JP6464425B2 - Magnetic characteristic measuring apparatus, magnetic characteristic measuring method, and magnetic characteristic measuring program - Google Patents

Description

  The present invention relates to a magnetic property measuring apparatus, a magnetic property measuring method, and a magnetic property measuring program.

  A technique for measuring magnetic properties by applying a magnetic field to a magnetic material has been developed. In an actual apparatus in which a magnetic material is used, a stress is applied to the magnetic material, and thus a method for measuring magnetic characteristics in a state where the stress is applied has been developed (for example, see Patent Document 1).

JP 2012-202974 A

  However, when a magnetic field is applied to the magnetic material, magnetostriction occurs because the crystal lattice constituting the magnetic material is mainly deformed in the magnetic field direction. Measuring magnetic properties by applying stress in a state where magnetostriction is occurring is suitable for grasping magnetic behavior in an actual environment. However, in order to perform magnetic characteristics (for example, simulation), it is preferable to separate the influence of magnetostriction from the influence of external force.

  The present invention has been made in view of the above problems, and an object thereof is to provide a magnetic property measuring apparatus, a magnetic property measuring method, and a magnetic property measuring program capable of measuring magnetic properties while reducing the influence of magnetostriction. .

In one embodiment, the magnetic characteristic measuring apparatus includes a distortion adding device for adding a magnetic field application device for applying a rotating magnetic field for the magnetic material, the strain in the magnetic material in synchronism with the phase angle of the rotating magnetic field, the A measuring device that measures the magnetic properties of the magnetic material in a state in which the magnetic material is strained by the strain applying device.

  Magnetic characteristics can be measured by reducing the influence of magnetostriction.

(A)-(c) is a figure illustrated about the magnetic sample used with the magnetic characteristic measuring apparatus which concerns on Example 1. FIG. (A) And (b) is a figure which illustrates the whole structure of the magnetic characteristic measuring apparatus which concerns on Example 1. FIG. It is a flowchart showing an example of operation | movement of a magnetic characteristic measuring apparatus. It is a flowchart showing the detail of FIG. It is a flowchart showing the detail of FIG. It is a flowchart showing the detail of FIG. It is a flowchart showing the detail of FIG. It is a flowchart showing the detail of FIG. It is a flowchart showing the detail of FIG. It is a flowchart showing the detail of FIG. It is a flowchart showing the detail of FIG. It is a figure showing the example of a table of data. (A)-(e) is a figure showing the result of the magnetic characteristic test done by the method based on Example 1. FIG. It is a block diagram for demonstrating the hardware constitutions of a controller.

  Devices that use magnetic energy are known. For example, generators and motors that mutually convert electrical energy and mechanical energy through magnetic energy, inverters that convert power from DC to AC through magnetic energy, and AC voltage conversion through magnetic energy For example, a transformer. In these devices, in order to efficiently use magnetic energy (in order to increase magnetic flux density and magnetic field strength), a magnetic material having a large magnetic permeability as an electromagnetic coil core (iron core) (for example, an electromagnetic steel plate such as a silicon steel plate) ) Is used.

  By the way, the magnetic material exhibits magnetic hysteresis characteristics in response to an external magnetic field. Therefore, energy loss (hysteresis loss) occurs during interaction with the external magnetic field. That is, the magnetic properties of the magnetic material significantly affect the conversion efficiency of electromagnetic energy. Therefore, in improving the performance of these devices, it is preferable to grasp the magnetic characteristics of the magnetic material in detail and design the equipment.

  In an actual apparatus, since not only various magnetic fields but also stress is applied to the magnetic material, it is expected to develop a method for measuring vector magnetic characteristics in a state where the stress is applied. For example, when a magnetic property is measured by applying stress, a strain (= stress / Young's modulus) of several to 200 ppm is generated in the magnetic material. On the other hand, when a magnetic field is applied to the magnetic material to generate magnetization (= magnetic flux density × constant), distortion called magnetostriction occurs in the magnetic material in the magnetization direction. In general, the magnitude of magnetostriction is several to several hundred ppm, which is equivalent to the strain due to stress caused by external force. That is, even when stress due to external force is not applied to the magnetic material, a large strain (stress) is generated in the magnetic material when measuring the magnetic characteristics (because a magnetic field is applied to the magnetic material).

  Examining the magnetic characteristics when stress due to external force is further applied to the state in which magnetostriction due to the measurement magnetic field is generated is suitable for knowing the magnetic behavior in an actual environment. However, in order to perform detailed analysis (for example, simulation) of magnetic characteristics, it is preferable to separate the influence of magnetostriction from the influence of stress caused by external force. In the following embodiments, a magnetic characteristic measuring apparatus, a magnetic characteristic measuring method, and a magnetic characteristic measuring program capable of measuring magnetic characteristics while reducing the influence of magnetostriction will be described.

