation pipe 12. The first pump 14 is always driven, and the chemical solution in the chemical solution tank 11 is constantly pumped out. Chemical solution is hydrofluoric acid, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, hydrogen peroxide, organic acid (eg citric acid, oxalic acid), organic alkali (eg TMAH), surfactant, corrosion prevention It may be a liquid containing at least one of the agents.

  As shown in FIG. 4, the first temperature adjustment mechanism 13 includes a first temperature adjustment unit 25 and a first temperature for measuring the temperature of the chemical liquid heated or cooled by the first temperature adjustment unit 25. And a first temperature control unit 27 that PID-controls the temperature of the first temperature adjustment unit 25 based on the temperature measured by the first thermometer 26. The first temperature control unit 27 is provided by, for example, a relay circuit. The first temperature control unit 27 is given a set temperature (target temperature) from the control device 7, and the first temperature control unit 27 includes a first temperature adjustment unit 25 (temperature adjustment module) that is a control target. PID control is performed so that the temperature of 29A, 29B) becomes the set temperature.

  As shown in FIG. 5, the first temperature adjustment unit 25 is a unit (in this embodiment, “heating”) for heating or cooling the chemical solution. The first temperature adjustment unit 25 is configured by connecting two temperature adjustment unit units 26A and 26B in the chemical solution distribution direction. Each temperature adjustment unit 26A, 26B has a housing 27A, 27B made of a box. In each of the housings 27A and 27B, chemical solution distribution spaces 28A and 28B through which the chemical solution flows are defined. Three temperature adjustment modules 29A and 29B are provided in each chemical solution distribution space 28A and 28B. In other words, the first temperature adjustment unit 25 has six temperature adjustment modules 29A and 29B.

  For example, a bellows pump is employed as the first pump 14. The bellows pump includes a cylinder (not shown), a moving member (not shown) provided in the cylinder so as to be capable of reciprocating movement, and a bellows (not shown) having one end fixed to the cylinder and the other end fixed to the moving member. Not). In the cylinder, an air chamber (not shown) to which air for reciprocating the moving member is supplied by a bellows and a chemical chamber (not shown) into which chemical liquid flows in and out as the moving member reciprocates are formed. Has been. When the moving member moves in one direction and the volume of the chemical solution chamber is increased, the chemical solution from the chemical solution tank 11 is sucked into the chemical solution chamber. From this state, when the moving member moves in the other direction by the pressure of the air supplied to the air chamber and the volume of the chemical solution chamber is reduced, the chemical solution is sent out from the chemical solution chamber. The bellows pump has a known configuration (for example, see Japanese Patent Application Laid-Open No. 11-174271), and detailed description thereof is omitted.

A first drive control valve 21 for driving the first pump 14 is connected to the first pump 14. The first drive control valve 21 is constituted by, for example, an electromagnetic valve, and controls the supply / stop of the air chamber of the first pump 14 formed of a bellows pump and the air supply flow rate to control the first drive control valve 21. The drive air pressure (drive air pressure) of the pump 14 is controlled.
In the first circulation pipe 12, between the first circulation valve 15 and the first regulator 16, a number corresponding to the number of processing units 8 included in the processing unit group G1 (two in FIG. 3). A first branch pipe 18 is branched and connected. A chemical nozzle 64 is attached to the tip of each first branch pipe 18. A chemical solution valve 19 for opening and closing the first branch pipe 18 is connected to a middle portion of each first branch pipe 18.

  The first processing liquid supply device 5 further includes a first pressure gauge 20 for measuring the pressure inside the first circulation pipe 12. In FIG. 3, the measurement position by the first pressure gauge 20 is a portion between the branch position 18 </ b> A of the first branch pipe 18 and the first regulator 16 in the first circulation pipe 12. The measurement position by the pressure gauge 20 may be another part of the first circulation pipe 12. The first regulator 16 and the first pressure gauge 20 are used for back pressure control, which will be described later, of the first circulation pipe 12.

  When the substrate processing apparatus 1 is in operation, the first pump 14 is always driven. In this state, when the first circulation valve 15 is opened, the chemical liquid drawn out from the chemical tank 11 and sent to the first circulation pipe 12 flows through the first circulation pipe 12. In this case, when the chemical liquid valves 19 corresponding to all the processing units 8 are closed and the first feedback valve 17 is opened, the chemical liquid circulates through the first circulation pipe 12. That is, the chemical liquid drawn out from the chemical liquid tank 11 returns to the chemical liquid tank 11 through the first temperature adjustment mechanism 13, the first circulation valve 15, and the first first feedback valve 17.

  On the other hand, when the first pump 14 is driven and the first circulation valve 15 is opened, the first feedback valve 17 is closed and the chemical valve 19 of a certain processing unit 8 is opened. The chemical liquid pumped from the chemical liquid tank 11 is supplied to the chemical liquid nozzle 64 through the first temperature adjustment mechanism 13, the first circulation valve 15, the first branch pipe 18, and the chemical liquid valve 19, and the chemical liquid nozzle 64. The chemical solution is discharged from.

The chemical liquid tank 11 is provided with a first liquid level sensor 22 for measuring the liquid level of the stored chemical liquid. The chemical solution tank 11 is connected to a new solution replenishing pipe 23 for replenishing the chemical solution new solution. When the measured value of the liquid level of the chemical liquid by the first liquid level sensor 22 becomes equal to or less than the reference value, the chemical liquid tank 11 is replenished with a new liquid.
The first processing liquid supply device 5 is provided with a first power saving mode and a second power saving mode. The first power saving mode is a mode in which the power consumption of the first temperature adjustment mechanism 13 is reduced as compared with the time of chemical treatment. The first processing liquid supply device 5 includes a first power-saving mode and a first process mode that is an execution mode during chemical processing, as modes relating to consumption of driving air in the first pump 14. One is prepared. Therefore, the first process mode is executed when the first power saving mode is not executed.

  The second power-saving mode is a mode in which the consumption amount of driving air in the first pump 14 is reduced as compared with the time of chemical processing, in other words, the circulation flow rate of the chemical in the first circulation pipe 12 is the time of chemical processing. It is a mode that has been reduced more. The first processing liquid supply device 5 includes a second power-saving mode and a second process mode that is an execution mode during chemical processing as modes relating to consumption of driving air in the first pump 14. One is prepared. Therefore, when the second power saving mode is not executed, the second process mode is executed.

  The second processing liquid supply device 6 includes a rinsing liquid tank 31 for storing a rinsing liquid, and a plurality of processing units 8 included in the first processing unit group G1. And a second circulation pipe 32 for guiding the rinse liquid into the second circulation pipe 32. The rinse liquid is circulated in the second circulation pipe 32 so that the rinse liquid flowing through the second circulation pipe 32 is desired. Hold at temperature. The rinsing liquid includes DIW (deionized water), carbonated water, electrolytic ion water, ozone water, diluted hydrochloric acid water (for example, about 10 to 100 ppm), reduced water (hydrogen water), and deaerated water. Also good.

  Both ends of the second circulation pipe 32 are connected to the rinse liquid tank 31. In the second circulation pipe 32, a second temperature adjustment mechanism 33, a second pump 34, a second circulation valve 35, and a second regulator are arranged in order from the rinse liquid tank 31 side along the rinse liquid flow direction. 36 and a second feedback valve 37 are interposed. The second temperature adjustment mechanism 33 heats or cools the rinse liquid flowing through the second circulation pipe 32 to adjust the temperature to a desired temperature. The second pump 34 pumps the rinse liquid from the rinse liquid tank 31 and sends it to the second circulation pipe 32. The second pump 34 is always driven, and the rinse liquid in the rinse liquid tank 31 is constantly pumped out.

  As shown in FIG. 4, the second temperature adjusting mechanism 33 includes a second temperature adjusting unit 45 and a second temperature measuring unit 45 for measuring the temperature of the rinse liquid heated or cooled by the second temperature adjusting unit 45. A thermometer 46 and a second set temperature controller 47 that performs PID control of the temperature of the second temperature adjustment unit 45 based on the temperature measured by the second thermometer 46 are included. The second set temperature control unit 47 is provided by, for example, a relay circuit. The second set temperature control unit 47 is provided with a set temperature (target temperature) from the control device 7, and the second set temperature control unit 47 is controlled by the second temperature adjustment unit 45 (temperature). PID control is performed so that the temperature of the adjustment modules 49A and 49B) becomes the set temperature.

