JP6428353B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using a plurality of light emitting elements.

  Light-emitting devices such as LEDs (light-emitting diodes) using light-emitting elements that are semiconductors and phosphors that convert light from the light-emitting elements into light of different wavelengths are used as light sources for general lighting, street lamps, in-vehicle headlamps, etc. It's being used. In order to achieve high output, a plurality of light emitting elements are used (for example, Patent Document 1).

  In addition to high output, a light emitting device capable of obtaining desired light distribution characteristics has also been proposed. For example, in order to output higher light in a specific direction, it is known that a light emitting device with high front luminance is obtained by covering the side surfaces of the light emitting element and the wavelength conversion member with a reflecting member (for example, Patent Document 2). ).

JP 2006-339060 A JP 2009-218274 A

  When a plurality of light emitting elements are used, the light emitting area becomes large, and it becomes difficult to control light distribution with the secondary lens.

  In order to solve the problem, a light emitting device according to the present invention includes an optical member including a light exit surface, a plurality of light incident surfaces inclined with respect to the light exit surface, and at least one of the plurality of light entrance surfaces A light emitting element disposed on each of two or more surfaces, a wavelength conversion member disposed on the light emitting surface and converting light from the light emitting element into light of a different wavelength, and a light reflecting member surrounding the wavelength conversion member. And the light emitting surface of the wavelength converting member surrounded by the light reflecting member is smaller than the total area of the light emitting surface of the light emitting element.

  As described above, a light-emitting device with high output and a small light-emitting area can be obtained.

FIG. 1A is a schematic perspective view showing a light emitting device according to an embodiment. 1B is a schematic top view of the light-emitting device shown in FIG. 1A. 1C is a schematic cross-sectional view taken along line AA of the light-emitting device shown in FIG. 1B. 1D is a schematic cross-sectional view taken along line BB of the light emitting device shown in FIG. 1B. FIG. 2 is a schematic view illustrating a method for manufacturing the light emitting device according to the embodiment. FIG. 3 is a schematic diagram illustrating a method for manufacturing a light emitting device according to an embodiment. FIG. 4 is a schematic view illustrating a method for manufacturing a light emitting device according to an embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. The contents described in one embodiment and example are applicable to other embodiments and examples.
The size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation.

  A light emitting device according to an embodiment of the present invention includes a light emitting element, a wavelength conversion member, an optical member, and a light reflecting member. Further, a substrate on which the light emitting element is placed is provided. An optical member is a member arrange | positioned at the light emission surface side of a light emitting element. A wavelength conversion member is a member arrange | positioned on the surface which is the surface of an optical member, and the light emitting element is not arrange | positioned. Here, among the surfaces of the optical member, a surface on which the light emitting element is arranged, that is, a surface on which light from the light emitting element is incident is referred to as a “light incident surface”. Also, the surface of the optical member that is different from the light incident surface and from which the light that has entered the optical member from the light incident surface is emitted to the outside is referred to as a “light emitting surface”. A wavelength conversion member is disposed on the light exit surface. The wavelength converting member has a light emitting surface surrounded by a light reflecting member.

  In such a light emitting device, the area of the light emitting surface of the wavelength conversion member is smaller than the total area of the light emitting surfaces of the light emitting elements. Thereby, light from a plurality of light emitting elements can be emitted in an area smaller than the area (total area) of the light emitting surface of the light emitting elements.

Here, the “light emitting surface of the light emitting element” will be described. The outer shape of the light-emitting element is a substantially rectangular parallelepiped, and includes an n-type semiconductor layer, an active layer (light-emitting layer), and a p-type semiconductor layer. Light from the light-emitting element is also emitted to the outside from the side surface. In this specification, the “light-emitting surface of the light-emitting element” refers to a surface facing the optical member. That is, in a light-emitting element having a stacked structure in which a plurality of semiconductor layers are stacked as described above, the surface on the upper surface side or the lower surface side of the stacked structure body and facing the optical member is referred to as “light emission of the light-emitting element. Surface ".
Hereinafter, each member will be described in detail.

