JP6451206B2 - Probe needle, probe card, probe needle manufacturing method, and probe needle regeneration method - Google Patents

Description

  The present invention relates to a probe needle, a probe card, a probe needle manufacturing method, and a probe needle regeneration method.

  Many semiconductor devices are formed by forming a semiconductor circuit on the surface of a silicon wafer. When manufacturing a semiconductor device, a semiconductor circuit is two-dimensionally formed on the surface of a silicon wafer, and then the semiconductor circuit formed on the surface of the silicon wafer is tested via a probe card or the like.

  When testing a semiconductor circuit formed on the surface of a silicon wafer, a probe needle in a probe card or the like is brought into contact with an electrode pad formed on the surface of the silicon wafer so that the electrode pad and the probe needle are It is performed in an electrically connected state. Specifically, the probe needle and the electrode pad connected to the semiconductor circuit are electrically connected, and an electric signal is input to the semiconductor circuit via the probe needle.

  In general, the electrode pad is made of aluminum (Al) or the like, and when the probe needle is brought into contact with the electrode pad, the oxide film naturally formed on the surface of the electrode pad is scraped off at the tip of the probe needle. Expose the aluminum metal surface. Thus, the probe needle is brought into contact with the electrode pad from which the metal surface of aluminum is exposed, and the semiconductor circuit formed on the surface of the silicon wafer by being electrically connected is tested.

JP 2001-165955 A Japanese Patent Laid-Open No. 10-227811

  By the way, when the oxide film formed on the surface of the electrode pad is scraped with the probe needle, a part of the scraped oxide film may adhere to the tip of the probe needle. Since the oxide film is highly insulating, if the oxide film remains attached to the tip of the probe needle and is brought into contact with the electrode pad, the electrical contact between the electrode pad and the probe needle becomes poor, and the semiconductor circuit An accurate test may not be possible.

  For this reason, every time the probe needle is used for a predetermined period, the tip of the probe needle is polished (cleaned) to remove the oxide film adhering to the tip of the probe needle, and the electrode pad, probe needle, The electrical contact is kept stable.

  However, since the semiconductor circuit cannot be inspected while the probe tip of the probe needle is being polished, the operating rate of the inspection apparatus is reduced, and the inspection throughput in the semiconductor circuit is reduced. Even before the predetermined period has elapsed, if the oxide film is attached to the tip of the probe needle, an accurate test of the semiconductor circuit cannot be performed.

  Therefore, there is a need for a probe needle that can stably maintain electrical contact between the electrode pad and the probe needle without polishing the tip of the probe needle.

  According to one aspect of the present embodiment, a probe needle to be brought into contact with an electrode pad has a probe needle main body portion, a tip portion connected to the probe needle main body portion and in contact with the electrode pad, The tip portion is formed of a plurality of metal fine particles, and in the tip portion, the vicinity of the connection portion connected to the probe needle main body portion is more than the vicinity of the contact end in contact with the electrode pad. It is characterized by a strong bonding strength between metal fine particles.

  According to the disclosed probe needle, electrical contact between the electrode pad and the probe needle can be stably maintained without performing needle tip polishing.

Structure diagram of the probe needle in the first embodiment Explanatory drawing (1) of the probe needle in the first embodiment The flowchart of the manufacturing method of the probe needle in a 1st embodiment Structure diagram of the probe card in the first embodiment Explanatory drawing of the probe card in the first embodiment Explanatory drawing (2) of the probe needle in 1st Embodiment Structural diagram of a probe needle in the second embodiment Explanatory drawing (1) of the regeneration method of the probe needle in 3rd Embodiment Explanatory drawing (2) of the regeneration method of the probe needle in 3rd Embodiment Flowchart of the probe needle regeneration method in the third embodiment

  The form for implementing is demonstrated below. In addition, about the same member etc., the same code | symbol is attached | subjected and description is abbreviate | omitted.

