JP6422866B2 - Mocvd反応炉の面状ヒータ用加熱エレメント - Google Patents
Mocvd反応炉の面状ヒータ用加熱エレメント Download PDFInfo
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- JP6422866B2 JP6422866B2 JP2015525776A JP2015525776A JP6422866B2 JP 6422866 B2 JP6422866 B2 JP 6422866B2 JP 2015525776 A JP2015525776 A JP 2015525776A JP 2015525776 A JP2015525776 A JP 2015525776A JP 6422866 B2 JP6422866 B2 JP 6422866B2
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- heating element
- porous sintered
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
- B22F7/004—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature comprising at least one non-porous part
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
- Chemical Vapour Deposition (AREA)
Description
事実上単一面内で延伸し、少なくとも90重量%のタングステンを含んだ材料からなる加熱体を生成する工程と、
この加熱体の表面に、タングステンが少なくとも90重量%である材料の粒子を含んだ懸濁液を少なくとも部分的に塗布する工程と、
この加熱体表面の懸濁液を焼結して多孔焼結被膜とする工程と、を含む。
20 加熱体
22a 一方の面
22b 他方の面
30 多孔焼結被膜
32 開口気孔
40 平板
Claims (17)
- 多孔焼結被膜(30)で少なくとも部分的に直接覆われた加熱体(20)を有し、前記加熱体(20)及び前記多孔焼結被膜(30)がそれぞれ少なくとも90重量%のタングステンを含んでおり、
前記多孔焼結被膜(30)が少なくとも部分的に前記加熱体(20)と冶金的に結合しており、
前記多孔焼結被膜(30)が外表面に開口気孔(32)を有し、該開口気孔(32)が、前記多孔焼結被膜(30)により覆われている前記加熱体(20)の表面積の10%以上に及ぶ投影面積を有し、前記加熱体(20)がほぼ平坦な形態である、加熱エレメント。 - 前記加熱体(20)が互いに反対側を向く2つの面をもち、該面が両方とも、少なくとも部分的に前記多孔焼結被膜(30)で覆われている、請求項1に記載の加熱エレメント。
- 前記開口気孔(32)が、前記多孔焼結被膜(30)により覆われている前記加熱体(20)の表面積の20%以上に及ぶ投影面積を有する、請求項1又は2に記載の加熱エレメント。
- 前記開口気孔(32)が、前記多孔焼結被膜(30)により覆われている前記加熱体(20)の表面積の30%以上に及ぶ投影面積を有する、請求項1又は2に記載の加熱エレメント。
- 前記開口気孔(32)が、前記多孔焼結被膜(30)により覆われている前記加熱体(20)の表面積の70%以下に及ぶ投影面積を有する、請求項1〜4のいずれか1項に記載の加熱エレメント。
- 前記開口気孔(32)が、前記多孔焼結被膜(30)により覆われている前記加熱体(20)の表面積の60%以下に及ぶ投影面積を有する、請求項1〜5のいずれか1項に記載の加熱エレメント。
- 前記多孔焼結被膜(30)が工業的純タングステンから形成されている、請求項1〜6のいずれか1項に記載の加熱エレメント。
- 前記加熱体(20)が、単一平面内で少なくとも部分的に湾曲している、請求項1〜7のいずれか1項に記載の加熱エレメント。
- 前記多孔焼結被膜(30)の放射率が0.5以上である、請求項1〜8のいずれか1項に記載の加熱エレメント。
- チャンバと、1以上のウェハを載置するサセプタと、請求項1〜9のいずれか1項に記載の加熱エレメントと、を備えた反応炉。
- 加熱エレメント(10)の製造方法であって、
実質的に単一平面内で延伸し、少なくとも90重量%のタングステンを含む材料から形成される加熱体(20)を生成する工程と、
前記加熱体(20)の表面に、タングステンが少なくとも90重量%である材料の粒子を含んだ懸濁液を少なくとも部分的に塗布する工程と、
当該加熱体(20)表面の懸濁液を焼結して、外表面に開口気孔を有する多孔焼結被膜(30)とする焼結工程と、
を含む製造方法。 - 前記懸濁液を、前記焼結工程の前に乾燥させる、請求項11に記載の製造方法。
- 前記懸濁液を、前記焼結工程中に乾燥させる、請求項11に記載の製造方法。
- 前記焼結工程は、1800℃より下の温度で実施する、請求項11〜13の何れか1項に記載の製造方法。
- 前記焼結工程は、1400℃〜1500℃の温度で実施する、請求項11〜14のいずれか1項に記載の製造方法。
- 前記焼結工程は、空気中の酸素を排除した中で実施する、請求項11〜15のいずれか1項に記載の製造方法。
- 前記焼結工程は、水素雰囲気又はアルゴン雰囲気中で実施する、請求項11〜16のいずれか1項に記載の製造方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/568,915 US20140041589A1 (en) | 2012-08-07 | 2012-08-07 | Heating element for a planar heater of a mocvd reactor |
| US13/568,915 | 2012-08-07 | ||
| PCT/EP2013/002337 WO2014023414A1 (en) | 2012-08-07 | 2013-08-05 | Heating element for a planar heater of a mocvd reactor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015527742A JP2015527742A (ja) | 2015-09-17 |
| JP6422866B2 true JP6422866B2 (ja) | 2018-11-14 |
Family
ID=49035508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015525776A Active JP6422866B2 (ja) | 2012-08-07 | 2013-08-05 | Mocvd反応炉の面状ヒータ用加熱エレメント |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140041589A1 (ja) |
| EP (2) | EP3130689A1 (ja) |
| JP (1) | JP6422866B2 (ja) |
| KR (1) | KR102042878B1 (ja) |
| SG (1) | SG11201500815YA (ja) |
| TW (1) | TWI605475B (ja) |
| WO (1) | WO2014023414A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9992917B2 (en) | 2014-03-10 | 2018-06-05 | Vulcan GMS | 3-D printing method for producing tungsten-based shielding parts |
| AT15991U1 (de) * | 2017-05-12 | 2018-10-15 | Plansee Se | Hochtemperaturkomponente |
| DE102018105220A1 (de) * | 2018-03-07 | 2019-09-12 | Hauni Maschinenbau Gmbh | Verfahren zur Fertigung eines elektrisch betreibbaren Heizkörpers für einen Inhalator |