(substrate)
A board | substrate is a member for mounting a light emitting element on it, and is provided with the mounting surface of the area and shape in which a light emitting element can be mounted. Since the light emitting elements are disposed on a plurality of surfaces (light incident surfaces) of the optical member, the substrate is also disposed so as to correspond thereto. For example, a plurality of substrates may be used so as to correspond to the respective light incident surfaces of the optical member, or an integrated substrate corresponding to the plurality of surfaces of the optical member can be used. When a plurality of substrates are used, a plurality of substrates (sub-substrates) on which light-emitting elements are mounted may be mounted on another substrate (main substrate) to be integrated.

As the substrate, a member with high heat dissipation is preferably used, and an insulating or conductive material can be used. Preferred materials include ceramics such as AlN, SiC, Al ₂ O ₃ , mullite, LTCC, silicone resin, silicone modified resin, epoxy resin, epoxy modified resin, phenol resin, acrylic resin, polyimide, BT resin, unsaturated polyester, etc. Or a resin such as polyphthalamide (PPA), a liquid crystal polymer (LCP), a polycarbonate resin, a thermoplastic resin such as polycyclohexane terephthalate, or a metal such as Cu, Fe, or Al. Further, a wiring capable of supplying power to the light emitting element to be mounted may be provided. For example, a spring terminal or a wire can be used for power supply from the outside. By using the spring terminal, for example, it can be fixed to the secondary substrate in a detachable form.

  Examples of the outer shape of the substrate include a flat plate, a prismatic body such as a quadrangular prism and a triangular prism, a pyramid such as a quadrangular pyramid and a triangular pyramid, or a truncated pyramid, and a combination of these. May have notches, irregularities, or even curved surfaces. In the case of a prismatic body, it may be a right prism whose side and bottom are orthogonal to each other, or an oblique prism whose side and bottom are obliquely crossed.Pyramids and pyramids also have a straight line connecting the bottom and top, and the center of the bottom and top. The connecting straight line may be perpendicular or inclined with respect to the bottom surface. Among these substrates, one or more surfaces can be a mounting surface of the light emitting element.

(Light emitting element)
A light emitting element (LED dice) is a semiconductor light emitting element, and a plurality of light emitting elements are used in the present invention. Specifically, one or a plurality of elements are arranged on an incident surface of an optical member described later. For example, one light emitting element may be disposed on each of a plurality of incident surfaces to form a plurality of light emitting elements as a whole, or two or more light emitting elements may be disposed on one incident surface. Only one capable of emitting light having a wavelength that can excite the wavelength conversion member may be used, or a light emitting element that emits light having a wavelength that does not substantially excite the wavelength conversion member may be used. For example, the blue, the green light emitting element, can be used with ZnSe and nitride semiconductor _{(In X Al Y Ga1-X} -YN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1). As the red light emitting element, GaAs, InP, or the like can be used. Furthermore, a light-emitting element made of a material other than this can also be used.

Among these, at least a nitride-based semiconductor (In _X Al _Y Ga1-X-YN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) capable of emitting blue light having a dominant wavelength of 430 nm to 490 nm is used. It is preferable to use the light emitting element used. Furthermore, it is preferable to use a blue light-emitting element used in one light-emitting device having a main wavelength difference of 2.5 nm or less, whereby a light-emitting device with little color unevenness in the light-emitting surface is obtained. Can do.

  The light-emitting element can be used either face-up mounting or flip-chip mounting on a substrate, and is preferably flip-chip mounting. By flip-chip mounting, the light emitting element and the translucent member can be arranged without using a wire or the like. Thereby, the light from a light emitting element can be efficiently entered in the entrance plane of a translucent member.

(Wavelength conversion member)
A wavelength conversion member is a member which is arrange | positioned on the light-projection surface of an optical member, and comprises the light emission surface of a light-emitting device. When the periphery of the wavelength conversion member is surrounded by a light reflecting member or the like in order to fix the wavelength conversion member, the surface exposed from these members is the light emitting surface. This light emitting surface has an area smaller than the total area of the light emitting surface of the light emitting element.

  The wavelength conversion member emits mixed color light from the light emitting surface as described above. Specifically, the wavelength conversion member is a member including a phosphor that is excited by light (and their collective light) from the light emitting element and emits light having a wavelength different from that of the light emitting element. The mixed color light with the converted light is emitted from the light emitting surface.

  As phosphors, granular materials are used, and in order to fix them, they are used in combination with translucent materials such as resin, glass, ceramic, etc., and wavelength conversion members are composed including these Has been.

