JP6439148B2 - MOUNTING BOARD MANUFACTURING SYSTEM AND METHOD FOR INSTALLING BOARD SUBSTITTING MEMBER IN MOUNTING BOARD MANUFACTURING SYSTEM - Google Patents

Description

  The present invention relates to a mounting board manufacturing system that performs predetermined processing such as screen printing and component mounting on a board, and a method for installing a substrate receiving member in the mounting board manufacturing system.

  2. Description of the Related Art Conventionally, in a mounting board manufacturing system that manufactures a mounting board by performing predetermined processing such as screen printing and component mounting on the board, the lower surface of the board to be processed is removed for the purpose of stably processing the board. Support is performed (for example, the following patent document 1). The substrate receiving member used for supporting the substrate differs in shape, size, etc. depending on the size of the substrate and the state of the lower surface (for example, the arrangement state of components already mounted on the lower surface of the substrate). In order to switch the type of substrate to be produced, it is necessary to prepare for replacing the substrate receiving member in accordance with the substrate to be processed.

Japanese Patent Laid-Open No. 2015-214088

  However, conventionally, most of the setup work for replacing the substrate receiving member is manual work, and there is a problem that the work man-hour increases and the productivity of the mounting board may be lowered.

  Therefore, the present invention provides a mounting board manufacturing system capable of reducing the man-hours required for replacing the board receiving member and improving the productivity of the mounting board, and a method for installing the board receiving member in the mounting board manufacturing system. The purpose is to do.

  The mounting board manufacturing system of the present invention is detachably installed on a conveyance unit that conveys a conveyance object to a work position, a lower member installation unit provided below the conveyance unit, and the lower member installation unit. The substrate lowering member that supports the lower surface of the substrate as the transfer object transferred to the work position by the transfer unit and the upper surface of the substrate whose lower surface is supported by the substrate lowering member are subjected to predetermined processing. A substrate processing section; and a first carrier that holds the substrate receiving member as the transfer object on a lower surface thereof, and the transfer section uses the first carrier holding the substrate receiving member as the work. The substrate lowering member is positioned at the working position by being conveyed to a position, and the substrate lowering member positioned at the working position is a magnetic force of a first magnet provided on the lower surface of the substrate lowering member. By the above It is fixed to the receiving member installation portion.

  In the mounting substrate manufacturing system of the present invention, the substrate receiving member installation method includes a transport unit that transports a transport target to a work position, a lower support member installation unit provided below the transport unit, and the lower support member. A substrate lower support member that is detachably installed in the installation section and supports the lower surface of the substrate as the transfer object that is transferred to the work position by the transfer section, and a substrate whose lower surface is supported by the substrate lower support member In the mounting method of the substrate support member in the mounting substrate manufacturing system, comprising: a substrate processing unit that performs a predetermined process on the upper surface of the substrate; and a first carrier that holds the substrate support member as the transport object on the lower surface. And the substrate carrier that moves the first carrier holding the substrate receiving member to the working position by the carrying unit, thereby positioning the substrate receiving member at the working position. A substrate conveying member, and a substrate lowering member that fixes the substrate lowering member positioned at the working position to the lower receiving member installation portion by a magnetic force of a first magnet provided on a lower surface of the substrate lowering member. Installation process.

  According to the present invention, it is possible to improve the productivity of the mounting substrate by reducing the number of work steps required to replace the substrate receiving member.