  As shown in FIG. 5, the second temperature adjustment unit 45 is a unit (in this embodiment, “heating”) for heating or cooling the rinse liquid. The second temperature adjustment unit 45 is configured by connecting two temperature adjustment unit units 46A and 46B in the rinsing liquid flow direction. Each temperature adjustment unit 46A, 46B has a housing 47A, 47B made of a box. Rinse liquid circulation spaces 48A and 48B through which the rinse liquid flows are defined in the housings 47A and 47B. Three temperature adjustment modules 49A and 49B are provided in each of the rinse liquid circulation spaces 48A and 48B. In other words, the second temperature adjustment unit 45 has six temperature adjustment modules 49A and 49B.

  For example, a bellows pump equivalent to the first pump 14 is employed as the second pump 34. A second drive control valve 41 for driving the second pump 34 is connected to the second pump 34. The second drive control valve 41 is constituted by, for example, an electromagnetic valve, and controls the supply / stop of the air chamber of the second pump 34 formed of a bellows pump and the air supply flow rate to control the second drive control valve 41. The drive air pressure (drive air pressure) of the pump 34 is controlled.

  In the second circulation pipe 32, between the second circulation valve 35 and the second regulator 36, the number corresponding to the number of the processing units 8 included in the processing unit group G1 (two in FIG. 3). A second branch pipe 38 is branched and connected. A rinse liquid nozzle 65 is attached to the tip of each second branch pipe 38. A rinsing liquid valve 39 for opening and closing the second branch pipe 38 is connected to an intermediate portion of each second branch pipe 38.

  The second processing liquid supply device 6 further includes a second pressure gauge 40 for measuring the pressure inside the second circulation pipe 32. In FIG. 3, the measurement position by the second pressure gauge 40 is a portion between the branch position 38 </ b> A of the second branch pipe 38 and the second regulator 36 in the second circulation pipe 32. The measurement position by the pressure gauge 40 may be another part of the second circulation pipe 32. The second regulator 36 and the second pressure gauge 40 are used for back pressure control, which will be described later, of the second circulation pipe 32.

  When the substrate processing apparatus 1 is in operation, the second pump 34 is always driven. In this state, when the second circulation valve 35 is opened, the rinse liquid pumped out from the rinse liquid tank 31 and sent to the second circulation pipe 32 flows through the second circulation pipe 32. In this case, the rinse liquid circulates through the second circulation pipe 32 in a state where the rinse liquid valves 39 corresponding to all the processing units 8 are closed and the second feedback valve 37 is opened. That is, the rinse liquid pumped from the rinse liquid tank 31 returns to the rinse liquid tank 31 through the second temperature adjustment mechanism 33, the second circulation valve 35, and the second feedback valve 37.

  On the other hand, when the second pump 34 is driven and the second circulation valve 35 is opened, the second feedback valve 37 is closed and the rinse liquid valve 39 of a certain processing unit 8 is opened. The rinse liquid pumped from the rinse liquid tank 31 is supplied to the rinse liquid nozzle 65 through the second temperature adjusting mechanism 33, the second circulation valve 35, the second branch pipe 38, and the rinse liquid valve 39. Then, the rinse liquid is discharged from the rinse liquid nozzle 65.

The rinse liquid tank 31 is provided with a second liquid level sensor 42 for measuring the liquid level of the accumulated rinse liquid. A rinse liquid replenishment pipe 43 for replenishing the rinse liquid is connected to the rinse liquid tank 31. When the measured value of the liquid level of the rinse liquid by the second liquid level sensor 42 becomes equal to or lower than the reference value, the new liquid is replenished to the rinse liquid tank 31.
The second processing liquid supply device 6 is provided with a third power saving mode and a fourth power saving mode. The third power saving mode is a mode in which the power consumption of the second temperature adjustment mechanism 33 is reduced as compared with the rinse process. The second processing liquid supply device 6 includes a second power saving mode and a third process mode that is an execution mode during the rinsing process as modes relating to the power consumption of the second temperature adjustment mechanism 33. One is prepared. Therefore, when the third power saving mode is not executed, the third process mode is executed.

  The fourth power saving mode is a mode in which the consumption amount of driving air in the second pump 34 is reduced as compared with the time of the rinsing process, in other words, the circulation flow rate of the rinsing liquid in the second circulation pipe 32 is It is a mode that is reduced from the time. The second processing liquid supply device 6 includes a fourth power saving mode and a fourth process mode that is an execution mode during the rinsing liquid processing, as modes relating to the power consumption of the second temperature adjustment mechanism 33. Two are available. Therefore, when the fourth power saving mode is not executed, the fourth process mode is executed. There is no causal relationship between the first to fourth power saving modes, and the first to fourth power saving modes are executed independently of each other.

  In addition, although the case where the 1st and 2nd process liquid supply apparatuses 5 and 6 were each provided for every process unit group G1-G4 was mentioned as an example, the 1st and 2nd process liquid was demonstrated. A part of the circulation path (tanks 11 and 31, circulation pipes 12 and 32, and functional members 13 to 17 and 33 to 37 interposed in the circulation pipes 12 and 32) of the supply devices 5 and 6 is a plurality of processing units. It may be shared by the groups G1 to G4, and other parts of the circulation path may be provided in the processing unit groups G1 to G4.

  Specifically, in the first circulation pipe 12 of the first treatment liquid supply device 5, as shown by a broken line in FIG. 3, the position between the first pump 14 and the first circulation valve 15; A first circulation bypass pipe 24 that connects the position between the first regulator 16 and the first feedback valve 17 is provided. Three first circulation bypass pipes 24 are provided, one for each of the second to fourth processing unit groups G2 to G4. Each first circulation bypass pipe 24 is provided with a first circulation valve 15 and a first regulator 16 along the flow direction of the chemical solution. The first processing liquid supply device 5 further includes a first pressure gauge 20 for measuring the pressure inside the first circulation bypass pipe 24. In each of the first circulation bypass pipes 24, the number according to the number of processing units 8 included in the corresponding processing unit group G <b> 2 to G <b> 4 between the first circulation valve 15 and the first regulator 16 (FIG. In FIG. 3, two first branch pipes 18 are branched and connected. A chemical liquid valve 19 is connected to a middle portion of each first branch pipe 18, and a chemical liquid nozzle 64 (not shown in FIG. 3) is attached to the tip of each first branch pipe 18. Yes.

  Further, in this case, in the second circulation pipe 32 of the second treatment liquid supply device 6, as shown by a broken line in FIG. 3, the position between the second pump 34 and the second circulation valve 35, A second circulation bypass pipe 44 that connects the position between the second regulator 36 and the second feedback valve 37 is provided. A total of three second circulation bypass pipes 44 are provided, one for each of the second to fourth processing unit groups G2 to G4. Each second circulation bypass pipe 44 is provided with a second circulation valve 35 and a second regulator 36 along the flow direction of the rinse liquid. The second treatment liquid supply device 6 further includes a second pressure gauge 40 for measuring the pressure inside the second circulation bypass pipe 44. In each of the second circulation bypass pipes 44, the number of the processing units 8 included in the corresponding processing unit group G2 to G4 between the second circulation valve 35 and the second regulator 36 (see FIG. In FIG. 3, two second branch pipes 38 are branched and connected. A rinsing liquid valve 39 is connected to the middle portion of each second branch pipe 38, and a rinse liquid nozzle 65 (not shown in FIG. 3) is attached to the tip of each second branch pipe 38. It has been.

The control device 7 is constituted by, for example, a microcomputer, and the indexer section 3 and the processing section 2 are connected as control targets. The control device 7 includes a CPU 51, a recipe storage unit 52, a machine operation / power saving mode correspondence table storage unit (table storage unit) 53, and first to fourth mode counters 54 to 57.
The recipe storage unit 52 stores a plurality of recipes that define processing conditions for the substrate W. Each recipe is stored in the recipe storage unit 52 with a unique recipe ID.

The machine operation-saving power mode correspondence table storage unit 53 includes a second machine operation that triggers the start of the first to fourth saving power modes, and a retract trigger for the first to fourth saving power modes. first machine operation is defined respectively made.
The first mode counter 54 is an addition / subtraction counter for prescribing switching between the first power saving mode and the first process mode. Based on the value of the first mode counter 54, the first power saving mode is switched to the first process mode, and the first process mode is switched to the first power saving mode.

