JP6437365B2 - Fixing method, covered conductor fixing structure - Google Patents

Description

  The present invention relates to a method for fixing a core wire of a coated conductor and a substrate, and a coated conductor fixing structure.

  In recent years, there has been an increasing demand for electrical components from the viewpoints of size reduction, weight reduction, performance, reliability, and the like. Examples of electrical components include power supplies, batteries, circuit boards, connectors, and the like. Generally, when connecting these electric components to a substrate, a terminal, etc., a conducting wire (electric wire) is used.

  Techniques related to conductive wires (electric wires) are disclosed in Patent Documents 1 to 5.

  Patent Document 1 discloses a connection portion of a bending resistant cable in which a cable end and a substrate such as an electronic device are connected by resistance welding. In Patent Document 1, an annealed copper wire whose outer periphery is coated with a thermosetting resin is used as a cable conductor.

  Patent Document 2 discloses an insulated coated electric wire in which an insulating layer is provided on the outer periphery of a conductor and a semiconductive layer is further provided on the outer periphery. The semiconductive layer is removed by laser peeling at the end portion of the insulating coated electric wire, and only the insulating layer is provided.

  Patent Document 3 describes (1) a coaxial cable provided in the order of outer coating, shielded wire, and inner coating from the outside and having a core wire at the center, and (2) outer coating, shielded wire, and inner coating of the coaxial cable. Disclosed is a terminal processing method for cutting and removing a wire.

  Patent Document 4 discloses a wiring structure of a wire harness in which a lamp and a wire harness for the lamp are assembled to a subframe made of a resin material, and the subframe is assembled to a vehicle body ceiling. In the wiring structure, the wire harness is composed of a plurality of uncoated conductors. And the said wire harness is fixed to a sub-frame because each conducting wire is welded to a sub-frame.

  Patent Document 5 discloses the following configuration. Specifically, in Cited Document 5, the aluminum-coated electric wire has an insulating coating on the outside of the core wire in which a plurality of aluminum strands are twisted together. When soldering to this aluminum-coated electric wire, (1) one end of the aluminum-coated electric wire from which the insulation coating is removed and the core wire is exposed is immersed in molten solder, (2) ultrasonic vibration is applied to the molten solder, (3) Air inside the insulation coating of the aluminum-coated wire is sucked from the other end of the aluminum-coated wire. As a result, the molten solder adheres to the outer periphery of the core wire and penetrates into the core wire.

JP 2002-358831 A (published on December 13, 2002) Japanese Patent Laying-Open No. 2005-285755 (released on October 13, 2005) JP 2008-300110 A (released on December 11, 2008) JP 2001-130347 A (published May 15, 2001) JP 2011-222406 A (published November 4, 2011)

  However, the techniques of Patent Documents 1 to 5 have the following problems.

  The technique of Patent Document 1 removes the coating of the end of the bending-resistant cable, exposes the annealed copper wire, and then connects the annealed copper wire and the wiring board by melting. That is, the technique of Patent Document 1 requires a step of removing the coating of the end of the bending-resistant cable in order to connect the annealed copper wire and the wiring board by melting.

  The techniques of Patent Document 2 and Patent Document 3 require a step of removing the coating from the terminal by laser peeling, and after that step, the insulated coated electric wire or coaxial cable and the substrate or the like are fixed.

  Patent Document 4 does not disclose a technique for welding or connecting a conductor having a coating and a portion to be routed.

  The technique of Patent Document 5 requires a step of removing one end of the insulating coating in order to attach the molten solder to the outer periphery of the core wire.

  In view of the above problems, the present invention aims to provide a fixing method for efficiently fixing a core wire of a coated conductor and a substrate, and a covered conductor fixing structure for fixing the core wire of the coated conductor and a substrate. And

  In order to solve the above problem, a fixing method according to an embodiment of the present invention is a fixing method for fixing a core wire of a coated conductor and a base material, and the coated conductor wire placed on the base material On the other hand, by spraying a powder material by cold spray, at least a part of the coating layer of the coated conductor is melted, and an exposure step that exposes the core wire of the coated conductor and the exposure step that is exposed in the exposure step A fixing step of fixing the core wire and the base material by spraying the powder material onto the core wire by cold spray.

  According to the above-described configuration, the fixing method according to the embodiment of the present invention exposes the core wire of the coated conductor by melting at least a part of the coating layer of the coated conductor in the exposing step. Therefore, in the fixing method according to an embodiment of the present invention, the core wire can be exposed in the exposure step.

  And the fixing method which concerns on one Embodiment of this invention is the fixing which fixes the said core wire and the said base material by spraying the said powder material with respect to the said core wire exposed at the said exposure step by cold spray. Includes steps. Therefore, the fixing method according to an embodiment of the present invention can fix the core wire and the base material by performing cold spraying on the core wire exposed in the exposure step.

  As described above, the fixing method according to the embodiment of the present invention exposes the core wire of the coated conductor in the exposing step, and thus does not require a separate process for removing the coating layer of the coated conductor. Furthermore, the fixing method according to an embodiment of the present invention fixes the core wire and the base material by cold spraying to the core wire exposed in the exposure step. It can be fixed efficiently.

