JP6457345B2 - Electronic component mounting package and electronic device - Google Patents

Description

  The present invention relates to an electronic component mounting package and an electronic apparatus.

  An electronic device on which an electronic component is mounted includes a package including a base having a recess that forms a housing space in which the electronic component is stored, and an electronic component mounted on a flat bottom surface of the recess of the base in the package. It is comprised including (refer patent document 1).

JP-A-4-322252

  In an electronic device in which a MEMS (Micro Electro Mechanical Systems) element having a movable part such as a pressure sensor, an inertial sensor such as an acceleration sensor and an angular velocity sensor is mounted as an electronic component, heat from the outside of the package is When transmitted to the MEMS element mounted on the bottom surface of the recess, the detection accuracy as a sensor may be reduced.

  Such a phenomenon that the detection accuracy of the MEMS element as a sensor due to heat from the outside of the package is lowered becomes more apparent as the size of the electronic device is further reduced.

  Therefore, a package structure that can prevent heat from the outside of the package from being transmitted to the electronic components mounted in the package is required, but the conventional package sufficiently suppresses heat transfer to the electronic components. I can't.

  An object of the present invention is an electronic component mounting package in which heat from the outside of the package can be prevented from being transmitted to the electronic component mounted in the package in the electronic component mounting package on which the electronic component is mounted, And an electronic device including the electronic component mounting package.

An electronic component mounting package according to one aspect of the present invention is an electronic component mounting package on which an electronic component is mounted, and a base body provided with a first recess and an annular electronic component mounting surface on which the electronic component is mounted The outer dimension in plan view is smaller than the dimension of the bottom surface of the first recess, and protrudes from the bottom surface of the first recess, the second recess is provided, and the annular electronic component mounting surface is defining an opening of the second recess, seen including a protrusion, wherein the protrusion has an opening edge portion of the second recess is characterized in that a shape which is chamfered.

  The electronic device according to an aspect of the present invention includes the electronic component mounting package, an adhesive layer provided on an inner peripheral end of the electronic component mounting surface of the protruding portion, and the electronic component mounting surface of the protruding portion. And an electronic component mounted by being bonded via the adhesive layer so as to cover the second recess.

According to the present invention, the electronic component mounting package has a configuration in which the electronic component mounting surface on which the electronic component is mounted is formed in the protruding portion protruding from the bottom surface of the first recess in the base.
Compared with a configuration in which the bottom surface of the recess is an electronic component mounting surface, heat from the outside of the package can be suppressed from being transmitted to the electronic component mounted in the package.

  Further, in the electronic component mounting package, the projecting portion has a second recess, and the annular electronic component mounting surface is configured to define the opening of the second recess. In the electronic component mounting package having such a configuration, the electronic component is mounted on the annular electronic component mounting surface of the protruding portion so as to cover the second recess. In other words, since the part corresponding to the opening of the second recess does not contact the protruding part, the contact area between the electronic part and the protruding part can be reduced, and thus the electronic part from the outside of the package can be reduced. The heat transfer to can be further suppressed.

  In addition, according to the present invention, the electronic device includes the electronic component mounting package that can suppress heat transfer to the electronic component from the outside of the package. It is possible to suppress the deterioration of characteristics.

It is sectional drawing which shows the structure of the electronic device 1 provided with the electronic component mounting package 2 which concerns on 1st Embodiment of this invention. 1 is an exploded perspective view showing a configuration of an electronic device 1. It is sectional drawing which shows the structure of 1 A of electronic devices provided with 2 A of electronic component mounting packages which concern on 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device 1B provided with the electronic component mounting package 2B which concerns on 3rd Embodiment of this invention.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing a configuration of an electronic device 1 including an electronic component mounting package 2 according to the first embodiment of the present invention, and FIG. 2 is an exploded perspective view showing the configuration of the electronic device 1.

  The electronic device 1 of this embodiment includes an electronic component mounting package 2, an electronic component 3, and a lid 4.

  Here, the electronic component 3 is a MEMS element having a movable part such as a pressure sensor, an inertial sensor such as an acceleration sensor and an angular velocity sensor, a switching element, and a micromirror element. Below, the structure of the electronic device 1 and the electronic component mounting package 2 of the present embodiment will be described by taking as an example the case where the electronic component 3 is a MEMS element. Hereinafter, the electronic component 3 is referred to as “MEMS element 3”. The MEMS element 3 includes a substrate 3a and a movable portion 3b mounted on the substrate 3a.

