JP6448898B2 - Component holding head of component mounter - Google Patents

Description

The present invention relates to a component holding head of a component mounter for mounting components on a substrate.

  In general, a component mounter is configured to pick up and hold a component from a component supply unit, transfer it onto a substrate, and mount it at a predetermined position on the substrate by a component holding head having a holder such as a nozzle. Yes.

  As one of such component holding heads, there is known a rotary type component holding head in which a rotary head having a plurality of holders is attached to the head body so as to be rotatable around a vertical axis. Discloses a rotary type component holding head provided with a non-contact type energy data transmission means (see paragraphs 0034 to 0036 and FIG. 1).

  Such a component holding head includes a large number of electronic components in order to receive control signals from the head body and control the operation of nozzles and the like and to exchange data with the head body. In general, these electronic components are mounted on a circuit board. In addition, since there are many electronic components to be mounted on the circuit board, a plurality of circuit boards are often required. Conventionally, when a plurality of circuit boards are required as described above, for example, as shown in FIG. 5, a circuit board structure in which a plurality of circuit boards 101 to 103 are arranged in the vertical direction is generally used.

  In such a circuit board structure in which a plurality of circuit boards are arranged in the vertical direction, the circuit boards 101 to 103 are spaced apart in the vertical direction so that electronic components mounted on the circuit boards 101 to 103 do not interfere with each other. In the circuit board structure of FIG. 5, the circuit boards 101 to 103 are arranged at intervals in the vertical direction by using a plurality of support bars 104 and inter-board connectors 105. However, this circuit board structure requires the support bar 104 in addition to the circuit boards 101 to 103, leading to an increase in the size of the circuit board structure. Further, when the support bar 104 is provided by penetrating the circuit boards 101 to 103 as shown in FIG. 5, an effective area (hereinafter simply referred to as “effective area”) on which electronic components can be mounted on the circuit boards 101 to 103 is small. Become. Further, in the circuit board structure of FIG. 5, the circuit boards 101 to 103 need to be connected and electrically connected by the board-to-board connector 105. The board-to-board connector 105 also reduces the effective area of the circuit boards 101 to 103. Is a factor. Thus, if the effective area of the circuit boards 101 to 103 is reduced, the number of circuit boards must be increased in order to ensure the necessary effective area, and the circuit board structure is further increased in size.

JP-T-2006-515715

  The problem to be solved by the present invention is to reduce the size of the circuit board structure of a component mounter having a plurality of circuit boards.

According to one aspect of the present invention, the following component holding head for a component mounter is provided.
A component holding head of a component mounter for mounting components on a board,
A fixedly arranged head body, a rotary head attached to the head body so as to be rotatable around a vertical axis , power is transmitted from the head body to the rotary head in a non-contact manner, and the head body and the head body A non-contact transmission device that transmits signals in a non -contact manner with a rotary head, and a circuit board structure disposed on the rotary head side,
The circuit board structure includes: a flat first circuit board; a flat second circuit board disposed above the first circuit board; and the first circuit board and the first circuit board. A third circuit board comprising a flexible circuit board disposed to surround a space between the second circuit board and electrically connected to the first circuit board; And
The first circuit board and the second circuit board are arranged in parallel and have the same outer shape in plan view, and the third circuit board is the first circuit board and the second circuit. It is arranged along the outline of the board, and further, the vertical axis is inserted in the center part of the first circuit board and the second circuit board,
The non-contact transmission device is wound around the first core, a first core disposed around the vertical axis, a second core disposed below the first core around the vertical axis, and the first core. A first coil for power transmission; a second coil for power transmission wound around the second core; a third coil for signal transmission wound around the first core; A fourth coil for signal transmission wound around two cores, and the vertical axis is inserted through the center of each of the first core and the second core,
The circuit board structure is rotatable about the vertical axis integrally with the second core;
The component holding head of the component mounting machine, wherein the outer shapes of the contactless transmission device and the circuit board structure are circles having the same size in plan view.

  In the present invention, the first circuit board and the first circuit board are arranged by arranging the third circuit board made of the flexible circuit board so as to surround the space between the flat first circuit board and the second circuit board. The space between the two circuit boards is effectively used as the arrangement space for the third circuit board. Thereby, the number of flat circuit boards arranged at intervals can be reduced, and the circuit board structure can be reduced in size. For example, in the circuit board structure of FIG. 5, three flat circuit boards are used, but according to the present invention, one of them is a third circuit board made of a flexible circuit board. The number of circuit boards can be reduced to two, and the circuit board structure can be miniaturized especially in the vertical dimension.