  Further, in the fixing method according to an embodiment of the present invention, the base material includes a powder deposition layer formed by cold spraying another powder material different from the powder material on the surface of the base material, In the exposing step, the powder material is preferably sprayed by cold spray onto the coated conductor placed on the powder deposition layer.

  According to the above-described configuration, the powder deposition layer is a layer formed by cold spraying another powder material different from the powder material on the surface of the substrate. In the exposure step, the powder material is sprayed by cold spray onto the coated conductor placed on the powder deposition layer.

  Therefore, in the fixing method according to an embodiment of the present invention, the core wire of the coated conductor and the base material are fixed through a film and / or a powder deposition layer formed by depositing the powder material. it can.

  Therefore, when the powder is difficult to be applied to the substrate by cold spraying, first, a powder material different from the powder material is cold sprayed on the surface of the substrate to form a powder deposition layer. What is necessary is just to form. Thereby, the said core wire and the said base material can be fixed by spraying the said powder material with respect to the said covered conducting wire mounted on the said powder deposition layer by cold spray.

  In the fixing method according to an embodiment of the present invention, the powder material is tin powder, the other powder material is zinc powder, the base material is a copper substrate, and the core wire is An aluminum core wire may be used.

  Thereby, in the fixing method which concerns on one Embodiment of this invention, the said core wire and the said base material can be fixed efficiently.

  In the fixing method according to an embodiment of the present invention, the powder material is a powder material in which tin powder and zinc powder are mixed, the base material is a copper substrate, and the core wire is an aluminum core wire. It may be.

  Thereby, in the fixing method which concerns on one Embodiment of this invention, the said core wire and the said base material can be fixed efficiently.

  In the fixing method according to an embodiment of the present invention, the powder material is a powder material in which tin powder and aluminum powder are mixed, the base material is an aluminum substrate, and the core wire is an aluminum core wire. It may be.

  Thereby, in the fixing method which concerns on one Embodiment of this invention, the said core wire and the said base material can be fixed efficiently.

  The coated conductor fixing structure according to an embodiment of the present invention includes a coated conductor having an aluminum core wire and a coating layer that covers the aluminum core wire, and a base material including another metal material different from aluminum. The aluminum core wire exposed from at least a part of the coating layer and the base material are fixed by a film formed by cold spraying.

  According to the above-described configuration, in the coated conductive wire fixing structure according to one embodiment of the present invention, the aluminum core wire exposed from at least a part of the coating layer and the base material are fixed by a film formed by cold spray. .

  Therefore, the covered conductor fixing structure according to an embodiment of the present invention can provide a covered conductor fixing structure in which the aluminum core wire and the base material are fixed using a cold spray.

  According to one aspect of the present invention, it is possible to provide a fixing method for efficiently fixing a core wire of a coated conductor and a base material, and a coated conductor fixing structure for fixing the core wire of the coated conductor and a base material.

It is the schematic of the cold spray apparatus which concerns on this embodiment. It is a figure for demonstrating the fixing method of the core wire of Al conducting wire and Cu board | substrate based on this embodiment, (a) is a figure which shows the process of forming Zn film in Cu board | substrate, (b) These are figures which show the process of carrying out the cold spray of Sn powder on Zn film | membrane and Al conducting wire, (c) is a figure which shows the state by which Sn film | membrane was formed into a film on Zn film and Al conducting wire. It is a flowchart which shows the fixing method of the core wire of Al conducting wire, and Cu board | substrate. It is a photograph when the Zn powder and the Sn powder are sequentially cold sprayed on the Cu substrate. It is a photograph when Sn powder is cold sprayed on the Cu substrate. It is a figure for demonstrating the fixing method of the core wire of Al conducting wire and Cu board | substrate based on other embodiment, (a) is a figure which shows the process of cold-spraying Sn + Zn mixed powder on Cu board | substrate and Al conducting wire. FIG. 6B is a diagram showing a state in which a Sn + Zn mixed film is formed on the Cu substrate and the Al conductive wire. It is a flowchart which shows the fixing method of the core wire of Al conducting wire, and Cu board | substrate. It is a photograph when Sn + Zn mixed powder is cold sprayed on the Cu substrate. It is a figure for demonstrating the fixing method of the core wire of Al conducting wire and Al board | substrate based on other embodiment, (a) is a figure which shows the process of cold-spraying Sn + Al mixed powder to Al board | substrate and Al conducting wire (B) is a figure which shows the state by which the Sn + Al mixed film was formed into the Al board | substrate and the Al conducting wire. It is a flowchart which shows the fixing method of the core wire and Al board | substrate of Al conducting wire. It is a photograph when Sn + Al mixed powder is cold sprayed on the Al substrate.

  Hereinafter, each embodiment will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

[About cold spray]
In recent years, a film forming method called a cold spray method has been used. In the cold spray method, a carrier gas having a temperature lower than the melting point or softening temperature of the metal powder that is the material of the metal film is made to flow at high speed, and the metal powder is injected into the carrier gas flow to accelerate it, and the substrate remains in a solid state. In other words, the film is formed by colliding with a high speed.

  The film forming principle of the cold spray method is understood as follows.

  In order for the metal powder to adhere to and deposit on the substrate and form a film, a collision speed higher than a certain critical value is required, and this is called a critical speed. When the metal powder collides with the substrate at a speed lower than the critical speed, the substrate is worn and the substrate can only have a small crater-like depression. The critical speed varies depending on the material, size, shape, temperature, oxygen content, substrate material, etc. of the metal powder.

  When the metal powder collides with the substrate at a speed equal to or higher than the critical speed, plastic deformation due to a large shear occurs in the vicinity of the interface between the metal powder and the substrate (or the already formed film). Along with this plastic deformation and the generation of a strong shock wave in the solid due to the collision, the temperature near the interface also rises, and in the process, between the metal powder and the substrate, and between the metal powder and the coating (the metal powder that has already adhered) Solid phase bonding occurs.

Embodiment 1
The first embodiment will be described below with reference to FIGS.

(Cold spray device 100)
FIG. 1 is a diagram showing an outline of a cold spray device 100. As shown in FIG. 1, the cold spray apparatus 100 includes a tank 110, a heater 120, a nozzle 130, a feeder 140, a base material holder 150, and a control device (not shown).

  The tank 110 stores a carrier gas. The carrier gas is supplied from the tank 110 to the heater 120. Examples of the carrier gas include nitrogen, helium, air, or a mixed gas thereof. The pressure of the carrier gas is adjusted to be, for example, 70 PSI or more and 150 PSI or less (about 0.48 Mpa or more and about 1.03 Mpa or less) at the outlet of the tank 110. However, the pressure of the carrier gas at the outlet of the tank 110 is not limited to the above range, and is appropriately adjusted depending on the material and size of the metal powder, the material of the substrate, and the like.

  The heater 120 heats the carrier gas supplied from the tank 110. More specifically, the carrier gas is heated to a temperature lower than the melting point of the metal powder supplied from the feeder 140 to the nozzle 130. For example, the carrier gas is heated in the range of 50 ° C. or more and 500 ° C. or less when measured at the outlet of the heater 120. However, the heating temperature of the carrier gas is not limited to the above range, and is appropriately adjusted depending on the material and size of the metal powder, the material of the substrate, and the like.

  The carrier gas is heated by the heater 120 and then supplied to the nozzle 130.

  The nozzle 130 accelerates the carrier gas heated by the heater 120 in a range of 300 m / s or more and 1200 m / s or less, and injects the carrier gas toward the substrate 10. The speed of the carrier gas is not limited to the above range, and is appropriately adjusted depending on the material and size of the metal powder, the material of the substrate, and the like.

  The feeder 140 supplies metal powder into the flow of carrier gas accelerated by the nozzle 130. The particle size of the metal powder supplied from the feeder 140 is 1 μm or more and 50 μm or less. The metal powder supplied from the feeder 140 is jetted from the nozzle 130 to the substrate 10 together with the carrier gas.

  The base material holder 150 fixes the base material 10. Carrier gas and metal powder are sprayed from the nozzle 130 onto the base material 10 fixed to the base material holder 150. The distance between the surface of the substrate 10 and the tip of the nozzle 130 is adjusted within a range of 5 mm to 30 mm, for example. However, the distance between the surface of the base material 10 and the nozzle 130 is not limited to the above range, and is appropriately adjusted according to the material and size of the metal powder, the material of the substrate, and the like.

  The control device controls the cold spray device 100 based on information stored in advance and / or an operator input. Specifically, the control device controls the pressure of the carrier gas supplied from the tank 110 to the heater 120, the temperature of the carrier gas heated by the heater 120, the type and amount of the metal powder supplied from the feeder 140, The distance between the surface and the nozzle 130 is controlled.

(Fixing method between core wire of coated conductor and substrate)
Next, a method for fixing an aluminum (Al) conductor core wire and a copper (Cu) substrate based on the present embodiment will be described with reference to FIGS.

  FIG. 2 is a view for explaining a method of fixing the core wire of the Al conductor and the Cu substrate based on the present embodiment. FIG. 2A is a diagram illustrating a process of forming a zinc (Zn) film on a Cu substrate. FIG. 2B is a diagram showing a step of cold spraying tin (Sn) powder on the Zn film and the Al conductor. FIG. 2C is a view showing a state in which an Sn film is formed on the Zn film and the Al conductor. FIG. 3 is a flowchart showing a method for fixing the core wire of the Al conductor and the Cu substrate.

  First, as shown in FIG. 2A, in a state where the base material holder 150 (not shown) fixes the substrate 11 (base material, copper substrate, base material containing a metal material different from aluminum), Zn powder 31 (another powder material, zinc powder) is injected onto the substrate 11 together with the carrier gas. As a result, Zn powder 31 is deposited on the substrate 11, and a Zn film 41 (powder deposition layer) is formed on the substrate 11. In FIG. 2A, for convenience, the Zn film 41 is shown in a rectangular shape.

  Next, as shown in FIG. 2 (b), Sn powder 32 (powder material, tin powder) together with the carrier gas is placed on the Zn film 41 in a state where the conductive wire 21 (covered conductive wire) is placed. 41 and the conductor 21. Thereby, as shown in FIG. 2C, Sn is deposited on the Zn film 41 and the conductive wire 21, and an Sn film 42 (film) is formed on the Zn film 41 and the conductive wire 21.

  Here, the conducting wire 21 includes a core wire 21a and a covering layer 21b covering the periphery of the core wire 21a. The core wire 21a may be Cu or Cu plated with Sn in addition to Al, and may be either a single wire or a stranded wire. The covering layer 21b is made of polyvinyl chloride, polyethylene, fluororesin, polyester, polyurethane, acrylic resin, or the like.

  In FIG. 2B, the coating layer 21 b of the conductive wire 21 is removed by melting the portion where the Sn powder 32 is sprayed and its periphery by heat. Thereby, the core wire 21a is exposed from a part of the coating layer 21b. Then, the Sn powder 32 is cold sprayed on the exposed core wire 21a, whereby the exposed core wire 21a of the conductive wire 21 is fixed to the substrate 11 via the Zn film 41 and / or the Sn film 42. The

  In order to limit the range in which the Sn powder 32 is sprayed, a metal plate or the like in which a hole having a predetermined diameter is formed as a mask is disposed on the conductive wire 21 and the Sn powder 32 is sprayed into the hole. May be. Thereby, the range in which the Sn powder 32 is sprayed onto the substrate 11 is limited, and the range in which the coating layer 21b is melted and removed can be limited.

  Next, with reference to FIG. 3, the fixing method of the core wire 21a of the conducting wire 21 and the board | substrate 11 is demonstrated.

  First, in SA1, Zn powder 31 is sprayed onto the substrate 11 by cold spray. Thereby, a Zn film 41 is formed on the substrate 11.

  Next, in SA2, Sn powder 32 is sprayed by cold spray onto the conductive wire 21 placed on the Zn film 41. Thereby, at least a part of the coating layer 21b of the conducting wire 21 is melted, and the core wire 21a of the conducting wire 21 is exposed (exposure step).

  Subsequently, in SA3, Sn powder 32 is sprayed by cold spray onto the core wire 21a exposed in the exposure step. Thereby, the core wire 21a and the board | substrate 11 are fixed (fixation step).

  The core wire 21a and the board | substrate 11 are fixed by passing through the process of the above SA1-SA3. At this time, it is not necessary to provide a separate process for removing the coating layer 21b.

  In addition, the covered conductive wire fixing structure (fixed structure in which the substrate 11, the core wire 21a, the Zn film 41, and the Sn film 42 are fixed to each other) formed by performing the above-described steps SA1 to SA3 includes the core wire 21a and the core wire 21a. And a substrate 11 made of Cu. Moreover, in the said covered conducting wire fixing structure, the core wire 21a exposed from at least one part of the coating layer 21b and the board | substrate 11 are being fixed by the membrane | film | coat (Sn film | membrane 42) formed by cold spray.

  In recent years, in order to reduce the weight of lead wires, Al is often used for the core material of lead wires. However, the conventional fixing method using solder has a problem when the Al wire is fixed to a metal substrate.

  Specifically, the Al wire can be fixed to the Al substrate with solder. However, when fixing an Al wire to a substrate made of a metal material different from Al, for example, in the case of Al and tin plating, it is difficult to fix both with solder.

  In addition, when an Al wire and a substrate made of a metal material different from Al are fixed with screws, corrosion may occur depending on the material of the substrate. For example, when the material of the substrate is Cu, battery action may occur at the connection portion between the Al wire and the Cu substrate, and the Al wire may corrode.

  Also, when fixing the Al wire and the substrate made of a metal material different from Al by welding, the oxide film is removed to activate the surface of the Al wire and the substrate and reduce the surface tension between the Al wire and the molten metal. It is necessary to perform a process such as, and it takes time and effort.

  In this regard, the fixing method according to the present embodiment can fix the Al wire and the substrate made of a metal material different from Al without going through the step of removing the coating layer. As a result, the fixing method according to the present embodiment can form the above-described covered conductor fixing structure.

Example 1
Next, Example 1 which fixes the core wire 21a of the conducting wire 21 and the substrate 11 will be described.

(conditions)
In Example 1, the substrate 11 of FIG. 2 corresponds to the base material 10 described in FIG. The substrate 11 is a copper plate material, is rectangular, and has a thickness of 0.5 mm. The core wire 21a of the conducting wire 21 is a stranded wire and has a diameter of 1 mm. The covering layer 21b is vinyl chloride.

  In Example 1, the metal powder is Zn powder 31 and Sn powder 32 in the order of cold spray from the nozzle 130. The Zn powder 31 has an average particle size of about 7 μm, and the Sn powder 32 has an average particle size of about 38 μm.

  The distance between the tip of the nozzle 130 and the substrate 11 is 10 mm. The carrier gas supplied from the tank 110 is air.

  The carrier gas pressure is set to 120 PSI (about 0.83 Mpa) at the outlet of the tank 110 in any case where the Zn powder 31 and the Sn powder 32 are injected from the nozzle 130.

