JP6423006B2 - Solder ball feeder - Google Patents

Description

  The present invention relates to a solder ball feeder for supplying solder balls to a component mounting machine.

  A solder ball feeder for supplying a solder ball to a component mounting machine includes a squeegee in which a space for accommodating a solder ball is formed and a solder ball as described in Patent Document 1 (Japanese Patent Laid-Open No. 2011-91192). And a ball alignment plate in which a predetermined number of ball holes to be accommodated one by one are formed in a predetermined arrangement pattern, and the ball alignment plate or squeegee is slid in a state where the lower end of the squeegee is in close contact with or close to the upper surface of the ball alignment plate In some cases, a squeegeeing operation is performed in which the solder balls in the squeegee enter the respective ball holes of the ball alignment plate from the lower end opening of the squeegee.

JP 2011-91192 A

  By the way, when the solder ball feeder is turned off, the operator can manually move the squeegee and ball alignment plate, so the operator may manually move the squeegee when changing the setup. When a person manually moves the squeegee, if there is a ball alignment plate below the squeegee, the lower end opening of the squeegee is closed by the ball alignment plate, so that the solder balls in the squeegee do not fall down. However, when the operator manually moves the squeegee and there is no ball alignment plate below the squeegee, the lower end opening of the squeegee is opened, and a large number of solder balls accumulated in the squeegee It spills from the opening and scatters widely within the solder ball feeder. In this case, the worker has to perform laborious work of collecting a large number of solder balls scattered in the solder ball feeder within a wide range, which is very troublesome and takes time to collect the solder balls. There was a drawback that the start of production was delayed.

  Therefore, the problem to be solved by the present invention is to make it possible to easily collect the solder balls that have fallen into the solder ball feeder from the lower end opening of the squeegee.

In order to solve the above-described problems, the present invention provides a ball alignment in which a squeegee in which a space for accommodating a large number of solder balls is formed and a predetermined number of ball holes each for receiving one solder ball are formed in a predetermined array pattern. The solder ball in the squeegee is moved from the lower end opening of the squeegee by sliding the squeegee or the ball alignment plate with the plate and the lower end of the squeegee in close contact with or close to the upper surface of the ball alignment plate. Drive means for performing a squeezing operation to enter each ball hole of the alignment plate, and the drive means includes a position for performing the squeezing operation of the ball alignment plate and a suction nozzle of a component mounting machine. in the solder ball feeder for sliding between the solder ball suction position to adsorb the solder balls of each ball hole of said ski With a drop ball collecting means for collecting the solder balls fell spilled inside the solder ball feeder from the lower end opening of the falling ball collection means includes a drop ball collection case is attached detachably to the solder ball feeder, the A falling ball collecting slope that rolls a solder ball that has fallen into the inside of the solder ball feeder into the falling ball collecting case, and the falling ball collecting slope is formed by a solder ball inside the solder ball feeder. The ball alignment plate, which is a region that may fall down, is arranged so as to cover a region in which sliding movement occurs. In this configuration, even when a large number of solder balls in the squeegee spill into the solder ball feeder from the lower end opening of the squeegee, the solder balls that have fallen into the solder ball feeder can be recovered by the falling ball recovery means. Therefore, it is possible to easily collect the solder balls that have fallen down.

As in the present invention, a drop ball collection unit, a drop ball collection case is attached detachably to the solder ball feeder toward the solder balls fell spilled inside the solder ball feeder to the falling ball collecting inside the case If it consists of a falling ball collecting slope that rolls, the solder balls that have fallen into the solder ball feeder will roll on the falling ball collecting slope and be collected in the falling ball collection case. The solder balls that have fallen down can be recovered very simply by simply detaching the falling ball recovery case.
Further, the falling ball collecting slope may be arranged so as to cover an area in which the ball alignment plate in the solder ball feeder inside which the solder balls may fall down is slid.

  In this case, the falling ball collection case may be attached so as to be detachable by the engaging means and / or the screw.

FIG. 1 is a perspective view of a solder ball feeder according to an embodiment of the present invention. FIG. 2 is a perspective view of the solder ball feeder with some side plates removed. FIG. 3 is a perspective view of the main part of the solder ball feeder for explaining the method for attaching and detaching the falling ball collection case. FIG. 4 is a perspective view of the falling ball collection case. FIG. 5 is a perspective view of the main part of the solder ball feeder showing a state where both the squeegee and the ball alignment plate are at the origin position (a state where the solder balls in the squeegee do not fall down). FIG. 6 is a perspective view of the main part of the solder ball feeder showing a state where the ball alignment plate is not present below the squeegee (a state where the solder balls in the squeegee fall down). FIG. 7 is a plan view of the ball alignment plate. FIG. 8 is a perspective view of a feeder set base of the component mounter. FIG. 9 is a block diagram showing the configuration of the control system of the component mounter.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described with reference to the drawings.

