JP6468462B2 - Laminate peeling apparatus, peeling method, and electronic device manufacturing method - Google Patents

Description

  The present invention relates to a peeling apparatus and a peeling method for a laminate, and a method for manufacturing an electronic device.

  As electronic devices such as display panels, solar cells, and thin-film secondary batteries become thinner and lighter, substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices are made thinner. Is desired.

However, as the thickness of the substrate decreases, the handling of the substrate deteriorates. Therefore, a functional layer for an electronic device (thin film transistor (TFT: Thin Film Transistor) is formed on the surface of the substrate.
), It is difficult to form a color filter (CF: Color Filter).

  Therefore, a glass reinforcing plate (second substrate) is attached to the back surface of the substrate to form a laminated body in which the substrate is reinforced with the reinforcing plate, and a functional layer is formed on the exposed surface of the substrate in the state of the laminated body. An electronic device manufacturing method has been proposed. In this manufacturing method, since the handling property of the substrate is improved, the functional layer can be favorably formed on the exposed surface of the substrate. And a reinforcement board is peeled from a board | substrate after formation of a functional layer.

  The method of peeling a reinforcing plate disclosed in Patent Document 1 is a direction in which the reinforcing plate and / or the substrate are separated from each other from one of the two corners located on the diagonal line of the rectangular laminate. This is performed by sequentially bending and deforming. At this time, in order to perform peeling smoothly, a peeling start part is created at one corner of the laminate. The peeling start portion is created by inserting a predetermined amount of a peeling blade from the end face of the laminate to the interface between the substrate and the reinforcing plate.

  The peeling device of Patent Document 1 includes a stage, a flexible plate, a plurality of pads, a plurality of driving devices (movable bodies), a control device, and the like. According to the peeling apparatus of Patent Document 1, the substrate is sucked and held on the stage, and the reinforcing plate is sucked and held on the flexible plate. To the flexible plate, rods of a plurality of driving devices are connected via a plurality of pads. And a control apparatus controls the position of the rod of the some drive device with respect to a stage for every rod. Specifically, the positions of the rods of the plurality of driving devices are controlled so that the reinforcing plate is sequentially bent and deformed from the peeling start portion in a state where the substrate is supported flat on the stage. Thereby, a reinforcement board can be peeled from a board | substrate.

Japanese Patent No. 5155454

  In the peeling device of Patent Document 1, a plurality of driving devices are provided in a grid pattern at equal intervals with respect to the flexible plate. That is, the peeling device of Patent Document 1 has a structure in which the power of each rod of a plurality of drive devices is directly transmitted to the flexible plate via the pads, so the number of drive devices increases and the device configuration becomes complicated. There was a problem.

  SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and a laminate peeling apparatus and a peeling method capable of reducing the number of movable bodies and peeling the first substrate and the second substrate, and An object is to provide a method for manufacturing an electronic device.

  In order to achieve the above object, one embodiment of a laminate peeling apparatus according to the present invention includes a first substrate and a second substrate, and the first substrate and the second substrate can be peeled off. In the peeling apparatus for a laminated body, which sequentially peels the interface between the first substrate and the second substrate from one end side to the other end side with respect to the laminated body bonded, the first of the laminated body A support portion for supporting the substrate, a flexible plate for adsorbing the second substrate of the laminate on its adsorption surface, and a surface opposite to the adsorption surface of the flexible plate. And a plurality of movable bodies that bend and deform the flexible plate from one end side to the other end side by being moved independently with respect to the support portion, and sequentially peel the interface, The plurality of movable bodies are attached to the flexible plate via a plurality of connecting members for each unit and for each unit. Characterized in that it is.

  In order to achieve the above object, one embodiment of the laminate peeling method of the present invention includes a first substrate and a second substrate, and the first substrate and the second substrate can be peeled off. In the method for peeling a substrate, in which the interface between the first substrate and the second substrate is sequentially peeled from one end side to the other end side with respect to the laminated body bonded, the first of the laminate body A supporting step of supporting the substrate by a support portion, an adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate, and the second substrate of the laminate from the one end side. A peeling step in which the flexible plate is bent and deformed by a plurality of movable bodies via a plurality of connecting members so as to bend and deform sequentially toward the end side, and the interface is sequentially peeled off. Features.

  In one aspect of the method for producing an electronic device of the present invention, in order to achieve the above object, the first substrate and the second substrate are attached to the first substrate so that the first substrate and the second substrate are detachable. In the method of manufacturing an electronic device, comprising: a functional layer forming step of forming a functional layer on the exposed surface of the substrate; and a separation step of separating the second substrate from the first substrate on which the functional layer is formed. The separation step includes a supporting step of supporting the first substrate of the laminate by a support portion, an adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate, and the lamination The flexible plate is bent and deformed by a plurality of movable bodies via a long connecting member so that the second substrate of the body is sequentially bent and deformed from one end side to the other end side. And a peeling step of sequentially peeling the two substrates from the first substrate. It is characterized in.

  According to one aspect of the present invention, in the peeling step, the power of the movable body is transmitted to the flexible plate via the connecting member, and the flexible plate is bent and deformed. That is, in the conventional movable body, the flexible plate is bent and deformed by transmitting power to the flexible plate at a single point. However, in the present invention, between the movable body and the flexible plate, Since the connecting member is interposed, the power of the movable body can be transmitted to the flexible plate in a line or plane. As a result, the first substrate and the second substrate can be peeled off by the peeling device in which the number of movable bodies is reduced.

