JP6464646B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

In recent years, light emitting devices using light emitting elements such as light emitting diodes (LEDs) and laser diodes (LDs) have been used as various light sources.
As such a light emitting device, for example, a configuration in which a light emitting element is mounted on a wiring portion on a substrate via an anisotropic conductive member (ACP) and covered with a sealing resin is known. Yes.

  Here, in the light emitting device described above, the paste-like anisotropic conductive member is disposed on the substrate and the wiring portion, and then the light emitting element is pressure-bonded while being heated, and the anisotropic conductive member is cured and bonded. For this reason, during thermocompression bonding, the solvent contained in the anisotropic conductive member is vaporized, and voids (voids) due to bubbles are formed at the interface between the anisotropic conductive member filled between the wiring portions and other members. May occur. Further, during the pressure bonding of the light emitting element, the central portion (above the gap) of the light emitting element is deformed downward according to the pressure. Therefore, the reaction inside the pressure bonding is completed and the deformation of the light emitting element returns to the original state, the inside of the anisotropic conductive member is in a reduced pressure state, and a cavity due to bubbles may be generated.

  Conventionally, in order to prevent the generation of a cavity of a semiconductor element as described above, a method of forming a hole that allows ventilation in the thickness direction of the substrate (see Patent Document 1), or a protective film that covers the substrate is formed in the cavity. A method of forming a groove for discharging bubbles (see Patent Document 2) has been proposed.

JP-A-5-343844 JP 2005-101125 A

  However, for example, when the method according to Patent Document 1 or Patent Document 2 is applied to the light-emitting device, the anisotropic conductive member or the sealing resin enters the above-described hole or groove, and ventilation becomes difficult.

  In addition, when the inventors of the present application drive a light-emitting device that includes such a cavity due to bubbles, the bubbles expand as the temperature of the light-emitting element rises, and the bubbles try to escape to the outside. It has been found that an air layer is formed at the interface between the sealing resin and the sealing resin, resulting in problems such as a decrease in light output.

  The present invention has been made in view of the above points, and even if there is a cavity at the interface between the anisotropic conductive member and the other member and the bubbles in the cavity move due to heat during driving, It is an object of the present invention to provide a light emitting device that can effectively discharge the bubbles and hardly reduce the light output, and a method for manufacturing the light emitting device.

  In order to solve the above-described problem, a light emitting device according to an embodiment of the present invention includes a substrate having at least a pair of wiring portions arranged on a base via an adhesive layer and spaced apart from each other, and an anisotropic conductive member. And the light-emitting element bonded onto the pair of wiring portions, and the adhesive layer has a configuration in which an adhesive is arranged in a plurality of lines at predetermined intervals on the base.

  Moreover, in order to solve the said subject, the manufacturing method of the light-emitting device which concerns on this invention was made into the following procedures. That is, a method for manufacturing a light emitting device includes an adhesive placement step in which an adhesive is placed in a plurality of lines at predetermined intervals on a base, and a metal foil that adheres a metal foil to the base via the adhesive A step of forming a substrate by an adhesion step, and a step of forming a wiring portion on the substrate, wherein at least a pair of wiring portions separated from each other from the metal foil; and an anisotropic conductive member on the pair of wiring portions An anisotropic conductive member arranging step of arranging a light emitting element, and a light emitting element joining step of joining a light emitting element on the wiring portion via the anisotropic conductive member.

  According to the light emitting device of the present invention, bubbles that expand and move by heat during driving from a cavity formed at the interface between the anisotropic conductive member and another member are provided on the substrate along the wiring portion. The space between the adhesives can be exhausted to the outside as a discharge path.

  According to the method for manufacturing a light emitting device according to the present invention, an anisotropic conductive member is formed by connecting a metal foil serving as a wiring portion to a substrate via an adhesive layer provided with linear adhesives spaced apart from each other. When there is a cavity at the interface between the adhesive and other members, bubbles that move due to heat can be discharged to the outside using the interface between the linear adhesive and the anisotropic conductive member and the space between the adhesive as a discharge path. . Therefore, in the method for manufacturing a light-emitting device according to the present invention, there is no need for machining such as drilling in the configuration of an existing substrate and the air is not generated at the interface between the light-emitting element and the sealing resin without a large manufacturing process change. It is possible to manufacture a light emitting device in which no layer is formed and problems such as a decrease in light output are prevented.