  The wavelength conversion member may be provided on the light exit surface of the optical member by a method such as coating, printing, electrodeposition, spraying, or a member formed separately from the optical member into a plate shape or a sheet shape. Alternatively, it may be provided by a method such as pasting. The thickness of the wavelength conversion member includes the target color tone, the characteristics of the phosphor used (wavelength, composition, etc.), the characteristics of the light emitting element (number, wavelength, composition, etc.), and the characteristics of the optical member (refractive index, thickness, shape, etc.) ) Can be selected as appropriate. Furthermore, the thickness of the wavelength conversion member is preferably uniform, but there may be a partially thick portion or a thin portion. Furthermore, the upper surface (the surface opposite to the surface facing the optical member) can be a flat surface, a convex surface, a concave surface, a prism surface, or the like. Moreover, it can be the same size as the light emission surface of the optical member, or can be made slightly smaller or larger. By making it larger than the exit surface of the optical member, the light from the optical member can be surely easily incident on the wavelength conversion member. Moreover, surface brightness can be made higher by making it smaller than the output surface of an optical member.

  The wavelength conversion member may be provided in one light emitting device so as to function as one continuous light emitting unit, or may be provided so as to function as two or more light emitting units. For example, when a plate-like wavelength conversion member is attached, one wavelength conversion member may be attached to the emission surface of the optical member, or two wavelength conversion members may be attached side by side. In the case of using a plurality of sheets, another member may be interposed therebetween, or they may be provided so as to contact each other. When forming directly on an optical member such as a spray, for example, it may be provided as one wavelength conversion member with a mask provided with one opening, or a wavelength return member separated using a mask provided with two openings Two may be provided.

  The phosphor preferably has an average particle diameter (D bar) of about 2.5 to 30 μm as measured by the Fisher Sub-Seeds Sizes Number (FSSS No.) measurement method.

As the phosphor, those known in the art can be used. For example, Ce (cerium) activated YAG (yttrium aluminum garnet) phosphor, Ce activated LAG (lutetium aluminum garnet) phosphor, Eu (europium) and / or Cr (chromium) Activated nitrogen-containing calcium aluminosilicate (CaO—Al ₂ O ₃ —SiO ₂ ) -based phosphor, Eu-activated silicate ((Sr, Ba) ₂ SiO ₄ ) -based phosphor, β sialon phosphor, KSF Examples thereof include (K ₂ SiF ₆ : Mn) phosphor. A quantum dot phosphor can also be used.

  As a member which comprises a wavelength conversion member with fluorescent substance, a translucent member is preferable. For example, a resin such as a silicone resin, a silicone-modified resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a trimethylpentene resin, a polynorbornene resin, or a hybrid resin containing one or more of these resins, glass, ceramic, and the like. It is done. Moreover, you may use what hardened only the fluorescent substance, without using a translucent material.

  For example, a diffusing material may be provided on the upper surface or the lower surface of the wavelength conversion member. In this case, a diffusion material may be applied, or another member such as a diffusion sheet may be laminated or bonded. Further, a filter or the like may be stacked.

(Optical member)
The optical member is a member for collecting light from the light emitting elements, and is a translucent member capable of transmitting light therein. And it is a polyhedron which has the several light-incidence surface into which the light from a light emitting element injects, and one or more light-projection surfaces provided in a different surface from a light-incidence surface. Furthermore, in addition to these surfaces, a light reflecting surface may be provided, and various functional parts such as a fixing part and a positioning part may be provided.

  Light emitted from a plurality of light emitting elements is incident on the inside from the light incident surface of the optical member, reflected on the inner surface at least once, and then gathered toward the outside from the light emitting surface of the optical member. (Exited as collective light. Then, it is emitted (passed) to the outside via a wavelength conversion member arranged on the light emission surface. Light incident on the inside of the optical member is reflected on the inner surface thereof. In some cases, the light is directly emitted to the outside without being reflected, and such light is also emitted as collective light.

  Each light incident surface of the optical member has a size and shape that allows the entire light emitting surfaces of the plurality of light emitting elements to be used to face each other. Each light incident surface may have a step, unevenness, or a curved surface, in addition to a single flat surface. A single plane is preferred. In addition, when the “light incident surface” has irregularities, the surface area becomes larger than in the case of a single flat surface without irregularities. In this specification, “area” means such It does not indicate a surface area, but indicates a flat area corresponding to a region surrounded by the outer periphery of each surface. The light emitting surface of the optical member, other surfaces, and the areas of the light emitting elements, which will be described later, have the same meaning.

