JP6423677B2 - Mold, molding apparatus, and method for manufacturing molded product - Google Patents

Description

  The present invention relates to a technique effective when applied to a molding die, a molding apparatus, and a molded article manufacturing technique.

  Japanese Patent Application Laid-Open Nos. 4-269854 (Patent Document 1), 6-177191 (Patent Document 2), and Japanese Patent Application Laid-Open No. Hei 8- -25424 (Patent Document 3), JP-A-2003-11187 (Patent Document 4), and JP-A-2007-130976 (Patent Document 5).

JP-A-4-269854 JP-A-6-177191 JP-A-8-25424 JP 2003-11187 A JP 2007-130976 A

  In a general molding die in transfer molding, a runner is provided on an end surface side on a substrate (for example, a lead frame on which a semiconductor chip is mounted) set in the die. In such a molding die, since the runner which is a resin path straddles the die and the substrate, the resin may leak from the gap between the die and the substrate. In particular, recent low-molecular-weight low-viscosity resins and low-viscosity resins for LED (Light Emitting Diode) lens molding are likely to cause resin leakage. Moreover, when installing a runner on a board | substrate, it is necessary to ensure the space for it on a board | substrate. Furthermore, the resin remaining in the molded gate runner has no added value as a molded product, and needs to be removed from the molded product as an unnecessary product (so-called degate). On the other hand, in the molding die having the vertical gate structure, since the runner gate does not run on the substrate, there is no problem of the gate remaining on the substrate, and the resin flows directly on the semiconductor chip, so that the wire is evenly distributed. Resin pressure is applied and wire flow problems are less likely to occur. For this reason, it is considered that a molding die having a vertical gate structure is effective.

  An object of the present invention is to provide a molding die having a novel vertical gate structure. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. The molding die concerning one embodiment of the present invention is provided between the 1st metallic mold and the 2nd metallic mold, and the 1st metallic mold and the 2nd metallic mold which are provided facing so that mold opening and closing is possible. A third mold, a plurality of first chucks provided around a mold surface of the first mold, and fixing the third mold on the first mold side; and a mold of the second mold A plurality of second chucks which are provided around a mold surface and fix the third mold on the second mold side, and the first mold and the second mold are disposed between the first mold and the second mold. a fixing mechanism for fixing the third mold, wherein the third mold has a resin placement portion where the resin is placed, and a gate which penetrates in the thickness direction, in the mold closed state, the first gold Culls and runners are formed at the boundary between the mold and the third mold, and cavities are formed at the boundary between the second mold and the third mold. Parts, the cull, the runner, the gate and the cavity communicates, when the first chuck to supply the resin through the resin arranged portion in a state in which the second chuck is opened is opened mold closed, the A third mold is fixed on the second mold side, and when the molded product molded in the cavity is taken out, the second mold is opened and the third mold is closed with the first chuck closed. Is fixed on the first mold side and opened .

  According to this, a gate penetrating in the thickness direction of the third mold (intermediate mold), that is, a vertical gate can be formed. For this reason, resin leakage from the runner can be prevented. Therefore, it is possible to improve the productivity by suppressing the number of cleanings against resin leakage. In addition, the vertical gate can minimize the runner arrangement area on the substrate on which the electronic component (for example, a semiconductor chip) is mounted. For this reason, more electronic components can be mounted in place of the runner installation area, and the number of products separated from the molded product after molding (sealing) can be increased. Therefore, it leads to reduction of product cost.

  In addition, the gate arrangement can be freely changed with respect to the molded product by exchanging the third mold (intermediate mold). For example, even if a bonding wire is used for electrical connection of an electronic component mounted on a substrate, the vertical gate can be arranged at an effective place for preventing the wire flow and the like. In addition, it may be difficult to place (set) the resin in the mold by using the third mold (intermediate mold), but the resin placement portion is provided in the third mold (intermediate mold). This can be solved.

In addition, a molding die according to another example includes a first die and a second die that are provided so as to be capable of opening and closing the die, and a third die provided between the first die and the second die. A plurality of support posts provided around a mold surface of the mold and the first or second mold and supporting the third mold and reciprocating in the mold opening and closing direction; A fixing mechanism for fixing the third mold between the mold and the second mold, wherein the third mold includes a resin arrangement portion in which resin is arranged, a gate penetrating in the thickness direction, and In the closed state, a cull and a runner are formed at the boundary between the first mold and the third mold, and a cavity is formed at the boundary between the second mold and the third mold. The resin arrangement portion, the cull, the runner, the gate, and the cavity communicate with each other and the resin is opened in a mold open state. When supplying the resin to the mounting portion, the third mold is separated from the first mold and the second mold and supported by the support posts, and the molded product molded in the cavity is molded. When opening and taking out, the third mold is separated from the first mold and the second mold and is supported by the support post.
According to this, the third mold (intermediate mold) can be fixed between the first mold and the second mold.

  In the molding die according to the embodiment, the first die has a first ejector pin that reciprocates in the mold opening / closing direction, and the second die reciprocates in the mold opening / closing direction. The third mold has a pin hole penetrating in the thickness direction so that the first ejector pin reciprocates, and when the molded product molded in the cavity is taken out, the first mold An ejector pin is provided so as to push the molded product to the second mold side to release the molded product from the third mold, and the second ejector pin pushes the molded product to the first mold side. It is more preferable that the molded product is provided so as to be extruded from the second mold. According to this, even if it uses a 3rd metal mold | die, a molded article can be taken out easily.

  In the molding die according to the one embodiment, the third die is fixed on the first die side by the fixing mechanism in the die open state, and in the direction intersecting the die opening / closing direction, the first die is attached to the first die. It is more preferable to provide a shuttle mechanism that relatively reciprocates the second mold. According to this, the molded product can be easily taken out by displacing the second mold from the state facing the first mold while the third mold is fixed to the first mold side.

  A molding apparatus according to an embodiment of the present invention includes a mold for the first mold that is inserted between the first mold and the third mold in a state where the mold is opened. A first cleaner that cleans the surface and one of the mold surfaces of the third mold, and is inserted between the second mold and the third mold in an open state, and the second mold And a second cleaner for cleaning the mold surface of the mold and the other mold surface of the third mold. According to this, cleaning can be performed inside the mold without taking out the third mold outside the mold.

A method for manufacturing a molded product according to an embodiment of the present invention includes a first mold and a second mold that are provided so as to be capable of opening and closing a mold, and between the first mold and the second mold. A third mold having a resin placement portion on which resin is placed and a gate penetrating in the thickness direction; and provided around the mold surface of the first mold; and A plurality of first chucks fixed on the first mold side and a plurality of second chucks provided around the mold surface of the second mold and fixing the third mold on the second mold side And a manufacturing method of a molded article using a molding die provided with a fixing mechanism for fixing the third die between the first die and the second die, (a) A step of fixing the third mold on the second mold side by the second chuck in a state where the mold is opened, and disposing the resin on the resin disposing portion; A mold is closed to form a cull and a runner at the boundary between the first mold and the third mold, and a cavity is formed at the boundary between the second mold and the third mold; A step of pumping the resin from the placement portion to the cavity through the cull, the runner, and the gate, filling the cavity with the resin, and thermally curing the resin filled in the cavity; (C) after fixing the third mold on the first mold side by the first chuck, separating the mold from the second mold and taking out the molded product molded in the cavity; It is preferable to contain.
Or the 1st metal mold | die and 2nd metal mold | die provided facing so that mold | die opening and closing is possible, the resin arrangement | positioning part provided between the said 1st metal mold | die and the said 2nd metal mold | die, and thickness A third mold having a gate penetrating in a direction, and a plurality of molds provided around the mold surface of the first or second mold and supporting the third mold to reciprocate in the mold opening and closing direction. A method for manufacturing a molded article using a molding die having a support post and having a fixing mechanism for fixing the third die between the first die and the second die, And a step of supporting the third mold while being supported by the support post while being spaced apart from the first mold and the second mold, and disposing the resin in the resin disposing portion. , Shi mold closing while inserted into the insertion hole provided in the mold surface facing the third mold (b) said support posts A cull and a runner are formed at a boundary between the first mold and the third mold, and a cavity is formed at a boundary between the second mold and the third mold. A step of pumping the resin to the cavity through the runner and the gate, filling the cavity with the resin, and thermosetting the resin filled in the cavity; and (c) the first Molding in which the first mold and the second mold are opened and the third mold is separated from the first mold and the second mold and supported by the support post while being molded in the cavity. And a step of taking out the product.
According to this, a gate penetrating in the thickness direction of the third mold, that is, a vertical gate can be formed. For this reason, resin leakage from the runner can be prevented and the productivity of the molded product can be improved.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to an embodiment of the present invention, a molding die having a novel vertical gate structure can be provided.

It is principal part typical sectional drawing of a shaping | molding apparatus provided with the shaping | molding metal mold | die in operation | movement which concerns on Embodiment 1 of this invention. FIG. 2 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 1. FIG. 3 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 2. FIG. 4 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 3. FIG. 5 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 4. FIG. 6 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 5. FIG. 7 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 6. It is a principal part schematic sectional drawing of a shaping | molding apparatus provided with the shaping die in operation | movement which concerns on Embodiment 2 of this invention. FIG. 9 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 8. FIG. 10 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 9. It is principal part typical sectional drawing of the shaping | molding apparatus in operation | movement following FIG. It is a principal part schematic sectional drawing of the shaping | molding apparatus in operation | movement following FIG. FIG. 13 is a schematic cross-sectional view of a main part of the molding apparatus in operation following FIG. 12. It is principal part typical sectional drawing of the shaping | molding apparatus in operation | movement following FIG. It is principal part typical sectional drawing of a shaping | molding apparatus provided with the shaping die which concerns on Embodiment 3 of this invention. It is principal part typical sectional drawing of the shaping | molding apparatus which concerns on Embodiment 4 of this invention. It is principal part typical sectional drawing of the shaping | molding apparatus which concerns on Embodiment 5 of this invention. It is a principal part schematic sectional drawing of the shaping | molding apparatus which concerns on Embodiment 6 of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A molding apparatus 100 including a molding die 10 (molding die mechanism) that performs transfer molding according to Embodiment 1 of the present invention will be described with reference to FIGS. FIGS. 1-7 is typical sectional drawing of the principal part of the shaping | molding apparatus 100 in operation | movement (during the manufacturing process of a molded article) in this embodiment. In the molding apparatus 100, sealing is performed by transfer molding using a workpiece W on which a plurality of electronic components (for example, semiconductor chips) are mounted on a substrate (for example, a wiring board). In the cross-sectional view, members that are not in the same cross-section may be shown in order to clarify the invention.

  First, the molding die 10 will be schematically described. The molding die 10 includes a press driving mechanism, and an upper die 11 (first die) and a lower die 12 (second die) provided so as to face each other so that the die can be opened and closed by the press driving mechanism. The press drive mechanism includes a movable platen 13 and a fixed platen 14, a drive source (not shown) for moving the movable platen 13 (servo motor, etc.) and a drive transmission mechanism (toggle link, etc.) not shown. In the present embodiment, the upper mold 11 is assembled to the movable platen 13, and the lower mold 12 is assembled to the fixed platen 14. As the movable platen 13 moves toward and away from the fixed platen 14, the upper mold 11 and the lower mold 12 approach (see FIG. 1) or separate (see FIG. 2). In this way, the molding die 10 is configured to be mold-closed (clamped) and mold-openable.

  The molding die 10 includes a transfer mechanism, a heating mechanism 15 that is a heater unit, and ejector mechanisms 16 and 17. The transfer mechanism includes a pot 20, a plunger 21 that slides in the pot 20, and a drive source (servo motor or the like) (not shown) that reciprocates the plunger 21. In the present embodiment, the transfer mechanism is assembled to the movable platen 13 side, and the pot 20 is assembled to the upper mold 11. In the state where the mold is closed, a cull 22, a runner 23, a gate 24 and a cavity C communicating with the pot 20 are formed in the molding die 10. In the molding die 10, the thermosetting resin R is pressed by the plunger 21 while the mold is closed, and the resin R is pumped (transferred) to the cavity C through the cull 22, the runner 23, and the gate 24 (see FIG. 1). ). The resin R is filled in the cavity C, and the resin R is thermoset and molded by the molding die 10 heated to a predetermined temperature by the heating mechanism 15. The molded workpiece W (molded product) is pushed out by the ejector mechanisms 16 and 17 with the mold opened (see FIGS. 2 and 3).

  Next, the molding die 10 will be specifically described. The upper mold 11 (see FIG. 6) of the molding die 10 includes a plurality of blocks (upper mold chase 25, upper mold inserts 26 and 27), and these are assembled. The upper mold chase 25 is provided on the lower surface of the movable platen 13. The upper mold inserts 26 and 27 are provided so as to be inserted from the lower surface side of the upper mold chase 25. In the upper mold 11, the pot 20 is provided in a through hole formed by communication with the movable platen 13, the upper mold chase 25, and the upper mold insert 26. The pot 20 is provided with a protruding portion that protrudes from the outer peripheral surface thereof, and is covered with the upper mold insert 26 so as to prevent the protruding portion from being pushed out. In the upper mold 11, the heating mechanism 15 is built in the upper mold chase 25. Further, in the upper die 11, a part of the ejector mechanism 16 is provided in a housing portion formed in the upper die chase 25 and is covered with the upper die insert 27.

  The lower mold 12 (see FIG. 3) of the molding die 10 includes a plurality of blocks (lower mold chase 30 and lower mold insert 31), and these are assembled. The lower die chase 30 is provided on the upper surface of the fixed platen 14. The lower mold insert 31 is provided so as to be inserted from the upper surface side of the lower mold chase 30. The lower mold insert 31 includes a cavity recess 32 that forms the cavity C and a workpiece placement portion 33 in which the workpiece W is placed, formed on the upper surface side thereof. In the lower mold 12, the heating mechanism 15 is built in the lower mold chase 30. Further, in the lower mold 12, a part of the ejector mechanism 17 is provided in a housing portion formed in the lower mold chase 30 and is covered with the lower mold insert 31.

  The molding die 10 including the upper die 11 and the lower die 12 includes a plate-like intermediate die 34 (third die) provided between the upper die 11 and the lower die 12. The intermediate mold 34 (intermediate plate) includes a plurality of blocks (intermediate mold frame 35 and intermediate mold insert 36), and these are assembled. In the intermediate mold 34, the intermediate mold insert 36 is provided in a housing portion (through hole) formed in the intermediate mold frame 35.

  The intermediate die 34 includes a resin placement portion 37 in which the resin R is placed in the intermediate die insert 36, a gate 24 that penetrates in the thickness direction, a cavity recess 40 that forms the cavity C, and a transport rail 41 that holds the workpiece W. And a housing recess 42 for housing (a jig) (see FIG. 6). The resin placement portion 37 (recessed portion) is provided to be recessed from the mold surface 30a on the upper mold 11 side of the intermediate die 34, and does not overlap with the cavity C (cavity recessed portion 40) in a plan view intersecting with the mold opening / closing direction. The cal 22 is overlapped. In the molding die 10 having such an intermediate die 34, the cull 22 and the runner 23 are formed at the boundary between the upper die 11 and the intermediate die 34 in the die closed state, and the boundary between the lower die 12 and the intermediate die 34 is formed. Thus, the cavity C is formed, and the resin arrangement portion 37, the cull 22, the runner 23, the gate 24, and the cavity C communicate with each other.

  The molding die 10 includes a fixing mechanism that fixes the intermediate die 34 between the upper die 11 and the die 12. The fixing mechanism of the present embodiment includes an upper chuck 43 and a lower chuck 44 (which is a hook-like claw portion as an example, but is not limited to the claw). The plurality of upper chucks 43 are provided around the mold surface 11a of the upper mold 11 at a predetermined interval, and are fixed on the upper mold 11 side so as to sandwich the outer periphery of the intermediate mold 34 (see FIG. 2). The upper mold chuck 43 is rotatably provided on the upper mold 11 so as to protrude from the mold surface 11 a of the upper mold 11. By rotating the upper mold chuck 43, the intermediate mold 34 arranged (set) on the mold surface 11a is fixed so as to be hooked, and can be opened. The plurality of lower mold chucks 44 are provided at predetermined intervals around the mold surface 12a of the lower mold 12, and are fixed on the lower mold 12 side so as to sandwich the outer periphery of the intermediate mold 34 (see FIG. 6). . The lower die chuck 44 is rotatably provided on the lower die 12 so as to protrude from the mold surface 12 a of the lower die 12. By rotating the lower die chuck 44, the intermediate die 34 arranged (set) on the die surface 12a is fixed so as to be hooked, and can also be released. In addition to the upper chuck 43 and the lower chuck 44, the fixing mechanism may be configured to switch between fixing and releasing the intermediate mold 34 by sliding the slider in the mold surface direction (horizontal direction). The upper mold 43 and the lower mold chuck 44 are mechanisms that move independently by a cylinder, an actuator, a motor, or the like.

  As described above, in the molding die 10 including the upper die chuck 43 and the lower die chuck 44 (fixing mechanism), when the resin R is supplied to the resin placement portion 37 in a state in which the die is opened, the intermediate die 34 is used by the lower die chuck 44. Is fixed on the lower mold 12 side, that is, fixed away from the upper mold 11 (see FIG. 7). Further, when taking out the molded product (work W) molded in the cavity C with the mold opened, the intermediate mold 34 is fixed on the upper mold 11 side by the upper mold chuck 43, that is, fixed away from the lower mold 12. (See FIG. 3). That is, by using the upper mold chuck 43 and the lower mold chuck 44, the intermediate mold 34 can be transferred between the upper mold 11 and the lower mold 12.

  According to this, the gate 24 (vertical) which divides the layer in which the cal 22 and the runner 23 are arranged and the layer in which the molded product (cavity C) is arranged through the intermediate die 34 and penetrates in the thickness direction of the intermediate die 34. Gate). Since the resin R is injected from the vertical gate 24, resin leakage can be prevented. Therefore, it is possible to improve the productivity by suppressing the number of cleanings against resin leakage. Further, the vertical gate 24 can minimize the runner arrangement area on the substrate on which an electronic component (for example, a semiconductor chip) is mounted as the work W. For this reason, more electronic components can be mounted in place of the runner installation area, and the number of products separated from the molded product after molding (sealing) can be increased. Therefore, it leads to reduction of product cost.

  Further, the gate arrangement can be freely changed with respect to the molded product by exchanging the intermediate die 34. Further, even if the workpiece W is a bonding wire used for electrical connection of an electronic component mounted on a substrate, for example, an effective place for preventing a wire flow (for example, directly above the cavity C) Alternatively, the vertical gate 24 can be disposed in the vicinity of the cavity C). In addition, using the intermediate mold 34 may make it difficult to arrange (set) the resin R in the mold, but this can be solved by providing the intermediate mold 34 with the resin arrangement portion 37. .

  In the present embodiment, the workpiece W (molded product) can be easily taken out by the ejector mechanisms 16 and 17 even if the molding die 10 uses the intermediate die 34 having the vertical gate 24. The ejector mechanism 16 includes an upper mold ejector pin 46 that reciprocates in the mold opening / closing direction, a support block 47 that supports the upper mold ejector pin 46, and a drive source (not shown) that moves the upper mold ejector pin 46 via the support block 47. (Cylinder, actuator, motor, etc.). In order to lower the upper ejector pin 46, the support block 47 is moved downward in the upper chase space, and the runner ejector pin 53 is represented by a spring to prevent the lower ejector pin 53 from moving downward at the same time. The elastic member 54 allows it.

  The upper mold insert 27 of the upper mold 11 and the intermediate mold insert 36 of the intermediate mold 34 are provided with pin holes 48 penetrating in the thickness direction so that the upper mold ejector pin 46 reciprocates. That is, when the workpiece W (molded molded product) is taken out into the cavity C, the upper mold ejector pin 46 pushes the workpiece W (molded product) to the lower mold 12 side to remove the workpiece W (molded product) from the intermediate mold 34. It is provided to release the mold (see FIG. 2). Further, the ejector mechanism 17 is not shown in the drawing, which moves the lower die ejector pin 50 through the support block 51, the lower die ejector pin 50 that reciprocates in the mold opening and closing direction, the support block 51 that supports the lower die ejector pin 50. Drive source (cylinder, actuator, motor, etc.). The lower mold insert 31 of the lower mold 12 includes a pin hole 52 penetrating in the thickness direction so that the lower mold ejector pin 50 reciprocates. That is, the lower die ejector pin 50 is provided so as to push the workpiece W (molded product) toward the upper die 11 and release the workpiece W (molded product) from the lower die 12 (see FIG. 3).

  The ejector mechanism 16 includes a runner ejector pin 53 that reciprocates in the mold opening and closing direction, and an elastic member 54 typified by a spring that urges the runner ejector pin 53 from the support block 47 to move it. The upper mold insert 27 of the upper mold 11 includes a pin hole 55 penetrating in the thickness direction so that the runner ejector pin 53 reciprocates. The runner ejector pin 53 is provided so that the tip surface thereof faces the gate 24 formed in the intermediate die 34. Moreover, the runner ejector pin 53 includes a groove 53a formed on the tip end surface thereof (see FIG. 6). According to the groove 53a, the resin R remaining in the runner 23 after molding can be released from the upper mold 11 in a locked state, and can be removed by a removal mechanism (not shown).

  The molding apparatus 100 including the molding die 10 according to the present embodiment includes a cleaner mechanism that cleans the mold surface. The cleaner mechanism includes a cleaner 55 that is inserted between the upper mold 11 and the intermediate mold 34 in a state where the mold is opened, and cleans the mold surface 11 a of the upper mold 11 and the mold surface 34 a of the intermediate mold 34 ( (See FIG. 7). The cleaner 55 includes a brush 55a for cleaning the mold surface 11a including the recesses and a brush 55b for cleaning the mold surface 34a including the recesses, and removes the resin R remaining on the mold surfaces 11a and 34a. . Further, the cleaner mechanism is inserted between the lower mold 12 and the intermediate mold 34 in a state where the mold is opened, and a cleaner 56 for cleaning the mold surface 12a of the lower mold 12 and the mold surface 34b of the intermediate mold 34 is provided. Provide (see FIG. 4). The cleaner 56 includes a brush 56a for cleaning the mold surface 12a including the recesses and a brush 56b for cleaning the mold surface 34b including the recesses, and removes the resin R and the like remaining on the mold surfaces 12a and 34b. . According to this cleaner mechanism, cleaning can be performed inside the mold (specifically, between the upper mold 11 and the lower mold 12) without taking out the intermediate mold 34 outside the mold. In the present embodiment, the cleaners 55 and 56 are described as separate configurations. However, the cleaners 55 and 56 may be integrated with each other by providing a mechanism for changing the height, or may be configured to be shared. In the present embodiment, the cleaner 55 is provided with a resin container 55c and used as a resin transport mechanism for supplying the resin R into the mold. According to this, the resin R can be supplied while cleaning. Further, in FIG. 4, when the mechanism straddling the transport rail 41 is used, the cleaner 56 may be a mechanism in which the upper mold brush 56b and the lower mold brush 56a are separated from each other.

  Next, the operation of the molding apparatus 100 including the molding die 10 according to the present embodiment will be described, and a method for manufacturing a molded product using the molding die 10 will be described. In the following, description will be made on the flow of manufacturing the molded product 10 as a molded product by taking out the workpiece W from a state in which the workpiece W is substantially completed as a molded product in the molding die 10.

  First, as shown in FIG. 1, in the state where the molding die 10 is closed, the molten resin R is pressed by the plunger 21, and the pot 20 and the resin placement portion 37 are passed through the cal 22, the runner 23, and the gate 24. Resin R is pumped to the cavity C by the plunger 21, and the cavity C is filled with the resin R. Next, the resin R filled in the cavity C is thermally cured for a predetermined time in a state where the resin R is held (final mold closed state). Next, the lower die 44 is opened (chuck off state) while the upper die 43 is closed (chuck on state), and the intermediate die 34 is fixed on the upper die 11 side.

  Thereafter, as shown in FIG. 2, the movable platen 13 is raised to open the mold 10. At this time, the intermediate die 34 is fixed apart from the lower die 12 because the upper die chuck 43 is closed and remains fixed on the upper die 11 side. At this time, the upper die ejector pin 46 is lowered, the workpiece W (molded product) is pushed out to the lower die 12 side and released (ejected) from the intermediate die 34, and the workpiece W is placed on the lower die 12. At this time, the workpiece W is divided from the narrow portion of the gate 24.

  Subsequently, as shown in FIG. 3, the lower die ejector pin 50 is raised to push the workpiece W (molded product) toward the upper die 11 and release from the lower die 12 (eject). Since the workpiece W (molded product) is held by the transport rail 41, it can move up and down outside the mold and is transported to a predetermined position. The molding die 10 may include a shuttle mechanism that reciprocates the lower die 12 relative to the upper die 11 in the planar direction in a planar direction that intersects the die opening and closing direction in the die open state. According to this, the workpiece W (molded product) can be easily taken out by shifting the lower die 12 from the state facing the upper die 11 while the intermediate die 34 is fixed to the upper die 11 side.

  Subsequently, as shown in FIG. 4, after the mold surface 12 a of the lower mold 12 (particularly the cavity recess 32) and the mold surface 34 b of the intermediate mold 34 (particularly the cavity recess 40) are cleaned by the cleaner 56, A new workpiece W (molded product) held by the transport rail 41 is transported from the outside into the mold. Next, the work W (molded product) is set (placed) on the work placement portion 13 of the lower mold 12. At this time, since the lower mold 12 is heated by the heating mechanism 15, preheating of the set work W is started. In the present embodiment, even when a new workpiece W (molded product) is set, the resin path such as the cull 22 and the runner 23 between the upper mold 11 and the intermediate mold 34 is still not used. Resin R remains.

  Subsequently, as shown in FIG. 5, the movable platen 13 is lowered to close the molding die 10 temporarily (soft clamp). Next, the upper chuck 43 is opened. Next, the intermediate die 34 is fixed on the lower die 12 side with the lower die chuck 44 closed (chuck-on state). Thereby, the intermediate mold 34 is transferred from the upper mold 11 side to the lower mold 12 side. Note that the operation of the upper mold chuck 43 and the operation of the lower mold check may be performed simultaneously.

  Thereafter, as shown in FIG. 6, the movable platen 13 is raised to open the mold 10. At this time, the intermediate die 34 remains fixed on the lower die 12 side, and thus is separated from the upper die 11. Further, the runner ejector pin 53 is lowered by being urged by the elastic member 54, and the resin R remaining in the cull 22 and the runner 23 is pushed out to the lower mold 12 side and released from the upper mold 11. Since the groove 53a is formed in the front end surface of the runner ejector 53, the mold can be released from the upper mold 11 while the residual resin R is locked. Next, the residual resin R is removed (taken out) out of the mold by a removal mechanism (not shown).

  Subsequently, as shown in FIG. 7, the mold surface 11 a of the upper mold 11 (particularly, the cal 22 and the runner 23) and the mold surface 34 a of the intermediate mold 34 (particularly the gate 24 and the resin placement portion 37) are cleaned by the cleaner 55. After cleaning, the tablet-shaped resin R is conveyed from outside the mold into the mold, and the resin R is set (arranged) in the resin arrangement portion 37. At this time, since the lower mold 12 is heated by the heating mechanism 15, the set resin R starts to melt.

  Next, the movable platen 13 is lowered and the molding die 10 is closed (clamped). Thereafter, as described with reference to FIG. 1, the molten resin R is pressed by the plunger 21 and is pumped to the cavity C to hold the resin R filled in the cavity C (final state) The mold is heat-cured for a predetermined time. In the present embodiment, since the molding die 10 including the vertical gate 24 is used, for example, resin leakage from the runner 23 can be prevented and the productivity of the molded product can be improved.

  The above-described operation flow of the molding die 10 is suitable for shortening the cycle time. However, in the cleaning step described with reference to FIG. 7, the resin scum is passed through the gate 24 and the pin hole 48 of the intermediate die 34. There is a possibility that the object to be molded (work W) enters the cavity C in which it is placed. For this reason, as an operation flow for giving priority to product quality, first, after taking out the molded product (work W) in the process with reference to FIG. 3 outside the mold, the mold surface 12a of the lower mold 12 and the intermediate mold The 34 mold surfaces 34b are cleaned. Next, the intermediate product 34 in the process referring to FIG. 5 is transferred to the lower mold 12 side without setting the molding target (work W) in the process referring to FIG. Next, after removing the resin R remaining on the kull 22 and the runner 23 in the step referring to FIG. 6, the cleaning in the step referring to FIG. 7 is performed. Then, after all the cleaning steps are completed, the molded product (work W) and the resin R are set. According to such an operation flow, it is possible to prevent the product quality from deteriorating.

  Although not shown or described in detail, there is a known mechanism for preventing positional displacement in the XY (planar) direction between the upper die chase 25 and the intermediate frame 35 and between the middle frame 35 and the lower die chase 30. A misalignment prevention mechanism such as a lock block is provided.

(Embodiment 2)
A molding apparatus 100 including a molding die 10 (molding die mechanism) that performs transfer molding according to Embodiment 2 of the present invention will be described with reference to FIGS. FIGS. 8-14 is typical sectional drawing of the principal part of the shaping | molding apparatus 100 in operation | movement (during the manufacturing process of a molded article) in this embodiment. The molding die 10 according to the first embodiment is a type in which the upper mold 11 is provided with a pot 20 (transfer mechanism), and the intermediate mold 34 is transferred and fixed to the upper mold 11 and the lower mold 12. In contrast, the molding die 10 according to the second embodiment is different in configuration in that a pot 20 (transfer mechanism) is provided in the lower die 12.

  Specifically, the operation of the molding apparatus 100 including the molding die 10 according to the present embodiment will be described, and a method for manufacturing a molded product using the molding die 10 will be described. In the following, description will be made on the flow of manufacturing the molded product 10 as a molded product by taking out the workpiece W from a state in which the workpiece W is substantially completed as a molded product in the molding die 10.

  First, as shown in FIG. 8, in the state where the molding die 10 is closed, the molten resin R is pressed by the plunger 21, and the pot 20 and the resin placement portion 37 are passed through the cal 22, the runner 23, and the gate 24. Resin R is pumped to the cavity C by the plunger 21, and the cavity C is filled with the resin R. Next, the resin R filled in the cavity C is thermally cured for a predetermined time in a state where the resin R is held (final mold closed state). Next, the lower die 44 is opened (chuck off state) while the upper die 43 is closed (chuck on state), and the intermediate die 34 is fixed on the upper die 11 side.

  Thereafter, as shown in FIG. 9, the movable platen 13 is raised to open the mold 10. At this time, the intermediate die 34 remains fixed on the upper die 11 side, and thus is separated from the lower die 12. Further, the upper die ejector pin 46 is lowered, the workpiece W (molded product) is pushed out to the lower die 12 side and released (ejected) from the intermediate die 34, and the workpiece W is placed on the lower die 12.

  Subsequently, as shown in FIG. 10, the lower die ejector pin 50 is raised, the workpiece W (molded product) is pushed out to the upper die 11 side, released from the lower die 12 (ejected), and the workpiece W extends to the outside of the die. Take out. Since the workpiece W (molded product) is held by the transport rail 41, it can move up and down outside the mold and is transported to a predetermined position.

  Subsequently, as shown in FIG. 11, after the mold surface 12a (particularly, the cavity recess 32) of the lower mold 12 and the mold surface 34b (particularly the cavity recess 40) of the intermediate mold 34 are cleaned by the cleaner 56, the mold A new workpiece W (molded product) held by the transport rail 41 is transported from the outside into the mold. Next, the work W (molded product) is set (placed) on the work placement portion 13 of the lower mold 12. At this time, since the lower mold 12 is heated by the heating mechanism 15, preheating of the set work W is started.

  Subsequently, as shown in FIG. 12, the movable platen 13 is lowered and the molding die 10 is temporarily closed (soft clamp). Next, the intermediate die 34 is fixed on the lower die 12 side with the upper die 43 opened, and then with the lower die 44 closed (chuck-on state). Thereby, the intermediate mold 34 is transferred from the upper mold 11 side to the lower mold 12 side.

  Thereafter, as shown in FIG. 13, the movable platen 13 is raised to open the mold 10. At this time, the intermediate die 34 remains fixed on the lower die 12 side. Further, the runner ejector pin 53 is lowered by being urged by the elastic member 54, and the resin R remaining in the cull 22 and the runner 23 is pushed out to the lower mold 12 side and released from the upper mold 11. Since the groove 53a is formed in the front end surface of the runner ejector 53, the mold can be released from the upper mold 11 while the residual resin R is locked. Next, the residual resin R is removed (taken out) out of the mold by a removal mechanism (not shown).

  Subsequently, as shown in FIG. 14, the mold surface 11 a of the upper mold 11 (particularly, the cal 22 and the runner 23) and the mold surface 34 a of the intermediate mold 34 (particularly the gate 24 and the resin placement portion 37) are cleaned by the cleaner 55. After cleaning, the tablet-shaped resin R is transported from outside the mold into the mold. In the present embodiment, the resin arrangement portion 37 is provided so as to penetrate the intermediate mold 34 in the thickness direction and communicate with the pot 20 of the lower mold 11. For this reason, the resin R conveyed into the mold is set (arranged) so as to be dropped into the resin arrangement portion 37 and the pot 20. The set resin R starts to melt because the lower mold 12 is heated by the heating mechanism 15.

  Next, the movable platen 13 is lowered and the molding die 10 is closed (clamped). Thereafter, as described with reference to FIG. 8, the molten resin R is pressed by the plunger 21 and is pumped to the cavity C to hold the resin R filled in the cavity C (final state). The mold is heat-cured for a predetermined time. Thereby, the workpiece | work W becomes a molded article. According to the molding die 10 having the vertical gate structure including the upper chuck 43 and the lower chuck 44 as described above, resin leakage can be prevented and the productivity of the molded product can be improved.

(Embodiment 3)
A molding apparatus 100 including a molding die 10 (molding die mechanism) for performing transfer molding according to Embodiment 3 of the present invention will be described with reference to FIG. FIG. 15 is a schematic cross-sectional view of a main part of the molding apparatus 100 in the present embodiment. The molding die 10 according to the first embodiment is a type in which the upper mold 11 is provided with a pot 20 (transfer mechanism), and the intermediate mold 34 is transferred and fixed to the upper mold 11 and the lower mold 12. On the other hand, the molding die 10 according to the third embodiment is different in configuration in that the intermediate die 34 is suspended from the upper die 11 and fixed.

  The molding die 10 according to the present embodiment includes a fixing mechanism that fixes the intermediate die 34 between the upper die 11 and the lower die 12. The fixing mechanism includes a plurality of support posts 60 that are provided around the mold surface 11a of the upper mold 11 (four corners) and suspend and support the intermediate mold 34 to reciprocate in the mold opening / closing direction. The intermediate die 34 includes a post hole 61 that penetrates in the thickness direction so that the support post 60 can slide. One end side of the support post 60 is fixed by the upper die 11, and the other end side is passed through the post hole 61 of the intermediate die 34 and is latched (prevented from being detached) at the flange-shaped tip portion. Therefore, in a state where the movable platen 13 is raised and completely opened, the intermediate die 34 is fixed (supported) while being suspended by the support post 60 (fixing mechanism) as shown in FIG. The lower mold 12 includes a plurality of insertion holes 62 at positions facing each of the plurality of support posts 60 so that the support posts 60 are inserted when the mold is closed.

  Next, the operation of the molding apparatus 100 including the molding die 10 according to the present embodiment will be described, and a method for manufacturing a molded product using the molding die 10 will be described. First, as shown in FIG. 15, in a state where the mold is opened, the intermediate mold 34 is fixed away from the lower mold 12 by the support posts 60, and the workpiece W (molded product) is arranged on the arrangement portion 32. Next, when the movable platen 13 is lowered, the intermediate die 34 suspended by the support posts 60 is also lowered, but eventually comes into contact with the lower die 12. At this time, the intermediate die 34 is separated from the upper die 11 by the support post 60 and fixed. Since a space for transporting the resin R is formed between the upper mold 11 and the intermediate mold 34, the resin R is set (arranged) in the resin arrangement portion 37. Since the intermediate mold 34 is provided with the heating mechanism 15, the set resin R starts to melt. Thus, by providing the heating mechanism 15 in the intermediate mold 34, the temperature of the intermediate mold 34 can be stabilized.

Next, when the movable platen 13 is further lowered, the support post 60 is inserted into the insertion hole 62 while the intermediate die 34 remains on the lower die 12, and is provided on the periphery of the mold surface 11a of the upper die 11. The elastic member 63 (for example, O-ring) is compressed and the upper die 11 comes into contact with the intermediate die 34 to be closed (clamped). Next, in a state where the mold is closed, the resin R is pumped from the resin arrangement portion 37 to the cavity C (configured by the cavity recesses 32 and 40) through the cull 22, the runner 23, and the gate 24, and the resin R is passed through the cavity C. The resin R filled in the cavity C is thermally cured. Thereby, the workpiece | work W becomes a molded article.

Next, when the movable platen 13 is raised, the upper die 11 moves away from the intermediate die 34, and eventually the intermediate die 34 is fixed to the support post 60, and when the movable platen 13 is further raised, FIG. As shown, the mold is opened. With the mold open, the workpiece W (molded product) is taken out, and the resin R remaining in the resin path such as the cull 22 and the runner 23 is taken out, and the mold surface 11a of the upper mold 11 and the mold of the intermediate mold 34 are removed. The surfaces 34a and 34b and the mold surface 12a of the lower mold 12 are cleaned. Thereafter, as described above, a new workpiece W (molded product) and resin R are arranged, and the process is repeated. According to the novel vertical gate structure molding die 10 provided with such support posts 60, resin leakage can be prevented and the productivity of the molded product can be improved.

(Embodiment 4)
A molding apparatus 100 including a molding die 10 (molding die mechanism) for performing transfer molding according to Embodiment 4 of the present invention will be described with reference to FIG. FIG. 16 is a schematic cross-sectional view of a main part of the molding apparatus 100 in the present embodiment. The molding die 10 according to the first embodiment is a type in which the upper mold 11 is provided with a pot 20 (transfer mechanism), and the intermediate mold 34 is transferred and fixed to the upper mold 11 and the lower mold 12. On the other hand, the molding die 10 according to the fourth embodiment is configured in that the pot 20 (transfer mechanism) is provided in the lower die 12 and the intermediate die 34 is suspended and fixed from the upper die 11 by the support posts 60. Is different. The novel vertical gate structure molding die 10 provided with such a support post 60 can also prevent resin leakage and improve the productivity of the molded product.

(Embodiment 5)
A molding apparatus 100 including a molding die 10 (molding die mechanism) for performing transfer molding according to Embodiment 5 of the present invention will be described with reference to FIG. FIG. 17 is a schematic cross-sectional view of a main part of the molding apparatus 100 in the present embodiment. The molding die 10 according to the first embodiment is a type in which the upper mold 11 is provided with a pot 20 (transfer mechanism), and the intermediate mold 34 is transferred and fixed to the upper mold 11 and the lower mold 12. On the other hand, the molding die 10 according to the fifth embodiment is different in configuration in that the intermediate die 34 is pushed up from the lower die 12 and fixed.

  The molding die 10 according to the present embodiment includes a fixing mechanism that fixes the intermediate die 34 between the upper die 11 and the lower die 12. This fixing mechanism includes a plurality of support posts 60 that are provided around the mold surface 11a of the upper mold 11 (four corners) and push up and support the intermediate mold 34 to reciprocate in the mold opening and closing direction. The intermediate die 34 includes a post hole 61 penetrating in the thickness direction so as to pass the support post 60. Further, the lower mold 12 includes a plurality of insertion holes 62 at positions facing each of the plurality of support posts 60 so that the support posts 60 are inserted when the mold is closed. One end of the support post 60 is fixed by the intermediate die 34, and the other end is connected to a lifting drive mechanism (not shown). Therefore, in a state where the movable platen 13 is raised and completely opened, the intermediate die 34 is fixed (supported) while being pushed up by the support post 60 (fixing mechanism) as shown in FIG.

Next, the operation of the molding apparatus 100 including the molding die 10 according to the present embodiment will be described, and a method for manufacturing a molded product using the molding die 10 will be described. First, as shown in FIG. 17, in a state where the mold is opened, the intermediate mold 34 is fixed away from the lower mold 12 by the support posts 60, and the workpiece W (molded product) is arranged on the arrangement portion 32. Next, with the upper die 11 as it is, the support post 60 is inserted into the insertion hole 62 by the lifting drive mechanism, and the intermediate die 34 is lowered through the support post 60 to contact the lower die 12. Accordingly, a space for transporting the resin R is formed between the upper mold 11 and the intermediate mold 34, and the resin R is set (arranged) in the resin arrangement portion 37. Since the intermediate mold 34 is provided with the heating mechanism 15, the set resin R starts to melt.

  Next, when the movable platen 13 is lowered, the upper mold 11 comes into contact with the intermediate mold 34, and when the movable platen 13 is further lowered, the elastic member 63 (provided on the periphery of the mold surface 12a of the lower mold 12). For example, the O-ring is compressed and the intermediate die 34 comes into contact with the lower die 12 to be closed (clamped). Next, in a state where the mold is closed, the resin R is pumped from the resin arrangement portion 37 to the cavity C (configured by the cavity recesses 32 and 40) through the cull 22, the runner 23, and the gate 24, and the resin R is passed through the cavity C. The resin R filled in the cavity C is thermally cured. Thereby, the workpiece | work W becomes a molded article.

Next, the movable platen 13 is raised until the position shown in FIG. 17 is reached, and the intermediate die 34 is raised via the support post 60 by the lifting drive mechanism to be in a state of being opened. With the mold open, the workpiece W (molded product) is taken out, and the resin R remaining in the resin path such as the cull 22 and the runner 23 is taken out, and the mold surface 11a of the upper mold 11 and the mold of the intermediate mold 34 are removed. The surfaces 34a and 34b and the mold surface 12a of the lower mold 12 are cleaned. Thereafter, as described above, a new workpiece W (molded product) and resin R are arranged, and the process is repeated. According to the novel vertical gate structure molding die 10 provided with such support posts 60, resin leakage can be prevented and the productivity of the molded product can be improved.

(Embodiment 6)
A molding apparatus 100 including a molding die 10 (molding die mechanism) for performing transfer molding according to Embodiment 6 of the present invention will be described with reference to FIG. FIG. 18 is a schematic cross-sectional view of a main part of the molding apparatus 100 in the present embodiment. The molding die 10 according to the first embodiment is a type in which the upper mold 11 is provided with a pot 20 (transfer mechanism), and the intermediate mold 34 is transferred and fixed to the upper mold 11 and the lower mold 12. On the other hand, the molding die 10 according to the sixth embodiment is configured in that the pot 20 (transfer mechanism) is provided in the lower die 12 and the intermediate die 34 is pushed up from the lower die 12 by the support posts 60 and fixed. Is different. The novel vertical gate structure molding die 10 provided with such a support post 60 can also prevent resin leakage and improve the productivity of the molded product.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the above-described embodiment, the case where the vertical gate is provided above the cavity in the vertical direction (mold opening / closing direction) has been described. The vertical gate is not limited to this, and a vertical gate may be provided on the lower side in the vertical direction. For the vertical gate on the lower side in the vertical direction, the mold configuration described in the above embodiment may be reversed.