[First Embodiment]
(Probe needle)
The probe needle in the first embodiment will be described. As shown in FIG. 1, the probe needle in the present embodiment is formed by a probe needle main body 11 and a tip portion 20, and the tip portion 20 is formed by sintering metal fine particles 21. . 1A is a structural diagram of the probe needle 10 according to the present embodiment, and FIG. 1B is an enlarged view of a portion surrounded by an alternate long and short dash line 1A in FIG. FIG. 1C is a bottom view of the distal end portion 20 of the probe needle 10.

  The probe needle 10 in the present embodiment has a bent portion 12 in the probe needle main body portion 11, and the length L1 from the bent portion 12 to the contact end 20a of the tip portion 20 that is the tip of the probe needle 10 is: It is formed to be 250 μm to 600 μm. Further, the length of the tip portion 20, that is, the length L2 from the connecting portion 20b to the probe needle main body 11 to the contact end 20a of the tip portion 20 is formed to be 100 μm to 300 μm. Further, the width W of the contact end 20a at the distal end portion 20 of the probe needle 10 is formed to be about 15 μm. In the present embodiment, the tip portion 20 of the probe needle 10 is formed to have the same width from the contact end 20a to the connection portion 20b.

  The tip portion 20 of the probe needle 10 is formed by sintering a plurality of metal fine particles 21, and the metal fine particles 21 are formed of, for example, a metal material in which Re (rhenium) is added to W (tungsten). ing. In the present embodiment, the bonding strength between the metal fine particles 21 is stronger in the vicinity of the connection portion 20b with the probe needle body 11 than in the vicinity of the contact end 20a of the tip portion 20.

  As described above, the probe needle 10 in the present embodiment is formed by the tip portion 20 sintering the metal fine particles 21. Therefore, as shown in FIG. 2, when the contact end 20 a of the tip portion 20 of the probe needle 10 is brought into contact with the surface of the electrode pad 120 and the oxide film formed on the surface of the electrode pad 120 is scraped off, the probe Part of the metal fine particles 21 at the tip portion 20 of the needle 10 is also peeled off. As described above, when the metal fine particles 21 at the contact end 20 a of the tip portion 20 of the probe needle 10 are partially peeled off, new metal fine particles 21 are exposed at the contact end 20 a of the tip portion 20 of the probe needle 10. As described above, since the new metal fine particles 21 are exposed at the contact end 20a of the tip portion 20 of the probe needle 10, the electrical contact between the electrode pad 120 and the probe needle 10 is stably maintained. Therefore, the oxide film does not adhere to the tip portion 20 of the probe needle 10, and the semiconductor circuit can be accurately tested without polishing the probe tip, thereby improving the throughput of the semiconductor circuit test. Can be made. In the present embodiment, since the tip portion 20 of the probe needle 10 is formed to have the same width from the contact end 20a to the connection portion 20b, the metal fine particles 21 at the contact end 20a are partially peeled off and the tip. Even if the portion 20 is shortened, the width of the contact end 20a in contact with the electrode pad 120 does not change without increasing the width, and thus the reduction in the allowable amount of alignment accuracy between the probe needle 10 and the electrode pad 120 is suppressed. be able to. FIG. 2 (a) is a diagram showing how the metal fine particles 21 are removed from the tip portion 20 of the probe needle 10 according to the present embodiment, and FIG. 2 (b) is an enlarged view of FIG. 2 (a). FIG.

(Probe needle manufacturing method)
Next, a method for manufacturing the probe needle will be described with reference to FIG.

  First, as shown in step 102 (S102), the probe needle main body 11 is prepared. The probe needle main body 11 is formed of an alloy obtained by adding Re to W.

  Next, as shown in step 104 (S104), a plurality of metal fine particles 21 for forming the tip portion 20 are placed together with the probe needle main body 11 in a mold (not shown) for forming the probe needle 10. At this time, the metal fine particles 21 used are formed of a metal material obtained by adding Re to W, and the particle size of the metal fine particles 21 is 0.05 μm or more and 1 μm or less.

