JP6431081B2 - Wafer transfer device - Google Patents

Description

  The present invention relates to a wafer transfer apparatus that takes out and transfers a predetermined wafer from a magazine that stores a plurality of wafers in a stacked state.

  As shown in Patent Document 1, the wafer transfer apparatus is applied to, for example, an apparatus that supplies a wafer as a kind of component supply apparatus of a component mounter. When there is a request to supply a predetermined wafer to the component supply device, the wafer transfer device pulls out the wafer from the magazine and allows the component mounter to pick up the wafer cut component (chip). Transport to the supply position.

  The component supply device grasps which wafer is stored in each slot of the magazine based on, for example, a setting file for the magazine. The component supply apparatus controls the wafer transfer apparatus so that the wafer designated by the supply request is pulled out from the corresponding slot. Further, as a method for pulling out a specific wafer from a magazine in a wafer transfer device, for example, as shown in Patent Document 2, a method is known in which a peripheral portion of a wafer is held and moved by a clamp portion.

JP 2012-222010 A JP 2005-310976 A

  By the way, if the information recorded in the setting file for the magazine does not match the wafer actually stored in each slot of the magazine, a wafer different from the wafer specified by the supply request is supplied. . Therefore, in the transfer process, the wafer transfer device identifies the unique identification code attached to each wafer by the identification device, and determines whether the wafer being transferred is a specified wafer based on the identification information included in the identification code. Determine whether or not.

  Here, in the method of gripping the wafer by the clamp unit and pulling it out from the magazine, if the wafer identification code is attached to the peripheral edge of the wafer, the identification code is covered by the clamp unit and the identification device identifies the identification code. Can not. In such a case, for example, the clamp portion is temporarily retracted from the wafer in a state where the peripheral portion of the wafer to which the identification code is attached is exposed to the outside of the magazine. As a result, the identification code is exposed, and the identification device can identify the identification code. However, when such control is performed, there is a concern that the cycle time may be extended with an increase in operations in the transport process.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a wafer transfer device that enables identification codes to be identified by an identification device in a state where a clamp unit grips a wafer.

  According to a first aspect of the present invention, there is provided a wafer transfer apparatus that takes out and transfers a predetermined wafer from a magazine that accommodates a plurality of stacked wafers. An identification code including identification information used for specifying the wafer is attached to the peripheral portion of the wafer. The wafer transfer device includes: a clamp unit that grips the peripheral portion of the wafer; a drive unit that moves the clamp unit in the transfer direction of the wafer; and the wafer that is at least partially removed from the magazine. And an identification device that identifies the identification code by receiving reflected light reflected by the identification code of the wafer. The clamp portion is formed of a material that transmits the reflected light reflected by the identification code, and the identification code of the identification device by the identification device is held in a state where the peripheral portion of the wafer to which the identification code is attached is gripped. Allows identification.

  According to such a configuration, when the wafer is gripped so that the clamp portion covers the identification code attached to the peripheral portion of the wafer, the reflected light reflected by the identification code is transmitted through the clamp portion. Therefore, in a state where the identification code is covered by the clamp portion, the identification device can identify the identification code without opening the clamp portion and retracting it.

It is a perspective view showing the whole component mounting machine in an embodiment. It is a side view which shows the component supply apparatus of the component mounting machine of FIG. It is a top view which shows the clamp part and wafer of FIG. It is an enlarged view which shows the clamp part and identification code in FIG. It is a block diagram which shows a wafer conveyance apparatus. It is a flowchart which shows the conveyance process of the wafer by a wafer conveyance apparatus.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a wafer transfer apparatus according to the present invention will be described below with reference to the drawings. In the embodiment, a configuration in which a wafer transfer device is applied to a wafer supply device that supplies a wafer as a kind of component supply device is illustrated. The component supply device supplies a predetermined electronic component so that it can be picked up by the component mounter in response to a request from the component mounter that mounts the electronic component on the circuit board.

<Embodiment>
(Overall configuration of component mounter 1)
A configuration of the component mounting machine 1 will be described with reference to FIGS. 1 and 3. As shown in FIG. 1, the component mounter 1 includes a substrate transfer device 2, a component supply device 3, and a component transfer device 4. In the following description, the horizontal width direction of the component mounter 1 (the direction from the upper left to the lower right in FIG. 1) is the X-axis direction, and the horizontal longitudinal direction of the component mounter 1 (the direction from the upper right to the lower left in FIG. 1). Is the Y-axis direction, and the vertical direction (vertical direction in FIG. 1) perpendicular to the X-axis and Y-axis is the Z-axis direction.