  FIG. 1A to FIG. 1C are diagrams illustrating a magnetic sample 10 used in the magnetic property measuring apparatus according to the first embodiment. 1A is a top view of the magnetic sample 10, and FIG. 1B is a cross-sectional view of the magnetic sample 10 along the By coil. FIG. 1C is a diagram for explaining the vector magnetic characteristics. The magnetic sample 10 is not particularly limited as long as it is a magnetic material. In the present embodiment, the magnetic sample 10 is an electromagnetic steel plate such as a disk-shaped non-oriented electrical steel plate 35A300 (plate thickness 0.35 mm), for example, and is wire-cut to a diameter of 70 mm, for example.

  Two axes orthogonal to each other on the main surface of the magnetic sample 10 are defined as an X axis and a Y axis. As illustrated in FIG. 1A and FIG. 1B, the magnetic sample 10 is provided so that the Bx coil 11 loops one turn through two through holes that are separated from each other along the Y axis. ing. The magnetic sample 10 is provided so that the By coil 12 loops one turn through two through holes spaced apart from each other along the X axis. The diameter of these through holes is, for example, 0.15 mm. The distance between the centers of the two through holes along the X axis and the two through holes along the Y axis is, for example, 20 mm. The Bx coil 11 and the By coil 12 are, for example, copper thin wires having a wire diameter of 0.1 mm.

  By magnetizing the magnetic sample 10, a magnetic flux is generated in the magnetic sample 10. As illustrated in FIG. 1C, the rotational magnetic flux density B is obtained by combining the magnetic flux density Bx in the X-axis direction and the magnetic flux density By in the Y-axis direction. The magnetic flux density Bx can be detected using the Bx coil 11. The magnetic flux density By can be detected using the By coil 12.

  A rotating magnetic field H can be obtained by combining the magnetic field Hx in the X-axis direction and the magnetic field Hy in the Y-axis direction. The vector magnetic characteristic can be measured by controlling the rotating magnetic field H so that the scalar quantity of the rotating magnetic flux density B becomes a constant value (so that the locus of B becomes a perfect circle). Note that Bx = Bsinθ = Bsinωt, and By = Bcosθ = Bcosωt. “Θ” represents an angle in the XY plane and represents a phase angle of the rotating magnetic field. “T” is the time, and “ω” is the angular velocity of the rotating magnetic field.

  Further, as illustrated in FIG. 1B, an X-axis piezo material 13 that applies distortion to the magnetic sample 10 in the X-axis direction is fixed to the main surface of the magnetic sample 10. On the other surface of the magnetic sample 10, a Y-axis piezo material 14 that gives distortion in the Y-axis direction to the magnetic sample 10 is fixed. The X-axis piezo material 13 and the Y-axis piezo material 14 are not particularly limited as long as they are materials that can apply an external force to the magnetic sample 10, but as an example, are piezoelectric films. In this embodiment, the X-axis piezo material 13 and the Y-axis piezo material 14 are PZT ceramic plates having a thickness of 1 mm and a diameter of 70 mm, and are fixed to the magnetic sample 10 with an epoxy adhesive or the like.

  In this embodiment, a vector magnetic characteristic measurement method using a rotating magnetic field obtained by combining two-axis magnetic fields is used. By using this measurement method, the direction and strength (vector) of the magnetic field and the direction and strength (vector) of the magnetic flux density can be individually observed, so that magnetic characteristics (vector magnetic characteristics) for various magnetic fields can be obtained.

  FIG. 2A and FIG. 2B are diagrams illustrating the overall configuration of the magnetic property measuring apparatus 100 according to the first embodiment. As illustrated in FIG. 2A, the magnetic property measuring apparatus 100 includes a controller 20, a phase adjuster 30, an X-axis coil 40a, a Y-axis coil 40b, an X-axis coil power supply 50a, a Y-axis coil power supply 50b, A database DB is provided. 2B, the magnetic characteristic measuring apparatus 100 includes an X-axis piezo power source 60a, a Y-axis piezo power source 60b, an X-axis magnetic field sensor 70a, a Y-axis magnetic field sensor 70b, an X-axis strain sensor 80a, A Y-axis strain sensor 80b, an accumulator 90, and the like are provided.

  The X-axis coil 40 a applies a magnetic field in the X-axis direction to the magnetic sample 10. The Y-axis coil 40 b applies a magnetic field in the Y-axis direction to the magnetic sample 10. The X-axis coil power supply 50a is an AC power supply and supplies an AC current to the X-axis coil 40a. The Y-axis coil power supply 50b is an AC power supply and supplies an AC current to the Y-axis coil 40b.

  The X-axis piezo power supply 60 a is an AC power supply and supplies an AC current to the X-axis piezo material 13. The Y-axis piezo power source 60b is an AC power source and supplies an AC current to the Y-axis piezo material 14. The X-axis magnetic field sensor 70a is an H coil, a Hall element or the like, and detects a magnetic field in the X-axis direction. The Y-axis magnetic field sensor 70b is an H coil, a Hall element or the like, and detects a magnetic field in the Y-axis direction. The X-axis magnetic field sensor 70a and the Y-axis magnetic field sensor 70b are, for example, copper thin wires having a wire diameter of 0.1 mm, and are wound coils having a cross section of 20 mm × 1 mm, a depth of 20 mm, and a winding number of 500 turns. The X-axis strain sensor 80a detects the strain of the magnetic sample 10 in the X-axis direction. The Y-axis strain sensor 80b detects the strain of the magnetic sample 10 in the Y-axis direction. The X-axis strain sensor 80a and the Y-axis strain sensor 80b are strain gauges, for example.