  In one aspect of the present invention, the connecting member is formed in an elongated shape, and a longitudinal axis thereof is disposed along a peeling front that is a boundary line between a peeled portion and an unpeeled portion of the interface, and the interface It is preferable that a plurality are arranged at intervals along the peeling progress direction.

  According to one aspect of the present invention, the longitudinal axis of the connecting member coincides with the peeling front, so that the first substrate and the second substrate can be smoothly peeled off.

  In one aspect of the present invention, the connecting member is configured to have a length corresponding to the length of the peeling front, and the movable body is disposed at a position that equally divides the connecting member in the longitudinal direction. preferable.

According to one aspect of the present invention, since the power of the movable body can be transmitted uniformly in the longitudinal direction of the connecting member, the first substrate and the second substrate can be more smoothly separated. .

  In one aspect of the present invention, the connecting member is preferably attached to the flexible plate via a buffer member.

  According to one aspect of the present invention, even if the spacing between the support portion and the flexible plate varies due to variations in the flatness of the support portion and the flexible plate, the buffer member absorbs the variation. The connecting member can be securely attached to the flexible plate. Moreover, since the buffer member absorbs the variation in straightness of the connecting member, the connecting member can be securely attached to the flexible plate.

  According to the laminate peeling apparatus and the peeling method and the electronic device manufacturing method according to the present invention, the number of movable bodies can be reduced and the first substrate and the second substrate can be peeled off.

The principal part enlarged side view which shows an example of the laminated body provided to the manufacturing process of an electronic device The principal part enlarged side view which shows an example of the laminated body produced in the middle of the manufacturing process of LCD Explanatory drawing which showed the peeling start part creation method by the peeling start part creation apparatus Plan view of a laminate in which a peeling start part is created by the peeling start part creation method The longitudinal cross-sectional view which showed the structure of the peeling apparatus of embodiment The top view of the flexible board which showed the arrangement position of a plurality of connecting members with respect to a peeling unit Explanatory drawing showing the configuration of the peeling unit Longitudinal sectional view of the peeling device that peels the interface of the laminate Longitudinal sectional view showing mounting structure of buffer member to connecting member A longitudinal sectional view of the buffer member showing the operation of the buffer member 82 Explanatory drawing which showed the peeling method which peels the reinforcement board of the laminated body by which the peeling start part was created by the peeling start part creation method in time series Explanatory drawing which showed the peeling method which peels the reinforcement board of a laminated body in time series following FIG. 11B and 11C are enlarged perspective views of main parts.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  Below, the case where the peeling apparatus and peeling method of the laminated body which concern on this invention are used at the manufacturing process (manufacturing method) of an electronic device is demonstrated.

  An electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. As a display panel, a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display) can be illustrated.

[Manufacturing process of electronic devices]
An electronic device is manufactured by forming a functional layer for an electronic device (in the case of LCD, a thin film transistor (TFT) and a color filter (CF)) on the surface of a substrate made of glass, resin, metal, or the like.

  Prior to the formation of the functional layer, the back surface of the substrate is bonded to a reinforcing plate to form a laminate. Thereafter, a functional layer is formed on the surface of the substrate in the state of the laminate. Then, after the functional layer is formed, the reinforcing plate is peeled from the substrate.

  That is, the electronic device manufacturing process includes a functional layer forming process for forming a functional layer on the surface of the substrate in the state of a laminate, and a separation process for separating the reinforcing plate from the substrate on which the functional layer is formed. In this separation step, the laminate peeling apparatus and peeling method according to the present invention are applied.

[Laminate 1]
FIG. 1 is an enlarged side view of an essential part showing an example of a laminated body 1.

  The laminate 1 includes a substrate (first substrate) 2 on which a functional layer is formed, and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. The reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the front surface 3 a, and the back surface 2 b of the substrate 2 is bonded to the resin layer 4. That is, the substrate 2 is detachably attached to the reinforcing plate 3 through the resin layer 4 by van der Waals force acting between the resin layer 4 or the adhesive force of the resin layer 4.

[Substrate 2]
The substrate 2 has a functional layer formed on its surface (exposed surface) 2a. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, a glass substrate is suitable as the substrate 2 for an electronic device because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. Further, as the linear expansion coefficient becomes smaller, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to be displaced during cooling.

  Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, it is preferable to select and use a glass suitable for the type of electronic device to be produced and a glass suitable for the production process. For example, it is preferable to employ glass (non-alkali glass) that does not substantially contain an alkali metal component for the glass substrate for a liquid crystal panel.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed as the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, and even more preferably 0.1 mm or less, in order to reduce the weight and thickness of the electronic device. Set to When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll. However, from the viewpoint of manufacturing the glass substrate and handling the glass substrate, the thickness is 0.03 mm or more. Preferably there is.

  In FIG. 1, the substrate 2 is composed of a single substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the board | substrate 2 can also be comprised with the laminated body which laminated | stacked the several board | substrate.

[Reinforcement plate 3]
Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

  The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type and thickness of the substrate 2 to be reinforced. The reinforcing plate 3 may be thicker or thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2.

  In this example, the reinforcing plate 3 is constituted by a single substrate, but the reinforcing plate 3 can also be constituted by a laminated body in which a plurality of substrates are laminated.

