JP6427005B2 - Spacer - Google Patents

Description

The present invention relates to a spacing equipment.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes referred to simply as “wafer”) is cut into a predetermined shape and a predetermined size, and semiconductor chips (hereinafter simply referred to as “chips”) as a plurality of strip-like bodies. In some cases, the chips are singulated and the distance between the singulated chips is increased and then mounted on an object to be mounted such as a lead frame or a substrate. An apparatus for widening the distance between chips is disclosed, for example, in Patent Document 1, and a configuration in which tension in four directions, for example, + X axis direction, -X axis direction, + Y axis direction, and -Y axis direction, is applied to an adhesive sheet. It has become.

JP 2001-223186 A

  However, in the conventional device as described in Patent Document 1, the moving range of the holding member must be secured in view of the structure for moving the holding member, which causes a problem that the device becomes large in size. .

An object of the present invention is to provide a separation equipment which can prevent the device is increased in size as much as possible.

The spacing device of the present invention is a spacing device which applies tension to a plate-like member on an adhesive sheet in at least two directions of tension directions to widen the interval between a plurality of strip-like members formed from the plate-like member. A plurality of holding means for holding the adhesive sheet, at least one of the holding means comprises a holding member for sandwiching the adhesive sheet from one surface and the other surface, and the surface direction of the adhesive sheet the holding member is driven to rotate about a parallel rotational axis, in Rukoto winding the adhesive sheet to the holding member, characterized in that is provided to be tensioning to the adhesive sheet.

  It is preferable that the spacing device of the present invention comprises surface position maintaining means capable of maintaining the surface positions of the plurality of strip-like members whose spacings are spread apart at a predetermined position.

  According to the present invention as described above, since the holding member is rotationally driven around the rotation axis parallel to the surface direction of the adhesive sheet to apply tension to the adhesive sheet, it is necessary to secure the movement range of the holding member It is possible to prevent the apparatus from being enlarged as much as possible.

  Under the present circumstances, if a surface position maintenance means is provided, since it can suppress that the surface position of a strip-like body changes with the rotational drive of a holding member, it is measurement means, such as an optical sensor and an imaging means, for example. In the case of measuring the mutual spacing of the strips, it is possible to prevent the measurement value from shifting from the actual mutual spacing.

(A) is a top view of the separation device concerning one embodiment of the present invention. (B) is a side view of (A). Operation | movement explanatory drawing of the separation apparatus of FIG. The top view of the spacing device concerning the modification of the present invention.

Hereinafter, an embodiment of the present invention will be described based on the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. I assume. Furthermore, in each embodiment, when referring to the direction from the front direction in FIG. 1 parallel to the Y-axis and indicating the direction, the “up” is the arrow direction of the Z-axis, the “down” is the opposite direction, “Left” is the arrow direction of the X axis, “right” is the opposite direction, and “front” is the arrow direction of the Y axis, “rear” is the opposite direction.

  In FIG. 1, the spacing device 10 has four directions of + X axial direction, + Y axial direction, −X axial direction and −Y axial direction (refer to FIG. 2) on a square wafer WF as a plate-like member on the adhesive sheet AS. A separating device which applies tension in the direction of tension to widen the distance between chips CP as a plurality of strip-like members formed from a wafer WF, which has a plurality of holding means 20 for holding adhesive sheet AS, It comprises surface position maintaining means 30 capable of maintaining the surface position of the plurality of chips CP which can be spread at a predetermined position, and measurement means 40 such as an optical sensor or a camera for measuring the mutual spacing of the chips CP. In addition, four holding means 20 and four surface position maintaining means 30 are provided in the front, rear, left and right centering on the central point CT. The wafer WF is separated into chips CP by wafer cutting means such as a cutting blade or pressurized water, or can be separated into chips CP by wafer weakening means such as a laser beam or a chemical solution, and the adhesive sheet AS It is temporarily attached and is considered as an integral object WK. In addition, the adhesive sheet AS extends in the direction of the outer edge of the adhesive sheet AS from the respective apexes AP of the polygonal surrounding area AC surrounding the adherend adhering area AW to which the wafer WF is attached, relative to the surrounding area AC. A non-interference cut CU is formed which prevents tension from being applied in the combined direction of each tension direction, and + X axis direction, -X axis direction, + Y axis direction, -Y axis direction from each side of the surrounding area AC A tensile region AL extending in the direction of