The second mode counter 55 is an addition / subtraction counter for defining switching between the second power saving mode and the second process mode. Based on the value of the second mode counter 55, the second power saving mode is switched to the second process mode, and the second process mode is switched to the second power saving mode.
The third mode counter 56 is an addition / subtraction counter for defining switching between the third power-saving mode and the third process mode. Based on the value of the third mode counter 56, the third power saving mode is switched to the third process mode, and the third process mode is switched to the third power saving mode.

The fourth mode counter 57 is an addition / subtraction counter for defining switching between the fourth power saving mode and the fourth process mode. Based on the fourth mode counter 57, the fourth power saving mode is switched to the fourth process mode, and the fourth process mode is switched to the fourth power saving mode.
FIG. 6 is a diagram when the configuration of the processing unit 8 is viewed in the horizontal direction.

The processing unit 8 is a single wafer type apparatus for performing a liquid process such as a cleaning process or an etching process on the surface of the substrate W such as a circular semiconductor wafer on the device forming region side.
The processing unit 8 is surrounded by a side wall 61 and has a chamber 62 whose inside is a sealed space. In the chamber 62, a spin chuck 63 that holds and rotates the substrate W, a chemical nozzle 64 for supplying a temperature-adjusted chemical solution to the surface (upper surface) of the substrate W held on the spin chuck 63, The surface (upper surface) of the substrate W held by the spin chuck 63 includes a rinse liquid nozzle 65 for supplying a temperature-adjusted rinse liquid and a cylindrical processing cup 66 for accommodating the spin chuck 63. ing.

  In the side wall 61 of the chamber 62, an opening 67 for carrying the substrate W in and out of the chamber 62 is formed. A central robot CR (see FIGS. 1 and 2) arranged outside the chamber 62 allows the hand H (see FIGS. 1 and 2) to access the chamber 62 through the opening 67, and spins the unprocessed substrate W into the spin chuck. The processed substrate W can be taken out from the spin chuck 63 or placed on the spin chuck 63. A shutter 68 for opening and closing the opening 67 in the vertical direction is provided outside the side wall 61. Coupled to the shutter 68 is a shutter drive mechanism 69 for moving the shutter 68 up and down between a closed position (shown by a solid line in FIG. 6) and an open position (shown by a two-dot chain line in FIG. 6). ing.

  As the spin chuck 63, a clamping chuck that holds the substrate W horizontally while sandwiching the substrate W in the horizontal direction is employed. Specifically, the spin chuck 63 includes a spin motor 70, a spin shaft 71 integrated with a drive shaft of the spin motor 70, and a disk-shaped spin base attached substantially horizontally to the upper end of the spin shaft 71. 72 and a plurality of (three or more, for example, six) clamping pins 73 arranged on the spin base 72. The plurality of sandwiching pins 73 are arranged at appropriate intervals on the circumference corresponding to the outer peripheral shape of the substrate W at the periphery of the upper surface of the spin base 72. A clamping pin drive mechanism 78 is coupled to the plurality of clamping pins 73. The sandwiching pin drive mechanism 78 switches these sandwiching pins 73 between a sandwiching state in which the substrates W are sandwiched in the horizontal direction in cooperation with each other and a non- sandwiching state released from the sandwiching state. The control device 7 picks up the substrate W released from the holding state by the hand H of the center robot CR, and retracts the hand H together with the substrate W from the chamber 62.

When the spin motor 70 is driven while the plurality of clamping pins 73 are in the clamping state, the spin base 72 is rotated around a predetermined rotation axis (vertical axis) A1 by the driving force, and together with the spin base 72 The substrate W is rotated around the rotation axis A1 while maintaining a substantially horizontal posture.
The chemical nozzle 64 is, for example, a straight nozzle that discharges the chemical in a continuous flow state. The chemical nozzle 64 is attached to the first nozzle arm 74 with the discharge port facing substantially downward. The first nozzle arm 74 extends in the horizontal direction and is provided to be rotatable around a rotation axis (not shown) extending in the vertical direction around the spin chuck 63. A first nozzle moving unit 75 that moves the chemical nozzle 64 is coupled to the first nozzle arm 74. The first nozzle moving unit 75 rotates the first nozzle arm 74 around a predetermined rotation axis (not shown), thereby moving the chemical nozzle 64 along the trajectory passing through the center of the upper surface of the substrate W in plan view. Move horizontally. The first nozzle moving unit 75 includes a processing position where the chemical liquid discharged from the chemical liquid nozzle 64 is deposited on the upper surface of the substrate W, and a home position where the chemical liquid nozzle 64 is set to the side of the spin chuck 63 in plan view. In between, the chemical nozzle 64 is moved horizontally. Further, the first nozzle moving unit 75 includes a central position where the chemical liquid discharged from the chemical liquid nozzle 64 is deposited on the center of the upper surface of the substrate W, and a chemical liquid discharged from the chemical liquid nozzle 64 on the peripheral edge of the upper surface of the substrate W. The chemical nozzle 64 is moved horizontally between the peripheral positions where the liquid is deposited. The center position and the peripheral position are both processing positions. The chemical nozzle 64 may be a fixed nozzle whose discharge port is fixedly arranged toward a predetermined position (for example, the central portion) on the upper surface of the substrate W.

  The rinse liquid nozzle 65 is, for example, a straight nozzle that discharges the rinse liquid in a continuous flow state. The rinsing liquid nozzle 65 is attached to the second nozzle arm 76 with the discharge port facing substantially downward. The second nozzle arm 76 extends in the horizontal direction, and is provided so as to be rotatable around a rotation axis (not shown) extending in the vertical direction around the spin chuck 63. A second nozzle moving unit 77 for moving the rinsing liquid nozzle 65 is coupled to the second nozzle arm 76. The second nozzle moving unit 77 rotates the second nozzle arm 76 around a predetermined rotation axis (not shown), thereby rinsing liquid nozzle 65 along a path passing through the center of the upper surface of the substrate W in plan view. Move horizontally. The second nozzle moving unit 77 is set to a central position where the rinsing liquid discharged from the chemical liquid nozzle 64 reaches the central portion of the upper surface of the substrate W, and the rinsing liquid nozzle 65 is set to the side of the spin chuck 63 in plan view. The rinse liquid nozzle 65 is moved horizontally between the set home positions. The rinsing liquid nozzle 65 may be a fixed nozzle in which the discharge port is fixedly arranged toward a predetermined position (for example, the central portion) on the upper surface of the substrate W.

  FIG. 7 is a flowchart for explaining a processing example executed by the processing unit 8. 8A to 8C are timing charts for explaining processing examples and mode switching executed by two processing units 8 included in a common processing unit group G1 to G4. FIG. 9 is a flowchart showing a flow of opening control of the shutter 68 of the processing unit 8. FIG. 10 is a flowchart showing the flow of substrate loading control into the chamber 62 of the processing unit 8. FIG. 11 is a flowchart showing a flow of movement control of the chemical liquid nozzle 64 of the processing unit 8. FIG. 12 is a flowchart showing a flow of movement control of the rinsing liquid nozzle 65 of the processing unit 8.

An example of processing executed by the processing unit 8 will be described mainly with reference to FIGS. 1 to 3 and FIGS. 9 to 12 will be referred to as appropriate.
The carrier C containing the unprocessed substrate W is placed on the stages ST1 to ST4 (see FIGS. 1 and 2). Along with the placement of the carrier C, the substrate ID of the substrate W accommodated in the carrier C and the recipe ID corresponding to the substrate ID are given to the substrate processing apparatus 1 from a host computer (not shown), for example. Is done. The control device 7 reads the recipe to be applied to the substrate W to be processed with reference to the stored contents of the recipe storage unit 52. The control device 7 refers to the contents of the read recipe and the stored contents of the machine operation-saving power mode correspondence table storage unit 53, and triggers for starting the first to fourth saving power modes in the current process. become mechanical operation (hereinafter, referred to as "second machine operation") regarded as, and the first to fourth process mode start that will trigger the machine operation (hereinafter, referred to as "first machine operation") and To do. In the processing example described below, the second mechanical operation in the first power saving mode is the start of the opening operation of the shutter 68, and the first mechanical operation in the first power saving mode is the processing position of the chemical nozzle 64. The evacuation is started. The second mechanical operation in the second power-saving mode is completion of holding the substrate W by the spin chuck 63 (holding completion), and the first mechanical operation in the second power-saving mode is the processing position of the chemical solution nozzle 64. The evacuation is started. The second mechanical operation in the third power saving mode is completion of holding the substrate W by the spin chuck 63 (holding completion), and the first mechanical operation in the third power saving mode is the center of the rinse liquid nozzle 65. The evacuation starts from the position. The second mechanical operation in the fourth power saving mode is that the rinsing liquid nozzle 65 has reached the center position, and the first mechanical operation in the fourth power saving mode is performed from the central position of the rinsing liquid nozzle 65. Evacuation start.

