JP6425639B2 - Substrate processing system - Google Patents

Description

  The disclosed embodiments relate to substrate processing systems.

  Conventionally, in the manufacturing process of semiconductor devices, various processes such as etching process, cleaning process or film forming process are performed on a substrate such as a semiconductor wafer.

  There are two types of processing for the substrate: one performed with the front surface of the substrate facing upward and the one performed with the back surface of the substrate facing upward. Therefore, in recent years, a substrate processing system has both a processing unit that performs substrate processing on a substrate whose front surface is upward and a processing unit that performs substrate processing on a substrate whose back surface is upward. Proposed.

  For example, Patent Document 1 discloses a first processing apparatus that supplies a cleaning liquid to the front surface of the substrate with the front surface of the substrate facing upward, and a back surface of the substrate with the back surface of the substrate facing upward. A second processing apparatus for supplying a cleaning liquid, a substrate reversing apparatus for reversing the front and back of a substrate, and a substrate transfer apparatus for accessing a first processing apparatus, a second processing apparatus, and a substrate reversing apparatus to load and unload a substrate A substrate processing system is disclosed.

Unexamined-Japanese-Patent No. 2013-21026

  However, in the substrate processing system described in Patent Document 1, there is a possibility that the state management of the substrate may be complicated because the substrate with the front surface facing upward and the substrate with the back surface facing up are mixed.

  One aspect of the embodiment provides a substrate processing system capable of suppressing complication of state management of the front and back of a substrate when handling both a front side up substrate and a back side up substrate. The purpose is

  A substrate processing system according to an aspect of the embodiment includes a first processing block, a second processing block, and a reversing mechanism. The first processing block includes a first processing unit that processes the substrate with the first surface of the substrate facing upward, and a first transfer device that transfers the substrate to and from the first processing unit. The second processing block includes a second processing unit for processing the substrate with the second surface facing the first surface of the substrate facing upward, and a second processing unit for processing the substrate relative to the second processing unit. And a second transfer device for carrying in and out. The reversing mechanism is disposed in the middle of the transport path of the substrate from the first processing block to the second processing block, and reverses the substrate.

  According to one aspect of the embodiment, in the case of handling both a substrate whose front surface is upward and a substrate whose back surface is upward, complication of state management of front and back of the substrate can be suppressed.

FIG. 1 is a schematic plan view of the substrate processing system according to the first embodiment. FIG. 2 is a schematic side view of the substrate processing system according to the first embodiment. FIG. 3 is a schematic plan view of the first processing unit. FIG. 4 is a schematic side view of the first processing unit. FIG. 5 is a schematic plan view of the second processing block. FIG. 6 is a schematic plan view of the second processing unit. FIG. 7 is a schematic side view of the second processing unit. FIG. 8 is a diagram showing the configuration of the first buffer unit. FIG. 9 is a diagram showing the configuration of the first buffer unit. FIG. 10 is a layout view of the main transfer device, the transfer device, the first transfer device, and the second transfer device. FIG. 11 is a schematic plan view of a wafer holding unit provided in the first transfer device. FIG. 12 is a schematic plan view of a wafer holding unit provided in the second transfer device. FIG. 13 is an explanatory diagram of a wafer transfer flow in the substrate processing system according to the first embodiment. FIG. 14 is a schematic plan view of the substrate processing system according to the second embodiment. FIG. 15 is a schematic side view of the substrate processing system according to the second embodiment. FIG. 16 is an explanatory diagram of a wafer transfer flow in the substrate processing system according to the second embodiment. FIG. 17 is a schematic plan view of the substrate processing system according to the third embodiment. FIG. 18 is an explanatory diagram of a wafer transfer flow in the substrate processing system according to the third embodiment. FIG. 19 is a schematic side view of the first processing unit according to the fourth embodiment. FIG. 20 is a schematic plan view of the substrate processing system according to the fifth embodiment. FIG. 21 is a schematic side view of a substrate processing system according to a fifth embodiment. FIG. 22 is a schematic plan view of a second processing unit according to the fifth embodiment. FIG. 23 is a schematic rear view of the delivery block according to the fifth embodiment. FIG. 24 is a schematic plan view of the buffer unit. FIG. 25 is a schematic side view of the buffer unit. FIG. 26 is an explanatory diagram of the transfer flow of the wafer W in the substrate processing system according to the fifth embodiment. FIG. 27 is an explanatory diagram of the transfer flow of the wafer W in the substrate processing system according to the fifth embodiment. FIG. 28 is an explanatory diagram of a wafer transfer flow when the front surface cleaning process is not performed.

  Hereinafter, embodiments of a substrate processing system disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited by the embodiments described below.

First Embodiment
<Configuration of Substrate Processing System 1>
First, the configuration of a substrate processing system 1 according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic plan view of the substrate processing system 1 according to the first embodiment. FIG. 2 is a schematic side view of the substrate processing system 1 according to the first embodiment. In the following, in order to clarify the positional relationship, the X axis, the Y axis, and the Z axis orthogonal to one another are defined, and the positive direction of the Z axis is the vertically upward direction.

  As shown in FIG. 1, the substrate processing system 1 according to the first embodiment includes a loading / unloading block 2, a processing block 3, and a delivery block 4. These are arranged in order of the loading and unloading block 2, the delivery block 4 and the processing block 3.

  The substrate processing system 1 transports the substrate carried in from the carry-in / out block 2, which is a semiconductor wafer (hereinafter, wafer W) in the present embodiment, to the processing block 3 via the delivery block 4 and processes it in the processing block 3. In addition, the substrate processing system 1 returns the processed wafer W from the processing block 3 to the loading / unloading block 2 via the delivery / receiving block 4 and delivers it from the loading / unloading block 2 to the outside. The configuration of each block 2 to 4 will be described below.

<Configuration of import / output block 2>
The loading / unloading block 2 includes a placement unit 11 and a transport unit 12. A plurality of cassettes C each accommodating a plurality of wafers W in a horizontal state are placed on the placement unit 11.

  The transport unit 12 is disposed adjacent to the placement unit 11 and includes a main transport device 13 therein. The main transfer device 13 transfers the wafer W between the placement unit 11 and the delivery block 4.

<Configuration of Processing Block 3>
As shown in FIG. 2, the processing block 3 includes a first processing block 3U and a second processing block 3L. The first processing block 3U and the second processing block 3L are spatially separated by a partition wall, a shutter or the like, and are arranged side by side in the height direction. In the present embodiment, the first processing block 3U is disposed on the upper side, and the second processing block 3L is disposed on the lower side.

  In the first processing block 3U, processing is performed on the wafer W in a state in which the circuit formation surface (hereinafter, referred to as "front surface") is directed upward. On the other hand, in the second processing block 3L, processing is performed on the wafer W in a state in which the back surface, which is the surface opposite to the front surface, is directed upward. The configurations of the first processing block 3U and the second processing block 3L will be described.

<Configuration of First Processing Block 3U>
As shown in FIG. 1, the first processing block 3U includes a transport unit 16, a first transport device 17, and a plurality of first processing units 18. The first conveyance device 17 is disposed inside the conveyance unit 16, and the plurality of first processing units 18 are disposed adjacent to the conveyance unit 16 outside the conveyance unit 16.

  The first transfer device 17 transfers the wafer W between the delivery block 4 and the first processing unit 18. Specifically, the first transfer device 17 takes out the wafer W from the delivery block 4 and transfers the wafer W to the first processing unit 18, and the wafer W processed by the first processing unit 18 from the first processing unit 18. A process of taking out and transporting to the delivery block 4 is performed.

  The first processing unit 18 performs a bevel cleaning process on the wafer W with the front surface facing upward. The bevel cleaning process is a process for removing particles, boat marks and the like attached to the peripheral portion (bevel portion) of the wafer W.

  Here, the configuration of the first processing unit 18 will be described with reference to FIGS. 3 and 4. FIG. 3 is a schematic plan view of the first processing unit 18. FIG. 4 is a schematic side view of the first processing unit 18.

  As shown in FIGS. 3 and 4, the first processing unit 18 includes a first chamber 101, a first holding unit 102, a first recovery cup 103, a bevel cleaning unit 104, and a first discharge unit 105 (see FIG. 4).

  The first chamber 101 accommodates the first holding unit 102, the first recovery cup 103, the bevel cleaning unit 104, and the first discharge unit 105. A ceiling of the first chamber 101 is provided with a FFU (Fun Filter Unit) 111 that forms a downflow in the first chamber 101.

  The first holding unit 102 includes a suction holding unit 121 for holding the wafer W by suction, a support member 122 for supporting the suction holding unit 121, and a drive unit 123 for rotating the support member 122.

  The suction holding unit 121 is connected to an intake device (not shown) such as a vacuum pump, and holds the wafer W horizontally by adsorbing the back surface of the wafer W using negative pressure generated by the intake of the intake device. Do. For example, a porous chuck can be used as the suction holding unit 121. The suction method is not limited to the above example, and another method such as an electrostatic chuck may be used.

  The suction holding unit 121 has a suction area smaller in diameter than the wafer W. Thereby, the bevel brush 141 of the bevel cleaning unit 104 described later can be brought into contact with the peripheral portion of the wafer W.

  The support member 122 is provided at the lower part of the suction holding portion 121, and is rotatably supported by the first chamber 101 and the first recovery cup 103 via a bearing (not shown). The drive unit 123 is provided at the lower part of the support member 122, and rotates the support member 122 about the vertical axis. Thus, the wafer W held by suction by the suction holding unit 121 is rotated.