  The electronic component mounting package 2 is a package on which the MEMS element 3 is mounted, and includes a base 21 and a protrusion 22.

  The base 21 has a first recess 211 that forms a mounting space in which the MEMS element 3 is mounted. In the present embodiment, the base body 21 has a rectangular outer shape when viewed in plan. The bottom surface 211a of the first recess 211 is flat, and the shape of the bottom surface 211a is rectangular. In a plan view, the outer dimensions of the base body 21 are, for example, a long side length of 1 to 60 mm and a short side length of 0.5 to 40 mm. Moreover, as for the dimension of the bottom face 211a of the 1st recessed part 211 in planar view, the length of a long side is 0.8-56 mm, and the length of a short side is 0.3-36 mm, for example.

  The base 21 is made of an insulating member made of a ceramic material such as alumina ceramics or glass-ceramics. The base 21 may be one using a ceramic layer made of an insulating member or may be a laminate of a plurality of ceramic layers made of an insulating member.

  In the base 21 according to the present embodiment, the outer electrode pad 24 is provided on the outermost ceramic layer, the inner layer pad 25 is provided between the ceramic layers, and the outer electrode pad 24 and the inner layer pad 25 are electrically connected. A connecting through conductor 27 is provided through the ceramic layer. Further, the inner layer pad 25 is electrically connected to an electrode pad 23 which is a conductor layer provided on an electronic component mounting surface 221a of the protrusion 22 described later via a through conductor 26.

  The external electrode pad 24 provided on the lower surface of the base body 21 which is the surface layer of the outermost ceramic layer is a terminal mounted on an external circuit board such as a printed board.

  The electrode pad 23, the external electrode pad 24, the inner layer pad 25, and the through conductors 26 and 27 are made of, for example, a sintered body of metal powder such as tungsten, molybdenum, copper, silver, or silver palladium.

  The protrusion 22 protrudes from the flat bottom surface 211a of the first recess 211 in the base 21 into the mounting space, and includes an annular electronic component mounting surface 221a on which the MEMS element 3 is mounted, and a second recess 221. . In the protrusion 22, the annular electronic component mounting surface 221 a defines the opening of the second recess 221. In the present embodiment, the bottom surface of the second recess 221 coincides with the bottom surface 211 a of the first recess 211 of the base 21. The protrusion 22 is a cylinder having an annular electronic component mounting surface 221a.

  The protrusion 22 is made of the same ceramic material as the base 21. In the present embodiment, the base body 21 and the protruding portion 22 are integrally formed of a ceramic material.

  In the present embodiment, the protrusion 22 has a rectangular outer shape when viewed in plan. The shape of the opening of the second recess 221, in other words, the shape of the opening of the annular electronic component mounting surface 221 a is a rectangular shape. In the plan view, the outer dimension of the protruding portion 22 is, for example, a long side length of 0.6 to 52 mm and a short side length of 0.2 to 32 mm. Moreover, as for the dimension of the opening of the 2nd recessed part 221 in planar view, the length of a long side is 0.5-42 mm, and the length of a short side is 0.1-22 mm, for example.

  In addition, an electrode pad 23 that is a conductor layer electrically connected to the MEMS element 3 is provided on the annular electronic component mounting surface 221 a of the protrusion 22. In the present embodiment, the electrode pad 23 is embedded in the protrusion 22 so that the surface thereof is flush with the electronic component mounting surface 221a. As described above, the electrode pad 23 is embedded in the protruding portion 22, so that the fixing strength between the electrode pad 23 and the electronic component mounting surface 221 a can be improved.

  Further, the MEMS element 3 and the electrode pad 23 mounted on the electronic component mounting surface 221a are electrically connected, for example, by the bonding wire 6, and this electrode pad 23 is provided on the electronic component mounting surface 221a. The bonding wire 6 can be shortened. As a result, signal transmission loss can be reduced.

The electronic component mounting package 2 configured as described above has a configuration in which the electronic component mounting surface 221a on which the MEMS element 3 is mounted is formed on the protruding portion 22 protruding from the bottom surface 211a of the first recess 211 in the base body 21. Therefore, as compared with the configuration in which the bottom surface 211a of the first recess 211 is the electronic component mounting surface, the heat from the outside of the electronic component mounting package 2 is applied to the MEMS element mounted in the electronic component mounting package 2. 3 can be suppressed.

  Further, in the electronic component mounting package 2, the protrusion 22 has a second recess 221, and the annular electronic component mounting surface 221 a is configured to define the opening of the second recess 221. In the electronic component mounting package 2 having such a configuration, the MEMS element 3 is mounted on the annular electronic component mounting surface 221 a of the protruding portion 22 so as to cover the second recess 221. That is, in the MEMS element 3, the portion corresponding to the opening of the second recess 221 does not contact the protruding portion 22, so that the contact area between the MEMS element 3 and the protruding portion 22 can be reduced. Heat transfer to the MEMS element 3 from the outside of the component mounting package 2 can be further suppressed.

  Further, in the electronic component mounting package 2 of the present embodiment, the protruding portion 22 that is a cylindrical body having an annular electronic component mounting surface 221a has a shape in which the opening edge 221b of the second concave portion 221 is chamfered. preferable. In the present embodiment, the protrusion 22 has a shape in which the outer peripheral edge 221c on the electronic component mounting surface 221a side is also chamfered. Specifically, when the protrusion 22 is viewed in cross section, the protrusion 22 is divided into two parts by the second recess 221, and the cross-sectional shape of each of these two parts is trapezoidal. At least the protrusion 22 having a shape in which the opening edge 221b of the second recess 221 is chamfered has a small contact area between the MEMS element 3 and the protrusion 22, so that the electronic component mounting package 2 is exposed from the outside. Heat transfer to the MEMS element 3 can be further suppressed.

  Next, a method for manufacturing the electronic component mounting package 2 will be described below.

  As described above, the electronic component mounting package 2 has a laminated structure in which a plurality of ceramic layers are laminated. Such a laminated structure can be formed using a thermoplastic sheet corresponding to each ceramic layer. Here, the thermoplastic sheet is a ceramic sheet that softens and flows when heated. In addition, as a thermoplastic sheet, the tape which adjusted the organic modulus, such as a binder and a plasticizer, and adjusted the elastic modulus in 60-80 degreeC low, for example is mainly used for an alumina, aluminum nitride, and glass ceramics. .

  In the manufacturing method of the electronic component mounting package 2, the electronic component mounting package 2 is manufactured by a molding method using a thermoplastic sheet and a mold. The mold has an inverted structure with respect to the shape of the bottom surface 211 a of the first recess 211 of the electronic component mounting package 2 and the shape of the protrusion 22 having the second recess 221.

  In the manufacturing method of the electronic component mounting package 2, first, a through hole penetrating in the thickness direction is formed in the thermoplastic sheet, and the through hole is filled with a conductive paste for the through conductors 26 and 27.

  Next, a conductive paste corresponding to the electrode pad 23, the external electrode pad 24, and the inner layer pad 25 is printed by a conventionally known screen printing method.

  Next, a laminate is produced by superimposing the thermoplastic sheets, and a mold is pressed against the laminate under heating to be deformed. At this time, the bottom surface 211a of the first recess 211 of the base body 21 rises so as to fit the mold, and the protruding portion 22 is formed. And the electronic component mounting package 2 can be manufactured by baking the laminated body after a deformation | transformation.

  As shown in FIGS. 1 and 2, the electronic device 1 includes the electronic component mounting package 2, the MEMS element 3, the lid 4, and the adhesive layer 5.

The adhesive layer 5 is made of a conventionally known adhesive mainly composed of a synthetic resin having an elastic modulus of 1 GPa or less. Examples of the synthetic resin as the main component of the adhesive include an epoxy resin and a silicone resin. The adhesive layer 5 is provided over the entire circumference of the inner peripheral end of the annular electronic component mounting surface 221a of the protrusion 22.

