JP6431440B2 - Substrate storage container - Google Patents

Description

  The present invention relates to a substrate storage container in which a gas in a container body is purged with a purge gas such as an inert gas.

  A conventional substrate storage container such as a FOUP has a front open box container body 1 capable of storing a plurality of semiconductor wafers W arranged in the vertical direction and an opening of the container body 1 as shown in part in FIG. And a pair of air supply valves and exhaust valves are disposed on the front and rear portions of the bottom plate of the container main body 1, respectively. Is purged and replaced with an inert gas such as nitrogen gas (see the arrow in FIG. 18), thereby preventing surface oxidation and contamination of the semiconductor wafer W and corrosion of the wiring (see Patent Documents 1 and 2). ).

  The container body 1 is provided with a pair of left and right support pieces for horizontally supporting the semiconductor wafer W on the inner surfaces of the left and right side walls, and the pair of support pieces are arranged at predetermined intervals in the vertical direction. Between the support pieces adjacent to each other in the direction, a slot having a substantially V-shaped cross section that is in slidable contact with the peripheral edge of the semiconductor wafer W is formed as a recess. The container body 1 is mounted on a lid opening / closing device 72 to which a purge device 71 is attached. The lid opening / closing device 72 allows the lid body to be fitted to the opened front surface or the lid body to be removed from the front surface. To do.

  The pair of air supply valves and exhaust valves are, for example, a pair of air supply valves for supplying an inert gas from the purge device 71 to the inside of the container main body 1, respectively, fitted on the rear side of the bottom plate of the container main body 1. A pair of exhaust valves for exhausting air from the inside to the outside are respectively fitted in front of the bottom plate of the container body 1.

  The pair of air supply valves are each fitted with a lower end portion of a tower nozzle 70 formed in a hollow cylindrical shape from the viewpoint of contributing to the flow control of the inert gas. The pair of tower nozzles 70 are oriented in the vertical direction of the container main body 1, and a plurality of air outlets are perforated in the vertical direction of the peripheral wall, and the flow of the inert gas that blows out from the air outlets does not intersect. The mounting angle is adjusted (see Patent Document 3).

  When such a substrate storage container is mounted on the lid opening / closing device 72 to which the purge device 71 is attached in a state where the front surface of the container main body 1 is closed by the lid, the substrate storage container is brought into the container main body 1 from the purge device 71. The inert gas is supplied through each supply valve, and the inert gas is blown out toward the lid while contacting the semiconductor wafer W from a plurality of outlets arranged in the vertical direction of the peripheral wall of the tower nozzle 70. 1 is full. When the inert gas is filled in the container main body 1, the air in the container main body 1 is purged to the outside via each exhaust valve, and the gas in the container main body 1 is replaced with the inert gas from the air. .

  By the way, the substrate storage container is generally purged in a state where the front surface of the container body 1 is closed by the lid, but when the relative humidity in the container body 1 is desired to be uniformly lowered to a certain level or less. The lid body may be removed from the front surface of the container body 1 by the lid body opening / closing device 72 and purged with the front surface of the container body 1 opened (see Patent Document 4).

  When purging with the front surface of the container body 1 opened, as shown in FIG. 18, the container body 1 of the substrate storage container is attached to a lid opening / closing device 72 attached to an EFEM (Equipment Front End Module) 73. After the lid is mounted and removed from the front of the container body 1 by the lid opening / closing device 72, a large amount of clean air (see the arrow in the figure) is down-flowed from the fan filter unit 74 on the ceiling of the EFEM 73 to the floor. In addition, an inert gas is supplied from the purge device 71 into the container main body 1 via the air supply valve.

  The supplied inert gas flows upward from the lower end of the tower nozzle 70, and blows out in the front direction in which the container body 1 is opened while contacting the semiconductor wafer W from each outlet of the tower nozzle 70.

JP 2003-168728 A JP 2010-161157 A JP 2012-114133 A JP 2004-327911 A

  The conventional substrate storage container is configured as described above and can be expected to have an excellent effect. However, since the lower end of the tower nozzle 70 is simply attached to the air supply valve of the container body 1, the container body 1 There is a possibility that the humidity between the semiconductor wafers W varies, in other words, the humidity between the support pieces of the container main body 1 varies and a defect may occur. This point will be described in detail. As the inert gas supplied to the inside of the tower nozzle 70 flows upward from below the tower nozzle 70, it gradually accumulates on the upper side of the tower nozzle 70 and the pressure increases. Since a large amount of air is blown out from the upper air outlet more than the lower air outlet, a difference occurs in the amount of air blown in the vertical direction of the tower nozzle 70.

  When there is a difference in the amount of inert gas blown from each outlet depending on the height of the tower nozzle 70, the humidity varies between the support pieces of the container body 1 in which a plurality of semiconductor wafers W are aligned and stored, and the semiconductor Since the humidity does not decrease depending on the support piece that supports the wafer W, there is a possibility that the relative humidity in the container body 1 cannot be reduced uniformly.

  As shown in FIG. 18, when the front surface of the container body 1 is opened and replaced with an inert gas, as shown in FIG. It collides partly, the air in the container body 1 stays without being replaced with the inert gas (see the folded arrow in the figure), and the humidity variation between the support pieces supporting the semiconductor wafer W increases. So become more serious and serious.