It is a top view which shows typically the whole light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows typically the light-emitting device which concerns on 1st Embodiment, and is sectional drawing in the BB line of FIG. It is an expanded sectional view which shows typically A section of Drawing 2A of a light-emitting device concerning a 1st embodiment. It is a figure shown about the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically the state which has arrange | positioned the adhesive agent to a base | substrate. It is a figure shown about the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically the state which joined metal foil to the base | substrate via the adhesive agent. It is a figure shown about the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically the state formed so that the metal foil joined to the base | substrate might become a pair of wiring part. It is a figure shown about the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically the state which has arrange | positioned the anisotropic conductive member in the gap | interval of a pair of wiring part. It is a figure shown about the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically the state which joined the light emitting element on the wiring part via the arrange | positioned anisotropic conductive member. It is a figure shown about the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically the state which provided sealing resin so that a light emitting element and an anisotropic conductive member might be coat | covered. It is a figure which shows the state of the adhesive agent in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is sectional drawing which shows typically the state before an adhesive agent is pressed by the base | substrate with the metal foil used as a wiring board. . It is a figure which shows the state of the adhesive agent in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: The cross section which shows typically the state by which the adhesive agent was pressed by the base | substrate with the metal foil used as a wiring board from the state of FIG. 4A. FIG. It is a figure which shows the state of the adhesive agent in the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: The other state by which the adhesive agent was pressed by the base | substrate with the metal foil used as a wiring board from the state of FIG. 4A is shown typically. It is sectional drawing shown. It is a top view which shows typically the light-emitting device which concerns on 2nd Embodiment. FIG. 6 is a light-emitting device according to a second embodiment, and is a cross-sectional view schematically showing a cross section taken along line BB in FIG. 5. It is a figure which shows the manufacturing process of the light-emitting device which concerns on 2nd Embodiment, and is a top view which shows typically the state which apply | coated the adhesive agent to the board | substrate of the light-emitting device. It is a figure which shows the manufacturing process of the light-emitting device which concerns on 2nd Embodiment, and is a top view which shows typically the state which joined metal foil to the board | substrate via the adhesive agent. It is a figure which shows the manufacturing process of the light-emitting device which concerns on 2nd Embodiment, and is a top view which shows typically the state which formed the metal foil joined to the board | substrate so that it might become a pair of wiring part. It is a figure which shows the manufacturing process of the light-emitting device which concerns on 2nd Embodiment, and is a top view which shows typically the state which provided the reflective material layer on wiring parts other than the joining area | region which joins a light emitting element, and a board | substrate. It is a figure which shows the manufacturing process of the light-emitting device which concerns on 2nd Embodiment, and is a top view which shows typically the state which apply | coated the anisotropic conductive member to the joining area | region. It is a figure which shows the manufacturing process of the light-emitting device which concerns on 2nd Embodiment, and is a top view which shows typically the state which joined the light emitting element on the wiring part. It is a figure which shows the light-emitting device which concerns on other embodiment, Comprising: It is a top view which typically shows the whole by notching a part of light-emitting device. It is a figure which shows the light-emitting device which concerns on other embodiment, Comprising: It is an enlarged plan view which expands and shows typically the A1 part shown to FIG. 8A. It is a figure which shows the light-emitting device which concerns on other embodiment, Comprising: It is sectional drawing which shows typically the cross section in CC line of FIG. 8A.

  Hereinafter, a light emitting device as an example of an embodiment according to the present invention and a manufacturing method thereof will be described with reference to the drawings. Note that the drawings referred to in the following description schematically show the present invention, and therefore the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There is a case. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and shall omit detailed description suitably.

<First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device 1 according to the first embodiment will be described with reference to FIGS. 1, 2A, and 2B. The light emitting device 1 can be used as a light source of a display device or a lighting device, for example. As shown in FIG. 2A, the light emitting device 1 includes a base body 11, a wiring portion 20, an anisotropic conductive member 30, an exhaust passage 40, a light emitting element 50, and a sealing resin 60.

  The substrate 10 is for arranging each member constituting the light emitting device 1. As shown in FIGS. 1 and 2A, the substrate 10 includes a base body 11 made of a resin layer and a wiring portion 20 formed on one surface of the base body 11 with an adhesive layer 12 interposed therebetween. The above-mentioned “one surface of the substrate 11” means the surface of the substrate 11 on the light emitting element 50 side. The material of the base 11 is not particularly limited, and insulating ceramics, resins, and the like can be used.

Further, as the substrate 11, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyetherimide (PEI), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), unsaturated polyester, glass epoxy, etc. When using a flexible or flexible resin material such as an insulating resin film, an anisotropic conductive member that can be bonded at a lower temperature than solder or the like is used for mounting the light emitting element. Is preferred. However, when the anisotropic conductive member 30 is crimped, the base body 11 bends in the vertical direction and returns to the original state after the completion of the crimping, thereby generating a cavity between the anisotropic conductive member 30 and the base body 11 or the wiring part 20. It becomes easy. Therefore, the present invention, which can reduce the adverse effects of cavities generated when the anisotropic conductive member 30 is used, is particularly preferably applied to a light emitting device using a resin material having flexibility or flexibility as a substrate. Can do.
The thickness of the substrate 10 is not particularly limited, and can be formed with an arbitrary thickness depending on the purpose and application.