First, the configuration of the solder ball feeder 11 will be described.
The solder ball feeder 11 is set on a feeder set base 12 (see FIG. 8) of a component mounting machine (not shown) so as to be replaceable with a tape feeder (not shown). The width dimension of the solder ball feeder 11 is substantially several times the width dimension of the tape feeder, and the solder ball feeder 11 is detachably set in a space corresponding to several tape feeders on the feeder set base 12.

  As shown in FIGS. 1 and 2, a box-shaped feeder main body 13 that extends in the front-rear direction, which is an attaching / detaching direction to the feeder set base 12 of the component mounting machine (see FIG. 8), is provided on the upper portion of the solder ball feeder 11. A guide rail 14 is provided on the feeder main body 13 so as to extend in the front-rear direction. As shown in FIG. 5, a slide base 15 is supported on the guide rail 14 so as to be slidable in the front-rear direction, and a ball alignment plate 16 is sandwiched by a U-shaped fixed frame 17 on the slide base 15 and screw 18. It is detachably attached.

  As shown in FIG. 7, the ball alignment plate 16 is formed with a predetermined number of ball holes 21 for receiving solder balls one by one in a predetermined array pattern. For example, two position correction marks 22 are formed at predetermined positions on the front side of the upper surface of the ball alignment plate 16 where the ball holes 21 are not formed (the mounting direction side of the solder ball feeder 11). The position correction mark 22 is imaged with a mark imaging camera 23 (see FIG. 9) provided in the component mounter and is recognized, so that the position correction mark 22 is used as a reference. Thus, the position of each ball hole 21 of the ball alignment plate 16 is corrected. The mark imaging camera 23 is provided so as to move integrally with the mounting head (not shown) by the head moving device 24 of the component mounting machine. The mark imaging camera 23 uses the reference of the circuit board on the conveyor 30. By imaging the mark and recognizing the reference mark, the component mounting position of the circuit board is corrected based on the position of the reference mark.

  As shown in FIGS. 5 and 6, a squeegee 27 formed with a space for accommodating a large number of solder balls is slidable in the front-rear direction on the rear side of the feeder main body 13 (the removal direction side of the solder ball feeder 11). When the squeegee 27 slides along the upper surface of the ball alignment plate 16, the height position of the squeegee 27 is set so that the lower end of the squeegee 27 is in close contact with or close to the upper surface of the ball alignment plate 16. It has been adjusted.

  A squeegee drive mechanism 28 for sliding the squeegee 27 in the front-rear direction is provided in the feeder main body 13, and the ball alignment plate 16 is the origin shown in FIG. 2 regardless of automatic operation / manual operation when the solder ball feeder 11 is energized. Only when it is in the position, the squeegee 27 is interlocked so that it can be slid forward by the squeegee drive mechanism 28 (see FIG. 9). With the ball alignment plate 16 stopped at the origin position shown in FIG. 5, the lower end of the squeegee 27 is brought into close contact with or close to the upper surface of the ball alignment plate 16, and the squeegee 27 is moved by the squeegee driving mechanism 28. The squeegee performs a squeegeeing operation to cause the solder balls in the squeegee 27 to enter the ball holes 21 of the ball alignment plate 16 from the lower end opening of the squeegee 27 by sliding forward along the upper surface of the ball. A predetermined number of solder balls are arranged in a predetermined arrangement pattern on the alignment plate 16. The solder ball in the squeegee 27 is moved from the lower end opening of the squeegee 27 by sliding the ball alignment plate 16 in a state where the lower end of the squeegee 27 is in close contact with or close to the upper surface of the ball alignment plate 16. You may make it enter in each ball hole 21 of the alignment plate 16. FIG.

  In the feeder main body 13, a ball alignment plate driving mechanism 29 (driving means) for sliding and moving the ball alignment plate 16 (slide base 15) in the front-rear direction is provided, and the ball alignment plate 16 is moved by the ball alignment plate driving mechanism 29. Is slid between the origin position shown in FIG. 5 and the solder ball suction position on the front end side of the feeder main body 13. After the squeegee 27 is slid forward along the upper surface of the ball alignment plate 16 at the origin position shown in FIG. 5, the solder balls are accommodated in the ball holes 21 of the ball alignment plate 16, and then the ball alignment plate 16 is slid and moved to the solder ball suction position on the front end side of the feeder main body 13, and the solder balls in the ball holes 21 of the ball alignment plate 16 are sequentially sucked by the suction nozzle of the component mounting machine, and the circuit on the conveyor 30 is sucked. It is designed to be mounted on the board.

  As shown in FIGS. 1 and 2, the signal line and the power line of the solder ball feeder 11 are connected to the front end surface (end surface on the attachment direction side) of the feeder main body 13 with the connector 31 (see FIG. 8) and two positioning pins 33, 34 are provided, and the two positioning pins 33, 34 are provided with positioning holes 35, 36 (see FIG. 8) of the feeder set base 12 of the component mounting machine. 2), the mounting position of the solder ball feeder 11 is positioned on the feeder set base 12, and the connector 32 of the solder ball feeder 11 is inserted and connected to the connector 31 of the feeder set base 12. Yes.

  As shown in FIG. 9, the control device 41 of the component mounting machine includes an input device 42 such as a keyboard, a mouse, and a touch panel, and a storage device 43 (memory) such as a hard disk, RAM, and ROM that stores various control programs and data. Means) and a display device 44 such as a liquid crystal display and a CRT. In addition, the component mounter is provided with a part imaging camera 45 for imaging a component such as a solder ball adsorbed by an adsorption nozzle (not shown) from below.

  By the way, when the power of the solder ball feeder 11 is turned off, the operator can move the squeegee 27 and the ball alignment plate 16 manually. Therefore, the operator manually moves the squeegee 27 from the origin position when changing the setup. However, if the ball alignment plate 16 exists below the squeegee 27 when the operator manually moves the squeegee 27, the lower end opening of the squeegee 27 is closed by the ball alignment plate 16, The solder balls in the squeegee 27 do not fall down. However, when the operator manually moves the squeegee 27, as shown in FIG. 6, if the ball alignment plate 16 does not exist below the squeegee 27, the lower end opening of the squeegee 27 is opened and the squeegee 27 is opened. Since a large number of solder balls accumulated in the squeegee 27 fall down from the lower end opening of the squeegee 27 and are scattered in the solder ball feeder 11 over a wide range, it is necessary to collect the solder balls spilled into the solder ball feeder 11. is there.

  Therefore, the solder ball feeder 11 of this embodiment has a configuration including a falling ball collecting means 51 that collects the solder balls that have fallen into the solder ball feeder 11 from the lower end opening of the squeegee 27. Hereinafter, the configuration of the falling ball collection means 51 will be described with reference to FIGS.

The falling ball collecting means 51 is directed to the falling ball collecting case 52 detachably attached to the vicinity of the center of the solder ball feeder 11 and the solder ball spilled into the solder ball feeder 11 toward the falling ball collecting case 52. And a falling ball collecting slope 53 that rolls. As shown in FIGS. 2 and 3, the falling ball collecting slope 53 is formed in a bowl shape that is inclined downward toward the falling ball collection case 52 located near the center of the solder ball feeder 11, and the inside of the solder ball feeder 11. Among them , the ball alignment plate 16, which is an area where the solder balls may fall , is attached by screwing or the like so as to cover the area where the sliding movement occurs . The falling ball collecting slope 53 does not need to be configured to be removable, but it goes without saying that it may be configured to be removable for the convenience of cleaning and the like.

  Near the center of the side plate 13a of the feeder body 13, an attachment opening 54 (see FIG. 1) for attaching the falling ball collection case 52 is formed. As shown in FIGS. 3 and 4, the side plate 52a of the falling ball collection case 52 is sized to close the mounting opening 54 of the side plate 13a of the feeder body 13, and is provided at two locations on the lower edge of the side plate 52a. An engagement piece 55 (engagement means) is formed downward, and a screw insertion hole 56 is formed at the center of the upper edge of the side plate 52a. The falling ball collecting case 52 is inserted into the engaging hole 55 (not shown) at the lower edge of the attachment opening 54 on the feeder body 13 side by inserting the engaging piece 55 at the lower edge of the side plate 52a of the falling ball collecting case 52. A screw 57 (see FIGS. 1 and 2) is inserted into the screw insertion hole 56 at the upper edge of the side plate 52a, and the screw 57 is inserted into the screw hole 58 at the upper edge of the attachment opening 54 on the feeder body 13 side. The fall ball collection case 52 is detachably attached to the feeder main body 13 by tightening to (see FIG. 3). In the state where the falling ball collection case 52 is attached to the feeder main body 13, the side plate 52a of the falling ball collection case 52 closes the attachment opening 54 on the feeder main body 13 side, and the lowest opening of the falling ball collection slope 53 is the falling ball. Solder balls that face the collection case 52 and roll over the fall ball collection case 52 fall into the fall ball collection case 52 from the lowest opening of the fall ball collection slope 53 and are collected.