  As a means for solving such a problem, there is a method of changing the size of the outlet according to the height of the tower nozzle 70. However, depending on the user, the inert gas supply conditions are different or the flow rate of the clean air downflow is different. Therefore, the method of changing the size of the blow-out port does not necessarily provide the optimum tower nozzle 70. It is not possible to solve such a problem.

  The present invention has been made in view of the above, and an object of the present invention is to provide a substrate storage container that can reduce variation in humidity between support pieces that support a substrate.

In the present invention, in order to solve the above problems, a container body of a front open box capable of storing a plurality of substrates arranged in the vertical direction, an air supply member capable of supplying purge gas from the outside to the inside of the container body, A purge unit capable of supplying the purge gas from the air supply member in the front direction from the inside rear of the container body,
A pair of support pieces for supporting the substrate substantially horizontally are provided on both sides inside the container body so as to face each other, and the pair of support pieces are arranged at predetermined intervals in the vertical direction.
Purge unit comprises a conductive member for purge gas is upstream in the bottom rear of the air supply member of the container body is communicating, elongated unit body for blowing a purge gas derived from the downstream outlet portion of the conductive member in the front direction of the container body located inside the rear of the container body including the door, a lead portion of the conductive member, disposed in the vicinity of the center portion or the central portion of the unit body, in the vertical direction of the facing portion which faces the container body front of the unit body, for purge gas It is characterized by providing a plurality of outlets .

Incidentally, the conductive member of the purge unit, the lower end portion to the air supply member is a thin conduit which is communicating, the unit body, the container body is formed into a hollow thin plate shape oriented in the vertical direction of the container body provided upright inside the rear, the conduit bent to connect the lead portion of the upper portion in the vicinity of the center portion or the central portion of the peripheral wall of the unit body, in the vertical direction of the front wall which faces the container body front side of the unit body A plurality of air outlets can be provided side by side.

In addition, the conducting member of the purge unit and the unit main body are integrally formed in a vertically long purge box having a plurality of outlets arranged in the vertical direction on the front, and the purge box is provided upright on the rear side inside the container main body. With the front facing the front of the container body, a connection pipe for the air supply member is provided on the lower side of the purge box, the purge box is formed in the purge space, and the side of the purge space communicates with the connection pipe. A purge gas conduction path extending from the lower portion of the purge space to approximately the central portion is formed, and a purge gas purge passage located near the central portion of the purge space in the lateral direction of the purge space is formed at the upper end of the conduction path. The lead-out path is formed in communication, and the purge space is divided into two parts by the lead-out path, and the purge gas branch paths facing the plurality of outlets are branched from the lead-out path. It may extend the number of branch paths in the vertical direction of the purge space.

  In addition, the purge box is formed in a substantially box shape with an opening at the front, and a connection pipe for an air supply member is provided on the lower side of the purge box, and a purge plate having a plurality of air outlets is attached to the front of the purge box, A filter for filtration may be interposed between the purge box and the purge plate.

  Further, the inside of the purge box is divided into a plurality of purge spaces, and a conduction path for purge gas extending from the lower part of the purge space communicating with the connecting pipe to the vicinity of the central portion is formed on the side of the purge space. In addition, a purge gas lead-out path that divides the purge space in the vertical direction in the width direction of the purge space is formed, and a plurality of purge gas branch paths facing the plurality of outlets from the lead-out path through a filter Can be branched, and the plurality of branch paths can be extended in the vertical direction of the purge space.

Further, a plurality of branch paths can be arranged in the longitudinal direction of the lead-out path, and the width of the plurality of branch paths can be narrowed from the conduction path side of the lead-out path toward the end portion of the lead-out path.
It is also possible to reduce the width of the branch path from the outlet path side toward the end portion.
Furthermore, the depth of the branch path can be made shallower from the outlet path side toward the end portion.

Here, the substrate in the claims includes at least various wafers, liquid crystal glass, and the like. The container body may be transparent, opaque, or translucent . This bottom front of the container body, it is possible to attach the evacuable exhaust member gas from the inside to the outside of the container body.

The purge gas includes at least various inert gases (for example, nitrogen gas or argon gas) and dry air . Further, the shape of the air outlet and the branching path can be a polygonal shape such as a groove shape, a circular shape, an elliptical shape, a triangular shape, and a trapezoidal shape, if necessary.

According to the present invention, when purging the substrate storage container, the container main body of the substrate storage container is mounted on the lid opening / closing device or the like, and the purge gas is supplied from the outside to the inside of the container main body. Then, the purge gas flows from the air supply member of the container body into the conducting member of the purge unit, flows through the conducting member, and flows into the central portion of the unit body or the vicinity of the central portion from the outlet portion downstream thereof. It circulates in the vertical direction from the inside and then blows out from the outlet of the unit body.

At this time, since the purge gas flows into the central portion or the vicinity of the central portion instead of the lower portion of the unit main body, the imbalance of the purge gas pressure in the vertical direction of the unit main body is reduced. When the purge gas is blown out from the outlet of the unit body, the purge gas flows out from the inside rear of the container body to the front of the container body through the plurality of substrates while contacting the substrate, and the gas in the container body is discharged from the container body. And purged with purge gas.