  The adhesive layer 12 is for adhering the wiring part 20 to one surface of the base 11 and is made of, for example, urethane resin, epoxy resin, or the like. As shown in FIG. 1, the adhesive layer 12 is provided so that the adhesive 13 is applied in a linear shape so that the linear adhesives 13 do not completely overlap each other. The adhesive 13 is also provided in the gap G between the wiring portions 20 and 20 so as to be spaced apart from each other and at a predetermined angle θ with respect to the straight line of the gap G. That is, the linear adhesive 13 is provided so as to intersect the straight direction of the gap G. As shown in FIG. 4A and FIG. 4B, the adhesive 13 is in a state where a predetermined distance D1 is provided as a space 14 when it is interposed between the base 11 and the wiring portion 20 (metal foil 200). Is provided. Therefore, the linear adhesive 13 is provided on the lower surface of the wiring portion 20 with the adjacent adhesive 13 and the space 14 being separated. As shown in FIG. 2B, the adhesive 13 is disposed in the space 14 at the position facing the lower surfaces of the anisotropic conductive member 30 and the sealing resin 60 described later. 60 has entered. Therefore, the space 14 of the adhesive 13 is configured as a bubble discharge path (exhaust passage) 40 at a position along the gap G between the wiring portions 20 and 20. The exhaust passage 40 will be described later.

The wiring unit 20 is for electrically connecting an external power source and the light emitting element 50.
As shown in FIGS. 1 and 2A, the wiring portion 20 of the present embodiment is configured as a pair corresponding to the pair of positive and negative electrodes 51 of the light emitting element 50, and a predetermined gap G is formed on the adhesive layer 12 of the substrate 10. They are spaced apart. The gap G is provided at a position corresponding to the diameter of the sealing resin 60 described later. The wiring part 20 is formed in a film shape having a predetermined thickness when viewed in cross section as shown in FIG. 2A. In addition, the wiring unit 20 includes a circular region and linear regions extending from the circular region to the left and right end portions of the substrate 10 in plan view as shown in FIG. Divides the circular region into two. The circular region of the wiring part 20 has an area equal to or wider than the circular region covered with the sealing resin 60 described later, and the periphery is exposed to the outside of the sealing resin 60. doing.

  In the gap G of the wiring part 20, as shown in FIG. 1, the adhesive layer 12 that is the uppermost surface of the substrate 10 is exposed, and an anisotropic conductive member 30 is directly provided on the adhesive layer 12, and here, A bubble exhaust passage 40 is formed. The exhaust passage 40 will be described later. As a material of the wiring part 20, for example, copper, silver, gold, aluminum, nickel, tin and alloys thereof, or a laminate thereof can be used. The outermost surface of the wiring part 20 is preferably gold or tin. Thereby, joining with the electroconductive particle 32 in the anisotropic conductive member 30 mentioned later can be performed favorably. Moreover, the thickness of the wiring part 20 is not specifically limited, It can form by arbitrary thickness according to the objective and a use. As the wiring portion 20 is thicker and the difference in height between the base 11 and the upper surface of the wiring portion 20 is larger, a cavity is more likely to be generated at the interface between the anisotropic conductive member 30 and another member. Therefore, it is preferable that the thickness of the wiring part 20 is about 10-100 micrometers, 20-80 micrometers, and 30-50 micrometers.

  Further, the width of the gap G described above can be set within a range of 150 μm to 300 μm, for example. The shape of the wiring part 20 and the gap G in plan view is not particularly limited. However, as shown in FIG. 1, the gap G does not have a bent part or a wide part in the part facing the anisotropic conductive member 30, that is, A linear or curved shape is preferred. When the gap G has a bent portion or a wide portion, a cavity is likely to be generated at the interface between the anisotropic conductive member 30 and other members around the gap G. However, by forming the gap G into a shape that does not have a linear or curved bent portion, the generation of cavities at the interface between the anisotropic conductive member 30 and other members can be suppressed. When the gap G has a bent part or a wide part, it is preferable to provide a discharge path described later so as to contact the part.

  The anisotropic conductive member 30 is for adhering and fixing the light emitting element 50 to the substrate 10 and for conducting the light emitting element 50 and the wiring portion 20. The anisotropic conductive member 30 is normally disposed on the pair of wiring parts 20 and in the gap G when viewed in cross section as shown in FIGS. 1 and 2A. Further, the anisotropic conductive member 30 is formed in a circular region so as to include the gaps G on the pair of wiring portions 20 when viewed in plan as shown in FIG. The anisotropic conductive member 30 is disposed in a larger area than the light emitting element 50 to be bonded.

Since the anisotropic conductive member 30 has two functions of bonding and fixing the light emitting element 50, the transparent resin 31 as an adhesive, and conductive particles 32 as a conductive member mixed therein, The composite of at least.
As the material of the translucent resin 31, a material excellent in light resistance and heat resistance is preferable. Specifically, an epoxy resin, a silicone resin, a polyimide resin, a modified resin thereof, a hybrid resin, or the like can be used. In addition, the conductive particles 32 are preferably those in which at least a part is a magnetic material, and specifically, a material having a conductive material such as nickel (Ni), iron (Fe), cobalt (Co), stainless steel on the surface. Can be used. The shape and size of the conductive particles 32 are not particularly limited. For example, as shown in FIG. 2A, a spherical shape, a needle shape, or an irregular shape, and a size of 1 μm to 20 μm can be used.