  The phase adjuster 30 controls the operations of the X-axis coil power supply 50a, the Y-axis coil power supply 50b, the X-axis piezo power supply 60a, and the Y-axis piezo power supply 60b according to the setting input from the controller 20. Specifically, the phase adjuster 30 adjusts the AC phase of the X-axis coil power supply 50a, the Y-axis coil power supply 50b, the X-axis piezo power supply 60a, and the Y-axis piezo power supply 60b to thereby reduce magnetostriction in the XY plane. Synchronize direction and strain direction.

  The acquirer 90 is an oscilloscope or the like, and detects waveforms of detection results of the Bx coil 11, the By coil 12, the X axis magnetic field sensor 70a, the Y axis magnetic field sensor 70b, the X axis distortion sensor 80a, and the Y axis distortion sensor 80b. It transmits to the controller 20. The controller 20 detects the magnetic flux density Bx in the X-axis direction according to the detection result of the Bx coil 11 and detects the magnetic flux density By in the Y-axis direction according to the detection result of the By coil 12. Further, the controller 20 detects the magnetic field Hx in the X-axis direction according to the detection result of the X-axis magnetic field sensor 70a, and detects the magnetic field Hy in the Y-axis direction according to the detection result of the Y-axis magnetic field sensor 70b. The controller 20 detects the strain εx of the magnetic sample 10 in the X-axis direction according to the detection result of the X-axis strain sensor 80a, and the Y-axis direction of the magnetic sample 10 according to the detection result of the Y-axis strain sensor 80b. The strain εy is detected. Note that the output signal of the phase adjuster 30 is transmitted to the acquirer 90 in order to use the output signal of the phase adjuster 30 as a measurement trigger.

  In the present embodiment, the phase adjuster 30 is configured so that a stress in a direction opposite to a crystal lattice deformation stress due to magnetostriction caused by application of a magnetic field by the X-axis coil 40a and the Y-axis coil 40b is applied to the magnetic sample 10. The axis piezo power source 60a and the Y axis piezo power source 60b are controlled. Thereby, the magnetic characteristics can be measured while reducing the influence of magnetostriction.

  In the vector magnetic characteristic measurement according to the present embodiment, the magnetic flux density and the magnetic field frequency are used as measurement parameters and arbitrarily fixed values. That is, the time change of the magnetic flux density is uniquely determined. Further, since magnetostriction is determined by the magnetic flux density, the time change of magnetostriction is also uniquely determined. On the other hand, since the distortion of the X-axis piezo material 13 and the Y-axis piezo material 14 can be controlled by the applied drive voltage (a function of time), the time variation of the distortion of the X-axis piezo material 13 and the Y-axis piezo material 14 is also unique. It is decided. From the above, it is possible to control the magnetostriction and the distortion of the piezoelectric material in synchronism with time change (phase change). Therefore, the magnetostriction can be arbitrarily controlled by the distortion of the piezoelectric material, and the vector magnetic characteristic can be measured by controlling the stress applied to the magnetic sample 10.

  In general, the frequency of the magnetic field used in the vector magnetic characteristic measurement is several Hz to several tens kHz. Therefore, it is difficult to cope with an external force application method using a mechanical method such as pulling the end of the magnetic material. However, in this embodiment, by using a piezoelectric film, the influence of magnetostriction can be controlled according to the magnetization (magnetic flux density) that changes at a frequency of several Hz to several tens of kHz.

  Hereinafter, details of the operation of the magnetic property measuring apparatus 100 will be described. FIG. 3 is a flowchart showing an example of the operation of the magnetic property measuring apparatus 100. As illustrated in FIG. 3, first, the controller 20 receives input of a measurement frequency and a magnetic flux density (Step S <b> 1). Next, the controller 20 creates reference data (step S2).

  FIG. 4 is a flowchart illustrating details of step S1 and step S2. As illustrated in FIG. 4, the controller 20 initializes the previous input content and the temporarily saved content (step S <b> 101). Next, the controller 20 receives input of the measurement frequency f and the magnetic flux density B (step S102). The measurement frequency f is a rotation frequency of a rotating magnetic field generated in the X-axis coil 40a and the Y-axis coil 40b. The magnetic flux density B is a scalar quantity of the rotating magnetic flux density induced by applying a rotating magnetic field. Next, the controller 20 calculates time T = 1 / f (step S103). Next, the controller 20 stores the time T in the database DB (step S104).

  Next, the controller 20 calculates the phase angle θ = 2πft (step S105). For example, “t” is a step value from 0 to T. Next, the controller 20 stores θ for each t (step S106). Next, the controller 20 calculates the reference data Bsinθ and Bcosθ for each θ (step S107). Next, the controller 20 stores the reference data Bsinθ and Bcosθ in the database DB in association with each θ (step S108).