  The substrate transfer device 2 is configured by a belt conveyor or the like, and sequentially transfers the circuit board Bd in the transfer direction (X-axis direction). The board conveying device 2 positions the circuit board Bd at a predetermined position in the component mounting machine 1. Then, after the mounting process by the component mounter 1 is executed, the board transfer device 2 carries the circuit board Bd out of the component mounter 1.

  The component supply device 3 supplies electronic components to be mounted on the circuit board Bd. In the present embodiment, the above-described electronic components include electronic components accommodated in a carrier tape at a predetermined pitch, and chips 91 obtained by cutting the wafer 90 in units of components. The carrier tape is fed and moved by a feeder that is detachably set in a plurality of slots of the component supply device 3. Thereby, the component supply apparatus 3 supplies an electronic component in the taking-out part of the front end side of a feeder. The component mounter 1 also includes a wafer supply device 20 that supplies a chip 91 of the wafer 90 as a kind of the component supply device 3. The detailed configuration of the wafer supply apparatus 20 will be described later.

  Here, as shown in FIG. 3, the wafer 90 has a plurality of chips 91, an adhesive sheet 92, a ring frame 93, and a bar code 94 (corresponding to the “identification code” of the present invention). . A plurality of chips 91 are formed, for example, in a lattice pattern on the wafer body, and are cut into parts by a laser cutter or the like while being attached to the adhesive sheet 92.

  The ring frame 93 is an annular plate member. The ring frame 93 holds the pressure-sensitive adhesive sheet 92 that is expanded in the radial direction. As a result, the plurality of chips 91 are separated from each other at the opening of the ring frame 93. With this configuration, the wafer 90 has a plate shape as a whole, and the whole shape is held by the ring frame 93 that functions as an outer frame.

  Further, an identification code used for specifying the wafer 90 is attached to the peripheral portion of the wafer 90 (the ring frame 93 in the present embodiment). As the identification code, any of a barcode, a two-dimensional code, a character string, a pattern, a color, or a combination thereof can be adopted. In the present embodiment, as shown in FIG. 3, the identification code employs a bar code 94 configured by arranging a plurality of bar lines having different line widths and intervals between lines in parallel.

  The component transfer device 4 is configured to be movable in the X-axis direction and the Y-axis direction. The component transfer device 4 is arranged from the rear side in the longitudinal direction of the component mounter 1 (upper right side in FIG. 1) to the upper side of the component supply device 3 on the front side. The component transfer device 4 includes a head driving device 11 and a mounting head 12. The head driving device 11 is configured to be able to move the moving table in the XY axis directions by a linear motion mechanism. The mounting head 12 is detachably provided on the moving table of the head driving device 11.

  The mounting head 12 is provided with a plurality of suction nozzles 13 in a detachable manner. The mounting head 12 supports each of the suction nozzles 13 so as to be rotatable about the R axis parallel to the Z axis and to be movable up and down. Each suction nozzle 13 is controlled in the elevation position and angle with respect to the mounting head 12 and the supply state of negative pressure. Each suction nozzle 13 sucks and holds the electronic components supplied at the feeder take-out portion and the chips 91 of the wafer 90 supplied by the wafer supply device 20 by being supplied with a negative pressure.

(Detailed Configuration of Wafer Supply Device 20)
As shown in FIGS. 2 and 5, the wafer supply device 20 includes a storage device 21, a magazine 30, a wafer transfer device 40, and a push-up device 80. The storage device 21 stores a setting file for a magazine that records which wafer 90 is accommodated in each slot of the magazine 30.

  The magazine 30 includes a housing 31, a wafer stocker 32, and a stocker lifting device 33. The housing 31 is formed in a rectangular parallelepiped shape. In the housing 31, a slit 31 a into which the wafer 90 can be carried in and out is formed in a portion of the outer peripheral surface facing the component supply position Ps where the component transfer device 4 picks up an electronic component.

  The wafer stocker 32 is provided inside the housing 31 so as to be movable up and down. The wafer stocker 32 stores a plurality of wafers 90 in a stacked state. More specifically, the wafer stocker 32 is formed with a plurality of slots arranged at equal intervals in the Z-axis direction, and a wafer 90 is accommodated in each slot so as to be slidable in the Y-axis direction.