  The plurality of light incident surfaces of the optical member may have the same size and shape, or may be different. Moreover, about the positional relationship, the combination with the below-mentioned light-projection surface can be selected suitably.

  The light emitting surface of the optical member is a surface provided at an angle different from the light incident surface, that is, inclined, and the wavelength conversion member is disposed so as to face this surface. Preferably, the light exit surface is inclined by 40 to 80 degrees with respect to the light incident surface. The light exit surface is preferably a single flat surface, but may have a step or unevenness, or may have a curved surface. Further, it may be the same size as the wavelength conversion member, or may be small or large. Preferably, it is about the same size as the wavelength conversion member. The light exit surface is preferably a single surface of a polyhedron, and may be two or more in some cases. When there are a plurality of light emitting surfaces, the total area thereof is smaller than the total area of the light emitting surfaces of the light emitting elements.

  As the outer shape of the optical member, basic shapes include a flat plate, a prismatic body such as a quadrangular prism and a triangular prism, a pyramid such as a quadrangular pyramid and a triangular pyramid, a truncated pyramid, and a combination of these. And may have a notch, unevenness, or a curved surface. In the case of a prismatic body, it may be a right prism whose side and bottom are orthogonal to each other, or an oblique prism whose side and bottom are obliquely crossed.Pyramids and pyramids also have a straight line connecting the bottom and top, and the center of the bottom and top. The connecting straight line may be perpendicular or inclined with respect to the bottom surface. Among these optical members, any two or more of the surfaces constituting the surface can be used as a light incident surface, and one or more of the surfaces other than the incident surface can be used as a light emitting surface.

  For example, when the optical member has a triangular prism shape, it has two bottom surfaces of a triangle and three side surfaces of a quadrangle. That is, it is a polyhedron having five surfaces. In the case of such a triangular prism shape, the light incident surface and the light emitting surface can be selected as follows. Note that the surface that is not the entrance surface or the exit surface is a surface that functions as a reflection surface or the like.

  The two triangles forming the bottom of the triangular prism may be regular triangles, isosceles triangles, right triangles, or other triangles, and the two faces may be the same area and the same shape triangles, and the areas and shapes may be different from each other. It does not matter. The three quadrangles forming the side surface of the triangular prism may be any of a square, a rectangle, and a parallelogram, and each may be a quadrangle having the same area and the same shape, and the area and shape may be changed.

  The sizes of the bottom surface and the side surface can be appropriately selected according to the number and size of light emitting elements to be arranged, the size of the wavelength conversion member, and the like.

  In addition, when the optical member has a quadrangular prism shape, it has two rectangular bottom surfaces and four rectangular side surfaces. That is, it is a polyhedron having six faces. Also in the case of such a quadrangular prism, the size and shape of each surface can be variously selected according to the purpose and application as in the case of the triangular prism described above. Moreover, the combination of a light-incidence surface and a light-projection surface can select various combinations similarly to the case where an optical member is triangular prism shape.

As a material for the optical member, a light-transmitting member that transmits 90% or more of light from the light-emitting element and light from the wavelength conversion member is suitable. Specific examples include resins such as glass and acrylic. Ceramics or the like can also be used. Ceramics may have a transmittance lower than 90%. For example, the ceramic can function as a diffusion member that diffuses light inside. And specific examples thereof include _Al 2 _{O 3,} and the like. A transparent single crystal phosphor plate member can also be used.

  Hereinafter, description of other polyhedrons is omitted, but as described above, the shape and size of each surface can be selected according to the purpose and application, and any one of these surfaces can be selected. Can be selected as the light incident surface or the light exit surface.

(Light reflecting member)
The light reflecting member is provided so as to surround the periphery of the emission surface of the wavelength conversion member, and a region surrounded by the light reflecting member is a light emitting surface. The enclosed region is set to be smaller than the total area of the light emitting surface of the light emitting element.

  The light reflecting member can surround the emission surface of the wavelength conversion member in various forms. For example, it is possible to surround the emission surface so as to cover only the side surface of the wavelength conversion member, or to provide a frame on the upper surface thereof, or to provide a frame from the side surface to the upper surface.