According to the present invention, the purge gas flows in and out from the central portion or near the central portion, not the lower portion of the unit body, and blows out from each outlet, so that the purge gas is discharged from the lower outlet due to pressure imbalance. However, the situation where a large amount of air is blown out from the upper outlet is reduced. Due to this decrease, it is possible to suppress the occurrence of a difference in the amount of purge gas blown in the vertical direction of the unit main body, the humidity varies between the support pieces of the container main body containing the substrate, and the relative humidity in the container main body is made uniform. There is an effect that the fear that it cannot be lowered can be eliminated. In particular, the amount of purge gas blown out at the uppermost and lowermost stages is almost uniform, which effectively suppresses the risk of large variations in humidity between the support pieces supporting the uppermost and lowermost substrates, which has been a problem in the past. can do. Moreover, it becomes possible to omit the operation | work which changes the magnitude | size of a blower outlet according to the height of a unit main body.

According to the second aspect of the present invention, the conducting pipe of the purge unit and the unit main body are formed to be thin and do not occupy a large space in the front-rear direction of the container main body. It becomes possible.

  According to the third aspect of the present invention, the purge gas sequentially flows into the conduction path, the outlet path, and the branch path of the purge box, flows in the vertical direction of the purge box, and blows out from the plurality of outlets. Due to the balance, it is possible to reduce a situation in which a large amount of air is blown out from the upper air outlet rather than the lower air outlet. Therefore, it is possible to effectively suppress the difference in the amount of purge gas blown out in the vertical direction of the purge box, to prevent the humidity between the substrates in the container main body from varying, and to contribute to the equalization of the relative humidity in the container main body. be able to.

According to the fourth aspect of the invention, it is possible to contribute to equalizing the pressure of the purge gas upstream and downstream of the outlet passage.
According to the fifth aspect of the present invention, since the width of the end portion side of the branch path is narrowed, the amount of purge gas blown from the end portion side of the branch path is increased, and substantially uniform blowing between a plurality of substrates is realized. Can be achieved.
According to the sixth aspect of the present invention, since the depth on the terminal end side of the branch path is made shallow, the amount of purge gas blown out from the terminal end side of the branch path is increased, and a substantially uniform gas blowing between a plurality of substrates is performed. It becomes possible to contribute to realization.

It is a section explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is front explanatory drawing which shows typically the container main body and purge unit in embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically the purge unit in embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically the state which removed the purge unit from the container main body in embodiment of the substrate storage container which concerns on this invention. It is explanatory drawing which shows typically the state by which an inert gas is introduce | transduced into the purge unit in embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically the container main body and purge unit in 2nd Embodiment of the substrate storage container which concerns on this invention. It is a fragmentary perspective explanatory view showing typically a container main part and a purge unit in a 2nd embodiment of a substrate storage container concerning the present invention. It is a disassembled perspective explanatory drawing which shows typically the purge box of the purge unit in 2nd Embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically the state which removed some purge plates from the purge box in 2nd Embodiment of the substrate storage container which concerns on this invention. It is a section explanatory view showing typically a 2nd embodiment of a substrate storage container concerning the present invention. FIG. 10 is a front explanatory view schematically showing a state where an inert gas flows in the purge box of FIG. 9. It is front explanatory drawing which shows typically the state which removed the purge plate from the purge space of the purge box in 2nd Embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically 3rd Embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically 4th Embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically 5th Embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically 6th Embodiment of the substrate storage container which concerns on this invention. It is side surface explanatory drawing which shows typically 7th Embodiment of the substrate storage container which concerns on this invention. It is explanatory drawing which shows the state which removes a cover body from the container main body front of a substrate storage container, opens the front of a container main body, and purges.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A substrate storage container in the present embodiment includes a plurality of semiconductor wafers W as shown in a part of FIGS. A container body 1 that can be arranged and stored in the vertical direction, a removable lid 10 that fits and closes the front of the container body 1, and a locking mechanism 20 that locks the lid 10 that closes the front of the container body 1. A pair of air supply valves 30 capable of supplying an inert gas from the outside of the container body 1 to the inside, a pair of exhaust valves 40 capable of exhausting air from the inside of the container body 1 to the outside, and the air supply valves 30 And a purge unit 50 capable of supplying the inert gas in the front direction from the rear of the container body 1, and the lead-out portion 52 of the conduction pipe 51, which is a conduction member of the purge unit 50, other than the lower part of the unit body 53. Touching part It is way.

  As shown in FIG. 1, each semiconductor wafer W is made of, for example, a φ300 mm or φ450 mm thin round silicon wafer having a circuit pattern formed on the surface thereof, and is horizontally placed inside the container body 1 by an arm of a dedicated robot apparatus (not shown). It is supported and stored in the storage.

  The container body 1, the lid 10, the locking mechanism 20, the pair of air supply valves 30, the pair of exhaust valves 40, and the purge unit 50 are injection-molded with a molding material containing a predetermined resin. Examples of the resin contained in the molding material include thermoplastic resins such as polycarbonate, cycloolefin polymer, cycloolefin copolymer, polyetherimide, polyether ketone, polyether ether ketone, polybutylene terephthalate, polyacetal, and liquid crystal polymer, and alloys thereof. Etc.

  As shown in FIGS. 1, 2, and 4, the container body 1 is formed into a front open box type with an opening on the front, and a flat bottom plate 3 serving as an interface is screwed to the bottom plate 2 from below. The bottom plate 3 exhibits a positioning function and a fixing function with respect to the lid opening / closing device 72 to which the purge device 71 is attached.