  Referring to FIG. 3 again, the controller 20 applies an X coil voltage to the X axis coil 40a (step S3). Next, the controller 20 measures the magnetic flux density (step S4). Next, the controller 20 compares the measured magnetic flux density with the reference data (step S5). Next, the controller 20 adjusts the X coil voltage (step S6).

  FIG. 5 is a flowchart illustrating details of step S3 to step S6. As illustrated in FIG. 5, the controller 20 inputs Ex (0) (frequency f) as the X coil voltage to the phase adjuster 30 (step S109). Thereby, the X-axis coil power supply 50a applies the X-coil voltage Ex = Ex (0) to the X-axis coil 40a (step S110). Next, the controller 20 measures the magnetic flux density Bx in the X-axis direction according to the acquisition result of the acquisition device 90 (step S111). The controller 20 stores the magnetic flux density Bx for each θ (step S112). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex (step S113).

  Next, the controller 20 compares the magnetic flux density Bx and Bsin θ for each θ (step S114). If there is a discrepancy of the degree of error, it may be determined as a match. When it is determined as “match” in step S114, the controller 20 stores the X coil voltage Ex as Ex (1) in the database DB (step S115). When it is determined as “mismatch” in step S114, the controller 20 adjusts the X coil voltage Ex (step S116). Next, the controller 20 instructs the phase adjuster 30 to cause the X-axis coil power supply 50a to apply the adjusted X-coil voltage Ex to the X-axis coil 40a (step S117). Next, the controller 20 measures the magnetic flux density Bx in the X-axis direction using the acquisition result of the acquirer 90 (step S118). The controller 20 stores the magnetic flux density Bx in the database DB in association with each θ (step S119). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex (step S120). Thereafter, step S114 is executed again.

  Referring to FIG. 3 again, the controller 20 applies a Y coil voltage to the Y axis coil 40b (step S7). Next, the controller 20 measures the magnetic flux density (step S8). Next, the controller 20 compares the measured magnetic flux density with the reference data (step S9). Next, the controller 20 adjusts the Y coil voltage (step S10).

  FIG. 6 is a flowchart illustrating details of step S7 to step S10. As illustrated in FIG. 6, the controller 20 inputs Ey (0) (frequency f) as the Y coil voltage to the phase adjuster 30 (step S <b> 121). Thereby, the Y-axis coil power supply 50b applies the Y-coil voltage Ey = Ey (0) to the Y-axis coil 40b (step S122). Next, the controller 20 measures the magnetic flux density By in the Y-axis direction according to the acquisition result of the acquisition device 90 (step S123). The controller 20 stores the magnetic flux density By for each θ (step S124). Next, the controller 20 causes the phase adjuster 30 to stop applying the Y coil voltage Ey (step S125).

  Next, the controller 20 compares the magnetic flux densities By and Bcos θ for each θ (step S126). If there is a discrepancy of the degree of error, it may be determined as a match. When it is determined as “match” in step S126, the controller 20 stores the Y coil voltage Ey as Ey (1) in the database DB (step S127). When it is determined as “mismatch” in step S126, the controller 20 adjusts the Y coil voltage Ey (step S128). Next, the controller 20 instructs the phase adjuster 30 to cause the Y-axis coil power source 50b to apply the adjusted Y-coil voltage Ey to the Y-axis coil 40b (step S129). Next, the controller 20 measures the magnetic flux density By in the Y-axis direction using the acquisition result of the acquirer 90 (step S130). The controller 20 stores the magnetic flux density By in the database DB in association with each θ (step S131). Next, the controller 20 causes the phase adjuster 30 to stop applying the Y coil voltage Ey (step S132). Thereafter, step S126 is executed again.

  Referring to FIG. 3 again, the controller 20 applies the adjusted X coil voltage and the adjusted Y coil voltage (step S11). Next, the controller 20 measures the magnetic flux density (step S12). Next, the controller 20 compares the measured magnetic flux density with the reference data (step S13). Next, the controller 20 performs readjustment of the X coil voltage and the Y coil voltage (step S14).

  FIG. 7 is a flowchart illustrating the details of steps S11 to S14. As illustrated in FIG. 7, the controller 20 inputs Ex (1) as the X coil voltage and Ey (1) as the Y coil voltage to the phase adjuster 30. Thereby, the X-axis coil power supply 50a applies the X-coil voltage Ex = Ex (1) to the X-axis coil 40a, and the Y-axis coil power supply 50b applies the Y-coil voltage Ey = Ey to the Y-axis coil 40b. (1) is applied (step S133). Next, the controller 20 measures the magnetic flux density Bx in the X-axis direction and the magnetic flux density By in the Y-axis direction according to the acquisition result of the acquirer 90 (step S134). The controller 20 stores the magnetic flux density Bx and the magnetic flux density By in the database DB in association with each θ (step S135). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex (1) and the Y coil voltage Ey (1) (step S136).