  When the solder balls collected in the falling ball collection case 52 are collected, the operator can remove the falling ball collection case 52 simply by removing the screw 57 that fixes the falling ball collection case 52. In this state, as shown in FIG. 3, when the falling ball collection case 52 is tilted and lifted toward the front, the engagement piece 55 of the falling ball collection case 52 becomes the lower edge of the attachment opening 54 on the feeder body 13 side. The falling ball recovery case 52 is removed from the solder ball feeder 11. After the solder balls accumulated in the falling ball collection case 52 are returned into the squeegee 27, if the falling ball collection case 52 is attached to the attachment opening 54 on the feeder body 13 side, the solder balls fall into the solder ball feeder 11. The solder ball collection operation is completed.

  Since the solder ball feeder 11 of the present embodiment described above includes the falling ball collecting means 51 for collecting the solder balls that have fallen into the solder ball feeder 11 from the lower end opening of the squeegee 27, a large number of squeegees 27 are provided inside the squeegee 27. Even when the solder balls fall down from the lower end opening of the squeegee 27 into the solder ball feeder 11, the solder balls that have fallen down into the solder ball feeder 11 can be collected by the fall ball collecting means 51. It is possible to easily collect the solder balls.

  In addition, in this embodiment, the falling ball collecting means 51 includes a falling ball collecting case 52 that is detachably attached to the solder ball feeder 11, and a solder ball that has fallen into the inside of the solder ball feeder 11. Since the falling ball collecting slope 53 rolls toward the inside of the solder ball 52, the solder ball falling into the solder ball feeder 11 can be collected in the falling ball collecting case 52 by rolling the falling ball collecting slope 53. The solder balls that have fallen into the solder ball feeder 11 can be recovered very simply by simply attaching and detaching the falling ball recovery case 52.

The present invention is not limited to the above configuration, and the configuration of the falling ball collecting means 51 may be changed as appropriate. For example, the falling ball collecting means 51 is engaged with the attachment opening 54 on the feeder body 13 side. The falling ball collecting case 52 and the falling ball collecting slope 53 may be integrated, and both may be integrally attached and detached. In addition, as a reference example related to the present invention, the configuration may be such that the solder balls collected in the falling ball collection case 52 are collected while the falling ball collection case 52 is attached to the solder ball feeder 11. An opening is formed at the bottom of the ball collection case 52, and a shutter mechanism for opening and closing the opening is provided. When collecting the solder balls accumulated in the fall ball collection case 52, the operator Without removing 52, the shutter mechanism is operated to open the opening at the bottom of the falling ball collection case 52, and the solder balls accumulated in the falling ball collection case 52 are removed from the opening at the bottom of the falling ball collection case 52. Alternatively, it may be dropped into an appropriate case prepared by the operator and recovered.

  In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as appropriately changing the configuration of the solder ball feeder 11.

  DESCRIPTION OF SYMBOLS 11 ... Solder ball feeder, 12 ... Feeder set stand, 13 ... Feeder main body, 14 ... Guide rail, 15 ... Slide base, 16 ... Ball alignment plate, 21 ... Ball hole, 22 ... Position correction mark, 23 ... Mark imaging Camera, 24 ... Head moving device, 27 ... Squeegee, 28 ... Squeegee driving mechanism, 29 ... Ball alignment plate driving mechanism (driving means), 41 ... Control device for component mounting machine, 51 ... Falling ball collecting means, 52 ... Falling ball Collection case, 53 ... Falling ball collection slope, 54 ... Mounting opening, 55 ... Engagement piece (engagement means), 56 ... Screw insertion hole, 57 ... Screw, 58 ... Screw hole

Claims (2)

A squeegee in which a space for accommodating a large number of solder balls is formed;
A ball alignment plate in which a predetermined number of ball holes for receiving one solder ball are formed in a predetermined array pattern;
The solder ball in the squeegee is moved from the lower end opening of the squeegee to the ball alignment plate by sliding the squeegee or the ball alignment plate in a state where the lower end of the squeegee is in close contact with or close to the upper surface of the ball alignment plate. Drive means for executing a squeezing operation to enter each ball hole ,
The driving means slides the ball alignment plate between a position where the squeezing operation is performed and a solder ball suction position where the solder balls in each ball hole of the ball alignment plate are sucked by a suction nozzle of a component mounting machine. In solder ball feeder,
A falling ball collecting means for collecting a solder ball that has fallen into the solder ball feeder from the lower end opening of the squeegee ;
The falling ball collecting means includes a falling ball collecting case that is detachably attached to the solder ball feeder, and a falling ball collecting slope that rolls the solder ball that has fallen into the solder ball feeder into the falling ball collecting case. And consists of
The falling ball collecting slope is arranged so as to cover an area in which the ball alignment plate is slidably moved, which is an area in which the solder balls in the solder ball feeder may fall down. Solder ball feeder. The solder ball feeder according to claim 1 , wherein the falling ball collection case is detachably attached by an engaging means and / or a screw.

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