  A pair of left and right support pieces 4 that support both sides of the periphery of the semiconductor wafer W substantially horizontally are provided on the inner surfaces of the left and right side walls of the container body 1, and the pair of support pieces 4 extend in the vertical direction of the container body 1. The support pieces 4 are arranged at predetermined intervals, and each support piece 4 is formed as a long plate oriented in the front-rear direction of the container body 1, and the semiconductor wafer W protrudes forward from the front end portion of the support piece 4. The pop-out preventing stepped portion 5 that regulates the above is integrally formed with a thickness greater than or equal to the thickness of the semiconductor wafer W.

  In the vicinity of both sides of the rear part of the bottom plate 2 of the container body 1, mounting holes 6 for the air supply valve 30 adjacent to the rear wall of the container body 1 are respectively drilled in a round shape. The mounting holes 6 for the exhaust valve 40 are respectively drilled through in a round shape. Each attachment hole 6 is perforated at a location outside the projection region of the semiconductor wafer W with respect to the bottom plate 2 so as to contribute to smooth insertion and removal of the semiconductor wafer W. In addition, a top flange 7 for transportation that is gripped by a ceiling transportation mechanism of a semiconductor manufacturing factory is detachably attached to the central portion of the top plate of the container body 1. Are each provided with a locking hole for the lid 10.

Grip portions 8 that function for gripping operation are detachably attached to the center portions of both side walls of the container body 1. Moreover, the side rails 9 for conveyance are each selectively attached to the lower part of the both side walls of the container body 1.
Such a container main body 1 is positioned and mounted on the lid opening / closing device 72 and purged in a state where the lid 10 is press-fitted and fitted to the opened front, or the lid opening / closing device attached to the EFEM 73. It is positioned and mounted at 72, and after the lid 10 in a sealed state is removed from the front by the lid opening / closing device 72, it is purged with the front opened.

  As shown in FIG. 1, the lid 10 includes a lid body 11 that is press-fitted into the open front of the container body 1, a surface plate 13 that covers the open front of the lid main body 11, and a container. A sealing gasket for sealing and sealing interposed between the front inner periphery of the main body 1 and the lid main body 11 is provided, and a locking mechanism 20 for locking is interposed between the lid main body 11 and the surface plate 13. Is done.

  The lid body 11 is basically formed in a substantially dish-shaped section with a shallow bottom, and is provided with a plurality of reinforcing and mounting ribs therein, and the center of the back surface, which is the facing surface facing the semiconductor wafer W. A recess that avoids contact with the semiconductor wafer W is formed in the vicinity of the portion, and a front retainer 12 that elastically holds the front of the peripheral edge of the semiconductor wafer W is attached to the recess.

A frame-shaped fitting groove is formed in the periphery of the back surface of the lid body 11, and an elastic seal gasket that press-contacts the front inner periphery of the container body 1 is tightly fitted in the fitting groove. On both sides of the upper and lower portions of the peripheral wall of 11, a recess / exit hole for the locking mechanism 20 facing the locking hole of the container body 1 is penetrated and drilled.
The surface plate 13 is formed in a horizontally long front rectangle, and a plurality of reinforcing and mounting ribs, screw holes, and the like are provided. On both sides of the surface plate 13, operation holes for the locking mechanism 20 are formed.

  As shown partially in FIG. 1, the locking mechanism 20 is pivotally supported on both left and right side portions of the lid body 11 of the lid body 10, and a pair of left and right rotating plates that are rotationally operated from the outside, and the rotation of each rotating plate. A plurality of advance / retreat plates that slide in the vertical direction of the lid body 10 and a plurality of locking claws that come in and out of the intrusion hole of the lid body 11 and slide into and out of the lock hole of the container body 1 as each advance / retreat plate slides. And is configured.

  Each rotary plate is opposed to the operation hole of the surface plate 13 of the lid 10 and is rotated by an operation key of the lid opening / closing device 72 penetrating through the operation hole. A pair of curved cam grooves are cut out at a predetermined interval in the vicinity of the peripheral edge of the rotating plate, and a connecting pin at the end of the advancing / retracting plate is slidably fitted into each cam groove.

  As shown partially in FIG. 1, each air supply valve 30 is attached to and detached from a substantially cylindrical first housing 31 facing the inside of the container body 1 and an opening lower portion of the first housing 31 via an O-ring. A substantially cylindrical second housing that is freely fitted and exposed to the outside of the container body 1, and the first and second housings are screwed together via screws, and the lid opening / closing device 72. When the container main body 1 is positioned and mounted, it is connected to the purge device 71 of the lid opening / closing device 72.

  A flat ring-shaped locking flange is provided on the outer peripheral surface of each of the first and second housings, and these locking flanges are inserted into the peripheral portion of the mounting hole 6 of the container body 1 through an O-ring from above and below. As a result, the air supply valve 30 is firmly fitted and fixed to the bottom plate 2 of the container main body 1 and is close to the back wall of the container main body 1.

  As for the 1st housing 31, the open upper end part is exposed in the container main body 1, and the filter for filtration is accommodated in the inside. Further, the second housing is formed shorter and shorter than the first housing 31, and a connecting joint is integrally formed at the lower portion as necessary, and the inert gas from the purge device 71 is removed from the first housing. Supply in 31 directions.