  The first recovery cup 103 is disposed to surround the first holding portion 102. At the bottom of the first recovery cup 103, a drainage port 131 for discharging the chemical solution discharged from the first discharge unit 105 to the outside of the first chamber 101, and for discharging the atmosphere in the first chamber 101. An exhaust port 132 is formed.

  The bevel cleaning unit 104 includes a bevel brush 141, an arm 143 extending in the horizontal direction (here, Y-axis direction) and supporting the bevel brush 141 from above via the shaft 142, and an arm 143 horizontally along the rail 144. And a moving mechanism 145 for moving in the direction (here, the X-axis direction). The moving mechanism 145 can move the arm 143 in the vertical direction (Z-axis direction).

  The first discharge unit 105 is provided, for example, at the bottom of the first recovery cup 103, and is connected to the chemical solution supply source 152 via a valve 151, a flow rate regulator (not shown), and the like. The first discharge unit 105 discharges the chemical solution supplied from the chemical solution supply source 152 toward the periphery of the back surface of the wafer W. Note that, for example, SC1 (a mixed solution of ammonia / hydrogen peroxide / water) or the like can be used as the chemical solution supplied from the chemical solution supply source 152.

  The first processing unit 18 is configured as described above, and rotates the wafer W in a state where the rear surface of the wafer W whose front surface is upward is held by suction by the suction holding unit 121. Then, the first processing unit 18 brings the bevel brush 141 of the bevel cleaning unit 104 into contact with the peripheral portion of the wafer W while discharging the chemical solution from the first discharge unit 105 toward the rear surface peripheral portion of the rotating wafer W. As described above, by combining chemical cleaning with a chemical solution and physical cleaning with the bevel brush 141, the removal performance of particles, boat marks and the like can be enhanced.

  Note that the first processing unit 18 may perform a rinse process to wash away the chemical solution remaining on the peripheral portion of the wafer W by supplying a rinse liquid such as pure water from the first discharge unit 105 after the bevel cleaning process. . In addition, the first processing unit 18 dries the peripheral portion of the wafer W by rotating the wafer W after the rinse process.

<Configuration of Second Processing Block 3L>
Subsequently, the configuration of the second processing block 3L will be described with reference to FIG. FIG. 5 is a schematic plan view of the second processing block 3L.

  As shown in FIG. 5, the second processing block 3 </ b> L includes a conveyance unit 26, a second conveyance device 27, and a plurality of second processing units 28. The second transport device 27 is disposed inside the transport unit 26, and the plurality of second processing units 28 are disposed adjacent to the transport unit 26 outside the transport unit 26.

  The second transfer unit 27 transfers the wafer W between the delivery block 4 and the second processing unit 28. Specifically, the second transfer device 27 takes out the wafer W from the delivery block 4 and transfers the wafer W to the second processing unit 28, and the wafer W processed by the second processing unit 28 from the second processing unit 28. A process of taking out and transporting to the delivery block 4 is performed.

  The second processing unit 28 performs back surface cleaning processing for removing particles and the like attached to the back surface of the wafer W with the back surface facing upward. Here, the configuration of the second processing unit 28 will be described with reference to FIGS. 6 and 7. FIG. 6 is a schematic plan view of the second processing unit 28. As shown in FIG. FIG. 7 is a schematic side view of the second processing unit 28.

  As shown in FIGS. 6 and 7, the second processing unit 28 includes a second chamber 201, a second holding unit 202, a second recovery cup 203, a back surface cleaning unit 204, and a second discharge unit 205. Prepare.

  The second chamber 201 accommodates the second holding unit 202, the second recovery cup 203, the back surface cleaning unit 204, and the second discharge unit 205. The ceiling portion of the second chamber 201 is provided with an FFU 211 that forms a downflow in the second chamber 201.

  The second holding portion 202 includes a main body portion 221 having a diameter larger than that of the wafer W, a plurality of holding portions 222 provided on the upper surface of the main body portion 221, a support member 223 supporting the main body portion 221, and a support member 223. A drive unit 224 is provided to rotate.

  The second holding unit 202 holds the wafer W by holding the peripheral portion of the wafer W using the plurality of holding units 222. Thus, the wafer W is held horizontally in a state of being slightly separated from the upper surface of the main body portion 221.

  In the second processing unit 28, the back surface cleaning process is performed on the wafer W in which the back surface is directed upward, in other words, the front surface is directed downward. For this reason, if the second processing unit 28 uses a type that adsorbs the wafer W as the first holding unit 102 (see FIG. 4), there is a possibility that the front surface, which is the circuit formation surface, may be soiled. Therefore, in the substrate processing system 1, the second holding unit 202 is of a type that holds the peripheral portion of the wafer W so as not to contaminate the circuit formation surface as much as possible.

  The second recovery cup 203 is disposed to surround the second holding unit 202. At the bottom of the second recovery cup 203, the same drainage port 231 and exhaust port 232 as the first recovery cup 103 are formed.

  The back surface cleaning unit 204 extends along the back surface brush 241, an arm 243 extending in the horizontal direction (here, Y axis direction) and supporting the back surface brush 241 from above via the shaft 242, and the arm 243 along the rail 244. And a moving mechanism 245 for moving in the horizontal direction (here, the X-axis direction). The moving mechanism 245 can move the arm 243 in the vertical direction (Z-axis direction). In addition, the back surface cleaning unit 204 includes a rotation mechanism (not shown), and can use the rotation mechanism to rotate the back surface brush 241 around the shaft 242.

  The second discharge unit 205 is disposed outside the second recovery cup 203. The second discharge unit 205 includes a nozzle 251, an arm 252 extending in the horizontal direction and supporting the nozzle 251, and a pivoting elevating mechanism 253 that pivots and raises and lowers the arm 252.

  As shown in FIG. 7, the nozzle 251 is connected to the cleaning liquid supply source 256 via a valve 255, a flow rate regulator (not shown), and the like. The second discharge unit 205 discharges the cleaning liquid supplied from the cleaning liquid supply source 256 toward the wafer W. The cleaning liquid supplied from the cleaning liquid supply source 256 is, for example, pure water. In addition, you may make it utilize a chemical | medical solution (for example, SC-1) as a washing | cleaning liquid.

  The second processing unit 28 is configured as described above, and the second holding unit 202 holds and rotates the peripheral portion of the wafer W whose back surface is directed upward. Subsequently, the second processing unit 28 brings the back surface brush 241 of the back surface cleaning unit 204 disposed above the rotating wafer W into contact with the wafer W. In addition, the second processing unit 28 discharges the cleaning liquid toward the wafer W from the second discharge unit 205 disposed above the rotating wafer W. Then, the second processing unit 28 moves, for example, the central portion of the wafer W to the outer peripheral portion while rotating the back surface brush 241. Thereby, particles and the like attached to the back surface of the wafer W are removed.

<Configuration of Delivery Block 4>
Next, the delivery block 4 will be described. As shown in FIGS. 1 and 2, inside the delivery block 4, a plurality of transfer devices 15a and 15b, a first buffer unit 21U, a second buffer unit 21L, a first delivery unit 22U, 2 delivery part 22L, the 1st reversal mechanism 23a, and the 2nd reversal mechanism 23b are arranged.

  The first buffer unit 21U, the second buffer unit 21L, the first delivery unit 22U, the second delivery unit 22L, the first reversing mechanism 23a, and the second reversing mechanism 23b are arranged in the height direction. Specifically, the first delivery unit 22U, the first buffer unit 21U, the second buffer unit 21L, the second delivery unit 22L, the first reversing mechanism 23a, and the second reversing mechanism 23b are arranged in order from the top (See Figure 2).

  The transfer devices 15a and 15b are provided with a lifting mechanism (not shown), and move in the vertical direction using the lifting mechanism to move the wafer W to the first delivery units 22U and the like arranged in the height direction. Carry in and out The transfer device 15a accesses the first delivery unit 22U or the like from the Y-axis positive direction side of the first delivery unit 22U or the like. Further, the transfer device 15b accesses the first delivery unit 22U or the like from the Y-axis negative direction side of the first delivery unit 22U or the like.

  The first buffer unit 21U, the second buffer unit 21L, the first delivery unit 22U, and the second delivery unit 22L are modules capable of accommodating wafers W in multiple stages. Among these, the first buffer unit 21U and the second buffer unit 21L are accessed by the main transport device 13 and the transfer devices 15a and 15b.

  Here, configurations of the first buffer unit 21U and the second buffer unit 21L will be described with reference to FIGS. 8 and 9. FIG. 8 and 9 are diagrams showing the configuration of the first buffer unit 21U. Although FIG. 8 shows the configuration of the first buffer unit 21U as an example, the configuration of the second buffer unit 21L is the same as that of the first buffer unit 21U.

  As shown in FIG. 8, the first buffer unit 21U includes a base unit 211 and three support units 212, 213, and 214 erected on the base unit 211. The three supports 212, 213, and 214 are arranged at intervals of about 120 degrees in the circumferential direction, and hold the outer peripheral portion of the wafer W at the tip. Further, a plurality of support portions 212, 213, and 214 are provided along the height direction (see, for example, a plurality of support portions 212 shown in FIG. 9). Thus, the first buffer unit 21U can accommodate a plurality of wafers W in multiple stages.