The top view which shows schematic structure of the mounting substrate manufacturing system in one embodiment of this invention The side view of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided The sectional side view of the vicinity of the board | substrate receiving member of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided The sectional side view which shows the board | substrate lower receiving member of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided with the lower receiving member installation part The block diagram which shows the operation | movement system of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided. (A) (b) (c) Operation | movement explanatory drawing at the time of the screen printing operation | work by the mounting substrate manufacturing system in one embodiment of this invention (A) (b) Operation explanatory drawing at the time of screen printing work by the mounting board manufacturing system in one embodiment of the present invention Operation explanatory diagram at the time of screen printing work by the mounting board manufacturing system in one embodiment of the present invention (A) (b) (c) Operation | movement explanatory drawing at the time of the screen printing operation | work by the mounting substrate manufacturing system in one embodiment of this invention (A) (b) The perspective view which shows the board | substrate receiving member of the screen printing apparatus with which the mounting board | substrate manufacturing system in one embodiment of this invention is provided with a 1st carrier (A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention (A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention (A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention (A) (b) The perspective view which shows the board | substrate lower receiving member of the screen printing apparatus with which the mounting board | substrate manufacturing system in one embodiment of this invention is equipped with a 2nd carrier (A) (b) (c) Explanatory drawing of operation | movement at the time of the collection | recovery operation | work of the substrate lowering member by the mounting substrate manufacturing system in one embodiment of this invention (A) (b) (c) Operation explanatory drawing at the time of collection work of a substrate lowering member by a mounting substrate manufacturing system in one embodiment of the present invention (A) (b) (c) Explanatory drawing of operation | movement at the time of the collection | recovery operation | work of the substrate lowering member by the mounting substrate manufacturing system in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a mounting board manufacturing system 1 according to an embodiment of the present invention. The mounting board manufacturing system 1 manufactures a mounting board by subjecting a board 2 to screen printing processing and component mounting processing, and includes a board supply unit 11, a carry-in relay conveyor 12, a screen printing device 13, and a carry-out relay conveyor. 14 and a component mounting apparatus 15 are provided. The flow of the substrate 2 is a direction from the left to the right as viewed from the operator OP, and this direction is defined as the X-axis direction. Further, the front-rear direction viewed from the operator OP is the Y-axis direction, and the vertical direction is the Z-axis direction.

  The substrate supply unit 11 is provided on the most upstream process side of the mounting substrate manufacturing system 1 and continuously supplies the substrate 2. The carry-in relay conveyor 12 is provided on the downstream process side of the substrate supply unit 11, receives the substrate 2 supplied by the substrate supply unit 11, and transfers it to the screen printing device 13.

  As shown in FIG. 1, the screen printing apparatus 13 includes a carry-in unit 22, a print execution unit 23, and a carry-out unit 24 on a base 21. The print execution unit 23 is provided in the center of the base 21, and the carry-in unit 22 is provided in the left area of the print execution unit 23 on the base 21 (upstream process side of the print execution unit 23). The carry-out unit 24 is provided in a region on the right side of the print execution unit 23 on the base 21 (on the downstream process side of the print execution unit 23).

  In FIG. 2, the print execution unit 23 includes a substrate holding unit 31 provided on a base 21, a mask 32, and a squeegee head 33. The substrate holding unit 31 includes an XYZ rotary stage 41 installed on the base 21, a base part 42 that can be moved in the horizontal plane, moved up and down, and rotated around the Z axis by the XYZ rotary stage 41, and a base part 42. A pair of clamps 45 and a transport unit 44 attached to a pair of transport unit support walls 43, a lower receiving member installation unit 46 provided below the transport unit 44, and an upper surface of the lower support member installation unit 46. A freely installed substrate lowering member 47 and an elevating mechanism 48 (lower receiving member installing portion elevating mechanism) for elevating and lowering the lower receiving member setting portion 46 (that is, the lower substrate receiving member 47) with respect to the base portion 42 are provided. ing. The mask 32 and the squeegee head 33 constitute a substrate processing unit that performs a predetermined process on the upper surface of the substrate 2 whose lower surface is supported by the substrate receiving member 47.

  In FIG. 2, the transport unit 44 includes a pair of conveyors 44 a that are installed to face each other in the Y-axis direction. The pair of clamp members 45 are driven by the clamp member drive unit 45M to operate so as to approach or separate from each other. The transport unit 44 receives the transport object sent from the carry-in unit 22 and transports (carries in) the work object to the work position, and transports (unloads) the transport object at the work position to the outside.

  As shown in FIGS. 2 and 3, the mask 32 is held in a horizontal posture above the substrate holding unit 31. The mask 32 is made of, for example, a metal plate-like member, and a pattern opening (not shown) corresponding to each of a plurality of electrodes (not shown) formed on the upper surface of the substrate 2 is provided at the center thereof. ing. The squeegee head 33 is driven by a head drive mechanism 33M and is moved to the squeegee base 33b that moves in the Y-axis direction above the mask 32. The two squeegees 33k are provided so as to face each other in the Y-axis direction. The configuration includes two cylinders 33 s that are moved up and down with respect to 33 b.

  The substrate receiving member 47 is a hollow box-shaped member having an internal space 47S as shown in FIGS. 3 and 4, and is made of a magnetic material. The substrate receiving member 47 is a member that supports the lower surface of the substrate 2 as a conveyance object positioned at the work position by the conveyance unit 44. In this embodiment, the substrate positioned at the work position by the conveyance unit 44. It is configured to adsorb while supporting the lower surface of 2.