  As shown partially in FIG. 1, each exhaust valve 40 includes a cylindrical case that is fitted to an attachment hole 6 near both sides of the front portion of the bottom plate 2 of the container body 1 via an O-ring. Has a built-in open / close valve that is a check valve that controls the flow of air so as to be movable up and down via a coil spring, and a filter 41 for filtration is fitted to the upper and lower portions of the case. Such an exhaust valve 40 is mounted in the lid body opening / closing device 72 with the container body 1 positioned, and when the air supply valve 30 feeds an inert gas, the front surface is closed in the container body 1 by the lid body 10. The air is exhausted to the purge device 71 of the lid opening / closing device 72.

  As shown in FIGS. 1 to 3 and 5, the purge unit 50 communicates with a pair of air supply valves 30 of the container body 1 to conduct an inert gas (see arrows in FIG. 5). 51 and a pair of unit main bodies 53 for blowing out an inert gas (see arrow in FIG. 1) derived from the lead-out portion 52 of each conducting pipe 51 in the front direction of the container main body 1, Specifically, it is located closer to the inner surface of the back wall of the container body 1.

  Each conducting pipe 51 is bent and formed into a hollow thin substantially L-shape that extends upward from the lower direction of the container body 1 and bends in the left-right lateral direction, and its lower end is supplied as an upstream introduction part for the inert gas. The upper end is connected to the air valve 30, and the upper end is connected to a portion other than the upper and lower ends of the peripheral wall of the unit main body 53, specifically, the central portion of the side wall and the vicinity thereof as the downstream outlet 52 for the inert gas. The

  Each unit main body 53 is formed in a vertically long hollow thin plate shape, and a plurality of inert gas outlets 54 are arranged in parallel at predetermined equal intervals in the vertical direction of the front wall facing the front of the container main body 1. The container body 1 is erected near the inner surface of the back wall of the container body 1 by a method such as ultrasonic welding, screw connection, or uneven connection. A membrane filter 55 for filtration that removes fine particles in the inert gas is attached to the front face of each unit main body 53.

  The plurality of air outlets 54 are arranged at equal intervals according to the arrangement pitch of the plurality of semiconductor wafers W supported by the support piece 4 and arranged in the vertical direction of the container body 1. Each outlet 54 is formed in a groove shape and extends in the lateral direction of the container body 1 and functions to blow out an inert gas between a plurality of semiconductor wafers W adjacent in the vertical direction of the container body 1.

  In the above configuration, when purging with the front surface of the container body 1 closed by the lid body 10, the container body 1 of the substrate storage container is positioned and mounted on the lid body opening / closing device 72, and the container body 1 is moved from the outside to the inside. An inert gas may be supplied. Then, the inert gas flows from the purge device 71 of the lid opening / closing device 72 into the conduction pipe 51 via the air supply valve 30, and is conducted through the conduction pipe 51 from the outlet 52 to the center of the unit main body 53. And flows through the central portion of the unit main body 53 in the vertical direction (see the arrows in FIG. 5), then passes through the membrane filter 55 and is blown out from each outlet 54.

  At this time, since the pressure of the inert gas at the upper and lower end portions of the unit body 53 increases, the flow velocity at the upper and lower end portions increases. When the inert gas is blown out from each outlet 54, the inert gas flows out in the front direction of the container body 1 through the plurality of semiconductor wafers W while contacting the semiconductor wafer W, Air is purged to the outside from the exhaust valve 40 and is replaced with an inert gas.

  On the other hand, when purging with the front surface of the container main body 1 opened, the container main body 1 of the substrate storage container is positioned and mounted on the lid opening / closing device 72 provided along with the EFEM 73, and the lid is opened from the container main body 1. After the body 10 is removed by the lid opening / closing device 72, a large amount of clean air is flowed down from the fan filter unit 74 on the ceiling of the EFEM 73 toward the floor, and an inert gas is supplied from the outside of the container body 1 to the inside.

  Then, the inert gas flows from the purge device 71 of the lid opening / closing device 72 into the conduction pipe 51 via the air supply valve 30, and is conducted through the conduction pipe 51 from the outlet 52 to the center of the unit main body 53. After flowing through the center of the unit main body 53 in the vertical direction, the unit body 53 passes through the membrane filter 55 and blows out from each outlet 54. Also at this time, since the pressure of the inert gas at the upper and lower ends of the unit body 53 increases, the flow velocity at the upper and lower ends increases.

  When the inert gas is blown out from each outlet 54, the inert gas flows out between the plurality of semiconductor wafers W in contact with the semiconductor wafer W and flows out in the front direction in which the container body 1 is opened. The inside air is purged from the front of the container body 1 to the outside, and is replaced with an inert gas.

  According to the above configuration, since the inert gas flows in and out from the central portion, not the lower end portion of the unit main body 53, and blows out from each outlet 54, the inert gas flows downward due to pressure imbalance. The situation in which a large amount of air is strongly blown out from the air outlet 54 above the air outlet 54 is reduced. Due to this reduction, it is possible to effectively suppress a difference in the amount of inert gas blown out in the vertical direction of the unit main body 53, so that the humidity between the support pieces 4 of the container main body 1 containing the semiconductor wafer W varies. The possibility that the relative humidity in the container body 1 cannot be reduced uniformly can be eliminated.