The conductive particles 32 may be constituted by a core made of a resin and a conductive layer made of a metal that covers the core. By using a flexible resin for the core, bonding by pressure bonding can be easily performed. For example, a methacrylic resin can be used as the material of the core, and the above-described metal can be used as the conductive layer. The conductive layer can be formed by electroless plating, electrolytic plating, mechanofusion (mechanochemical reaction), or the like.
The conductive particles 32 are present in the anisotropic conductive member 30 at a substantially uniform concentration, but are not shown in some parts, for example, in the gap G.
The anisotropic conductive member 30 may contain a light reflecting material such as titanium oxide or zinc oxide in order to increase the light reflectance.
The arrangement region of the anisotropic conductive member 30 is not limited to a circular shape in a plan view as shown in FIG. In addition, it is not limited to be disposed in a larger area than the light emitting element, and may have an area substantially equal to or less than that as long as adhesion and conduction can be sufficiently performed.

  The exhaust passage 40 is provided at a position along the gap G. Further, the exhaust passage 40 is formed over the outer periphery of the wiring portions 20 and 20 adjacent to the gap G. The exhaust passage 40 forms the space 14 as a passage for exhausting bubbles by providing the adhesive 13 through the space 14. The exhaust passage 40 is formed so as to be continuous with the gap G, so that the air bubbles moving on the interface between the anisotropic conductive member 30 and other members on the lower side of the light emitting element 50 are different. It is discharged out of the isotropic conductive member 30 or out of the sealing resin 60. That is, when a bubble that expands and moves due to heat is generated at the interface of the anisotropic conductive member 30, the bubble moves along a portion that easily passes. Since there are many continuous spaces 14 along the gap G, the bubbles moving on the interface between the anisotropic conductive member 30 and other members are exhausted to the outside using the space 14 as the exhaust passage 40. .

  In the present embodiment, as shown in FIG. 1, the light emitting element 50 includes a pair of positive and negative electrodes 51 on the surface opposite to the light emitting surface, and the electrodes 51 respectively correspond to wirings via the anisotropic conductive member 30. The chip 20 is flip-chip bonded to the portion 20. More specifically, as shown in FIG. 2A, the light emitting element 50 is bonded onto the pair of wiring parts 20 via the anisotropic conductive member 30 so as to straddle the gap G between the pair of wiring parts 20. ing. The light emitting element 50 is provided at the center of a sealing resin 60 described later. The above-described “light emitting surface” is a surface on the opposite side to the surface facing the substrate 10 when the light emitting element 50 is bonded to the wiring portion 20 of the substrate 10, and the light extraction direction of the light emitting device 1. It is a side surface.

As the light emitting element 50, for example, a light emitting diode having a semiconductor layer composed of an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer can be used, and a light emitting diode having an arbitrary wavelength can be selected. For example, as a light emitting element 50 of blue (light having a wavelength of 430 nm to 490 nm) and green (light having a wavelength of 490 nm to 570 nm), ZnSe, nitride-based semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, or the like can be used. As the red light emitting element 50 (light having a wavelength of 620 nm to 750 nm), GaAlAs, AlInGaP, or the like can be used. In the case of the light emitting device 1 using a fluorescent material, a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 capable of efficiently exciting the fluorescent material and capable of emitting light of a short wavelength. ≦ Y, X + Y ≦ 1) is preferably used. Note that the component composition, emission color, size, and the like of the light emitting element 50 can be appropriately selected according to the purpose and application.

The electrodes of the light emitting element 50 are not limited to those having a pair of positive and negative electrodes on the surface opposite to the light emitting surface as shown in FIG. 1, but have a pair of positive and negative electrodes on the light emitting surface and the surface on the substrate 10 side. May be.
Note that when the light-emitting element is bonded by flip chip, a substrate is not provided above the semiconductor layer or a light-transmitting substrate such as sapphire is provided so that light can be sufficiently extracted from the light-emitting surface. It is preferable.

  The sealing resin 60 protects the light emitting element 50 bonded to the substrate 10 from dust, moisture, external force, and the like, and arbitrarily adjusts optical characteristics such as light extraction efficiency improvement and wavelength conversion of the light emitting element 50. It is. 2A, the sealing resin 60 of the present embodiment covers the upper surface on the substrate 10, the anisotropic conductive member 30, and the light emitting element 50, and is formed in a dome shape (hemisphere). Has been. Further, the sealing resin 60 is formed in a circular shape so as to substantially include the circular regions of the pair of wiring portions 20 when viewed in plan as shown in FIG. Further, as shown in FIGS. 1 and 2A, the exhaust passage 40 described above is formed both at a position facing the lower side of the sealing resin 60 and at a position facing the wiring portions 20 and 20.

  As the material of the sealing resin 60, a material having translucency capable of transmitting light from the light emitting element 50 is preferable. Specifically, an epoxy resin, a silicone resin, a modified type thereof, a urea resin, or the like is used. Can do. In addition to the organic material described above, an inorganic material such as an oxide may be used as the sealing resin 60. In addition to these, a phosphor, a colorant, a light diffusing agent, a filler, and the like for converting light distribution and wavelength may be included as desired.

