JP6463227B2 - 基板搬送方法 - Google Patents
基板搬送方法 Download PDFInfo
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- JP6463227B2 JP6463227B2 JP2015136210A JP2015136210A JP6463227B2 JP 6463227 B2 JP6463227 B2 JP 6463227B2 JP 2015136210 A JP2015136210 A JP 2015136210A JP 2015136210 A JP2015136210 A JP 2015136210A JP 6463227 B2 JP6463227 B2 JP 6463227B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/57—Mask-wafer alignment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/27—Structural arrangements therefor
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
Description
X2+Y2+lX+mY+n=0 … (1)
各エッジ交差点28a,28e,28dの第1のウエハ座標系におけるそれぞれの座標を(X1,Y1),(X2,Y2),(X3,Y3)とすると、上記(1)は行列A及び行列Bを用いて下記式(2)の様に表される。
10 プラズマ処理装置
14 基板搬送室
15 基板処理室
16 搬送ロボット
17 制御部
23 センサ対
23a 右側センサ
23b 左側センサ
Claims (4)
- 円板状の基板を搬送手段によって基板処理室へ搬送する基板搬送方法であって、
前記基板を搬送する際の前記基板の位置の基準となる基準基板位置を予め取得する工程と、
前記基板処理室へ搬送される前記基板の位置である搬送時基板位置を取得する工程と、 前記基準基板位置に対する前記搬送時基板位置の位置ずれを算出する工程と、
前記算出された位置ずれを解消するように前記基板処理室までの前記基板の進路を修正する工程と、
前記修正された基板の進路に基づいて前記基板を前記基板処理室へ搬送する工程とを有し、
前記搬送時基板位置を取得する工程は、
前記基板の搬送経路において、2つの位置センサを前記基板の直径よりも小さい間隔で互いに離間し、且つ前記搬送される基板に対向するように配置する工程と、
前記基板が前記基板処理室へ搬送される間に、前記2つの位置センサが前記基板の外縁と交差する4つの交差点を取得する工程と、
前記4つの交差点のうち2つの交差点を基準交差点として選択する工程と、
前記2つの基準交差点を通過し且つ互いに直径が異なる2つの円を規定する工程と、 前記4つの交差点から前記基準交差点として選択されなかった2つの交差点のうち前記2つの円によって囲われた領域内に存在する交差点、並びに前記2つの基準交差点に基づいて前記搬送時基板位置を取得する工程とを有することを特徴とする基板搬送方法。 - 前記基板が搬送される度に、前記搬送時基板位置を取得する工程と、前記位置ずれを算出する工程と、前記基板の進路を修正する工程とを実行することを特徴とする請求項1に記載の基板搬送方法。
- 前記搬送手段の経年劣化が予測される時点において、前記搬送時基板位置を取得する工程と、前記位置ずれを算出する工程と、前記基板の進路を修正する工程とを実行することを特徴とする請求項1に記載の基板搬送方法。
- 前記位置センサを交換した時点において、前記搬送時基板位置を取得する工程と、前記位置ずれを算出する工程と、前記基板の進路を修正する工程とを実行することを特徴とする請求項1に記載の基板搬送方法。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015136210A JP6463227B2 (ja) | 2015-07-07 | 2015-07-07 | 基板搬送方法 |
| CN201610465321.8A CN106340479B (zh) | 2015-07-07 | 2016-06-23 | 基板输送方法和基板处理装置 |
| KR1020160083583A KR102588989B1 (ko) | 2015-07-07 | 2016-07-01 | 기판 반송 방법, 프로그램 및 기판 처리 장치 |
| TW105120869A TWI707425B (zh) | 2015-07-07 | 2016-07-01 | 基板運送方法、程式及基板處理裝置 |
| US15/202,658 US9805960B2 (en) | 2015-07-07 | 2016-07-06 | Substrate conveyance method |
| KR1020230132488A KR102794710B1 (ko) | 2015-07-07 | 2023-10-05 | 기판 반송 방법, 프로그램 및 기판 처리 장치 |
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| JP2015136210A JP6463227B2 (ja) | 2015-07-07 | 2015-07-07 | 基板搬送方法 |
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| JP2018247208A Division JP6640321B2 (ja) | 2018-12-28 | 2018-12-28 | 基板搬送方法及び基板処理装置 |
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| Publication Number | Publication Date |
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| JP2017022166A JP2017022166A (ja) | 2017-01-26 |