  In particular, since the blowout amount of the inert gas at the uppermost and lowermost stages is substantially uniform, the variation in humidity between the support pieces 4 that support the uppermost and lowermost semiconductor wafers W, which has been a problem in the past, increases. The fear can be eliminated very effectively. Further, it is possible to reliably omit the work of changing the size of the air outlet 54 according to the height of the unit main body 53. Furthermore, since the conducting pipe 51 and the unit main body 53 of the purge unit 50 are formed thin and do not occupy a large space in the front-rear direction of the container main body 1, it is possible to easily install the container main body 1 at the rear inside. .

  Next, FIGS. 6 to 12 show a second embodiment of the present invention. In this case, the conducting member of the purge unit 50 and the unit main body 53 are connected to the front purge plate 61 with a plurality of outlets. 62 is formed integrally with the purge box 56, and a conduction path 58 that communicates with the air supply valve 30 and is directed in the vertical direction of the container body 1 is formed inside the purge box 56. In addition, a lead-out path 59 directed in the left-right width direction of the container body 1 is formed in communication, and a branch path 60 facing the outlet 62 of the purge plate 61 is branched from the lead-out path 59 to extend in the vertical direction of the container body 1. Like to do.

  As shown in FIGS. 6 to 8 and 10, the purge box 56 is formed in a vertically thin and shallow box shape with a front opening, and a pair of left and right purge plates 61 are covered on the front, and each purge plate A longitudinally long membrane filter 55 that removes fine particles in the inert gas is interposed between the front plate 61 and the front purge plate 61 that stands near the inner surface of the back wall of the container body 1. Directed in the direction.

  The purge box 56 faces the vicinity of the center of the inner surface of the back wall of the container body 1, and connecting pipes extending downward are connected to both sides of the lower part, and each connecting pipe is connected and supported by the air supply valve 30. . The purge box 56 is fixed to the back of the bottom plate 2, the back of the side wall, the back wall, and the back of the top plate of the container body 1 by a method such as ultrasonic welding, screw connection, and uneven connection, as necessary.

  As shown in FIGS. 8, 9, 11, and 12, the inside of the purge box 56 is divided into a pair of left and right purge spaces 57, and each purge space 57 is partitioned into a vertically long front rectangle corresponding to the membrane filter 55. It is formed. On the side of each purge space 57, a conductive path 58 for an inert gas extending from the lower portion of the purge space 57 communicating with the connecting pipe to the vicinity of the central portion is partitioned and formed in a substantially I-shaped groove shape. An inert gas lead-out path 59 directed in the left-right lateral direction of the purge space 57 is formed in communication with the upper end downstream of the purge space 57, and the lead-out path 59 is formed in a substantially I-shaped groove shape to form the purge space. The purge space 57 is divided into two parts in the vertical direction.

  From the upper and lower parts of the lead-out path 59, a plurality of inert gas branch paths 60 facing the plurality of air outlets 62 via the membrane filter 55 respectively branch and extend in the vertical direction of the purge space 57. As shown in FIG. 12, the plurality of branch paths 60 are arranged in parallel in the longitudinal direction of the lead-out path 59 at predetermined intervals, and each branch path 60 is partitioned into a substantially I-shaped groove shape with the same width and depth. It is formed.

  As shown in FIGS. 6 to 9 and 11, each purge plate 61 is formed as a vertically long thin plate with a front rectangular shape corresponding to each membrane filter 55 and each purge space 57, and is arranged vertically on the container body 1 in the vertical direction. A plurality of air outlets 62 corresponding to the arrangement pitch of the plurality of semiconductor wafers W arranged in the direction are arranged in parallel at equal intervals. Each air outlet 62 is formed in a groove shape and extends in the lateral direction of the container body 1, faces the membrane filter 55 and the plurality of branch paths 60, and blows out an inert gas between the plurality of semiconductor wafers W. It works as follows.

  In the above configuration, when purging with the front surface of the container body 1 closed by the lid body 10, the container body 1 of the substrate storage container is positioned and mounted on the lid body opening / closing device 72, and the container body 1 is moved from the outside to the inside. An inert gas may be supplied. Then, the inert gas flows from the purge device 71 of the lid opening / closing device 72 into the connection pipe of the purge box 56 via the air supply valve 30, and flows through this connection pipe to connect the conduction path 58 and the outlet path 59. Are sequentially introduced to the plurality of branch paths 60 and distributed in the vertical direction, then pass through the membrane filter 55 and blow out from the respective outlets 62 (see arrows in FIG. 11).

  At this time, the pressure of the inert gas at the upper and lower ends of the plurality of branch paths 60 increases, so that the flow velocity at the upper and lower ends of the branch path 60 increases. When an inert gas (see an arrow in FIG. 10) blows out from each outlet 62, the inert gas flows out in the front direction of the container body 1 through a plurality of semiconductor wafers W while contacting the semiconductor wafers W. Then, the air in the container body 1 is purged to the outside by the exhaust valve 40 and replaced with an inert gas.

  On the other hand, when purging with the front surface of the container main body 1 opened, the container main body 1 is positioned and mounted on the lid opening / closing device 72 attached to the EFEM 73, and the lid body 10 is covered with the lid body 10 from the container main body 1. After being removed by the body opening / closing device 72, a large amount of clean air is flowed down from the fan filter unit 74 on the ceiling of the EFEM 73 toward the floor, and an inert gas is supplied from the outside of the container body 1 to the inside.