  The main transfer device 13 and the transfer device 15a access the first buffer unit 21U from different directions. Specifically, the main transport device 13 enters the first buffer unit 21U from the X-axis negative direction side of the first buffer unit 21U, passing between the support unit 212 and the support unit 214. Further, the transfer device 15a enters the first buffer unit 21U from the positive side in the Y-axis direction of the first buffer unit 21U through the space between the support unit 212 and the support unit 213.

  Each of the first buffer unit 21U and the second buffer unit 21L accommodates the wafer W with the front surface facing upward.

  The first transfer unit 17 can transfer the first transfer unit 17 and the transfer units 15a and 15b to the first delivery unit 22U, and delivers the wafer W transferred from the delivery block 4 to the first processing block 3U or the first processing block 3U The wafer W carried out to the block 4 is accommodated. The first delivery unit 22U accommodates the wafer W with the front surface facing upward. The first delivery unit 22U is disposed at a position where the first transfer device 17 can access, specifically, a position adjacent to the transfer unit 16 of the first processing block 3U.

  The second transfer unit 27 and the transfer units 15a and 15b are accessible to the second delivery unit 22L, and the delivery block 4 transfers the wafer W transferred from the delivery block 4 to the second processing block 3L or the second processing block 3L The wafer W carried out to the block 4 is accommodated. The second delivery section 22L accommodates the wafer W with the back surface facing upward. The second delivery unit 22L is disposed at a position where the second transfer device 27 can access, specifically, a position adjacent to the transfer unit 26 of the second processing block 3L.

  The first reversing mechanism 23 a and the second reversing mechanism 23 b reverse the front and back of the wafer W. In the present embodiment, it is assumed that the first reversing mechanism 23a reverses the wafer W whose front surface is upward, and the second reversing mechanism 23b reverses the wafer W whose back surface is upward. It is not limited to the above-mentioned example as to whether the reversing mechanism 23a and the second reversing mechanism 23b reverse the wafer W in the front and back states.

  As described above, in the substrate processing system 1 according to the first embodiment, the first processing unit 18 that performs processing on the wafer W with the front surface facing upward is disposed in the first processing block 3U, and the back surface is The second processing unit 28 that performs processing on the wafer W turned upward is disposed in the second processing block 3L spatially separated from the first processing block 3U. In addition, in the substrate processing system 1 according to the first embodiment, the reversing mechanisms 23a and 23b for reversing the front and back of the wafer W are delivered as the transfer path of the wafer W from the first processing block 3U to the second processing block 3L. I decided to arrange in block 4.

  With this configuration, in the first processing block 3U, only the wafer W with the front surface facing upward can be handled, and in the second processing block 3L, only the wafer W with the back surface facing upward It can be handled. That is, in any of the first processing block 3U and the second processing block 3L, there is no situation where the wafer W whose front surface is upward and the wafer W whose back surface is upward are mixed. For this reason, according to the substrate processing system 1 according to the first embodiment, complication of state management of the front and back of the wafer W can be suppressed.

<Configuration of Control Device 5>
The substrate processing system 1 includes a control device 5 (see FIG. 1). Control device 5 is, for example, a computer, and includes control unit 51 and storage unit 52. The storage unit 52 stores programs for controlling various processes performed in the substrate processing system 1. The control unit 51 is, for example, a central processing unit (CPU), and reads out and executes a program stored in the storage unit 52 to control the operation of the substrate processing system 1.

  The program may be recorded in a storage medium readable by a computer, and may be installed in the storage unit 52 of the control device 5 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card. The control unit 51 may be configured only by hardware without using a program.

<Configuration of transport means>
Next, the configuration of the transport means provided in the substrate processing system 1, that is, the main transport device 13, the transfer devices 15a and 15b, the first transport device 17, and the second transport device 27 will be described with reference to FIG. FIG. 10 is a layout view of the main transfer device 13, the transfer devices 15a and 15b, the first transfer device 17 and the second transfer device 27. As shown in FIG.

  As shown in FIG. 10, the main transfer device 13 includes a plurality of (here, five) wafer holders 130 for holding the wafer W. The main transfer unit 13 can move in the horizontal direction and the vertical direction and can pivot around the vertical axis, and the wafer holding unit 130 is used to move the cassette C to the first buffer unit 21U and the second buffer unit 21L. A plurality of wafers W can be simultaneously transported between them.

  As described above, the transfer devices 15a and 15b are the first buffer unit 21U, the second buffer unit 21L, the first delivery unit 22U, the second delivery unit 22L, the first reversing mechanism 23a, and the second reversing unit shown in FIG. The wafer W is carried into and out of the mechanism 23b.

  The first transport device 17 and the second transport device 27 can move in the horizontal direction and the vertical direction. The first transfer unit 17 transfers the wafer W between the first delivery unit 22U and the first processing unit 18 using the wafer holding unit 170, and the second transfer unit 27 uses the wafer holding unit 270. The wafer W is transported between the second delivery unit 22L and the second processing unit 28.

  Here, the configurations of the wafer holders 170 and 270 provided in the first transfer device 17 and the second transfer device 27 will be described with reference to FIGS. 11 and 12. FIG. 11 is a schematic plan view of the wafer holder 170 provided in the first transfer device 17. FIG. 12 is a schematic plan view of the wafer holder 270 provided in the second transfer device 27. As shown in FIG.

  As shown in FIG. 11, the wafer holding unit 170 included in the first transfer device 17 is provided on the upper surface of the main body 171 having a bifurcated tip end and the main body 171 and adsorbs the wafer W. A plurality of suction units 172 are provided. The adsorbing portion 172 is provided, for example, on the base end portion of the main body portion 171 and each bifurcated distal end portion. Each suction unit 172 is connected to an intake device (not shown) such as a vacuum pump, and adsorbs the wafer W using the negative pressure generated by the intake of the intake device.

  The wafer holding unit 170 holds the wafer W by suctioning the back surface of the wafer W using the suction unit 172. For this reason, according to the wafer holding unit 170, positional deviation of the wafer W during transfer can be prevented.

  In the first processing unit 18, the bevel cleaning process is performed as described above. Here, when the position of the wafer W is shifted when performing the bevel cleaning process, it is difficult to appropriately abut the bevel brush 141 with the peripheral portion of the wafer W. Therefore, when the bevel cleaning process is performed, it is preferable that the center of the wafer W coincides with the rotation center of the first holding unit 102.

  Misalignment of the wafer W may occur during transfer. For this reason, it is conceivable to adjust the position of the wafer W and correct the positional deviation of the wafer W due to the transfer before transferring the wafer W to the first processing unit 18 and before starting the bevel cleaning processing. However, in this case, the throughput may decrease due to the increase of the processing time, or the system may be enlarged due to the arrangement of the position adjustment mechanism.

  On the other hand, in the substrate processing system 1 according to the first embodiment, the positional deviation of the wafer W during conveyance can be prevented by the suction unit 172, so the first holding unit 102 of the first processing unit 18 can be prevented. Thus, the wafer W can be held at an appropriate position. Therefore, since position adjustment processing and a mechanism for position adjustment are unnecessary, it is possible to suppress a decrease in throughput and an increase in size of the system.

  Subsequently, the configuration of the wafer holding unit 270 provided in the second transfer device 27 will be described. As shown in FIG. 12, the wafer holding unit 270 provided in the second transfer device 27 includes a main body 271 having an inner periphery larger in diameter than the wafer W, and an inner periphery of the inner periphery of the main body 271. And a plurality of claws 272 projecting radially inward.

  The wafer holding unit 270 holds the wafer W by placing the outer peripheral portion of the wafer W on the claws 272. Therefore, according to wafer holder 270, wafer W can be transported without causing contamination such as suction marks as much as possible.

  In the substrate processing system 1, the second transfer apparatus 27 transfers to the delivery block 4 the cleaned wafer W on which both the bevel cleaning process and the back surface cleaning process have been completed. For this reason, in the substrate processing system 1, the second transfer unit 27 including the wafer holding unit 270 that does not contaminate the cleaned wafer W as much as possible is disposed in the transfer unit 26 of the second processing block 3L.

  As described above, the first processing unit 18 and the second processing unit 28 differ in the transfer device suitable for loading and unloading the wafer W. On the other hand, in the substrate processing system 1, since the processing block 3 is divided into the first processing block 3U and the second processing block 3L, the first transfer device 17 suitable for the first processing unit 18, and the second processing unit 28. It is possible to use both the second transport device 27 suitable for

  Although FIG. 10 shows an example in which the transfer devices 15a and 15b, the first transfer device 17 and the second transfer device 27 have one wafer holding unit, the transfer devices 15a and 15b, and the first transfer The apparatus 17 and the second transfer apparatus 27 may be provided with a plurality of wafer holding units as the main transfer apparatus 13 does.

<Transport Flow of Wafer W>
Next, the transfer flow of the wafer W in the substrate processing system 1 according to the first embodiment will be described with reference to FIG. FIG. 13 is an explanatory diagram of the transfer flow of the wafer W in the substrate processing system 1 according to the first embodiment. In FIG. 13, the transfer flow of the wafer W whose front surface is upward is shown by a solid line, and the transfer flow of the wafer W whose back surface is upward is shown by a broken line.