The indexer robot IR moves the hand H, unloads the substrate W from the carrier C, and delivers the substrate W to the center robot CR. The center robot CR moves the hand H and carries the substrate W into the processing unit 8.
When carrying the substrate W into the processing unit 8, the control device 7 controls the shutter drive mechanism 69 to open the shutter 68 and controls the center robot CR to enter the chamber 62 of the processing unit 8. A substrate W for processing is carried in (step S1). Prior to the loading of the substrate W, the chemical nozzle 64 and the rinsing liquid nozzle 65 are retracted to the home position so as not to hinder the loading.

  Specifically, as shown in FIG. 9, when the shutter 68 is closed (YES in step S <b> 11 in FIG. 9), when it is time to open the shutter 68 (YES in step S <b> 12 in FIG. 9), the control device 7 The shutter driving mechanism 69 is controlled to start moving the shutter 68 from the closed position (step S13 in FIG. 9), and as a result, the shutter 68 is opened. When the opening operation of the shutter 68 starts, the values of the first and second mode counters 54 and 55 are incremented (+1) (step S14 in FIG. 9), and then the processing in FIG. 9 is returned. The opening 67 is exposed.

On the other hand, when the shutter 68 is not in the closed state (NO in step S11) or when it is not time to open the shutter 68 (NO in step S12), the shutter opening control in FIG. 9 is returned as it is.
The control device 7 controls the center robot CR to cause the hand H holding the unprocessed substrate W to enter the chamber 62 through the opened opening 67 as shown in FIG. 10 (step 21 in FIG. 10). Then, the substrate W is placed (temporarily held) on the spin chuck 63 with the surface thereof facing upward (step 22 in FIG. 10). Specifically, the peripheral portion of the substrate is contact-supported from below by a plurality of clamping pins 73 in a non-clamping state. The control device 7 controls the center robot CR to retract the hand H after delivering the substrate W out of the chamber 62 through the opening 67. After the hand H is retracted, the control device 7 controls the shutter drive mechanism 69 to close the shutter 68.

  After the substrate W is placed on the spin chuck 63, the control device 7 controls the sandwiching pin drive mechanism 78 to switch the plurality of sandwiching pins 73 from the sandwiching state to the unpinching state. The holding pin 73 is switched from the open state to the closed state (step S23 in FIG. 10). After the pinching pin 73 is switched to the non-pinching state (YES in step S24 in FIG. 10), the values of the second and third mode counters 55 and 56 are respectively incremented (+1) (step in FIG. 10). After that, the process of FIG. 10 is returned.

After sandwiching the substrate W, the control device 7 starts the rotation of the substrate W by the spin motor 70 (step S2). The substrate W is raised to a predetermined liquid processing speed (in the range of 300 to 1500 rpm, for example, up to 500 rpm, and maintained at the liquid processing speed.
When the rotation speed of the substrate W reaches the liquid processing speed, the control device 7 then performs a chemical liquid supply process (step S3) for supplying the chemical liquid to the substrate W. In the chemical solution supply step (S3), the chemical solution discharged from the chemical solution nozzle 64 is deposited on the center of the upper surface of the substrate W.

  At the start of the chemical liquid supply step (S3), the control device 7 controls the first nozzle moving unit 75 to move the chemical liquid nozzle 64 from the home position to the processing position as shown in FIG. Specifically, when the chemical nozzle 64 is located at the home position (YES in step S31 of FIG. 11), when the movement start timing of the chemical nozzle 64 is reached (that is, when the chemical supply step (S3) starts). 11), the control device 7 moves the chemical nozzle 64 toward the processing position. Accordingly, the chemical nozzle 64 is disposed above the substrate W.

On the other hand, when it is not the movement start timing of the chemical nozzle 64 (NO in step S32 of FIG. 11), the chemical nozzle movement control of FIG. 11 is returned as it is.
After the chemical nozzle 64 is disposed above the substrate W, the control device 7 opens the chemical valve 19. Accordingly, the temperature-adjusted chemical liquid is circulated through the first circulation pipe 12 and supplied to the chemical liquid nozzle 64, and the chemical liquid is discharged from the discharge port of the chemical liquid nozzle 64 to land on the upper surface of the substrate W. . The discharge of the chemical solution from the chemical solution nozzle 64 may be performed in a state where the chemical solution nozzle 64 is stationary at the processing position (for example, the central position), and the liquid solution landing position is set to the central portion and the peripheral portion of the upper surface of the substrate W. It may be performed while moving between. The chemical solution supplied to the upper surface of the substrate W receives a centrifugal force due to the rotation of the substrate W and spreads the upper surface of the substrate W toward the peripheral portion.

  When a predetermined chemical solution processing time has elapsed from the start of the discharge of the chemical solution, the control device 7 closes the chemical solution valve 19 and stops the discharge of the chemical solution from the chemical solution nozzle 64. Moreover, the control apparatus 7 moves the chemical | medical solution nozzle 64 from a process position to a home position, as shown in FIG. Specifically, when the chemical nozzle 64 is located at the processing position (YES in step S34 of FIG. 11), when the timing of retracting the chemical nozzle 64 is reached (when the predetermined chemical processing time elapses). The control device 7 moves the chemical solution nozzle 64 toward the home position (step S36 in FIG. 11), and the values of the first and second mode counters 54 and 55 are decremented (−1). Then, the process of FIG. 11 is returned.

  Next, a rinsing liquid supply step (step S4) for supplying the rinsing liquid to the substrate W is performed. At the start of the rinsing liquid supply step (S4), the control device 7 moves the rinsing liquid nozzle 65 from the home position to the center position by controlling the second nozzle moving unit 77 as shown in FIG. Specifically, when the rinse liquid nozzle 65 is located at the home position (YES in step S41 in FIG. 12), when the movement start timing of the rinse liquid nozzle 65 is reached (that is, at the start timing of the rinse liquid supply step (S4)). Then, the control device 7 moves the rinsing liquid nozzle 65 toward the central position.

On the other hand, even if it is not the movement start timing of the rinsing liquid nozzle 65 (NO in step S42 in FIG. 12), when the rinsing liquid nozzle 65 reaches the center position (YES in step S44), the fourth mode counter 57 is reached. Is incremented (+1) (step S45 in FIG. 12). Thereafter, the processing of FIG. 12 is returned.
After the rinse liquid nozzle 65 is disposed at the center position, the control device 7 opens the rinse liquid valve 39. Thus, the rinse liquid whose temperature is adjusted by circulating through the second circulation pipe 32 is discharged from the rinse liquid nozzle 65 toward the center of the upper surface of the substrate W. The rinse liquid supplied to the upper surface of the substrate W receives a centrifugal force due to the rotation of the substrate W and spreads toward the peripheral portion, whereby the chemical liquid is washed away over the entire upper surface of the substrate W. When a predetermined time elapses after the rinse liquid valve 39 is opened, the control device 7 closes the rinse liquid valve 39 and stops the discharge of the rinse liquid from the rinse liquid nozzle 65. Further, the control device 7 moves the rinse liquid nozzle 65 from the processing position to the home position as shown in FIG. Specifically, when the rinsing liquid nozzle 65 is located at the center position (YES in step S46 in FIG. 12), when the rinsing liquid nozzle 65 is retracted (when the above-described predetermined rinsing time has elapsed). In step S47, YES), the control device 7 moves the rinse liquid nozzle 65 toward the home position (step S48 in FIG. 12), and the values of the third and fourth mode counters 56, 57 are decremented ( -1) (step S49 in FIG. 12), and then the processing in FIG. 12 is returned.