  According to the light emitting device 1 of the present embodiment having the above-described configuration, heat is generated during driving through the exhaust passage 40 from the lower side of the anisotropic conductive member 30 serving as the periphery of the gap G to the outside or the outside of the sealing resin 60. Bubbles moving at the interface between the anisotropic conductive member and the other member can be discharged. Therefore, the light-emitting device 1 can reduce the troubles associated with the movement of bubbles, for example, the risk that an air layer is formed at the interface between the light-emitting element 50 and the sealing resin 60, and reduces the occurrence of a decrease in light output and the like. be able to.

[Method for Manufacturing Light Emitting Device]
Hereinafter, a method for manufacturing the light emitting device 1 according to the first embodiment of the present invention will be described with reference to FIGS. 3A to 3F. The manufacturing method of the light emitting device 1 includes an adhesive arranging step (FIG. 3A), a metal foil adhering step (FIG. 3B), a wiring portion forming step (FIG. 3C), and an anisotropic conductive member arranging step (FIG. 3D). And a light emitting element joining process (FIG. 3E) and a sealing resin formation process (FIG. 3F) are performed in order. In addition, let the board | substrate preparation process be from the adhesive arrangement | positioning process 3A to the wiring part formation process 3C.

As shown in FIG. 3A, in the adhesive placement step, linear adhesives 13 are applied on the base 11 so as to be separated from each other. In addition, the method of arrange | positioning the adhesive agent 13 will not be limited if it is a method which can be provided in the predetermined space apart from the space 14, such as a printing method and a spray method.
For example, in this embodiment, as shown in FIG. 3B, when the adhesive 13 is applied and the adhesive layer 12 is formed in the metal foil bonding step, the metal foil 200 that becomes the wiring portion 20 is bonded thereon. . Note that the metal foil 200 is bonded to the substrate 11 under a certain pressure as shown in the state of FIG. 4A to the state of FIG. 4B. As shown in FIG. 4B, the adhesive 13 is set to have a space so that the space 14 is secured by calculating the pressure of the metal foil 200.

As shown in FIG. 3C, when the metal foil 200 is bonded, a wiring portion forming step is performed next. This wiring portion forming step is performed in the following procedure.
That is, after a metal foil is formed on the base 11 via the adhesive 13, a resist layer is formed by printing or the like so as to cover almost the entire surface of the metal foil 200, and dried. Next, a mask having an opening corresponding to the wiring portion 20 is disposed on the resist layer. Next, exposure is performed by irradiating light (ultraviolet light) to the mask and the resist in the opening of the mask using an exposure apparatus, and then the mask is removed and developed. As a result, the resist layer in the region irradiated with light (or the region covered with the mask) is removed, and a resist layer having an opening is formed. The metal foil is exposed in the opening. Next, using the resist layer in which the opening is formed as a mask, the metal foil exposed in the opening of the resist layer is etched, whereby the metal foil corresponding to the resist opening is removed. As a result, the upper surface (adhesive layer 12) of the base 11 is exposed, and this exposed portion becomes a portion other than the gap G and the wiring portion 20, and becomes a substrate 10 having a pair of wiring portions 20 having the gap G (see FIG. 1A). .

Next, in the anisotropic conductive member arranging step, a paste-like anisotropic conductive member 30 is applied to the central portion on the pair of wiring portions 20 as shown in FIG. 3D. More specifically, in the anisotropic conductive member arranging step, the paste-like anisotropic conductive member 30 is placed on a circular region including a part of the pair of wiring parts 20 and a part of the gap G in plan view. Apply. Here, in the anisotropic conductive member arrangement step, the paste-like anisotropic conductive member 30 can be arranged by, for example, a potting (dropping) method, a compression molding method, a printing method, a transfer molding method, a jet dispensing method, or the like. .
In the anisotropic conductive member arranging step, a necessary amount of the anisotropic conductive member 30 may be provided at one place at a time, but may be provided at one place or a plurality of positions at a plurality of times.

In the light emitting element bonding step, as shown in FIG. 3E, the light emitting element 50 is bonded onto the pair of wiring parts 20 via the anisotropic conductive member 30 so as to straddle the gap G between the pair of wiring parts 20. More specifically, in the light emitting element bonding step, the light emitting element 50 is disposed on the anisotropic conductive member 30 before curing with the electrode 51 facing downward, and thermocompression bonding is performed from above the light emitting element 50. As a result, the light emitting element 50 is bonded to the pair of wiring portions 20. In this light emitting element bonding step, the anisotropic conductive member 30 is solidified in a state where the conductive particles 32 in the translucent resin 31 are crushed (see FIG. 2A). The light emitting element 50 is connected to the wiring part 20 through the conductive particles 32.
Note that the anisotropic conductive member 30 is provided in a larger area than the light emitting element 50 by crushing the paste-like anisotropic conductive member 30 during the pressurization.

