JP6432035B2 - Electronic parts storage case - Google Patents

Description

The present invention relates to a drainage structure for water that has entered a sealed electronic component storage case for storing heat-generating electronic components and entered inside.

When a case containing electronic parts is installed outdoors, a case or case having a sealing property is used to prevent rainwater from entering and dust from entering. However, in some cases, rainwater or the like may enter the case due to some sort of malfunction (when exposed to an unexpected storm, when an external impact is applied, when a screw is loose, or when there is a poor construction, etc.).

In the invention described in Patent Document 1 for such a problem, a float valve is provided in a pipe that penetrates the bottom wall of the casing, and automatic drainage is possible when water accumulates in the casing. .

JP 2005-209972 A

In the thing of patent document 1, since the float valve is used, it is necessary to make the specific gravity of this valve lighter than water, and even if the volume is large and the overall weight is heavy, it is sufficiently sealed against outdoor gusts and external pressure. In some cases, the sex could not be secured.
In particular, when the valve is continuously used for a long period of time, the number of times that the float valve operates is increased. At this time, fine dust enters and accumulates, and rainwater may flow backward due to wind pressure during a storm. In addition, if the valve is opened at high humidity, moisture may enter unnecessarily, and the inside of the housing may condense at a later date. Furthermore, if the force to close the valve is weak, high sealing performance cannot be ensured, and the electronic components may be deteriorated by intruding dust and humidity (moisture).

This invention provides the electronic component storage case aiming at coexistence with the sealing performance of a housing | casing and a drainage mechanism with respect to the said subject.

An electronic component storage case according to the present invention includes a front panel that is attached to a bottomed die-cast housing having an open front surface so as to cover the front opening and to have a sealing property through a first packing. In the electronic component storage case that attaches the bottom side of the cast housing to a wall surface, a pedestal, etc., and has a cover that can be removably attached via the second packing so as to close the notch in the lower wall of the die cast housing, The second packing is provided with a communication portion that connects the inside and outside of the die-cast housing.

In the electronic component storage case of the present invention, the front opening is sealed with a front panel with a sealing property,
A communication part is provided in the packing of the cover that closes the notch in the lower wall of the die-cast housing, and the water accumulated in the lower part can be drained.

It is a front view which shows the state which removed the front panel of the die-cast housing | casing which shows one Example of this invention. It is a rear view of the die-cast housing | casing shown in FIG. It is a bottom view of the die-cast housing | casing shown in FIG. It is a back view of the front panel which shows one Example of this invention. It is explanatory drawing of the cover part shown in FIG. It is a perspective view of the cover shown in FIG.

The present invention is applied to an electronic component storage case that stores electronic components, and is particularly applied to a case that requires airtightness and drainage.

FIG. 1 is a front view of a die-cast housing 2 showing a state in which a front panel 1 of an electronic component storage case according to an embodiment of the present invention is removed, FIG. 2 is a rear view thereof, and FIG. FIG.
The die-cast housing 2 is integrally formed of aluminum or an alloy thereof in a bottomed shape, and a part of the bottom constitutes a heat sink 3 that dissipates heat-generating electronic components. This heat sink 3
Has a plurality of fins and also serves as the back surface of the die-cast housing 2, and this back surface is attached to the wall surface or mount of the building. At this time, the back surface may be attached to a wall surface or the like via a predetermined attachment plate.

The exothermic electronic components include a semiconductor element 4 constituting an inverter circuit for power conversion, a reactor 5 constituting a chopper type DC booster circuit, and a reactor 6 constituting a low pass filter for AC power. The heat generated from these electronic components increases as the output (for example, the capacity of the inverter circuit) increases. The die-cast housing 2 houses an electrical board 7 that controls the operation of these heat-generating electronic components.

The front panel 1 shown in FIG. 4 has an annular shape at a portion that abuts against a rib portion 8 that continuously protrudes from the tip of the wall that forms the opening of the front surface of the die-cast housing 2, that is, an edge portion on the back side of the front panel 1. A first packing 9 (ethylene propylene diene rubber or the like) is provided. After the front panel 1 is aligned with the opening on the front surface of the die-cast housing 2, the first rib portion 8 is secured by screwing.
In close contact with the packing 9, the inside of the electronic component storage case is sealed.