[Resin layer 4]
In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling process, the interface between the resin layer 4 and the substrate 2 is peeled off.

  Although resin which comprises the resin layer 4 is not specifically limited, Acrylic resin, polyolefin resin, polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin can be illustrated. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 4-20 micrometers. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matters can be absorbed by the deformation of the resin layer 4. On the other hand, when the thickness of the resin layer 4 is 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not used more than necessary, which is economical.

  The outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entire substrate 2.

  Moreover, although the resin layer 4 is comprised by 1 layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer. In this case, the type of resin constituting each layer may be different.

  Furthermore, in the embodiment, the resin layer 4 that is an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

  Furthermore, although the laminated body 1 of FIG. 1 includes the resin layer 4 as an adsorption layer, the resin layer 4 may be eliminated and the substrate 2 and the reinforcing plate 3 may be configured. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. In this case, it is preferable to form an inorganic thin film on the surface 3a of the reinforcing plate 3 so that the substrate 2 which is a glass substrate and the reinforcing plate 3 which is a glass plate do not adhere at a high temperature.

[Laminated body 6 of embodiment in which functional layer is formed]
A functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 through the functional layer forming step. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed in a predetermined pattern by photolithography or etching.

  FIG. 2 is an enlarged side view of an essential part showing an example of a rectangular laminate 6 produced during the manufacturing process of the LCD.

  The laminate 6 is configured by laminating a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B in this order. That is, the laminate 6 in FIG. 2 corresponds to a laminate in which the laminate 1 shown in FIG. 1 is arranged symmetrically with the functional layer 7 in between. Hereinafter, a laminate composed of the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminate 1A, and a laminate composed of the substrate 2B, the resin layer 4B, and the reinforcement plate 3B is referred to as a second laminate 1B. Called.

  A thin film transistor (TFT) as the functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter as the functional layer 7 is formed on the surface 2Ba of the substrate 2B of the second laminated body 1B. (CF) is formed.

  The first laminate 1A and the second laminate 1B are integrated by superimposing the surfaces 2Aa and 2Ba of the substrates 2A and 2B. Thereby, the laminated body 6 having a structure in which the first laminated body 1A and the second laminated body 1B are arranged symmetrically with the functional layer 7 interposed therebetween is manufactured.

  In the laminate 6, after the peeling start portion is formed with a knife in the peeling start portion creation step of the separation step, the reinforcing plates 3 </ b> A and 3 </ b> B are sequentially peeled off in the separation step of the separation step, and then the polarizing plate and the backlight Etc. are attached, and LCD which is a product is manufactured.

[Peeling start part creation device 10]
FIG. 3 is an explanatory view showing the configuration of the peeling start part creation device 10 used in the peeling start part creation step, and FIG. 3 (A) shows the positional relationship between the laminate 6 and the knife N. 3B is an explanatory diagram for creating the peeling start portion 26 at the interface 24 by the knife N, and FIG. 3C is an explanatory diagram showing a state immediately before creating the peeling start portion 30 at the interface 28. 3D is an explanatory diagram for creating the peeling start portion 30 on the interface 28 by the knife N, and FIG. 3E is an explanatory diagram of the laminate 6 in which the peeling start portions 26 and 30 are created. FIG. 4 is a plan view of the laminate 6 in which the peeling start portions 26 and 30 are created.

  At the time of creating the peeling start portions 26 and 30, the laminated body 6 is supported horizontally (X-axis direction in the drawing) with the back surface 3Bb of the reinforcing plate 3B being sucked and held by the table 12, as shown in FIG.

  The knife N is horizontally supported by the holder 14 such that the blade edge faces the end surface of the corner (one end side) 6A of the laminate 6. In addition, the position of the knife N is adjusted by the height adjusting device 16 in the height direction (Z-axis direction in the drawing). Furthermore, the knife N and the laminated body 6 are relatively moved in the horizontal direction by a feeding device 18 such as a ball screw device. The feeding device 18 may move at least one of the knife N and the table 12 in the horizontal direction. In the embodiment, the knife N is moved. Furthermore, a liquid supply device 22 for supplying the liquid 20 is disposed above the knife N on the upper surface of the knife N before or during insertion.

[Peeling start part creation method]
The peeling start part creation method by the peeling start part creation apparatus 10 sets the insertion position of the knife N to the corner 6A of the laminated body 6 at a position overlapping in the thickness direction of the laminated body 6, and the knife N The amount of insertion is set to be different for each of the interfaces 24 and 28.

  The creation procedure will be described.

  In the initial state, the cutting edge of the knife N exists at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B, which is the first insertion position. Therefore, first, as shown in FIG. 3A, the knife N is moved in the height direction, and the height of the blade edge of the knife N is set to the height of the interface 24.

  Thereafter, as shown in FIG. 3B, the knife N is moved horizontally toward the corner 6 </ b> A of the stacked body 6, and a predetermined amount of the knife N is inserted into the interface 24. In addition, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N at the time of or before the insertion of the knife N. As a result, the substrate 2B at the corner 6A is peeled off from the resin layer 4B, so that a triangular peeling start portion 26 is created at the interface 24 in plan view as shown in FIG. Although supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 even after the knife N is removed, and thus the peeling start portion 26 that cannot be reattached can be created.