In the sealing resin forming step, for example, as illustrated in FIG. 3F, the substrate 10, the anisotropic conductive member 30, and the light emitting element 50 are covered with the sealing resin 60. More specifically, in the sealing resin forming step of the present embodiment, the sealing resin 60 is formed in a dome shape so as to substantially include the circular regions of the pair of wiring portions 20 in plan view.
Here, in the sealing resin forming step, the sealing resin 60 can be formed by, for example, a potting method, a compression molding method, a printing method, a transfer molding method, a jet dispensing method, a spray method, or the like. The shape of the sealing resin 60 is not particularly limited as long as the anisotropic conductive member 30 and the light emitting element 50 are sealed and the exhaust passage 40 is disposed to the outside of the sealing resin 60.
The exhaust passage 40 is provided at a position along the periphery of the gap G. That is, the exhaust passage 40 is formed as a region for exhausting bubbles by forming a large number of spaces 14 of the adhesive 13 in succession to the gap G. Since the exhaust passage 40 is continuously formed outside the anisotropic conductive member 30 and the sealing resin 60, bubbles move due to heat at the interface between the anisotropic conductive member 30 and other members. In this case, the sealing resin 60 can be discharged to the outside.

  According to the method of manufacturing the light emitting device 1 that performs the above steps, the exhaust passage 40 is provided along the gap G of the wiring portion 20 from the anisotropic conductive member 30 to the outside of the sealing resin 60. When the isotropic conductive member 30 is used, air bubbles that move at the interface by heat during driving can be discharged from the exhaust passage 40 to the outside from a cavity that may be formed at the interface with another member. Therefore, it is not necessary to machine holes, grooves, or the like in each component of the light emitting device 1 as compared with the conventional device. And in the manufacturing method of the light-emitting device 1, an air layer is not formed in the interface of the light emitting element 50 and the sealing resin 60 of the manufactured light-emitting device 1, and troubles, such as a fall of the light output of the light-emitting device 1, are prevented. Can do. In the above manufacturing method, the sealing resin forming step may be omitted depending on the configuration of the light emitting device. When the sealing resin molding step is omitted, the exhaust passage 40 is provided along the gap G from one end of the anisotropic conductive member 30 to multiple ends.

Second Embodiment
(Configuration of light emitting device)
The configuration of the light emitting device 1A according to the second embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 5 and 6, the light emitting device 1 </ b> A includes a reflective material layer (reflective member) 70 in addition to the configuration of the light emitting device 1 (see FIG. 1).

  The reflective material layer 70 is for reflecting light from the light emitting element 50. As shown in FIG. 6, the reflective material layer 70 is provided on the substrate 10 other than the bonding region J. The details of the reflective material layer 70 will be described later in the description of the manufacturing method.

Examples of the reflective material of the reflective material layer 70 include epoxy resin, silicone resin, modified silicone, urethane resin, oxetane resin, fluororesin, acrylic, polycarbonate, polyimide, polyphthalamide, etc., TiO ₂ , ZrO ₂ , Al ₂ O ₃ , A material containing a reflective material such as SiO ₂ can be used. Further, the thickness of the reflective material layer 70 is not particularly limited, and can be formed with any thickness depending on the purpose and application. By providing such a reflective material layer 70, the light emitting device 1A can reflect the light emitted from the light emitting element 50, and can improve the light output.

[Method for Manufacturing Light Emitting Device]
Hereinafter, a method for manufacturing the light emitting device 1A according to the second embodiment will be described with reference to FIGS. 7A to 7F and FIG. The manufacturing method of the light emitting device 1A is different from the adhesive placement step (FIG. 7A), the metal foil bonding step (FIG. 7B), the wiring portion forming step (FIG. 7C), and the reflective material layer forming step (FIG. 7D). The conductive conductive member arranging step (FIG. 7E), the light emitting element bonding step (FIG. 7F), and the sealing resin forming step (FIG. 5) are performed in order. In addition, let the board | substrate preparation process be from an adhesive arrangement | positioning process to a wiring part formation process. The manufacturing method of the light emitting device 1A is the same as the manufacturing method of the light emitting device 1 described above (see FIGS. 3A to 3F) except for the reflective material layer forming step. Therefore, the reflective material layer forming step will be mainly described below. To do.

  As shown in FIG. 7D, the reflective material layer forming step is performed after the wiring portion forming step. In this reflective material layer forming step, the reflective material layer 70 that reflects light is placed on the substrate 10 other than the junction region J outside the circular portion of the wiring portions 20 and 20 including the junction region to which the light emitting element 50 is joined. Provided. That is, after forming the wiring part 20 on the substrate 10 (FIG. 7C), in the reflective material layer forming step, the reflective material is masked while masking a region that is larger than the circular part of the predetermined wiring parts 20 and 20. The reflective material layer 70 as shown in FIG. 7D is applied. Here, in the reflective material layer forming step, the reflective material can be provided by, for example, a printing method, a coating method, a spray method, or the like, with the bonding region J being masked.