  The upper surface of the top plate 51 of the substrate receiving member 47 is a surface that contacts the lower surface of the substrate 2 and includes a plurality of suction holes 51a that open upward. The lower surface of the bottom plate 52 of the substrate lower receiving member 47 is a surface that comes into contact with the upper surface of the lower receiving member installation portion 46, and includes a plurality of pipe connection holes 52a that open downward.

  3 and 4, a plurality of magnets (first magnets 47 </ b> M) embedded so as to be exposed on the lower surface side are provided on the bottom plate 52 of the substrate receiving member 47. On the other hand, the lower receiving member installation portion 46 is made of a magnetic material in a certain region including at least the upper surface thereof. Therefore, a magnetic force attracting each other acts between the substrate lower receiving member 47 and the lower receiving member installing portion 46, and when the substrate lower receiving member 47 is installed in the lower receiving member installing portion 46, the substrate lower receiving member 47 is fixed to the receiving member installation portion 46 by magnetic force.

  As shown in FIG. 4, a convex portion 47a projecting downward is provided on the lower surface of the substrate receiving member 47, and a concave portion having a shape that can be fitted to the convex portion 47a on the upper surface of the lower member installing portion 46. 46a is provided. A plurality of convex portions 47 a and concave portions 46 a are provided side by side in the X-axis direction (direction perpendicular to the paper surface of FIG. 4), and the plurality of convex portions 47 a of the substrate lowering member 47 are the lower receiving member installation portions 46. The substrate receiving member 47 is installed in the lower receiving member installation portion 46 in a state of being accurately positioned with respect to the lower receiving member installation portion 46 by being engaged with the plurality of recesses 46a.

  The convex portions 47a are preferably frustoconical. In this way, when the substrate lower receiving member 47 is installed on the lower receiving member installation portion 46 from above, the central axis of each convex portion 47a corresponds to the concave portion 46a. Even if it is slightly deviated from the central axis, the substrate receiving member 47 can be installed in an accurate installation on the receiving member installation portion 46. Here, the convex portion 47 a is provided on the lower surface of the substrate receiving member 47 and the concave portion 46 a is provided on the upper surface of the lower receiving member installation portion 46, but the concave portion is provided on the lower surface of the substrate lowering member 47, A convex portion may be provided on the upper surface of the lower receiving member installation portion 46. That is, the convex portion provided in one of the substrate lower receiving member 47 and the lower receiving member installation portion 46 is the concave portion provided in either one of the substrate lower receiving member 47 and the lower receiving member installation portion 46. As long as the board lower member 47 is installed in the lower member installation portion 46 in a state where it is fitted.

  3 and 4, an adsorption pipe 56 is formed inside the lower receiving member installation portion 46, and an outlet opening 56 a of the adsorption pipe 56 is formed on the upper surface of the lower receiving member installation portion 46. . When the substrate receiving member 47 is installed in the lower receiving member installation portion 46, the outlet opening 56a of the suction piping 56 matches the pipe connection hole 52a provided in the bottom plate 52 of the substrate receiving member 47, and the substrate receiving member The internal space 47S of 47 and the suction pipe 56 are connected (FIG. 4).

  In FIG. 3, the suction pipe 56 is connected to the vacuum source VP through an external pipe 56G extending outside the lower member installation portion 46, and a control valve 57 is interposed in the external pipe 56G. When the vacuum source VP sucks out air through the external pipe 56G and the suction pipe 56 in a state where the substrate 2 is in contact with the substrate lower receiving member 47, the substrate 2 is lowered by the suction force generated in the suction hole 51a. To be adsorbed. The holding force of the substrate 2 can be adjusted by driving the control valve 57 and adjusting the magnitude of the suction force generated in the suction hole 51a, and the suction valve 56 is opened to the atmosphere by driving the control valve 57. Thus, the adsorption of the substrate 2 to the substrate receiving member 47 can be released.

  In FIG. 1, the conveyance unit 44 carries the conveyance object to the carry-out unit 24 when carrying the conveyance object. The carry-out unit 24 receives the conveyance object carried out from the conveyance unit 44 and carries out the conveyance object to the outside (conveyance-side relay conveyor 14).