  Next, a spin dry process (step S5) for drying the substrate W is performed. Specifically, the control device 7 controls the spin motor 70 to accelerate the substrate W to a drying rotation speed (for example, several thousand rpm) larger than the liquid processing rotation speed, and the substrate W at the drying rotation speed. Rotate. Thereby, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhering to the substrate W is shaken off around the substrate W. In this way, the liquid is removed from the substrate W, and the substrate W is dried. When a predetermined time elapses after the high-speed rotation of the substrate W is started, the control device 7 controls the spin motor 70 to stop the rotation of the substrate W by the spin chuck 63 (step S6).

  Next, the substrate W is unloaded from the chamber 62 (step S7). Specifically, the control device 7 controls the shutter drive mechanism 69 to open the shutter 68 and cause the hand H of the center robot CR to enter the chamber 62. Further, the control device 7 controls the holding pin driving mechanism 78 to release the holding pin 73 from the holding state of the substrate W to the non-holding state. The control device 7 picks up the substrate W released from the holding state by the hand H of the center robot CR, and retracts the hand H together with the substrate W from the chamber 62. Thereby, the processed substrate W is unloaded from the chamber 62.

  As described above, the control device 7 causes the indexer robot IR to carry out the unprocessed substrate W in the carrier C. Then, the control device 7 causes the indexer robot IR to pass the unprocessed substrate W to the center robot CR. Thereafter, the control device 7 causes the center robot to carry the unprocessed substrate W into the processing unit 8. Then, as described above, the control device 7 causes the processing unit 8 to process the substrate W based on the recipe. The control device 7 causes the indexer robot IR or the like to repeat this series of operations for each of the plurality of substrates included in the carrier C. Therefore, as shown in FIGS. 8A and 8B, a plurality of substrates W are sequentially loaded into the plurality of processing units 8, and the processing of the substrates W in the plurality of processing units 8 is sequentially started. FIGS. 8A and 8B respectively show processing examples executed by two processing units 8 (for example, processing units 81 and 82) included in a common processing unit group G1 to G4 (for example, processing unit group G1).

  FIG. 13 is a flowchart showing a flow of chemical temperature control of the first processing liquid supply device 5. FIG. 14 is a flowchart showing the flow of the first power saving mode. FIG. 15 is a flowchart showing a flow of chemical pressure control of the first processing liquid supply device 5. FIG. 16 is a flowchart showing the flow of the second power saving mode (the fourth power saving mode shown in FIG. 21) shown in FIG. FIG. 17 is a flowchart showing a flow at the start of the second power saving mode (fourth power saving mode). FIG. 18 is a flowchart showing a flow at the time of evacuation in the second power saving mode (fourth power saving mode). FIG. 19 is a flowchart showing a flow of rinsing liquid temperature control of the second processing liquid supply device 6. FIG. 20 is a flowchart showing the flow of the third power saving mode shown in FIG. FIG. 21 is a flowchart showing a flow of rinsing liquid pressure control of the second processing liquid supply device 6.

The first to fourth power saving modes and the first to fourth process modes will be described with reference to FIGS. 3, 6, 8 </ b> A to 8 </ b> C, and FIGS. 13 to 21.
As described above, the first processing liquid supply device 5 is provided with two modes, ie, the first power saving mode and the first process mode, as modes relating to the consumption amount of driving air in the first pump 14. ing. As shown in FIG. 13, when the value of the first mode counter 54 exceeds zero (that is, “1” or more) (YES in step S51), the control device 7 executes the first process mode. (Step S52). On the other hand, when the value of the first mode counter 54 is zero (NO in step S51), the first power saving mode is executed (step S53).

  As shown in FIG. 14, during the first process mode (that is, during the process), the set temperature of the first temperature adjustment unit 25 (see FIGS. 4 and 5) is a predetermined first set temperature (for example, 100 ° C.). In other words, it is set to a temperature that can be used for chemical liquid processing (a state in which processing liquid can be supplied). On the other hand, during the first power saving mode, the set temperature of the first temperature adjustment unit 25 is set to a predetermined second set temperature (for example, 90 ° C.) that is lower than the first set temperature. Is set.

  The second set temperature (for example, 90 ° C.) is obtained by PID control of the first temperature adjustment unit 25 by the first temperature control unit 27 when the first process power mode is returned to the first process mode. The temperature can be returned to the first set temperature (for example, 100 ° C.) in a short time (processing liquid can be supplied). That is, when returning from the first power-saving mode to the first process mode, the temperature of the chemical liquid circulating through the first circulation pipe 12 (see FIG. 3) can be reduced to the first set temperature (for example, The second set temperature (for example, 90 ° C.) is set so that it can be returned to 100 ° C.).

Referring to FIG. 8C, the trigger for shifting from the first process mode to the first power saving mode is the start of the opening operation of the shutter 68 of the processing unit 81 in which processing is performed first (that is, a plurality of processing units 81). a second second machine operation the earliest of machine operations) to be performed at 82. The trigger for shifting from the first power saving mode to the first process mode is that the processing unit 82 to be processed later starts to be retracted from the processing position of the chemical nozzle 64 (that is, a plurality of processing units 81 and 82). it is in first mechanical operation of the last of the first machine operations performed).

In the first power saving mode, since the set temperature of the first temperature adjustment unit 25 is lower than that in the first process mode, power consumption can be reduced as compared with the first process mode. Therefore, by providing the first power saving mode, it is possible to reduce power consumption in the first processing liquid supply device 5.
Note that the second set temperature is not limited to 90 ° C., and until the start of the chemical solution discharge of the processing unit 81 that performs the process first when returning from the first power saving mode to the first process mode. If the temperature of the circulating chemical solution is within a range where it can be returned to the first set temperature (for example, 100 ° C.), it may be set to less than 90 ° C.

  As described above, the first processing liquid supply device 5 is provided with two modes, ie, the second power saving mode and the second process mode, as modes relating to the consumption amount of driving air in the first pump 14. ing. As shown in FIG. 15, when the value of the second mode counter 55 exceeds zero (that is, “1” or more) (YES in step S61), the control device 7 executes the second process mode. (Step S62). On the other hand, when the value of the second mode counter 55 is zero (NO in step S61), the second power saving mode is executed (step S63).

  As shown in FIG. 16, during the second process mode (that is, during the process), the driving pressure of the first pump 14 (the pressure of the driving air supplied to the first pump 14) is a predetermined first level. The driving pressure (high pressure) is set. Further, by adjusting the opening degree of the first circulation pipe 12 by the first regulator 16, the circulation pressure of the chemical solution in the first circulation pipe 12 is set to a predetermined first circulation pressure (high pressure). The magnitude of the circulation pressure of the chemical liquid circulating in the first circulation pipe 12 is linked to the discharge pressure of the chemical liquid from each chemical liquid nozzle 64. Therefore, when the chemical solution is discharged from the chemical solution nozzle 64, the circulation pressure of the first circulation pipe 12 needs to be kept high in order to ensure the discharge pressure of the chemical solution. In other words, the driving pressure of the first pump 14 and the circulation pressure of the chemical liquid are in a pressure state (process liquid supply enabled state) in which the chemical liquid can be immediately supplied to the processing unit 8.

  On the other hand, during the second power saving mode, the driving pressure of the first pump 14 is lower than the first driving pressure (for example, about 1/2 to 1/10 of the first driving pressure). The second driving pressure (low pressure) is set, and the circulating pressure of the chemical liquid is set to a low second circulating pressure (low pressure). In the second power saving mode, it is sufficient that the circulation itself is performed in order to keep the liquid temperature of the chemical liquid at a predetermined value, and the circulation flow rate may be low.

Referring to FIG. 8C, the trigger for shifting from the second process mode to the second power saving mode is the completion of holding (holding) the substrate W by the spin chuck 63 in the processing unit 81 where the processing is performed first ( that is, the second machine operation the earliest of the second machine operations performed by a plurality of processing units 81, 82). In addition, the trigger for shifting from the second power saving mode to the second process mode is the start of retreat from the processing position of the chemical nozzle 64 of the processing unit 82 to be processed later (that is, in the processing units 81 and 82). the last first machine operation) of the first machine operations performed.