  The stocker lifting / lowering device 33 is disposed inside the housing 31 so that the wafer stocker 32 can be lifted / lowered. The stocker lifting / lowering device 33 supports a wafer stocker 32 provided so as to be movable up and down with respect to the housing 31. The stocker raising / lowering device 33 is constituted by, for example, a motor and a ball screw mechanism, and raises and lowers the wafer stocker 32 to a predetermined vertical position with respect to the housing 31.

  With such a configuration, the magazine 30 raises and lowers the wafer stocker 32 based on the control command so that a predetermined wafer 90 can be carried out from the slit 31 a of the housing 31. Similarly, the magazine 30 enables the wafer 90 to be loaded into the empty slot by positioning the empty slot of the wafer stocker 32 at the vertical position corresponding to the slit 31 a of the housing 31.

  The wafer transfer device 40 takes out a predetermined wafer 90 from the magazine 30 and transfers it. As shown in FIGS. 2, 3, and 5, the wafer transfer device 40 includes a clamp unit 41, an arm 42, a wafer table 43, a drive device 50, an identification device 60, and a control device 70. . The clamp portion 41 is configured to be able to grip a front peripheral edge portion 93 a of the wafer 90 at a vertical position corresponding to the slit 31 a of the housing 31 among the plurality of wafers 90 accommodated in the wafer stocker 32. The detailed configuration of the clamp part 41 will be described later.

  A base end portion of the arm 42 is fixed to the driving device 50. The distal end portion of the arm 42 supports the clamp portion 41. The wafer table 43 is arranged at a component supply position Ps where the component transfer device 4 can pick up an electronic component (chip 91). The wafer table 43 is configured to be able to hold a ring frame 93 of the wafer 90 transferred upward.

  The driving device 50 is a loader that moves the clamp unit 41 in the transport direction (left and right direction in FIG. 2) via the arm 42. Further, the driving device 50 operates an actuator (not shown) provided in the clamp unit 41 to switch between the gripping state and the open state of the clamp unit 41. The drive device 50 includes a slide body 51, a guide rail 52, an endless belt 53, and a servo motor 54.

  The slide body 51 of the drive device 50 supports the proximal end portion of the arm 42. The slide body 51 is guided by a guide rail 52 extending in the Y-axis direction so as to be movable along the transport direction. The slide body 51 is fixed to a part of the endless belt 53. The endless belt 53 is suspended by a pair of pulleys (not shown), and rotates by driving a servo motor 54 connected to the rotation shaft of one pulley.

  With such a configuration, the drive device 50 drives the servo motor 54 based on the control command to reciprocate the clamp portion 41 in the transport direction via the endless belt 53, the slide body 51, and the arm 42. In addition to the above-described transport operation, the driving device 50 synchronizes the gripping operation for switching the gripping state and the open state of the clamp unit 41 to carry out the wafer 90 pulled out from the magazine 30 to the wafer table 43, and the wafer table 43. Then, the wafer 90 is loaded into the magazine 30.

  The identification device 60 identifies the barcode 94 by receiving the reflected light reflected by the barcode 94 of the wafer 90 for the wafer 90 in a state where at least a part is taken out from the magazine 30. The identification information included in the barcode 94 is read. As shown in FIG. 2, the identification device 60 is provided on an upper portion of the outer peripheral surface of the housing 31 where the slit 31 a is formed.

  The identification device 60 includes a sensor unit 61 that receives the reflected light reflected by the barcode 94. With such a configuration, the identification device 60 can identify the barcode 94 in the identification region Rs adjacent to the slit 31a of the housing 31, as shown in FIG. That is, the identification device 60 reads the identification information of the barcode 94 attached to the wafer 90 for the wafer 90 that is partially pulled out from the magazine 30.

  The control device 70 is mainly composed of a CPU, various memories, and a control circuit. The control device 70 is connected to the driving device 50 and the identification device 60 through an interface circuit, and controls the transfer processing of the wafer 90 by the wafer transfer device 40. As illustrated in FIG. 5, the control device 70 includes a conveyance control unit 71 and a code presence / absence determination unit 72. The transfer control unit 71 executes transfer processing of the wafer 90 by the wafer transfer device 40 based on the control command of the wafer supply device 20.

  Specifically, the transfer control unit 71 controls the operation of the driving device 50 to switch between gripping and releasing of the wafer 90 by the clamp unit 41, and the wafer 90 held by the clamp unit 41 is transferred to the magazine 30 and the wafer table. 43. Further, the transfer control unit 71 controls the operation of the identification device 60 to identify the wafer 90 pulled out from the magazine 30, and collates the wafer 90 with the wafer designated by the supply request. Details of the transfer process by the wafer transfer apparatus 40 including the verification process will be described later.