| AT17391U1 (de) | 2020-07-31 | 2022-03-15 | Plansee Se | Hochtemperaturkomponente |
| EP4186881A1 (en) | 2021-11-24 | 2023-05-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Producing tantalum carbide layer on technical ceramics using a spray coating and high-temperature sintering process based on aqueous solutions |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3737714A (en) * | 1964-12-18 | 1973-06-05 | Sylvania Electric Prod | Dark coated heater for vacuum tube cathode |
| US3808043A (en) | 1972-05-30 | 1974-04-30 | Rca Corp | Method of fabricating a dark heater |
| US4415835A (en) * | 1981-06-22 | 1983-11-15 | General Electric Company | Electron emissive coatings for electric discharge devices |
| JPH0692736A (ja) * | 1992-09-14 | 1994-04-05 | Tokai Carbon Co Ltd | 炭化珪素焼結体の電気抵抗制御法 |
| US5641363A (en) * | 1993-12-27 | 1997-06-24 | Tdk Corporation | Sintered magnet and method for making |
| US6133557A (en) * | 1995-01-31 | 2000-10-17 | Kyocera Corporation | Wafer holding member |
| DE19652822A1 (de) * | 1996-12-18 | 1998-06-25 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Sinterelektrode |
| DE29823366U1 (de) * | 1998-08-06 | 1999-07-08 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 81543 München | Elektrode für eine Hochdruckentladungslampe mit langer Lebensdauer |
| JP4505073B2 (ja) * | 1999-03-25 | 2010-07-14 | 独立行政法人科学技術振興機構 | 化学蒸着装置 |
| JP2001297857A (ja) * | 1999-11-24 | 2001-10-26 | Ibiden Co Ltd | 半導体製造・検査装置用セラミックヒータ |
| JP3228924B2 (ja) * | 2000-01-21 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| US7057350B2 (en) * | 2004-05-05 | 2006-06-06 | Matsushita Electric Industrial Co. Ltd. | Metal halide lamp with improved lumen value maintenance |
| US7666323B2 (en) * | 2004-06-09 | 2010-02-23 | Veeco Instruments Inc. | System and method for increasing the emissivity of a material |
| JP4454527B2 (ja) * | 2005-03-31 | 2010-04-21 | 日本碍子株式会社 | 発光管及び高圧放電灯 |
| US7638737B2 (en) * | 2005-06-16 | 2009-12-29 | Ngk Spark Plug Co., Ltd. | Ceramic-metal assembly and ceramic heater |
| JP3972944B2 (ja) * | 2005-09-12 | 2007-09-05 | 住友電気工業株式会社 | セラミックスヒータ及びそれを備えた半導体製造装置 |
| JP2009529605A (ja) * | 2005-11-28 | 2009-08-20 | マセソン トライ−ガス, インコーポレイテッド | 化学蒸着法により形成されたガス貯蔵コンテナーライニング |
| US20070181065A1 (en) * | 2006-02-09 | 2007-08-09 | General Electric Company | Etch resistant heater and assembly thereof |
| KR101099371B1 (ko) * | 2009-10-14 | 2011-12-29 | 엘아이지에이디피 주식회사 | 버퍼 챔버를 구비하는 금속 유기물 화학기상증착장치 |
| US20120234240A1 (en) * | 2011-03-17 | 2012-09-20 | Nps Corporation | Graphene synthesis chamber and method of synthesizing graphene by using the same |
-
2012
- 2012-08-07 US US13/568,915 patent/US20140041589A1/en not_active Abandoned
-
2013
- 2013-06-14 TW TW102121081A patent/TWI605475B/zh active
- 2013-08-05 WO PCT/EP2013/002337 patent/WO2014023414A1/en not_active Ceased
- 2013-08-05 EP EP16001871.9A patent/EP3130689A1/en not_active Withdrawn
- 2013-08-05 EP EP13753087.9A patent/EP2882884B1/en active Active
- 2013-08-05 JP JP2015525776A patent/JP6422866B2/ja active Active
- 2013-08-05 SG SG11201500815YA patent/SG11201500815YA/en unknown
- 2013-08-05 KR KR1020157003036A patent/KR102042878B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102042878B1 (ko) | 2019-11-08 |
| WO2014023414A1 (en) | 2014-02-13 |
| EP3130689A1 (en) | 2017-02-15 |
| KR20150040907A (ko) | 2015-04-15 |
| JP2015527742A (ja) | 2015-09-17 |
| SG11201500815YA (en) | 2015-03-30 |
| TW201413747A (zh) | 2014-04-01 |
| US20140041589A1 (en) | 2014-02-13 |
| CN104662197A (zh) | 2015-05-27 |
| EP2882884A1 (en) | 2015-06-17 |
| TWI605475B (zh) | 2017-11-11 |
| EP2882884B1 (en) | 2016-11-30 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |