JP6469428B2 - Inorganic fiber heat insulating material and heat insulating panel using the same - Google Patents

Description

  The present invention relates to an inorganic fiber heat insulating material having high density, high compressibility, and high resilience and a heat insulating panel using the same.

  2. Description of the Related Art Conventionally, inorganic fibers such as glass wool are used as so-called inorganic fiber heat insulating materials arranged on the walls of buildings such as wooden houses. This inorganic fiber heat insulating material is usually sandwiched between plywoods and moisture-proof films and used as a heat insulating panel as a building wall.

In recent years, due to an increase in interest in energy saving, improvement of heat insulation performance by this inorganic fiber heat insulating material has been demanded. It has been found that increasing the density of the inorganic fiber heat insulating material is effective for improving the heat insulating performance. That is, heat insulation performance improves by making an inorganic fiber heat insulating material into high density. Specifically, conventionally, the inorganic fiber insulation having a relatively low density of about 10kg ^/ m ³ ~20kg / m 3 were common, it is required to improve the heat insulating performance as a high-density than this Yes.

As a heat insulating material having such a high density, one having a density of 45 kg / m ³ or more is known (see, for example, Patent Document 1). If a high-density heat insulating material as typified by Patent Document 1 is used, the heat insulating performance can be improved as compared with a conventional heat insulating material having a relatively low density.

  However, in recent years, in such heat insulation panels using inorganic fiber heat insulating materials, for example, seismic reinforcements such as bracing are often arranged in the panel, so the space for accommodating the inorganic fiber heat insulating materials in the panel is narrow. It has become. In order to push the inorganic fiber heat insulating material into the space thus narrowed and accommodate it, it is necessary to crush the inorganic fiber heat insulating material, but it is preferable that the thickness subsequently expands due to resilience in the panel. . That is, even if the inorganic fiber heat insulating material is pushed into the complicated space in the panel, the inorganic fiber heat insulating material can be restored by the elastic force, and the space in the panel can be filled with the inorganic fiber heat insulating material without a gap. preferable.

  In a high-density inorganic fiber heat insulating material, hardness increases as density increases, so flexibility and compressibility are reduced. Therefore, it becomes difficult to fill the heat insulation panel in which the seismic reinforcement as described above is inherent.

Japanese Patent No. 3004569

  The present invention is based on the above prior art, and has a high density, high compressibility, and high resilience, and fills a narrow space in which a seismic reinforcement is contained without gaps. An object of the present invention is to provide an inorganic fiber heat insulating material that can be used and a heat insulating panel using the same.

To achieve the above object, the present invention consists of an aggregate having a thickness by intertwining a plurality of inorganic fibers for the density and direction of ^{20kg / m 3 ~40kg / m 3} , wherein the collection is added pressure The initial thickness in a state where the initial thickness is not applied, and by applying a pressing force of 0.3 kPa to 0.8 kPa to the aggregate, the thickness is set to 55% to 70% with respect to the initial thickness. Provided is an inorganic fiber heat insulating material characterized in that, when released, the thickness is restored to 90% or more of the initial thickness.

  Preferably, the aggregate includes a thermosetting binder, and the thermosetting binder is 1.5% by mass to 3.5% by mass of the aggregate.

  Preferably, the thermosetting binder contains 0.1% by mass to 0.5% by mass of a compound having lubricity.

  Preferably, the compound having lubricity includes any of a silicon surfactant, a wax, and a surfactant.

  Further, in the present invention, a substantially plate-shaped plate body that sandwiches the assembly, a column body that is sandwiched and disposed along the outer edge of the opposite side of the plate body, and spans between the column bodies. A heat insulating panel using an inorganic fiber heat insulating material is provided.

According to the present invention, even if the pressing force is applied to the aggregate having the initial thickness to 55% to 70%, the aggregate thickness is restored to 90% or more of the initial thickness by releasing the pressing force. also inorganic fibers a collection of high density contained ^{20kg / m 3 ~40kg / m 3} , the clearance space by its restoring force when pushed crushed against narrowing been space It can be filled without. That is, it is possible to improve the heat insulation performance by high density and to improve the filling workability of the heat insulating material.

