JP6423382B2 - Nameplate manufacturing method - Google Patents

Description

  The present invention relates to a nameplate manufacturing method.

  For example, Patent Document 1 discloses a method of manufacturing a name plate by etching one surface of a metal plate using an adhesive film having a thermally expandable adhesive layer as a mask. Patent Document 2 discloses a method of manufacturing a name plate by etching one surface of a metal plate using an adhesive film made of an ionizing radiation curable adhesive as a mask.

JP 2011-208179 A JP 2011-208180 A

  However, in the above method, a pattern such as a character is formed on the surface of the metal plate as a protrusion having a certain height, or a pattern such as a character is formed on the surface of the metal plate as a depression having a certain height. Can not. Therefore, the design of the manufactured nameplate is low.

  This invention is made | formed in view of the situation mentioned above, The objective is to provide the nameplate manufacturing method which can manufacture the nameplate rich in design property.

 (1) In the nameplate manufacturing method according to the present invention, the first masking film from which the first region other than the first pattern including at least the foreground pattern is removed is formed on one first surface of the metal plate, A second masking film from which a second region other than a second pattern including at least a back pattern corresponding to the back surface and a background pattern provided in a region different from the back pattern is removed is used as the first masking film. Forming a mask on the other second surface of the metal plate so as to match the foreground pattern, and until the metal plate is penetrated in a region where the first region and the second region overlap. An etching step of etching the metal plate from each of the first surface side and the second surface side.

  According to the above method, the metal plate region where the first region of the first masking film and the second region of the second masking film overlap is penetrated between the first surface and the second surface. Moreover, the area | region of the metal plate corresponding to the 1st area | region of a 1st masking film other than a 2nd area | region removes the 1st surface to the center of the thickness direction of a metal plate. Accordingly, a step is provided on the first surface of the metal plate so that the foreground pattern is positioned higher than the background pattern, and on the second surface, the foreground pattern and the background pattern are positioned at the same height. A nameplate through which a gap (second region) in the background pattern passes is manufactured. As a result, a nameplate rich in design is produced.

 (2) Preferably, in the one cover film having an area corresponding to the first masking film and the second masking film, the mask forming step includes an area corresponding to the first area of the first masking film. And a printing step in which an ink for suppressing the transmission of ultraviolet rays is attached to a region corresponding to the second region of the second masking film, the cover film is bent, and a predetermined reference position of the cover film is set to the metal plate The first masking film is positioned between a region of the cover film corresponding to the first masking film and the first surface of the metal plate, and the cover film has the first mask. 2nd masking film between the area corresponding to 2 masking film and the second surface of the metal plate A film fixing step for fixing the relative position between the cover film and the metal plate, and the first of the metal plate to which the cover film is fixed. A photosensitive step of irradiating the masking film and the second masking film with ultraviolet light; and a removing step of removing the first region of the first masking film and the second region of the second masking film by etching.

  According to the above method, the foreground pattern of the first masking film and the back pattern of the second masking film are easily aligned on the metal plate.

 (3) Preferably, the said 1st pattern and the said 2nd pattern contain the edge pattern corresponding to the outer peripheral part of the said metal plate.

  According to the said method, the nameplate which has an outer frame is manufactured.

 (4) Preferably, the first masking film and the second masking film are dry film resists.

  According to the said method, the masking film which has a fine pattern is produced easily.

 (5) Preferably, the metal plate etched by the etching step is placed on the resin plate such that the second surface is in contact with one surface of the resin plate, and the resin plate And a potting step of potting resin on the one surface.

  According to the above method, since the metal plate is sealed inside the resin, a nameplate with more excellent design is manufactured.

 (6) Preferably, the method further includes a molding step of molding the resin plate by pressing with a press.

  According to the above method, the generation of weld lines is suppressed.

 (7) The method may further include an application step of applying a paint to the second surface of the metal plate whose both surfaces are etched by the etching step.