  In the said embodiment, the case where the shape of resin arrange | positioned at a resin arrangement | positioning part before shaping | molding was a tablet shape was demonstrated. Not limited to this, the shape of the resin can be liquid, powder, sheet, or the like. At this time, it is conceivable that the resin placement portion has a shape suitable for the resin shape.

  In the embodiment, the case where the upper mold is the movable mold and the lower mold is the fixed mold has been described. Not limited to this, the upper mold may be a fixed mold, the lower mold may be a movable mold, or both may be movable.

DESCRIPTION OF SYMBOLS 10 Molding die 11 Upper mold 12 Lower mold 22 Cal 23 Runner 24 Gate 34 Intermediate mold 37 Resin arrangement part 43 Upper mold chuck 44 Lower mold chuck 100 Molding device C Cavity R Resin

Claims (7)

A first mold and a second mold which are provided so as to be openable and closable;
A third mold provided between the first mold and the second mold;
A plurality of first chucks provided around the mold surface of the first mold and fixing the third mold on the first mold side, and provided around the mold surface of the second mold A plurality of second chucks for fixing the third mold on the second mold side, and fixing the third mold between the first mold and the second mold. A fixing mechanism,
The third mold has a resin arrangement portion where resin is arranged and a gate penetrating in the thickness direction,
In the mold closed state, a cull and a runner are formed at the boundary between the first mold and the third mold, and a cavity is formed at the boundary between the second mold and the third mold, The resin placement portion, the cal, the runner, the gate and the cavity communicate with each other,
The third mold is fixed on the second mold side when the resin is supplied through the resin placement portion with the first chuck opened and the second chuck closed and the mold opened.
When the molded product molded in the cavity is taken out, the second chuck is opened and the third mold is fixed on the first mold side and the mold is opened while the first chuck is closed. Characteristic mold. A first mold and a second mold which are provided so as to be openable and closable;
A third mold provided between the first mold and the second mold;
A plurality of support posts which are provided around a mold surface of the first or second mold and support the third mold and reciprocate in a mold opening and closing direction; and the first mold and the first mold A fixing mechanism for fixing the third mold between the two molds,
The third mold has a resin arrangement portion where resin is arranged and a gate penetrating in the thickness direction,
In the mold closed state, a cull and a runner are formed at the boundary between the first mold and the third mold, and a cavity is formed at the boundary between the second mold and the third mold, The resin placement portion, the cal, the runner, the gate and the cavity communicate with each other,
When supplying the resin to the resin placement portion in a mold open state, the third mold is supported by the support post apart from the first mold and the second mold,
When the molded product molded in the cavity is opened and taken out, the third mold is separated from the first mold and the second mold and is supported by the support post. Mold. In the molding die according to claim 1 or 2,
The first mold has a first ejector pin that reciprocates in the mold opening and closing direction,
The second mold has a second ejector pin that reciprocates in the mold opening and closing direction,
The third mold has a pin hole penetrating in the thickness direction so that the first ejector pin reciprocates,
When taking out the molded product molded in the cavity, the first ejector pin is provided to push the molded product to the second mold side to release the molded product from the third mold, The molding die, wherein the second ejector pin is provided so as to push the molded product toward the first mold to release the molded product from the second mold. In the molding die according to any one of claims 1 to 3,
In the mold open state, the third mold is fixed on the first mold side by the fixing mechanism, and the second mold is moved relative to the first mold in a direction crossing the mold opening / closing direction. A molding die comprising a shuttle mechanism that reciprocates. The molding die according to any one of claims 1 to 4,
A mold is inserted between the first mold and the third mold in a state where the mold is opened, and a mold surface of the first mold and one mold surface of the third mold are cleaned. 1 cleaner and
A second mold is inserted between the second mold and the third mold in the opened state to clean the mold surface of the second mold and the other mold surface of the third mold. A molding apparatus comprising two cleaners. A first mold and a second mold that are provided so as to face each other so that the mold can be opened and closed; a resin arrangement portion provided between the first mold and the second mold; A third mold having a gate penetrating through the first mold, a plurality of first chucks provided around a mold surface of the first mold, and fixing the third mold on the first mold side; A plurality of second chucks provided around the mold surface of the second mold and fixing the third mold on the second mold side; the first mold and the second mold A method of manufacturing a molded product using a molding die provided with a fixing mechanism for fixing the third die between the die,
(A) fixing the third mold on the second mold side by the second chuck in a state where the mold is opened, and disposing the resin on the resin disposing portion;
(B) Close the mold to form a cull and a runner at the boundary between the first mold and the third mold, and form a cavity at the boundary between the second mold and the third mold, A step of pumping the resin from the resin arrangement portion to the cavity through the cull, the runner, and the gate, filling the cavity with the resin, and thermosetting the resin filled in the cavity; When,
(C) after fixing the third mold on the first mold side by the first chuck, opening the mold away from the second mold and taking out the molded product formed in the cavity; ,
The manufacturing method of the molded article characterized by including this. A first mold and a second mold that are provided so as to face each other so that the mold can be opened and closed; a resin arrangement portion provided between the first mold and the second mold; And a plurality of supports provided around the mold surface of the first or second mold and reciprocating in the mold opening / closing direction by supporting the third mold. A method for producing a molded article using a molding die having a post and a fixing mechanism for fixing the third die between the first die and the second die,
(A) The third mold is supported by being spaced apart from the first mold and the second mold while being supported by the support post in a state where the mold is opened, and the resin is disposed in the resin placement portion. Process,
(B) the local at the boundary with the support post inserted into the insertion holes provided in the mold surface facing the third mold mold closing to the first mold and the third mold and runner And a cavity is formed at the boundary between the second mold and the third mold, and the resin is pumped from the resin placement portion to the cavity through the cull, the runner, and the gate. Filling the cavity with the resin and thermosetting the resin filled in the cavity;
(C) The first mold and the second mold are opened, and the third mold is separated from the first mold and the second mold and supported by the support post while the cavity is supported. A step of taking out the molded product formed in
The manufacturing method of the molded article characterized by including this.

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