In FIG. 1, a cover 10 is detachably attached via a second packing 12 so as to close a notch 11 in the lower wall of the die-cast housing 2. FIG. 5 is an explanatory view of the cover portion, and FIG. 6 is a perspective view of the cover 10. The cover 10 has an L-shaped cross section, and is integrally formed with, for example, a synthetic resin. The cover 10 is provided with a knockout hole 13a for drawing the wiring to the back side and a knockout hole 13b for drawing the wiring to the bottom surface side.

The cover 10 is configured to be substantially flush with the inner side surface 14 a of the lower wall 14 of the die-cast housing 2, and the outer surface 14 b of the lower wall 14 is connected to the lower periphery of the main cover portion 15.
And a flange portion 16 that does not protrude outward. The second packing 12 is sandwiched between the lower wall 14 of the die-cast housing 2 and the flange portion 16.

The second packing 12 is provided with a communication portion 17 that connects the inside and outside of the die-cast housing 2 and is disposed closer to the main cover portion 15 side. Water, dust or the like entering through the communication portion 17 once hits the rising wall portion 18 of the main cover portion 15 and further intrusion into the case is suppressed.

In addition, the semiconductor element 4 operates and generates heat, the internal temperature rises, and the internal atmospheric pressure becomes higher than the outside, so that intrusion of dust is suppressed by the atmospheric pressure difference, and the moisture that contributes to the infiltrated humidity is also this atmospheric pressure difference. It is possible to discharge. In addition, since the communication part 17 exists in the 2nd packing 12 of the flange part 16 located in the lower side of the cover 10 attached to the lower wall 14 of the die-cast housing 2, the accumulated water passes through this lowermost communication part 17. Drained by its own weight. The communication part 17 may be large enough to allow the accumulated water to be drained by its own weight, and the second packing 12 may be provided with two or three so that the amount of drainage increases.

Further, after the cover 10 is inserted along the back surface from the lower wall 14 side of the die-cast housing 2, the cover 10 is attached to the die-cast housing 2 with a screw 19, and then the outer surface of the lower wall 14 of the die-cast housing 2. It is attached with a screw 20 from the 14b side.

The present invention is applied to an electronic component storage case that stores electronic components, and is particularly applied to a case that requires airtightness and drainage.

As mentioned above, although one Embodiment of this invention was described, the above description is for making an understanding of this invention easy, and does not limit this invention. It goes without saying that the present invention can be changed and improved without departing from the gist thereof, and that the present invention includes equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Front panel 2 Die-cast housing 3 Heat sink 4 Semiconductor element 8 Rib part 9 1st packing 10 Cover 11 Notch 12 2nd packing 14 Lower wall 15 Main cover part 16 Flange part 17 Communication part 18 Standing wall part

Claims (3)

A bottom panel side of the die-cast housing is provided with a front panel attached to a bottomed die-cast housing having an open front surface so as to cover the opening of the front surface and having a sealing property via a first packing. in the electronic component storing case attached to the wall or frame, etc., with a cover removably attached through the second packing so as to close the notch of the lower wall of the die cast housing, with the second packing Comprising a communicating portion for connecting the inside and outside of the die-cast housing to be formed ;
The cover has a main cover portion and a flange portion provided around the lower side of the main cover portion,
The second packing is sandwiched between a lower wall of the die cast casing and the flange portion.
,
The communication unit, the electronic component accommodating case, characterized in Rukoto provided between the die cast housing bottom wall and the flange portion of the body. It said main cover portion Ri Do the inner surface and substantially the same surface of the lower wall of the die-cast housing,
The electronic component storage case according to claim 1, wherein the flange portion does not protrude from an outer surface of the lower wall. The electronic component storage case according to claim 2, wherein the die-cast housing stores an exothermic electronic component.

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