  Next, the controller 20 compares the magnetic flux densities Bx and Bsinθ for each θ, and compares the magnetic flux densities By and Bcosθ (step S137). If there is a discrepancy of the degree of error, it may be determined as a match. When it is determined as “match” in step S137, the controller 20 stores the X coil Ex as Ex (2) in the database DB, and stores the Y coil voltage Ey as Ey (2) in the database DB (step S138). . When it is determined as “mismatch” in step S137, the controller 20 adjusts the X coil voltage Ex and the Y coil voltage Ey (step S139). Next, the controller 20 instructs the phase adjuster 30 to cause the X-axis coil power supply 50a to apply the adjusted X-coil voltage Ex to the X-axis coil 40a and adjust the Y-axis coil power supply 50b. The Y coil voltage Ey is applied to the Y axis coil 40b (step S140).

  Next, the controller 20 measures the magnetic flux density Bx in the X-axis direction and the magnetic flux density By in the Y-axis direction using the acquisition result of the acquirer 90 (step S141). Next, the controller 20 stores the magnetic flux density Bx and the magnetic flux density By in the database DB in association with each θ (step S142). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex and the Y coil voltage Ey (step S143). Thereafter, step S137 is executed again.

  Referring to FIG. 3 again, the controller 20 receives an input of a desired strain based on the applied stress (step S15). Here, the desired strain is (applied stress / Young's modulus of the magnetic sample 10). Next, the controller 20 refers to the database DB and assigns magnetostriction according to the magnetic flux density (step S16). Next, the controller 20 calculates a piezo strain based on the desired strain and magnetostriction (step S17). Here, the piezo strain is a value obtained by subtracting magnetostriction from desired strain. Next, the controller 20 refers to the database DB and assigns a piezo drive voltage according to the piezo distortion (step S18).

  FIG. 8 is a flowchart illustrating details of step S15 to step S18. As illustrated in FIG. 8, the controller 20 receives an input of a desired distortion in the X-axis direction and a desired distortion in the Y-axis direction (step S144). Next, the controller 20 reads from the database DB the relationship between the magnetic flux density Bx and the magnetostriction λx in the X-axis direction and the relationship between the magnetic flux density By and the magnetostriction λy in the Y-axis direction (step S145). The relationship between the magnetic flux density Bx and the magnetostriction λx and the relationship between the magnetic flux density By and the magnetostriction λy can be measured in advance using the magnetic sample 10. Further, the controller 20 reads from the database DB the relationship between the piezoelectric drive voltage Vx in the X-axis direction and the piezoelectric strain εx and the relationship between the piezoelectric drive voltage Vy in the Y-axis direction and the piezoelectric strain εy (step S146). The relationship between the piezo drive voltage Vx and the piezo strain εx and the relationship between the piezo drive voltage Vy and the piezo strain εy can be measured in advance using the magnetic sample 10.

Next, the controller 20 assigns the magnetostriction λx corresponding to Bx = Bsinθ and the magnetostriction λy corresponding to By = Bcosθ (step S147). Next, the controller 20 stores the magnetostriction λx according to Bx = Bsinθ and the magnetostriction λy according to By = Bcosθ in the database DB (step S148). Next, the controller 20 calculates the following equation for each θ (step S149).
εx = desired strain in X direction + λx
εy = desired strain in the Y direction + λy
Here, the piezoelectric strains εx, εy, the desired strain in the X direction, the desired strain in the Y direction, λx, λy are values including the sign. It is stress.

  Next, the controller 20 stores the piezo strain εx and the piezo strain εy in the database DB in association with each θ (step S150). Next, the controller 20 assigns the piezo drive voltage Vx and the piezo drive voltage Vy corresponding to the piezo strain εx and the piezo strain εy (step S151). The piezo drive voltage Vx is a voltage applied to the X-axis piezo material 13. The piezo drive voltage Vy is a voltage applied to the Y-axis piezo material 14. Next, the controller 20 stores the piezo drive voltage Vx and the piezo drive voltage Vy as Vx (0) and Vy (0) in association with each θ (step S152).

  Referring to FIG. 3 again, the controller 20 applies the readjusted X coil voltage and the readjusted Y coil voltage (step S19). Next, the controller 20 applies a piezo drive voltage (step S20). Next, the controller 20 measures the magnetic flux density (step S21). Next, the controller 20 measures piezo distortion (step S22).

  Next, the controller 20 compares the desired strain with the actually measured strain (step S23). Next, the controller 20 adjusts the piezo drive voltage in the X-axis direction and the Y-axis direction (step S24). Next, the controller 20 compares the measured magnetic flux density with the reference data (step S25). Next, the controller 20 performs final adjustment of the X coil voltage and the Y coil voltage (step S26).

  9 and 10 are flowcharts illustrating details of step S19 to step S26. As illustrated in FIG. 9, the controller 20 inputs Ex (2) to the phase adjuster 30 as the X coil voltage. Accordingly, the X-axis coil power supply 50a applies the X coil voltage Ex = Ex (2) to the X axis coil 40a (step S153). Next, the controller 20 inputs Ey (2) as the Y coil voltage to the phase adjuster 30. Thereby, the Y-axis coil power supply 50b applies the Y coil voltage Ey = Ey (2) to the Y axis coil 40b (step S154).