  Each holding means 20 includes one holding member 21. Each holding member 21 is supported by the surface position maintaining means 30, and the rotation motor 22 as a driving device for supporting the rotation plate 22B by the output shaft 22A as a rotation axis parallel to the surface direction of the adhesive sheet AS 22B supported by the output shaft 23A for supporting the upper gripping member 23B by a rotation motor 23 as a driving device, and supported by the rotating plate 22B for supporting one end side of the lower gripping member 24B by the slider 24A Motor 24 as a motor, a rotation motor 25 as a driving device supported by surface position maintaining means 30 and supporting a rotation plate 25B by an output shaft 25A as a rotation axis parallel to the surface direction of adhesive sheet AS A rotation motor 26 as a drive device supported by the plate 25B and supporting the upper pressing member 26B by the output shaft 26A, and a rotation plate It is supported on 5B, and a linear motor 27 as a driving device for supporting the other end of the lower gripping member 24B at its slider 27A.

  The surface position maintaining means 30 is supported on the base plate 50, and has a linear motion motor 31 as a driving device for supporting the rotation motor 22 by its output shaft 31A, and a driving device for supporting the rotation motor 25 by its output shaft 32A. A linear motion motor 32 is provided, and surface position detection means 33 such as an optical sensor for detecting the position of the upper surface of the adhesive sheet AS or the position of the upper surface of the chip CP.

A procedure for widening the mutual spacing of the plurality of chips CP formed from the wafer WF in the above separating apparatus 10 will be described.
First, with respect to the separation device 10 shown by the solid line in FIG. 1 in which each member stands by at the initial position, conveyance means (not shown) such as a human hand or articulated robot or a belt conveyor conveys the integral object WK to the position shown in FIG. . Next, as shown in FIGS. 2A and 2B, each holding means 20 drives the respective rotation motors 23, 26 and the linear motors 24, 27 to overturn the upper gripping member 23B, and then the upper The upper gripping member 23B is pressed from above by the pressing member 26B, and the lower gripping member 24B is raised to sandwich the adhesive sheet AS between the upper gripping member 23B and the lower gripping member 24B.

  Next, each holding means 20 drives the respective rotation motors 22, 25 to rotationally drive the upper gripping members 23B and the lower gripping members 24B at the same speed centering on the output shafts 22A, 25A, as shown in FIG. As shown in (C), the adhesive sheet AS is wound around the upper gripping member 23B and the lower gripping member 24B, and the tension region AL is 4 in the + X axial direction, −X axial direction, + Y axial direction, −Y axial direction Move in the direction. As a result, tension is applied to the surrounding area AC in the adhesive sheet AS in four directions of + X axis direction, −X axis direction, + Y axis direction, and −Y axis direction, and the distance between the chips CP increases. At this time, the non-interference cut CU can minimize the application of tension in the combined direction in each tension direction to the surrounding area AC. Then, the chip CP located at the outermost periphery has reached a predetermined position, that is, at predetermined positions on two opposing sides of the wafer WF separated (divided chips CP group). When the measuring means 40 detects that the width has become the predetermined width, each holding means 20 stops driving the respective rotation motors 22, 25.

  Here, when the adhesive sheet AS is wound around the upper gripping member 23B and the lower gripping member 24B, the outer diameter of the wound adhesive sheet AS changes, and the position of the chip CP group approaches the measuring means 40, A transport device or a pick-up device in which the measured values by the measurement means 40 deviate from the actual mutual spacing, or the chip CP on the adhesive sheet AS is held and transported, and mounted on a mounting object such as a lead frame or substrate Etc. may shift the position where the chip CP is accessed. Therefore, as shown in FIG. 2C, the surface position maintaining means 30 drives the linear motion motors 31, 32 based on the detection result of the surface position detection means 33, and raises / lowers their output shafts 31A, 32A. Control is performed so that the top surface position of the chip CP does not deviate from the predetermined surface position.