  The heating temperature of the carrier gas is set to 200 ° C. lower than the melting point of Zn (419.6 ° C.) at the outlet of the heater 120 when the Zn powder 31 is injected from the nozzle 130. The carrier gas heating temperature is set to 150 ° C. lower than the melting point of Sn (231.97 ° C.) at the outlet of the heater 120 when the Sn powder 32 is injected from the nozzle 130.

  The heating temperature of the carrier gas is set in consideration of the thermal effect on the coating layer 21b. In the present Example 1, the coating layer 21b is made of vinyl chloride. Therefore, when the heating temperature of the carrier gas is higher than 150 ° C., the coating layer 21b melts over a wide range beyond the region where the Sn powder 32 is injected. Taking this into consideration, in Example 1, when the Sn powder 32 is sprayed onto the conducting wire 21, the heating temperature of the carrier gas is set to 150 ° C. The temperature at which the Sn powder 32 sprayed from the nozzle 130 onto the substrate 11 reaches the substrate 11 is about 103 ° C.

(Fixed state of coated conductor core and substrate)
FIG. 4 is a photograph when the Zn powder 31 and the Sn powder 32 are cold sprayed in that order on the Cu substrate 11. As shown in FIG. 4, an Sn film 42 is formed on the substrate 11 and the conductive wire 21. At this time, as for the conducting wire 21, a part of coating layer 21b melt | dissolves and the core wire 21a is exposed from there (not shown). An Sn film 42 is formed on the exposed core wire 21a. Thereby, the core wire 21 a is fixed to the substrate 11 via the Zn film 41 and / or the Sn film 42. The Zn film 41 is not shown in FIG. 4 because it is covered with the Sn film 42.

(Comparative example)
Next, a comparative example for Example 1 will be described.

  In Example 1, the Zn powder 31 and the Sn powder 32 are cold sprayed on the substrate 11 in that order. On the other hand, in this comparative example, the Sn film 42 is cold sprayed on the substrate 11 without the Zn powder 31 being cold sprayed on the substrate 11. In this comparative example, various conditions relating to the substrate 11, the Sn powder 32, and the cold spray device 100 are the same as those in the first embodiment.

  FIG. 5 is a photograph when only the Sn powder 32 is cold sprayed on the substrate 11. As shown in FIG. 5, when the Sn powder 32 is directly sprayed onto the substrate 11, the Sn film 42 is not uniformly formed on the substrate 11, and a part thereof is peeled off. The substrate 11 is exposed from a part of the Sn film 42. This is shown in FIG.

  As a cause of peeling, it is considered that the adhesion between the Sn film 42 and the substrate 11 is not good. For this reason, it is considered that the Sn film 42 formed by the previously injected Sn powder 32 collides with the Sn film 42 injected later, so that the Sn film 42 is peeled off. The same applies to the case where the pressure of the carrier gas supplied from the tank 110 is greater than 120 PSI.

  The adhesion between the metal particles and the substrate is considered to be affected by the hardness of the metal particles and the substrate, the shape and speed of the metal particles to be injected, and the like.

(Consideration from Example 1 and Comparative Example)
From the above, the following (1) and (2) are derived.
(1) Role of Zn Powder 31 as Film Formation Material As described above, it is difficult to form the Sn film 42 on the substrate 11 even if the Sn powder 32 is cold sprayed on the Cu substrate 11. . On the other hand, when the Zn powder 31 is cold sprayed onto the substrate 11, a Zn film 41 is formed on the substrate 11. Therefore, first, the Zn powder 31 is cold sprayed onto the substrate 11 to form the Zn film 41 on the substrate 11, and then the Sn powder 32 is cold sprayed onto the Zn film 41 to thereby form the Zn film 41 on the Zn film 41. The Sn film 42 can be formed.

In this way, by using the Zn powder 31 that can form a film having good adhesion to the substrate 11, the Zn film 41, which is the deposited layer closest to the substrate 11, is formed on the Cu substrate 11. The film 42 can be formed.
(2) Role of Zn powder 31 as anticorrosion material Next, the role of Zn powder 31 as an anticorrosion material will be described. Corrosion of a metal occurs when water drops or the like adhere to the metal and the metal is electrolyzed. Specifically, the metal emits electrons into the water droplets and dissolves in the water droplets as metal ions.

  When the core wire 21a made of Al is in contact with the Zn film 41, the following phenomenon occurs. When electrons are emitted from the core wire 21a into the water droplets, the electrons move from the Zn film 41 to the core wire 21a, and the Zn film 41 is ionized. Therefore, the core wire 21 a is not easily ionized while in contact with the Zn film 41. That is, the core wire 21a is protected from corrosion by being in contact with the Zn film 41. In this case, the Zn film 41 is called a sacrificial electrode because it is electrolyzed instead of the core wire 21a.

  Thus, the role as an anticorrosive material can be found in the Zn powder 31.

[Embodiment 2]
The second embodiment will be described below with reference to FIGS.

(Fixing method between core wire of coated conductor and substrate)
A method for fixing the core wire of the Al conductive wire and the Cu substrate based on the present embodiment will be described with reference to FIGS.