It is a figure which shows notionally the structure of the component holding head of the component mounting machine to which the circuit board structure based on this invention is applied. The structure of the circuit board structure used in FIG. 1 is shown, (a) is its perspective view, and (b) is a developed view. It is an expanded view which shows the other Example of the circuit board structure based on this invention. It is a front view which shows the reference example of the circuit board structure which concerns on this invention. It is a figure which shows notionally the structure of the circuit board structure of the conventional component mounting machine.

  Hereinafter, an embodiment of the present invention will be described based on an example in which a circuit board structure according to the present invention is applied to a component holding head of a component mounter. FIG. 1 is a diagram conceptually showing the configuration of a component holding head of the component mounter.

The component holding head shown in FIG. 1 picks up and holds an electronic component from a component supply unit in a component mounting machine, transfers it to the printed circuit board, and mounts it on a predetermined position on the printed circuit board. The component holding head includes a head body 10 that is fixedly arranged, a rotary head 30 that is rotatably attached to the head body 10 around a vertical axis 20, and a non-contact type from the head body 10 to the rotary head 30. A non-contact transmission device 40 that transmits electric power in a non-contact manner between the head main body 10 and the rotary head 30 and a circuit board structure 50 disposed on the rotary head 30 side are provided.

  The head main body 10 includes a servo motor 11 that rotates the rotary head 30 and a servo motor 12 that controls the raising and lowering of the nozzles 31 arranged in the rotary head 30. Although omitted in FIG. 1, the head main body 10 also incorporates a main controller that controls the rotation operations of the servo motors 11 and 12 and the rotary head 30.

  The rotary head 30 has a barrel shape whose outer shape is substantially cylindrical, and the vertical shaft 20 passes through the center thereof. The rotation of the servo motor 11 causes the rotary head 30 to rotate in the R direction around the vertical axis 20 with respect to the head body 10. The rotary head 30 is provided with a plurality of nozzles 31 as holders for holding electronic components along the circumferential direction. Each nozzle 31 can be rotated in the T direction around the axis by an actuator (not shown) made of a servo motor or the like built in the rotary head 30, and can be moved in the Z direction along the axis by the servo motor 12. It is attached to.

  The non-contact transmission device 40 includes a first core 41 and a second core 42, a first coil 43 and a second coil 44 as coils for power transmission, and a third coil 45 and a fourth coil as coils for signal transmission. And a coil 46. The first core 41 is integrally disposed on the head body 10 side, and the second core 42 is integrally disposed on the rotary head 30 side. The first core 41 and the second core 42 have the same shape and are opposed to each other with a certain gap G so as to be vertically symmetrical.

  In such a configuration, the non-contact transmission device 40 transmits electric power from the head body 10 to the rotary head 30 in a non-contact manner by electromagnetic induction between the first coil 43 and the second coil 44, and the third By electromagnetic induction between the coil 45 and the fourth coil 46, a signal is transmitted between the head body 10 and the rotary head 30 in a non-contact manner by electromagnetic induction. In addition to the electromagnetic induction method, an electric field induction method can be adopted as a method for transmitting power and signals in a non-contact manner.

  Next, the configuration of the circuit board structure 50 will be described. 2 shows the configuration of the circuit board structure 50 used in FIG. 1, wherein (a) is a perspective view and (b) is a developed view.

  The circuit board structure 50 includes a first circuit board 51, a second circuit board 52, and a third circuit board 53.

  The first circuit board 51 and the second circuit board 52 are both flat and are made of, for example, a glass epoxy board. In the present embodiment, the first circuit board 51 and the second circuit board 52 have the same outer shape (circular shape) in plan view, and are arranged in parallel in the vertical direction. The first circuit board 51 and the second circuit board 52 are formed with circular through holes 51a and 52a through which the vertical shaft 20 as the rotation center axis of the rotary head 30 described in FIG. Yes. The centers of the through holes 51 a and 52 a are located on the central axis of the vertical shaft 20, and the diameter is slightly larger than the diameter of the vertical shaft 20. By inserting the vertical shaft 20 into the through holes 51 a and 52 a, the circuit board structure 50 can rotate around the vertical shaft 20 together with the rotary head 52.

  The third circuit board 53 is formed of a flexible circuit board (hereinafter referred to as “FPC”), and is disposed so as to surround the space between the first circuit board 51 and the second circuit board 52. In the present embodiment, the first circuit board 51 and the second circuit board 52 are arranged in parallel as described above and have the same outer shape (circular shape) in plan view, so that the third circuit The substrate 53 is arranged in a cylindrical shape so as to follow the outline of the first circuit substrate 51 and the second circuit substrate 52. The third circuit board 53 is electrically connected to the first circuit board 51 and the second circuit board 52. In this embodiment, one end of the third circuit board 53 is electrically connected to the first circuit board 51 through the inter-board connector 54a, and the other end of the third circuit board 53 is connected through the inter-board connector 54b. And electrically connected to the second circuit board 52. In order to protect the third circuit board 53 made of FPC, a resin case can be provided so as to surround the third circuit board 53.