  Then, after providing the reflective material layer 70 in the reflective material layer forming step and removing the mask, as shown in FIG. 7E, the anisotropic conductive member arranging step (FIG. 7E) and the light emitting element bonding step (FIG. 7F) and the sealing resin formation step (FIG. 5), the light emitting device 1A is manufactured. According to the method of manufacturing the light emitting device 1A that performs such a process, there is a cavity at the interface between the anisotropic conductive member 30 and another member, and the air bubbles that move from the cavity due to heat during driving are exhaust passages that are the space 14 The light emitting device 1 </ b> A with improved light output can be provided by forming the reflective resin layer 70 in addition to the bonding region J.

  As mentioned above, although the specific structure was illustrated and demonstrated about the light-emitting device and its manufacturing method which concern on this invention, the meaning of this invention is not limited to these description, and is based on description of a claim. Must be interpreted widely. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.

  For example, in the above-described light emitting devices 1 and 1A, as shown in FIGS. 2A and 6, the wiring portion 20 is bonded to one surface of the resin base 11 via the adhesive layer 12, and the configuration of the substrate 10 and the wiring portion 20 is configured. However, in addition to this, a metal layer may be provided on the other surface of the substrate 11 via another adhesive layer or the like, and a total of five layers may be formed. The above-mentioned “the other surface of the substrate 11” means a surface opposite to the surface on which the light emitting element 50 side of the substrate 11 is mounted.

  In this case, the metal layer provided in the lowermost layer is for improving the mechanical strength and heat dissipation of the substrate 10 as a part of the base, and for example, aluminum and its alloy can be used. Further, as the adhesive layer for adhering the substrate 11 and the metal layer, for example, a urethane resin, an epoxy resin, or the like can be used similarly to the adhesive layer 12 described above.

  Furthermore, the light emitting devices 1 and 1A are formed by forming the linear adhesive 13 and the space 14 from the center of the gap G (directly below the light emitting element 50) to one end, so that the sealing resin 60 is formed from directly below the light emitting element 50. You may comprise so that the exhaust passage 40 may be provided along the gap G to the position of the length of the radius to an edge part. The light emitting devices 1 and 1A may be configured such that only the gap G becomes the adhesive 13 and the space 14. That is, in the case where the gap G is continuous over the entire substrate as shown in FIG. 8A described later, an area in which the adhesive 13 and the space 14 are repeated may be provided in the gap G.

In the light emitting devices 1, 1 </ b> A, bubbles that move by heat to the outside of the sealing resin 60 by the exhaust passage 40 are provided by providing a region that repeats the adhesive 13 and the space 14 beyond the end of the sealing resin 60. Can be reliably discharged.
Further, as shown in FIG. 1, in the light emitting devices 1 and 1 </ b> A, one light emitting element 50 is arranged on one substrate 10, and the wiring portion 20 has a circular area and the circular area. However, the configuration of the substrate 10 and the wiring portion 20 is not limited to this.

  For example, as shown in FIGS. 8A to 8C, a plurality of pairs of wiring portions 20A are formed on the surface of a single long substrate 10A, and the light emitting element 50 is bonded to each wiring portion 20A. I do not care. In this case, the substrate 10A of the light emitting device 1B is a flexible substrate that is flexible and can be bent and deformed. The substrate is made of, for example, polyethylene terephthalate (PET) or polyimide (PI). As shown in FIG. 8A, a wiring portion 20A is provided on the substrate 10A.

  The wiring portion 20A of the light emitting device 1B is made of, for example, aluminum in order to increase the reflectance, and one or the other of the pair of wiring portions 20A to which the light emitting element 50 is bonded is adjacent to the light emitting element 50. It is comprised so that it may serve as the other or one of a pair of wiring part 20A joined. That is, as shown in FIG. 8A, the light emitting device 1B is configured such that one wiring part 20Ab to which the central light emitting element 50b is joined becomes the other wiring part 20Ab to which the light emitting element 50a adjacent to the left side is joined. Has been. Similarly, the light emitting device 1B is configured such that the other wiring part 20Ac to which the central light emitting element 50b is joined becomes one wiring part 20Ac to which the light emitting element 50c adjacent to the right side is joined. Note that reference numerals 20Ab and 20Ac and reference numerals 50a, 50b, and 50c in FIG. 8A are used for convenience to distinguish the positions of the wiring portion 20A and the light emitting element 50, and have the same configuration.

  Even in the light emitting device 1B having such a configuration, the exhaust passage 40 is formed along the gap G from the anisotropic conductive member 30 to the outside of the sealing resin 60, similarly to the light emitting devices 1 and 1A described above. Thus, bubbles moving by heat at the interface between the anisotropic conductive member 30 and another member can be discharged to the outside. As shown in FIG. 8A, the light emitting device 1B is provided with only the wiring portion 20 on the substrate 10A. However, like the light emitting device 1A (see FIG. 5), a reflective material layer 70 is further provided. The configuration may be different. When the reflective material layer 70 is provided, the wiring portion 20A of the light emitting device 1B may be made of copper, for example.