  FIG. 6 is a diagram for explaining a method of fixing the core wire of the Al conductive wire and the Cu substrate based on the present embodiment. (A) of FIG. 6 is a figure which shows the process of cold-spraying Sn + Zn mixed powder on Cu board | substrate and Al conducting wire. FIG. 6B is a diagram showing a state in which a Sn + Zn mixed film is formed on the Cu substrate and the Al conductive wire. FIG. 7 is a flowchart showing a method for fixing the core wire of the Al conductor and the Cu substrate.

  First, as shown in FIG. 6A, the substrate holder 150 (not shown) fixes the substrate 11, and the conducting wire 21 is placed on the substrate 11. In this state, Sn + Zn mixed powder (powder material, powder material in which tin powder and zinc powder are mixed) 33 is injected onto the substrate 11 and the conductor 21 together with the carrier gas. As a result, as shown in FIG. 6B, Sn and Zn are deposited on the substrate 11 and the conductive wire 21, and a Sn + Zn mixed film (film) 43 is formed on the substrate 11 and the conductive wire 21.

  As in the first embodiment, the conducting wire 21 includes a core wire 21a and a coating layer 21b that covers the periphery of the core wire 21a. In FIG. 6B, the coating layer 21 b is removed by melting the portion where the Sn + Zn mixed powder 33 is sprayed and its periphery by heat. Thereby, the core wire 21a is exposed from a part of the coating layer 21b (not shown). Then, the Sn + Zn mixed powder 33 is cold sprayed on the exposed core wire 21 a, whereby the exposed core wire 21 a of the conductive wire 21 is fixed to the substrate 11 via the Sn + Zn mixed film 43.

  Next, with reference to FIG. 7, the fixing method of the core wire 21a of the conducting wire 21 and the board | substrate 11 is demonstrated.

  First, in SB1, the Sn + Zn mixed powder 33 is sprayed onto the conducting wire 21 placed on the substrate 11 by cold spray. Thereby, at least a part of the coating layer 21b of the conducting wire 21 is melted, and the core wire 21a of the conducting wire 21 is exposed (exposure step).

  Next, in SB2, Sn + Zn mixed powder 33 is sprayed by cold spray onto the core wire 21a exposed in the exposure step. Thereby, the core wire 21a and the board | substrate 11 are fixed (fixation step).

  Through the processes of SB1 and SB2, the core wire 21a and the substrate 11 are fixed. At this time, it is not necessary to provide a separate process for removing the coating layer 21b.

  Further, the covered conductive wire fixing structure (fixed structure in which the substrate 11, the core wire 21a, and the Sn + Zn mixed film 43 are fixed to each other) formed through the above steps SB1 and SB2 covers the core wire 21a and the core wire 21a. A conductive wire 21 having a coating layer 21b and a Cu substrate 11 are provided. Moreover, in the said covered conducting wire fixing structure, the core wire 21a exposed from at least one part of the coating layer 21b and the board | substrate 11 are being fixed by the membrane | film | coat (Sn + Zn mixed film 43) formed by cold spray.

(Example 2)
Next, a second embodiment in which the core wire 21a of the conducting wire 21 and the substrate 11 are fixed will be described.

(conditions)
In Example 2, the substrate 11 of FIG. 6 corresponds to the base material 10 described in FIG. The substrate 11 is a copper plate, is rectangular, and has a thickness of 0.5 mm. The core wire 21a of the conducting wire 21 is a stranded wire and has a diameter of 1 mm. The covering layer 21b is vinyl chloride.

  In Example 2, the metal powder is Sn + Zn mixed powder 33. The average particle diameter of the Sn powder contained in the Sn + Zn mixed powder 33 is about 38 μm, and the average particle diameter of the Zn powder is about 7 μm. The volume ratio of Sn powder to Zn powder in the Sn + Zn mixed powder 33 is 50%.

  The distance between the tip of the nozzle 130 and the substrate 11 is 10 mm. The carrier gas supplied from the tank 110 is air.

  The pressure of the carrier gas is set to 120 PSI (about 0.83 Mpa) at the outlet of the tank 110. Further, the heating temperature of the carrier gas is set to 125 ° C. lower than the melting point of Zn (419.6 ° C.) and the melting point of Sn (231.97 ° C.) at the outlet of the heater 120.

  The heating temperature of the carrier gas is set in consideration of the thermal effect on the coating layer 21b of the conducting wire 21. In the second embodiment, the covering layer 21b is made of vinyl chloride. If the heating temperature of the carrier gas is lower than 125 ° C., the coating layer 21b made of vinyl chloride is not sufficiently melted, and the coating layer 21b cannot be removed. Considering this, in Example 2, when the Sn + Zn mixed powder 33 is cold sprayed onto the conductive wire 21, the heating temperature of the carrier gas is set to 125 ° C. The temperature at which the Sn + Zn mixed powder 33 cold sprayed from the nozzle 130 onto the substrate 11 reaches the substrate 11 is about 85 ° C.