  In the screen printing apparatus 13 configured as described above, the operation control of the carry-in unit 22, the operation control of the transport unit 44, the operation control of the clamp member driving unit 45M, the movement control of the base unit 42 by the XYZ rotary stage 41, the base unit by the lifting mechanism 48 The control device 60 provided in the screen printing device 13 performs the control operation of the lift 42, the control of the lift operation of the squeegee 33k by the cylinder 33s, the movement control of the squeegee head 33 by the head drive mechanism 33M, and the operation control of the carry-out unit 24 (FIG. 5). ). The control device 60 also performs drive control of the control valve 57 (see also FIG. 3).

  In FIG. 1, the carry-out side relay conveyor 14 is provided on the downstream process side of the screen printing apparatus 13. The carry-out side relay conveyor 14 receives the conveyance object carried out by the carry-out unit 24 of the screen printing apparatus 13 to the outside and conveys it to the component mounting apparatus 15.

  In FIG. 1, the component mounting apparatus 15 conveys the substrate 2 sent from the carry-out side relay conveyor 14 by the substrate conveyance path 61 and positions it at the work position, and the substrate support unit 62 positioned below the substrate conveyance path 61. To support the substrate 2. Then, a component (not shown) is mounted on the electrode of the substrate 2 on which screen printing has been performed in the screen printing apparatus 13 by the mounting head 63.

  Next, the operation at the time of manufacturing a mounting board by the mounting board manufacturing system 1 will be described. In manufacturing the mounting substrate, first, the substrate supply unit 11 supplies the substrate 2 to the carry-in relay conveyor 12 (FIG. 6A). The carry-in relay conveyor 12 that has received the substrate 2 from the substrate supply unit 11 delivers the substrate 2 to the carry-in unit 22 (FIG. 6B). The carrying-in part 22 which received the board | substrate 2 carries out the board | substrate 2 to the conveyance part 44, and the conveyance part 44 conveys the received board | substrate 2 to a working position (FIG.6 (c)). When the substrate 2 is transported to the working position, the lifting mechanism 48 raises the lower receiving member installation portion 46 (arrow A1 shown in FIG. 7A), and the upper surface of the lower substrate receiving member 47 is brought into contact with the lower surface of the substrate 2. (FIG. 7A).

  When the upper surface of the substrate lowering member 47 comes into contact with the lower surface of the substrate 2, the control device 60 operates the control valve 57 to generate an adsorption force in the adsorption hole 51a. As a result, the substrate 2 is in close contact with the upper surface of the substrate receiving member 47 and is supported by the substrate receiving member 47 in a state where the deformation is corrected even when the substrate 2 is deformed such as warping.

  When the substrate 2 is supported by the substrate lower receiving member 47, the lifting mechanism 48 further raises the lower receiving member installation portion 46 (arrow A2 shown in FIG. 7B). Thus, the substrate 2 is lifted by the substrate receiving member 47 and is separated from the transport unit 44 (FIG. 7B). When the substrate 2 is lifted and the upper surfaces thereof are at the same height as the upper surfaces of the pair of clamp members 45, the pair of clamp members 45 driven by the clamp member driving unit 45M operate so as to be close to each other. Clamping from both ends in the Y-axis direction (FIG. 7 (b), arrow B shown in the figure).

  When the pair of clamp members 45 clamp the substrate 2, the XYZ rotation stage 41 is actuated to move the substrate 2 horizontally so that the pattern opening of the mask 32 and the electrode of the substrate 2 are aligned vertically, and then the base portion 42. Is raised (arrow C shown in FIG. 8). Thus, when the upper surface of the substrate 2 comes into contact with the lower surface of the mask 32, the squeegee head 33 lowers one squeegee 33k by the cylinder 33s and makes the lower end of the squeegee 33k contact the upper surface of the mask 32 (FIG. 8). When the lower end of the squeegee 33k comes into contact with the upper surface of the mask 32, the head drive mechanism 33M is operated to move the squeegee head 33 in the Y-axis direction (arrow D shown in FIGS. 8 and 9A). Then slide the squeegee 33k. As a result, the paste Pst previously supplied onto the mask 32 is scraped by the squeegee 33k, and the paste Pst is printed on the electrode of the substrate 2 through the opening of the mask 32.