  As described above, in the circuit board structure 50, the third circuit board 53 is disposed so as to surround the space between the first circuit board 51 and the second circuit board 52, whereby the first circuit The space between the board 51 and the second circuit board 52 is effectively used as the arrangement space for the third circuit board 31. As a result, an effective area equivalent to that of the circuit board structure of FIG. 5 using three flat circuit boards can be obtained, and the circuit board structure has a particularly vertical dimension as compared with the circuit board structure of FIG. Can be miniaturized. Since the first circuit board 51 and the second circuit board 52 are flat, large electronic components are mounted on these flat circuit boards, and the third circuit board 32 has relatively small electronic components. If all the electronic components are mounted, the electronic components can be mounted without any problem.

  FIG. 3 is a development view showing another embodiment of the circuit board structure according to the present invention. That is, FIG. 3 shows a state in which the circuit board structure is developed as in FIG.

  In the circuit board structure 50 of FIG. 2, the first circuit board 51, the second circuit board 52, and the third circuit board 53 are electrically connected by the inter-board connectors 54a and 54b. In the structure 60, in order to eliminate the board-to-board connector, the first circuit board 61, the second circuit board 62, and the third circuit board 63 are constituted by one continuous FPC, and the circuit board structure is formed by folding this. To form. That is, the first circuit board 61 and the second circuit board 62 are folded at a right angle with respect to the third circuit board 63, and the third circuit board 63 is folded into a cylindrical shape, which is the same as FIG. A circuit board structure 60 having a shape can be obtained.

  As described above, in the circuit board structure 60 of FIG. 3, the board-to-board connectors for electrically connecting the circuit boards are unnecessary, and therefore, the board-to-board connectors 54a and 54b are occupied in the circuit board structure 50 of FIG. Electronic components can also be mounted in the area, and as a result, the circuit board structure can be further miniaturized.

FIG. 4 is a front view showing a reference example of the circuit board structure according to the present invention.

  In the circuit board structure 70 of FIG. 4A, the second circuit board 72 is smaller than the first circuit board 71, and the third circuit board 73 made of FPC extends along the outline of the second circuit board 72. This is an example of a cylindrical arrangement. 4B is larger in the second circuit board 82 than the first circuit board 81, and the third circuit board 83 made of FPC is replaced with the first circuit board 81 and the second circuit board 82. This is an example in which the circuit board 82 is arranged in an inverted truncated cone shape along the outline of the circuit board 82. However, considering the ease of manufacturing the circuit board structure, stability, etc., it is preferable to use a circuit board structure having a shape as shown in FIG. In FIGS. 4A and 4B, an inter-board connector for electrically connecting circuit boards is omitted.

10 Head body 11, 12 Servo motor 20 Vertical axis 30 Rotary head 31 Nozzle (holder)
40 Non-contact transmission device 41 1st core 42 2nd core 43 1st coil 44 2nd coil 45 3rd coil 46 4th coil 50, 60, 70, 80 Circuit board structure 51, 61, 71, 81 1st circuit Boards 52, 62, 72, 82 Second circuit boards 53, 63, 73, 83 Third circuit boards 54a, 54b Inter-board connectors

Claims (2)

A component holding head of a component mounter for mounting components on a board,
A fixedly arranged head body, a rotary head attached to the head body so as to be rotatable around a vertical axis , power is transmitted from the head body to the rotary head in a non-contact manner, and the head body and the head body A non-contact transmission device that transmits signals in a non -contact manner with a rotary head, and a circuit board structure disposed on the rotary head side,
The circuit board structure includes: a flat first circuit board; a flat second circuit board disposed above the first circuit board; and the first circuit board and the first circuit board. A third circuit board comprising a flexible circuit board disposed to surround a space between the second circuit board and electrically connected to the first circuit board; And
The first circuit board and the second circuit board are arranged in parallel and have the same outer shape in plan view, and the third circuit board is the first circuit board and the second circuit. It is arranged along the outline of the board, and further, the vertical axis is inserted in the center part of the first circuit board and the second circuit board,
The non-contact transmission device is wound around the first core, a first core disposed around the vertical axis, a second core disposed below the first core around the vertical axis, and the first core. A first coil for power transmission; a second coil for power transmission wound around the second core; a third coil for signal transmission wound around the first core; A fourth coil for signal transmission wound around two cores, and the vertical axis is inserted through the center of each of the first core and the second core,
The circuit board structure is rotatable about the vertical axis integrally with the second core;
The component holding head of the component mounting machine, wherein the outer shapes of the contactless transmission device and the circuit board structure are circles having the same size in plan view. 2. The component holding head of the component mounting machine according to claim 1 , wherein the first circuit board, the second circuit board, and the third circuit board are made of a single flexible circuit board.

Images