  In the following, the main transport device 13 may be described as "CRA", the transfer devices 15a and 15b as "MPRA", the first transport device 17 as "PRA1", and the second transport device 27 as "PRA2". . The first buffer unit 21U is "SBU1", the second buffer unit 21L "SBU2", the first delivery unit 22U is "TRS1", the second delivery unit 22L is "TRS2", and the first reversing mechanism 23a is "RVS1". The second reversing mechanism 23b may be described as "RVS2". Also, the first processing unit 18 may be described as "CH1" and the second processing unit 28 as "CH2". In FIG. 13, the first buffer unit 21U (SBU1), the second buffer unit 21L (SBU2), the first delivery unit 22U (TRS1), the second delivery unit 22L (TRS2), and the first reversing mechanism 23a (RVS1). The second inversion mechanism 23b (RVS2) is shown with the reference numerals omitted.

  As shown in FIG. 13, in the substrate processing system 1, first, the main transfer device 13 (CRA) takes out a plurality of unprocessed wafers W together from the cassette C and stores them in the first buffer unit 21U (SBU 1) ( Step S101).

  Subsequently, the transfer device 15a (MPRA) takes out the unprocessed wafer W from the first buffer unit 21U (SBU1) and transfers it to the first delivery unit 22U (TRS1) (step S102).

  Subsequently, the first transfer device 17 (PRA1) of the first processing block 3U takes out the wafer W from the first delivery unit 22U (TRS1) and transfers it to the first processing unit 18 (CH1) (step S103). The first processing unit 18 (CH1) performs a bevel cleaning process on the wafer W. Further, when the bevel cleaning process is completed, the first transfer apparatus 17 (PRA1) takes out the wafer W subjected to the bevel cleaning process from the first processing unit 18 (CH1) and stores it in the first delivery unit 22U (TRS1) Step S104).

  Subsequently, the transfer device 15a (MPRA) takes out the bevel cleaned wafer W from the first delivery unit 22U (TRS1) and transfers it to the first reversing mechanism 23a (RVS1) (step S105), and the first reverse The mechanism 23a (RVS1) reverses the front and back of the wafer W. Thereby, the wafer W is in the state where the back surface is directed upward.

  Subsequently, the transfer device 15b (MPRA) takes out the wafer W from the first reversing mechanism 23a (RVS1) and transfers it to the second delivery section 22L (TRS2) (step S106).

  Subsequently, the second transfer device 27 (PRA2) of the second processing block 3L takes out the wafer W from the second delivery unit 22L (TRS2) and transfers it to the second processing unit 28 (CH2) (step S107). The second processing unit 28 (CH2) performs the back surface cleaning process on the wafer W. When the back surface cleaning process is completed, the second transfer device 27 (PRA2) takes out the wafer W subjected to the back surface cleaning process from the second processing unit 28 (CH2) and stores it in the second delivery unit 22L (TRS2) Step S108).

  Note that the transfer process of the wafer W by the second transfer unit 27 (steps S107 and S108) and the back surface cleaning process by the second processing unit 28 are the transfer process of the wafer W by the first transfer unit 17 (steps S103 and S104) and It is performed in parallel with the bevel cleaning process in the processing unit 18. Further, the transfer processing of the wafer W by the first transfer unit 17 (steps S103 and S104) and the transfer processing of the wafer W by the second transfer unit 27 (steps S107 and S108) are performed by the transfer units 15a and 15b (MPRA). It is performed in parallel with the W transfer process (steps S102, S105, S106, S109, S110). Thereby, the throughput of a series of substrate processing can be improved.

  Subsequently, the transfer device 15b (MPRA) takes out the wafer W from the second delivery unit 22L (TRS2) and transfers it to the second reversing mechanism 23b (RVS2) (step S109), and the second reversing mechanism 23b (RVS2) However, the front and back of the wafer W is reversed. As a result, the wafer W is again in the state where the front surface faces upward.

  Subsequently, the transfer device 15a (MPRA) takes out the wafer W from the second reversing mechanism 23b (RVS2) and transfers it to the second buffer unit 21L (SBU2) (step S110), and the main transfer device 13 (CRA) A plurality of wafers W subjected to the bevel cleaning process and the back surface cleaning process are collectively taken out from the second buffer unit 21L (SBU2) and stored in the cassette C (step S111). Thus, a series of substrate processing ends.

  As described above, the substrate processing system 1 according to the first embodiment includes the first processing block 3U, the second processing block 3L, the first reversing mechanism 23a, and the second reversing mechanism 23b (RVS1, RVS2). Equipped with The first processing block 3U includes a first processing unit 18 (CH1) for processing the wafer W in a state in which the front surface (corresponding to an example of the “first surface”) of the wafer W is upward; And a first transfer device 17 (PRA1) that carries the wafer W into and out of the processing unit 18 (CH1). The second processing block 3L performs the processing of the wafer W in a state where the back surface (corresponding to an example of the “second surface”) which is the surface opposite to the front surface of the wafer W is directed upward A unit 28 (CH2) and a second transfer device 27 (PRA2) for carrying in and out the wafer W with respect to the second processing unit 28 (CH2) are included. The first reversing mechanism 23a and the second reversing mechanism 23b (RVS1, RVS2) are disposed in the middle of the transfer path of the wafer W from the first processing block 3U to the second processing block 3L, and reverse the wafer W.

  Therefore, according to the substrate processing system 1 according to the first embodiment, in the case of handling both the wafer W whose front surface is upward and the wafer W whose back surface is upward, the state management of the front and back of the wafer W is performed. The complexity can be reduced.

  Further, in the substrate processing system 1 according to the first embodiment, the transfer devices 15a and 15b (MPRA) perform loading and unloading of the wafer W with respect to the first reversing mechanism 23a (RVS1) and the second reversing mechanism 23b (RVS2). It is supposed to Thus, the first transfer device 17 (PRA1) and the second transfer device 17 (PRA1) and the second transfer device 17 are compared with the case where the first transfer device 17 (PRA1) and the second transfer device 27 (PRA2) carry the wafer W The processing load of the device 27 (PRA 2) can be reduced.

  The substrate processing system 1 carries in and out the wafer W with respect to the first reversing mechanism 23a (RVS1) and the second reversing mechanism 23b (RVS2) as the first transfer apparatus 17 (PRA1) and the second transfer apparatus 27 (PRA2). It may be done by In this case, the first reversing mechanism 23a (RVS1) and the second reversing mechanism 23b (RVS2) may be disposed at positions accessible by the first transfer device 17 (PRA1) and the second transfer device 27 (PRA2). .

  In the first embodiment, the first processing block 3U is disposed on the upper side and the second processing block 3L is disposed on the lower side. However, the first processing block 3U and the second processing are described. The arrangement of the blocks 3L may be reversed.

Second Embodiment
<Configuration of Substrate Processing System 1A According to Second Embodiment>
Next, a substrate processing system 1A according to the second embodiment will be described. First, the configuration of a substrate processing system 1A according to the second embodiment will be described with reference to FIGS. 14 and 15. FIG. FIG. 14 is a schematic plan view of a substrate processing system 1A according to the second embodiment. FIG. 15 is a schematic side view of the substrate processing system according to the second embodiment. In the following description, parts that are the same as the parts that have already been described will be assigned the same reference numerals as the parts that have already been described, and redundant descriptions will be omitted.

  As shown in FIG. 14, the substrate processing system 1A according to the second embodiment includes the loading / unloading block 2, the first processing block 3B, the second processing block 3F, the first delivery block 4F, and the second delivery. And block 4B. These are arranged in order of the loading / unloading block 2, the first delivery block 4F, the second processing block 3F, the second delivery block 4B, and the first processing block 3B.

  In addition, about the carrying in / out block 2 and the 1st delivery block 4F, since it is the structure similar to the carrying in / out block 2 and the delivery block 4F in 1st Embodiment, description here is abbreviate | omitted.

<Configuration of First Processing Block 3B>
The first processing block 3B is disposed behind the second delivery block 4B, that is, at the rear of the substrate processing system 1A. The first processing block 3 </ b> B includes a first transfer device 17 and a plurality of first processing units 18. The first transfer device 17 transfers the wafer W between the first processing unit 18 and the second delivery block 4B.

  The plurality of first processing units 18 are disposed adjacent to the Y-axis positive direction side and the Y-axis negative direction side of the first conveyance device 17. As shown in FIG. 15, the plurality of first processing units 18 are arranged side by side in the height direction.

<Configuration of Second Processing Block 3F>
The second processing block 3F is disposed between the first delivery block 4F and the second delivery block 4B, and includes a second transport device 27 and a plurality of second processing units 28. The second transfer device 27 transfers the wafer W between the first delivery block 4F and the second processing unit 28. The second transfer device 27 also transfers the wafer W between the first delivery block 4F and the second delivery block 4B.

  The plurality of second processing units 28 are disposed adjacent to the Y-axis positive direction side and the Y-axis negative direction side of the second conveyance device 27. As shown in FIG. 15, the plurality of second processing units 28 are arranged side by side in the height direction.

<Configuration of Second Delivery Block 4B>
The second delivery block 4B is disposed between the second processing block 3F and the first processing block 3B. Inside the second delivery block 4B, the transfer device 15c and the third delivery unit 19 are disposed.

  The transfer device 15c has the same configuration as the transfer devices 15a and 15b described above, and is disposed on the Y-axis positive direction side of the third delivery unit 19. The second delivery block 4B does not necessarily have to include the transfer device 15c.