In the second power saving mode, the driving pressure of the first pump 14 (the pressure of the driving air supplied to the first pump 14) is low. Therefore, compared with the second process mode, the amount of air consumption is reduced. Reduction is achieved (for example, reduction to about 1/2 to 1/10). By providing the second power saving mode, it is possible to reduce the amount of air consumed in the second processing liquid supply device 6.
Further, in the second power saving mode, the driving pressure of the first pump 14 and the circulation pressure of the chemical liquid are low, so that the circulation flow rate of the chemical liquid in the first circulation pipe 12 is reduced. Since the first temperature adjustment unit 25 is PID-controlled, the power consumption of the first temperature adjustment unit 25 can be reduced if the circulation flow rate of the chemical solution in the first circulation pipe 12 can be reduced. In other words, power consumption corresponding to the heat radiation of the circulating chemical solution is sufficient. Therefore, by providing the second power saving mode, power consumption in the second processing liquid supply device 6 can be reduced.

  As shown in FIG. 17, at the start of the second power saving mode, the control device 7 controls the first regulator 16 to lower the circulation pressure of the chemical solution in the first circulation pipe 12 (step S65). ), The first drive control valve 21 is controlled to reduce the drive pressure of the first pump 14 (step S66). The circulation pressure and the pump driving pressure are gradually reduced (steps S65 and S66). When the circulating pressure and the pump driving pressure are reduced to predetermined pressure values (YES in step S67), the control device 7 stops the reduction of the circulating pressure and the pump driving pressure. With such a method, the circulating pressure and the pump driving pressure can be smoothly reduced.

  As shown in FIG. 18, when the second power saving mode is retracted (that is, when the second process mode is started), the control device 7 controls the first regulator 16 to perform the first circulation. While increasing the circulating pressure of the chemical solution in the pipe 12 (step S68), the first drive control valve 21 is controlled to increase the drive pressure of the first pump 14 (step S69). The circulation pressure and the pump driving pressure are gradually increased (steps S68 and S69). When the circulation pressure and the pump drive pressure return to the predetermined pressure values (YES in step S70), the control device 7 stops the pressure increase control of the circulation pressure and the pump drive pressure. With such a method, the circulating pressure and the pump driving pressure can be increased smoothly.

  The pressure change of the circulating pressure of the chemical solution and the pressure change of the driving pressure of the first pump 14 shown in FIGS. 17 and 18 can be performed in a relatively short time, respectively. Therefore, at the time of transition from the second power saving mode to the second process mode, the chemical solution is immediately supplied to the processing unit 8 using the circulation pressure of the chemical solution in the first circulation pipe 12 and the driving pressure of the first pump 14. It is possible to return to a possible pressure state (process liquid supply enabled state) in a short time.

  As described above, the second processing liquid supply device 6 is provided with two modes, ie, the third power saving mode and the third process mode, as modes relating to the power consumption of the second temperature adjustment mechanism 23. ing. As shown in FIG. 19, when the value of the third mode counter 56 exceeds zero (that is, “1” or more) (YES in step S71), the control device 7 executes the third process mode. (Step S72). On the other hand, when the value of the third mode counter 56 is zero (NO in step S71), the third power saving mode is executed (step S73).

  As shown in FIG. 20, during the third process mode (that is, during the process), the set temperature of the second temperature adjustment unit 45 (see FIGS. 4 and 5) is set to a predetermined third set temperature (for example, 60 ° C.). In other words, it is set to a temperature that can be used for the rinsing process (a state in which processing liquid can be supplied). On the other hand, during the third power saving mode, the set temperature of the second temperature adjustment unit 45 is set to a predetermined fourth set temperature (for example, 60 ° C.) lower than the third set temperature. Is set.

  The fourth set temperature (for example, 60 ° C.) is the PID control of the second temperature adjustment unit 45 by the second set temperature control unit 47 when the third process power saving mode returns to the third process mode. Thus, the temperature can be restored to the third set temperature (for example, 70 ° C.) in a short time. That is, when returning from the third power saving mode to the third process mode, the temperature of the rinsing liquid circulating through the second circulation pipe 32 (see FIG. 3) is set to the third set temperature ( For example, a fourth set temperature (for example, 60 ° C.) is set so that the temperature can be returned to 70 ° C.

Referring to FIG. 8C, the trigger for shifting from the third process mode to the third power saving mode is the completion (holding) of holding (holding) the substrate W by the spin chuck 63 of the processing unit 81 where the processing is performed first. a second machine operation the earliest of the second machine operations performed by a plurality of processing units 81, 82). In addition, the trigger for shifting from the third power saving mode to the third process mode is the start of retreating of the processing unit 82 to be processed later from the central position of the rinse liquid nozzle 65 (that is, a plurality of processing units 81, 82 is the last of the first machine operation) of the first machine operations performed.

In the third power saving mode, since the set temperature of the second temperature adjustment unit 45 is lower than that in the third process mode, power consumption can be reduced as compared with the third process mode. Therefore, by providing the third power saving mode, power consumption in the second processing liquid supply device 6 can be reduced.
Note that the fourth set temperature is not limited to 60 ° C., and when the third process power-saving mode returns to the third process mode, the rinsing liquid discharge start of the processing unit 81 that performs the process first is performed. By the time, the temperature of the circulating rinsing liquid may be set to less than 60 ° C. as long as the temperature is within a range that can be returned to the third set temperature (for example, 70 ° C.).

  As described above, the second processing liquid supply device 6 is provided with two modes, the fourth power saving mode and the fourth process mode, as modes relating to the consumption amount of driving air in the second pump 34. ing. As shown in FIG. 21, when the value of the fourth mode counter 57 exceeds zero (that is, “1” or more) (YES in step S81), the control device 7 executes the fourth process mode. (Step S82). On the other hand, when the value of the fourth mode counter 57 is zero (NO in step S81), the fourth power saving mode is executed (step S83).

  As shown in FIG. 16, during the fourth process mode (that is, during the process), the driving pressure of the second pump 34 (the pressure of the driving air supplied to the second pump 34) is a predetermined third level. The driving pressure (high pressure) is set. Further, by adjusting the opening degree of the second circulation pipe 32 by the second regulator 36, the circulation pressure of the rinse liquid in the second circulation pipe 32 is set to a predetermined third circulation pressure (high pressure). The magnitude of the circulation pressure of the rinse liquid circulating in the third circulation pipe 32 is linked to the discharge pressure of the rinse liquid from each rinse liquid nozzle 65. Therefore, when the rinse liquid is discharged from the rinse liquid nozzle 65, the circulation pressure of the third circulation pipe 12 needs to be kept high in order to ensure the discharge pressure of the rinse liquid. In other words, the driving pressure of the second pump 34 and the circulating pressure of the rinsing liquid are in a pressure state in which the rinsing liquid can be immediately supplied to the processing unit 8.

  On the other hand, during the fourth power saving mode, the driving pressure of the second pump 34 is lower than the third driving pressure (for example, about 1/2 to 1/10 of the first driving pressure). The fourth driving pressure (low pressure) is set to a fourth circulation pressure (low pressure), and the rinsing liquid circulation pressure is low. In the fourth power saving mode, it is sufficient that the circulation itself is performed so as to keep the temperature of the rinse liquid at a predetermined value, and the circulation flow rate may be low.

Referring to FIG. 8C, the trigger for shifting from the fourth process mode to the fourth power saving mode is that the rinse liquid nozzle of the processing unit 81 to be processed first has reached the center position (that is, a plurality of triggers). it is executed by the processing unit 81, 82 a second second machine operation the earliest of machine operations). Further, the trigger for shifting from the fourth power saving mode to the fourth process mode is the start of retreating of the processing unit 82 to be processed later from the central position of the rinsing liquid nozzle 65 (that is, a plurality of processing units 81, 82 is the last of the first machine operation) of the first machine operations performed.

In the fourth power saving mode, the driving pressure of the second pump 34 (the pressure of the driving air supplied to the second pump 34) is low. Therefore, compared with the fourth process mode, the amount of air consumption is reduced. Reduction is achieved (for example, reduction to about 1/2 to 1/10). By providing the fourth power saving mode, the amount of air consumed in the second processing liquid supply device 6 can be reduced.
In the fourth power saving mode, the driving pressure of the third pump 34 and the circulation pressure of the rinse liquid are low, and the circulation flow rate of the rinse liquid in the second circulation pipe 32 is reduced. Since the second temperature adjustment unit 45 is PID-controlled, if the circulation flow rate of the rinse liquid in the second circulation pipe 32 can be reduced, the power consumption of the second temperature adjustment unit 45 can be reduced. In other words, power consumption corresponding to the heat radiation of the circulating rinse liquid is sufficient. Therefore, by providing the fourth power saving mode, the power consumption in the second processing liquid supply device 6 can be reduced.