  When the paste Pst is printed on the electrode of the substrate 2, the XYZ rotary stage 41 is operated to lower the base portion 42, thereby separating the substrate 2 from the mask 32 (plate separation). When the substrate 2 is separated from the mask 32, the control device 60 operates the control valve 57 to release the adsorption of the substrate 2. When the suction of the substrate 2 is released, the pair of clamp members 45 operate in a direction away from each other to release the clamp of the substrate 2, and the lifting mechanism 48 lowers the lower member setting portion 46 to transfer the substrate 2 to the transport portion. 44 (FIG. 3). If the board | substrate 2 is mounted in the conveyance part 44, the conveyance part 44 will convey the board | substrate 2 and will carry it out to the carrying-out part 24 (FIG.9 (b)). The carry-out unit 24 receives the substrate 2 (substrate 2 on which screen printing has been performed) carried out by the conveyance unit 44, and transfers it to the carry-out side relay conveyor 14 (FIG. 9C). Thereby, the screen printing per substrate 2 by the screen printing device 13 is completed.

  The carry-out relay conveyor 14 carries the board 2 received from the screen printing device 13 to the component mounting device 15. The component mounting apparatus 15 receives the substrate 2 carried out by the carry-out-side relay conveyor 14 through the substrate conveyance path 61 and positions the substrate 2 at a work position. Install the parts. When all the components to be mounted on the substrate 2 are mounted, the substrate 2 is carried out to the outside (downstream process side).

  In the mounting board manufacturing system 1 having such a configuration, the board receiving member 47 provided in the screen printing apparatus 13 can be automatically installed and removed, and the procedure will be described below.

  When the substrate support member 47 is automatically installed in the support member installation portion 46 of the screen printing apparatus 13, the first carrier 71 (FIGS. 10A and 10B) formed in a substrate shape is used. . A plurality of magnets (second magnets 71M) are provided on the lower surface of the first carrier 71 so as to be exposed downward. As described above, the substrate receiving member 47 is made of a magnetic material, and the second magnet 71M attracts the substrate receiving member 47 with a magnetic force, so that the upper surface of the substrate receiving member 47 is set to the lower surface of the first carrier 71. The substrate lower receiving member 47 is held by the first carrier 71. As described above, in the present embodiment, the second magnet 71M is provided on the lower surface of the first carrier 71, and the substrate lowering member 47 is formed by the magnetic force exerted by the second magnet 71M. 71 is held on the lower surface.

  Here, the second magnet 71 </ b> M exerts a magnetic force that attracts the substrate receiving member 47 with an attractive force that is weaker than the magnetic force that the first magnet 47 </ b> M provided on the substrate receiving member 47 attracts the lower receiving member installation portion 46. It is supposed to be. That is, the pulling force between the substrate lower receiving member 47 and the first carrier 71 is weaker than the pulling force between the substrate lower receiving member 47 and the lower receiving member installing portion 46.

  As shown in FIGS. 10A and 10B, the lower surface of the first carrier 71 is provided with a plurality of protrusions 71a protruding downward, and the protrusions 71a are provided on the upper surface of the substrate receiving member 47. A plurality of holes 47b having a shape that can be fitted to 71a are provided. The plurality of protrusions 71 a of the first carrier 71 are fitted into the plurality of holes 47 b of the substrate receiving member 47 so that the substrate receiving member 47 is accurately held at a predetermined holding position with respect to the first carrier 71. Is done.

  When the operator OP installs the substrate support member 47 in the support member installation portion 46, the operator OP inputs (supplies) the first carrier 71 holding the substrate support member 47 to the carry-in relay conveyor 12. (Substrate lowering member supplying step. FIG. 11A). The carry-in relay conveyor 12 that has received the first carrier 71 holding the substrate lower receiving member 47 delivers the first carrier 71 to the carry-in section 22 (FIG. 11B). The carry-in unit 22 transfers the first carrier 71 received from the carry-in relay conveyor 12 to the transport unit 44, and then the transport unit 44 transports the received first carrier 71 to the work position (FIG. 11C). ). That is, the transport unit 44 transports the first carrier 71 holding the substrate support member 47 to the work position, thereby positioning the substrate support member 47 at the work position (substrate support member transport process).