  The third delivery unit 19 can store a plurality of wafers W in multiple stages. Further, the third delivery unit 19 is configured to be slidable along the horizontal direction (here, the X-axis direction), and slides to the transport unit 26 of the second processing block 3F by sliding in the X-axis negative direction side. Then, the wafer W can be delivered to and from the second transfer device 27. The third delivery unit 19 may have the same configuration as the first delivery unit 22U and the second delivery unit 22L.

  The substrate processing system 1A according to the second embodiment is configured as described above, and the first delivery block 4F, the second processing block 3F, and the second delivery block 4B are loaded with the wafer W from the loading / unloading block 2. Through the first processing block 3B, and bevel cleaning processing is performed in the first processing block 3B. Thereafter, the substrate processing system 1A returns the wafer W after bevel cleaning processing from the first processing block 3B to the second delivery block 4B, the second processing block 3F, and the first delivery block 4F, and then to the second processing block 3F. After being transported, the back surface cleaning process is performed in the second processing block 3F. Then, the substrate processing system 1A transports the wafer W after the back surface cleaning processing from the second processing block 3F to the loading / unloading block 2 via the first delivery block 4F, and delivers the wafer W from the loading / unloading block 2 to the outside.

<Transport Flow of Wafer W>
The above-described transfer flow of the wafer W will be specifically described with reference to FIG. FIG. 16 is an explanatory diagram of the transfer flow of the wafer W in the substrate processing system 1A according to the second embodiment. In FIG. 16, the third delivery unit 19 is described as “TRS3”. In FIG. 16, the first buffer unit 21U (SBU1), the second buffer unit 21L (SBU2), the first delivery unit 22U (TRS1), the second delivery unit 22L (TRS2), and the third delivery unit 19 (TRS3). The symbols of the first reversing mechanism 23a (RVS1), the second reversing mechanism 23b (RVS2), the first processing unit 18 (CH1) and the second processing unit 28 (CH2) will be omitted.

  The processes of steps S201 and S202 shown in FIG. 16 are the same as the processes of steps S101 and S102 shown in FIG. That is, in the substrate processing system 1A, first, the main transport apparatus 13 (CRA) takes out a plurality of unprocessed wafers W together from the cassette C and stores them in the first buffer unit 21U (SBU1) (step S201). The transfer device 15a (MPRA) takes out the unprocessed wafer W from the first buffer unit 21U (SBU1) and transfers it to the first delivery unit 22U (TRS1) (step S202).

  Subsequently, the second transfer device 27 (PRA2) takes out the wafer W from the first delivery unit 22U (TRS1) and transfers it to the third delivery unit 19 (TRS3) (step S203). Then, the first transfer apparatus 17 (PRA1) takes out the wafer W from the third delivery unit 19 (TRS3) and transfers it to the first processing unit 18 (CH1) (step S204), and the first processing unit 18 (CH1) Then, the wafer W is subjected to bevel cleaning processing.

  Subsequently, when the bevel cleaning process is completed, the first transfer apparatus 17 (PRA1) takes out the wafer W subjected to the bevel cleaning process from the first processing unit 18 (CH1) and stores it in the third delivery unit 19 (TRS3). (Step S205). Then, the second transfer device 27 (PRA2) takes out the wafer W from the third delivery unit 19 (TRS3) and stores it in the first delivery unit 22U (TRS1) (step S206). The subsequent processing (steps S207 to S213) is the same as steps S105 to S111 shown in FIG.

  As described above, the first processing block 3B including the first processing unit 18 and the second processing block 3F including the second processing unit 28 are in the height direction as in the substrate processing system 1 according to the first embodiment. Not limited to the case of being arranged side by side, it may be arranged side by side in the horizontal direction.

  Further, in the substrate processing system 1A according to the second embodiment, the second processing block 3F is disposed at a position upstream of the first processing block 3B, in other words, at a position near the loading / unloading block 2. With this arrangement, it is possible to prevent the first transfer apparatus 17 for holding the wafer W by suction from holding the cleaned wafer W after the bevel cleaning process and the back surface cleaning process. For this reason, it is possible to suppress the adhesion of dirt such as suction marks on the cleaned wafer W.

  In the substrate processing system 1A according to the second embodiment, in the second processing block 3F, both the wafer W with the front surface facing upward and the wafer W with the back surface facing upward are transported. It will be. However, since the wafer W with the front surface facing upward merely passes through the second processing block 3F, compared to the substrate processing system 1 according to the first embodiment, the front and back of the wafer W State management does not become large and complicated.

Third Embodiment
In the second embodiment described above, an example in which the first reversing mechanism 23a and the second reversing mechanism 23b are disposed in the first delivery block 4F has been described, but in the first reversing mechanism 23a and the second reversing mechanism 23b The arrangement is not limited to the above example. Thus, in the third embodiment, a modification of the arrangement of the first reversing mechanism 23a and the second reversing mechanism 23b will be described.

  FIG. 17 is a schematic plan view of a substrate processing system 1B according to the third embodiment. As shown in FIG. 17, in the substrate processing system 1B according to the third embodiment, the first reversing mechanism 23a is disposed in the second delivery block 4B, and the second reversing mechanism 23b is disposed in the first delivery block 4F. Ru.

  Next, the transfer flow of the wafer W in the substrate processing system 1B according to the third embodiment will be described with reference to FIG. FIG. 18 is an explanatory diagram of the transfer flow of the wafer W in the substrate processing system 1B according to the third embodiment.

  Hereinafter, the transfer devices 15a and 15b disposed in the first delivery block 4F will be referred to as "first transfer devices 15a and 15b", and the transfer device 15c disposed in the second delivery block 4B It describes as 2nd transfer apparatus 15c. Further, in FIG. 18, the first transfer devices 15a and 15b are described as "MPRA1", and the second transfer device 15c is described as "MPRA2".

  Also, as in FIG. 16, in FIG. 18, the first buffer unit 21U (SBU1), the second buffer unit 21L (SBU2), the first delivery unit 22U (TRS1), the second delivery unit 22L (TRS2), and the third delivery unit. The code | symbol is abbreviate | omitted about the transfer part 19 (TRS3), 1st inversion mechanism 23a (RVS1), 2nd inversion mechanism 23b (RVS2), 1st processing unit 18 (CH1), and 2nd processing unit 28 (CH2).

  The process of steps S301 to S305 shown in FIG. 18 is the same as the process of steps S201 to S205 shown in FIG. After the process of step S205, the second transfer device 15c (MPRA2) takes out the wafer W from the third delivery unit 19 (TRS3) and transfers it to the first reversing mechanism 23a (RVS1) (step S306), The reversing mechanism 23a (RVS1) reverses the front and back of the wafer W. Thereby, the wafer W is in the state where the back surface is directed upward.

  Subsequently, the second transfer device 15c (MPRA2) takes out the wafer W from the first reversing mechanism 23a (RVS1) and transfers it to the third delivery unit 19 (TRS3) (step S307), and the second transfer device 27 ( The PRA 2) takes out the wafer W from the third delivery unit 19 (TRS 3) and transfers it to the second processing unit 28 (step S308), and the second processing unit 28 (CH 2) cleans the back surface of the wafer W Do.

  Subsequently, when the back surface cleaning process is completed, the second transfer device 27 (PRA2) takes out the wafer W subjected to the back surface cleaning process from the second processing unit 28 (CH2) and stores it in the second delivery unit 22L (TRS2). (Step S309). The subsequent processing (steps S310 to S312) is the same as steps S211 to S213 shown in FIG.

  Thus, the first reversing mechanism 23a and the second reversing mechanism 23b may be disposed in the first delivery block 4F and the second delivery block 4B, respectively.

Fourth Embodiment
In each of the embodiments described above, an example in which the bevel cleaning processing is performed in the first processing blocks 3U and 3B has been described. However, the substrate processing performed in the first processing blocks 3U and 3B is not limited to the bevel cleaning processing. Therefore, in the fourth embodiment, a modified example of the substrate processing performed in the first processing blocks 3U and 3B will be described with reference to FIG. FIG. 19 is a schematic side view of the first processing unit 18A according to the fourth embodiment.

  As shown in FIG. 19, the first processing unit 18A according to the fourth embodiment further includes a third discharge unit 106. The third discharge unit 106 is connected to the etching solution supply source 162 via a valve 161, a flow rate regulator (not shown), and the like. The third discharge unit 106 discharges the etching solution supplied from the etching solution supply source 162 from the upper side of the wafer W toward the outer peripheral portion on the front surface side of the wafer W. Thus, the film formed on the outer peripheral portion of the wafer W is removed.

  The first processing unit 18A is configured as described above and performs the bevel cleaning process on the rotating wafer W using the bevel cleaning unit 104 and the first ejection unit 105, and then the third ejection unit 106 Perform the edge cutting process used.

  As described above, after the bevel cleaning process and the edge cutting process are performed in the first processing blocks 3U and 3B, the back surface cleaning process may be performed in the second processing blocks 3L and 3F.

  Here, an example in which the first processing unit 18A performs both the bevel cleaning processing and the edge cutting processing has been described, but the processing unit performing the bevel cleaning processing and the processing unit performing the edge cutting processing are divided. You may arrange | position to 1st process block 3U and 3B.