  Next, the controller 20 inputs Vx (0) as a piezo drive voltage to the phase adjuster 30. Thereby, the X-axis piezo power supply 60a applies the piezo drive voltage Vx = Vx (0) to the X-axis piezo material 13 (step S155). Next, the controller 20 inputs Vy (0) as a piezo drive voltage to the phase adjuster 30. Thereby, the Y-axis piezo power supply 60b applies the piezo drive voltage Vy = Vy (0) to the Y-axis piezo material 14 (step S156).

  Next, the controller 20 measures the magnetic flux density Bx and the magnetic flux density By according to the acquisition result of the acquirer 90 (step S157). Next, the controller 20 measures the distortion εx and the distortion εy according to the acquisition result of the acquirer 90 (step S158). Next, the controller 20 stores the magnetic flux density Bx and the magnetic flux density By in the database DB in association with each θ (step S159). Next, the controller 20 stores the strain εx and the strain εy in the database DB in association with each θ (step S160).

  Next, the controller 20 causes the phase adjuster 30 to stop applying the piezo drive voltage Vx (0) (step S161). Next, the controller 20 causes the phase adjuster 30 to stop applying the piezo drive voltage Vy (0) (step S162). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex (2) (step S163). Next, the controller 20 causes the phase adjuster 30 to stop applying the Y coil voltage Ey (2) (step S164).

  Next, as illustrated in FIG. 10, the controller 20 determines whether or not the desired strain, the strain εx, and the strain εy match for each θ (step S165). If there is a discrepancy of the degree of error, it may be determined as a match. The determination in step S165 is referred to as determination A. When it is determined as “match” in step S165, the controller 20 associates each θ with the piezo drive voltage Vx and the piezo drive voltage Vy as the piezo drive voltage Vx (1) and the piezo drive voltage Vy (1). (Step S166).

  Next, the controller 20 determines whether or not the magnetic flux densities Bx and Bsinθ match and the magnetic flux densities By and Bcosθ match each θ (step S167). If there is a discrepancy of the degree of error, it may be determined as a match. The determination in step S167 is referred to as determination B. When it is determined as “match” in step S167, the controller 20 sets the X coil voltage Ex (2) and the Y coil voltage Ey (2) as the X coil voltage Ex (3) and the Y coil voltage Ey (3). (Step S168). Next, the controller 20 determines whether or not there is a mismatched experience between the determination A and the determination B (step S169). If “No” is determined in step S169, the process is executed again from step S165. In this case, the presence / absence of experience of mismatch between the judgment A and the judgment B is reset.

  When it is determined as “mismatch” in step S165, the controller 20 adjusts the piezo drive voltage Vx and the piezo drive voltage Vy (step S170). Next, the controller 20 inputs Ex (2) to the phase adjuster 30 as the X coil voltage. As a result, the X-axis coil power supply 50a applies the X coil voltage Ex = Ex (2) to the X axis coil 40a (step S171). Next, the controller 20 inputs Ey (2) as the Y coil voltage to the phase adjuster 30. Thereby, the Y-axis coil power supply 50b applies the Y coil voltage Ey = Ey (2) to the Y axis coil 40b (step S172).

  Next, the controller 20 inputs the adjusted piezo drive voltage Vx to the phase adjuster 30. Thereby, the X-axis piezo power supply 60a applies the piezo drive voltage Vx to the X-axis piezo material 13 (step S173). Next, the controller 20 inputs the adjusted piezo drive voltage Vy to the phase adjuster 30. Thereby, the Y-axis piezoelectric power supply 60b applies the piezoelectric drive voltage Vy to the Y-axis piezoelectric material 14 (step S174).

  Next, the controller 20 measures the magnetic flux density Bx and the magnetic flux density By according to the acquisition result of the acquirer 90 (step S175). Next, the controller 20 measures the distortion εx and the distortion εy according to the acquisition result of the acquirer 90 (step S176). Next, the controller 20 stores the magnetic flux density Bx and the magnetic flux density By in the database DB in association with each θ (step S177). Next, the controller 20 stores the strain εx and the strain εy in the database DB in association with each θ (step S178). Next, the controller 20 causes the phase adjuster 30 to stop applying the piezo drive voltage Vx and the piezo drive voltage Vy (step S179). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex (2) and the Y coil voltage Ey (2) (step S180). Thereafter, step S165 is executed again.

  When it is determined as “mismatch” in step S167, the controller 20 adjusts the X coil voltage Ex and the Y coil voltage Ey (step S181). Next, the controller 20 inputs the adjusted X coil voltage Ex to the phase adjuster 30. Thereby, the X-axis coil power supply 50a inputs the adjusted X-coil voltage Ex to the X-axis coil 40a (step S182). Next, the controller 20 inputs the adjusted Y coil voltage Ey to the phase adjuster 30. Thereby, the Y-axis coil power supply 50b inputs the adjusted Y coil voltage Ey to the Y axis coil 40b (step S183).