| JP2017022166A5 JP2017022166A5 (ja) | 2018-04-19 |
| JP6463227B2 true JP6463227B2 (ja) | 2019-01-30 |
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| JP2015136210A Active JP6463227B2 (ja) | 2015-07-07 | 2015-07-07 | 基板搬送方法 |
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| Country | Link |
|---|---|
| US (1) | US9805960B2 (ja) |
| JP (1) | JP6463227B2 (ja) |
| KR (2) | KR102588989B1 (ja) |
| CN (1) | CN106340479B (ja) |
| TW (1) | TWI707425B (ja) |
Families Citing this family (16)
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| JP6463227B2 (ja) * | 2015-07-07 | 2019-01-30 | 東京エレクトロン株式会社 | 基板搬送方法 |
| KR101927698B1 (ko) | 2016-11-14 | 2018-12-12 | 세메스 주식회사 | 이송 로봇, 기판 처리 장치 및 기판 처리 방법 |
| JP6767253B2 (ja) * | 2016-12-13 | 2020-10-14 | 株式会社ディスコ | レーザー加工装置 |
| JP6842934B2 (ja) * | 2017-01-27 | 2021-03-17 | 株式会社Screenホールディングス | 基板搬送装置、検出位置較正方法および基板処理装置 |
| CN108666258A (zh) * | 2017-03-31 | 2018-10-16 | 奇景光电股份有限公司 | 晶圆夹具及夹持晶圆的方法 |
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| CN110494586A (zh) * | 2018-03-14 | 2019-11-22 | 应用材料公司 | 处理掩模布置的方法、用于掩模布置的光学检查的参考基板和真空沉积系统 |
| KR102099115B1 (ko) * | 2018-06-08 | 2020-04-10 | 세메스 주식회사 | 기판 이송 장치, 이를 포함하는 기판 처리 장치 및 기판 틀어짐 보정 방법 |
| JP7105629B2 (ja) * | 2018-06-20 | 2022-07-25 | 東京エレクトロン株式会社 | 自動教示方法及び制御装置 |
| CN112786475B (zh) * | 2019-11-08 | 2024-07-30 | 沈阳新松半导体设备有限公司 | 一种晶圆自动纠偏方法 |
| CN112775956A (zh) * | 2019-11-08 | 2021-05-11 | 沈阳新松机器人自动化股份有限公司 | 一种机械手awc纠偏系统实现方法 |
| JP7470586B2 (ja) * | 2020-07-14 | 2024-04-18 | 東京エレクトロン株式会社 | 基板搬送システム及び基板搬送方法 |
| KR102230866B1 (ko) * | 2020-10-27 | 2021-03-25 | 한국야스카와전기(주) | 반도체 반송장치 및 반도체 반송장치의 티칭방법 |
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-
2015
- 2015-07-07 JP JP2015136210A patent/JP6463227B2/ja active Active
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2016
- 2016-06-23 CN CN201610465321.8A patent/CN106340479B/zh active Active
- 2016-07-01 TW TW105120869A patent/TWI707425B/zh active
- 2016-07-01 KR KR1020160083583A patent/KR102588989B1/ko active Active
- 2016-07-06 US US15/202,658 patent/US9805960B2/en active Active
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2023
- 2023-10-05 KR KR1020230132488A patent/KR102794710B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201724329A (zh) | 2017-07-01 |
| US20170011940A1 (en) | 2017-01-12 |
| KR20170006264A (ko) | 2017-01-17 |
| TWI707425B (zh) | 2020-10-11 |
| KR102794710B1 (ko) | 2025-04-10 |
| US9805960B2 (en) | 2017-10-31 |
| JP2017022166A (ja) | 2017-01-26 |
| CN106340479A (zh) | 2017-01-18 |
| KR20230145291A (ko) | 2023-10-17 |
| CN106340479B (zh) | 2020-08-28 |
| KR102588989B1 (ko) | 2023-10-12 |
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