Fifth Embodiment
<Configuration of Substrate Processing System 1C>
Next, a substrate processing system 1C according to the fifth embodiment will be described. FIG. 20 is a schematic plan view of a substrate processing system 1C according to the fifth embodiment, and FIG. 21 is a schematic side view of the same.

  As shown in FIGS. 20 and 21, a substrate processing system 1C according to the fifth embodiment has substantially the same configuration as the substrate processing system 1 according to the first embodiment, but a processing block 3C and a delivery block 4C. And the substrate processing system 1 according to the first embodiment.

  As shown in FIG. 21, the processing block 3C includes a second processing unit 28C. Unlike the second processing unit 28, the second processing unit 28C processes the wafer W with the back surface facing upward, and the wafer W with the back surface facing downward (ie, the front surface is facing upward) And processing for

<Configuration of Second Processing Unit 28C>
Here, the configuration of the second processing unit 28C will be described with reference to FIG. FIG. 22 is a schematic plan view of a second processing unit 28C according to the fifth embodiment.

  As shown in FIG. 22, the second processing unit 28C includes the second chamber 201, the second holding unit 202, the second recovery cup 203, the back surface cleaning unit 204C, the second discharge unit 205, and the fourth discharge. And a unit 206. The configuration other than the back surface cleaning unit 204C and the fourth discharge unit 206 is the same as that of the second processing unit 28, and thus the description thereof is omitted here.

  The back surface cleaning unit 204C extends in the horizontal direction (here, the Y-axis direction) with the back surface brush 241, and supports the arm 246 supporting the back surface brush 241 from above via the shaft 242 and pivots and raises and lowers the arm 246. And a pivoting lift mechanism 247. Further, the back surface cleaning unit 204C includes a rotation mechanism (not shown), and can use the rotation mechanism to rotate the back surface brush 241 around the shaft 242.

  The back surface cleaning unit 204C and the second discharge unit 205 correspond to an example of a first processing unit that processes the substrate with the second surface of the substrate facing upward. The second processing unit 28C may include the back surface cleaning unit 204 provided in the second processing unit 28 instead of the back surface cleaning unit 204C.

  The fourth discharge unit 206 is disposed outside the second recovery cup 203. The fourth discharge unit 206 includes a nozzle 261, an arm 262 extending in the horizontal direction and supporting the nozzle 261, and a pivoting elevating mechanism 263 for pivoting and elevating the arm 262.

  The nozzle 261 is, for example, a two-fluid nozzle, and is connected to the cleaning solution supply source 265 via a valve 264 and a flow rate regulator (not shown) and the like, and also via a valve 266 and a flow rate regulator (not shown) and the like Is connected to the gas supply source 267.

  The fourth discharge unit 206 mixes the cleaning fluid (for example, pure water) supplied from the cleaning fluid supply source 265 and the gas (for example, inert gas such as nitrogen) supplied from the gas supply source 267 in the nozzle 261. Thus, the cleaning solution in the form of droplets or mist is supplied from the nozzle 261 to the substrate.

  The fourth discharge unit 206 corresponds to an example of a second processing unit that processes the substrate with the first surface of the substrate facing upward. Although an example in which the nozzle 261 provided in the fourth ejection unit 206 is a two-fluid nozzle is shown here, the nozzle 261 may be a normal nozzle.

  The second processing unit 28 </ b> C processes the wafer W using the back surface cleaning unit 204 </ b> C and the second discharge unit 205 when the wafer W whose back surface is directed upward is carried in.

  Specifically, the second processing unit 28C holds and rotates the peripheral portion of the wafer W whose back surface is upward by the second holding unit 202. Subsequently, the second processing unit 28C brings the back surface brush 241 of the back surface cleaning unit 204C disposed above the rotating wafer W into contact with the wafer W. Further, the second processing unit 28C discharges the cleaning liquid toward the wafer W from the second discharge unit 205 disposed above the rotating wafer W. Then, the second processing unit 28C moves, for example, the central portion of the wafer W to the outer peripheral portion while rotating the back surface brush 241. Thereby, particles and the like attached to the back surface of the wafer W are removed.

  The second processing unit 28 </ b> C processes the wafer W using the fourth discharge unit 206 when the wafer W with the front surface facing up is carried in.

  Specifically, the second processing unit 28C holds and rotates the peripheral portion of the wafer W whose front surface is upward by the second holding unit 202. Subsequently, the second processing unit 28C arranges the nozzle 261 of the fourth discharge unit 206 above the rotating wafer W, and forms droplets or mists from the nozzle 261 toward the front surface of the wafer W. Supply the cleaning solution. As a result, the front surface of the wafer W is cleaned, and particles and the like that have been attached to the front surface from the beginning can be removed. Further, even if not initially attached, for example, particles and the like that have been attached during the process of the first processing unit 18, the back surface process of the second processing unit 28C, and the transfer of the wafer W are also removed. be able to.

<Configuration of Delivery Block 4C>
Next, the configuration of the delivery block 4C will be described with reference to FIG. 20, FIG. 21 and FIG. FIG. 23 is a schematic rear view of the delivery block 4C according to the fifth embodiment.

  As shown in FIGS. 21 and 23, inside the delivery block 4C, a first delivery unit 22U, a buffer unit 21, a first reversing mechanism 23a, a second delivery unit 22L, and a second reversing mechanism 23b Are arranged side by side in the height direction in the order described above from the top. Further, as shown in FIGS. 20 and 23, a first transfer device 15Ca and a second transfer device 15Cb are disposed inside the delivery block 4C.

  The first transfer device 15Ca and the second transfer device 15Cb have an elevating mechanism (not shown), and move in the vertical direction using the elevating mechanism to arrange the first delivery units arranged in the height direction. 22 W and the like are loaded and unloaded from the wafer W. The first transfer device 15Ca is disposed on the Y-axis positive direction side of the first delivery unit 22U and the like, and the second transfer device 15Cb is disposed on the Y-axis negative direction side of the first delivery unit 22U and the like. .

  As shown in FIG. 23, the first transfer device 15Ca can access the first delivery unit 22U and the buffer unit 21. On the other hand, the second transfer device 15Cb can access the buffer unit 21, the first reversing mechanism 23a, the second delivery unit 22L, and the second reversing mechanism 23b.

  Thus, in the delivery block 4C, the buffer unit 21 is disposed at a position where both the first transfer device 15Ca and the second transfer device 15Cb can access.

<Configuration of Buffer Unit 21>
The buffer unit 21 has substantially the same configuration as the first buffer unit 21U and the second buffer unit 21L described above, but the number of stages of wafers W that can be accommodated is larger than that of the first buffer unit 21U and the second buffer unit 21L. The second embodiment differs from the first buffer unit 21U and the second buffer unit 21L in point.

  Here, the configuration of the buffer unit 21 will be described with reference to FIGS. 24 and 25. FIG. FIG. 24 is a schematic plan view of the buffer unit 21 and FIG. 25 is a schematic side view of the same.

  As shown in FIG. 24, the main transport device 13, the first transfer device 15Ca, and the second transfer device 15Cb can access the buffer unit 21 from different directions. Specifically, the main transport device 13 enters the buffer unit 21 from the X-axis negative direction side of the buffer unit 21 through the space between the support unit 212 and the support unit 213. The first transfer device 15Ca enters the buffer unit 21 from the Y-axis positive direction side of the buffer unit 21 through the space between the support unit 213 and the support unit 214.

  Then, the second transfer device 15Cb enters the buffer unit 21 from the Y axis negative direction side of the buffer unit 21 through the space between the support unit 212 and the support unit 214. The buffer unit 21 accommodates the wafer W with the front surface facing upward.

  As shown in FIG. 25, the buffer unit 21 is divided into three areas of a lower area 210L, a middle area 210M, and an upper area 210U sequentially from the lower side. The lower wafer 210 is accommodated in the lower area 210L. In the middle area 210M, the wafer W processed by the first processing unit 18 is accommodated, and in the upper area 210U, the wafer W processed by the first processing unit 18 and the second processing unit 28C is accommodated. .

<Transport Flow of Wafer W>
Next, the transfer flow of the wafer W in the substrate processing system 1C according to the fifth embodiment will be described with reference to FIG. 26 and FIG. FIGS. 26 and 27 are explanatory diagrams of the transfer flow of the wafer W in the substrate processing system 1C according to the fifth embodiment.

  Note that FIG. 26 shows a transfer flow before the wafer W is delivered from the first transfer device 15Ca to the second transfer device 15Cb, and FIG. 27 shows the wafer W to the second transfer device 15Cb. The transport flow after delivery is shown.

  In FIGS. 26 and 27, the transfer flow of the wafer W whose front surface is upward is shown by a solid line, and the transfer flow of the wafer W whose back surface is upward is shown by a broken line. In the following, the first transfer device 15Ca may be described as "MPRA1", and the second transfer device 15Cb may be described as "MPRA2". In FIGS. 26 and 27, the buffer unit 21 (SBU), the first delivery unit 22U (TRS1), the second delivery unit 22L (TRS2), the first reversing mechanism 23a (RVS1), and the second reversing mechanism 23b (RVS2). The symbol) is omitted.

  In the substrate processing system 1C according to the fifth embodiment, delivery of the wafer W from the first transfer device 15Ca to the second transfer device 15Cb is performed via the buffer unit 21. In addition, in the substrate processing system 1C, the second processing unit 28C adds the processing (back surface cleaning processing) to the wafer W with the back surface facing upward, and the processing (front surface cleaning) to the wafer W with the front surface facing upward. Process).