  When the transport unit 44 transports the first carrier 71 to the working position, the substrate lowering member 47 held by the first carrier 71 is positioned at the working position (above the lower receiving member installation unit 46) (see FIG. 12 (a)), the elevating mechanism 48 installs the substrate receiving member 47 in the lower receiving member installation portion 46 (substrate under receiving member installation step). Specifically, first, the elevating mechanism 48 raises the lower receiving member installation portion 46 (arrow A3 shown in FIG. 12B), and the upper surface of the lower receiving member installation portion 46 is made the lower surface of the substrate lower receiving member 47. By making the contact, the substrate lowering member 47 held by the first carrier 71 is fixed to the lower receiving member setting portion 46 by the magnetic force between the first magnet 47M and the lower receiving member setting portion 46 (this (The plurality of concave portions 46a on the lower receiving member installation portion 46 side are fitted with the plurality of convex portions 47a on the substrate lower receiving member 47 side). When the substrate receiving member 47 is fixed to the lower receiving member installation portion 46 in this way, the elevating mechanism 48 lowers the lower receiving member installation portion 46 (FIG. 12 (c), arrow A4 shown in the figure).

  In the raising / lowering operation of the lower receiving member installation portion 46 as described above, when the lower receiving member installation portion 46 comes into contact with the lower surface of the lower substrate receiving member 47 held by the first carrier 71, the lower substrate receiving member 47 is The pulling force between the first carrier 71 and the pulling force between the lower receiving member installation portion 46 are received. As described above, the pulling force between the substrate lowering member 47 and the first carrier 71 is received. Is weaker than the pulling force between the substrate receiving member 47 and the lower receiving member installation portion 46, and when the lower receiving member installation portion 46 is subsequently lowered, the substrate lower receiving member 47 is separated from the first carrier 71. Then, it is in a state where it is installed in the lower receiving member installation section 46 (FIG. 12C).

  When the substrate lowering member 47 is installed in the lower receiving member installation unit 46 as described above, the transport unit 44 transports the first carrier 71 separated from the substrate lowering member 47 and delivers it to the carry-out unit 24 ( FIG. 13 (a)). Then, the unloading unit 24 that has received the first carrier 71 unloads the first carrier 71 to the unloading-side relay conveyor 14 (FIG. 13B). When the first carrier 71 is carried out to the carry-out relay conveyor 14, the operator OP takes out the first carrier 71 from the carry-out relay conveyor 14 and collects it (FIG. 13C). Thereby, the installation of the substrate lower receiving member 47 in the screen printing apparatus 13 is completed.

  When the substrate receiving member 47 installed in the screen printing device 13 is automatically collected, the second carrier 72 formed in a substrate shape is used (FIGS. 14A and 14B). 14A and 14B, a plurality of magnets (third magnets 72M) are provided on the lower surface of the second carrier 72 so as to be exposed downward. As described above, the substrate lowering member 47 is made of a magnetic material, and the third magnet 72M attracts the substrate lowering member 47 with a magnetic force, so that the upper surface of the substrate lowering member 47 is placed on the second carrier 72. By contacting the lower surface, the substrate lowering member 47 can be held by the second carrier 72. The third magnet 72M provided on the second carrier 72 exhibits an attractive force stronger than the magnetic force with which the first magnet 47M provided on the substrate lower receiving member 47 pulls the lower receiving member installation portion 46. It has become. That is, the pulling force between the substrate lower receiving member 47 and the second carrier 72 is stronger than the pulling force between the substrate lower receiving member 47 and the lower receiving member installation portion 46.

  When collecting the substrate lower receiving member 47 installed in the lower receiving member installing portion 46, the operator OP inputs (supplies) the second carrier 72 to the carry-in relay conveyor 12 to the carry-in portion 22. Second carrier supply step. FIG. 15 (a)). The carry-in relay conveyor 12 that has received the second carrier 72 delivers the second carrier 72 to the carry-in unit 22 (FIG. 15B). The carry-in unit 22 transfers the second carrier 72 received from the carry-in relay conveyor 12 to the transport unit 44, and then the transport unit 44 transports the received second carrier 72 to the working position (FIG. 15C). ).

  When the transporting part 44 transports the second carrier 72 to the working position, the second carrier 72 is positioned above the substrate lowering member 47 installed in the lowering member installing part 46 (FIG. 16 ( a)) The substrate lowering member 47 installed in the lower receiving member installation unit 46 is removed from the lower receiving member installation unit 46 and delivered to the transport unit 44 (substrate lowering unit removal step). Specifically, first, the elevating mechanism 48 raises the lower receiving member installation portion 46 (arrow A5 shown in FIG. 16B), and the upper surface of the substrate lowering member 47 contacts the lower surface of the second carrier 72. By doing so, the substrate lowering member 47 is held by the second carrier 72 by the magnetic force between the third magnet 72M and the substrate lowering member 47. When the substrate lowering member 47 is thus held by the second carrier 72 (FIG. 16B), the elevating mechanism 48 lowers the lower receiving member installation portion 46 (FIG. 16C). Arrow A6) shown in the figure.