  Moreover, the restoring property after compression of an aggregate can be obtained by including 1.5 mass%-3.5 mass% thermosetting binder in an aggregate. Further, by including 0.1% by mass to 0.5% by mass of a compound having lubricity in this thermosetting binder, higher compressibility can be obtained. Further, it has been found that the compound having lubricity may contain any of silicon surfactants, waxes, and surfactants.

  On the other hand, when a seismic reinforcing material is arranged in a space sandwiched between plates, a heat insulating panel can be obtained by filling such a space with an inorganic fiber heat insulating material. Thus, even if it is the narrowed filling space, the heat insulation panel which can be filled with an inorganic fiber heat insulating material without a gap, and can also improve heat insulation performance can be obtained.

It is the schematic of the inorganic fiber heat insulating material which concerns on this invention. It is the schematic of the heat insulation panel which concerns on this invention. It is AA sectional drawing of FIG. FIG. 3 is a BB view of FIG. 2.

As shown in FIG. 1, the inorganic fiber heat insulating material 1 which concerns on this invention consists of the aggregate | assembly 2 formed by intertwining multiple inorganic fibers (not shown), such as glass wool. In FIG. 1, the assembly 2 is conceptually shown as a substantially rectangular parallelepiped. Its density is ^{20kg / m 3 ~40kg / m 3} , and has a thickness T for at least one direction. The aggregate 2 has an initial thickness, and this initial thickness is the thickness when no pressure is applied to the aggregate 2. That is, when no pressure is applied, the thickness T is equal to the initial thickness. On the other hand, since the aggregate 2 is formed by intertwining inorganic fibers, a gap is generated between the fibers. For this reason, the assembly 2 is reduced in the pressing direction when a pressing force is applied.

It is assumed that a pressing force is applied in the thickness T direction of the aggregate 2 so that the length T of the aggregate 2 is 55% to 70% of the initial thickness. Thereafter, when the pressing force is released, the aggregate 2 is restored by its elastic force until the thickness T becomes 90% or more of the initial thickness. Thus, even if the pressing force is applied to the aggregate 2 having the initial thickness to 55% to 70%, the thickness of the aggregate 2 is restored to 90% or more of the initial thickness by releasing the pressing force. also inorganic fibers a collection of high density contained ^{20kg / m 3 ~40kg / m 3} , the clearance space by its restoring force when pushed crushed against narrowing been space It can be filled without. That is, it is possible to improve heat insulation performance by high density, and to enhance high compressibility and high resilience. In order to obtain such an effect, the density of the aggregate 2 has been found to be particularly 20kg ^{/ m 3} ~40kg ^/ m 3 preferred. Note that high compressibility refers to the property of compressing greatly with a small load. In the aggregate 2 that has been greatly compressed by such high compressibility, the portion that has been compressed by high resilience expands.

  The inorganic fiber heat insulating material 1 according to the present invention will be described in detail below. The inorganic fibers forming the aggregate 2 are preferably glass fibers. Although there are many types of glass fibers, soda lime glass and A glass generally used in glass wool are particularly preferable. This is because glass fibers formed using these glasses by a rotary method have a fiber diameter and a fiber length suitable as a heat insulating material. The fiber system is preferably 3.0 μm to 5.0 μm, more preferably 3.5 μm to 5.0 μm. The fiber length is preferably 20 mm to 200 mm. Considering the restoring property of the inorganic fiber heat insulating material, the longer the fiber length, the better. Since the resilience in an inorganic fiber heat insulating material such as glass wool is greatly influenced by the fiber diameter and fiber length of glass fiber, it is important to consider the fiber diameter and fiber length in this way.

  Moreover, it is preferable that the pressing force at the time of pressing to compress the aggregate 2 corresponds to a pressing force by human power. Specifically, the pressure value is preferably 0.3 kPa to 0.8 kPa, and more preferably 0.4 kPa to 0.6 kPa. As described above, when the assembly 2 is crushed and pushed into the narrowed space, it is often pushed by human power, so the inorganic fiber heat insulating material 1 according to the present invention is filled in such a space. This is because it is important to consider the actual implementation. That is, it is important that a high compression performance can be exhibited by such a pressing force close to human power, and the present invention considers the pressing force due to human power for that purpose. The numerical value of 0.3 kPa to 0.8 kPa, more preferably 0.4 kPa to 0.6 kPa is meaningful in order to achieve the effect of the present invention in that it is a pressure corresponding to a pressing force by human power.

  Therefore, the inorganic fiber heat insulating material 1 of the present invention is compressed to 55% to 70% of the initial thickness when pressed at 0.3 kPa to 0.8 kPa, more preferably 0.4 kPa to 0.6 kPa. is there. The inorganic fiber heat insulating material 1 has a characteristic of being greatly compressed with such a small load, and this characteristic is referred to as high compressibility.

As described above, the density of the inorganic fiber insulation 1 is ^{20kg / m 3 ~40kg / m 3} . If the density is less than 20 kg / m ³ , the object of the present invention can be achieved in terms of high compressibility and high resilience, but the heat insulation performance is insufficient. On the other hand, if it exceeds 40 kg / m ³ , the desired high compressibility cannot be obtained although the heat insulation performance is sufficient.

  On the other hand, as an example for obtaining the above-described high compression performance and high restoration performance, it has been found that a thermosetting binder (not shown) as a so-called adhesive may be included in the assembly 2. It has also been found that the thermosetting binder may be 1.5 mass% to 3.5 mass% of the aggregate 2. Thus, by including 1.5 mass% to 3.5 mass% of a thermosetting binder in the aggregate 2, it is possible to give the aggregate 2 a characteristic of high resilience.

  It has also been found that higher compressibility can be obtained by including 0.1% by mass to 0.5% by mass of a compound having lubricity in the thermosetting binder. Examples of this compound include silicon surfactants, waxes, surfactants and the like, and any of these may be included. These lubricating compounds are sufficiently mixed with the thermosetting binder and then applied to the inorganic fibers. This is to prevent separation of the compound and the binder.

All the above binders are added for the purpose of imparting a high restoring force to the aggregate 2. The numerical value obtained in order to use inorganic fiber as a heat insulating material including a binder and to give a higher restoring force is the mass% (1.5 mass% to 3.5 mass%) of the binder. This value is not to be set for other purposes, only the aggregate 2 of high density inorganic fibers are contained ^{20kg / m 3 ~40kg / m 3} , is created in order to provide high resilience This is a verified numerical value.

  By providing the binder as described above, the inorganic fibers forming the inorganic fiber heat insulating material 1 are bonded by the thermosetting binder at the intersection. Thereby, not only the shape of the inorganic fiber heat insulating material 1 can be maintained, but also the handleability during construction, such as compressibility and recoverability, can be improved.

  The adhesion amount of the thermosetting binder to the inorganic fiber heat insulating material 1 will be described in detail. If the binder adhesion amount is less than 1.5% by mass, the restorability after releasing the pressing force is lacking. When the amount of the binder attached exceeds 3.5% by mass, the compressibility at the time of pressing becomes insufficient. The binder adhesion amount is more preferably 2.0% by mass to 3.0% by mass.

  In addition, it is preferable to apply | coat a thermosetting binder to the inorganic fiber immediately after fiberizing by the rotary method etc. Since the thermosetting binder is applied to inorganic fibers by spraying or the like in a high temperature atmosphere, it is preferably aqueous.

  As a kind of thermosetting binder, it is preferable to use a thermosetting resin that is cured by any one of amidation reaction, imidation reaction, esterification reaction, and transesterification reaction. For example, a resin composition containing a polycarboxylic acid obtained by polymerizing an ethylenically unsaturated monomer and a crosslinking agent containing an alcohol having an amino group or an imino group can be used.

  As the polycarboxylic acid, for example, one or more monomers selected from ethylenically unsaturated carboxylic acid monomers may be used alone, or an ethylenically unsaturated monomer containing no carboxyl group. You may use what is obtained by superposing | polymerizing using a body together.