  After that, conveying means (not shown) such as a conveying device or a pickup device holds and conveys each chip CP and mounts it on the object to be mounted. Thereafter, when transport of all chips CP is completed, each holding means 20 and each surface position maintaining means 30 drive each drive device to return each component to the initial position, and then the chips CP are removed and integrated. The transport means recovers the object WK, and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, since the holding member 21 is rotationally driven about the rotation axis parallel to the surface direction of the adhesive sheet AS, the movement of the holding member 21 is performed to apply tension to the adhesive sheet AS. There is no need to secure a range, and the apparatus can be prevented from becoming large as much as possible.

  As described above, the best configuration, method and the like for carrying out the present invention are disclosed in the above description, but the present invention is not limited to this. That is, although the present invention has been particularly illustrated and described primarily with respect to particular embodiments, it is to be understood that shapes relative to the above-described embodiments can be made without departing from the spirit and scope of the invention. A person skilled in the art can make various modifications in material, quantity, and other detailed configurations. Moreover, the description which limited the shape, the material, etc. which were disclosed above is described in an exemplification for facilitating the understanding of the present invention, and the present invention is not limited. The description in the name of the member from which the limitation of some or all of the limitations such as is removed is included in the present invention.

  For example, each holding means 20 may be provided with two holding members 21A, as shown in FIG. Each holding member 21A is supported by the rotation motor 22 and the rotation plate 22B, and the rotation shaft 23A supports the rotation member 23C of approximately half the length of the upper holding member 23B, and the rotation plate A linear motor 24 is supported by 22B and supports a lower gripping member (not shown) having a length approximately half that of the lower gripping member 24B by a slider 24A. In this case, each holding means 20 individually rotates the holding members 21A on the basis of the measurement results of the measurement means 40, so that the size of each area in the cross direction orthogonal to the tension direction in the adhesive sheet AS is different. Tension can be applied to adjust the distance between the chips CP. In this case, for example, even if the adhesive sheet AS is wound around the lower gripping members 23B and 24B at the same speed and the same amount of rotation at the same rotation motor 22 and tension is applied to each tension region AL, the material of the adhesive sheet AS As shown in FIG. 3A, each chip CP may not be disposed at a theoretical position, as shown in FIG. 3A, depending on the cut depth to the adhesive sheet by the cutter when it is cut into chips CP. In such a case, each holding means 20 individually drives the rotation motor 22 based on the measurement result of the measurement means 40, and rotationally drives the holding members 21A individually to perform the adjustment operation. As a result, as shown in FIG. 3B, the chips CP can be arranged at theoretical positions. Here, the theoretical position of each chip CP means the width of the reference position of the wafer WF before being spread out from the width of the reference position of the divided and spread wafer WF, and The positions of the respective chips CP when the respective chips CP are equally spread by a value divided by the number of interval lines formed between the chips CP.

The holding means 20 may be two or three or five or more.
When two holding means are used, one holding means is configured to only hold the adhesive sheet AS by, for example, a chuck cylinder as a driving device or a linear motor, and the other holding means 20 is the above embodiment and Similarly, the adhesive sheet AS may have a configuration for applying tension, for example, may be configured to apply tension in two directions of + X direction and −X direction or in two directions of + Y direction and −Y direction. Even when the number of holding means is three or more, any one of the holding means holds the adhesive sheet AS, and the other holding means 20 applies tension to the adhesive sheet AS as in the above embodiment. can do.