  Next, the controller 20 inputs the piezo drive voltage Vx = Vx (1) to the phase adjuster 30. Thereby, the X-axis piezo power supply 60a applies the piezo drive voltage Vx = Vx (1) to the X-axis piezo material 13 (step S184). Next, the controller 20 inputs the piezo drive voltage Vy = Vy (1) to the phase adjuster 30. Thereby, the Y-axis piezo power supply 60b applies the piezo drive voltage Vy = Vy (1) to the Y-axis piezo material 14 (step S185).

  Next, the controller 20 measures the magnetic flux density Bx and the magnetic flux density By according to the acquisition result of the acquirer 90 (step S186). Next, the controller 20 measures the distortion εx and the distortion εy according to the acquisition result of the acquirer 90 (step S187). Next, the controller 20 stores the magnetic flux density Bx and the magnetic flux density By in the database DB in association with each θ (step S188). Next, the controller 20 stores the strain εx and the strain εy in the database DB in association with each θ (step S189). Next, the controller 20 causes the phase adjuster 30 to stop applying the piezo drive voltage Vx (1) and the piezo drive voltage Vy (1) (step S190). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex and the Y coil voltage Ey (step S191). Thereafter, step S167 is executed again.

  Referring to FIG. 3 again, the controller 20 applies the finally adjusted X coil voltage and Y coil voltage (step S27). Next, the controller 20 applies the adjusted piezo drive voltage in the X-axis direction and the Y-axis direction (step S28). Next, the controller 20 measures the magnetic field and the magnetic flux density (step S29). Next, the controller 20 graphs the relationship between the magnetic flux density Bx and the magnetic flux density By and the relationship between the magnetic field Hx and the magnetic field Hy (step S30).

  FIG. 11 is a flowchart showing details of steps S27 to S30. As illustrated in FIG. 11, when the controller 20 determines “Yes” in step S <b> 169 of FIG. 10, the controller 20 inputs Ex (3) as the X coil voltage to the phase adjuster 30. Thereby, the X-axis coil power supply 50a applies the X-coil voltage Ex = Ex (3) to the X-axis coil 40a (step S192). Next, the controller 20 inputs Ey (3) to the phase adjuster 30 as the Y coil voltage. Thereby, the Y-axis coil power supply 50b applies the Y-coil voltage Ey = Ey (3) to the Y-axis coil 40b (step S193).

  Next, the controller 20 inputs Vx (1) to the phase adjuster 30 as a piezo drive voltage. Thereby, the X-axis piezo power supply 60a applies the piezo drive voltage Vx = Vx (1) to the X-axis piezo material 13 (step S194). Next, the controller 20 inputs Vy (1) to the phase adjuster 30 as a piezo drive voltage. Thereby, the Y-axis piezo power supply 60b applies the piezo drive voltage Vy = Vy (1) to the Y-axis piezo material 14 (step S195).

  Next, the controller 20 measures the magnetic field Hx and the magnetic field Hy according to the acquisition result of the acquirer 90 (step S196). Next, the controller 20 measures the magnetic flux density Bx and the magnetic flux density By according to the acquisition result of the acquirer 90 (step S197). Next, the controller 20 stores the magnetic field Hx and the magnetic field Hy in the database DB in association with each θ (step S198). Next, the controller 20 stores the magnetic flux density Bx and the magnetic flux density By in the database DB in association with each θ (step S199).

  Next, the controller 20 causes the phase adjuster 30 to stop applying the piezo drive voltage Vx (1) (step S200). Next, the controller 20 causes the phase adjuster 30 to stop applying the piezo drive voltage Vy (1) (step S201). Next, the controller 20 causes the phase adjuster 30 to stop applying the X coil voltage Ex (3) (step S202). Next, the controller 20 causes the phase adjuster 30 to stop applying the Y coil voltage Ey (3) (step S203). Next, the controller 20 graphs the relationship between the magnetic flux density Bx and the magnetic flux density By sharing θ (step S204). Next, the controller 20 graphs the relationship between the magnetic field Hx and the magnetic field Hy that share θ (step S205). Thereafter, the execution of the flowchart ends.

  FIG. 12 is a diagram illustrating a table example of data stored in association with each θ. As illustrated in FIG. 12, for example, an X coil voltage Ex, a Y coil voltage Ey, a piezo drive voltage Vx, a piezo drive voltage Vy, and the like are stored in association with θ1, θ2, θ3,. These data are created by the processing of steps S1 to S26 in FIG. Further, in association with θ1, θ2, θ3,..., Magnetic flux density Bx, magnetic flux density By, magnetic field Hx, magnetic field Hy, and the like are stored as measured values. These data are created by the process of step S29 in FIG.