  Next, the knife N is pulled out from the corner 6A in the horizontal direction, and as shown in FIG. 3C, the cutting edge of the knife N is moved to the height of the interface 28 between the substrate 2A and the resin layer 4A which is the second insertion position. Set to

  Thereafter, as shown in FIG. 3D, the knife N is moved horizontally toward the laminated body 6 and a predetermined amount of the knife N is inserted into the interface 28. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. As a result, as shown in FIG. 3D, a peeling start portion 30 is created at the interface 28. Here, the amount of insertion of the knife N into the interface 28 is smaller than the amount of insertion into the interface 24. The above is the peeling start part creation method. Note that the amount of insertion of the knife N into the interface 24 may be smaller than the amount of insertion into the interface 28.

  The laminate 6 in which the peeling start portions 26 and 30 are created is taken out from the peeling start portion creating apparatus 10 and is transported to a peeling apparatus described later, and the interfaces 24 and 28 are sequentially peeled by the peeling apparatus.

  Although details of the peeling method will be described later, as shown by an arrow A in FIG. 4, by peeling the laminated body 6 from the corner 6 </ b> A toward the corner (other end side) 6 </ b> B opposite to the corner 6 </ b> A, a peeling start portion The interface 24 having a large area 26 is first peeled off starting from the peeling start portion 26. Thereby, the reinforcing plate 3B is peeled off. Thereafter, the laminated body 6 is bent again from the corner 6 </ b> A toward the corner 6 </ b> B, whereby the interface 28 having a small area of the peeling start portion 30 is peeled off from the peeling start portion 30. Thereby, the reinforcing plate 3A is peeled off.

  The insertion amount of the knife N is preferably set to 7 mm or more, more preferably about 15 to 20 mm, depending on the size of the laminate 6.

[Peeling device 40]
FIG. 5 is a longitudinal sectional view showing the configuration of the peeling device 40 of the embodiment. 6 shows a plurality (19 in FIG. 6) of connecting members 44A, 44B, 44C, 44D, 44E, 44F, 44G, 44H, 44I, 44J, 44K, 44L, 44M, 44N, 44O, 44P, 44Q, 44R, 44S, and a plurality of driving devices (movable bodies) 48A, 48B, 48C, 48D, 48E, 48F, 48G, 48H, 48I, 48J, 48K, 48L, 48M, 48N, 48O 48P, 48Q, 48R, 48S is a plan view of the peeling unit 42 schematically showing the arrangement position of. 5 corresponds to a cross-sectional view taken along line B-B in FIG. 6, and in FIG. 6, the stacked body 6 is indicated by a solid line.

  As shown in FIG. 5, the peeling device 40 includes a pair of movable devices 46 and 46 that are disposed above and below the laminated body 6. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side of FIG. 5 will be described here, and the description of the movable device 46 disposed on the upper side will be omitted by attaching the same reference numerals. .

  The movable device 46 is provided for each of the plurality of drive devices 48A to 48S and the drive devices 48A to 48S described above that move the connection members 44A to 44S up and down for each of the plurality of connection members 44A to 44S and the connection members 44A to 44S. It comprises a controller 50 or the like that controls the driving devices 48A to 48S. The connecting members 44A to 44S and the driving devices 48A to 48S will be described later. Further, the connecting members 44A, 44B, 44C, 44D, 44P, 44Q, 44R, 44S are moved up and down by one (single) drive device 48A, 48B, 48C, 48D, 48P, 48Q, 48R, 48S. The other connecting members 44E, 44F, 44G, 44H, 44I, 44J, 44K, 44L, 44M, 44N, 44O are two (multiple) 48E, 48F, 48G, 48H, 48I, 48J, 48K, 48L, 48M. , 48N, 48O.

  The peeling unit 42 holds the reinforcing plate 3B by vacuum suction in order to bend and deform the reinforcing plate 3B. Instead of vacuum suction, electrostatic suction or magnetic suction may be used.

[Peeling unit 42]
FIG. 7A is a plan view of the peeling unit 42, and FIG. 7B is an enlarged longitudinal sectional view of the peeling unit 42 taken along the line CC in FIG. 7A. FIG. 7C also shows that the suction portion 54 constituting the peeling unit 42 is detachably attached to the rectangular plate-like flexible plate 52 constituting the peeling unit 42 via a double-sided adhesive tape 56. FIG. 6 is an enlarged vertical cross-sectional view of the peeling unit 42 showing that it has been done.

  As described above, the peeling unit 42 is configured such that the suction portion 54 is detachably attached to the flexible plate 52 via the double-sided adhesive tape 56.

  The adsorption portion 54 includes a flexible plate 58 that is thinner than the flexible plate 52. The lower surface of the flexible plate 58 is detachably attached to the upper surface of the flexible plate 52 via a double-sided adhesive tape 56.

  Further, the suction portion 54 is provided with a rectangular breathable sheet (suction surface) 60 that sucks and holds the inner surface of the reinforcing plate 3B of the laminate 6. The thickness of the breathable sheet 60 is 2 mm or less, preferably 1 mm or less for the purpose of reducing the tensile stress generated in the reinforcing plate 3B at the time of peeling, and in the embodiment, the thickness of 0.5 mm is used.

  Further, the adsorbing portion 54 is provided with a seal frame member 62 that surrounds the air permeable sheet 60 and that contacts the outer peripheral surface of the reinforcing plate 3B. The seal frame member 62 and the breathable sheet 60 are bonded to the upper surface of the flexible plate 58 via a double-sided adhesive tape 64. Further, the seal frame member 62 is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is configured to be 0.3 mm to 0.5 mm thicker than the thickness of the breathable sheet 60. Has been.