  Then, the inert gas flows from the purge device 71 of the lid opening / closing device 72 into the connection pipe of the purge box 56 via the air supply valve 30 and flows through this connection pipe to the conduction path 58 and the lead-out path 59. After being sequentially introduced and branched from the lead-out path 59 to the plurality of branch paths 60 and circulated in the vertical direction, they pass through the membrane filter 55 and blow out from the respective outlets 62. Also in this case, since the pressure of the inert gas at the upper and lower ends of the plurality of branch paths 60 increases, the flow velocity at the upper and lower ends of the branch path 60 increases.

  When an inert gas (see the arrow in FIG. 7) blows out from each outlet 62, the front direction in which the container main body 1 is opened through the plurality of semiconductor wafers W while the inert gas is in contact with the semiconductor wafers W. The air in the container body 1 is purged from the front of the container body 1 to the outside, and is replaced with an inert gas. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected. In addition, the inert gas sequentially flows into the conduction path 58, the lead-out path 59, and the plurality of branch paths 60 of the purge box 56, so that the purge space 57 Since it flows in the up-down direction and blows out from each blower outlet 62, it is clear that the situation where the inert gas is blown out in a large amount from the blower outlet 62 above the lower blower outlet 62 due to pressure imbalance is reduced.

  Therefore, since it is possible to effectively suppress the difference in the amount of the inert gas blown out in the vertical direction of the purge box 56, the humidity between the support pieces 4 of the container body 1 containing the semiconductor wafer W varies, and the container The possibility that the relative humidity in the main body 1 cannot be lowered uniformly can be eliminated. In particular, it is possible to very effectively eliminate the possibility that the variation in humidity between the support pieces 4 supporting the uppermost and lowermost semiconductor wafers W, which has been a problem in the past, will increase. In addition, since the conducting member of the purge unit 50 and the unit main body 53 are integrally configured in a thin purge box 56 that does not occupy a large space, it can be easily installed in the container main body 1.

  Next, FIG. 13 shows a third embodiment of the present invention. In this case, a plurality of branch paths 60 are arranged in the longitudinal direction of the lead-out path 59, and the width (thickness) of the plurality of branch paths 60 is shown. Is gradually narrowed from the conduction path 58 side of the upstream outlet path 59 toward the closed end portion of the downstream outlet path 59. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the width of the plurality of branch paths 60 is narrowed from the upstream direction of the derivation path 59 toward the downstream direction. It is possible to equalize the pressure of the inert gas downstream, and to easily control the pressure and flow rate of the inert gas.

Next, FIG. 14 shows a fourth embodiment of the present invention. In this case, the purge gas branch passages 60 facing the plurality of outlets 62 from the front end portion and the upper and lower portions of the outlet passage 59 are provided. The branch path 60 bulges into a large frontal diamond shape so as to extend in the vertical direction of the container body 1.
The width of the branch path 60 is formed so as to be gradually narrowed from the upstream outlet path 59 side toward the upper and lower closed end portions. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the width of the branch path 60 gradually becomes sharply tapered from the lead-out path 59 side toward the end portion. The pressure and flow rate can be easily controlled. Further, if the width on the end portion side of the branch path 60 is tapered, an increase in the pressure of the inert gas on the end portion side of the branch path 60 can be expected, so that the inert gas blown out from the end portion side of the branch path 60 can be expected. By increasing the amount, it is possible to easily realize uniform blowout between all the semiconductor wafers W. In addition, since the number of branch paths 60 is not single but single, it is possible to simplify the construction of the purge box 56 in addition to facilitating the manufacture of the purge box 56.

  Next, FIG. 15 shows a fifth embodiment of the present invention. In this case, a plurality of branch paths 60 are arranged in the longitudinal direction of the lead-out paths 59, and the width of each branch path 60 is determined as the lead-out paths 59. A sharp and narrow taper is formed gradually from the side toward the upper and lower closed end portions. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as the above embodiment can be expected, and easy control of the pressure and flow rate of the inert gas can be greatly expected. Further, if the width of the end portion side of the branch path 60 is sharply tapered, an increase in the pressure of the inert gas at the end portion side of the branch path 60 can be expected, so the inert gas blown out from the end portion side of the branch path 60 It is possible to easily achieve uniform blowout between all the semiconductor wafers W. Furthermore, diversification of the shape of each branch path 60 can be expected.

Next, FIG. 16 shows a sixth embodiment of the present invention. In this case, the purge gas branch passages 60 facing the plurality of outlets 62 from the front end portion and the upper and lower portions of the lead-out passage 59 are shown. The branch path 60 bulges into a large front polygon similar to a rhombus and extends in the vertical direction of the container body 1.
The width of the branch path 60 is formed so as to be gradually narrowed and tapered from the outlet path 59 side toward the upper and lower closed end portions. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above-described embodiment can be expected, and the control of the inert gas pressure and flow velocity can be easily controlled, and the diversification of the shape of the branch path 60 can be expected. Further, if the width of the end portion side of the branch path 60 is narrowed, an increase in the pressure of the inert gas at the end portion side of the branch path 60 can be expected, so that the inert gas blown out from the end portion side of the branch path 60 can be expected. By increasing the amount of blowout, it becomes possible to achieve uniform blowout between all the semiconductor wafers W.