(Fixed state of coated conductor core and substrate)
FIG. 8 is a photograph when the Sn + Zn mixed powder 33 is cold sprayed on the Cu substrate 11. As shown in FIG. 8, a Sn + Zn mixed film 43 is formed on the substrate 11 and the conductive wire 21. At this time, as for the conducting wire 21, a part of the coating layer 21b is melted, and the core wire 21a is exposed therefrom (not shown). An Sn + Zn mixed film 43 is formed on the exposed core wire 21a. Thereby, the core wire 21a is fixed to the substrate 11 via the Sn + Zn mixed film 43.

[Embodiment 3]
The third embodiment will be described below with reference to FIGS.

(Fixing method between core wire of coated conductor and substrate)
A method of fixing the core wire of the Al conductive wire and the Al substrate based on the present embodiment will be described with reference to FIGS.

  FIG. 9 is a view for explaining a method of fixing the core wire of the Al conductive wire and the Al substrate based on the present embodiment. (A) of FIG. 9 is a figure which shows the process of carrying out the cold spray of Sn + Al mixed powder to Al board | substrate and Al conducting wire. FIG. 9B is a diagram showing a state in which an Sn + Al mixed film is formed on the Al substrate and the Al conductive wire. FIG. 10 is a flowchart showing a method of fixing the core wire of the Al conductor and the Al substrate.

  First, as shown in FIG. 9A, the base material holder 150 (not shown) fixes the substrate 12, and the conductive wire 21 is placed on the substrate 12. In this state, Sn + Al mixed powder 34 (powder material, powder material in which tin powder and aluminum powder are mixed) is injected onto the substrate 12 and the conductive wire 21 together with the carrier gas. As a result, as shown in FIG. 9B, Sn and Al are deposited on the substrate 12 and the conductive wire 21, and a Sn + Al mixed film 44 (film) is formed on the substrate 12 and the conductive wire 21.

  The conducting wire 21 includes a core wire 21a and a covering layer 21b that covers the periphery of the core wire 21a, as in the first and second embodiments. The coating layer 21b is removed by melting the portion where the Sn + Al mixed powder 34 is sprayed and its surroundings by heat. Thereby, the core wire 21a is exposed from a part of the coating layer 21b. Then, the Sn + Al mixed powder 34 is cold sprayed on the exposed core wire 21 a, whereby the exposed core wire 21 a of the conductive wire 21 is fixed to the substrate 12 via the Sn + Al mixed film 44.

  Next, with reference to FIG. 10, the fixing method of the core wire 21a of the conducting wire 21 and the board | substrate 12 is demonstrated.

  First, in SC <b> 1, Sn + Al mixed powder 34 is sprayed onto the conductive wire 21 placed on the substrate 12. Thereby, at least a part of the coating layer 21b of the conducting wire 21 is melted, and the core wire 21a of the conducting wire 21 is exposed (exposure step).

  Next, in SC2, Sn + Al mixed powder 34 is sprayed by cold spray onto the core wire 21a exposed in the exposure step. Thereby, the core wire 21a and the board | substrate 12 are fixed (fixing step).

  Through the processes of SC1 and SC2, the core wire 21a and the substrate 12 are fixed. At this time, it is not necessary to provide a separate process for removing the coating layer 21b.

  In addition, the conductive wire fixing structure (fixed structure in which the substrate 12, the core wire 21a, and the Sn + Al mixed film 44 are fixed to each other) formed through the processes of SC1 and SC2 described above is a coating that covers the core wire 21a and the core wire 21a. A conductive wire 21 having a layer 21b and an Al substrate 12 are provided. Moreover, in the said covered conducting wire fixing structure, the core wire 21a exposed from at least one part of the coating layer 21b and the board | substrate 12 are being fixed by the membrane | film | coat (Sn + Al mixed film 44) formed by the cold spray.

Example 3
Next, Example 3 which fixes the board | substrate 12 and the core wire 21a of the conducting wire 21 is demonstrated.

(conditions)
In Example 3, the substrate 12 of FIG. 9 corresponds to the base material 10 described in FIG. The substrate 12 is an aluminum plate, is rectangular, and has a thickness of 0.5 mm. The core wire 21a of the conducting wire 21 is a stranded wire and has a diameter of 1 mm. The covering layer 21b is vinyl chloride.

  In Example 3, the metal powder is Sn + Al mixed powder 34. The average particle diameter of the Sn powder contained in the Sn + Al mixed powder 34 is about 38 μm, and the average particle diameter of the Al powder is about 40 μm. The volume ratio of Sn powder to Al powder in the Sn + Al mixed powder 34 is 50%.

  The distance between the tip of the nozzle 130 and the substrate 12 is 10 mm. The carrier gas supplied from the tank 110 is air.

  The pressure of the carrier gas is set to 120 PSI (about 0.83 Mpa) at the outlet of the tank 110. The heating temperature of the carrier gas is set to 125 ° C. lower than the melting point of Al (660.4 ° C.) and the melting point of Sn (231.97 ° C.) at the outlet of the heater 120.