  The code presence / absence determination unit 72 determines whether or not the barcode 94 is attached to the peripheral portion of the wafer 90 held by the clamp unit 41. More specifically, the identification device 60 performs identification by irradiating the identification region Rs with light based on a control command from the control device 70 and receiving reflected light from the sensor unit 61. Based on the identification result, the code presence / absence determination unit 72 determines that the barcode 94 is attached when the identification information is read, and otherwise the barcode 94 is attached. Judge that there was no.

  As shown in FIG. 2, the push-up device 80 is provided on a base below the wafer transfer device 40 at the component supply position Ps. The push-up device 80 includes a pin lifting / lowering device 81 and a pin member 82. The pin lifting / lowering device 81 is supported by an XY robot and is provided to be movable in the X-axis direction (front-rear direction in FIG. 2) and the Y-axis direction (left-right direction in FIG. 2) at the component supply position Ps. Further, the pin lifting device 81 supports a pin member 82 extending in the Z-axis direction.

  The push-up device 80 pushes up a portion at a predetermined XY position on the wafer 90 held by the wafer table 43 from below. The chip 91 at the predetermined XY position in the wafer 90 is peeled off from the adhesive sheet 92 by the pin member 82 being pushed up. The chip 91 is picked up by the suction nozzle 13 in a state where a negative pressure is supplied.

  The wafer supply apparatus 20 having such a configuration executes a wafer 90 supply process based on the control command. The supply process of the wafer 90 includes a lifting process of the wafer stocker 32 by the magazine 30, a transfer process of the wafer 90 by the wafer transfer device 40, and a peeling process of a predetermined chip 91 by the push-up device 80.

(Detailed configuration of the clamp part 41)
As shown in FIG. 2, the clamp unit 41 holds the wafer 90 by sandwiching the peripheral portion (ring frame 93) of the wafer 90 from the up and down direction. The clamp portion 41 is formed of a material that transmits the reflected light reflected by the barcode 94 of the wafer 90 among the light irradiated by the identification device 60.

  That is, when the identification device 60 emits visible light for identification, the clamp unit 41 is formed of a transparent material that can transmit visible light. Various materials such as acrylic resin and glass are applicable as the transparent material. In this embodiment, the clamp part 41 is formed with an acrylic resin. With such a configuration, the clamp unit 41 enables the identification device 60 to identify the barcode 94 while holding the peripheral portion of the wafer 90 to which the barcode 94 is attached.

  As shown in FIG. 4, the area Sp of the gripping surface 41 a facing the peripheral edge of the wafer 90 in the clamp part 41 is set larger than the area Sc of the barcode 94. Thus, when the clamp portion 41 grips the peripheral portion of the wafer 90 to which the barcode 94 is attached, the entire barcode 94 is covered with the clamp portion 41. In such a state, all the reflected light reflected by the barcode 94 passes through the clamp portion 41.

  Here, when the barcode 94 is gripped by the transparent clamp portion 41 as described above, the apparent shape of the barcode 94 visually recognized by the transmitted light is distorted according to the shape, refractive index, etc. of the clamp portion 41. . Therefore, as shown in FIG. 3, the clamp portion 41 is disposed at the center in the width direction with respect to a region (identification region Rs) in which the identification device 60 can identify the barcode 94. The above-mentioned “width direction” is defined as a direction (left-right direction in FIG. 3) perpendicular to the conveyance direction of the wafer 90 on a plane including the peripheral edge of the wafer 90 (that is, the upper surface of the ring frame 93). Hereinafter, the width direction in the identification region Rs in which the identification device 60 scans the barcode 94 is referred to as “scanning width direction”.

  With such a configuration, the reflected light that has passed through both ends of the clamp portion 41 in the scanning width direction out of the reflected light reflected by the barcode 94 has the same optical path length to the sensor portion 61. Accordingly, when the identification device 60 identifies the barcode 94, the distortion amount is the same at both ends of the barcode 94, and the distortion amount is biased by the clamp unit 41 in the scanning width direction with respect to the identification region Rs. It becomes smaller than the maximum amount of distortion when arranged.

(Wafer transfer processing by the wafer transfer device 40)
The component mounter 1 supplies the corresponding chip 91 to the wafer supply device 20, which is the component supply device 3, when a predetermined chip 91 needs to be mounted in the execution of the electronic component mounting process. Request. The wafer supply apparatus 20 first transports the wafer 90 designated by the supply request from the magazine 30 to the component supply position Ps. Next, the wafer supply device 20 pushes up a predetermined chip 91 from below by the push-up device 80 so that the chip 91 can be picked up.