  According to the above method, since the color of the paint is reflected in the resin portion, a nameplate with more design is manufactured.

  According to the present invention, the foreground pattern is masked on the first surface and the back surface and the background pattern on the second surface are masked on both sides of the unmasked area on both the first surface and the second surface. The nameplate with high design is manufactured.

FIG. 1 is a perspective view of a nameplate 10 according to an embodiment of the present invention. FIG. 2 is a flowchart showing a flow of manufacturing the nameplate 10. 3A and 3B are perspective views of the metal nameplate 11, wherein FIG. 3A shows a state when the upper surface is viewed, and FIG. 3B shows a state when the lower surface is viewed. FIG. 4 is a plan view showing the cover film 13. FIG. 5 is a cross-sectional view illustrating a state in which the cover film 13 is fixed to the metal plate 12 provided with the resist layers 41 and 42, and FIG. 5A corresponds to the BB cross section in FIG. FIG. 4B is a view corresponding to a partial cross section taken along the line CC in FIG. FIG. 6 is a cross-sectional view showing the metal plate 12 from which the resist layers 41 and 42 of the unexposed portions are removed, and FIG. 6A is a view corresponding to the BB cross section in FIG. FIG. 3B is a view corresponding to a partial cross section taken along the line CC in FIG. 7A and 7B are cross-sectional views showing the etched metal plate 12. FIG. 7A is a view corresponding to the BB cross section in FIG. 3A, and FIG. It is a figure corresponding to the partial cross section of C cross section. 8 is a cross-sectional view taken along the line AA in FIG.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings as appropriate. Note that the embodiment described below is merely an example of the present invention, and it is needless to say that the embodiment of the present invention can be changed as appropriate without departing from the gist of the present invention.

[Structure of nameplate 10]
The name plate 10 shown in FIG. 1 includes a metal name plate 11, a resin plate 51, and a potting resin 54. The nameplate 10 has a substantially rectangular flat plate shape with rounded corners. The metal nameplate 11 shown in FIG. 3 has a foreground 14, a background 15, and an outer frame 16. The metal nameplate 11 has a substantially rectangular flat plate shape with rounded corners. In the metal nameplate 11, the foreground 14 is “FUKUDA”. The foreground 14 is a pattern that represents the most characteristic content of the nameplate 10 such as a company name. Each character of the foreground 14 is distributed in the horizontal direction inward from the outer frame 16. In the metal nameplate 11, the background 15 is a stripe. The background 15 is a pattern for improving the design of the nameplate 10. The stripes of the background 15 extend in the vertical direction of the metal nameplate 11. Between the stripes, the metal nameplate 11 is penetrated in the thickness direction. The foreground 14, the background 15, and the outer frame 16 are connected to each other and integrally form the metal nameplate 11.

  The front of the foreground 14 in the metal nameplate 11 shown in FIG. 3A, that is, the surface in which the letters “FUKUDA” can be seen facing the front is hereinafter referred to as “first surface 12A”, and FIG. ), The rear surface of the foreground 14 in the metal nameplate 11, that is, the surface in which the characters “FUKUDA” appear to be reversed is referred to as “second surface 12B” below. The second surface 12B of the characters “FUKUDA” corresponds to the back pattern 28 described later shown in FIG. 4 and has the same shape as the back pattern 28.

  As shown in FIG. 8, the first surface 12 </ b> A in the foreground 14 and the first surface 12 </ b> A in the outer frame 16 are located at the same position in the thickness direction of the metal nameplate 11. The first surface 12 </ b> A in the background 15 is located at a position half the thickness of the foreground 14 and the outer frame 16 in the thickness direction of the metal nameplate 11. Further, the second surface 12B in the foreground 14, the second surface 12B in the background 15, and the second surface 12B in the outer frame 16 are located at the same position in the thickness direction of the metal nameplate 11.

  As shown in FIG. 1, the resin plate 51 has a substantially rectangular flat plate shape with rounded corners, and is made of a transparent resin. As shown in FIG. 8, the resin plate 51 is formed on one surface 52 (hereinafter referred to as “upper surface 52”) with a convex shape projecting in an endless annular manner from the peripheral edge of the upper surface 52 in a direction perpendicular to the upper surface 52. A portion 53 is provided. The metal name plate 11 is placed on the resin plate 51 so that the second surface 12B is in contact with the upper surface 52 of the resin plate 51. The inner peripheral surface of the convex portion 53 corresponds to the outer peripheral surface of the metal nameplate 11.

  As shown in FIG. 8, a potting resin 54 is potted on the upper surface 52 of the resin plate 51 so that the metal nameplate 11 is sealed. The potting resin 54 is a transparent resin. Thereby, the surface opposite to the resin plate 51 in the nameplate 10 has a rounded shape.

[Manufacture of nameplate 10]
The production of the nameplate 10 includes a metal nameplate production step S10 and a resin sealing step S20 shown in FIG.

[Metal nameplate production step S10]
In the metal nameplate production step S10 shown in FIG. 2, the metal nameplate 11 shown in FIG. 3 is produced. Here, the metal nameplate 11 refers to a nameplate formed only of metal. As shown in FIG. 2, the metal nameplate production step S10 includes a metal plate preparation step S11, a mask formation step S12, an etching step S13, a cleaning step S14, and a coating step S15.

[Metal plate preparation step S11]
In the metal plate preparation step S11, in the production of the metal nameplate 11 shown in FIG. 3, a metal plate 12 (see FIG. 5) that is the basis of the metal nameplate 11 is prepared. The metal plate 12 is produced according to the shape of the target metal nameplate 11. In the metal nameplate 11 shown in FIG. 3, the shape of the metal plate 12 is a rectangular flat plate shape with rounded corners. First, a material for the metal plate 12 is selected. The material of the metal plate 12 is, for example, brass. The material of the metal plate 12 may be stainless steel or another metal that can be etched. The metal plate 12 is produced, for example, by cutting out a metal plate 12 having a predetermined thickness into a predetermined shape. In the example of the nameplate 10 shown in FIG. 1, the thickness of the metal plate 12 is 0.2 mm.

  The metal nameplate 11 and the metal plate 12 may have other shapes. For example, the metal nameplate 11 may have a circular or elliptical flat plate shape. In these cases, the metal plate 12 may be manufactured in a circular or elliptical flat plate shape in accordance with the shape of the metal nameplate 11. Further, the metal nameplate 11 and the metal plate 12 may have other thicknesses, for example, 0.5 mm.

[Mask Formation Step S12]
As shown in FIG. 2, the mask forming step S12 includes a printing step S21, a resist sticking step S22, a film fixing step S23, a photosensitive step S24, and a removing step S25.

[Printing step S21]
In the printing step S21, a photomask is printed on the cover film 13 shown in FIG. The cover film 13 is a colorless and transparent resin film. In the following, a case will be described in which the metal nameplate 11 with the outer frame 16 having the characters “FUKUDA” shown in FIG.

  In the cover film 13 shown in FIG. 4, the left side of the folding line 21 is a first mask region 22 corresponding to the first surface 12 </ b> A (see FIG. 3) of the metal plate 12. The fold line 21 is an example of a reference position. In the cover film 13, the right side of the fold line 21 is a second mask region 23 corresponding to the second surface 12 </ b> B (see FIG. 3) of the metal plate 12. The first mask region 22 of the cover film 13 includes a foreground pattern 24 corresponding to the characters “FUKUDA” (see FIG. 3) as the foreground 14 and an edge pattern 25 corresponding to the outer frame 16 (see FIG. 3). Black ink is applied to an area other than the first pattern 26 (hereinafter referred to as “first negative area 27”). The first negative area 27 is an example of a first area. For example, the ink is applied by silk printing. The ink application may be performed by other printing methods such as printing by a printer. For the second mask region 23 of the cover film 13, a back pattern 28 obtained by inverting the foreground pattern 24, a background pattern 29 corresponding to a stripe (see FIG. 3) as the background 15, and an edge pattern 25 corresponding to the outer frame 16. Black ink is applied to a region (hereinafter referred to as “second negative region 31”) other than the second pattern 30 formed of The second negative area 31 is an example of a second area. The foreground pattern 24 in the first mask region 22 and the back pattern 28 in the second mask region 23 are line symmetric with respect to the folding line 21. The edge pattern 25 of the first mask region 22 and the edge pattern 25 of the second mask region 23 are line symmetric with respect to the folding line 21. In the second mask region 23, the background pattern 29 is connected to the back pattern 28 and the edge pattern 25.

  In addition to the first negative region 27 and the second negative region 31, a fold line 21 is printed on the cover film 13. The fold line 21 is a line indicating a position at which the cover film 13 is bent in order to align the cover film 13 with the metal plate 12 in a film fixing step S23 described later.

[Registration step S22]
In the resist pasting step S22, resist layers 41 and 42 are formed on the first surface 12A and the second surface 12B of the metal plate 12 shown in FIG. The resist layer 41 formed on the first surface 12A is an example of a first masking film, and the resist layer 42 formed on the second surface 12B is an example of a second masking film. The resist layers 41 and 42 are formed by attaching a dry film resist to the first surface 12A and the second surface 12B of the metal plate 12, respectively. A dry film resist is a film-like resist material. A dry film resist consists of three layers, for example, a base film, a resist layer, and a protective film. The base film is peeled from the dry film resist, the resist layer is pressure-bonded to the first surface 12A and the second surface 12B of the metal plate 12, the protective film is peeled off, and the first surface 12A and the second surface 12B of the metal plate 12 are peeled off. Then, resist layers 41 and 42 are formed.

[Film fixing step S23]
In the film fixing step S <b> 23, as shown in FIG. 5, the cover film 13 on which the first negative region 27, the second negative region 31, and the fold line 21 are printed is bent along the fold line 21. Although illustration is omitted, in the state where the cover film 13 is folded, the foreground pattern 24 (see FIG. 4) and the edge pattern 25 (see FIG. 4) of the first mask region 22 and the back pattern 28 of the second mask region 23 are shown. (Refer FIG. 4) and the edge pattern 25 (refer FIG. 4) correspond in the state which looked at the folded cover film 13 planarly.

  As shown in FIG. 5, the metal plate 12 prepared in the metal plate preparation step S11 is sandwiched between the folded cover film 13 and positioned. For example, the outer periphery 32 (see FIG. 4) of the edge pattern 25 is printed on the cover film 13 as an alignment mark. The outer periphery 32 is an example of a reference position. And it positions so that this outer periphery 32 and the outer periphery of the metal plate 12 may correspond. You may position so that the outer periphery (an example of the predetermined position of a metal plate) of the metal plate 12 may contact | fold the bending position of the folded cover film 13. FIG. After positioning the metal plate 12 on the cover film 13, the cover film 13 is attached to the first surface 12A and the second surface 12B of the metal plate 12 on which the resist layers 41 and 42 are formed by pressure bonding. Precisely, the cover film 13 is affixed to the resist layers 41 and 42.

[Sensitive Step S24]
In the photosensitive step S24, ultraviolet rays are irradiated from the outside of the cover film 13 over a predetermined time toward the first surface 12A and the second surface 12B of the metal plate 12 to which the cover film 13 shown in FIG. As a result, the resist layers 41 and 42 corresponding to areas other than the first negative area 27 (see FIG. 4) and the second negative area 31 (see FIG. 4) of the cover film 13 are exposed, and the resist layer 41 in the exposed area is exposed. , 42 is cured. In other words, the resist layers 41 and 42 corresponding to the area where the black ink is not applied on the cover film 13 are cured. On the other hand, the resist layers 41 and 42 corresponding to the first negative region 27 and the second negative region 31 to which the black ink is applied are not exposed, and the resist layers 41 and 42 in this region are not cured.