  Examples of the ethylenically unsaturated monomer containing no carboxyl group include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl (meth). Acrylate, 2-ethylhexyl (meth) acrylate, cetyl (meth) acrylate, n-stearyl (meth) acrylate, diethylene glycol ethoxy (meth) acrylate, methyl-3-methoxy (meth) acrylate, ethyl-3-methoxy (meth) acrylate , Butyl-3-methoxy (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, tetrahydrofurfuryl acrylate, 2-hydroxyethyl acrylate 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, mono (meth) acrylate of trihydric or higher polyol, aminoalkyl (meth) acrylate, N-alkylaminoalkyl (meth) acrylate, N, N-dialkylaminoalkyl ( Acrylic monomers such as (meth) acrylate, vinyl alkyl ether, N-alkyl vinyl amine, N, N-dialkyl vinyl amine, N-vinyl pyridine, N-vinyl imidazole, N- (alkyl) aminoalkyl vinyl amine, etc. Vinyl monomers, (meth) acrylamide, N-alkyl (meth) acrylamide, N, N-dialkyl (meth) acrylamide, N, N-dialkylaminoalkyl (meth) acrylamide, diacetone (meth) acrylamide, N-bi Amide monomers such as formamide, N-vinylacetamide, N-vinylpyrrolidone, aliphatic unsaturated hydrocarbons such as ethylene, propylene, isobutylene, isoprene, butadiene, styrene, α-methylstyrene, p-methoxystyrene, Styrene monomers such as vinyl toluene, p-hydroxystyrene, p-acetoxystyrene, vinyl ester monomers such as vinyl acetate and vinyl propionate; acrylonitrile, glycidyl (meth) acrylate and the like. Moreover, these may use together 1 type, or 2 or more types.

  Examples of the ethylenically unsaturated carboxylic acid monomer include acrylic acid, methacrylic acid, crotonic acid, fumaric acid, maleic acid, 2-methylmaleic acid, itaconic acid, 2-methylitaconic acid, α-β-methylene. Glutaric acid, monoalkyl maleate, monoalkyl fumarate, maleic anhydride, acrylic anhydride, β- (meth) acryloyloxyethylene hydrogen phthalate, β- (meth) acryloyloxyethylene hydrogen maleate, β- (meta ) Acrylyloxyethylene hydrogen succinate and the like.

  The crosslinking agent contained in the thermosetting resin contains an alcohol having an amino group and / or an imino group. Examples of such alcohols include alkanolamines such as ethanolamine, isopropanolamine, diethanolamine, diisopropanolamine, and aliphatic polyamines (eg, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, 1, 2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,6-diaminohexane, 3,3′-iminobis (propylamine), 3- (methylamino) propylamine, 3- (dimethyl Amino) propylamine, 3- (ethylamino) propylamine, 3- (butylamino) propylamine, N-methyl-3,3′-iminobis (propylamine), polyethyleneimine, etc.), aromatic poly (For example, phenylenediamine, o-tolidine, m-toluylenediamine, m-xylylenediamine, dianisidine, diaminodiphenyl ether, 1,4-diaminoanthraquinone, 3,3'-dimethyl-4,4'-diaminobiphenyl, 4,4′-diaminobenzanilide, 4,4′-diamino-3,3′-diethyldiphenylmethane, etc.), heterocyclic amines (eg piperazine, 2-methylpiperazine, 1- (2-aminoethyl) piperazine, 2 , 5-dimethylpiperazine, cis-2,6-dimethylpiperazine, bis (aminopropyl) piperazine, 1,3-di (4-piperidyl) propane, 3-amino-1,2,4-triazole, 1-aminoethyl Amines such as -2-methylimidazole), ethylene oxide, or Polyamine polyol obtained by adding B pyrene oxide.

  In the present invention, it is preferable that at least one kind of dialkanolamine such as diethanolamine or diisopropanolamine is contained as a crosslinking agent.

