JP6466205B2 - Resin coating device - Google Patents

Description

  The present invention relates to a resin coating apparatus for defoaming a liquid resin and supplying the liquid resin to a nozzle.

  Patent Documents 1 and 2 disclose a method of removing bubbles contained in a liquid resin by using a vacuum pump or a stirrer. In these methods, by placing the liquid resin in a vacuum atmosphere, bubbles contained in the liquid resin can easily escape from the resin. Further, by stirring the resin in a vacuum atmosphere, the bubbles are more likely to escape from the resin.

  Patent Document 3 discloses a defoaming device that removes bubbles from a liquid resin through a liquid resin containing bubbles with respect to a net-like member formed in a cylindrical shape. In this defoaming device, the mesh member is disposed in the atmosphere above the liquid surface of the liquid resin, and the liquid resin moving by its own weight is defoamed when passing through the mesh member.

Japanese Patent Laid-Open No. 11-213990 JP 2004-033924 A JP2013-233696A

  However, the methods described in Patent Documents 1 and 2 have a problem that a vacuum pump and a stirrer are required for defoaming, and the apparatus to be used becomes large. Moreover, the apparatus described in Patent Document 3 has a problem that the liquid resin that has passed through the mesh member is hardened by touching the atmosphere. In other words, when the liquid resin is a mixture of a plurality of components, the components that tend to harden when exposed to air harden, which may clog the mesh and prevent passage of the mesh resin. For this reason, there exists a problem that components other than the solidified component will pass a net-like member and liquid resin will be isolate | separated.

  This invention is made | formed in view of this point, can be set as a compact structure, and suppresses that a liquid resin isolate | separates when defoaming the liquid resin containing the component of at least 2 types of resin. An object of the present invention is to provide a resin coating apparatus that can perform the above process.

The resin coating apparatus of the present invention includes a nozzle that applies a liquid resin to a member to be coated, a first supply path that supplies the liquid resin to the nozzle, a first pump that is disposed in the first supply path, A resin comprising defoaming means connected to the first supply path, a second supply path communicating the defoaming means and the resin supply source, and a second pump disposed in the second supply path In the coating apparatus, the defoaming means is connected to the first supply path, and is disposed inside the cup, the cup storing the liquid resin supplied from the second supply path by the second pump, A receiving portion that receives the liquid resin supplied from the second supply path, and the receiving portion is formed in a cylindrical shape having an opening that allows the liquid resin to be supplied from the second supply path ; , side surfaces connecting the bottom surface of the closing surface which is disposed below the cylindrical portion, to the lower end portion of the bottom surface and the cylindrical portion Is arranged, comprising a network area of a predetermined width from the bottom surface is formed with a size mesh of the net that does not pass air bubbles contained in the liquid resin, the defoaming of the second supply path in the liquid resin to be accumulated in the cup one end communicating with the means, while maintaining a state where the entire network area hands were Botsueki, and performs degassing of liquid resin by supplying liquid resin to the nozzle in the first pump.

  According to this configuration, the liquid resin can be defoamed by passing through the net area by the weight of the liquid resin, and the structure can be made compact compared to a conventional defoamer using a vacuum pump or a stirrer. Can be planned. In addition, since the mesh area is immersed in the liquid resin, the liquid resin is prevented from being solidified by contact with the atmosphere before and after passing through the mesh area, as compared with the case where the mesh member is arranged in the atmosphere as in the past. Can do. Thereby, even if it is liquid resin which mixed several components, it can avoid that the component which is hard to be solidified when it touches air clogs a mesh, and it becomes difficult to pass. As a result, it is possible to prevent the liquid resin from being separated by passing only the components other than the hardened component through the mesh member.

  The resin coating apparatus of the present invention further includes an upper limit sensor that detects the upper limit of the liquid level of the liquid resin, and a lower limit sensor that detects the lower limit, and the first pump and the second pump include the upper limit sensor and It is good also as a structure which maintains the liquid level of liquid resin between an upper limit and a minimum according to the detection result of a lower limit sensor.

  According to the present invention, since the defoaming is performed by passing through the net area by the weight of the liquid resin, a compact configuration can be achieved. In addition, since the entire net area is immersed in the liquid resin, it is possible to prevent the liquid resin from separating when defoaming the liquid resin containing at least two kinds of resin components.

It is a schematic diagram of the resin coating apparatus which concerns on this Embodiment.

  Hereinafter, a resin coating apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic diagram of a resin coating apparatus according to the present embodiment. Note that the resin coating apparatus according to the present embodiment is not limited to the apparatus configuration shown in FIG. 1 and may include, for example, a control apparatus or the like as necessary.