  Next, FIG. 17 shows a seventh embodiment of the present invention. In this case, at least the depth (thickness) of a predetermined branch path 60 among a plurality of branch paths 60 is derived upstream. As it goes from the side of the passage 59 toward the closed end portion downstream, it gradually becomes shallower. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above-described embodiment can be expected, and the control of the inert gas pressure and flow velocity can be easily controlled, and the diversification of the shape of the branch path 60 can be expected. Further, if the depth on the terminal end side of the branch path 60 is made shallow, an increase in the pressure of the inert gas on the terminal end side of the branch path 60 can be expected, so that the inert gas blown out from the terminal end side of the branch path 60 can be expected. The amount can be increased, and it can be expected that uniform blowout between all the semiconductor wafers W will be realized.

  In the above embodiment, the conducting pipe 51 is directly connected to the air supply valve 30, but the conducting pipe 51 may be connected to the air supply valve 30 via a joint member. Further, the connection pipe of the purge box 56 may be directly connected to the air supply valve 30, but the connection pipe may be connected to the air supply valve 30 via a joint member. Further, the lead-out portion 52 of the conducting tube 51 is connected to the vicinity of the central portion of the side wall of the unit main body 53. However, depending on the conditions of the EFEM 73, the conductive portion 51 is electrically connected to the upper portion of the side wall of the unit main body 53. You may connect the derivation | leading-out part 52 of the pipe | tube 51. FIG.

  Moreover, although the unit main body 53 and the purge box 56 of the purge unit 50 are formed of synthetic resin, the present invention is not limited to this. For example, the unit main body 53 and the purge box 56 can be made of a breathable porous pipe. Further, the unit main body 53 can be formed in a hollow cylindrical shape, a prismatic shape, or the like. Further, the inside of the purge box 56 can be divided into a plurality of purge spaces 57, or a single purge space 57 can be formed.

  In addition, the conduction path 58 and the lead-out path 59 may be combined in an L shape, but the present invention is not limited to this, and may be combined in, for example, a T shape. Further, the width of the branch path 60 is gradually reduced from the outlet path 59 toward the closed end portion, and the depth of the branch path 60 is gradually decreased from the outlet path 59 toward the end section. It is also possible to do.

  The substrate storage container according to the present invention is used in the field of manufacturing semiconductors, liquid crystal glass, reticles and the like.

1 Container body 2 Bottom plate (bottom)
4 Supporting piece 6 Mounting hole 10 Lid 20 Locking mechanism 30 Air supply valve (air supply member)
40 Exhaust valve 50 Purge unit 51 Conducting pipe (conducting member)
52 Lead-out part 53 Unit main body 54 Air outlet 55 Membrane filter 56 Purge box 57 Purge space 58 Conducting path (conducting member)
59 Leading path (conduction member)
60 Branch 61 Purge plate (front wall)
62 Air outlet 71 Purge device 72 Lid opening / closing device 73 EFEM
74 Fan filter unit W Semiconductor wafer (substrate)

Claims (6)

A container body of a front open box that can store a plurality of substrates arranged in the vertical direction, an air supply member that can supply purge gas from the outside of the container body to the inside, and purge gas from the air supply member inside the container body A substrate storage container provided with a purge unit that can be supplied in the front direction from the back,
A pair of support pieces for supporting the substrate substantially horizontally are provided on both sides inside the container body so as to face each other, and the pair of support pieces are arranged at predetermined intervals in the vertical direction.
Purge unit comprises a conductive member for purge gas is upstream in the bottom rear of the air supply member of the container body is communicating, elongated unit body for blowing a purge gas derived from the downstream outlet portion of the conductive member in the front direction of the container body located inside the rear of the container body including the door, a lead portion of the conductive member, disposed in the vicinity of the center portion or the central portion of the unit body, in the vertical direction of the facing portion which faces the container body front of the unit body, for purge gas A substrate storage container provided with a plurality of air outlets . The conductive member of the purge unit, the lower end portion to the air supply member is a thin conduit which is communicating, the unit body, the inside rear of the hollow formed in a thin plate shape with the container body directed in the vertical direction of the container body stand provided, the conduit bent to connect the lead portion of the upper portion in the vicinity of the center portion or the central portion of the peripheral wall of the unit body, in the vertical direction of the front wall which faces the container body front face of the unit body, a plurality The substrate storage container according to claim 1 , wherein the air outlets are arranged side by side. The conducting member of the purge unit and the unit main body are integrally formed in a vertically long purge box having a plurality of outlets arranged in the vertical direction of the front, and the purge box is provided upright on the rear side inside the container main body and the front thereof is A connection pipe for the air supply member is provided on the lower side of the purge box toward the front of the container body, the purge box is formed in the purge space, and a purge connected to the connection pipe on the side of the purge space. A purge gas conduction path extending from the lower part of the space to approximately the central part is formed, and a purge gas lead-out path located near the central part of the purge space in the lateral direction of the purge space at the upper end of the conduction path. The purge space is divided into two vertically by this lead-out path, and the purge gas branch paths facing the plurality of outlets are respectively branched from the lead-out path. Substrate storage container according to claim 1, wherein the elongated a crossroads in the vertical direction of the purge space.   4. The substrate storage container according to claim 3, wherein a plurality of branch paths are arranged in the longitudinal direction of the lead-out path, and the width of the plurality of branch paths is narrowed from the conduction path side of the lead-out path toward the end portion of the lead-out path.   The substrate storage container according to claim 3 or 4, wherein the width of the branch path is narrowed from the outlet path side toward the end portion.   6. A substrate storage container according to claim 3, wherein the depth of the branch path is made shallower as it goes from the lead-out path side toward the end part.

Images