  Further, the light emitting devices 1, 1 </ b> A, 1 </ b> B are provided with the linear adhesive 13 and the space 14 so as to intersect at a predetermined angle θ with respect to the straight line formed by the gap G of the wiring part 20. You may form so that the adhesive agent 13 and the space 14 may face in the direction parallel to the straight line which 20 gap | interval G forms. In other words, the linear adhesive 13 and the space 14 may be formed in the gap G in parallel.

Further, as shown in FIG. 4B, the relationship between the adhesive 13 and the space 14 is illustrated as a linear line having a wide width of the adhesive 13, but the adhesive 13 and the space 14 have the same interval, Alternatively, the space 14 may be wider than the adhesive 13 and can be appropriately changed within a range in which the wiring portion 20 can be reliably bonded.
Furthermore, as shown to FIG. 4C, you may comprise so that it may become the relationship between the adhesive agent 13a and the space 14a. That is, the adhesive 13a may be provided so as to have a distance D2 such that a part of the adhesive 13a contacts the adjacent adhesive 13a, and the space 14a may be formed on the wiring part 20 side.

  The light-emitting device 1B shown in FIGS. 8A to 8C can be used as a manufacturing method in which a flexible substrate is used to manufacture a roll-to-roll method, or alternatively, the adhesive 13 is applied to a sheet obtained by cutting a resin film into a predetermined size. After that, it may be manufactured by a single wafer method in which a metal foil is pasted and further exposed.

  Further, as described above, the anisotropic conductive member 30 described above has a light-transmitting thermosetting resin or light reflecting material as a main component, and more preferably a thermosetting resin as a main component. Thus, light absorption by the anisotropic conductive member can be prevented to the maximum. Moreover, in such a light-transmitting thermosetting resin, since the light reflecting material is more uniformly distributed than the solder, not only the light absorption by the solder is minimized, but also the wiring. In the meantime, light irradiation to the base 11 can be minimized, and deterioration of the substrate 10 can be avoided. Furthermore, even when light emitted from the light emitting element 50 is not directly reflected by the anisotropic conductive member 30 and reflected, that is, when reflected / scattered light from the peripheral member enters the anisotropic conductive member 30 again, Light can be reflected efficiently.

The anisotropic conductive member 30 preferably contains, for example, 25 to 85 parts by weight of a thermosetting resin, 5 to 30 parts by weight of solder, and 10 to 70 parts by weight of a light reflecting material. It is more preferable that 35 to 85 parts by weight, 5 to 30 parts by weight of solder, and 10 to 40 parts by weight of light reflecting material are contained.
The plurality of linear adhesives 13 described above are not limited to being completely separated from each other, and may be continuous through an adhesive portion having a thickness smaller than that of the linear adhesive.

1, 1A, 1B Light emitting device 10, 10A Substrate 11 Base (resin layer)
12 Adhesive layer 13 Adhesive 14 Space 20, 20A, 20Ab, 20Ac Wiring part 30, 130 Anisotropic conductive member 31 Translucent resin 32 Conductive particle 40 Exhaust passage 50, 50a, 50b, 50c Light emitting element 51 Electrode 60 Sealing Resin 70 Reflective material layer G Gap J Bonding area

Claims (6)

A substrate having at least a pair of wiring portions arranged on a base via an adhesive layer and spaced apart from each other;
A light emitting element bonded onto the pair of wiring parts via an anisotropic conductive member,
The adhesive layer is arranged in a plurality of lines at intervals in the gap between the pair of wiring parts, the adhesive being spaced apart from each other on the base .
The wiring portion is a light emitting device in which the linear adhesive is provided so as to intersect a direction of a straight line formed by the gap .   The light emitting device according to claim 1, further comprising a sealing resin that covers the anisotropic conductive member and the light emitting element. A reflective material layer that reflects light is provided on the substrate other than a bonding region where the light-emitting element is bonded onto the wiring portion;
The light emitting device according to claim 2, wherein the sealing resin is provided on the reflective material layer so as to cover the anisotropic conductive member and the light emitting element. An adhesive arrangement step in which an adhesive is arranged in a plurality of lines on the substrate;
A metal foil bonding step of bonding a metal foil on the substrate via the adhesive;
Wiring formed on the substrate such that at least a pair of wiring portions separated from each other from the metal foil are arranged in a plurality of lines at intervals in at least a gap between the pair of wiring portions. Forming a substrate in a part forming step;
An anisotropic conductive member arranging step of arranging an anisotropic conductive member on the pair of wiring portions;
Via the anisotropic conductive member, seen including a light emitting element bonding step of bonding the light emitting element on the wiring portion,
The wiring part forming step is a method of manufacturing a light emitting device , wherein the wiring part is formed so that a linear direction formed by a gap between the pair of wiring parts intersects a linear adhesive direction . The method for manufacturing a light emitting device according to claim 4 , wherein a sealing resin forming step of covering the anisotropic conductive member and the light emitting element with a sealing resin is performed after the light emitting element bonding step. A reflective material layer forming step of providing a reflective material layer that reflects light on the substrate other than a bonding region to which the light emitting element is bonded, between the wiring portion forming step and the anisotropic conductive member arranging step; The manufacturing method of the light-emitting device of Claim 4 or Claim 5 to perform.

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