When it is necessary to weaken the tension of the adhesive sheet AS from the measurement result of the measuring means 40, the holding means 20 rotationally drives the rotation motors 22 and 25 in the direction opposite to the rotational direction for applying tension to the adhesive sheet AS. Good.
When it is necessary to weaken or strengthen the tension of the adhesive sheet AS based on the measurement results of the measurement means 40, the holding means 20 may rotate the rotational motors 22, 25 independently for each tension area AL.
The holding means 20 holds the holding members 21 and 21A for each holding means 20 in four directions of + X axis direction, -X axis direction, + Y axis direction and -Y axis direction without rotationally driving the respective rotation motors 22 and 25. After being moved to each position, each holding means 20 may rotate the rotation motors 22 and 25 to adjust the distance between the chips CP.
For example, the holding means 20 may be provided with a chuck cylinder as a driving device on the rotation plate 22B to hold the adhesive sheet AS, and the invention is not limited to the above embodiment.

The surface position maintaining means 30 may detect the positions of the upper surface and the lower surface of the adhesive sheet AS and the positions of the upper surface and the lower surface of the chip CP from above and below the one-piece object WK. Or a contact type sensor such as a limit switch or a pressure sensor.
The measuring means 40 may be omitted.

The tension applied to the wafer WF may be in two directions, three directions, five directions or more, and the holding means 20 may be provided in accordance with the number of the directions.
The shape of the plate-like member or the piece-like body may be any other shape such as, for example, a circle, an ellipse, a triangle, or a polygon having five or more sides.

  Further, the material, type, shape and the like of the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS may have a circular shape, an elliptical shape, a triangular shape, a pentagonal or more polygonal shape, or another shape, or may have an adhesion form such as pressure-sensitive adhesion or heat-sensitive adhesion. The adhesive sheet AS has, for example, a single-layer adhesive layer only, an intermediate layer between the substrate sheet and the adhesive layer, and three or more layers such as a cover layer on the upper surface of the substrate sheet. Or even a so-called double-sided adhesive sheet capable of peeling the base material sheet from the adhesive layer, the double-sided adhesive sheet having a single layer or a plurality of intermediate layers, or It may be a single layer or multilayer without an intermediate layer. Further, as the plate-like member, for example, food, resin container, semiconductor wafer such as silicon semiconductor wafer or compound semiconductor wafer, circuit substrate, information recording substrate such as optical disk, glass plate, steel plate, pottery, wood plate or resin plate, etc. A member, an article, etc. of arbitrary forms can also be made into object, and a strip-like body should just be those in which it was separated into pieces. In addition, the adhesive sheet AS is changed to a functional and practical reading, for example, any sheet such as a protective sheet, dicing tape, die attach film, die bonding tape, film, tape, etc. It can be attached to the garment.

The means and steps in the present invention are not limited in any way as long as the operations, functions or steps described in the means and steps can be performed, and it is needless to say that the constitutions of only one embodiment shown in the above embodiment or There is no limitation to the process. For example, the holding means comprises a plurality of holding means for holding the adhesive sheet, at least one of which comprises a holding member for sandwiching the adhesive sheet from one side and the other side, in the plane direction of the adhesive sheet As long as the holding member can be rotationally driven about a parallel rotation axis, there is no limitation as long as it is within the technical scope in light of the technical common knowledge at the time of filing of the application (others) Description of the means and steps of
Further, the drive device in the above-described embodiment includes a rotary motor, a linear motion motor, a linear motor, an electric device such as a single-axis robot and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder and a rotary cylinder. Besides being adoptable, it is also possible to adopt a combination of them directly or indirectly (some overlap with those exemplified in the embodiment).

Reference Signs List 10 separation device 20 holding means 21 holding member 22A output shaft (rotational shaft)
25A output shaft (rotational shaft)
30 surface position maintenance means AS adhesive sheet WF wafer (plate-like member)
CP chip (piece)

Claims (1)

A separating device for applying tension to a plate-like member on an adhesive sheet in at least two directions of tension to widen the distance between a plurality of strip-like members formed from the plate-like member,
A plurality of holding means for holding the adhesive sheet,
At least one of the holding means includes a holding member sandwiching the adhesive sheet from one surface and the other surface, and rotationally drives the holding member around a rotation axis parallel to the surface direction of the adhesive sheet. It is allowed, in Rukoto winding the adhesive sheet to the holding member, spacing device, characterized in that provided a tension to be given to the adhesive sheet.

Images