  Next, as shown in step 106 (S106), the tip portion 20 of the probe needle 10 is formed by sintering the metal fine particles 21. At this time, the temperature from the contact end 20a of the tip portion 20 toward the connection portion 20b is set to 1000 ° C. to 1200 ° C. near the contact end 20a of the tip portion 20 and from 1800 ° C. to 2200 ° C. near the connection portion 20b. The metal fine particles 21 are sintered by heating so as to generate a gradient. The reason why the sintering temperature in the vicinity of the connecting portion 20b is higher than that in the vicinity of the contact end 20a of the tip portion 20 is that the tip portion 20 is joined to the probe needle body 11 in the vicinity of the connecting portion 20b rather than the contact end 20a. This is to increase the strength. When the sintering temperature is high, the bonding strength between the metal fine particles 21 can be increased. Therefore, in the probe needle 10 according to the present embodiment, the bonding strength between the metal fine particles 21 increases from the contact end 20a of the tip portion 20 to the connecting portion 20b, and is higher than the vicinity of the contact end 20a of the tip portion 20. In the vicinity of the connecting portion 20b with the probe needle main body 11, the bonding strength between the metal fine particles 21 can be increased. Thus, the vicinity of the connection portion 20b with the probe needle body 11 is connected from the contact end 20a by increasing the bonding strength between the metal fine particles 21 rather than the vicinity of the contact end 20a of the tip portion 20. Even if the portion 20b has the same width, the metal fine particles 21 are gradually peeled off from the contact end 20a of the tip end portion 20. As a sintering method for forming the probe needle 10 in this way, a method of heating by irradiating with changing the intensity of the laser beam can be mentioned. Specifically, by increasing the intensity of the laser light applied to the vicinity of the connection portion 20b rather than the vicinity of the contact end 20a of the tip portion 20, the contact end 20a of the tip portion 20 toward the connection portion 20b. Sintering with a temperature gradient that gradually increases in temperature.

  Next, as shown in step 108 (S108), the probe needle 10 is removed from the mold for forming the probe needle 10. Thereby, the probe needle 10 having the tip portion 20 formed by the sintered metal fine particles 21 can be produced.

  In the above description, the case where the tip portion 20 of the probe needle 10 is formed of metal fine particles obtained by adding Re to W has been described. However, the tip portion 20 of the probe needle 10 may be formed of other materials. .

  Specifically, the tip portion 20 of the probe needle 10 may be formed using metal fine particles 21 of a metal material in which Cu (copper) and Ag (silver) are added to Pd (palladium). At this time, the tip portion is heated and sintered by generating a temperature gradient so that it is 450 ° C. to 550 ° C. near the contact end 20a of the tip portion 20 and 700 ° C. to 900 ° C. near the connecting portion 20b. 20 is formed.

  Further, the tip portion 20 of the probe needle 10 may be formed using metal fine particles 21 of a metal material containing Pt (platinum). At this time, the tip portion is heated and sintered by generating a temperature gradient so that the temperature is 500 ° C. to 700 ° C. near the contact end 20a of the tip portion 20 and 800 ° C. to 1000 ° C. near the connecting portion 20b. 20 is formed.

  Further, the tip portion 20 of the probe needle 10 may be formed using metal fine particles 21 of a metal material containing Rh (rhodium). At this time, the tip end portion 20 is heated and sintered by generating a temperature gradient so that the contact end 20a of the tip end portion 20 is 550 ° C. to 750 ° C. and the vicinity of the connecting portion 20b is 1000 ° C. to 1200 ° C. 20 is formed.