  The flow at the start of the fourth power saving mode and the start of the fourth process mode is as shown in FIGS. 17 and 18, respectively, at the start of the second power saving mode and the second process. Processing equivalent to that at the start of the mode is performed. Such a change in the circulation pressure of the rinse liquid and a change in the driving pressure of the second pump 34 can be performed in a relatively short time. Therefore, at the time of transition from the fourth power saving mode to the fourth process mode, the rinsing liquid circulation pressure in the second circulation pipe 32 and the driving pressure of the second pump 34 are immediately supplied to the processing unit 8. Can be restored in a short time to a pressure state in which can be supplied.

  Next, the first process mode and the first power saving mode according to the modification will be described. FIG. 22 is a flowchart showing a flow of the first (third) power saving mode according to the modification. During the first process mode (that is, during the process), the first temperature adjustment unit 25 controls the temperature of the chemical solution using the six temperature adjustment modules 29A and 29B (see FIG. 5). On the other hand, during the first power saving mode according to the modification, the first temperature adjustment unit 25 includes only three temperature adjustment modules 29A (see FIG. 5) included in one temperature adjustment unit unit 26A. Is used to control the temperature of the chemical solution. That is, during the first power saving mode according to the modification, power is not supplied to the three temperature adjustment modules 29B (see FIG. 5) included in the other temperature adjustment unit 26B.

In the first power-saving mode according to this modification, the number of temperature adjustment modules used for temperature adjustment is reduced as compared with the first process mode. Reduction is achieved. Therefore, by providing the first power saving mode, it is possible to reduce power consumption in the first processing liquid supply device 5.
Further, the same method is employed for the third process mode and the third power saving mode according to the modification. During the first process mode according to the modification (that is, during the process), the third temperature adjustment unit 45 controls the temperature of the chemical solution using the six temperature adjustment modules 49A and 49B (see FIG. 5). ing. On the other hand, during the third power saving mode according to the modified example, the third temperature adjustment unit 45 includes only three temperature adjustment modules 49A (see FIG. 5) included in one temperature adjustment unit unit 46A. Is used to control the temperature of the chemical solution. That is, during the third power saving mode according to the modification, power is not supplied to the three temperature adjustment modules 49B (see FIG. 5) included in the other temperature adjustment unit unit 46B.

In the third power saving mode according to this modification, the number of temperature adjustment modules used for temperature adjustment is reduced as compared with the third process mode. Reduction is achieved. Therefore, by providing the third power saving mode, power consumption in the second processing liquid supply device 6 can be reduced.
Next, the second process mode and the second power saving mode according to the modification will be described. FIG. 23 is a flowchart showing a flow of the second (fourth) power saving mode according to the modification. FIG. 24 is a flowchart showing a flow at the start of the second (fourth) power saving mode according to the modification shown in FIG. FIG. 25 is a flowchart showing a flow during retraction in the second (fourth) power saving mode according to the modification shown in FIG.

During the second process mode (that is, during the process), the number of times the first pump 14 is driven (the number of times drive air is supplied to the first pump 14) is equal to the predetermined first number of times (high number of times). ) Is set.
On the other hand, during the second power saving mode according to the modified example, the number of times of driving the first pump 14 is smaller than the first number of times of driving (for example, about half). Frequency) and a second circulating pressure (low pressure) at which the circulating pressure of the chemical solution is low. In the second power saving mode, it is sufficient that the circulation itself is performed in order to keep the liquid temperature of the chemical liquid at a predetermined value, and the circulation flow rate may be low.

In the second power saving mode according to the modified example, the number of times the first pump 14 is driven (the number of times the driving air is supplied to the first pump 14) is small. Consumption is reduced (for example, reduced to about 1/2). Thereby, reduction of the air consumption in the 2nd process liquid supply apparatus 6 can be aimed at.
Further, in the second power saving mode, the number of times the first pump 14 is driven and the circulation pressure of the chemical liquid is low, so that the circulation flow rate of the chemical liquid in the first circulation pipe 12 is reduced. Since the first temperature adjustment unit 25 is PID-controlled, the power consumption of the first temperature adjustment unit 25 can be reduced if the circulation flow rate of the chemical solution in the first circulation pipe 12 can be reduced. In other words, power consumption corresponding to the heat radiation of the circulating chemical solution is sufficient. Therefore, by providing the second power saving mode according to the modification, it is possible to reduce the power consumption in the second processing liquid supply device 6.

  As shown in FIG. 24, at the start of the second power saving mode according to the modification, the control device 7 controls the first regulator 16 to reduce the circulation pressure of the chemical solution in the first circulation pipe 12. At the same time (step S165), the first drive control valve 21 is controlled to reduce the number of times of driving the first pump 14 (step S166). The circulation pressure and the pump driving frequency are gradually reduced (steps S165 and S166). When the circulating pressure and the number of times of pump driving are reduced to predetermined values (YES in step S167), control device 7 stops the decrease of the circulating pressure and the number of times of pump driving. With such a method, the circulating pressure and the number of pump driving operations can be smoothly reduced.

  As shown in FIG. 25, when the second power saving mode according to the modified example is retracted (that is, at the start of the second process mode according to the modified example), the control device 7 controls the first regulator 16 to In addition to increasing the circulating pressure of the chemical solution in the first circulation pipe 12 (step S168), the first drive control valve 21 is controlled to increase the number of times of driving the first pump 14 (step S169). ). The circulation pressure and the pump driving frequency are gradually increased (steps S168 and S169). When the circulating pressure and the number of times of pump driving return to predetermined values (YES in step S170), control device 7 stops the increase of the circulating pressure and the number of times of pump driving. With such a method, the circulation pressure and the number of pump driving times can be increased smoothly.

  The pressure change of the chemical circulation pressure and the pressure change of the driving frequency of the first pump 14 shown in FIGS. 23 and 24 can be performed in a relatively short time, respectively. Therefore, at the time of transition from the second power saving mode to the second process mode, the chemical solution is immediately supplied to the processing unit 8 using the circulation pressure of the chemical solution in the first circulation pipe 12 and the driving pressure of the first pump 14. It is possible to return to a possible pressure state in a short time.

As shown in FIG. 23, during the fourth process mode according to the modification (that is, during the process), the number of times the third pump 34 is driven (the number of times drive air is supplied to the third pump 34) is The predetermined third number of times of driving (high number of times) is set.
On the other hand, during the fourth power saving mode according to the modified example, the number of times of driving the third pump 34 is smaller than the third number of times of driving (for example, about half) and the fourth number of times of driving (low). The circulation pressure of the rinse liquid is set to a low fourth circulation pressure (low pressure). In the fourth power saving mode, it is sufficient that the circulation itself is performed so as to keep the temperature of the rinse liquid at a predetermined value, and the circulation flow rate may be low.

In the fourth power saving mode according to the modified example, the number of times the third pump 34 is driven (the number of times the driving air is supplied to the third pump 34) is small. Consumption is reduced (for example, reduced to about 1/2). Thereby, reduction of the air consumption in the 2nd process liquid supply apparatus 6 can be aimed at.
In the fourth power saving mode, the number of times the second pump 34 is driven and the circulation pressure of the rinse liquid is low, so that the circulation flow rate of the rinse liquid in the second circulation pipe 32 is reduced. Since the second temperature adjustment unit 45 is PID-controlled, if the circulation flow rate of the rinse liquid in the second circulation pipe 32 can be reduced, the power consumption of the second temperature adjustment unit 45 can be reduced. In other words, power consumption corresponding to the heat radiation of the circulating rinse liquid is sufficient. Therefore, by providing the fourth power saving mode according to the modification, it is possible to reduce power consumption in the second processing liquid supply device 6.

  Further, the flow at the start of the fourth power saving mode according to the modification and at the start of the fourth process mode according to the modification, as shown in FIG. 24 and FIG. The same process as that at the start of the power saving mode and at the start of the second process mode according to the modification is performed. Such a change in the number of times of rinsing liquid circulation and a change in the driving pressure of the second pump 34 can be performed in a relatively short time.