  In the raising / lowering operation of the lower receiving member installation portion 46 as described above, when the second carrier 72 comes into contact with the upper surface of the lower substrate receiving member 47, the lower substrate receiving member 47 is attracted to the lower receiving member installation portion 46. Although the force and the pulling force between the second carrier 72 are received, as described above, the pulling force between the substrate lower receiving member 47 and the second carrier 72 is different from the substrate lower receiving member 47 and the lower receiving member. Since it is stronger than the pulling force between the mounting portion 46 and the lower receiving member setting portion 46 is subsequently lowered, the substrate lowering member 47 is separated from the lower receiving member setting portion 46 and delivered to the second carrier 72. Thus, the substrate lower receiving member 47 is removed from the lower receiving member installation portion 46 (FIG. 16C).

  When the substrate receiving member 47 is transferred to the second carrier 72 as described above, the transport unit 44 transfers the second carrier 72 to the unloading unit 24 (FIG. 17A), and the unloading unit 24 then Then, the second carrier 72 received from the transport unit 44 is carried out to the carry-out-side relay conveyor 14 (substrate lowering member carrying-out step, FIG. 17B). The operator OP takes out the second carrier 72 from the carry-out relay conveyor 14 when the second carrier 72 holding the substrate receiving member 47 is carried out to the carry-out relay conveyor 14 (FIG. 17C). In this way, the transport unit 44 transports the second carrier 72 holding the substrate receiving member 47 so that the substrate receiving member 47 is unloaded from the work position. Thereby, the recovery of the substrate receiving member 47 from the screen printing apparatus 13 is completed.

  The substrate receiving member 47 can be installed on the screen printing apparatus 13 and the substrate receiving member 47 can be collected from the screen printing apparatus 13 by the above-described procedure. After the substrate receiving member 47 is collected, Subsequently, by performing the installation work of the substrate lower support member 47, the replacement work of the substrate lower support member 47 during the production of the mounting board can be automatically performed.

  As described above, in the mounting substrate manufacturing system 1 in this embodiment (the method for installing the substrate receiving member in the mounting substrate manufacturing system 1), the first carrier 71 holding the substrate receiving member 47 on the lower surface is conveyed. The substrate receiving member 47 is positioned at the working position by being conveyed to the working position by the unit 44, and the substrate lowering member 47 located at the working position is provided with the first magnet 47M provided on the lower surface of the substrate lowering member 47. It is configured to be fixed to the lower receiving member installation portion 46 by the magnetic force. For this reason, it is possible to automatically install the substrate support member 47, and the number of work steps required to replace the substrate support member 47 can be reduced and the productivity of the mounting substrate can be improved.

  In the above-described embodiment, the substrate lowering member 47 is held by the first carrier 71 by magnetic force. However, the substrate lowering member 47 is held by the first carrier by means other than magnetic force. 71 may be held. Similarly, the substrate receiving member 47 is held by the second carrier 72 by magnetic force, but the substrate receiving member 47 is held by the second carrier 72 by means other than magnetic force. It may be.

  Further, in the above-described embodiment, the operator OP manually inputs the first carrier 71 and the second carrier 72 into the carry-in relay conveyor 12 and removes them from the carry-out relay conveyor 14. However, it is also possible to automate the work that was performed by these workers OP. In this case, a carrier supply device for feeding the first carrier 71 and the second carrier 72 into the carry-in relay conveyor 12 is provided, and the first carrier 71 and the second carrier 72 are moved from the carry-out relay conveyor 14. A carrier take-out device for taking out is provided. Further, after the carry-in unit 22 and the carry-out unit 24 are used as distribution conveyors, respectively, the carry-in unit 22 and the carry-out unit 24, which are the distribution conveyors, and the carrier supply device and the carrier take-out device are combined for automation. Can be achieved.