  The component transfer device 4 of the component mounter 1 inputs information related to the coordinate position of the chip 91 supplied at the component supply position Ps from the wafer supply device 20 and moves the suction nozzle 13 based on the information to move the chip. 91 is adsorbed. In such a wafer 90 supply process by the wafer supply apparatus 20, the wafer transfer apparatus 40 executes a wafer 90 transfer process as shown in FIG.

  Here, the ring frame 93 of the wafer 90 corresponds to the peripheral portion of the wafer 90. Further, the identification code (bar code 94) including identification information used for specifying the wafer 90 is the front peripheral edge 93a in the transport direction (vertical direction in FIG. 3) or the rear of the peripheral edge (ring frame 93) of the wafer 90. It is attached to at least one of the side peripheral edge portions 93b.

  In the transfer processing of the wafer 90, first, the transfer control unit 71 pulls out the wafer 90 moved to the vertical position corresponding to the slit 31a of the magazine 30 by a predetermined amount (Step 11 (hereinafter, “Step” is referred to as “S”). ))). As a result, the front peripheral edge 93a of the wafer 90 is positioned so as to be within the identification region Rs of the identification device 60 while being held by the clamp 41 (see FIG. 3). At this time, when the wafer 90 is taken out from the magazine 30 as described above, the clamp unit 41 maintains a state in which the front peripheral edge portion 93a of the wafer 90 is gripped.

  Next, the identification device 60 executes identification processing for the barcode 94 attached to the wafer 90 (S12). Specifically, the identification device 60 irradiates the barcode 94 with light using an illumination LED. The irradiated light passes through the clamp part 41 and is reflected by the bar code 94, and then passes through the clamp part again. The identification device 60 receives the reflected light from the sensor unit 61 and scans the barcode 94.

  When the barcode 94 is normally attached to the ring frame 93 of the wafer 90 by scanning the barcode 94, the barcode 94 is identified by the identification device 60 and the identification information is read. Subsequently, the code presence / absence determination unit 72 determines whether or not the barcode 94 is attached to the front peripheral edge portion 93a of the wafer 90 held by the clamp unit 41 based on the identification result by the identification device 60 (S13). ).

  In the identification process (S12), the code presence / absence determination unit 72 determines that the barcode 94 is attached to the front peripheral edge 93a of the wafer 90 when the identification information included in the barcode 94 is read (S12). S13: Yes). On the other hand, if the identification information is not read in the identification process (S12), the code presence / absence determination unit 72 determines that the barcode 94 is not attached to the front peripheral edge 93a of the wafer 90 (S13: No).

  The transfer control unit 71 moves the clamp unit 41 in the transfer direction, and further pulls out the wafer 90 held by the clamp unit 41 (S14). Accordingly, the rear peripheral edge portion 93b of the wafer 90 is positioned so as to be within the identification region Rs of the identification device 60. The identification device 60 executes identification processing for the barcode 94 attached to the rear peripheral edge portion 93b (S15). Subsequently, the code presence / absence determination unit 72 determines whether or not the barcode 94 is attached to the rear peripheral edge 93b of the wafer 90 based on the result of the identification process (S15) (S16).

  The identification process (S15) for the rear peripheral edge 93b and the determination of the presence or absence of the barcode 94 (S16) are substantially the same as the identification process (S12) for the front peripheral edge 93a and the determination of the presence or absence of the barcode 94 (S13). Therefore, detailed description is omitted. Here, when it is determined that the barcode 94 is not attached to the rear peripheral edge 93b (S16: No), the wafer 90 has the barcode 94 on both the front peripheral edge 93a and the rear peripheral edge 93b. Is not properly attached.

  Therefore, the wafer transfer apparatus 40 executes error processing (S17) and ends the transfer process. The error processing (S17) includes notifying the wafer supply apparatus 20 that it is unclear whether or not the drawn wafer 90 matches the wafer specified by the supply request. For example, when the same kind of wafer 90 is stored in the wafer stocker 32, the wafer supply apparatus 20 that has input the notification may be replaced with the wafer 90. Further, if the wafer supply apparatus 20 cannot be replaced with another wafer, the wafer supply apparatus 20 notifies the component mounter 1 that the designated chip 91 cannot be supplied.