  Further, the tip portion 20 of the probe needle 10 may be formed using metal fine particles 21 of a metal material containing Ir (iridium). In this case, the tip portion is heated and sintered by generating a temperature gradient so that it is 700 ° C. to 900 ° C. near the contact end 20a of the tip portion 20 and 1100 ° C. to 1300 ° C. near the connecting portion 20b. 20 is formed.

(Probe card)
Next, the probe card in the present embodiment will be described with reference to FIG. As shown in FIG. 4, the probe card 100 in the present embodiment is provided with a plurality of probe needles 10. In the present embodiment, the tip of the probe needle 10 of the probe card 100 corresponding to each electrode pad 120 is brought into contact with the electrode pad 120 formed on the surface of the silicon wafer 110 to be formed on the silicon wafer 110. Test the existing semiconductor circuit. FIG. 5 shows the state of the upper surface when each probe needle 10 is in contact with the electrode pad 120 formed on the silicon wafer 110.

  In the present embodiment, as shown in FIG. 6, the metal fine particles 21 can be easily peeled off by polishing the side surface of the tip portion 20 of the probe needle 10 near the contact end 20a. The contact end 20a of the portion 20 can be easily sharpened. FIG. 6A shows a state in which the contact end 20a of the tip portion 20 is sharpened by polishing in the probe needle 10 according to the present embodiment, and FIG. 6B shows the state shown in FIG. It is an enlarged view of the part enclosed with the dashed-dotted line 6A.

[Second Embodiment]
Next, a second embodiment will be described. In the probe needle in the present embodiment, the tip portion of the probe needle is formed by sintering metal fine particles of two or more different materials. Specifically, as shown in FIG. 7, the tip portion 220 of the probe needle 210 is formed by sintering a plurality of first metal particles 221 and a plurality of second metal particles 222. FIG. 7A is a structural diagram of the probe needle 210 in the present embodiment, and FIG. 7B is an enlarged view of a portion surrounded by an alternate long and short dash line 7A in FIG. 7A.

  In the present embodiment, the first metal fine particles 221 and the second metal fine particles 222 are different in the composition ratio of Re added to W, and the first metal fine particles 221 and the second metal fine particles 221 are different. The size of the fine particles 222 is also different. For example, the particle diameter of the first metal fine particles 221 is approximately 0.5 μm, and the particle diameter of the second metal fine particles 222 is approximately 0.1 μm. In the probe needle 210 in the present embodiment, the tip portion 220 is connected to the probe needle main body 11 as in the first embodiment.

  As described above, when the tip portion 220 of the probe needle 210 is formed by the first metal fine particles 221 and the second metal fine particles 222 having different particle diameters, the particle diameter of the first metal fine particles 221 having a large particle diameter is reduced. Small second metal fine particles 222 enter. As a result, as shown in FIG. 7B, at the tip portion 220 of the probe needle 210, the layer formed by the first metal fine particles 221 and the layer formed by the second metal fine particles 222 are alternately arranged. It is formed. In the present embodiment, the materials are combined such that the bonding strength between the first metal fine particles 221 and the second metal fine particles 222 is weaker between different materials than the same. . As a result, each layer formed by the first metal fine particles 221 or each layer formed by the second metal fine particles 222 is easily peeled off, so that the peeling effect at the tip portion 220 of the probe needle 210 can be further enhanced.

  In the above description, the case where the tip portion 220 of the probe needle 210 is formed of two types of metal fine particles having different composition ratios and particle sizes has been described. However, in the present embodiment, there are three types having different composition ratios and particle sizes. The tip portion 220 may be formed of the above metal fine particles.

  The contents other than the above are the same as in the first embodiment.

[Third Embodiment]
Next, a third embodiment will be described. By using the probe needle 10 in the first embodiment, the metal fine particles 21 at the tip portion 20 are peeled off, and the length of the tip portion 20 is shortened. The present embodiment is a method for regenerating a probe needle in which, in the probe needle from which the metal fine particles 21 have been peeled, the metal fine particles 21 that have been peeled off are supplemented to regenerate the tip portion 20 of the probe needle 10.