  As shown in FIG. 1, a resin coating apparatus 1 supplies (applies) a liquid resin L from a nozzle 11 to a surface Wa of a member W to be coated such as a sheet adhered to a substrate such as a semiconductor wafer. It is. The semiconductor wafer to which the member to be coated W is attached is placed on the table T. As liquid resin L, what mixed several liquid resin (for example, ultraviolet curable resin) is used, and a thixotropic agent is also mix | blended as needed.

  The resin coating apparatus 1 includes a nozzle 11, a first supply path 10, a first pump 12, a second supply path 20, a second pump 21, and a defoaming means 100.

  The upstream end of the first supply path 10 is connected to the defoaming means 100, and the downstream end of the first supply path 10 is connected to the nozzle 11. A first pump 12 is disposed in the middle of the first supply path 10, and the first pump 12 supplies the liquid resin L to the nozzle 11 from the defoaming means 100 through the first supply path 10. To do. The upstream end of the second supply path 20 is connected to a resin supply source 30 that is a supply source of the liquid resin L, and the downstream end of the second supply path 20 is connected to the defoaming means 100. Accordingly, the resin supply source 30 and the defoaming means 100 communicate with each other via the second supply path 20. A second pump 21 is disposed in the middle of the second supply path 20 to pump the liquid resin L from the resin supply source 30 toward the defoaming means 100.

  The defoaming means 100 includes a cup 110 that can store the liquid resin L supplied from the second supply path 20 and a receiving portion 120 that is disposed inside the cup 110. The cup 110 is formed in a cylindrical cup body 111 having an opening 121 a on the upper side, a tapered bottom portion 112 connected to the lower end of the cup body 111, and substantially at the center of the bottom portion 112. And a flow path 113 coupled to the.

  The receiving part 120 includes a cylindrical part 121 having an opening 121a on the upper side, a bottom face 122 that is disposed below the cylindrical part 121 and serves as a closed surface that does not allow the liquid resin L to pass therethrough, and the cylindrical part 121 and the bottom face 122. Network area 123 formed between the two. The receiving part 120 forms a first storage space S1 in which the liquid resin L is stored. Further, the downstream end of the second supply path 20 is disposed in the first storage space S1 through the opening 121a, and receives the liquid resin L supplied from the second supply path 20.

  The cylindrical portion 121 is a closed surface that does not allow the liquid resin L to pass therethrough. The diameter of the cylindrical part 121 is smaller than the diameter of the cup body 111. A support member 150 is provided on the upper end (opening 121a) side of the cylindrical portion 121. The support member 150 is placed on the upper end of the cup body 111 so as to be directed outward from the opening 121a side.

  In a state where the support member 150 is placed on the upper end of the cup body 111, the receiving portion 120 is disposed inside the cup 110, and the bottom surface 122 of the receiving portion 120 is positioned above the bottom portion 112 of the cup 110. Yes. Moreover, the cup main body 111, the cylindrical part 121, and the net | network area 123 are arrange | positioned on the substantially same axis | shaft. Here, a second storage space S <b> 2 for storing the liquid resin L is formed between the inner peripheral surface of the cup 110 and the outer peripheral surface of the receiving portion 120.

  The mesh area 123 is formed of a mesh of a size that allows passage of the liquid resin L by its own weight supplied on the bottom surface 122 but does not allow bubbles contained in the liquid resin L to pass. Although it does not specifically limit as a material of a net | network, A metal, resin, etc. can be illustrated. Since the net area 123 allows the liquid resin L to pass through, the first storage space S1 and the second storage space S2 are communicated with each other through the net area 123. Further, the net area 123 is connected to the lower end portion of the cylindrical portion 121 and the outer periphery of the bottom surface 122. Therefore, the net area 123 is formed with a predetermined width in the vertical direction from the bottom surface 122 and is disposed on substantially the same plane as the cylindrical portion 121.

  The defoaming means 100 further includes an upper limit sensor 130 and a lower limit sensor 140 that detect the liquid level of the liquid resin L. The upper limit sensor 130 and the lower limit sensor 140 are provided at positions outside the cup 110. The upper limit sensor 130 includes a light projecting element 131 and a light receiving element 132, and the lower limit sensor 140 similarly includes a light projecting element 141 and a light receiving element 142. The upper limit sensor 130 and the lower limit sensor 140 determine whether the liquid resin L exists in the storage spaces S1 and S2 until the light generated by the light projecting elements 131 and 141 reaches the light receiving elements 132 and 142. To detect.

  The upper limit sensor 130 is located above the lower limit sensor 140. The upper limit sensor 130 is disposed so as to detect the upper limit of the liquid level of the liquid resin L, and the lower limit sensor 140 is disposed so as to detect the lower limit of the liquid level of the liquid resin L. Here, the liquid level position at which the detection of the liquid resin L is switched by the upper limit sensor 130 is indicated by the reference numeral HL in FIG. 1 as the upper limit value, and the liquid level position at which the detection of the liquid resin L is switched by the lower limit sensor 140 is the lower limit value in FIG. This is indicated by reference sign LL.