  When the identification information is read by the identification processing (S12, S15) of the barcode 94 attached to either the front peripheral edge 93a or the rear peripheral edge 93b of the wafer 90 (S13: Yes, S16: Yes), the wafer 90 collation process is executed (S21). Specifically, the transfer control unit 71 collates the wafer 90 pulled out from the magazine 30 with the wafer designated by the supply request by the wafer supply apparatus 20 based on the identification information acquired by reading.

  Subsequently, when the wafer 90 pulled out from the magazine 30 is different from the wafer specified by the supply request (S22: No), the wafer transfer device 40 executes error processing (S17) and performs transfer processing. finish. The error processing (S17) includes notifying the wafer supply apparatus 20 that the pulled wafer 90 and the wafer specified by the supply request do not match. The operation of the wafer supply apparatus 20 that has input the notification is the same as the operation of the wafer supply apparatus 20 when it is determined that the barcode 94 is not attached (S16: No).

  On the other hand, when the wafer 90 pulled out from the magazine 30 coincides with the wafer specified by the supply request (S22: Yes), the transfer control unit 71 controls the operation of the driving device 50 and clamps 41 The wafer 90 held by is transferred to the component supply position Ps (S23). Thus, the wafer transfer apparatus 40 ends the transfer process of the wafer 90.

(Effects of the configuration of the embodiment)
The wafer transfer apparatus 40 of this embodiment takes out a predetermined wafer 90 from the magazine 30 that accommodates a plurality of wafers 90 in a stacked state, and transfers the wafer 90. An identification code (bar code 94) including identification information used for specifying the wafer 90 is attached to the peripheral portion of the wafer 90.
The wafer transfer device 40 includes a clamp unit 41 that grips the peripheral edge of the wafer 90, a drive device 50 that moves the clamp unit 41 in the transfer direction of the wafer 90, and a wafer that is at least partially removed from the magazine 30. And an identification device 60 that identifies the identification code by receiving reflected light reflected by the identification code of the wafer 90.
The clamp portion 41 is formed of a material that transmits the reflected light reflected by the identification code, and enables the identification device 60 to identify the identification code while holding the peripheral portion of the wafer 90 to which the identification code is attached. .

  According to such a configuration, when the wafer 90 is gripped so that the clamp portion 41 covers the barcode 94 attached to the peripheral portion of the wafer 90, the reflected light reflected by the barcode 94 on the clamp portion 41 is reflected. To Penetrate. Therefore, in a state where the barcode 94 is covered with the clamp portion 41, the identification device 60 can identify the barcode 94 without opening the clamp portion 41 and retracting it.

  Accordingly, in the transfer process of the wafer 90, when it is determined whether or not the wafer 90 pulled out from the magazine 30 is the wafer 90 designated by the supply request (S21, S22), the gripping state by the clamp unit 41 is maintained. This determination can be made. Thereby, extension of cycle time is suppressed.

  Further, the area Sp of the gripping surface 41a facing the peripheral edge of the wafer 90 in the clamp part 41 is set larger than the area Sc of the identification code (bar code 94) (see FIG. 4). When the clamp 41 holds the peripheral edge of the wafer 90 to which the identification code is attached, the entire identification code is covered with the clamp 41.

  According to such a configuration, the barcode 94 is not separated by the end portion of the clamp portion 41 in a state where the clamp portion 41 holds the wafer 90. Thereby, the reflected light reflected by the barcode 94 passes through the clamp part 41 through an optical path corresponding to the refractive index of the clamp part 41. Therefore, the apparent shape of the barcode 94 can be visually recognized with distortion suppressed as a whole. Accordingly, the identification accuracy of the barcode 94 by the identification device 60 is improved.

In addition, the clamp unit 41 has a width orthogonal to the conveyance direction of the wafer 90 on a plane including the peripheral portion of the wafer 90 with respect to the region (identification region Rs) where the identification device 60 can identify the identification code (bar code 94). It is arranged at the center in the direction (scanning width direction in the present embodiment).
According to such a configuration, the maximum distortion amount of the barcode 94 due to the reflected light reflected by the barcode 94 passing through the clamp portion 41 in the scanning width direction is reduced. Thereby, the identification accuracy of the barcode 94 is improved.