  Compared with the polyamine-based polyol, dialkanolamine has a low molecular weight, but has a boiling point of 200 ° C. or higher. Therefore, the dialkanolamine has high reactivity with the polycarboxylic acid, and in the curing step of the inorganic fiber heat insulating material. There is little volatilization and it is economical.

  Further, the thermosetting resin may further contain a polyol other than the alcohol as a crosslinking agent. Such a polyol is preferably a water-soluble polyol. Specifically, 1,2-ethanediol (ethylene glycol) and its dimer or trimer, 1,2-propanediol (propylene) Glycol) and dimers or trimers thereof, 1,3-propanediol, 2,2-methyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, 1,3 -Butanediol, 1,4-butanediol, 2-methyl-2,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, 2-methyl-2,4-pentanediol 1,6-hexanediol, 1,4-cyclohexanediol, 2-ethyl-1,3-hexanediol, 2-hydroxymethyl-2-methyl-1,3 Propanediol, 2-ethyl-2-hydroxymethyl-2-methyl-1,3-propanediol, 1,2,6-hexanetriol, 2,2-bis (hydroxymethyl) -2,3-propanediol, etc. Aliphatic polyols, trialkanolamines such as triethanolamine and triisopropanolamine, sugars such as glucose, fructose, mannitol, sorbitol and maltitol, and the above polyols and polyester polyols such as phthalic acid, adipic acid and azelaic acid, polyethylene glycol , Polypropylene glycol, acrylic resin polyol and the like. These can use together 1 type (s) or 2 or more types. Among them, trialkanolamine is preferable because it has a high boiling point and is difficult to volatilize.

  Further, the thermosetting binder used in the present invention is preferably an aldehyde condensable resin. Examples of the aldehyde condensable resin include a resol type phenol resin, an amino resin, and a furan resin.

  The phenol resin is a resin obtained by addition reaction of phenols and aldehydes. Examples of the phenols include phenol, cresol, xylenol, resorcin, and modified products thereof. Examples of the aldehydes include formaldehyde, Examples include acetaldehyde, furfural and paraformaldehyde.

  An amino resin is a resin obtained by an addition reaction of urea and a compound having an amino group derived from urea such as melamine, acetoguanamine, benzoguanamine, and aldehydes. In a similar manner, a resin obtained by an addition reaction between a compound having an amino group such as polyacrylamide, aminoethanol, polyamines and aldehydes can also be used.

  When an aldehyde condensable resin is used, each resin may be used alone, or the above resins may be mixed and used. For example, a part of the phenol resin may be replaced with a melamine resin or a urea resin.

  The thermosetting binder used in the present invention neutralizes a pH adjuster, a curing accelerator, a silane coupling agent, a colorant, a dustproof agent, and an alkali component eluted from inorganic fibers in addition to the main component thermosetting resin. An additive such as a neutralizing agent may be added as necessary. The binder is adjusted to a predetermined concentration by mixing the above components according to a conventional method and adding water.

  The compound having lubricity will be described in detail. The compound contains a lubricant. This lubricant is applied to the surface of the inorganic fiber so that the inorganic fiber is not broken by rubbing between the fibers during compression. If the lubricating component is absent or small, the inorganic fiber is likely to be broken during compression, and there may be a problem that the restoring property after releasing the pressure is insufficient.

  The lubricant is applied on the inorganic fiber in a state of being mixed with the thermosetting binder, but the lubricant does not react with the thermosetting binder and flows on the inorganic fiber when the thermosetting binder is heated. preferable.

  Examples of such a compound having lubricity include silicone surfactants, waxes, and surfactants. Each will be described below.

  The silicone surfactant is obtained by adding a hydrophilic group such as polyethylene oxide or polypropylene oxide to the side chain or terminal of polysiloxane. In the silicone surfactant, the hydrophilicity of the product changes depending on the mixing ratio of the polysiloxane chain and the hydrophilic group chain, but if the hydrophilicity is sufficient to be mixed with the aqueous thermosetting binder. There is no particular limitation.