  The MEMS element 3 is mounted on the annular electronic component mounting surface 221 a of the protrusion 22 by being bonded via the adhesive layer 5 so as to cover the second recess 221. Specifically, in the MEMS element 3, the movable portion 3 b is accommodated in the second recess 221, and the peripheral edge of the substrate 3 a is bonded to the electronic component mounting surface 221 a via the adhesive layer 5, so that the second recess It is mounted on the electronic component mounting surface 221 a so as to cover 221. As described above, the MEMS element 3 is mounted on the electronic component mounting surface 221a in a state where the movable portion 3b is accommodated in the second recess 221, so that the movable portion 3b is connected to the second recess 221 and the base 21. It will be sealed in the space by 1 recessed part 211. Thereby, it can suppress that the detection accuracy as a sensor of the MEMS element 3 falls. The MEMS element 3 is electrically connected to the electrode pad 23 provided on the electronic component mounting surface 221 a by the bonding wire 6.

  The lid 4 is made of, for example, an alloy containing at least one of iron, nickel, or cobalt, a glass material, silicon, or the like. Such a lid 4 is for hermetically sealing the first recess 211 in a vacuum state or the first recess 211 filled with nitrogen gas or the like. Specifically, the lid 4 is placed on the base 21 in a predetermined atmosphere. Then, a predetermined current is applied to the lid body 4 so that the sealing conductor pattern formed on the frame portion on the base body 21 and the lid body 4 are welded to perform seam welding to join the base body 21. . Moreover, the cover body and the base body 21 may be bonded via a bonding material such as glass, or may be bonded by anodic bonding.

  Since the electronic device 1 configured as described above includes the electronic component mounting package 2 that can suppress heat transfer to the MEMS element 3 from the outside of the electronic component mounting package 2, it serves as a sensor for the MEMS element. It can suppress that detection accuracy falls, and can suppress the characteristic deterioration of the electronic apparatus 1 by extension. In plan view, the range of the MEMS element 3 to be joined to the electronic component mounting surface 221a of the protrusion 22 is, for example, about the length of one side of the MEMS element from the outer periphery to the inside of the lower surface of the MEMS element 3. It is set to a band-like range with a width of about 1/5 or less.

  FIG. 3 is a cross-sectional view showing a configuration of an electronic device 1A including an electronic component mounting package 2A according to the second embodiment of the present invention. FIG. 3 (1) shows the configuration of the electronic component mounting package 2A and the electronic device 1A, and FIG. 3 (2) shows an enlarged main part.

  The electronic component mounting package 2A is an electronic component except that the adhesive structure with the MEMS element 3 via the adhesive layer 5 at the inner peripheral end of the electronic component mounting surface 221a of the protrusion 22 is different from the adhesive structure described above. The configuration is the same as the mounting package 2. The electronic device 1A is configured in the same manner as the electronic device 1 except that the electronic device mounting package 2A is provided. As described above, the electronic component mounting package 2A and the electronic device 1A according to the present embodiment have the same parts as the electronic component mounting package 2 and the electronic device 1 according to the first embodiment described above. Accordingly, in the following description and drawings, corresponding similar parts are denoted by the same reference numerals and description thereof is omitted.

  Similarly to the electronic component mounting package 2 described above, the electronic component mounting package 2A includes a base 21 having a first recess 211, an annular electronic component mounting surface 221a, and a second recess 221. And a projecting portion 22 projecting from the bottom surface 211a.

  In the electronic component mounting package 2A of the present embodiment, an electronic device having a concave groove 222a for forming an adhesive layer 5 to which the MEMS element 3 is bonded is formed at the inner peripheral end of the electronic component mounting surface 221a of the protruding portion 22. A raised portion 222 is provided to rise upward from the component mounting surface 221a.

  By such a raised portion 222 having the concave groove 222a, the adhesive layer 5 in which a certain amount of adhesive is filled in the concave groove 222a can be formed. Thereby, it is possible to suppress the adhesive from flowing out and spreading. Therefore, the MEMS element 3 can be more accurately fixed at a certain height, so that the effect of stress relaxation from the outside of the adhesive can be further stabilized. In addition, if it is a manufacturing method using the above casting_mold | templates, formation of such a comparatively fine ditch | groove 222a is easy, and the precision of a dimension is also high.

  FIG. 4 is a cross-sectional view showing a configuration of an electronic device 1B including an electronic component mounting package 2B according to the third embodiment of the present invention. FIG. 4A shows the configuration of the electronic component mounting package 2B and the electronic device 1B, and FIG. 4B shows an enlarged main part.