The identification code (bar code 94) is attached to at least one of the front peripheral edge 93a in the transfer direction and the rear peripheral edge 93b in the transfer direction among the front peripheral edge 93a of the wafer 90. When the wafer 90 is taken out from the magazine 30, the clamp unit 41 holds the front peripheral edge 93 a of the wafer 90.
The wafer transfer device 40 has a determination unit (code presence / absence determination unit 72) that determines whether or not the identification code is attached to the front peripheral edge 93a gripped by the clamp unit 41 based on the identification result by the identification device 60. Further prepare.
When the determination unit determines that the identification code is not attached to the front peripheral edge 93a, the identification device 60 identifies the identification code attached to the rear peripheral edge 93b.

  According to such a configuration, it is possible to determine the presence / absence of the barcode 94 in a state where the clamp portion 41 grips the front peripheral edge portion 93a of the wafer 90 (S13). The wafer 90 is transported so that the rear peripheral edge 93b is moved to the identification region Rs only when the barcode 94 is not attached to the front peripheral edge 93a. Can be improved.

The material of the clamp part 41 is acrylic resin or glass.
According to such a configuration, the clamp part 41 reliably transmits visible light. Moreover, the clamp part 41 can be formed at low cost, and the manufacturing cost can be reduced. Further, it is easy to form with a uniform density, and the clamp portion 41 with a small distortion can be formed.

<Modification of Embodiment>
(About wafers)
In the embodiment, the wafer 90 is configured such that a ring frame 93 holds an adhesive sheet 92 to which a plurality of chips 91 are attached. On the other hand, if a plurality of wafers are stored in the magazine 30 in a stacked state, the wafers are to be transferred by the wafer transfer device 40. Therefore, the wafer may be configured without the adhesive sheet 92 or the ring frame 93, for example. In this configuration, the identification code is attached to the peripheral edge of the wafer body.

  In the embodiment, a barcode 94 is used as the identification code attached to the wafer 90. On the other hand, as the identification code, any of a two-dimensional code, a character string, a pattern, a color, or a combination thereof can be adopted. For example, an identification code employing a two-dimensional code is configured by arranging a plurality of unit cells in a matrix shape, and includes identification information used for specifying a wafer.

(Clamp part)
In the embodiment, the thickness in the gripping direction (vertical direction in FIG. 2) at each part of the clamp portion 41 is set to be constant over the entire region in the scanning width direction. On the other hand, the thickness in the holding direction at each part of the clamp part 41 may be set according to the distance from each part to the sensor part 61 of the identification device 60.

  Specifically, the clamp part 41 is set so that the thickness gradually increases, for example, from the center part toward both end parts. At this time, the upper surface of the clamp part 41 is formed to have a planar shape or a curved surface shape. Moreover, when the clamp part 41 is not arrange | positioned in the center of the scanning width direction with respect to the sensor part 61 of the identification apparatus 60, the clamp part 41 is the other side from the edge part of the side close | similar to the sensor part 61, for example. It is set so that the thickness gradually increases as it goes to the end of the. According to such a configuration, for example, by setting the thickness in the gripping direction of the clamp portion 41 so as to correct the distortion amount, the distortion amount of the visually recognized identification code is adjusted. Thereby, the identification device 60 can appropriately identify the identification code, and can reliably read the identification information.

  In the embodiment, the ring frame 93 corresponding to the peripheral portion of the wafer 90 is formed of, for example, a metal material. On the other hand, the wafer 90 may employ a configuration in which the ring frame 93 is not provided as described above, or a configuration in which the ring frame 93 is formed of a flexible material having low hardness (for example, a resin material). In such a case, the peripheral portion of the wafer 90 to which the identification code is attached may be bent in the accommodated state of the wafer 90.

  Therefore, the following configuration may be employed. That is, the hardness of the clamp portion 41 is set higher than the hardness of the front peripheral edge portion 93 a of the wafer 90. Furthermore, the gripping surface 41a of the clamp part 41 is formed in a planar shape. According to such a configuration, the peripheral portion of the wafer 90 is stretched in a planar shape by being gripped by the clamp portion 41. Thereby, distortion of an identification code becomes small and the identification accuracy of the identification code by the identification device 60 is improved.

(Regarding the controller 70)
As described above, for example, a two-dimensional code may be employed as the identification code. In such a case, the identification device 60 requires image processing when identifying the identification code and reading the identification information. Therefore, when such an identification code is attached to the wafer 90, the identification device 60 includes an image conversion unit 65, an image processing unit 66, and an information acquisition unit 67, as shown in FIG. Also good.