  The heating temperature of the carrier gas is set in consideration of the thermal effect on the coating layer 21b of the conducting wire 21. In the third embodiment, the covering layer 21b is made of vinyl chloride. If the heating temperature of the carrier gas is lower than 125 ° C., the coating layer 21b made of vinyl chloride is not sufficiently melted, and the coating layer 21b cannot be removed. Considering this, in Example 3, when the Sn + Al mixed powder 34 is cold sprayed onto the conductive wire 21, the heating temperature of the carrier gas is set to 125 ° C. The temperature at which the Sn + Al mixed powder 34 cold sprayed from the nozzle 130 onto the substrate 12 reaches the substrate 12 is about 85 ° C.

(Fixed state of coated conductor core and substrate)
FIG. 11 is a photograph when the Sn + Al mixed powder 34 is cold sprayed on the substrate 12 made of Al. As shown in FIG. 11, an Sn + Al mixed film 44 is formed on the substrate 12 and the conductive wire 21. At this time, a part of the coating layer 21b of the conductive wire 21 is melted, and the core wire 21a is exposed therefrom. An Sn + Al mixed film 44 is formed on the exposed core wire 21a. Thereby, the core wire 21 a is fixed to the substrate 12 via the Sn + Al mixed film 44.

(Use)
As described above, in the first embodiment, the method of fixing the aluminum core wire and the Cu substrate included in the coated conducting wire by cold spraying Zn powder and Sn powder in that order has been described. In the second embodiment, the method of fixing the aluminum core wire and the Cu substrate included in the coated conductive wire by cold spraying the Sn + Zn mixed powder has been described. In the third embodiment, the method of fixing the aluminum core wire and the aluminum substrate included in the coated conductor by cold spraying the Sn + Al mixed powder has been described.

  However, the fixing method according to the present embodiment is applicable to the following uses, for example.

  First, the fixing method according to the present embodiment is applicable to, for example, a plurality of types of coated conductors in which the core wire is aluminum, copper, iron, nickel, or an alloy thereof, or a wire plated with tin, silver, or the like. Can be applied. Further, the present invention can be applied to a plurality of types of coated conductors whose coating layers are polyvinyl chloride, polyethylene, fluororesin, polyester, and the like. Examples of the coated conductor include a general coated conductor, a lead wire, a cable, and an optical fiber.

  Moreover, the fixing method according to the present embodiment can be applied to various conductive substrates. Examples of the substrate include circuit boards such as copper, aluminum, or copper plated with tin, connectors, terminals (tab leads that are output terminals of laminated lithium ion batteries, etc.), and the like. Further, the substrate may be a non-conductive substrate.

  Thus, the fixing method according to the present embodiment can be applied to various uses. Specifically, the material and size of the metal powder, the material of the substrate, and the like may be appropriately adjusted according to the material of the object to be cold sprayed. Similarly, the pressure of the carrier gas supplied from the tank 110 to the heater 120, the temperature of the carrier gas heated by the heater 120, the type and amount of the metal powder supplied from the feeder 140, the surface of the substrate 10 and the nozzle 130 And the like may be adjusted as appropriate. Thus, the fixing method according to the present embodiment can be applied to various uses.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be used for a method of fixing a core material having a coating and a base material.

10 base material 11 substrate (base material, copper substrate, base material containing other metal material different from aluminum)
12 Substrate (base material)
21 Conductor (Coated conductor)
21a Core wire 21b Coating layer 31 Zn powder (other powder materials, zinc powder)
32 Sn powder (powder material, tin powder)
33 Sn + Zn mixed powder (powder material, powder material in which tin powder and zinc powder are mixed)
34 Sn + Al mixed powder (powder material, powder material in which tin powder and aluminum powder are mixed)
41 Zn film (powder deposition layer)
42 Sn film (film)
43 Sn + Zn mixed film (film)
44 Sn + Al mixed film (film)
100 cold spray equipment

Claims (6)

A fixing method for fixing a core wire of a coated conductor and a base material,
By spraying a powder material by cold spray onto the coated conductor placed on the base material, at least a part of the coating layer of the coated conductor is melted and the core wire of the coated conductor is exposed. Exposure step,
A fixing step of fixing the core wire and the base material by spraying the powder material by cold spray on the core wire exposed in the exposure step;
The fixing method characterized by including. The base material includes a powder deposition layer formed by cold spraying another powder material different from the powder material on the surface of the base material,
The fixing method according to claim 1, wherein, in the exposing step, the powder material is sprayed by cold spray onto the coated conducting wire placed on the powder deposition layer. The powder material is tin powder,
The other powder material is zinc powder,
The base material is a copper substrate,
The fixing method according to claim 2, wherein the core wire is an aluminum core wire. The powder material is a powder material in which tin powder and zinc powder are mixed,
The base material is a copper substrate,
The fixing method according to claim 1, wherein the core wire is an aluminum core wire. The powder material is a powder material in which tin powder and aluminum powder are mixed,
The base material is an aluminum substrate,
The fixing method according to claim 1, wherein the core wire is an aluminum core wire. A coated conductor having an aluminum core wire and a coating layer covering the aluminum core wire;
A substrate comprising another metallic material different from aluminum;
A covered conductor fixing structure comprising: a fixing film that fixes the aluminum core wire exposed from the covering layer and the base material at positions different from both ends of the covered conductor.