  In the present embodiment, the light receiving element 132 of the upper limit sensor 130 is disposed on the light projecting element 141 of the lower limit sensor 140, and the light projecting element 131 of the upper limit sensor 130 is disposed on the light receiving element 142 of the lower limit sensor 140. Established. Thereby, each light receiving element 132,142 can suppress the malfunction which detects the light from the light projection elements 131,141 which are not originally targeted. The arrangement of the light projecting elements 131 and 141 and the light receiving elements 132 and 142 can be appropriately changed as long as the liquid level of the liquid resin L can be accurately measured.

  Depending on the detection results of the upper limit sensor 130 and the lower limit sensor 140, the operations of the first pump 12 and the second pump 21 are controlled through control means (not shown). Specifically, when the upper limit sensor 130 detects the liquid resin L, control is performed to turn on the first pump 12 and turn off the second pump 21. Further, when the lower limit sensor 140 does not detect the liquid resin L, control is performed to turn off the first pump 12 and turn on the second pump 21.

  Here, the position of the lower limit sensor 140 is disposed at a position higher than the upper end of the mesh area 123, and the lower limit value LL of the liquid resin L is also set at a position higher than the upper end of the mesh area 123. Further, the downstream end serving as one end of the second supply path 20 is disposed at a position lower than the upper end of the mesh area 123. Therefore, when the liquid level of the liquid resin L is maintained at the lower limit value LL or more, the state where the downstream end of the second supply path 20 and the entire mesh area 123 are immersed in the liquid resin L is maintained.

  Next, a method for applying the liquid resin L by the resin coating apparatus 1 according to the present embodiment will be described below.

  First, by the operation of the second pump 21, the liquid resin L is pressure-fed from the resin supply source 30 through the second supply path 20 to the first storage space S <b> 1 that is inside the receiving part 120. Then, the liquid resin L is supplied onto the bottom surface 122 of the receiving part 120, and the liquid resin L passes through the mesh area 123 and is supplied to the second storage space S2 by its own weight. And each liquid level position of the liquid resin L supplied to 2nd storage space S2 and the liquid resin L in 1st storage space S1 is kept the same. The liquid resin L in the second storage space S2 is pumped to the nozzle 11 through the first supply path 10 by the operation of the first pump 12, and is applied to the surface Wa of the member W to be coated.

  Here, the relationship between the operations of the first pump 12 and the second pump 21 in the application of the liquid resin L and the detection results of the upper limit sensor 130 and the lower limit sensor 140 will be described below. In the present embodiment, the operations of the first pump 12 and the second pump 21 are controlled according to the detection results of the upper limit sensor 130 and the lower limit sensor 140. However, the first pump 12 and the second pump The control method 21 is not limited to this.

  In the application of the liquid resin L, when both the upper limit sensor 130 and the lower limit sensor 140 detect the liquid resin L, the liquid level position of the liquid resin L becomes higher than the upper limit value HL. In this case, in order to lower the liquid surface position of the liquid resin L, the second pump 21 is stopped, and the operation of the first pump 12 is controlled to be permitted. Accordingly, the liquid surface position of the liquid resin L is lowered according to the application of the liquid resin L from the nozzle 11, and the liquid resin L can be prevented from overflowing from the cup 110 without exceeding the upper limit value HL.

  On the other hand, when both the upper limit sensor 130 and the lower limit sensor 140 do not detect the liquid resin L, the position of the liquid resin L becomes lower than the lower limit value LL. In this case, in order to raise the liquid level position of the liquid resin L, the first pump 12 is stopped and the second pump 21 is controlled to operate. Thereby, the liquid surface position of the liquid resin L is raised by the supply of the liquid resin L from the second supply path 20. As a result, the liquid resin L can be prevented from disappearing in the cup 110, and the liquid surface position of the liquid resin L does not fall below the lower limit LL, and the downstream end of the second supply path 20 and all of the mesh area 123 Is kept immersed in the liquid resin L. As described above, the liquid level of the liquid resin L is maintained between the upper limit value HL and the lower limit value LL.

  Next, the defoaming process of the liquid resin L in the defoaming means 100 will be described. When the liquid resin L containing bubbles is supplied onto the bottom surface 122 from the second supply path 20, the liquid resin L passes through the mesh area 123 due to its own weight. At this time, bubbles contained in the liquid resin L cannot pass through the mesh area 123 depending on the size of the mesh forming the mesh area 123, and the bubbles can be removed from the liquid resin L that has passed through the mesh area 123.