  Waxes are solids at room temperature but become liquids with relatively high fluidity when heated to about 40 ° C. or higher. Specifically, animal waxes such as beeswax, lanolin wax and shellac wax, plant waxes such as carnauba wax, wood wax, rice wax and candelilla wax, mineral waxes such as montan wax and ozokerite, paraffin wax and Synthetic waxes such as petroleum wax such as microcrystalline wax, Fischer-Tropsch wax, polyethylene wax, polypropylene wax, polycarbonate wax, palm oil fatty acid ester, beef tallow fatty acid ester, stearic acid amide, dipeptadecyl ketone and hardened castor oil It is done. These can use together 1 type (s) or 2 or more types. Of these, paraffin wax, polyethylene wax, and polypropylene wax are preferred from the viewpoint of economy. In addition to the above wax, heavy oil close to wax can be used.

  Generally, since waxes are hydrophobic materials, when adding wax to a binder, it is preferable to use it by dispersing or emulsifying in water in advance to improve miscibility.

  Surfactants include anionic surfactants, cationic surfactants, and nonionic surfactants, and nonionic surfactants are preferred from the viewpoint of miscibility with the aqueous thermosetting binder.

  Nonionic surfactants include ester surfactants such as glycerin fatty acid esters, sorbitan fatty acid esters, and sucrose fatty acid esters, polyethylene glycol, polypropylene glycol, and block copolymers thereof, higher alcohols, and addition of polyethylene oxide of alkylphenols. And ether-based surfactants such as polyethylene glycol fatty acid esters, polyethylene glycol fatty acid esters, polypropylene glycol fatty acid esters, and glycerin fatty acid esters, sorbitan fatty acid esters, and polyethylene oxide adducts of sucrose fatty acid esters.

  On the other hand, the lubricant is preferably mixed with a thermosetting binder, and is preferably 0.1% by mass to 0.5% by mass in terms of lubricant solid content with respect to the total mass in terms of solid content of the mixture. When the content of the lubricant is less than 0.1% by mass, the lubricity on the fiber is lacking, the fiber is likely to be broken during compression, and the restorability after releasing the press may be lacking. On the other hand, if the lubricant content exceeds 0.5% by mass, no further improvement in lubricity is observed, which is not economical, and the adhesiveness of the thermosetting binder is impaired, and restoration properties are obtained. The problem of not.

  The inorganic fiber heat insulating material 1 of this invention can be manufactured as follows, for example. That is, first, the molten inorganic raw material is made into a fiber by a fiberizing apparatus, and immediately after that, the binder is applied to the inorganic fiber. Next, a pair of upper and lower perforated holes are formed so as to form a bulky inorganic fiber heat insulating material intermediate by depositing inorganic fibers provided with a binder on a perforated conveyor and having a desired thickness. The inorganic fiber heat insulating material 1 is formed by feeding it to a conveyor or the like and heating it while narrowing the pressure to cure the binder. And you may coat | cover a skin material etc. as needed. An actual product is obtained by cutting the inorganic fiber heat-absorbing sound-absorbing material 1 into a desired width and length.

  Hereinafter, the manufacturing process described above will be described in detail.

  As an inorganic fiber used for the inorganic fiber heat insulating material 1 of this invention, the glass wool, the rock wool, etc. which are used for the normal heat insulation sound-absorbing material can be used. Various methods such as a flame method, a blow-off method, and a centrifugal method (also referred to as a rotary method) can be used as a method for fiberizing inorganic fibers. In particular, when the inorganic fiber is glass wool, it is preferable to use a centrifugal method. In order to impart the binder to the inorganic fibers, it is applied and sprayed using a spray device or the like.

  The timing of applying the binder to the inorganic fiber may be any time after fiberization, but in order to efficiently apply the binder, it is preferable to apply it immediately after fiberization.

  The inorganic fiber to which the binder has been applied by the above process is deposited on a perforated conveyor and becomes a bulky inorganic fiber intermediate. Here, when depositing on the perforated conveyor, it is more preferable to suck by the suction device from the opposite side of the perforated conveyor on which the inorganic fibers are deposited.