[Removal Step S25]
In the removal step S25, the resist layers 41 and 42 are developed to dissolve uncured regions in the resist layers 41 and 42. Specifically, the cover film 13 is peeled from the metal plate 12 after the photosensitive step S24. Then, the exposed metal plate 12 on which the resist layers 41 and 42 are formed is immersed in a predetermined developer for a predetermined time. As a result, as shown in FIG. 6, the first surface 12 </ b> A and the second surface 12 </ b> B of the metal plate 12 are in a state where regions that the metal plate 12 does not want to etch are masked by the resist layers 41 and 42. Specifically, the first pattern 26 is masked on the first surface 12A of the metal plate 12, and the second pattern 30 is masked on the second surface 12B of the metal plate 12.

[Etching step S13]
In the etching step S13, the metal plate 12 in which the first surface 12A and the second surface 12B are masked by the resist layers 41 and 42 shown in FIG. 6 is immersed in an etching solution for a predetermined etching time. The etching solution may be any etching solution as long as it can corrode (etch) the metal plate 12, but is usually a strongly acidic solution such as ferric chloride solution. is there. The etching time is a time required for the target thickness to be eroded in the metal plate 12. The etching time is set, for example, to a time for which the position of the metal plate 12 not masked by any of the resist layer 41 and the resist layer 42 penetrates by etching.

  When the metal plate 12 shown in FIG. 6 is etched over the etching time, the state of the metal plate 12 shown in FIG. 7 is reached. In the metal plate 12 shown in FIG. 7, the region of the metal plate 12 having the resists 41 and 42 on both the first surface 12A and the second surface 12B of the metal plate 12 (the foreground 14 and the outer frame 16 shown in FIG. 3). Neither the first surface 12A nor the second surface 12B is etched. The region of the metal plate 12 where the resist 41 is not present on the first surface 12A of the metal plate 12 and the resist 42 is present on the second surface 12B (the region corresponding to the background 15 shown in FIG. 3) is etched from the first surface 12A. However, the second surface 12B is not etched. Therefore, the first surface 12A is etched to the center of the metal plate 12 in the thickness direction. A region of the metal plate 12 where the resists 41 and 42 are not present on both the first surface 12A and the second surface 12B of the metal plate 12 (a region corresponding to a portion penetrating in the thickness direction between the stripes of the background 15 shown in FIG. 3). Is etched from both the first surface 12A and the second surface 12B. Therefore, the metal plate 12 penetrates in the thickness direction.

[Washing step S14]
In the cleaning step S14, the etched metal plate 12 is taken out of the etching solution, and the resist layers 41 and 42 attached to the first surface 12A and the second surface 12B of the metal plate 12 are removed. Thereby, the metal nameplate 11 shown in FIG. 3 is completed.

[Coating step S15]
In the application step S15, a paint for coloring is applied to the second surface 12B of the completed metal nameplate 11 and applied. Instead of painting, plating for providing gloss on the surface of the metal nameplate 11 may be performed. Further, the metal nameplate 11 may be coated on the plated surface. Painting and plating may not be performed. The painting of coloring may be performed on the entire surface of the metal nameplate 11. Here, the painting includes, for example, printing, dyeing, color plating and the like.

[Resin sealing step S20]
In the resin sealing step S20, as shown in FIG. 8, the metal nameplate 11 manufactured in the metal nameplate manufacturing step S10 is covered and sealed with a transparent resin, as shown in FIG. The resin sealing step S20 includes a molding step S31, a placing step S32, and a potting step S33.

[Molding step S31]
In the molding step S31, for example, a resin plate 51 having a predetermined shape is molded by pressing a colorless and transparent polycarbonate plate with a press.