  Here, since the entire mesh area 123 is immersed in the liquid resin L, the liquid resin L does not touch the atmosphere before and after passing through the mesh area 123. Moreover, since the downstream end of the second supply path 20 is also submerged in the liquid resin L, the liquid resin L immediately after being supplied from the second supply path 20 does not come into contact with the atmosphere. Thereby, even when the liquid resin L contains a component that easily solidifies when exposed to air, the liquid resin L can be prevented from solidifying inside and outside the mesh area 123. As a result, it can be avoided that the solidified resin clogs the mesh and the passage of the liquid resin L in the mesh area 123 is prevented, and the resin component other than the solidified component passes through the mesh area 123 and the liquid resin L is separated. Can be suppressed.

  By the way, when the mesh member through which the liquid resin passes is arranged in the atmosphere above the liquid surface of the liquid resin as in the conventional structure, the liquid resin is a mixture of a plurality of components. There are things that are easily caught in the mesh. The resin component that is caught makes it difficult to pass through the mesh of the mesh member because the components try to attract each other. Furthermore, since a resin having a component different from that of the component caught in the mesh passes through the mesh, there is a problem that the liquid resin is separated.

  In this respect, in the present embodiment, since the entire mesh area 123 is immersed in the liquid resin L, a plurality of resin components constituting the liquid resin L are present both inside and outside the mesh area 123. . Therefore, the same resin component is present in the same proportion in the resin component stored inside the mesh area 123 and the resin component stored outside the mesh area 123. Resin that is pushed by the weight of the resin and passes through the mesh is attracted to the resin outside the mesh area 123, so that all the components of the liquid resin L easily pass through the mesh area 123, and the resin that easily passes through the mesh And separation of the liquid resin L from which the component resin that does not easily pass through the mesh is separated.

  As described above, according to the present embodiment, the liquid resin L can be degassed by passing through the mesh area 123 by the dead weight of the liquid resin L, and the structure can be made compact. Further, since the mesh area 123 is immersed in the liquid resin L, it is possible to suppress separation of specific components of the liquid resin L in the mesh area 123 as described above.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, direction, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, the liquid resin L to be used may contain a plurality of resin components or a single component liquid resin. Even in the case of a single component liquid resin, the mesh of the mesh area 123 cannot be increased for the purpose of defoaming as in the above embodiment, but by submerging the mesh area 123, the resin component Even if it is a component that is easily caught in the mesh, the resin can facilitate the passage of the mesh.

  Moreover, the net | network area 123 may be formed in the area | region which occupies a part of the circumferential direction, and may be formed in the whole area of the circumferential direction. Moreover, the material of the net | network which comprises the net | network area 123 is not specifically limited, A metal or resin may be sufficient.

  Moreover, in said embodiment, as long as the upper limit sensor 130 and the lower limit sensor 140 are the structures which can detect the liquid resin L of each storage space S1, S2, you may change. For example, the liquid resin L at the upper limit value HL and the lower limit value LL described above may be detected using sound waves such as ultrasonic waves.

  As described above, the present invention can have a compact configuration, and the effect that the liquid resin can be prevented from separating when defoaming the liquid resin containing at least two kinds of resin components. Have

DESCRIPTION OF SYMBOLS 1 Resin coating device 10 1st supply path 11 Nozzle 12 1st pump 20 2nd supply path 21 2nd pump 30 Resin supply source 100 Defoaming means 110 Cup 120 Receiving part 121a Opening 122 Bottom 122 Net area 130 Upper limit Sensor 140 Lower limit sensor L Liquid resin W Coating member

Claims (2)

A nozzle for applying a liquid resin to a member to be coated; a first supply path for supplying the liquid resin to the nozzle; a first pump disposed in the first supply path; and the first supply path A resin coating apparatus comprising: a defoaming means to be connected; a second supply path that communicates the defoaming means with a resin supply source; and a second pump that is disposed in the second supply path. And
The defoaming means includes
A cup connected to the first supply path and storing a liquid resin supplied from the second supply path by the second pump; and disposed in the cup; A receiving portion for receiving the supplied liquid resin,
The receiving unit includes a tubular formed in a cylindrical portion having an opening which can be supplied with liquid resin from the supply path of the second, and the bottom plane of occlusion that is disposed below the cylindrical portion, A mesh area that is disposed on a side surface that is connected to the bottom surface and the lower end portion of the cylindrical portion, and that is formed of a mesh of a size that does not allow air bubbles contained in the liquid resin to pass through the bottom surface; Prepared,
One end communicating with the dehydration bubble means of the supply path of the second to the liquid resin to be accumulated in the cup, while maintaining the state in which the total net-area hands were Botsueki, liquid resin in the first pump A resin coating apparatus for defoaming a liquid resin by supplying to the nozzle. An upper limit sensor for detecting the upper limit of the liquid level of the liquid resin, and a lower limit sensor for detecting the lower limit;
The first pump and the second pump maintain the liquid level of the liquid resin between the upper limit and the lower limit according to detection results of the upper limit sensor and the lower limit sensor. Item 4. The resin coating apparatus according to Item 1 .

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