  Fig.13 (a)-FIG.13 (e) are the figures showing the result of the magnetic characteristic test done by the method based on a present Example. FIG. 13A shows the distortion of the magnetic sample 10 in the X-axis direction. FIG. 13B shows the distortion of the magnetic sample 10 in the Y-axis direction. FIG. 13C shows a combined distortion of the distortion in the X-axis direction and the distortion in the Y-axis direction. 13A to 13C, the horizontal axis represents the phase of the rotating magnetic field, and the vertical axis represents the strain (ppm). A solid line represents a case where the X-axis piezo material 13 and the Y-axis piezo material 14 are not used. A dotted line represents a case where magnetostriction is reduced by using the X-axis piezo material 13 and the Y-axis piezo material 14. A broken line represents a case where magnetostriction is canceled (cancelled) using the X-axis piezo material 13 and the Y-axis piezo material 14. The rotation frequency is 1 kHz.

  As illustrated in FIGS. 13A to 13C, when the X-axis piezo material 13 and the Y-axis piezo material 14 are not used, the magnetostriction is not reduced, and thus the distortion is large. On the other hand, the strain is reduced by reducing the magnetostriction using the X-axis piezo material 13 and the Y-axis piezo material 14. The magnetostriction is canceled by driving the piezo material in synchronization with the phase θ of the rotating magnetic field. In this embodiment, since the magnetic flux density is controlled to be constant, as illustrated in FIG. 13D, the locus of the magnetic flux density is almost a perfect circle in any case. On the other hand, as illustrated in FIG. 13E, the locus of the magnetic field becomes different by driving the piezo material. This is because magnetostriction can be reduced and controlled.

(Other examples)
FIG. 14 is a block diagram for explaining the hardware configuration of the controller 20. As illustrated in FIG. 14, the controller 20 includes a CPU 201, a RAM 202, a storage device 203, an interface 204, and the like. Each of these devices is connected by a bus or the like. A CPU (Central Processing Unit) 201 is a central processing unit. The CPU 201 includes one or more cores. A RAM (Random Access Memory) 202 is a volatile memory that temporarily stores programs executed by the CPU 201, data processed by the CPU 201, and the like. The storage device 203 is a nonvolatile storage device. As the storage device 203, for example, a ROM (Read Only Memory), a solid state drive (SSD) such as a flash memory, a hard disk driven by a hard disk drive, or the like can be used. When the CPU 201 executes the magnetic measurement program, the controller 20 is realized in the magnetic property measuring apparatus 100. Alternatively, the controller 20 may be hardware such as a dedicated circuit.

  In the above example, the strain is applied so as to reduce the magnetostriction of the magnetic material caused by the application of the magnetic field in the biaxial direction. When applying a uniaxial or triaxial magnetic field, by adding strain to the magnetic material so as to reduce the magnetostriction of the magnetic material caused by the application of the magnetic field, the effect of magnetostriction is reduced and the magnetic characteristics are improved. Can be measured.

  In the above example, the X-axis coil 40a and the Y-axis coil 40b function as an example of a magnetic field application device that applies a magnetic field to the magnetic material. X-axis piezo material 13, Y-axis piezo material 14, controller 20 and phase adjuster 30 of a strain applying device that adds strain to a magnetic material so as to reduce magnetostriction of the magnetic material caused by application of a magnetic field by the magnetic field applying device. It serves as an example. The Bx coil 11, the By coil 12, the controller 20, and the collector 90 function as an example of a measuring device that measures the magnetic flux density induced in the magnetic material.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

DESCRIPTION OF SYMBOLS 10 Magnetic sample 11 Bx coil 12 By coil 13 X-axis piezo material 14 Y-axis piezo material 20 Controller 30 Phase adjuster 40a X-axis coil 40b Y-axis coil 50a X-axis coil power supply 50b Y-axis coil power supply 60a X-axis piezo power supply 60b Y-axis piezo power supply 70a X-axis magnetic field sensor 70b Y-axis magnetic field sensor 80a X-axis strain sensor 80b Y-axis strain sensor 90 Acquisition device 100 Magnetic characteristic measuring device

Claims (5)

A magnetic field application device for applying a rotating magnetic field for the magnetic material,
A strain applying device that applies strain to the magnetic material in synchronization with the phase angle of the rotating magnetic field ;
And a measuring device that measures the magnetic properties of the magnetic material in a state where strain is applied to the magnetic material by the strain applying device. The magnetic characteristic measuring apparatus according to claim 1 , wherein the magnetic field applying device performs control to keep a scalar amount of the rotating magnetic field constant. 3. The magnetic characteristic measuring apparatus according to claim 1 , wherein the strain applying device is a voltage-driven piezo material. The rotating magnetic field is applied for the magnetic material,
Adding strain to the magnetic material in synchronization with the phase angle of the rotating magnetic field ;
A magnetic property measuring method, comprising: measuring magnetic properties of the magnetic material in a state where strain is applied to the magnetic material. On the computer,
A process for applying a rotating magnetic field for the magnetic material,
A process of adding strain to the magnetic material in synchronization with the phase angle of the rotating magnetic field ;
And a process for measuring the magnetic properties of the magnetic material in a state where strain is applied to the magnetic material.

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