  A frame-shaped groove 66 is provided between the breathable sheet 60 and the seal frame member 62. In addition, a plurality of through holes 68 are opened in the flexible plate 52, and one end of each of these through holes 68 is communicated with the groove 66, and the other end is connected to an intake source via a suction pipe (not shown). (For example, a vacuum pump).

  Therefore, when the intake source is driven, air in the suction pipe, the through hole 68, and the groove 66 is sucked, so that the inner surface of the reinforcing plate 3B of the laminate 6 is vacuum-adsorbed and held on the air-permeable sheet 60. In addition, the outer peripheral surface of the reinforcing plate 3B is pressed against the seal frame member 62. Thereby, the airtightness of the adsorption space surrounded by the seal frame member 62 is improved.

The flexible plate 52 has higher bending rigidity than the flexible plate 58, the air permeable sheet 60, and the seal frame member 62, and the bending rigidity of the flexible plate 52 dominates the bending rigidity of the peeling unit 42. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40000 N · mm ² / mm. For example, in a portion where the width of the peeling unit 42 is 100 mm, the bending rigidity is 100000 to 4000000 N · mm ² . By setting the bending rigidity of the peeling unit 42 to 1000 N · mm ² / mm or more, it is possible to prevent the reinforcing plate 3B from being bent and held by the peeling unit 42 from being bent. In addition, by setting the bending rigidity of the peeling unit 42 to 40000 N · mm ² / mm or less, the reinforcing plate 3B sucked and held by the peeling unit 42 can be appropriately bent and deformed.

  The flexible plates 52 and 58 are resin members having a Young's modulus of 10 GPa or less, for example, resin members such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, and polyacetal (POM) resin.

[Movable device 46]
A plurality of connecting members 44 </ b> A to 44 </ b> S constituting the movable device 46 of FIG. 5 are fixed to the lower surface (surface opposite to the suction surface) of the flexible plate 52 via the buffer member 82.

<Connecting members 44A to 44S>
As shown in FIG. 6, the connecting members 44 </ b> A to 44 </ b> S are made of, for example, aluminum having high rigidity, and the longitudinal axis thereof is a boundary between the already peeled portion and the unpeeled portion of the interfaces 24 and 28 (see FIG. 5) of the laminate 6. It arrange | positions along the peeling front L (refer FIG. 6, FIG. 8) which is a line.

  On the other hand, the corner 52A of the flexible plate 52 corresponding to the corner 6A of the laminated body 6 extends in a direction opposite to the peeling progress direction A of the peeling front L. Two connecting members 44A and 44B and two driving devices 48A and 48B are arranged in the corner 52A along the peeling progress direction A. That is, the corner 6A is peeled off by moving the two drive devices 48A and 48B arranged at the corner 52A upward.

  Further, the connecting members 44A to 44S are arranged at intervals along the peeling progress direction (arrow A in FIG. 6) of the interfaces 24 and 28 (see FIG. 5). Thereby, since the longitudinal axis of connecting member 44A-44S and the peeling front L to advance correspond, the reinforcement board 3B can be smoothly peeled from the board | substrate 2B.

  Further, the connecting members 44C to 44Q are each configured to have a length corresponding to the length of the peeling front L.

  Furthermore, the driving devices 48A to 48S coupled to the coupling members 44A to 44S are arranged at positions that equally divide the coupling members 44A to 44S in the longitudinal direction. That is, the connecting members 44A, 44B, 44R, and 44S arranged outside the peeling start end and the peeling end end do not pass the peeling front below the connecting members 44A, 48B, 48R, and 48S. One unit is arranged at the center in the longitudinal direction of 44B, 44R, and 44S. The connecting members 44C, 44D, 44P, and 44Q disposed at the peeling start end and the peeling end end have a length of the peeling front L that passes below the connecting members 44C, 48D, and 48P. , 48Q are arranged at the center in the longitudinal direction of the connecting members 44C, 44D, 44P, 44Q, respectively. The other connecting members 44E to 44O are longer in the length of the peeling front L passing through the lower part than the other parts, so that the driving devices 48E to 48O divide the connecting members 44E to 44O into three equal parts in the longitudinal direction. As shown in FIG. Thereby, since the power from the drive devices 48A to 48S can be transmitted uniformly in the longitudinal direction of the connecting members 44A to 44S, the reinforcing plate 3B can be more smoothly separated from the substrate 2B. Note that the number of divisions in the longitudinal direction is not limited to two divisions and three divisions, and may be four or more divisions, but it is assumed that the number does not deviate from the object of the present invention to reduce the number of drive devices.

  These driving devices 48 </ b> A to 48 </ b> S are moved up and down independently by the controller 50.

  That is, the controller 50 controls the driving devices 48A to 48S to connect the connecting member 44A located on the corner 6A side of the laminate 6 in FIG. The member 44S is sequentially moved downward. By this operation, as shown in the longitudinal sectional view of FIG. 8, the interface 24 of the laminate 6 is peeled off from the peeling start portion 26 (see FIG. 4). In addition, the laminated body 6 shown in FIG. 5, FIG. 8 is the laminated body 6 by which the peeling start parts 26 and 30 were created by the peeling start part preparation method demonstrated in FIG.