  Specifically, by using the probe needle 10 shown in FIG. 1, the tip portion 20 of the probe needle 10 is peeled off from the contact end 20a, and the length of the tip portion 20 is shortened as shown in FIG. In the present embodiment, as shown in FIG. 9, a new tip portion 20c is joined to the tip portion 20 thus shortened so as to have the same length as that of the first tip portion 20. Can be played. 8A is a structural diagram of the probe needle 10 in which the length of the tip portion 20 is shortened, and FIG. 8B is a diagram of the portion surrounded by the alternate long and short dash line 8A in FIG. 8A. It is an enlarged view. FIG. 9A is a structural diagram of the probe needle 10 in which the tip portion 20 is regenerated in the present embodiment, and FIG. 9B is a portion surrounded by an alternate long and short dash line 9A in FIG. 9A. FIG.

  This embodiment will be described based on FIG.

  First, as shown in step 202 (S202), a plurality of metal fine particles 21 for forming the tip portion 20c are put into the mold for forming the probe needle 10 together with the probe needle 10 whose tip portion 20 is shortened. At this time, the metal fine particles 21 used are the same as the metal fine particles 21 forming the shaved tip portion 20, and are formed of, for example, a metal material obtained by adding Re to W.

  Next, as shown in step 204 (S204), the metal fine particles 21 are sintered to form the tip portion 20c and join the tip portion 20 of the probe needle 10 that has been scraped. The temperature in this sintering is 1000 ° C to 1200 ° C.

  Next, as shown in step 206 (S206), the probe needle 10 sintered from the mold for forming the probe needle 10 is removed. Thereby, the probe needle 10 having the tip portion 20 formed by the sintered metal fine particles 21 can be produced.

  Through the above steps, the tip portion 20c formed of the new metal fine particles 21 is joined to the tip portion 20 of the probe needle 10 that has been scraped, and the length of the tip portion 20 of the probe needle 10 is regenerated to the same length as the initial length. can do.

  Although the embodiment has been described in detail above, it is not limited to the specific embodiment, and various modifications and changes can be made within the scope described in the claims.

In addition to the above description, the following additional notes are disclosed.
(Appendix 1)
In the probe needle that contacts the electrode pad,
A probe needle body,
A tip portion that is connected to the probe needle body portion and contacts the electrode pad;
Have
The tip portion is formed of a plurality of metal fine particles,
The probe needle characterized in that the bonding strength between the metal fine particles is higher in the vicinity of the connection portion connected to the probe needle main body portion in the distal end portion than in the vicinity of the contact end in contact with the electrode pad.
(Appendix 2)
In the probe needle that contacts the electrode pad,
A probe needle body,
A tip portion that is connected to the probe needle body portion and contacts the electrode pad;
Have
The probe needle is characterized in that the tip portion is formed by sintering a plurality of metal fine particles.
(Appendix 3)
3. The probe needle according to appendix 1 or 2, wherein, in the tip portion, a connecting portion connected to the probe needle main body portion and a contact end in contact with the electrode pad are formed with the same width.
(Appendix 4)
The tip portion includes a plurality of first metal particles and a plurality of second metal particles,
4. The probe needle according to any one of appendices 1 to 3, wherein the first metal fine particles and the second metal fine particles have different compositions or composition ratios.
(Appendix 5)
The probe needle according to appendix 4, wherein the first metal fine particles and the second metal fine particles have different particle sizes.
(Appendix 6)
The probe needle according to any one of appendices 1 to 5, wherein the metal fine particles forming the tip portion are peeled off by bringing the tip portion into contact with the electrode pad.
(Appendix 7)
A probe card comprising a plurality of probe needles according to any one of appendices 1 to 6.
(Appendix 8)
In the method of manufacturing the probe needle to be brought into contact with the electrode pad,
Putting a probe needle main body part and a plurality of metal fine particles forming the tip part of the probe needle into a mold for forming a probe needle;
Forming a tip portion connected to the probe needle body by heating and sintering the metal fine particles; and
A method of manufacturing a probe needle, comprising:
(Appendix 9)
The tip portion is connected at the probe needle main body portion and the connection portion,
The probe needle manufacturing method according to appendix 8, wherein the step of forming the tip portion is performed by sintering the connection portion at a temperature higher than that of the contact end contacting the electrode pad at the tip portion. Method.
(Appendix 10)
A probe needle main body portion and a tip portion connected to the probe needle main body portion, wherein the tip portion is formed by sintering a plurality of metal fine particles, and the tip portion is an electrode pad. When the metal fine particles in the tip portion are partly peeled by contacting
Putting a probe needle in which the metal fine particles in the tip portion are partially peeled into the mold forming the probe needle and the metal fine particles forming the tip portion;
Heating and sintering the metal fine particles to make up for the partially peeled portion and forming a new tip portion; and
A method for regenerating a probe needle, comprising:

DESCRIPTION OF SYMBOLS 10 Probe needle 11 Probe needle main-body part 12 Bending part 20 Tip part 20a Contact end 20b Connection part 21 Metal fine particle 120 Electrode pad

Claims (11)

In the probe needle that contacts the electrode pad,
A probe needle body,
A tip portion that is connected to the probe needle body portion and contacts the electrode pad;
Have
The tip portion is formed of a plurality of metal fine particles,
The probe needle characterized in that the bonding strength between the metal fine particles is higher in the vicinity of the connection portion connected to the probe needle main body portion in the distal end portion than in the vicinity of the contact end in contact with the electrode pad. The bonding strength of the metal fine particles is a probe needle according to claim 1, characterized in Rukoto a strongly toward the connecting portion from the contact end.   3. The probe needle according to claim 1, wherein, in the tip portion, the probe needle is formed with the same width from a connection portion connected to the probe needle main body portion to a contact end in contact with the electrode pad. . The tip portion includes a plurality of first metal particles and a plurality of second metal particles,
4. The probe needle according to claim 1, wherein the first metal fine particles and the second metal fine particles have different compositions or composition ratios.   The probe needle according to claim 4, wherein the first metal fine particles and the second metal fine particles have different particle sizes.   The probe needle according to claim 1, wherein the metal fine particles forming the tip portion are peeled off by bringing the tip portion into contact with the electrode pad.   A probe card comprising a plurality of probe needles according to claim 1. In the method of manufacturing the probe needle to be brought into contact with the electrode pad,
Putting a probe needle main body part and a plurality of metal fine particles forming the tip part of the probe needle into a mold for forming a probe needle;
Forming a tip portion connected to the probe needle body by heating and sintering the metal fine particles; and
A method of manufacturing a probe needle, comprising: The tip portion is connected at the probe needle main body portion and the connection portion,
9. The probe needle according to claim 8, wherein the step of forming the tip portion is performed by sintering the connection portion at a temperature higher than a contact end in contact with the electrode pad at the tip portion. Production method. A probe needle main body portion and a tip portion connected to the probe needle main body portion, wherein the tip portion is formed by sintering a plurality of metal fine particles, and the tip portion is an electrode pad. When the metal fine particles in the tip portion are partly peeled by contacting
Putting a probe needle in which the metal fine particles in the tip portion are partially peeled into the mold forming the probe needle and the metal fine particles forming the tip portion;
Heating and sintering the metal fine particles to make up for the partially peeled portion and forming a new tip portion; and
A method for regenerating a probe needle, comprising: The new tip portion is brought into contact with the electrode pad at the contact end,
The step of forming the new tip portion is characterized in that the new tip portion is sintered at a lower temperature than the connection portion connected to the probe needle main body portion at the tip portion. Item 11. A method for regenerating a probe needle according to Item 10.

Images