[Mounting step S32]
In the placing step S32, the metal nameplate 11 is placed on the upper surface 52 of the resin plate 51 as shown in FIG. In the mounted state, the second surface 12 </ b> A of the metal name plate 11 contacts the upper surface 52, and the outer peripheral surface of the metal name plate 11 is located inside the inner peripheral surface of the convex portion 53 of the resin plate 51.

[Potting step S33]
In the potting step S33, as shown in FIG. 8, the metal nameplate 11 is sealed by potting the potting resin 54 on the upper surface 52 of the resin plate 51. The potting resin 54 is, for example, a colorless and transparent urethane resin. Thereby, the nameplate 10 shown in FIG. 1 is completed.

[Operational effects of this embodiment]
As described above, the region of the metal plate 12 corresponding to the region where the first negative region 27 and the second negative region 31 overlap is penetrated between the first surface 12A and the second surface 12B. Further, the first surface 12 </ b> A of the metal plate 12 corresponding to the first negative region 31 other than the second negative region 27 is removed to the center in the thickness direction of the metal plate 12. Thereby, the metal nameplate 11 is produced. On the first surface 12 </ b> A of the metal nameplate 11, a step is provided so that the foreground 14 and the outer frame 16 are positioned higher than the background 15. Further, on the second surface 12B of the metal nameplate 11, the foreground 14, the background 15 and the outer frame 16 are located at the same height. And the clearance gap (2nd negative area | region 31) of the background 15 has penetrated. As a result, the nameplate 10 rich in design is manufactured.

  Further, since the gap of the background 15 penetrates in the thickness direction, the wall surface to which the nameplate 10 is attached, for example, when the nameplate 10 is attached to the body surface of the automobile, the color of the body surface passes through the gap of the background 15. 10 is reflected. Here, “reflecting” includes that the color of the wall surface is visible through the gap in the background 15 and that the color of the wall surface is reflected by the surface of the metal nameplate 11, the resin plate 51 or the potting resin 54 and reflected on the nameplate 10. . Therefore, the design of the nameplate 10 is further increased.

  In one cover film 13 having the first mask region 22 and the second mask region 23, black ink is printed on the first negative region 27 and the second negative region 31. Then, the metal film 12 is sandwiched between the cover film 13 so that the cover film 13 is bent and the bent position of the cover film 13 abuts on the outer peripheral edge of the metal plate 12. Thereby, the relative position of the cover film 13 and the metal plate 12 is fixed. As described above, the first negative region 27 and the second negative region 31 of the cover film 13 are easily aligned on the metal plate 12.

  Since the 1st pattern 26 and the 2nd pattern 30 contain the edge pattern 25 corresponding to the outer peripheral part of the metal plate 12, the nameplate 10 which has an outer frame is manufactured.

  Since the resist layers 41 and 42 are dry film resists, a mask having a fine pattern is easily created.

  The metal name plate 11 is placed on the resin plate 51 so that the second surface 12B of the metal name plate 11 contacts the upper surface 52 of the resin plate 51, and the resin is potted on the upper surface 52 of the resin plate 51. Therefore, the metal nameplate 11 is sealed inside the resin, and the nameplate 10 with higher design is manufactured.

  Since the resin plate 51 is molded by pressing with a press, the occurrence of weld lines is suppressed.

  Since the paint is applied to the second surface 12B of the metal nameplate 11, the color of the paint is reflected in the resin portion, and the nameplate 10 with higher design is manufactured.

[Modification]
In the above-described embodiment, the cover film 13 is attached to the metal plate 12 in a state where the resist layers 41 and 42 are formed on the first surface 12A and the second surface 12B. However, the first negative region 27 and the second negative region 31 are printed with black ink on a protective film of a dry film resist composed of three phases, and the dry film resist resist layer and the protective film are integrated. Thus, a dry film resist may be attached to the metal plate 12.

  The cover film 13 or the dry film resist may be affixed to the metal plate 12 by a method other than pressure bonding, for example, may be affixed to the metal plate 12 with an adhesive.