The light reflecting member is not only provided to define the light emitting surface of the light emitting device as described above, but may be provided at another part. For example, you may cover surfaces (light reflection surface etc.) other than the light-incidence surface and the light-projection surface among the surfaces of an optical member. Further, it may be provided between the light emitting element and the substrate, or may be provided between the light emitting element and the light emitting element. In this case, a light reflecting member may be provided so as to be in contact with the side surface of the light emitting element, or light is emitted through a translucent resin, an insulating inorganic material (for example, SiO ₂ or Al ₂ O ₃ ), or the like. It may be formed on the side surface of the element.

  The light reflecting member can be composed of a resin or glass containing inorganic particles. The resin and glass used as the base material of the light reflecting member can be variously selected according to the purpose and application, and among them, a silicone resin or an epoxy resin is preferable, and a silicone resin particularly excellent in light resistance and heat resistance is more preferable. . Since the light reflecting member can be formed by a printing method or the like, inorganic particles can be contained at a high concentration. Further, the light reflecting member may be added with silica (aerosil) or the like in order to adjust the viscosity and fluidity.

  The refractive index of the inorganic particles added to the light reflecting member is, for example, 1.8 or more, and preferably 2 or more in order to efficiently scatter light and obtain high light extraction efficiency. More preferably. The refractive index difference between the resin or glass of the base material of the light reflecting member and the inorganic particles is, for example, 0.4 or more, and is 0.7 or more in order to efficiently scatter light and obtain high light extraction efficiency. It is preferable that it is 0.9 or more. Further, the concentration of the inorganic particles is preferably 10 weight percent concentration (wt%) or more and 60 weight percent concentration or less, preferably 20 weight percent concentration or more and 50 weight percent, considering preferable light reflection characteristics and ease of formation. More preferred is a weight percent concentration. The average particle diameter (median diameter) of the inorganic particles is preferably 0.08 μm or more and 10 μm or less, and more preferably 0.1 μm or more and 5 μm or less, at which a light scattering effect can be obtained with high efficiency. The inorganic particles are preferably white. Specifically, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, or the like can be used as the inorganic particles. . Of these, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index and excellent thermal conductivity.

(Joining member)
The bonding member is a member that fixes the light emitting element on the mounting surface of the substrate. Either a conductive bonding member or an insulating bonding member can be selected depending on the type of light emitting element to be placed. For example, when a light-emitting element in which a nitride semiconductor layer is stacked on sapphire, which is an insulating substrate, is face-up mounted (the insulating substrate side is mounted), the bonding member may be insulating or conductive. When a conductive substrate such as a SiC substrate is used, or when a light emitting element using an insulating substrate is flip-chip mounted, conduction can be achieved by using a conductive bonding member. As the insulating bonding member, an epoxy resin composition, a silicone resin composition, a polyimide resin composition, a modified resin thereof, a hybrid resin, or the like can be used. When these resins are used, a metal layer having a high reflectance such as an Al or Ag film or a dielectric reflecting film can be provided on the back surface of the light emitting element in consideration of deterioration due to light or heat from the semiconductor light emitting element. In this case, methods such as vapor deposition, sputtering, and bonding of thin films can be used. As the conductive bonding member, conductive paste such as silver, gold or palladium, solder such as Au—Sn eutectic, brazing material such as low melting point metal, bump such as Au or Cu, etc. may be used. it can. Furthermore, when using a translucent joining member among these joining members, the fluorescent member which absorbs the light from a semiconductor light-emitting element and light-emits light of a different wavelength can also be contained in it.

(Other parts)
In the present embodiment, the light emitting device may have a member other than the above. For example, a protective element such as a Zener diode may be provided in addition to the light emitting element. The protection element may be placed on the substrate, or may be placed on a base that supports the substrate.

(Embodiment 1)
1A to 1D are light-emitting devices according to the first embodiment. It has a rectangular parallelepiped substrate 1, a plurality of light emitting elements 2 mounted on the substrate 1, and a wavelength conversion member 3 that converts light from the light emitting elements 2 into light of different wavelengths. An optical member 4 is provided between the light emitting element 2 and the wavelength conversion member 3. The optical member 4 has a triangular prism shape, and the light emitting element 2 is disposed on one surface thereof, and this surface is a light incident surface 4a on which light from the light emitting element 2 is incident. The optical member 4 includes a light emitting surface 4b as a surface different from the light incident surface 4a, and the wavelength conversion member 3 is disposed on the light emitting surface 4b. Both the light incident surface 4a and the light emitting surface 4b are rectangles constituting the side surfaces of the triangular prism-shaped optical member. In the first embodiment, there are two light incident surfaces 4a and one light emitting surface 4b.