  Further, in the above-described embodiment, the processing content for the substrate 2 is a screen printing operation in which the paste Pst is printed on the substrate 2 by the screen printing device 13, but this is another operation, for example, the substrate by the component mounting device 15. 2 may be a component mounting operation for mounting a component. When the processing content for the substrate 2 is a component mounting operation, the substrate support path 61 provided in the component mounting apparatus 15 shown in the above embodiment is provided in the transport unit 44 in the above embodiment as a substrate support unit. What is necessary is just to set it as the structure which replaced 62 with the board | substrate lowering member 47. FIG.

  Provided are a mounting board manufacturing system capable of reducing the man-hours required for replacing a board lowering member and improving the productivity of the mounting board, and a method for installing the board lowering member in the mounting board manufacturing system.

1 mounting substrate manufacturing system 2 substrate 32 mask (substrate processing section)
33 Squeegee head (substrate processing section)
44 Conveying part 46 Lower receiving member installation part 46a Concave part 47 Substrate lowering member 47a Convex part 47M First magnet 48 Elevating mechanism (lower receiving member installation part elevating mechanism)
71 1st carrier 71M 2nd magnet 72 2nd carrier

Claims (8)

A transport unit for transporting a transport object to a work position;
A lower receiving member installation section provided below the transport section;
A substrate lower receiving member that is detachably installed in the lower receiving member setting portion and supports a lower surface of the substrate as the transfer object transferred to the work position by the transfer portion;
A substrate processing unit for performing a predetermined process on the upper surface of the substrate whose lower surface is supported by the substrate receiving member;
A first carrier that holds the substrate receiving member as the transport object on a lower surface;
The transport unit transports the first carrier holding the substrate receiving member to the working position to position the substrate receiving member at the working position,
The mounting substrate manufacturing method, wherein the substrate receiving member positioned at the work position is fixed to the receiving member installation portion by a magnetic force of a first magnet provided on a lower surface of the substrate receiving member. system.   A second magnet is provided on the lower surface of the first carrier, and the substrate receiving member is held on the lower surface of the first carrier by the magnetic force of the second magnet. The mounting board manufacturing system according to claim 1.   A lower receiving member installation portion elevating mechanism that elevates and lowers the lower receiving member installation portion, and the lower receiving member installation portion elevating mechanism raises the lower receiving member installation portion and is held by the first carrier. A substrate lower receiving member is fixed to the lower receiving member installing portion, and when the substrate lower receiving member is fixed to the lower receiving member installing portion, the lower receiving member installing portion is lowered to lower the substrate lower receiving member. The mounting board manufacturing system according to claim 1, wherein the mounting board manufacturing system is installed in a receiving member installation section.   A lower receiving member installation portion elevating mechanism for elevating the lower receiving member installation portion is provided, and the lower receiving member installation portion elevating mechanism raises the lower receiving member installation portion so that the substrate lower receiving member becomes a second carrier. The substrate receiving member is removed from the lower receiving member installation portion by lowering the lower receiving member installation portion when the substrate lowering member is held by the second carrier. The mounting board manufacturing system in any one of 1-3.   5. The mounting substrate manufacturing method according to claim 4, wherein the transport unit transports the second carrier holding the substrate lower receiving member to unload the substrate lower receiving member from the work position. system.   The mounting substrate manufacturing system according to claim 1, wherein the substrate receiving member is adsorbed while supporting a lower surface of the substrate positioned at the working position by the transport unit.   A convex portion provided on one of the substrate lower receiving member and the lower receiving member installing portion is provided on either one of the substrate lower receiving member and the lower receiving member installing portion. The mounting substrate manufacturing system according to claim 1, wherein the substrate lower receiving member is installed in the lower receiving member installation portion in a state of being fitted with the concave portion. A conveyance unit that conveys a conveyance object to a work position, a lower receiving member installation unit provided below the conveyance unit, and a removably installed unit on the lower reception member installation unit. A substrate receiving member that supports the lower surface of the substrate as the transferred object, a substrate processing unit that performs a predetermined process on the upper surface of the substrate whose lower surface is supported by the substrate receiving member, and the transfer object A mounting method for a substrate receiving member in a mounting substrate manufacturing system comprising: a first carrier that holds the substrate receiving member as a lower surface;
A substrate lowering member transporting step of positioning the substrate lowering member at the working position by transporting the first carrier holding the substrate lowering member to the working position by the transporting unit;
And a substrate lower member installation step of fixing the substrate lower member positioned at the working position to the lower receiver member installation portion by a magnetic force of a first magnet provided on a lower surface of the substrate lower member. An installation method of a substrate receiving member in a mounting substrate manufacturing system.

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