  One or both of the resin plate 51 and the potting resin 54 may be colored and transparent. The resin plate 51 is not necessarily made of polycarbonate, but is preferably a resin that is not easily broken by press molding and has high transparency. Further, the potting resin may be another resin as long as it is a potable resin, and is not necessarily a urethane resin.

  In the above-described embodiment, the foreground 14 of the metal nameplate 11 is a character “FUKUDA”, but the foreground 14 may not be a character, for example, a symbol, a mark, a design, or the like. May be. The background 15 of the metal nameplate 11 is a stripe, but may be another pattern, for example, a lattice pattern or a wave pattern. The background 15 needs to be connected to the foreground 14. The metal nameplate 11 may not have the outer frame 16.

  In the above-described embodiment, the nameplate 10 is a metal nameplate 11 sealed with a resin. However, as long as the metal nameplate 11 is included, the nameplate may take any form. For example, the metal nameplate 11 which is not sealed with resin may be used alone as the nameplate. Moreover, what sealed the metal nameplate 11 with transparent raw materials other than resin, such as glass, may be used as a nameplate.

DESCRIPTION OF SYMBOLS 12 ... Metal plate 12A ... 1st surface 12B ... 2nd surface 13 ... Cover film 21 ... Bending line (reference position)
24 ... Foreground pattern 25 ... Edge pattern 26 ... First pattern 27 ... First negative area (first area)
28 ... back pattern 29 ... background pattern 30 ... second pattern 31 ... second negative area (second area)
32 ... Outer circumference (reference position)
41 ... resist layer (first masking film)
42 ... resist layer (second masking film)
51 ... Resin plate 52 ... Upper surface (one surface)

Claims (7)

A first masking film from which a first region other than the first pattern including at least the foreground pattern is removed is formed on one first surface of the metal plate, a back pattern corresponding to the back of the foreground pattern, and the back pattern The second masking film from which the second region other than the second pattern including at least the background pattern provided in the different region is removed is made to match the back pattern with the foreground pattern of the first masking film. A mask forming step to be formed on the other second surface;
An etching step for etching the metal plate from each of the first surface side and the second surface side until the metal plate is penetrated in a region where the first region and the second region overlap. Production method. The mask forming step includes
In one cover film having a region corresponding to the first masking film and the second masking film, a region corresponding to the first region of the first masking film and a second region of the second masking film A printing step for attaching an ink for suppressing the transmission of ultraviolet rays to the corresponding area;
The cover film is bent, a predetermined reference position of the cover film is positioned at a predetermined position of the metal plate, a region corresponding to the first masking film of the cover film, and the first surface of the metal plate In the state where the first masking film is located between the region and the second masking film is located between the region corresponding to the second masking film of the cover film and the second surface of the metal plate, A film fixing step of sandwiching the metal plate with the cover film and fixing the relative position of the cover film and the metal plate;
A photosensitive step of irradiating the first masking film and the second masking film of the metal plate to which the cover film is fixed with ultraviolet rays;
The nameplate manufacturing method of Claim 1 including the removal step which removes the said 2nd area | region of the said 1st area | region of the said 1st masking film and the said 2nd masking film by an etching.   The nameplate manufacturing method according to claim 1 or 2, wherein the first pattern and the second pattern include an edge pattern corresponding to an outer peripheral portion of the metal plate.   The nameplate manufacturing method according to any one of claims 1 to 3, wherein the first masking film and the second masking film are dry film resists. Placing the metal plate etched by the etching step on the resin plate such that the second surface is in contact with one surface of the resin plate;
The nameplate manufacturing method according to any one of claims 1 to 4, further comprising a potting step of potting a resin on the one surface of the resin plate.   The nameplate manufacturing method according to claim 5, further comprising a molding step of molding the resin plate by pressing with a press. The nameplate manufacturing method according to any one of claims 5 to 6, further comprising an application step of applying a paint to the second surface of the metal plate whose both surfaces have been etched by the etching step.

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