  The drive devices 48A to 48S are constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism. Connecting members 44 </ b> A to 44 </ b> S are connected to the tip portion of the rod 70 via a ball joint and a skid mechanism (not shown). Thereby, the connecting members 44 </ b> A to 44 </ b> S can be tilted following the bending deformation of the peeling unit 42. Therefore, the peeling unit 42 can be bent and deformed sequentially from the corner 6A toward the corner 6B without applying an excessive force to the peeling unit 42. The driving devices 48A to 48S are not limited to a rotary servo motor and a ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

  The frame 74 is moved downward by a drive unit (not shown) when the peeled reinforcing plate 3B is removed from the peeling unit 42.

  The controller 50 is configured as a computer including a recording medium such as a CPU, a ROM, and a RAM. The controller 50 controls the plurality of drive devices 48A to 48S for each of the drive devices 48A to 48S by causing the CPU to execute the program recorded on the recording medium, and moves the plurality of connecting members 44A to 44S up and down. Control.

<Buffer member 82>
FIG. 9 is a longitudinal sectional view showing a structure for attaching the buffer member 82 to the connecting member 44D. 10A is a longitudinal sectional view of the buffer member 82 when not compressed, and FIG. 10B is a longitudinal sectional view of the buffer member 82 when compressed. 9 and 10 illustrate the buffer member 82 attached to the connecting member 44D, the buffer member 82 attached to the other connecting members 44A to 44C and 44D to 44S has the same configuration. The buffer member 82 includes a bolt 84, a spring 86, a stopper 88, and a nut 90.

  The base 84A of the bolt 84 is fixed to the flexible plate 52 of the peeling unit 42 with a screw 92, and the screw 84B protrudes outward from the through hole 45 of the connecting member 44D. The screw portion 84B is inserted into the spring 86, and the spring 86 is interposed between the base portion 84A and the connecting member 44D. The connecting member 44D has a U-shaped cross section.

  A stopper 88 having a diameter larger than that of the through hole 45 is fixed to the screw portion 84 </ b> B protruding from the through hole 45 by the nut 90. As shown in FIG. 10A, the spring 86 is held at the precompressed length in a form in which the stopper 88 is in contact with the surface of the connecting member 44D. Thereby, the buffer member 82 becomes an uncompressed form. In FIG. 9, when the connecting member 44 </ b> D is raised by the driving device 48 </ b> D, the surface of the connecting member 44 </ b> D comes into contact with the stopper 88, so that the peeling unit 42 can be raised via the stopper 88 and the bolt 84.

  In addition, when the flatness of the flexible plate 52 of the peeling unit 42 varies, the distance between the pair of peeling units 42, 42 disposed above and below (the distance between the support portion and the flexible plate) varies. The spring 86 contracts as shown in FIG. 10B so as to absorb the variation. Further, the variation in straightness of the connecting member 44D is absorbed by the spring 86 contracting. As a result, the connecting member 44 </ b> D can be reliably attached to the flexible plate 52 even if the spacing and the straightness are varied.

[Peeling method of reinforcing plates 3A and 3B by peeling device 40]
11 (A) to 11 (C) to 12 (A) to 12 (C) show a laminate 6 in which peeling start portions 26 and 30 are created at the corner 6A by the peeling start portion creating method described in FIG. The peeling method is shown. That is, in the drawing, a peeling method for peeling the reinforcing plates 3A and 3B of the laminate 6 is shown in time series.

  Moreover, the carrying-in operation | work of the laminated body 6 to the peeling apparatus 40 and the carrying-out work of the peeled reinforcement board 3A, 3B and the panel P are performed by the conveying apparatus 80 provided with the suction pad 78 shown to FIG. 11 (A). In FIGS. 11 and 12, the movable device 46 is not shown in order to avoid complexity of the drawings. The panel P is a product panel in which the substrate 2A excluding the reinforcing plates 3A and 3B and the substrate 2B are attached via the functional layer 7.

  FIG. 11A is a side view of the peeling device 40 in which the laminate 6 is placed on the lower peeling unit 42 by the operations shown by arrows E and F of the transport device 80. In this case, the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the transfer device 80 is inserted between the lower peeling unit 42 and the upper peeling unit 42. It is moved in advance to the position. When the laminated body 6 is placed on the lower peeling unit 42, the lower peeling unit 42 holds the reinforcing plate 3 </ b> B of the laminated body 6 by vacuum suction. That is, FIG. 11A shows an adsorption process in which the reinforcing plate 3B as the second substrate is adsorbed and held by the lower peeling unit 42.

  In FIG. 11B, the lower peeling unit 42 and the upper peeling unit 42 are moved in a relatively approaching direction, and the reinforcing plate 3 </ b> A of the laminate 6 is vacuum-sucked and held by the upper peeling unit 42. It is a side view of the peeling apparatus 40 in a state. That is, FIG. 11B shows an adsorption process in which the reinforcing plate 3A as the first substrate is adsorbed and held by the upper peeling unit (supporting portion) 42. FIG. 13A is a perspective view corresponding to FIG. 11B, and is an enlarged perspective view of the corner 6 </ b> A of the stacked body 6.