  The image converter 65 converts the reflected light reflected by the identification code into an image. The image processing unit 66 corrects image distortion using a correction value set in advance based on the shape and refractive index of the clamp unit 41. The information acquisition unit 67 reads identification information based on the corrected image. According to such a configuration, the image processing unit 66 performs correction processing on the identification code that is distorted according to the refractive index of the clamp unit 41. Thereby, since the distortion amount assumed in advance can be reflected in the image, the identification accuracy of the identification code by the identification device 60 is improved.

(Other)
In the embodiment, the wafer conveyance device 40 is applied to a wafer supply device 20 that is a kind of the component supply device 3 of the component mounter 1. On the other hand, the wafer transfer apparatus is applied to an apparatus that takes out a predetermined wafer from a magazine that accommodates a plurality of wafers in a stacked state, transfers the wafer, and requires identification code identification during the transfer. Can do.

  In the embodiment, the reflected light reflected by the identification code and transmitted through the clamp portion 41 is visible light. On the other hand, the reflected light may be infrared light other than visible light, for example, as long as the sensor unit 61 of the identification device 60 can receive light. In such a configuration, the clamp portion 41 is formed of a material that transmits reflected light, as in the embodiment.

DESCRIPTION OF SYMBOLS 1: Component mounting machine 3: Component supply apparatus 20: Wafer supply apparatus 30: Magazine 40: Wafer transfer apparatus, 41: Clamp part, 41a: Holding surface 50: Drive apparatus 60: Identification apparatus, 61: Sensor part 65: Image Conversion unit 66: Image processing unit 67: Information acquisition unit 70: Control device 72: Code presence / absence determination unit (determination unit)
90: Wafer 93: Ring frame, 93a: Front peripheral edge, 93b: Rear peripheral edge 94: Bar code (identification code)
Rs: identification area, Bd: circuit board, Ps: component supply position

Claims (8)

A wafer transfer device that takes out a predetermined wafer from a magazine that accommodates a plurality of wafers in a stacked state, and transfers the wafer.
An identification code including identification information used for specifying the wafer is attached to the peripheral portion of the wafer,
The wafer transfer device
A clamp for gripping the peripheral edge of the wafer;
A drive device for moving the clamp part in the wafer transfer direction;
An identification device for identifying the identification code by receiving the reflected light reflected by the identification code of the wafer for the wafer in a state where at least a part is taken out from the magazine;
The clamp portion is formed of a material that transmits the reflected light reflected by the identification code, and the identification code of the identification device by the identification device is held in a state where the peripheral portion of the wafer to which the identification code is attached is gripped. Wafer transfer device that enables identification. Of the clamp part, the area of the gripping surface facing the peripheral edge of the wafer is set larger than the area of the identification code,
2. The wafer transfer according to claim 1, wherein when the clamp portion grips the peripheral portion of the wafer to which the identification code is attached, the entire identification code is covered with the clamp portion. apparatus.   The clamp part is disposed at a center in a width direction orthogonal to a wafer transfer direction on a plane including the peripheral edge of the wafer with respect to a region where the identification device can identify the identification code. The wafer transfer apparatus according to 1 or 2. The identification device has a sensor unit that receives the reflected light reflected by the identification code,
The wafer conveyance device according to any one of claims 1 to 3, wherein a thickness in a holding direction at each part of the clamp unit is set according to a distance from each part to the sensor unit of the identification device. . The identification code is attached to at least one of the front peripheral edge in the transfer direction and the rear peripheral edge in the transfer direction among the peripheral edges of the wafer,
The clamp portion grips the front peripheral edge of the wafer when the wafer is taken out of the magazine,
The wafer transfer device further includes a determination unit that determines whether the identification code is attached to the front peripheral edge gripped by the clamp unit based on a result of identification by the identification device,
The said identification apparatus identifies the said identification code attached | subjected to the said rear side peripheral part, when the said determination part determines with the said identification code not being attached | subjected to the said front side peripheral part. The wafer conveyance apparatus as described in any one of. The identification device includes:
An image converter that converts the reflected light reflected by the identification code into an image;
An image processing unit for correcting distortion of the image using a correction value set in advance based on the shape and refractive index of the clamp unit;
An information acquisition unit that acquires the identification information based on the corrected image;
The wafer conveyance apparatus as described in any one of Claims 1-5 which have these. The hardness of the clamp part is set higher than the hardness of the peripheral part of the wafer,
The wafer transfer apparatus according to claim 1, wherein a gripping surface of the clamp portion that faces the peripheral edge portion of the wafer is formed in a flat shape.   The wafer conveyance device according to any one of claims 1 to 7, wherein the material of the clamp portion is acrylic resin or glass.

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