  The periphery of the wavelength conversion member 3 is surrounded by the light reflecting member 6, and the surrounded region, that is, the surface not covered by the light reflecting member 6 is the light emitting surface. The light emitting surface is smaller than the total area of the light emitting surface of the light emitting element 2.

Such a light emitting device 10 can be obtained by the following method.
FIG. 2 is a schematic view showing a state in which the light emitting element 2 is mounted on the substrate 1. A substrate 1 provided with a wiring 1a on a ceramic such as Al ₂ O ₃ is prepared, and a plurality of light emitting elements 2 are placed in a straight line thereon. Then, the light source by which the light emitting element was mounted in the board | substrate 1 is obtained by cut | disconnecting using a dicer etc. The wiring 1a provided on the substrate 1 and the light emitting element 2 are electrically connected. The wiring 1a of the substrate 1 is provided in a wide area on the substrate 1 so that power can be supplied from the outside. Specifically, it is provided so as to extend to a position not covered by the light reflecting member 6.

  FIG. 3 is a schematic view showing a state in which the substrate 1 on which the light emitting element is placed is disposed on the base 5. The angle of the substrate 1 can be adjusted as appropriate depending on the shape of the substrate 5.

  FIG. 4 is a schematic view showing a state in which the optical member 4 and the wavelength conversion member 3 are arranged. In this way, the two light incident surfaces 4a are arranged so as to face the light emitting elements, respectively. In addition, although the optical member 4 is arrange | positioned after mounting the board | substrate 1 which mounted the light emitting element 2 in the base | substrate 5 previously here, the order which mounts each member is not restricted to this. That is, the substrate 1 on which the light emitting element 2 is placed may be attached to the optical member 4 first.

The light emitting element 2 has a size of about 1 mm × about 1 mm, and the area of the light emitting surface is about 1 mm ² . That is, the total area of the light emitting surface of the light emitting element 2 is about 8 mm ² .

  The wavelength conversion member 3 contains YAG as a phosphor, and is formed into a plate shape together with glass. The size is, for example, 0.6 mm × 4.65 mm, and is smaller than the total area of the light emitting surface of the light emitting element 2.

  The light emitting device of the present invention can be used for various general illuminations, scanners, projectors, in-vehicle headlamps, and the like.

DESCRIPTION OF SYMBOLS 10 ... Light-emitting device 1 ... Board | substrate 2 ... Light-emitting element 3 ... Wavelength conversion member 4 ... Optical member 4a ... Light incident surface 4b ... Light-emitting surface 5 ... Base | substrate 6 ... Light reflection member

Claims (5)

A plurality of light emitting elements, a substrate on which the light emitting elements are disposed,
Light emitting surface and an optical member having a plurality of light incidence surfaces inclined relative to the light exit surface,
A wavelength conversion member that is disposed on the light exit surface of the optical member and converts the light from the light emitting element into light of a different wavelength;
A substrate on which the substrate and the optical member are disposed;
A light reflecting member made of a resin containing inorganic particles ;
With
A light emitting surface of the light emitting element is disposed on each of a plurality of light incident surfaces of the optical member;
The light reflecting member has a surface other than the light incident surface on which the light emitting surface of the light emitting element is disposed and the light emitting surface on which the wavelength converting member is disposed, of the side surface of the wavelength converting member and the surface of the optical member. Covering
The light emitting device, wherein a light emitting surface of the wavelength conversion member surrounded by the light reflecting member is smaller than a total area of a light emitting surface of the light emitting element. It said light emitting surface-emitting device according to claim 1 which is inclined 40 to 80 degrees with respect to the light incident surface. The light emitting device according to claim 1, wherein the optical member is a triangular prism. The inorganic particles include at least one selected from titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, and aluminum oxide. The light emitting device according to any one of 1 to 3. Wiring is provided on the substrate,
A plurality of the light emitting elements are linearly mounted on the wiring,
5. The light emitting device according to claim 1, wherein the substrate extends to a position not covered by the light reflecting member.

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