  The electronic component mounting package 2B is an electronic component except that the adhesive structure with the MEMS element 3 via the adhesive layer 5 at the inner peripheral end of the electronic component mounting surface 221a of the protrusion 22 is different from the above-described adhesive structure. The configuration is the same as the mounting package 2. The electronic device 1B is configured in the same manner as the electronic device 1 except that the electronic device mounting package 2B is provided. As described above, the electronic component mounting package 2B and the electronic device 1B according to the present embodiment have the same parts as the electronic component mounting package 2 and the electronic device 1 according to the first embodiment described above. Accordingly, in the following description and drawings, corresponding similar parts are denoted by the same reference numerals and description thereof is omitted.

  Similar to the electronic component mounting package 2 described above, the electronic component mounting package 2B includes a base 21 having a first recess 211, an annular electronic component mounting surface 221a, and a second recess 221. And a projecting portion 22 projecting from the bottom surface 211a.

  In the electronic component mounting package 2B of the present embodiment, a concave groove 223 for forming the adhesive layer 5 for bonding the MEMS element 3 is provided at the inner peripheral end of the electronic component mounting surface 221a of the protrusion 22. Yes.

  By such a concave groove 223, the adhesive layer 5 in which a certain amount of adhesive is filled in the concave groove 223 can be formed. Thereby, it is possible to suppress the adhesive from flowing out and spreading. Since the MEMS element 3 can be fixed at a constant height, the effect of stress relaxation from the outside of the adhesive can be further stabilized.

  In addition, this invention is not limited to the example of the above embodiment, A various change may be added in the range which does not deviate from the summary of this invention. For example, a SAW element (surface acoustic wave element) may be mounted as the electronic component 3 having a movable part.

DESCRIPTION OF SYMBOLS 1,1A, 1B Electronic device 2,2A, 2B Electronic component mounting package 3 MEMS element 3a Substrate 3b Movable part 4 Lid 5 Adhesive layer 6 Bonding wire 21 Base 211 First recess 211a Bottom 22 Projection 221 Second recess 221a Electronic component mounting surface 222 Raised portions 222a, 223 Concave groove 23 Electrode pad 24 External electrode pad 25 Inner layer pad 26, 27 Through conductor

Claims (7)

An electronic component mounting package on which electronic components are mounted,
A base provided with a first recess;
A projecting portion having an annular electronic component mounting surface on which an electronic component is mounted , the outer dimension in plan view being smaller than the size of the bottom surface of the first recess, and protruding from the bottom surface of the first recess, the second recess is provided, the electronic component mounting surface of the annular defining an opening of the second recess, seen including a protrusion, a,
The package for mounting an electronic component , wherein the protrusion has a shape in which an opening edge of the second recess is chamfered .   The electronic component mounting package according to claim 1, wherein the base body and the protruding portion are integrally formed of a ceramic material. The electronic component is provided on the mounting surface, the electronic component mounting package according to claim 1 or 2 a conductive layer that is an electronic component electrically connected, characterized in that it further comprises. The concave part for forming the adhesive bond layer which adhere | attaches an electronic component is provided in the inner peripheral end of the said electronic component mounting surface, The description of any one of Claims 1-3 characterized by the above-mentioned. Electronic component mounting package. The inner peripheral end of the electronic component mounting surface is provided with a raised portion that protrudes upward from the electronic component mounting surface, and has a concave groove for forming an adhesive layer for bonding the electronic component. The electronic component mounting package according to any one of claims 1 to 4 . The electronic component mounting package according to any one of claims 1 to 5 ,
An adhesive layer provided on an inner peripheral end of the electronic component mounting surface of the protruding portion;
An electronic device comprising: an electronic component mounted on the electronic component mounting surface of the protruding portion by being bonded via the adhesive layer so as to cover the second recess. The electronic component is a MEMS element having a substrate and a movable part mounted on the substrate,
In the MEMS element, the movable part is accommodated in the second recess, and the peripheral edge of the substrate is bonded to the electronic component mounting surface via the adhesive layer so as to cover the second recess. The electronic device according to claim 6 , wherein the electronic device is mounted on an electronic component mounting surface.

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