  After that, the inorganic fiber intermediate that continuously moves on the perforated conveyor is sent to a pair of upper and lower perforated conveyors and the like that are spaced so as to have a desired thickness, and at the same time, the binder is removed by heated hot air. After curing and forming the inorganic fiber heat insulating material into a mat shape, it is cut into a desired width and length.

  The heat curing temperature of the binder is preferably 200 to 350 ° C. Further, the heat curing time is appropriately adjusted between 30 seconds and 10 minutes depending on the density and thickness of the inorganic fiber heat insulating material 1.

  The inorganic fiber heat insulating material 1 of the present invention may be used as it is, or may be used after being covered with a skin material. As the skin material, paper, synthetic resin film, metal foil film, non-woven fabric, woven fabric, or a combination thereof can be used.

  Hereinafter, as an example of what utilizes the inorganic fiber heat insulating material 1 which has such a high restoring force, there exists the heat insulation panel 3 as shown in FIGS. The heat insulation panel 3 has a substantially plate-shaped plate body 4. The inorganic fiber heat insulating material 1 is sandwiched between two plate bodies 4. A plywood or the like can be used as the plate body 4. The plate body 4 also holds the column body 5. The column body 5 is made of wood and has a substantially prismatic shape, and is disposed along the outer edges of the opposing sides of the plate body 4. In other words, the column bodies are arranged at the left and right ends between the plate bodies 4 and extend in the vertical direction.

  As shown in FIG. 3, a substantially rod-shaped seismic reinforcing material 6 is bridged between the column bodies 5. The seismic reinforcing material 6 shown in the example of FIG. 3 is a so-called bracing, in which substantially rod-shaped steel materials are arranged obliquely. In addition, even if the seismic reinforcement 6 does not cross, it is sufficient if it spans between the pillars 5. When such a seismic reinforcing material 6 is arranged, the space formed by the plate body 4 is complicated, and the space space is also narrowed. The inorganic fiber heat insulating material 1 is filled in such a narrowed space. Therefore, in order to push into the space, the inorganic fiber heat insulating material 1 is reduced and inserted by applying a pressing force. After being inserted, the inorganic fiber heat insulating material 1 is a space complicated by the earthquake-resistant reinforcing material 6 and the like due to its restoring force. Even if it exists, it can be filled without gaps. Furthermore, since the inorganic fiber heat insulating material 1 has a high density as described above, the heat insulating performance is also high. For this reason, the inorganic fiber heat insulating material 1 of this invention is suitable in order to apply to the heat insulation panel which has the seismic reinforcement 6 in consideration of recent seismic performance.

1: Insulating inorganic fiber material, 2: Aggregate, 3: Thermal insulation panel, 4: Plate body, 5: Column, 6: Seismic reinforcement

Claims (5)

A fiber diameter 3.0Myuemu～5.0Myuemu, an aggregate of fiber length has a thickness to density and unidirectional inorganic fibers 20 kg ^/ m 3 by causing a plurality intertwining ~40kg / ^{m 3} is 20mm~200mm Become
The assembly has an initial thickness in the absence of pressure;
By applying a pressing force of 0.3 kPa to 0.8 kPa to the aggregate, the thickness is set to 55% to 70% with respect to the initial thickness. Thereafter, when the pressing force is released, the thickness is equal to the initial thickness. An inorganic fiber heat insulating material characterized by being restored to 90% or more. The assembly includes a thermosetting binder,
The inorganic fiber heat insulating material according to claim 1, wherein the thermosetting binder is 1.5 mass% to 3.5 mass% of the aggregate.   The inorganic fiber heat insulating material according to claim 2, wherein the thermosetting binder contains a compound having lubricity of 0.1% by mass to 0.5% by mass.   The inorganic fiber heat insulating material according to claim 3, wherein the compound having lubricity includes any of a silicon surfactant, a wax, and a surfactant. A substantially plate-shaped plate that sandwiches the assembly;
A columnar body that is sandwiched and disposed along the outer edge of the opposite side of the plate body;
The heat insulation panel using the inorganic fiber heat insulating material according to any one of claims 1 to 3, further comprising a substantially rod-shaped seismic reinforcing material spanned between the columns.

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