As described above, according to this embodiment, the second machine operation is used as a trigger to switch from the first to fourth process modes to the first to fourth power saving modes. Further, the first machine operation is used as a trigger to switch from the first to fourth process modes to the first to fourth power saving modes. Since the transition between the first to fourth process modes and the first to fourth power saving modes is performed using the first and second machine operations as triggers, the first to fourth process modes and the first There is no need to predetermine the transition time between the fourth power saving mode. Therefore, in a situation where it is difficult to determine the transition time, the first to fourth process modes and the first to fourth power saving modes can be evacuated with good timing. Therefore, the first and second processing liquid supply devices 5 and 6 can be suitably provided with a power saving mode, whereby the power used in each of the processing liquid supply devices 5 and 6 can be reduced. .

Further, since the first to fourth process-saving power modes return to the corresponding first to fourth process modes without passing through the intermediate mode such as the recovery mode, the first and second processing liquid supply devices 5 are used. , 6 can be restored in a short time to a state in which the processing liquid can be supplied (a state in which a processing liquid usable for processing liquid processing can be immediately supplied to the processing unit 8).
Of the second machine operations executed by each processing unit 8, the first and second process liquid supply devices 5 and 6 are triggered by the earliest second machine operation as the first to fourth process modes. To the first to fourth power saving modes. Of the first machine operations executed by each processing unit 8, the first and second process liquid supply devices 5, 6 are first to fourth savings triggered by the last first machine operation. The utility mode is shifted to the first to fourth process modes. Thereby, in the case where each of the processing liquid supply devices 5 and 6 supplies the processing liquid to the plurality of processing units 8, the processing liquid is satisfactorily supplied to each of the processing units 8, and the utility is reduced to the maximum. Can do.

  The process mode and the power saving mode are provided in four (first to fourth process modes and first to fourth power saving modes) corresponding to the power targets to be reduced in the power saving mode. ing. Therefore, a separate power saving mode can be executed for each target of the power to be reduced (for example, power consumption of the temperature adjustment mechanisms 13 and 33, power for driving air, etc.), and thus a detailed power saving mode. Can be realized.

Further, a separate power saving mode can be executed for each of the processing liquid supply devices 5 and 6. Since the power saving mode can be provided in accordance with the contents corresponding to the chemical solution and the rinsing liquid, a detailed power saving mode can be realized.
As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented with another form.

The second and fourth power saving modes have been described by taking the example of reducing the driving pressure or the number of times of driving of the pumps 14 and 34. However, the driving pressures of the pumps 14 and 34 and the driving pressures of the pumps 14 and 34 are described. You may make it control the drive control valves 21 and 41 so that both the frequency | counts of a drive may be reduced.
As the first machine operation and the second machine operation, in the above description, the shutter 68 is opened, the processing position of the chemical nozzle 64 is retracted, the substrate W is held by the spin chuck 63, and the rinse liquid nozzle is used. The arrangement operation at the center position of 65 and the retraction operation from the center position of the rinsing liquid nozzle 65 have been described as examples. However, in addition to this, the rotation operation of the spin chuck 63, the discharge operation of the processing gas, In relation to the discharge operation of the processing liquid, the lifting and lowering operation of the blocking member disposed opposite to the upper surface of the substrate and controlling the atmosphere of the upper surface of the substrate, the lifting and lowering operation of the processing cup 66, the opening and closing operations of various valves And a second machine operation may be defined.

Further, in the machine operation-saving power mode correspondence table, even if the object to be saved is the same (for example, chemical temperature), the first and second machine operations are made different according to the processing conditions read in the recipe. It may be.
Further, the first processing liquid supply device 5 that supplies the chemical liquid may be configured to include a plurality of processing liquid supply mechanisms (processing liquid supply apparatuses) so as to supply different types of chemical liquids. In this case, the first and second machine operations may be different for each type of liquid, and thus it is possible to execute different energy saving plans for each type of chemical liquid.

Moreover, although the case where two processing units 8 are included in each processing unit group G1 to G4 has been described as an example, each processing unit group G1 to G4 may include three or more processing units 8. . For example, each processing unit group G1-G4 can be made into a three-story structure.
Moreover, the structure by which only one processing unit 8 is included in each processing unit group G1-G4 may be sufficient. In this case, only one processing unit 8 corresponds to one processing liquid supply device 5 or 6.

Moreover, although the 1st process liquid supply apparatus 5 which supplies a chemical | medical solution as a process liquid supply apparatus and the 2nd process liquid supply apparatus 6 which supplies a rinse liquid were mentioned as an example, the 2nd process liquid supply was demonstrated. The apparatus 6 may not be provided.
Further, the processing unit 8 may be a so-called batch type in which a plurality of substrates W are processed by immersing them in a processing solution tank at a time, in addition to the single wafer type that processes the substrates W one by one.

  In the above-described embodiment, the wafer W is taken up as a substrate to be processed. However, the wafer W is not limited to the wafer W. Other types of substrates such as a disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, and a solar cell substrate may be processed.

  In addition, various design changes can be made within the scope of matters described in the claims.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 11 Chemical solution tank 12 1st circulation piping 13 1st temperature adjustment mechanism 31 Rinse solution tank 32 2nd circulation piping 33 2nd temperature adjustment mechanism 53 Machine operation | movement-saving mode corresponding table (table storage part) )
61 Side wall 62 Chamber 63 Spin chuck 64 Chemical nozzle (treatment liquid nozzle)
65 Rinse solution nozzle (treatment solution nozzle)
67 Opening 68 Shutter

Claims (8)

A substrate holding means for holding the substrate; a processing liquid nozzle for discharging a processing liquid to the substrate held by the substrate holding means; and a side of the substrate on which the processing liquid nozzle is held by the substrate holding means And a nozzle moving unit for moving between a home position located on the side and a processing position located above the substrate held by the substrate holding means, and held by the substrate holding means. A processing unit for performing processing using a processing liquid on a substrate;
A processing liquid tank for storing the processing liquid and a circulation pipe having both ends connected to the processing liquid tank, and supplying the processing liquid circulating through a circulation path including the processing liquid tank and the circulation pipe to the processing unit A processing liquid supply device,
Triggered by a predetermined second mechanical operation of the processing unit, the processing liquid supply device starts from the process mode in which the processing liquid that can be used in the processing liquid processing of the processing unit can be supplied to the processing unit. Is switched to a power saving mode with reduced power for maintaining at least one of the temperature and the flow rate of the processing liquid circulating in the circulation path, and the predetermined first machine operation of the processing unit is used as a trigger. Mode switching means for switching the processing liquid supply device from the power saving mode to the process mode;
Nozzle movement control means for controlling the nozzle movement unit after the first machine operation to start moving the processing liquid nozzle from the home position toward the processing position;
The predetermined value in the power saving mode becomes a state in which the processing liquid supply device can be returned to the process mode before the timing at which the processing liquid nozzle is arranged at the processing position by the nozzle moving unit. The substrate processing apparatus is set as follows. The treatment liquid supply device further includes a temperature adjustment mechanism for adjusting the temperature of the treatment liquid flowing through the circulation pipe,
The substrate processing apparatus according to claim 1, wherein the power saving mode includes a mode in which power consumption of the temperature adjustment mechanism is reduced as compared with the process mode. The processing liquid supply device further includes a pump for sending the processing liquid stored in the processing liquid tank to the circulation pipe,
The substrate processing apparatus according to claim 1, wherein the power saving mode includes a mode in which a consumption amount of driving air in the pump is reduced as compared with the process mode. The processing unit further includes a chamber for accommodating the substrate holding means,
The substrate processing apparatus according to claim 1, wherein the first mechanical operation is a substrate carry-in operation for carrying a substrate into the chamber. The chamber includes a side wall that surrounds the substrate holding means, and a shutter that is an opening formed in the side wall and closes an opening for carrying the substrate in and out.
The substrate processing apparatus according to claim 4, wherein the substrate carry-in operation is an opening operation of the shutter.   The substrate processing apparatus according to claim 4, wherein the substrate carry-in operation is a holding operation of the substrate by the substrate holding unit.   The substrate processing apparatus according to claim 1, wherein the second mechanical operation is a retreat operation of the processing liquid nozzle from the processing position. A table storage unit for storing a machine operation-saving power mode correspondence table that defines a correspondence relationship between the first and / or second machine operation and the process mode and / or the saving state from the saving power mode; ,
The mode switching means controls retreat of the processing liquid supply device from the process mode and / or the power saving mode based on the machine operation / power saving mode correspondence table stored in the table storage unit. The substrate processing apparatus as described in any one of Claims 1-7.

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