  When the substrate 2 of the laminate 1 shown in FIG. 1 is peeled from the reinforcing plate 3 by the peeling device 40, the substrate 2 as the first substrate is supported by the upper peeling unit (supporting portion) 42. (Supporting step) The reinforcing plate 3 as the second substrate is sucked and held by the lower peeling unit 42 (sucking step). In this case, the support part that supports the substrate 2 is not limited to the peeling unit 42, and may be any member that can detachably support the substrate 2. However, since the substrate 2 and the reinforcing plate 3 can be simultaneously bent and peeled by using the peeling unit 42 as the support portion, the peeling force can be increased as compared with a mode in which only the substrate 2 or the reinforcing plate 3 is bent. There is an advantage that can be reduced.

  Returning to FIG. 11, FIG. 11C shows that the interface 24 of the laminate 6 starts to be peeled while the lower peeling unit 42 is bent downward and deformed from the corner 6 </ b> A to the corner 6 </ b> B of the laminate 6. It is the side view which showed the state which peels from the part 26 (refer FIG. 4) as the starting point. That is, in the plurality of connecting members 44A to 44S of the lower peeling unit 42 shown in FIG. 8, the connecting member 44S located on the corner 6B side from the connecting member 44A located on the corner 6A side of the laminate 6 is changed. The interface 24 is peeled by sequentially moving downward (peeling process). FIG. 13B is a perspective view corresponding to FIG. 11C, and is an enlarged perspective view of the corner 6A of the stacked body 6. FIG. According to the figure, it can be seen that the peeling unit 42 is bent and deformed by the downward movement of the connecting members 44A to 44E, and the reinforcing plate 3B is peeled from the substrate 2B.

  In conjunction with the above operation, in the plurality of connecting members 44A to 44S of the upper peeling unit 42, the connecting member 44S positioned on the corner 6B side from the connecting member 44A positioned on the corner 6A side of the stacked body 6. May be lifted and moved sequentially to peel the interface 24. Thereby, a peeling force can be made small compared with the form which curves only the reinforcement board 3B.

  FIG. 12A is a side view of the peeling apparatus 40 in a state where the interface 24 is completely peeled. According to the figure, the peeled reinforcing plate 3B is vacuum-sucked and held by the lower peeling unit 42, and the laminate 6 (laminate comprising the reinforcing plate 3A and the panel P) excluding the reinforcing plate 3B is the upper peeling unit 42. Is held by vacuum suction.

  Also, the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the conveying device 80 shown in FIG. 11A is inserted between the upper and lower peeling units 42. Moved to position.

  After this, first, vacuum suction of the lower peeling unit 42 is released. Next, the reinforcing plate 3B is sucked and held by the suction pad 78 of the transport device 80 via the resin layer 4B. Next, the reinforcing plate 3B is unloaded from the peeling device 40 by the operation of the conveying device 80 indicated by arrows G and H in FIG.

  FIG. 12B is a side view in which the laminated body 6 excluding the reinforcing plate 3B is vacuum-sucked and held by the lower peeling unit 42 and the upper peeling unit 42. That is, the lower peeling unit 42 and the upper peeling unit 42 are moved relatively closer to each other, and the substrate 2B is held by vacuum suction on the lower peeling unit 42 (supporting step).

  FIG. 12C shows the peeling start part 30 (see FIG. 4) while the interface 28 of the laminate 6 is bent and deformed upward from the corner 6A of the laminate 6 toward the corner 6B. It is the side view which showed the state which peels from the origin. That is, in the plurality of connecting members 44A to 44S of the upper peeling unit 42 shown in FIG. 8, the connecting member 44S located on the corner 6B side is sequentially moved from the connecting member 44A located on the corner 6A side of the laminated body 6. The interface 28 is peeled off by moving upward (stripping process). In conjunction with this operation, in the plurality of connecting members 44 </ b> A to 44 </ b> S of the lower peeling unit 42, the connecting member positioned on the corner 6 </ b> B side from the connecting member 44 </ b> A positioned on the corner 6 </ b> A side of the laminate 6. The interface 28 may be peeled by sequentially moving 44S downward. Thereby, a peeling force can be made small compared with the form which curves only reinforcement board 3A.

  Thereafter, the reinforcing plate 3A completely peeled from the panel P is taken out from the upper peeling unit 42, and the panel P is taken out from the lower peeling unit 42. The above is the peeling method of the laminated body 6 in which the peeling start parts 26 and 30 were created in the corner 6A.

[Features of peeling device 40]
[First feature]
In the peeling step, the power of the driving devices 48A to 48S is transmitted to the flexible plate 52 via the long connecting members 44A to 44S, and the flexible plate 52 is bent and deformed.

  In other words, the conventional driving device deflects and deforms the flexible plate by transmitting power to the flexible plate at one point. In the embodiment, the driving devices 48A to 48S and the flexible plate 52 are deformed. Since the long connecting members 44 </ b> A to 44 </ b> S are interposed therebetween, the power of the driving devices 48 </ b> A to 48 </ b> S can be transmitted to the flexible plate 52 by a line or a surface. Thereby, the board | substrate 2 (2A, 2B) and the reinforcement board 3 (3A, 3B) can be peeled with the peeling apparatus 40 which reduced the number of drive devices 48A-48S.

[Second feature]
The connecting members 44A to 44S are characterized in that their longitudinal axes are arranged along the peeling front L as shown in FIG. 6 and a plurality of connecting members 44A to 44S are arranged at intervals along the peeling progress direction indicated by the arrow A. .

  Thereby, since the longitudinal axis of connection member 44A-44S and the peeling front L correspond, the board | substrate 2 (2A, 2B) and the reinforcement board 3 (3A, 3B) can be peeled smoothly.