  As shown in FIG. 26, in the substrate processing system 1C, first, the main transfer device 13 (CRA) takes out a plurality of unprocessed wafers W together from the cassette C and stores them in the buffer unit 21 (SBU) (step S401). ). At this time, the main transfer device 13 (CRA) accommodates the wafer W in the lower area 210L of the buffer unit 21 (SBU).

  Subsequently, the first transfer device 15Ca (MPRA1) takes out the unprocessed wafer W from the buffer unit 21 (SBU) and transfers it to the first delivery unit 22U (TRS1) (step S402).

  Subsequently, the first transfer device 17 (PRA1) of the first processing block 3U takes out the wafer W from the first delivery unit 22U (TRS1) and transfers it to the first processing unit 18 (CH1) (step S403), The first processing unit 18 (CH1) performs a bevel cleaning process on the wafer W. Further, when the bevel cleaning process is completed, the first transfer apparatus 17 (PRA1) takes out the wafer W subjected to the bevel cleaning process from the first processing unit 18 (CH1) and stores it in the first delivery unit 22U (TRS1) Step S404).

  Subsequently, the first transfer device 15Ca (MPRA1) takes out the wafer W subjected to the bevel cleaning processing from the first delivery unit 22U (TRS1) and transfers it to the buffer unit 21 (SBU) (step S405). At this time, the first transfer device 15Ca (MPRA1) accommodates the wafer W in the middle area 210M of the buffer unit 21 (SBU).

  Subsequently, as shown in FIG. 27, the second transfer device 15Cb (MPRA2) takes out the wafer W from the buffer unit 21 (SBU) and transfers it to the second reversing mechanism 23b (RVS2) (step S406), The two-inversion mechanism 23b (RVS2) inverts the front and back of the wafer W. Thereby, the wafer W is in the state where the back surface is directed upward.

  Subsequently, the second transfer device 27 (PRA2) of the second processing block 3L takes out the wafer W from the second reversing mechanism 23b (RVS2) and transfers it to the second processing unit 28C (CH2) (step S407). At this time, since the back surface of the wafer W is facing upward, the back surface cleaning process using the back surface cleaning unit 204C and the second discharge unit 205 is performed on the wafer W in the second processing unit 28C (CH2). It will be. Here, the processing statuses of the plurality of second processing units 28C are managed in real time, for example, by the control device 5, and the wafer W is sequentially transferred from the vacant units.

  Subsequently, when the back surface cleaning process is completed, the second transfer device 27 (PRA2) takes out the wafer W subjected to the back surface cleaning process from the second processing unit 28C (CH2) and transfers it to the first reversing mechanism 23a (RVS1). (Step S408) The first reversing mechanism 23a (RVS1) reverses the front and back of the wafer W. As a result, the wafer W is in a state in which the front surface faces upward.

  Subsequently, the second transfer apparatus 27 (PRA2) takes out the wafer W from the first reversing mechanism 23a (RVS1) and transfers it again to the second processing unit 28C (CH2) (step S409). At this time, since the front surface of the wafer W is directed upward, in the second processing unit 28 C (CH 2), the front surface cleaning processing is performed on the wafer W using the fourth discharge unit 206. It will be. Here, the processing status of the plurality of second processing units 28C is managed, for example, in real time by the control device 5, and the wafer W is sequentially transferred from the vacant units after the back surface cleaning processing is completed.

  Subsequently, when the front surface cleaning process is completed, the second transfer device 27 (PRA2) takes out the wafer W which has been subjected to the front surface cleaning process from the second processing unit 28C (CH2), and the second delivery unit 22L. Transport to (TRS 2) (step S410). Subsequently, the second transfer device 15Cb (MPRA2) takes out the wafer W from the second delivery unit 22L (TRS2) and transfers it to the buffer unit 21 (SBU) (step S411). At this time, the second transfer device 15Cb (MPRA2) stores the wafer W in the upper stage area 210U of the buffer unit 21 (SBU).

  Then, the main transfer device 13 (CRA) takes out a plurality of processed wafers W at once from the buffer unit 21 (SBU) and stores them in the cassette C (step S412). Thus, a series of substrate processing ends.

  With the above configuration, since the first transfer device 15Ca and the second transfer device 15Cb handle only the wafer W whose front surface is directed upward, the complication of the state management of the wafer W is further suppressed. be able to.

  Further, by transferring the wafer W from the second transfer device 15Cb to the second transfer device 27 not via the second delivery unit 22L but via the second reversing mechanism 23b, the second reversing mechanism 23b to the second delivery unit Since the transfer of the wafer W to 22 L is omitted, the efficiency of the series of substrate processing can be enhanced.

  In addition, the first transfer device 15Ca is in charge of access to the first delivery unit 22U and the buffer unit 21, and access to the buffer unit 21, the first reversing mechanism 23a, the second delivery unit 22L, and the second reversing mechanism 23b. By having the second transfer device 15Cb take charge of, it is possible to shorten the moving distance of the first transfer device 15Ca and the second transfer device 15Cb. Thus, this also can increase the efficiency of the series of substrate processing.

  Here, in addition to the processing (back surface cleaning processing) on the wafer W with the back surface facing upward, the plurality of second processing units 28C is a processing (front surface cleaning processing) on the wafer W with the front surface facing upward. ), But functions may be assigned in advance so as to perform any one of the processes. That is, for example, 5 out of 10 second processing units 28C are allocated for back surface cleaning processing only, 5 are allocated for front surface cleaning processing only, and the former is the transfer destination in step S407, the latter is the step You may make it the conveyance destination of S409. In addition, the front surface cleaning process does not necessarily have to be performed. Here, the transfer flow of the wafer W when the front surface cleaning process is not performed will be described with reference to FIG. FIG. 28 is an explanatory diagram of the transfer flow of the wafer W when the front surface cleaning process is not performed.

  After finishing the processing of steps S401 to S405 shown in FIG. 26, in the substrate processing system 1C, as shown in FIG. 28, the second transfer apparatus 15Cb takes out the wafer W from the buffer unit 21 (SBU) and performs the second process. Transfer to the reversing mechanism 23b (RVS2) (step S501), and the second reversing mechanism 23b (RVS2) reverses the front and back of the wafer W. Thereby, the wafer W is in the state where the back surface is directed upward.

  Subsequently, the second transfer device 27 (PRA2) of the second processing block 3L takes out the wafer W from the second reversing mechanism 23b (RVS2) and transfers it to the second processing unit 28C (CH2) (step S502). In the second processing unit 28C (CH2), the backside cleaning process using the backside cleaning unit 204C and the second discharge unit 205 is performed on the wafer W.

  Subsequently, when the back surface cleaning process is completed, the second transfer device 27 (PRA2) takes out the wafer W subjected to the back surface cleaning process from the second processing unit 28C (CH2) and transfers it to the first reversing mechanism 23a (RVS1). (Step S503) The first reversing mechanism 23a (RVS1) reverses the front and back of the wafer W. As a result, the wafer W is in a state in which the front surface faces upward.

  Subsequently, the second transfer device 15Cb (MPRA2) takes out the wafer W subjected to the back surface cleaning processing from the first reversing mechanism 23a (RVS1) and transfers it to the buffer unit 21 (SBU) (step S504). The second transfer device 15Cb (MPRA2) accommodates the wafer W in the upper area 210U of the buffer unit 21 (SBU). Then, the main transfer device 13 (CRA) takes out a plurality of processed wafers W together from the buffer unit 21 (SBU) and stores them in the cassette C (step S505). Thus, a series of substrate processing ends.

  As described above, the substrate processing system 1C may dispense the wafer W after the back surface cleaning process without performing the front surface cleaning process after the back surface cleaning process. In this case, the substrate processing system 1C does not necessarily have to include the second delivery unit 22L. In addition, the substrate processing system 1C may include a second processing unit 28 (see FIGS. 6 and 7) instead of the second processing unit 28C.

  Here, the second transfer device 15Cb carries the wafer W into the second reversing mechanism 23b (step S406), and the second transfer device 27 carries the wafer W into the first reversing mechanism 23a (step S408). And However, not limited to this example, the second transfer device 15Cb may load the wafer W into the first reversing mechanism 23a, and the second transfer device 27 may load the wafer W into the second reversing mechanism 23b. Further, both of the second transfer device 15Cb and the second transfer device 27 may access only one of the first reversing mechanism 23a and the second reversing mechanism 23b. In this case, the delivery block 4C does not necessarily have to include two reversing mechanisms.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the invention are not limited to the specific details and representative embodiments represented and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

W wafer 1 substrate processing system 2 loading / unloading block 3 processing block 3 U first processing block 3 L second processing block 4 delivery block 5 control device 13 main transport device (CRA)
15a, 15b Transfer device (MPRA)
17 First transport device (PRA1)
18 1st processing unit (CH1)
27 Second transport device (PRA2)
28 Second processing unit (CH2)
21U first buffer unit (SBU1)
21 L Second buffer unit (SBU2)
22U first delivery section (TRS1)
22L second delivery section (TRS2)
23a 1st reversing mechanism (RVS1)
23b Second reversing mechanism (RVS2)

Claims (16)