[Third feature]
The connecting members 44A to 44S are respectively configured to have a length corresponding to the length of the peeling front L, and the driving devices 48A to 48S are respectively arranged at positions where the connecting members 44A to 44S are equally divided in the longitudinal direction. There is.

  Accordingly, since the power of the driving devices 48A to 48S can be transmitted uniformly in the longitudinal direction of the connecting members 44A to 44S, the substrate 2 (2A, 2B) and the reinforcing plate 3 (3A, 3B) are further connected. It can be peeled off smoothly.

[Fourth feature]
There is a feature in that the connecting members 44 </ b> A to 44 </ b> S are attached to the flexible plate 52 via the buffer member 82.

  As a result, even if there is a variation in the distance between the pair of peeling units 42, 42, the spring 86 of the buffer member 82 contracts so as to absorb the variation. Further, the variation in straightness of the connecting member 44B is also absorbed by the spring 86 contracting. As a result, the connecting member 44 </ b> B can be reliably attached to the flexible plate 52 even if the spacing and the degree of straight travel vary.

  N ... knife, P ... panel, 1 ... laminated body, 1A ... first laminated body, 1B ... second laminated body, 2 ... substrate, 2a ... surface of substrate, 2b ... back surface of substrate, 2A ... substrate, 2Aa ... surface of substrate, 2Ab ... back surface of substrate, 2B ... substrate, 2Ba ... surface of substrate, 2Bb ... back surface of substrate, 3 ... reinforcing plate, 3a ... surface of reinforcing plate, 3b ... back surface of reinforcing plate, 3A ... reinforcing plate 3Aa ... the surface of the reinforcing plate, 3Ab ... the back surface of the reinforcing plate, 3B ... the reinforcing plate, 3Ba ... the surface of the reinforcing plate, 3Bb ... the back surface of the reinforcing plate, 4 ... the resin layer, 4A ... the resin layer, 4B ... the resin layer, 6 ... Laminate, 6A, 6B ... Corner, 7 ... Functional layer, 8 ... Reinforcement plate, 10 ... Peeling start creation device, 12 ... Table, 14 ... Holder, 16 ... Height adjustment device, 18 ... Feeding device, 20 ... liquid, 22 ... liquid supply device, 24 ... interface, 26 ... peeling start part, 28 ... interface, 30 ... peeling open Part, 32, 34 ... peeling start part, 40 ... peeling apparatus, 42 ... peeling unit, 44A-44S ... connecting member, 46 ... movable device, 48A-48S ... driving device, 50 ... controller, 52 ... flexible plate, 54 ... Adsorption part, 56 ... Double-sided adhesive tape, 58 ... Flexible plate, 60 ... Breathable sheet, 62 ... Sealing frame member, 64 ... Double-sided adhesive sheet, 66 ... Groove, 68 ... Through-hole, 70 ... Rod, 72 ... Ball joint, 74 ... Frame, 78 ... Suction pad, 80 ... Conveying device, 82 ... Buffer member, 84 ... Bolt, 86 ... Spring, 88 ... Stopper, 90 ... Nut, 92 ... Screw

Claims (6)

A laminated body including a first substrate and a second substrate, the first substrate and the second substrate being detachably bonded to each other, the first substrate and the second substrate In the peeling device of the laminate that sequentially peels the interface from one end side to the other end side,
A support part for supporting the first substrate of the laminate;
A flexible plate for adsorbing the second substrate of the laminate on its adsorption surface;
The flexible plate is attached to a surface opposite to the suction surface of the flexible plate and is flexibly deformed from one end side to the other end side by being moved independently with respect to the support portion. A plurality of movable bodies that sequentially peel the interface,
The plurality of movable bodies are attached to the flexible plate via a plurality of connecting members for each singular and each plurality.   The connecting member is formed in an elongated shape, and the longitudinal axis thereof is disposed along a peeling front that is a boundary line between the peeled portion and the unpeeled portion of the interface, and along the peeling progress direction of the interface. The peeling apparatus of the laminated body of Claim 1 arrange | positioned in multiple numbers at intervals. The connecting members are each configured to have a length corresponding to the length of the peeling front,
The peeling device for a laminate according to claim 2, wherein the movable body is arranged at a position where the connecting member is equally divided in the longitudinal direction.   The peeling device for a laminate according to claim 1, wherein the connecting member is attached to the flexible plate via a buffer member. A laminated body including a first substrate and a second substrate, the first substrate and the second substrate being detachably bonded to each other, the first substrate and the second substrate In the peeling method of the substrate that peels sequentially from one end side to the other end side of the interface,
A supporting step of supporting the first substrate of the laminate by a support portion;
An adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate;
The flexible plate is bent and deformed by a plurality of movable bodies via a plurality of connecting members so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side, and the A peeling step for sequentially peeling the interface;
A method for peeling a laminate, comprising: A functional layer forming step of forming a functional layer on an exposed surface of the first substrate with respect to a laminate in which the first substrate and the second substrate are detachably attached, and the functional layer is formed. Separating the second substrate from the first substrate, and a method for manufacturing an electronic device comprising:
The separation step includes
A supporting step of supporting the first substrate of the laminate by a support portion;
An adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate;
The flexible plate is bent and deformed by a plurality of movable bodies via a long connecting member so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side. A peeling step of sequentially peeling the second substrate from the first substrate;
An electronic device manufacturing method comprising:

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