A first processing block including a first processing unit that processes the substrate with the first surface of the substrate facing upward, and a first transfer device that performs loading and unloading of the substrate with respect to the first processing unit When,
A second processing unit for processing the substrate with the second surface opposite to the first surface of the substrate facing upward, and loading of the substrate to the second processing unit A second processing block including a second transport device for
A reversing mechanism disposed in the middle of a transport path of the substrate from the first processing block to the second processing block, for reversing the substrate ;
A first delivery unit that is disposed at a position accessible by the first transport device and that accommodates the substrate with the first surface facing upward, and a position that is accessible by the second transport device; A delivery including a second delivery unit that accommodates the substrate with the second surface facing upward, and a transfer device that carries the substrate into and out of the first delivery unit and the second delivery unit. Equipped with blocks ,
The first processing block and the second processing block are arranged side by side in the height direction,
The reversing mechanism is
A substrate processing system disposed in the delivery block . The transfer device transports the substrate with the first surface facing upward to the first delivery unit, and the first transport device takes out the substrate from the first delivery unit and transfers the substrate to the first delivery unit. While transporting to the processing unit, the substrate processed by the first processing unit is taken out from the first processing unit and transported to the first delivery unit, and the transfer device transfers the substrate from the first delivery unit. Are taken out and transported to the reversing mechanism, and the substrate inverted by the reversing mechanism is removed from the reversing mechanism and transported to the second delivery unit, and the second delivery device transfers the substrate from the second delivery unit. The substrate processing system according to claim 1 , wherein the substrate is taken out and transported to the second processing unit. A first processing block including a first processing unit that processes the substrate with the first surface of the substrate facing upward, and a first transfer device that performs loading and unloading of the substrate with respect to the first processing unit When,
A second processing unit for processing the substrate with the second surface opposite to the first surface of the substrate facing upward, and loading of the substrate to the second processing unit A second processing block including a second transport device for
A reversing mechanism disposed in the middle of a transport path of the substrate from the first processing block to the second processing block, for reversing the substrate ;
A first delivery unit that is disposed at a position accessible by the second transport device and that accommodates the substrate with the first surface facing upward, and a position that is accessible by the second transport device; A second delivery unit that accommodates the substrate with the second surface facing upward; and a transfer device that carries the substrate in and out of the first delivery unit and the second delivery unit, A first delivery block disposed adjacent to the second processing block;
And a third delivery unit disposed at a position accessible by the first transport device and the second transport device and containing the substrate with the first surface or the second surface facing upward. A second delivery block disposed between the first processing block and the second processing block ;
The reversing mechanism is
A substrate processing system disposed in the first delivery block . The transfer device transports the substrate with the first surface facing upward to the first delivery unit, and the second transport device takes out the substrate from the first delivery unit and performs the third transfer. The first transport device takes out the substrate from the third delivery unit and transports the substrate to the first processing unit, and transports the substrate processed by the first processing unit to the first processing unit. The substrate is taken out from the unit and conveyed to the third delivery unit, and the second conveyance device takes out the substrate from the third delivery unit and conveys the substrate to the first delivery unit, and the transfer device receives the first reception. The substrate is taken out from the transfer section and transported to the reversing mechanism, and the substrate reversed by the reversing mechanism is removed from the reversing mechanism and transported to the second delivery section, and the second transport apparatus Delivery The substrate processing system of claim 3, characterized by conveying to the second processing unit takes out the substrate from. The substrate processing system according to any one of claims 1 to 4 , wherein the transfer of the substrate by the first transfer device, the second transfer device, and the transfer device is performed in parallel. A first processing block including a first processing unit that processes the substrate with the first surface of the substrate facing upward, and a first transfer device that performs loading and unloading of the substrate with respect to the first processing unit When,
A second processing unit for processing the substrate with the second surface opposite to the first surface of the substrate facing upward, and loading of the substrate to the second processing unit A second processing block including a second transport device for
A reversing mechanism disposed in the middle of a transport path of the substrate from the first processing block to the second processing block, for reversing the substrate ;
A first delivery unit that is disposed at a position accessible by the second transport device and that accommodates the substrate with the first surface facing upward, and a position that is accessible by the second transport device; A second delivery unit for accommodating the substrate with the second surface facing upward; and a first transfer device for carrying the substrate in and out of the first delivery unit and the second delivery unit. A first delivery block that is disposed adjacent to the second processing block,
A third delivery unit disposed at a position accessible by the first transport device and the second transport device and accommodating the substrate with the first surface or the second surface facing upward; And (3) a second transfer device for loading and unloading the substrate to and from the delivery section, and comprising a second delivery block disposed between the first processing block and the second processing block ,
The reversing mechanism is
A substrate processing system disposed in the second delivery block . The first transfer device transports the substrate with the first surface facing upward to the first delivery unit, and the second transfer device takes out the substrate from the first delivery unit and performs the transfer. The substrate is transported to a third delivery unit, and the first transport device takes out the substrate from the third delivery unit and transports the substrate to the first processing unit, and the substrate processed by the first processing unit is removed The substrate is taken out from the processing unit 1 and conveyed to the third delivery unit, and the second transfer device takes out the substrate from the third delivery unit and conveys the substrate to the reversing mechanism, and the reversal is performed by the reversing mechanism. The substrate is taken out of the reversing mechanism and conveyed to the third delivery unit, and the second conveyance device takes out the substrate from the third delivery unit and conveys the substrate to the second processing unit. A substrate processing system according to claim 6 . The substrate according to claim 6 or 7 , wherein the transfer of the substrate by the first transfer device, the second transfer device, the first transfer device, and the second transfer device is performed in parallel. Processing system. The first delivery unit, the second delivery unit, and the reversing mechanism
The substrate processing system according to any one of claims 1 to 8 , which is arranged side by side in the height direction. A first processing block including a first processing unit that processes the substrate with the first surface of the substrate facing upward, and a first transfer device that performs loading and unloading of the substrate with respect to the first processing unit When,
A second processing unit for processing the substrate with the second surface opposite to the first surface of the substrate facing upward, and loading of the substrate to the second processing unit A second processing block including a second transport device for
A reversing mechanism disposed in the middle of a transport path of the substrate from the first processing block to the second processing block, for reversing the substrate ;
A first delivery unit that is disposed at a position accessible by the first transport device and that accommodates the substrate with the first surface facing upward; and loading and unloading of the substrate with respect to the first delivery unit First transfer device to be carried out, second transfer device for loading the substrate to the reversing mechanism, and the first transfer device and the second transfer device are disposed at accessible positions, And a delivery block including a buffer unit for temporarily containing the substrate ,
The first processing block and the second processing block are arranged side by side in the height direction,
The reversing mechanism is
A substrate processing system disposed in the delivery block . The first transfer device transports the substrate with the first surface upward to the first delivery unit, and the first transport device takes out the substrate from the first delivery unit and performs the transfer. While transporting to the first processing unit, the substrate processed by the first processing unit is taken out of the first processing unit and transported to the first delivery unit, and the first transfer device receives the first receiving unit. The substrate is taken out from the transfer section and transported to the buffer section, the second transfer device takes out the substrate from the buffer section and transports the substrate to the reversing mechanism, and the reversing mechanism reverses the substrate, and The substrate processing system according to claim 10 , wherein a second transfer device takes out the substrate from the reversing mechanism and transfers it to the second processing unit. The delivery block is
And a second delivery unit disposed at a position accessible by the second transfer device and accommodating the substrate with the first surface facing upward.
The second processing unit is
A first processing unit that processes the substrate with the second surface of the substrate facing upward;
The substrate processing system according to claim 10 , further comprising: a second processing unit configured to process the substrate with the first surface of the substrate facing upward. The first transfer device transports the substrate with the first surface upward to the first delivery unit, and the first transport device takes out the substrate from the first delivery unit and performs the transfer. While transporting to the first processing unit, the substrate processed by the first processing unit is taken out of the first processing unit and transported to the first delivery unit, and the first transfer device receives the first receiving unit. The substrate is taken out from the transfer section and transported to the buffer section, the second transfer device takes out the substrate from the buffer section and transports the substrate to the reversing mechanism, and the reversing mechanism reverses the substrate, and The second transfer device takes out the substrate from the reversing mechanism and transfers it to the second processing unit, and the second processing unit processes the substrate using the first processing unit, and the second transfer device And removing the substrate from the second processing unit and transporting the substrate to the reversing mechanism, the reversing mechanism reverses the substrate, and the second transport device removes the substrate from the reversing mechanism and performs the second process. The substrate processing system according to claim 12 , wherein the substrate processing system is transported to a unit, and the second processing unit processes the substrate using the second processing unit. The first processing unit is
Processing the peripheral portion of the substrate in a state where the second surface of the substrate having the first surface facing up, which is a circuit formation surface, is held by suction;
The second processing unit is
The substrate according to any one of claims 1 to 13, wherein the second surface of the substrate is treated while holding the peripheral portion of the substrate with the second surface facing upward. Processing system. The first transport device is
An adsorption unit for adsorbing the substrate, the substrate being transported in a state where the second surface is adsorbed and held using the adsorption unit,
The second transport device is
An inner peripheral portion larger in diameter than the substrate, and a plurality of claws projecting radially inward from the inner peripheral portion from the inner peripheral portion, the outer peripheral portion of the substrate is placed on the claws The substrate processing system according to any one of claims 1 to 14 , wherein the substrate is transported in a state. The substrate processing system according to any one of claims 1 to 15 , wherein the processing by the first processing unit and the processing by the second processing unit are performed in parallel.

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